Embedding presses, grinding and / or polishing apparatuses and lines for embedding samples and processing embedded samples

Abstract

This invention relates to an embedding press for automatically embedding samples in embedding material, comprising a pressing unit with a pressing cylinder; a dispensing device for metering the feeding embedding material; a sample loading platform with multiple loading positions, at which an operator can place samples to be embedded; and a control device. The invention also relates to a grinding and / or polishing apparatus, comprising: a housing; at least one processing station for processing the bottom surface of a sample, wherein the processing station has a grinding disc with abrasive pads for grinding the bottom surface of the sample, or a polishing disc for polishing the bottom surface of the sample; a sample conveying device having a sample removal position for providing samples for the grinding and / or polishing process; and a sample placement position for placing samples after the grinding and / or polishing process; and a control device. A grinding / polishing head with a sample holder for gripping a sample, wherein the grinding / polishing head with the sample holder moves to a sample removal position and the sample holder grips the sample, wherein the grinding / polishing head with the sample holder delivers the sample to at least one processing station and the bottom surface of the sample is ground or polished at the processing station, and wherein after grinding or polishing and, if necessary, other processing steps, the grinding / polishing head with the sample holder delivers the sample to a sample placement position and places the sample there. The invention also relates to an automated production line for embedding multiple samples and for processing the thus embedded samples by grinding and / or polishing the samples in a program-controlled integrated system, the integrated system comprising an automated embedding press and automated grinding and polishing equipment.

Description

Technical Field

[0001] This invention relates to an embedding press for automatically embedding samples in embedding materials, particularly for automatic thermal embedding with plastic embedding materials under pressure. It also relates to a laboratory-scale grinding and / or polishing apparatus and a method for planar grinding and / or polishing the bottom surface of a sample, particularly an embedded sample, as well as an automated production line for embedding multiple samples and for processing the thus embedded samples by grinding and / or polishing them in a program-controlled integrated system comprising an automatic embedding press and an automatic surface processing apparatus, particularly an automatic grinding and polishing apparatus. Background Technology

[0002] For metallographic material examination, smaller sample pieces are typically embedded in cylinders of plastic material. These embedded samples are then planar ground and, if necessary, polished to allow for material studies, such as hardness testing or microstructure analysis, on the planar-ground and, if necessary, polished surface.

[0003] A simple embedding press consists of a cylinder with a pressing piston and a manually operated closure. Small metallographic samples are placed in the cylinder containing embedding particles, for example, made of thermoplastic plastic, and are then hot-pressed for embedding, typically at a maximum pressure of approximately 250 to 350 bar, a maximum temperature of approximately 200°C, and for several minutes. This embedding press has a control system that allows setting the heating temperature, heating and cooling times, and pressing pressure. The embedding process using such an embedding press is as follows:

[0004] 1. Open the closure and move the cylinder to the upper position.

[0005] 2. Place the sample in and move the cylinder downwards.

[0006] 3. Use a shovel to scoop the embedded particles into the cylinder.

[0007] 4. Close the closure and begin the pressing process.

[0008] 5. Wait for the embedding process to finish (a few minutes, depending on the set parameters).

[0009] 6. Open the closure.

[0010] 7. Move the cylinder upwards so that the sample can be removed.

[0011] The operator manually repeats this process for each individual sample. Depending on the set parameters, the total time for the sample embedding procedure is typically around 15 minutes. A modular embedding press from ATM Qness GmbH, named Opal X-Press, is known (see www.qatm.com). The Opal X-Press is similar to the aforementioned embedding press in basic structure and function. However, several presses, potentially with different sample diameters, can be combined and operated simultaneously. Each cylinder with a pressing piston has a lever-operated closing mechanism at its upper end, which allows the pressing chamber in the cylinder to be closed and locked using a handle. The advantage of this modular embedding press is that it allows for a corresponding increase in sample throughput. However, the operator must still be essentially present at all times to fill the individual embedding presses and remove the embedded samples.

[0012] In addition, a dual-press with a metering system is also known. The dual-press operates similarly to the aforementioned encapsulation press, but the encapsulated particles can be introduced via a feeding device. It is manually pivoted above the pressing cylinder, and the encapsulated particles are fed into the cylinder. This press features a dual design, with two pressing cylinders, and the feeding device can be manually pivoted alternately above them.

[0013] All the systems described share a drawback: the operator must essentially remain on-site. Embedding is a time-consuming process, partly due to the waiting time during the embedding compression process, typically under high pressure and temperature, which wastes valuable time for laboratory professionals. Furthermore, embedding represents a specific bottleneck in the overall sample preparation process, as it usually consumes a significant portion of the total preparation time. This is especially true for laboratories with high sample throughput, i.e., those requiring the thermocompression of large quantities of samples.

[0014] After the sample is embedded, it is typically ground flat using a laboratory grinding apparatus with rotating grinding discs, followed by polishing. These laboratory disc grinding apparatuses are often designed as combined grinding and polishing devices, meaning a polishing disc can also be mounted on the grinding disc to alternatively provide polishing functionality. For example, such laboratory disc grinding apparatuses, known by the trademarks Saphir and Rubin from ATM Qness GmbH (see www.qatm.com), are used for planar grinding and, if necessary, polishing of the bottom surface of embedded samples, commonly used for materials testing, particularly hardness testing and microstructure analysis.

[0015] These grinding / polishing devices are available in single-axis or multi-axis versions. Manual grinding / polishing devices generally consist of a grooved housing, a drive motor, and a grinding disc. In simple grinding / polishing devices, the embedded sample can be pressed onto the disc by hand and ground. Semi-automatic grinding / polishing devices additionally have a device head, sometimes called a polishing head, which has a rotating extrusion punch and a sample holder, typically in which four to six embedded samples can be placed, and tensioned if necessary. With individual extrusion pressure, the sample is placed only in the sample holder and carried by it. Each individual sample is pressed onto the grinding disc by a pneumatic cylinder or spring. With central extrusion pressure, the entire sample holder is pressed onto the grinding disc, thus firmly clamping the sample within the sample holder. In automated systems, the sample is typically clamped because these systems usually operate with central extrusion pressure.

[0016] Placing and clamping the sample, if necessary, is a manual activity, and the sample must be oriented very precisely in the plane in an unfavorable manner in the appropriate device, which results in a corresponding time expenditure.

[0017] Traditional semi-automatic grinding / polishing equipment has a toolbox that can hold, for example, 16 grinding discs. These discs are placed on a grinding disc via an automatic changing system for use in each processing step. First, a coarser grit is used, then finer, and finally a polishing disc is applied. Typically, four to six grinding and polishing steps are required to produce the surface of the finished sample. After each processing step, one or two cleaning steps are performed with water, methanol, or in an ultrasonic bath.

[0018] Advantages include its relatively compact size and low cost. However, disadvantages include the fact that it can only automatically produce six samples at a time on the sample holder before the holder needs to be replaced. Furthermore, the grinding and polishing discs must be changed between grinding and polishing steps after each step. Additionally, the samples are manually clamped and oriented in the sample holder.

[0019] In another essentially similar variant, the sample is clamped in a holder, and the grinding disc is also replaced. However, more than one sample holder can be loaded, and the machine has two cleaning stations. A drawback of this type of machine, however, is its increasing size.

[0020] An automated grinding and polishing machine with multiple grinding / polishing stations is known from ATM Qness GmbH. This machine can be modularly equipped with multiple grinding / polishing discs, a cleaning station, and a planar grinding device for sample trimming. It also features a toolbox with different grinding and polishing discs. The machine includes two polishing heads, each capable of holding one sample holder, and can simultaneously process two sample holders containing multiple samples. The machine has a sample holder toolbox that can hold up to 12 sample holders. These 12 sample holders are automatically taken over or replaced by the machine and clamped. However, the samples must be manually clamped into the sample holders and oriented planar. Through its modular design, the machine can be built with 4 stations, but also with 6 or 8 stations. Advantageously, this automated grinding / polishing machine achieves high sample throughput, and due to its modular design, it can be easily adapted to user requirements. However, its purchase requires a relatively high investment cost. Furthermore, the machine requires a considerable amount of space.

[0021] Another type of machine is known in which multiple sample holders are stored on a conveyor belt and transported to a first device. There, they are first trimmed (leveled) with a grinding stone, cleaned, and then undergo a first fine grinding process. The sample holders are then transported to a second device, where they undergo two polishing steps with intermediate and final cleaning. The two stations operate simultaneously, meaning that while the first sample holder is being polished in the second device, the first device is already processing the next sample holder.

[0022] This machine is also modularly built and can be combined with any number of devices. Its disadvantages are high purchase cost and very large space requirements, especially when several devices are combined together. Summary of the Invention

[0023] The purpose of this invention is to provide an embedding press for embedding samples in embedding materials, which is easy to operate and does not require a high level of operator skill.

[0024] Another aspect of the present invention is to provide an embedding press for automatically embedding multiple samples in an embedding material.

[0025] Another aspect of the present invention is to provide an embedding press for embedding samples in an embedding material, which enables an operator to prepare multiple samples for embedding in a single work operation, wherein the embedding press can then automatically embed the prepared samples in the absence of the operator and provide them for further processing, such as surface grinding and polishing.

[0026] Another object of the present invention is to provide a grinding and / or polishing apparatus for surface grinding and / or polishing, especially for the bottom surface of embedded samples, which provides the operator with high efficiency and high comfort.

[0027] Another aspect of the present invention is to provide an apparatus for grinding and / or polishing, particularly for grinding and / or polishing the bottom surface of embedded samples, which is inexpensive and requires little space in a laboratory but has a high sample throughput.

[0028] Another aspect of the present invention is to provide a grinding and / or polishing apparatus for surface grinding and / or polishing, especially for the bottom surface of embedded samples, which eliminates the need for sample trimming / leveling.

[0029] Another aspect of the present invention is to provide a grinding and / or polishing apparatus for surface grinding and / or polishing, particularly for the bottom surface of embedded samples, which combines several advantageous features, namely low cost, high working time efficiency, high sample throughput and low space requirements.

[0030] Another object of the present invention is to simplify the production of embedded samples, which are ready for hardness testing, microstructure analysis or other metallurgical research.

[0031] Another aspect of the invention is to provide a production system capable of automatically embedding samples and then processing the bottom surface of the embedded samples, particularly grinding and possibly polishing them, without operator intervention between samples.

[0032] Another aspect of the present invention is to provide a production system for embedding, grinding, and, if necessary, polishing multiple samples, which coordinates the efficiency of the operator's required working time with the low space requirements and low cost of the laboratory.

[0033] The objective of this invention is achieved through the subject matter of the independent claims. Preferred embodiments are the subject matter of the dependent claims.

[0034] One aspect of the invention relates to an embedding press for embedding metallographic samples into an embedding material. The diameter of the embedded sample can, for example, be in the range of 20 mm to 60 mm, to better handle small pieces of metal, for example, for materials research, such as hardness testing or microstructure analysis, and to better perform the corresponding preparation steps.

[0035] An embedding press includes a pressing unit with a sample receiving position for the sample to be embedded and a pressing cylinder in which the sample is pressed against an embedding material, such as a plastic embedding material, under high pressure and possibly high temperature by a piston, so that the sample is securely embedded in the embedding material after the embedding pressing process is completed. The piston drive can be, for example, a spindle-driven or hydraulically driven piston rod. The pressing cylinder is preferably heated to perform the embedding pressing process at a high temperature, especially to melt the plastic embedding material, for example, melting can occur between 100°C and 300°C. The pressing cylinder can also be cooled for faster cooling. In metallography, this process is called hot embedding or warm embedding.

[0036] In addition, the embedding press includes a feeding device for metering the embedding material into the pressing cylinder. During metering the embedding material, the sample to be embedded is loosely positioned on a piston within the pressing cylinder, and the embedding material is dispensed from above onto the sample and piston in the form of embedding particles, particularly plastic particles. The feeding device can be connected to one or more storage containers from which the embedding particles are conveyed, for example, via screw conveyors.

[0037] The embedding press also includes a sample loading stage with multiple loading positions, where the operator can place the sample to be embedded at each position, i.e., set the sample for embedding. For example, the sample loading stage can be a rotary table with multiple loading positions on its outer periphery.

[0038] In addition, a control device is included that automatically controls the embedding press in a programmed manner. Specifically, it preferably controls at least the sample loading stage, the pressing unit, and the dispensing device, enabling multiple embedding pressing processes to be performed sequentially and completely automatically without intermediate operator intervention, especially after multiple samples to be embedded have been loaded onto the sample loading stage. To this end, the control device is designed to automatically control the embedding press in multiple cycle cycles, each cycle having the following cyclic steps:

[0039] Cyclic step a): The control device controls the sample loading stage to move one of the loading positions together with one of the samples to be embedded to the sample receiving position of the pressing unit.

[0040] Cyclic step b): Then, the control device controls the pressing unit so that the sample to be embedded, whose loading position was moved to the sample receiving position in cyclic step a), is automatically introduced from the sample receiving position into the pressing cylinder. Furthermore, the control device controls the dispensing device so that the embedding material is automatically metered and fed into the pressing cylinder onto the sample to be embedded.

[0041] Cyclic step c): Subsequently, the control device controls the pressing unit to carry out the embedding pressing process under pressure and, if necessary, at increased temperature to produce an embedded sample.

[0042] Cyclic step d): Then the control device controls the pressing unit to eject the embedded sample generated in cyclic step c) from the pressing cylinder.

[0043] The control unit then controls the embedding press, automatically repeating the cycle with periodic steps a) to d) until all samples placed at the loading positions are embedded. The sample loading stage is controlled by the control unit to move one loading position further within each cycle. If necessary, a monitoring device can be configured to monitor whether the loading position currently at the sample receiving position is actually loaded before the sample to be embedded is introduced into the pressing cylinder via program control. If not, the control unit can automatically control the sample loading stage to omit the cycle steps b) to d) and move the next loading position to the sample receiving position. When all samples have been embedded, the control unit can automatically shut down the embedding press, for example, when the required number of cycle positions has been completed.

[0044] Therefore, when using this embedding press, the operator only needs to load a large number of samples, such as dozens, into the sample loading stage, placing one sample to be embedded in each loading position. This can still be done manually if necessary, but without any waiting time, allowing for a relatively quick one-time completion. The operator then activates the control program of the control device, which automatically executes multiple of the aforementioned cycle cycles to automatically embed the samples sequentially without operator intervention. Each cycle in this embedding process requires a certain amount of time, for example, approximately 15 minutes. Therefore, embedding 32 samples in 32 cycle cycles would take, for example, a total of 8 hours, or a full shift. However, with automatic execution of the cycle cycles, no operator intervention is required. Therefore, the operator can, for example, load the sample loading stage and activate the control program at night, and all samples will be embedded by the next morning. This significantly saves skilled workers' time.

[0045] According to an exemplary embodiment, the sample loading stage is designed as a cyclic stage, preferably a rotary stage, wherein the loading position is arranged in the outer annular region of the rotary stage, and the rotary stage is further rotated by a predetermined angular step in each cycle to move the next loading position to the sample receiving position.

[0046] Preferably, the pressing cylinder has a first opening at the bottom and a second opening at the top. This allows for the automatic introduction of the sample and the metering feeding of the embedding material to occur at two axially opposite ends of the pressing cylinder, which has structural advantages. Preferably, the sample is introduced into the pressing cylinder from below, i.e., through the first opening at the bottom, while the embedding material is metered into the pressing cylinder from above, i.e., through the second opening at the top.

[0047] Preferably, the pressing unit has an upper closing slider, and the control device is adapted to control the upper closing slider so that the upper closing slider automatically closes the second opening at the top of the pressing cylinder after the embedding material is metered and fed, so that the embedding pressing process can be performed subsequently, i.e. after cycle step b) and before cycle step c).

[0048] According to a preferred aspect of the invention, at each loading position, there are pistons designed as compression pistons for pressing cylinders, serving as placement locations for the samples to be embedded. For this purpose, recesses can be formed at the loading positions, for example, on the upper side of the sample loading stage, and placement surfaces with bottoms are provided in each recess, for example, an annular surface is provided as a placement edge with a central opening. Therefore, the pistons placed on the sample loading stage have a dual function: on the one hand, they serve as placement surfaces for the operator to place the samples during the pre-loading process; on the other hand, they serve as compression pistons in the respective embedding compression processes. Preferably, the compression unit has a piston drive device, such as a piston rod, wherein at the sample receiving position, the piston drive device or piston rod is coupled to the pistons located at the sample receiving position to lift the piston with the sample to be embedded on it from the loading position and push it from below through a first opening in the lower part into the compression cylinder, wherein each respective piston functions as a compression piston in the subsequent embedding compression process. In other words, each sample has its own compression piston, on which it is placed during the pre-loading step.

[0049] Preferably, the pressing unit has an automatic sample ejector. After the embedding pressing process, the now-embedded sample is moved upward out of the pressing cylinder by a piston drive device or a piston rod and piston, and the control device controls the sample ejector to automatically eject the embedded sample that has moved upward out of the pressing cylinder from the pressing unit.

[0050] Preferably, the sample ejector pushes the embedded sample radially toward the axis of the pressing cylinder from the upwardly moving piston to eject the embedded sample. For this purpose, the piston is preferably moved upward to the extent that the embedded sample is completely removed from the pressing cylinder, but the piston remains radially fixed in order to overcome any possible adhesion between the embedding material and the piston surface.

[0051] After the sample is ejected, the control device controls the embedding press to move the piston drive or piston rod down with the piston again, and before moving to the sample receiving position with the next piston and the next sample, the empty piston is placed back into the loading position of the sample loading stage to start the next cycle.

[0052] The embedding press has an inlet in its lower region for a sample loading stage. In the case of a rotary table, the inlet is preferably U-shaped, meaning the embedding press has a side-opening recess under the pressing cylinder. In the case of a linear sample loading stage, the inlet can also be designed as a continuous opening through which the linear sample loading stage passes. This allows the sample loading stage to move at least partially within the recess of the embedding press, cyclically introducing loading positions containing the sample to be embedded into the side-opening recess, thereby sequentially moving the sample to be embedded under the pressing cylinder.

[0053] According to a preferred embodiment, the embedding press includes at least one first storage container and a second storage container for storing different first and second embedding materials. Both storage containers are connected to a dispensing device, which meterly feeds the embedding materials from the first and second storage containers into a pressing cylinder. The metering of the first and second embedding materials is controlled by a control device to automatically feed the first and / or second embedding materials, preferably sequentially, into the pressing cylinder in predetermined amounts. In this way, two layers of embedding can be manufactured without operator intervention, for example, using a higher-quality embedding material in the lower region and a lower-cost embedding material in the upper region. The embedding materials can be fed from the first and / or second storage containers into the metering gate, for example, via a first and / or second screw conveyor. The storage containers containing the embedding materials are preferably each equipped with an automatic fill level monitor that communicates with the control device. If one of the storage containers runs out of encapsulating material, the relevant fill level sensor reports this status to the control unit, which in turn stops the machine and preferably outputs an error message (e.g., no encapsulated particles in the container) to the operator via a display. If necessary, a red indicator light can also be activated.

[0054] One aspect of the present invention relates to a method for embedding multiple samples in an embedding material using an embedding press, wherein in a preparation step, multiple samples to be embedded are loaded onto a sample loading stage having multiple loading positions, which may be done manually if necessary. After the sample loading stage has loaded the multiple samples to be embedded, the samples are automatically embedded sequentially in a cycle under program control, with the cycle steps as follows:

[0055] Cyclic step a): Under program control, one of the loading positions on which the sample to be embedded is placed beforehand is moved to the sample receiving position of the pressing unit.

[0056] Cyclic step b): Under program control, the sample from step a) is pushed from the sample receiving position into the pressing cylinder of the pressing unit, and the embedding material is metered and fed into the pressing cylinder under program control.

[0057] Cyclic step c): Under program control, the embedding material and sample are pressed in a pressing cylinder to produce an embedded sample.

[0058] Cyclic step d): Under program control, the embedded sample is ejected from the compression cylinder.

[0059] Under program control, repeat the cyclical process with steps a) to d) until multiple samples are embedded.

[0060] Preferably, the sample is introduced into the pressing cylinder from below, and the embedding material is metered and fed into the pressing cylinder from above.

[0061] Preferably, after the embedding material is metered and fed, the pressing cylinder is automatically closed at its upper end in a program-controlled manner, so that the embedding and pressing process can then be carried out automatically in a program-controlled manner.

[0062] In the preparatory loading step, the samples to be embedded are preferably placed on their respective pistons at the loading position, wherein the pistons act as pressing pistons within the pressing cylinder during the subsequent embedding process. In the periodic step b), each corresponding sample, along with its respective pressing piston, is axially pushed into the pressing cylinder from below, for example, by connecting a piston rod to each corresponding pressing piston below the pressing cylinder and pushing each corresponding pressing piston, along with its corresponding sample, upward into the pressing cylinder.

[0063] After cycle step c), the piston carrying the now-embedded sample is moved upward, wherein the embedded sample is removed from the compression cylinder so that in cycle step d), the sample ejector is pushed down from the piston radially about the axis of the compression cylinder to eject the sample.

[0064] After cycle step d), the empty piston moves down again, and before moving to the sample receiving position with the next piston and the next sample, the empty piston is placed back into the loading position to begin the next cycle.

[0065] Preferably, under the control of the control device, the sample loading stage sequentially and cyclically moves the loading position with the piston and the sample to be embedded placed thereon to the pressing cylinder, so that the respective pistons with the sample are subsequently axially introduced into the pressing cylinder from below. After the embedding and pressing process, the piston is moved axially downward again out of the pressing cylinder, and is placed back in the loading position before the next loading position with the next piston and the next sample is moved into the pressing cylinder in the next cycle.

[0066] Preferably, at least two different embedding materials are automatically metered and fed into the pressing cylinder in a program-controlled manner to produce two layers of embedding.

[0067] One aspect of the present invention relates to an embedding press for embedding samples in an embedding material, particularly an embedding press having the above-described features, comprising...

[0068] A pressed cylinder with a vertical axis

[0069] The piston on which the sample to be embedded can be placed, and

[0070] A feeding device for metering and feeding embedding materials into a pressing cylinder.

[0071] The pressing cylinder has a lower first opening and an upper second opening. The sample to be embedded is pushed into the pressing cylinder through the lower first opening by a piston, and the embedding material is metered into the pressing cylinder through the upper second opening.

[0072] In principle, it has proven advantageous to introduce the sample into the pressing cylinder from one axial side (i.e., from below) using separate pistons, and to meter the embedding material from the other axial side (i.e., from above). This structural design, along with, but also independently of, the other features mentioned above, simplifies the embedding pressing process, even though it may be structurally slightly more complex than introducing the sample and embedding particles from above.

[0073] Therefore, the present invention also relates to a method for embedding a sample in an embedding material, particularly a method having the above-described features, comprising the following steps:

[0074] The piston, carrying the previously placed sample to be embedded, is introduced into the pressing cylinder through the first opening at the bottom of the pressing cylinder.

[0075] The embedding material is metered and fed through the second opening at the top of the pressing cylinder onto a piston containing the sample.

[0076] Close the second opening at the top of the pressing cylinder, and press the sample and embedding material inside the pressing cylinder.

[0077] The embedded sample is ejected from the compression cylinder.

[0078] Another aspect of the invention relates to an embedding press for embedding samples in an embedding material, particularly an embedding press having the above-described features, comprising...

[0079] A pressing unit with a pressing cylinder,

[0080] A piston drive device used to drive a piston to perform an embedding and pressing process in a pressing cylinder.

[0081] A sample loading stage with multiple loading positions, and

[0082] Preferably, a plurality of pistons having an upper piston side and being configured as pressing pistons for pressing cylinders are used.

[0083] The pistons can be stored in one of the loading positions with the top side of the piston as the placement surface, allowing the operator to place the sample to be embedded on the top side of the piston.

[0084] The piston drive device can be alternately coupled with the piston to embed multiple samples in a cycle. That is, in each cycle, the piston drive device is coupled with one of the pistons and introduces the samples to be embedded into the pressing cylinder with their own pistons to carry out the embedding and pressing process.

[0085] The following sections will describe in more detail the implementation schemes and related methods for grinding and / or polishing equipment and automated production lines.

[0086] Grinding and / or polishing equipment

[0087] The present invention also relates to a laboratory-scale automated grinding and / or polishing apparatus for grinding and / or polishing planar surfaces, particularly the bottom surface of embedded samples. Grinding and / or polishing are particularly useful for preparing for testing and measurement and for preparing embedded samples, such as for hardness testing, especially of embedded metallographic samples.

[0088] Grinding and / or polishing equipment includes a housing that can accommodate, for example, a drive motor for a grinding and / or polishing disc, control devices, etc., and a groove may be formed on its upper side in which the grinding and / or polishing disc can be arranged. Furthermore, the housing may house a machine frame on which a movable equipment head, commonly referred to as a grinding / polishing head, can be horizontally and movably suspended.

[0089] According to one aspect of the invention, the device housing has at least one surface processing station for grinding the bottom surface of a sample, the processing station being particularly designed as a grinding station or a polishing station, i.e., having a rotating and / or vibrating grinding disc with grinding pads for grinding the bottom surface of the sample, or having a rotating and / or vibrating polishing disc for polishing the bottom surface of the sample.

[0090] In addition, a sample transport device with a sample removal position is included for transporting and providing samples for the grinding and / or polishing process. These samples are provided individually and loosely, particularly sequentially, one sample at a time. Preferably, the embedded samples are thus processed individually, and multiple samples are not clamped in a single sample holder. The sample transport device can be designed, for example, as a chute or conveyor belt, through which the embedded samples slide or are automatically transported individually, sequentially, and sequentially to the sample removal position so that they can be removed individually and sequentially there.

[0091] In addition, the equipment includes a sample placement location for placing samples after the grinding and / or polishing process, where the sample can be placed individually after the grinding and / or polishing process is completed at the grinding and / or polishing station. For example, the sample placement location can be designed again as part of a chute or additional conveyor belt, whereby the sample will again automatically, sequentially, and sequentially leave the sample placement location to be collected, for example, into a sample collection device. However, the grinding and / or polishing equipment may also have multiple sample removal locations and / or multiple sample placement locations, in which case the grinding / polishing heads move one after another to the sample removal and sample placement locations to process all samples sequentially.

[0092] The grinding / polishing head includes a sample holder for holding and manipulating the sample, preferably a single embedded sample.

[0093] In order to grind and / or polish the embedded sample, the grinding / polishing head with sample holder is first moved to the sample removal position in a programmed manner, and the sample holder preferably grips a single embedded sample there and holds it firmly.

[0094] Subsequently, a grinding / polishing head with a sample holder moves in a programmed manner to at least one surface processing station and feeds the embedded sample into the station for grinding, particularly grinding or polishing, the bottom surface of the sample. Here, the sample holder securely holds the individual embedded sample and, if necessary, rotates continuously itself in addition to the rotation and / or vibration of the grinding or polishing discs at the surface processing station.

[0095] After grinding or polishing and, if necessary, further surface finishing steps, the grinding / polishing head with a sample holder moves in a programmed manner to the sample placement position to deliver a single embedded sample to the sample placement position, and finally releases the embedded sample in a programmed manner at the sample placement position to store it there.

[0096] Therefore, the entire processing from picking up the embedded sample to storing the embedded sample is automatically operated under program control, and the operator does not need to intervene between samples.

[0097] Preferably, the grinding and / or polishing equipment has a linear displacement device, such as a linear slider driven by a motor and controlled by a programmable controller, which is suspended on the machine frame and moves the grinding / polishing head horizontally to move back and forth between a sample removal position, at least one surface processing station, and a placement position.

[0098] Furthermore, the grinding / polishing head preferably has a vertical linear displacement device, such as a linear slider driven by a motor and controlled by a programmable controller, by which the sample holder is moved vertically to receive the embedded sample at the sample removal position, to lower the embedded sample and press it onto the grinding or polishing disc at at least one surface processing station, and to store the embedded sample at the sample placement position. This can be achieved, for example, by a spindle drive.

[0099] Advantageously, the grinding and / or polishing equipment can fully automate the sequential manipulation of embedded samples, grinding and / or polishing their bottom surfaces, eliminating the need for operator intervention during continuous grinding and / or polishing of multiple sequentially processed embedded samples. The operator can load, for example, the required number of embedded samples, whose total processing time may take several hours, onto the grinding and / or polishing equipment at night, and the next morning, all completed embedded samples are individually prepared in a sample collection device for retrieval. This translates to high efficiency and comfort for the operator when performing planar grinding and / or polishing of embedded samples.

[0100] A further advantage is that a compact design can be achieved when multiple different surface finishing stations, such as a grinding station and a polishing station, or even multiple grinding stations with different abrasive grit sizes and / or multiple polishing stations with different polishing suspensions, are installed in the same device housing and sequentially approached by the same grinding / polishing head. Preferably, all grinding and polishing stations are installed in the same device and are preferably operated by the same grinding / polishing head. However, the device may also have two or more grinding / polishing heads, each with a sample holder that alternately approaches the same surface finishing station within the same device.

[0101] Preferably, the sample holder is suitable for individually gripping, specifically automatically gripping, embedded metallographic samples under program control, without requiring multiple sample holdings, and especially without user intervention. The outer cladding surface of the embedded metallographic sample is preferably cylindrical and formed from a thermoplastic or thermosetting embedding material by pressing the sample in the pressing cylinder of a hot embedding press. The sample holder is particularly suitable for gripping the cylindrical cladding surface of the hot-pressed plastic embedding material of the embedded metallographic sample and holding it securely by friction engagement, for example by multiple gripping fingers radially pressed against the cylindrical cladding surface. Advantageously, additional auxiliary tools, such as cups with special protrusions for gripping by a robotic arm, can be eliminated during the hot embedding process. Therefore, the cladding surface of the cylindrical embedded metallographic sample is preferably composed of a plastic material hot-pressed in the pressing cylinder of an embedding press.

[0102] Regarding sample throughput, initially it seems counterproductive to process embedded samples in isolation. However, high sample throughput can still be achieved, especially if all grinding and polishing steps are preferably performed sequentially and fully automatically in the same equipment, particularly if the grinding and / or polishing equipment operates fully automatically for extended periods, such as overnight, without user intervention. High efficiency can be achieved, particularly in terms of the ratio of sample throughput to effective user working time.

[0103] Furthermore, especially if the embedded sample is held individually and directly by the sample holder and held firmly throughout the processing, it may be possible to eliminate the need to trim or flatten the embedded sample with a grinding stone, which further simplifies the processing.

[0104] In particular, it can achieve a favorable synergy of low cost and low space requirements on the one hand, while still maintaining high working time efficiency and high sample throughput on the other hand, which is an advantageous variable in laboratory operations, such as when preparing embedded samples for hardness testing or tissue analysis.

[0105] For example, sample grippers can be designed as finger grippers with at least three gripping fingers, wherein the gripping fingers are radially movable and grasp and securely hold the embedded sample on the surrounding outer surface of the embedded plastic by radially retracting the gripping fingers. Finger grippers, such as three-finger grippers, have proven suitable for grasping single embedded samples.

[0106] Preferably, the gripping fingers each have a horizontal shoulder, so that when the sample clamp is lowered, the shoulder of the gripping finger acts as a vertical stop against the upper side of the sample, so as to grasp the embedded sample as horizontally as possible.

[0107] This allows for precise gripping of the embedded sample in an advantageous manner, which helps to eliminate the need for trimming when necessary. Furthermore, the shoulders on the sample holder also provide counter-support against the compressive forces during grinding and / or polishing, thus keeping the radial gripping force within acceptable limits and preventing unwanted slippage of the embedded sample during grinding and / or polishing.

[0108] Preferably, the sample holder rotates continuously during the grinding and / or polishing process. For this purpose, the grinding / polishing head has a drive shaft driven by a motor, and the sample holder is fixed to the lower end of the drive shaft. Thus, during the grinding and / or polishing process, the sample holder rotates with the clamped embedded sample at a predetermined rotational speed, particularly simultaneously with the rotation or vibration of the grinding and / or polishing disc. The rotation of the sample holder is preferably also program-controlled, particularly activated program-controlled to perform the grinding and / or polishing process after the embedded sample is clamped at the sample removal position, and preferably terminated program-controlled again before the embedded sample is placed at the sample placement position.

[0109] When the embedded sample is held by the sample holder, the axis of symmetry of the embedded sample is preferably coaxial with the axis of rotation of the sample holder, so that the embedded sample will rotate around its axis of symmetry.

[0110] This allows for the use of relatively small grinding and / or polishing discs, which has a favorable impact on the size of the grinding and / or polishing equipment. Furthermore, the abrasive in the grinding discs can be used efficiently when necessary. Preferably, the diameter of the grinding and / or polishing discs in the surface finishing station is less than or equal to 300 mm, preferably less than or equal to 250 mm, preferably between 80 mm and 250 mm, and preferably between 200 mm + / - 50 mm. In the polishing station with a vibratory disc with horizontal vibration, the polishing discs may be even smaller, for example, with a diameter of at least 50 mm, preferably between 50 mm and 200 mm, and more preferably between 120 mm and 200 mm.

[0111] Preferably, the embedded samples are sequentially and automatically fed one by one into the grinding and / or polishing equipment so that they are sequentially held by the sample holders. For this purpose, the grinding and / or polishing equipment preferably has an automatic sample transport device, through which each embedded sample is automatically and sequentially transported to the sample removal position. When the sample holder grasps and removes the embedded sample currently at the sample removal position, the next embedded sample is automatically transported to the sample removal position, where the next embedded sample is ready for the sample holder after the grinding and / or polishing process of the previous embedded sample is completed.

[0112] This is beneficial to the efficiency of the entire process.

[0113] For example, the automated conveying device may include a chute in which embedded samples slide sequentially towards the sample removal position due to gravity, or a conveyor belt that automatically and sequentially delivers the embedded samples to the sample removal position, wherein the sample removal position is determined by a sample stop if necessary, or a sample cassette, for example, in which a large number of embedded samples are stacked. A sorter may be provided in front of the sample removal position to separate the embedded samples, and / or the lower part of the chute may pivot to a horizontal position to remove the sample, whereby the sample can be horizontally gripped by a sample holder. The sorter separates the samples by a distance from each other, and / or prevents other samples from slipping in while pivoting and / or gripping the sample to be gripped. The bottom sample may also be pushed to the sample removal position by a sample pusher.

[0114] According to a particularly preferred embodiment, the grinding and / or polishing equipment has multiple surface processing stations arranged side-by-side for processing the sample underside, wherein each surface processing station has its own rotating and / or vibrating grinding disc with abrasive pads for grinding the sample underside, or its own rotating and / or vibrating polishing disc for polishing the sample underside. Thus, in a particularly advantageous manner, the grinding / polishing head carrying the gripped embedded sample is sequentially moved to at least two, preferably more than two, for example, 2 to 10, preferably 3 to 8, and most preferably 3 to 6 surface processing stations, depending on the desired surface, to automatically and sequentially grind and polish the same embedded sample, and / or sequentially grind with different grit sizes and / or sequentially polish with different polishing agents. The embedded sample preferably does not need to be re-clamped, but rather all surface processing steps are performed in one and the same grinding and / or polishing equipment, or it is kept on the same grinding / polishing head or sample holder throughout all surface processing steps, and advantageously, no replacement of grinding or polishing discs is required (unless due to wear). This offers advantages in terms of structural dimensions, workflow efficiency, and / or the quality of the results obtained.

[0115] Therefore, the grinding and / or polishing equipment preferably has at least one first grinding station with a first grinding disc and a first polishing station with a first polishing disc. The grinding / polishing head preferably moves first to the first grinding station with the embedded sample held by the sample holder, and then, preferably with intermediate intervention at the cleaning station, moves to the first polishing station, particularly without re-clamping the embedded sample, so that the same embedded sample is automatically ground first and then polished in the same grinding and / or polishing equipment under program control.

[0116] The grinding and / or polishing equipment preferably has at least two, preferably even more than two grinding stations, each with a grinding disc, for example, a first grinding station with a first grinding disc, a second grinding station with a second grinding disc, a third grinding station with a third grinding disc, and possibly further grinding stations with further grinding discs, and / or at least two or more polishing stations, each with a polishing disc, for example, a first polishing station with a first polishing disc and a second polishing station with a second polishing disc. Here, the grinding / polishing head is preferably moved sequentially with the gripped embedded sample to at least two, three or more grinding stations and / or at least one polishing station without re-clamping, so that the same embedded sample can be automatically ground and / or subsequently polished with different grit sizes in the same grinding and / or polishing equipment under program control, and, if necessary, polished sequentially with different polishing agents.

[0117] According to a preferred embodiment, the grinding and / or polishing apparatus has at least one cleaning container or cleaning bath, which is approached by the grinding / polishing head in a programmed manner, into which the captured embedded sample is immersed before, during, and / or after the grinding and / or polishing process. Preferably, the cleaning container of the at least one has a liquid inlet and / or a liquid outlet so that the cleaning container can be automatically filled and / or emptied in a programmed manner.

[0118] Preferably, the grinding and / or polishing equipment has at least one gas nozzle on the cleaning container for automatically drying the gripped embedded sample in a programmed manner before, between, and / or after the grinding and / or polishing process. Thus, the embedded sample can be first ground by a clamp at the grinding station, then immersed in a cleaning bath to rinse away the grinding debris, then dried above the cleaning liquid surface in the cleaning bath, and then polished—all of which can be performed in a programmed manner using the same grinding / polishing head or the same sample clamp, especially for samples that do not require re-clamping.

[0119] Grinding and / or polishing equipment preferably has one or more liquid nozzles for metering feed coolant and / or rinsing fluid, such as water, to meter the feed coolant and / or rinsing fluid during the grinding process at the grinding station. Additionally, polishing suspensions, such as diamond particle suspensions, can also be metered into the polishing station through one of the liquid nozzles.

[0120] Therefore, liquid nozzles for coolant, rinsing fluid, and / or polishing suspension are preferably arranged on the grinding / polishing head so that they can move from one surface processing station to another along with the embedded sample. This allows the same or a few liquid nozzles to serve several surface processing stations. Thus, regardless of the number of surface processing stations, the grinding and / or polishing equipment only needs one set of liquid nozzles for each grinding / polishing head. Preferably, at least two liquid nozzles are arranged on the grinding / polishing head: at least one for coolant and rinsing fluid during the grinding process and at least one for polishing suspension during the polishing process. This allows for automatic metering of the feed coolant and / or rinsing fluid at the grinding station and the feed polishing suspension at the polishing station under program control. However, more than two liquid nozzles can also be provided, for example, for various different coolant and rinsing fluids, particularly for different polishing suspensions.

[0121] According to one possible implementation, the surface finishing stations and at least one possible cleaning container are arranged in a straight line within the grinding and / or polishing equipment. The grinding / polishing heads are preferably arranged along this line and suspended in a manner that allows for linear movement via a linear guide, enabling sequential access to different surface finishing stations. Specifically, the grinding / polishing heads move along the linear guide past the surface finishing stations and possible cleaning containers, and automatically stop at each corresponding station under program control. The embedded sample is then lowered by a clamp, for example, onto a grinding disc at the grinding station for grinding, into a cleaning bath for cleaning, and / or onto a polishing disc at the polishing station for polishing. In a laboratory setting, such a linear arrangement is advantageous in terms of space requirements.

[0122] To further utilize the laboratory's space, surface finishing stations and at least one possible cleaning container can also be arranged in a two-dimensional configuration on a horizontal plane. For example, two grinding stations and two polishing stations can be arranged in a 2x2 configuration, three grinding stations and two polishing stations in a 3x2 configuration, or even more surface finishing stations. Preferably, one or more cleaning containers are also arranged between the grinding and / or polishing stations, which can be laterally offset if necessary. Such an arrangement can be advantageous in terms of the path to the surface finishing stations and possible cleaning containers, which is beneficial for processing speed. In a two-dimensional arrangement, the grinding / polishing heads are also suspended in a manner that allows independent movement in two dimensions, such as independently in the x and y directions, to access all points in the horizontal plane. For example, this can be achieved by a gantry arrangement similar to that of a container crane, allowing access to all surface finishing stations and one or more cleaning containers in both the x and y dimensions. For this purpose, the grinding / polishing heads can be suspended, for example, on a U-shaped bridge, with the grinding / polishing heads suspended on the bridge in a manner that allows movement in a linear direction, either x or y. The bridge itself is located on a linear guide device, which allows the bridge to move in another linear direction, either y or x.

[0123] The housing of the grinding and / or polishing equipment preferably has a safety shield, such as in the form of a protective fence, in which all moving parts, such as clamps, grinding / polishing heads, and / or all grinding and / or polishing stations are housed to prevent the risk of injury. The safety shield can open at the front, wherein the front opening is secured by a light grating, such as a (laser) light grating, to prevent intrusion. If an operator enters the interior of the safety shield through the light grating, for example by touching a sample clamp, grinding station, polishing station, or cleaning container, the light grating automatically activates for an emergency closure.

[0124] The sample holder is suspended from the grinding / polishing head, particularly utilizing a vertical linear guide device, in a manner that allows for vertical linear movement. For vertical movement of the sample holder, the grinding / polishing head preferably has a vertical linear slider, and the sample holder and / or a motor for rotating the sample holder are suspended on the linear slider in a manner that allows for longitudinal movement in the z-direction (perpendicular to the table surface). For example, the vertical linear slider may have a mandrel driver for vertical movement of the sample holder. This allows for vertical displacement and simultaneous continuous rotation of the sample holder, thus enabling the sample holder to automatically, under program control: i) move together with the grinding / polishing head to one or more sample removal positions, one or more grinding stations, one or more polishing stations, one or more cleaning containers, and / or one or more sample placement positions; ii) lower here to receive and grasp embedded samples, grind, polish, rinse, and / or store the embedded samples; and iii) rotate, for example, during grinding, polishing, and / or rinsing; and iv) subsequently move upwards again before the next processing step. Preferably, each embedded sample, from its introduction into the grinding and / or polishing equipment until it becomes a fully ground, polished, and cleaned embedded sample, is held by a sample holder and automatically, individually and sequentially guided under program control through a grinding process that may have multiple grinding steps, a polishing process that may have multiple polishing steps, and a cleaning process that may have multiple cleaning steps, if necessary, within a single, unified apparatus. The grinding and / or polishing equipment can still be constructed relatively compactly, and may even be used as a desktop apparatus if necessary. The thus fully ground, polished, and cleaned embedded samples can then be directly subjected to, for example, hardness testing using a hardness tester, such as the applicant's Q-series hardness tester, or microstructural analysis.

[0125] Preferably, the embedded sample exists loosely at the sample receiving position as a separate embedded sample, without the need for manual clamping in a special sample holder, especially for sample holders containing multiple embedded samples. Furthermore, it is advantageous if the same grinding and / or polishing head with the same sample clamp can automatically approach multiple grinding stations and / or multiple polishing stations, where different abrasives and / or polishing compounds are used if necessary, especially under program control, without re-clamping the embedded sample.

[0126] For grinding and / or polishing the embedded sample, it is advantageous that the grinding / polishing head has a force sensor that measures the compressive force of the sample holder used to press the embedded sample onto the grinding or polishing disc, and a control loop that adjusts the compressive force of the embedded sample to a predetermined value via a driver of a vertical linear slider, preferably a mandrel driver.

[0127] Further preferably, the displacement of the sample holder in the vertical direction (z-direction) is measured. For this purpose, the grinding / polishing head preferably has a displacement gauge to measure the linear travel of the sample holder or its vertical linear slider in the z-direction. In this way, for example, a layer thickness set by the operator can be automatically removed during the grinding process in a programmed manner. To this end, the vertical linear slider holds the embedded sample against the grinding disc until contact with the grinding disc is detected by a force sensor and stored as the zero point position of the movement displacement. Subsequently, the grinding of the embedded sample continues automatically under program control until the grinding thickness value previously set by the operator in the program controller is reached. Therefore, the zero point of the predetermined layer thickness removal can be determined by the force sensor.

[0128] Another object of the present invention is a method for automatically grinding and / or polishing, especially the bottom surface of embedded samples, under the automatic control of a programmable controller, particularly using the aforementioned grinding and / or polishing apparatus, wherein the programmable controller automatically controls a grinding / polishing head having a sample clamp movable in the z-direction in at least the following steps, particularly without re-clamping the sample:

[0129] a) Move the grinding / polishing head to the sample removal position and lower the sample clamp. At the sample removal position, use the sample clamp to grasp the sample, especially loose, single embedded samples.

[0130] b) Move to the grinding station, lower the sample holder containing the sample, and press the sample onto the rotating grinding disc at the grinding station with a predetermined extrusion force, especially while the sample holder rotates simultaneously. If necessary, meter the feed coolant at the same time, and then lift the sample holder containing the sample.

[0131] c) If necessary, move the sample held by the sample holder into the cleaning container (sample bath), lift the sample out of the cleaning container, and dry the sample if necessary.

[0132] d) Repeat step b) if necessary, but at different grinding stations, especially those with grinding discs similar to those in step b).

[0133] e) Repeat step c) if necessary.

[0134] Steps d) and / or e) can be repeated several times, especially at other grinding stations with other grinding discs.

[0135] f) Move to the polishing station, lower the sample holder containing the sample, and press the sample onto the polishing disc at the polishing station with a predetermined extrusion force, especially while the sample holder rotates simultaneously, metering the polishing suspension if necessary, and then lifting the sample holder containing the sample.

[0136] g) If necessary, move the sample to the cleaning container, immerse the sample held by the sample holder into the cleaning container (sample bath), and lift the sample out of the cleaning container. If necessary, dry the sample.

[0137] h) Repeat step f) if necessary, but use different polishing agents at different polishing stations, such as a different polishing suspension metered in the feed than in step f).

[0138] i) Repeat step g) if necessary.

[0139] Steps h) and / or i) can be repeated several times, especially at other polishing stations using other polishing agents, such as other polishing suspensions.

[0140] h) Move the grinding / polishing head to the sample placement position, place the sample in the sample placement position using the sample clamp, especially by lowering the sample clamp and releasing the sample using the sample clamp.

[0141] The present invention also aims to provide a grinding / polishing and / or etching apparatus for processing the bottom surface of embedded samples, particularly as described above, comprising:

[0142] Equipment casing,

[0143] A sample clamp for gripping samples, wherein the sample clamp is configured to grip each embedded sample, and

[0144] At least one or more of the following workstations or combinations thereof:

[0145] A grinding station equipped with a grinding disc and grinding pads is used to grind the bottom surface of embedded samples in a grinding process.

[0146] The cleaning station is used to clean the bottom surface of embedded samples.

[0147] A polishing station with a polishing disc is used to grind the bottom surface of embedded samples in a polishing manner, and / or

[0148] Etching station, used to etch the bottom surface of embedded samples.

[0149] The embedded sample is gripped by a sample fixture, which then delivers the gripped embedded sample to one or more workstations for processing the sample bottom surface or cleaning the embedded sample at each corresponding workstation.

[0150] Grasping individual embedded samples has proven advantageous in automating workflows. Furthermore, manual clamping in the sample holder can be eliminated, as can trimming if necessary. Additionally, the device can be built in a relatively small size and is cost-effective.

[0151] Automated production line

[0152] The present invention also relates to an automated production line that can automatically perform the embedding of metallographic samples and subsequent surface processing of the embedded samples in a program-controlled manner, especially without operator intervention, and the samples automatically pass through the production line from embedding to a finished state with a prepared, i.e., ground and possibly polished, sample bottom surface.

[0153] The production line includes an automatic embedding press for sequentially embedding and ejecting multiple samples under program control, and an automatic surface finishing device for sequentially finishing the bottom surfaces of the multiple samples embedded by the embedding press under program control, particularly as described above. The surface finishing device further includes a sample removal position for the embedded samples delivered from the embedding press and a sample placement position for storing the surface-finished embedded samples. The finishing of the sample bottom surfaces is performed by grinding, particularly grinding and / or polishing. Therefore, this surface finishing device is particularly a grinding and / or polishing device, which can be used to grind and / or polish the sample bottom surfaces.

[0154] At the end of the production line, i.e. after the surface processing equipment, there may be a sample collection device for collecting multiple embedded samples that have been embedded by an embedding press and ground and / or polished by grinding and / or polishing equipment, for the operator to remove and use further.

[0155] Samples embedded and ejected by the embedding press are automatically and sequentially transported by a first conveying device to the sample removal position of the grinding and / or polishing equipment. If necessary, embedded samples ground and / or polished by the grinding and / or polishing equipment can be transported from the sample placement position to the sample collection device via a second conveying device. Thus, embedded samples are automatically fed into the grinding and / or polishing equipment and / or automatically transferred out of it again.

[0156] The embedding press and grinding and / or polishing equipment are automatically controlled by a programmable controller, enabling the embedding press and grinding and / or polishing equipment to sequentially embed and grind and / or polish multiple samples under program control.

[0157] Using this production line, a large number of samples can be automatically embedded and ground in one go under program control, and polished when necessary, without operator intervention. This greatly improves efficiency compared to traditional equipment.

[0158] Preferably, the samples are not only individually embedded, but the embedded samples are also individually further processed throughout the production line, particularly without sample holders. Specifically, the first and / or second conveying devices transport the embedded samples individually and loosely. Furthermore, the embedded samples are individually ground and / or polished in grinding and / or polishing equipment, and / or individually stored in sample placement positions after grinding and / or polishing, and / or the embedded, ground, and, if necessary, polished samples are automatically and loosely stored individually in sample collection devices after passing through the production line, for example, in boxes with multiple placement positions for the ground and, if necessary, polished embedded samples, ready for operator retrieval. The embedded samples prepared in the sample collection device can be used directly from there, for example, for analytical equipment such as hardness testers, microscopes, macromicroscopes, or similar analytical equipment, or for microstructural analysis or other metallurgical analyses, especially without requiring further surface processing steps on the actual material samples.

[0159] This advantageously saves operators the need to clamp and release several samples, such as six samples, on a single sample holder, which is required in many conventional devices. This simplifies the combined process of embedding and surface finishing, and helps to improve the efficiency of the production process of embedded, ground, and, where necessary, polished samples.

[0160] To transport individual loosely embedded samples from the embedding press to the grinding and / or polishing equipment, and / or from the latter to the collection station, conveyor belts, such as chutes or motor-driven conveyors, can be used. Since the embedded samples continue to move individually through the production line after the embedding press, the conveyor belts, but also the grinding and / or polishing equipment, can have a relatively compact design. The conveyor belt only needs a net transport width corresponding to the diameter of a single embedded sample, which can be between 15 mm and 100 mm, preferably between 25 mm and 50 mm.

[0161] The entire production line, including the automated embedding press and grinding and / or polishing equipment, can be constructed in a very compact manner, allowing it to be placed on a laboratory bench. In this case, the floor space of the production line is preferably a maximum of 800cm × 150cm, preferably a maximum of 600cm × 120cm, and preferably a maximum of 400cm × 90cm.

[0162] An automated embedding press preferably includes a pressing unit with a pressing cylinder, a dispensing device for metering the feed embedding material, such as plastic granules, and a sample loading platform with multiple loading positions where the operator can place the sample to be embedded. In a preparatory step, the operator can load the sample to be embedded into multiple loading positions, for example, dozens of samples. After this typically only manual preparatory step, the operator can start the production line via a programmable controller. The production line then automatically and sequentially embeds the samples, automatically and sequentially conveying the embedded samples to a grinding and / or polishing device. The grinding and / or polishing device automatically and sequentially grinds the bottom surface of the embedded samples, polishes them if necessary, and conveys the embedded and ground / or polished samples to a sample collection device, preferably as a single loose embedded sample, without the need for a sample holder.

[0163] For embedding the sample, the pressing cylinder preferably has a first opening at the bottom and a second opening at the top. The sample to be embedded preferably enters the pressing cylinder through the first opening at the bottom from the corresponding loading position, and the embedding material is metered into the pressing cylinder through the second opening at the top.

[0164] Introducing the sample to be embedded and the embedded particles into the space of the compression cylinder for separation has structural advantages and helps to further improve the efficiency of embedding samples in the compression cylinder under automatic program control.

[0165] After the embedding and pressing process, the embedded sample is preferably moved upward from the pressing cylinder through the second opening at the top, and the pressing unit includes a sample ejector that ejects the embedded sample from the pressing unit to the first conveying device in a program-controlled manner.

[0166] Automatic sample ejectors help improve the automation level of production lines, and the separation of sample introduction into the pressing cylinder and the space from which the embedded sample is ejected from the pressing cylinder has a structural advantage for automated production lines.

[0167] Following the embedding and pressing process, the pressing piston preferably moves upward within the pressing cylinder, thereby removing the embedded sample upward from the pressing cylinder. Then, a sample ejector, for example designed as a motor-driven pusher, can push the embedded sample from the pressing piston onto the first delivery device transversely to the axis of the pressing cylinder, i.e., substantially horizontally. The motor-driven pusher may, for example, include an electric motor, a pneumatic or hydraulic actuator.

[0168] This overcomes surface adhesion between the embedding material and the pressing cylinder, and the path of the embedded sample can be kept short, which can contribute to the compactness of the production line and the simplicity of the structure.

[0169] Preferably, the surface processing equipment for grinding and polishing the bottom surface of the embedded sample includes:

[0170] A grinding station with a grinding disc and grinding pads is used to grind the bottom surface of the sample, and a polishing station with a polishing disc is used to polish the bottom surface of the sample. This surface treatment equipment is therefore preferably a combination of grinding and polishing equipment with corresponding grinding and polishing stations. Preferably, multiple grinding stations and, if necessary, multiple polishing stations exist in one and the same equipment, so that all necessary grinding processes of different grit sizes and all necessary polishing processes using different polishing suspensions can be performed in one and the same equipment. Each grinding station preferably has its own grinding tank, its own grinding disc, and grinding pads applied to the relevant grinding disc, and each polishing station preferably has its own polishing tank and its own polishing disc, which, if necessary, has polishing pads, which may also include polishing cloths.

[0171] The embedded sample is preferably picked up from the sample removal position by a sample holder, that is, the sample holder holds the single loose embedded sample there and moves it from one station to another so that the bottom surface of the sample can be subjected to the corresponding surface finishing steps. In other words, the sample holder picks up the single sample and then first moves it to one of the grinding stations for a first grinding process. Subsequently, the sample holder can move the same embedded sample to the next grinding station for a grinding process, for example, with a finer grit. Subsequently, the sample holder can move the same sample to the polishing station for a polishing process, and so on. Preferably, about 4 to 6 grinding and polishing processes are performed on each sample with different abrasives and polishing agents, with each grinding and polishing process performed at its own station. The advantage of doing so is that it avoids the need to change the grinding and / or polishing pads between grinding and / or polishing processes, i.e., during the process, unless the grinding pads need to be replaced due to wear. This makes the grinding and polishing process highly efficient.

[0172] If necessary, the grinding and / or polishing equipment may also include a cleaning container, and the sample holder moves the embedded sample to a cleaning station after each grinding and polishing process for rinsing and cleaning the embedded sample.

[0173] After all the necessary grinding and polishing processes, as well as cleaning processes if necessary, are completed, the grinding / polishing head with the sample holder moves the sample to the sample placement position, where the sample holder stores the sample.

[0174] As already explained, in grinding and / or polishing equipment, embedded samples are also processed individually, and preferably loosely, i.e., the sample holder is designed to individually grip the embedded sample without a sample holding device, and to move the individual sample gripped in this way from one grinding station to another, from one grinding station to another, and from one polishing station to another, with cleaning stations provided in between if necessary, so that it passes through all grinding and polishing processes and cleaning processes if necessary.

[0175] This avoids clamping and removing samples from the sample holder. Furthermore, the handling of individual samples and the elimination of multiple sample holders during intermediate storage between the embedding press and grinding and polishing equipment, final storage in the sample collection device, and transport on the conveyor belt contribute to space savings. Additionally, grinding, polishing, and / or cleaning stations can be implemented with small structural dimensions, which synergistically contributes to the compactness and cost savings of the production line. The contradiction currently present in embedded sample production—high automation and efficiency on one hand, and low space requirements and low cost on the other—can be reconciled.

[0176] Preferably, the grinding / polishing head has a drive shaft driven by a motor. A sample holder is arranged on the drive shaft so that the sample holder rotates about the rotation axis. High-quality grinding or polishing results can be obtained if the sample also rotates during the grinding and polishing process, in addition to the rotation or vibration of the grinding or polishing discs. Preferably, when the embedded sample is gripped by the sample holder, the sample's axis of symmetry is coaxial with the sample holder's axis of rotation, causing the embedded sample to rotate about its axis of symmetry.

[0177] Within an automated production line, it is advantageous if the same grinding and / or polishing equipment includes at least two or more grinding stations, such as 2, 3, 4, 5, 6, 7, 8, or more, each with its own grinding disc and grinding pad. Therefore, different grinding pads of different grit sizes can be set at different grinding stations, so that when grinding the bottom surface of a sample with several different grit sizes, such as 2, 3, 4, 5, 6, 7, 8, or more, especially when grinding all grit sizes of embedded samples, there is no need to change the grinding pads. In embedded sample production series, such as grinding dozens of samples, all the different grit sizes of grinding pads required are simultaneously installed at different grinding stations, so that the grinding pads do not need to be changed between grinding processes; instead, the sample is moved sequentially from one grinding station to another without changing the grinding pads in between. In other words, the same grinding and / or polishing equipment includes at least so many grinding stations that each grit size has its own grinding station, and all these grinding stations belong to the same grinding and / or polishing equipment, or can be accessed using the same sample fixture.

[0178] This can also be applied to polishing stations, where at least one, but preferably at least two or more, such as 2, 3, 4 or more, exist within the grinding / polishing equipment. Thus, each polishing station can correspond to a specific polishing agent, such as a specific polishing suspension. In this way, it is possible to avoid changing polishing pads or thoroughly cleaning the polishing station between samples if necessary. Similarly, it is preferable for production lines of embedded samples, such as dozens of samples, to have polishing agents available simultaneously at different polishing stations, so that when polishing multiple embedded samples, the polishing pads and / or polishing suspensions do not need to be changed; instead, the samples are moved sequentially from one polishing station to another without the need to change the polishing pads and / or polishing suspensions in between. In other words, one and the same grinding and polishing equipment includes at least so many polishing stations that each polishing pad or each polishing suspension has its own polishing station, and all these polishing stations belong to the same grinding and polishing equipment or can be accessed using the same sample holder.

[0179] This specifically means that all grinding stations with the grinding discs required for embedding the sample and all polishing cloths and / or polishing suspensions required for the same sample belong to the same grinding and polishing equipment, or can be accessed using the same sample holder. Therefore, each embedded sample is gripped once by the sample holder, and then one and the same sample holder is used to access all the required grinding stations (e.g., 2, 3, 4, 5, 6, 7, 8 or more) and / or all the required polishing stations (e.g., 1, 2, 3, 4 or more) to perform the respective grinding and / or polishing processes at these stations with different grit sizes, and, if necessary, different polishing cloths and / or polishing suspensions, wherein, throughout all grinding and / or polishing processes, the embedded sample remains held by the same sample holder.

[0180] The grinding and / or polishing apparatus may further include at least one cleaning container, preferably two or more, which are approached by the grinding / polishing head or sample holder, into which the respective clamped embedded sample is immersed for cleaning before, between and / or after the grinding and polishing process.

[0181] One aspect of the invention relates to an automated method for producing multiple embedded samples having ground and / or polished sample bottom surfaces, particularly using the aforementioned production line, comprising the following steps, with additional steps interspersed where necessary:

[0182] a) In the preparatory steps, multiple samples to be embedded are provided on the embedding press. If necessary, the operator manually places the samples at their respective loading positions on the sample loading stage.

[0183] b) Press the first sample to be embedded with embedding material in the pressing cylinder of the embedding press to produce the first embedded sample.

[0184] c) Eject the first embedded sample from the compression cylinder.

[0185] d) The first embedded sample is transferred from the embedding press to the surface processing equipment.

[0186] e) Use the sample holder of the surface processing equipment to grasp the first embedded sample, specifically, grasp it individually.

[0187] f) Approaching at least one, preferably multiple, surface processing stations, such as one or more grinding stations and / or one or more polishing stations of the same surface processing equipment, with the same sample fixture, to process the bottom surface of the first embedded sample, preferably multiple times, in these one or more different surface processing stations with different abrasives and / or polishing agents.

[0188] g) Approach the sample placement position with the sample clamp and place the first embedded sample into the sample placement position.

[0189] h) Repeat steps b) to d) and e) to g) several times to automatically produce multiple embedded samples with surface-processed sample bottoms, wherein all finished embedded samples with surface-processed sample bottoms are automatically and individually fed into a sample collection device to await operator retrieval. Here, steps b) to h) are performed automatically under program control, specifically, all samples are automatically processed sequentially, without operator intervention. The repetition cycles of steps b) to d) and e) to g) can be independent or synchronous, wherein the embedded samples can be buffered between the embedding press and the surface processing equipment. Especially if the repetition cycles of steps b) to d) and e) to g) are independent, and embedding is performed more than one embedded sample ahead, the embedded samples are buffered between the embedding press and the surface processing equipment.

[0190] Preferably, after each grinding and / or polishing process, the sample holder is also moved to the cleaning container under program control, and the embedded sample held by the sample holder is immersed in the cleaning container to rinse or clean the embedded sample. Attached Figure Description

[0191] The invention will be explained in more detail below by way of embodiments and with reference to the accompanying drawings, wherein the same and similar elements are partially provided with the same reference numerals, and the features of the various embodiments may be combined with each other.

[0192] In the picture:

[0193] Figure 1 A 3D view of an automatic embedding press is shown.

[0194] Figure 2 It shows Figure 1 The cross-section of the embedded press.

[0195] Figure 3 It shows Figure 1 A three-dimensional cross-sectional view of the embedding press.

[0196] Figure 4 It shows Figure 1 A schematic cross-sectional view of the embedding press in the start-up state.

[0197] Figure 5 It shows Figure 4 In the case of metering and feeding of encapsulated particles,

[0198] Figure 6 It shows Figure 4 During the embedding and compression process

[0199] Figure 7 It shows Figure 4 When the embedded sample is ejected...

[0200] Figure 8 A cross-section of a sample embedded by an example is shown.

[0201] Figure 9 A three-dimensional illustration of an automated grinding and polishing device is shown.

[0202] Figure 10 It shows Figure 9 A magnified view of a portion of the feed chute.

[0203] Figure 11 It shows Figure 9 However, it has a feed belt.

[0204] Figure 12 It shows Figure 11 A magnified view of a portion of the feed belt.

[0205] Figure 13 It shows Figure 9 In this case, but with a vertical feed box,

[0206] Figure 14 It shows Figure 13 The enlarged section of the feed box,

[0207] Figure 15 It shows Figure 9 Grinding and polishing equipment with safety covers

[0208] Figure 16 It shows Figure 15 A partial sectional view of the grinding station in a medium-sized polishing and grinding equipment.

[0209] Figure 17 It shows Figure 16 3D view of the intermediate grinding station.

[0210] Figure 18 A vertical cross-sectional view through the cleaning bath is shown.

[0211] Figure 19 A 3D diagram of a grinding and polishing head without a housing is shown.

[0212] Figure 20 It shows along Figure 19 The AA section line passes through the vertical cross-section of the grinding and polishing head.

[0213] Figure 21 It shows along Figure 19 The BB section line passes through the vertical cross-section of the grinding and polishing head.

[0214] Figure 22 A perspective view of an automated grinding and polishing apparatus with an etching module is shown.

[0215] Figure 23 It shows Figure 22 A 3D diagram of the etching module.

[0216] Figure 24 It shows Figure 22 A 3D cross-sectional view of the etching module in the image.

[0217] Figure 25 It shows the way Figure 22 A schematic cross-sectional view of the etching module.

[0218] Figure 26 A 3D view of a fully automated embedding, grinding, and polishing production line on a laboratory bench is shown.

[0219] Figure 27 A 3D diagram of another embodiment of a fully automated embedding, grinding, and polishing production line is shown.

[0220] Figure 28 It shows Figure 27 The embedding, grinding, and polishing production line in the middle is equipped with safety covers.

[0221] Figure 29 It shows the use of according to Figures 1 to 7 An exemplary method flow for embedding samples using an embedding pressure machine.

[0222] Figure 30 It shows the use of according to Figures 9 to 21 An exemplary method process for performing grinding and polishing using grinding and polishing equipment.

[0223] Figure 31 It shows the use of according to Figures 26 to 28 An exemplary method flow for producing embedded samples on a production line. Detailed Implementation

[0224] 1. Automatic embedding press

[0225] Reference Figures 1 to 7 An example of an automatic encapsulation press 110 is shown. The encapsulation press 110 has a housing 112, in this example having three storage containers 114 for plastic granules used as encapsulation material, each storing different encapsulation granules. A dispensing device 115 can meter and feed the different encapsulation granules into the pressing cylinder in a programmed manner at the desired amounts, without user intervention. For this purpose, the storage containers 114 are connected to a common feed hopper 118 via connecting pipes 116, allowing the desired encapsulation granules to be selectively metered from the respective storage containers 114 into the pressing cylinder through the feed hopper 118.

[0226] Reference Figure 5 The embedded particles 117 are conveyed from the respective storage containers 114 to the feed hopper 118 via the metering screw 120 in the connecting pipe 116, which has a metering gate 119 at the outlet.

[0227] Reference Figure 1 and Figure 3 The embedding press 110 has a sample loading stage 122 with multiple loading positions 124, in this example, 32 loading positions 124. In this example, the sample loading stage 122 is designed as a rotary table, and the loading positions 124 are arranged around the outer periphery of the sample loading stage 112 in an annular region 123. Each loading position 124 includes a cylindrical hole 127 in the sample loading stage 122 and a piston 128 in the form of a metal cylinder placed in the hole. The piston 128 rests against an edge 130 at its lower part and is slidable upward out of the hole. The piston 128 is formed as a pressing piston for the heated pressing cylinder 132 of the pressing unit 134.

[0228] In the preparation step, the operator places the sample 126 to be embedded onto the piston upper side 128b of each corresponding piston 128. The operator loads the metallographic sample 126 to be embedded into some or all of the loading positions 124. Figure 1 The two parts are symbolized as bolts cut in half. Therefore, the operator places each sample 126 to be embedded individually onto one of the loading positions 124. The piston 128 located within the loading position 124 is slightly recessed in the sample loading stage 122, which facilitates positioning of the sample 126 to be embedded when placed on the pressing piston 128.

[0229] Following the manual preparation steps, the operator can initiate a program-controlled, fully automated embedding process to embed all placed samples 126 to be embedded. The control device or programmable controller 111 controls the embedding process of the samples 126 cyclically. In each cycle, under program control, the sample loading stage 122 moves the loading position 124 and the pressing piston 128 located therein, along with the sample 126 to be embedded, into the sample receiving position 136 of the pressing unit 134, i.e., below the pressing cylinder 132.

[0230] Figures 4 to 7 The cyclic steps of a periodic cycle of thermal embedding and pressing are schematically shown for one of the samples 126 to be embedded.

[0231] exist Figure 4In this design, the sample 126 to be embedded and placed on its pressing piston 128 is located in the sample receiving position 136 below the pressing cylinder 132. A piston drive device 138, in this example in the form of a piston rod, moves upward, coupled from below to the pressing piston 128, and pushes the pressing piston 128 through the lower opening 132a of the pressing cylinder 132 into its cavity 135. For example, the piston rod 138 may be part of a hydraulic cylinder or driven by a motor-driven spindle, not shown in detail in the figure.

[0232] Now for reference Figure 5 One or more potentially different encapsulated particles 117 are metered into the cavity 135 through the upper opening 132b of the pressing cylinder 132 by means of the dispensing device 115, and onto the sample 126 and the pressing piston 128. Subsequently, the dispensing port 132b of the pressing cylinder 132 is closed by the horizontal sliding closing slider 140 above the pressing cylinder 132.

[0233] Reference Figure 6 Then, under high pressure, the sample 126 and the embedded particles 117 are hot-pressed together between the pressing piston 128 and the closed slider 140 using the piston rod 138 and the pressing piston 128 while the pressing cylinder 132 is heated. In this example, two different types of embedded particles 117 are metered in: first, higher-quality particles surround the sample 126 at the bottom, and lower-cost particles 117 are in the upper region.

[0234] After the thermal embedding and pressing process is completed, the closing slider 140 is pulled to one side again to open the pressing cylinder 132 at the top. Subsequently, the pressing piston 128 is moved upward by the piston drive device, and the embedded sample 142 is now removed from the pressing cylinder 132 through the upper opening 132b.

[0235] Reference Figure 7 The embedded sample 142 is now automatically pushed horizontally to the side by the sample ejector 144 from the compression piston 128, wherein in this example, the embedded sample 142 is ejected from the side ejection opening 147 of the compression unit 134 and reaches the sample slide 148, on which the embedded sample 142 slides into the collection container 150. Figure 1 ).exist Figures 1 to 7 In the example of the embedding press 110 shown, the embedding sample 142 is collected in the collection container 150.

[0236] Subsequently, piston rod 138 moves pressing piston 128 downward again, returning pressing piston 128 to its loading position 124, and piston rod 138 disengages from pressing piston 128 again. For this purpose, piston rod 138 is locked within each corresponding pressing piston 128 (not shown) so that it cannot disengage from piston rod 138 when pressing piston 128 is pulled out of pressing mold or pressing cylinder 132. The locking structure is designed to be activated and released by a control device or programmable controller 111. Advantageously, when pressing piston 128 is placed in sample loading stage 122, it is decoupled from piston rod 138, and piston rod 138 continues to move downward slightly so that sample loading stage 122 can move the next sample 126 to be embedded into pressing unit 134 or under pressing cylinder 132.

[0237] Now that the cycle of embedding the first sample is complete, the next cycle can begin in the same way, with the sample loading stage 122 moving the next loading position 124 to the sample receiving position 136 below the pressing cylinder 132.

[0238] In the example of the embedding press 110 shown in the figure, the sample loading stage 122 is designed as a rotary stage, which is rotated one position each cycle by a drive 151 that is periodically controlled by a programmable controller 111, so as to couple the piston rod 138 with the next pressing piston 128 having the sample 126 to be embedded on it.

[0239] The cross-section of the pressing unit 134 is generally U-shaped. Figure 2 , Figures 4 to 6 The pressing cylinder 132, after being heated and possibly cooled, has an inlet 152. The loading position 124, with the sample 126 to be embedded and the associated pressing piston 128, periodically enters laterally into the inlet 152, which in this example is designed as a laterally open recess. In this example, this is accomplished by rotating the rotary table by an angular segment corresponding to the interval of the loading position 124. However, it is also conceivable to use a linear sample loading stage 122, advancing the sample loading stage 122 one cycle position in each cycle, thereby allowing the next pressing piston 128 to enter the pressing cylinder 132. The inlet 152 of the pressing unit 134 can also be protected from intrusion (not shown) if desired.

[0240] Therefore, apart from the preparatory manual loading step, the embedding press 110 is a fully automatic embedding press 110. This means that for multiple samples 126 to be embedded, the embedding and pressing process and the ejection of the samples are performed sequentially and automatically under program control. In other words, in the preparation step, the operator loads all the samples 126 to be embedded into the loading position 124, starts the embedding press 110, and from this point on, the embedding and pressing process runs completely automatically for all the samples 126 to be embedded. Therefore, the operator can, for example, load and start the embedding press 110 at night and obtain all the samples in the embedded state in the collection container 150 the next morning. Figure 8 A cross-section of an example of an embedded sample 142 is shown.

[0241] Reference Figure 29 One embodiment of the embedding compression method includes a preparatory method step performed by an operator, namely, loading multiple samples to be embedded onto a sample loading stage in step 402, followed by a cyclical execution of method steps each comprising the following program-controlled steps:

[0242] Step 404: Move the sample loading stage 122, wherein one of the loading positions 124 with one of the pressing punches 128 and the sample 126 to be embedded placed thereon is moved to the sample receiving position 136 under the pressing cylinder 132 of the pressing unit 134.

[0243] Step 406: Move the piston drive 138 onto the pressing punch 128 and couple the piston drive 138 to the pressing punch 128 in the loading position 124 in the sample receiving position 136.

[0244] Step 408: The piston drive device 138 pushes the pressing punch 128, which carries the sample 126 to be embedded, from below into the cavity 135 of the pressing cylinder 132.

[0245] Step 410: One or more encapsulated particles 117 are metered into the pressing cylinder 132 through the upper opening 132b, onto the pressing punch 128 and the sample 126 to be encapsulated placed thereon.

[0246] Step 412: Close the upper opening 132b of the pressing cylinder 132.

[0247] Step 414: Under pressure and temperature, the sample and embedded particles 117 are hot-pressed in the pressing cylinder 132.

[0248] Step 416: Open the pressing cylinder 132.

[0249] Step 418: Remove the embedded sample 142 from the compression cylinder 132.

[0250] Step 420: Eject the embedded sample 142 from the compression unit 134.

[0251] Step 422: Pull the pressing punch 128 out of the cavity 135 of the pressing cylinder 132 and place the pressing punch 128 in the placement position, especially in the loading position 124 of step 406.

[0252] Step 424: Decouple the piston drive device 138 from the pressing piston 128.

[0253] Repeat the cycle with steps 404-424 multiple times in a program-controlled manner.

[0254] In summary, using the aforementioned embedding press 110, the embedding process can be fully automated after the preparatory loading steps. Specifically, no operator is required for any of the samples 126 to be embedded. However, the structure remains relatively simple and inexpensive, allowing the investment in the automated embedding press 110 to be amortized in a short period.

[0255] 2. Automatic grinding and polishing machine

[0256] Reference Figures 9 to 21 An example of a fully automated grinding and polishing apparatus 210 (automatic grinding and polishing machine) is shown. The automated grinding and polishing apparatus 210 has a sample feeder 212 for sequentially feeding the embedded sample 142 to the sample removal position 214. For example, the sample feeder 212 can be formed as a sample chute, such as... Figure 9 and 10 As shown, or a motor-driven conveyor belt with a stop 213 to determine the sample removal position, such as... Figure 11 and 12 As shown, or a sample box, such as Figure 13 and 14 As shown. Therefore, each embedded sample 142 can be transported, collected or stored using different solutions, and can be automatically received from the upstream embedding press 110 if necessary.

[0257] Reference Figure 9 and Figure 10The lowest embedded sample 142 can be selectively pushed to the sample removal position 214 by the sample pusher 215. Alternatively, the lowest portion of the sample chute, where the embedded sample 142 is ready to be removed, can be pivotable to bring the embedded sample 142 to a horizontal position for clamping with the sample clamp 222. When the embedded sample 142 to be gripped is pivoted, the remaining embedded samples 142 preferably remain on the sample chute to prevent them from slipping. This can be achieved, for example, using a sorter. The sorter 217 can also be used on the conveyor belt 212 to better individually grip the embedded sample 142 located at the sample removal position 214.

[0258] In such Figure 13 and 14 In the sample box shown, the bottom sample can also be pushed to the sample removal position 214 by means of the sample pusher 215.

[0259] These sample feeders 212 or feeding devices share the common feature of sequentially conveying the embedded samples 142 to the sample removal position 214, where the embedded sample 142 located can be removed, and the next embedded sample 142 is then automatically conveyed. Furthermore, regardless of the type of sample feeder, the embedded sample 142 is generally preferably positioned horizontally in the sample removal position 214 for precise clamping with the sample clamp 222.

[0260] The automated grinding and polishing apparatus 210 has a grinding and polishing head 216, which in this example is suspended on a frame or bridge 218 and is movable in two horizontal dimensions, x and y, within a horizontal xy plane. For this purpose, the grinding and polishing head 216 can move along the frame 218 in the x-direction, and the frame 218 moves in the y-direction via a linear guide 220. Both are motor-driven and can be performed under program control. Therefore, the grinding and polishing apparatus 210 described herein can be configured as a gantry structure. However, other motion mechanisms can also be used for the sample holder, for example, utilizing a cantilever.

[0261] The grinding and polishing head 216 includes a sample holder 222, which is configured to hold a single embedded sample 142 in the absence of a sample holder. In this example, the sample holder 222 is configured as a three-finger holder. The sample holder 222 has radially movable gripping fingers 224—three in this example—that grasp the embedded sample 142 at the radially surrounding outer surface 142c and hold it securely in a force-fit manner. The gripping fingers 224 have a step 226 or an inward shoulder that forms a stop against the upper side 142b of the sample and ensures that the embedded sample 142 can be gripped as horizontally as possible by the sample holder 222.

[0262] Reference Figure 19-21The sample clamp 222 is arranged at the lower end of a drive shaft 228 supported by ball bearings. This drive shaft is driven by a drive motor 232 via a belt drive 230, allowing the sample clamp 222 to rotate continuously about its axis of symmetry A at a predetermined speed during the grinding and polishing process. The drive motor 232 for rotating the sample clamp 222 is connected to the belt drive 230 via a transmission 244 and a clutch 246. Furthermore, the grinding and polishing head 216 has a linear slider 234 by which the sample clamp 222 can move axially in the z-direction, i.e., vertically, to bring the held embedded sample 142 against the grinding or polishing disc. The axial movement of the sample clamp 222 is also automatically controlled by a program and driven by the motor 236. In this example, two deep holes 252 and 254 are formed on the drive shaft 228 to guide pneumatic gas into and out of the sample clamp 222, allowing it to open and close radially along the radial guide 238. For this purpose, each gripping finger 224 has a corresponding radially driven slider 238, which can move radially inward or outward to grip or release the embedded sample 142. However, other driving mechanisms for the gripping fingers 224 are also possible for gripping the embedded sample 142.

[0263] Therefore, the embedded samples 142 do not need to be clamped in the sample holder, as they are individually held and held by the sample clamp 222, which is configured here as a three-finger clamp. The sample clamp 222 causes the held embedded sample 142 to rotate about its axis of symmetry, which is coaxial with the rotation axis A of the sample clamp 222. Thus, during the grinding process, both the grinding disc and the gripped embedded sample 142, which is offset from its axial direction, rotate continuously, for example, in opposite directions or in the same direction.

[0264] The linear displacement of the sample clamp 222 in the z-direction is monitored by an optical measurement probe 240 and an associated optical measurement band 242, thereby forming a displacement measurement system 240, 242 for the displacement of the sample clamp 222 in the z-direction.

[0265] Furthermore, the grinding and polishing head 216 for the sample holder 222 has a force sensor 248, through which it measures the compressive force exerted by the embedded sample 142 held by the sample holder 222 against the grinding or polishing disc. On one hand, the force sensor 248 can be used for grinding and polishing at a predetermined compressive force, which the operator can input into the program controller 211 beforehand. The contact point of the embedded sample 142 as it descends onto the grinding disc can also be detected by the force sensor 248, and then the predetermined amount of material previously input by the operator into the program controller 211 can be removed in a programmed manner by means of the displacement measurement systems 240, 242. Thus, the grinding and polishing head 216 detects the contact point of the embedded sample 142 on the grinding or polishing disc, measures the actual compressive force, and / or can measure the axial travel of the sample holder 222 in the z-direction during grinding of the embedded sample 142, feeding one or more of these measurements back to the program controller 211 to control the grinding and / or polishing process using a control loop in terms of compressive force and / or the thickness of the layer removed by grinding.

[0266] In other words, the grinding and polishing head 216 is equipped with displacement measurement systems 240 and 242 on its z-axis, which enables the automatic removal of a predetermined layer thickness (target preparation) of the embedded sample 142, which has been pre-set in the program controller 211. To determine the zero point during target preparation, a force sensor 248 is used to detect when the gripped embedded sample 142 contacts the corresponding grinding disc.

[0267] The gas used for pneumatically manipulating the gripping fingers 224 is guided to the drive spindle 228 via the rotary guide device 250. The pneumatic gas is then supplied to the linear slider 238 of the gripping fingers 224 via the drive spindle and the gas supply device 252. The pneumatic gas is discharged again via the gas discharge device 254. Therefore, the rotary guide device 250 in this example is designed as a dual-channel rotary guide device for the pneumatic drive of the sample clamp 222.

[0268] Reference Figures 9 to 12 One embodiment of the automatic grinding and polishing equipment 210 has four grinding stations 256, each with its own grinding disc 258, sometimes referred to as a spindle, and a groove 260 in which the respective grinding disc 258 rotates. Grinding debris and / or coolant can be collected in the grinding groove 260 and discharged through a drain.

[0269] Each grinding disc 258 is equipped with a grinding disc 262. Each of the four grinding stations 256 is preferably equipped with different grinding discs of different grit sizes, thereby ensuring that the sample holder 222 firmly holds the embedded sample 142 grasped at one time throughout the grinding process and moves it from one grinding station to another for successive coarse-to-fine grinding. Here, it is not necessary to change the grinding disc 262 between grinding processes of different grit sizes, because there is a separate grinding station 256 with a corresponding grinding disc 262 for each desired grit size, which is approached sequentially by the grinding and polishing head 216 and the sample holder 222 with the same grasped embedded sample 142. Thus, the grinding and polishing head 216 first approaches the sample removal position 214, where the sample holder 222 is lowered and holds a single loose embedded sample 142. Then the sample holder 222 moves upward again, and the grinding and polishing head 216 moves to the first grinding station 256, which typically has the coarsest grinding disc 262. Once there, the sample holder 222 moves downward in the z-direction until the clamped embedded sample 142 contacts the grinding disc 262, which can be detected by the force sensor 248. Then, with feedback from the control loop, a first grinding process is performed under force control and, if necessary, displacement control, while the grinding disc 262 and the sample holder 222 rotate simultaneously. After the first grinding process is completed, the sample holder 222 moves upward again. The grinding and polishing head 216 then preferably moves to the cleaning station 268. In this example, the sample holder 222 moves downward again here to immerse the clamped embedded sample 142 in the cleaning bath. The sample holder 222 then moves upward again. Subsequently, the grinding and polishing head 216 with the sample holder 222 preferably moves to the next grinding station 256 with a different grinding disc 262, which has a different grit size, typically finer, where the sample holder 222 descends again and preferably performs the next grinding process in the same manner as described above. In the grinding and polishing apparatus 210 shown here, it is preferable to sequentially approach up to four different grinding stations 256, each having a corresponding four different grinding discs 262, in the same manner.

[0270] Reference Figure 17 In this example, the grinding and polishing head 216 has liquid nozzles 264 and 266. During grinding, coolant is added through liquid nozzle 264 for wet grinding. Advantageously, the liquid nozzles 264 and 266 are located on the grinding and polishing head 216, allowing it to move from one grinding station 256 to another along with the sample holder 222 and the held embedded sample 142, so that not every grinding station 256 requires its own cooling liquid nozzle. The coolant can be discharged along with the grinding debris through the respective grinding chambers 260 in a known manner.

[0271] Reference Figure 9 , 11 18. The automated grinding and polishing apparatus 210 has two cleaning stations 268 with cleaning containers 269, which are approached by sample holders 222 between grinding processes. For this purpose, after a grinding process, the grinding and polishing head 216 moves to the cleaning container 269, which is filled with cleaning fluid 270, and the sample is immersed in the cleaning fluid 270 to rinse and clean it. For example, water or alcohol can be used as the cleaning fluid 270 in the cleaning station 268. If needed, the sample holder 222 with embedded sample 142 can be rotated during this process, and / or an ultrasonic device 271 can be set to form the cleaning station 268 as an ultrasonic bath. The cleaning containers 269 can be selectively and automatically emptied and refilled with new cleaning fluid.

[0272] In the cleaning container 269, an air nozzle 272 is radially attached to the upper region above the cleaning solution 270, which allows the embedded sample 142 to be dried with cold and / or warm air after rinsing or washing. After thorough cleaning, the sample holder 222 with the embedded sample 142 moves upward again, and the embedded sample 142 is dried by the air nozzle 272. After the cleaning process in the cleaning station 268, the sample holder 222 can approach the next grinding station 256.

[0273] In the example shown, the automated grinding and polishing equipment further includes two polishing stations 276. Therefore, the example shown has four grinding stations 256, two cleaning stations 268, and two polishing stations 276. However, it is clear that different numbers and / or arrangements of stations 256, 268, and 276 are also possible, for example, three grinding stations 256, two cleaning stations 268, and three polishing stations 276, or for example, three grinding stations 256, two cleaning stations 268, and two polishing stations 276, as in... Figure 13 As shown, or other desired quantities and / or arrangements. Polishing stations 276 each have polishing discs 278 arranged in polishing tanks 280, and polishing pads 282 are fixed thereon, wherein the polishing pads 282 may also include polishing cloth. When all the required grinding processes have been completed, and the embedded sample 142 has been cleaned and rinsed after the last grinding process, the grinding and polishing head 216 with sample clamp 222 and the clamped embedded sample 142 moves to the first polishing station 276 to polish the sample bottom surface 142a with a first polishing agent. The polishing suspension for the polishing process can be supplied through the liquid nozzle 266 of the grinding and polishing head 216. Preferably, the extrusion pressure is also controlled in a feedback manner by force sensor 248 during the polishing process so as to polish with a determined extrusion pressure, which can be specified by the user in the program controller.

[0274] Therefore, the feeding of the water coolant for the grinding process and / or the polishing suspending agent for the polishing process is accomplished by supplying from the grinding and polishing head 216. This allows the required liquid at each surface processing station 256, 276 to be fed from the grinding and polishing head 116, without having to be supplied separately at each surface processing station 256, 276. In other words, the liquid nozzles 264, 266 move together with the sample holder 222 or with the clamped embedded sample 142.

[0275] When the first polishing process is completed at the first polishing station 276, the grinding and polishing head 216, with the sample holder 222 and the clamped embedded sample 142, moves to the cleaning station 268 for cleaning and rinsing, as described above for the grinding process. Advantageously, the first cleaning station 268 is used for the grinding process, and the second cleaning station 268 is used for the polishing process, thus preventing cross-contamination of grinding debris and polishing suspension, or reducing the need for frequent refilling of the cleaning station. After cleaning and rinsing the embedded sample 142 in the second cleaning station 268, it can be moved back to the second polishing station 276 for polishing with different polishing agents, such as different polishing suspensions, if necessary. Another polishing suspension can be fed through the same liquid nozzle 266, or additional liquid nozzles, such as 2, 3, 4, 5, 6 or more, can be provided on the grinding and polishing head 216 for coolant and / or polishing suspension, which move from station 256, 268, 276 together with sample holder 222.

[0276] Therefore, in this example, the embedded sample 142 is held once by the sample holder 222 and then successively ground with different grit sizes in multiple, in this example, four, grinding stations 256, with rinsing and cleaning in cleaning baths 268 and 270 between each corresponding grinding process. Furthermore, the same embedded sample 142 is successively polished with different polishing agents in one or more, in this example, two polishing stations 276, using the same sample holder 222. Similarly, between polishing processes, the embedded sample 126 can be rinsed and cleaned in cleaning station 268. The entire grinding, polishing, and cleaning process is fully automated and controlled by a program, without operator intervention.

[0277] In the example shown, the sample is processed individually and passed through each of the corresponding stations 256, 276, 268, where it is always held securely by the same sample fixture 222.

[0278] The grinding and polishing head 216 can adjust the height (z-axis) of the sample holder 222 with the embedded sample 142 being held, pressing it against the respective grinding pads 262 or the respective polishing cloths or polishing pads 282, or immersing it in the respective cleaning containers 269. If the grinding and polishing head 216 is preferably equipped with a force sensor 248, the gripped embedded sample 142 can be brought into contact with the respective grinding pads 262, and the force pressing the gripped embedded sample 142 against the grinding pads 262 or polishing pads 282 can be measured and adjusted in the feedback control loop according to the measured value to a value previously set in the program controller 211.

[0279] At the end of the grinding and polishing process, the grinding and polishing head 216 moves to the sample placement position 284 and stores the embedded sample 142, which has been ground, polished and cleaned, there so that the embedded sample can be used immediately without further processing steps, such as for material analysis, such as hardness testing or microstructure analysis.

[0280] Reference Figure 9 The diagram schematically illustrates sample placement position 284 with several individual placement locations. (Refer to...) Figure 11 The sample placement position 284 is designed as part of a conveying device, which in this example is formed as a motor-driven conveyor belt that transports the prepared embedded sample 142 to the sample collection device.

[0281] exist Figure 9 and Figure 11 In this design, the surface processing stations, namely grinding station 256 and polishing station 276, are arranged in a rectangular 3×2 configuration, with two cleaning stations 268 located between the surface processing stations 256 and 276. The exemplary automatic grinding and polishing machine 210 with a 3×2 arrangement is approximately 1.0 to 1.2 m long and approximately 0.8 to 0.9 m deep, thus it can be placed in a standard laboratory compartment (90 cm deep). However, the grinding and polishing equipment 210 can also be configured as an integrated floor-standing unit, where the controller, liquid storage container, dispensing system, etc., can be located below the grinding and polishing equipment 210. Surface processing stations 256 and 276 are both located within the same housing 208, and the grinding / polishing head 216 is also suspended from this housing, thus belonging to the same grinding and / or polishing equipment 210.

[0282] For example, a touch display screen integrated into the grinding and polishing equipment 210 or attached via an adjustable support arm (not shown) can be used as a GUI.

[0283] Reference Figure 13Alternatively, the surface finishing stations 256, 276 and the cleaning station 268 can be arranged in a basically linear pattern. The advantage of this is that the grinding / polishing head 216 only needs to move in one dimension (x). For this, the overall length of the grinding and polishing equipment 210 is slightly larger, or it can accommodate fewer stations 256, 268, 276. (As in...) Figure 9 and 11 In this example, multiple surface processing stations 256 and 276 with different processing fineness are also arranged side by side on the xy plane so that the sample bottom surface 142a can be ground and / or polished with an automated process of multiple surface processing steps in each of the respective different surface processing stations 256 and 276 to continuously improve the surface fineness. If necessary, the number of surface processing stations 256 and 276 and the cleaning station 268 and their spatial arrangement on the xy plane can be designed according to the corresponding customer requirements.

[0284] Reference Figure 15 The automatic grinding and polishing equipment 210 can be enclosed in a safety cover 286 with a front access port 288, which is protected by a laser grating 290 as an access protection device. In this way, if someone intervenes in the safety cover 286 during operation, the grinding and polishing equipment will automatically shut down in an emergency.

[0285] Reference Figure 30 One embodiment of the grinding and polishing method includes the following process-controlled method steps:

[0286] Step 502: Approach the sample removal position 214 with the grinding and polishing head 216 and lower the sample clamp 222 to hold the embedded sample 142 at the sample removal position 214.

[0287] Step 504: Move to the first grinding station 256, lower the sample holder 222 with the embedded sample 142 being held, and press the embedded sample 142 onto the rotating first grinding disc 262 with the first grit size of the first grinding station 256 with a predetermined extrusion force. At the same time, rotate the sample holder 222, add coolant, and lift the sample holder 222 with the embedded sample 142 being held.

[0288] Step 506 if necessary: ​​Move to the first cleaning container 269, immerse the embedded sample 142 held by the sample clamp 222 into the first cleaning container 269, lift the embedded sample 142 out of the first cleaning container 269, and dry the clamped embedded sample 142 if necessary.

[0289] Step 508: Move to the second grinding station 256, lower the sample holder 222 with the embedded sample 142 being held, and press the embedded sample 142 onto the rotating second grinding disc 262 with the second grit size of the second grinding station 256 with a predetermined pressing force. At the same time, rotate the sample holder 222, add coolant, and lift the sample holder 222 with the embedded sample 142 being held.

[0290] Step 510 if necessary: ​​Move to the first or another cleaning container 269, immerse the embedded sample 142 held by the sample holder 222 into the cleaning container 269, lift the embedded sample 142 out of the cleaning container 269, and dry the held embedded sample 142 if necessary.

[0291] Step 512: Move to the third grinding station 256, lower the sample holder 222 with the embedded sample 142 being held, and press the embedded sample 142 onto the rotating third grinding disc 262 with the third grit size of the third grinding station 256 with a predetermined extrusion force. At the same time, rotate the sample holder 222, add coolant, and lift the sample holder 222 with the embedded sample 142 being held.

[0292] Step 514 if necessary: ​​Move to the first or another cleaning container 269, immerse the embedded sample 142 held by the sample clamp 222 into the cleaning container 269, lift the embedded sample 142 out of the cleaning container 269, and dry the held embedded sample 142 if necessary.

[0293] Step 516: Move to the first polishing station 276, lower the sample holder 222 with the embedded sample 142 being held, and press the embedded sample 142 onto the rotating or vibrating first polishing disc 282 of the first polishing station 276 with a predetermined extrusion force. At the same time, rotate the sample holder 222, add the first polishing suspension, and lift the sample holder 222 with the embedded sample 142 being held.

[0294] If necessary, step 518: Move to a second or another cleaning container 269, immerse the embedded sample 142 held by the sample clamp 222 into the cleaning container 269, lift the embedded sample 142 out of the cleaning container 269, and dry the clamped embedded sample 142.

[0295] Step 520: Move to the second polishing station 276, lower the sample holder 222 with the embedded sample 142 being held, and press the embedded sample 142 onto the rotating or vibrating second polishing disc 282 of the second polishing station 276 with a predetermined extrusion force. At the same time, rotate the sample holder 222, add the second polishing suspension, and lift the sample holder 222 with the embedded sample 142 being held.

[0296] Step 522 if necessary: ​​Move to a second or another cleaning container 269, immerse the embedded sample 142 held by the sample clamp 222 into the cleaning container 269, lift the embedded sample 142 out of the cleaning container 269, and dry the held embedded sample 142 if necessary.

[0297] Step 524: Approach the sample placement position 284 with the grinding / polishing head 216 and place the embedded sample 142 in the sample placement position 284 with the sample clamp 222.

[0298] Repeat steps 502-524 multiple times under program control.

[0299] In an advantageous manner, embodiments of the grinding and polishing apparatus 216 are characterized by:

[0300] -The embedded sample 142 does not need to be clamped in the sample holder if necessary.

[0301] - The entire process of grinding, polishing, and cleaning can be fully automated when necessary, without human intervention.

[0302] The 210 grinding and polishing equipment is characterized by low investment costs and rapid amortization.

[0303] The 210 grinding and polishing equipment is characterized by its compact size and ability to be integrated into traditional laboratory cubicles.

[0304] - The grinding and polishing equipment 210 can be used flexibly.

[0305] Reference Figure 22-25The grinding and polishing apparatus 210 may further include an etching station 756 having an etching bath 758 for etching the bottom surface 142a of the ground and / or polished sample. In the example shown, the etching station 756 is mounted on the grinding and polishing apparatus 210 in a separate etching module 710, where feed and discharge conveyors 712, 314 transport the embedded sample 142 to be etched. A sample holder 722 grips each individual embedded sample 142, feeds it into the etching station 756, and immerses it in the etching bath 758. Subsequently, the sample holder 722 delivers the etched embedded sample 142 to a cleaning station 768, where the embedded sample 142 is immersed in a cleaning bath formed by cleaning solution 770 in a cleaning container 769. The sample holder 722 with the embedded sample 142 then moves to a sample placement position 284, in this example on the discharge conveyor 314, where the embedded sample 142 is stored.

[0306] The etching module 710 also includes a hermetically sealable housing 708 with a hermetically sealed door 732 and an exhaust port 734 for drawing away vapors from the etching bath 758. Furthermore, the etching bath 758 can be sealed with a lid 759 to prevent excessive evaporation of acid from the etching bath 758.

[0307] In the example shown, etching station 756 is mounted on grinding and polishing equipment 210 within a separate etching module 710 and includes a second sample holder 722, which is preferably constructed like sample holder 222. However, etching station 756 can also be integrated into grinding and polishing equipment 210 (not shown). Therefore, grinding / polishing equipment 210 with mounted etching module 710 or with integrated etching station 756 can also be referred to as grinding / polishing and / or etching equipment 210.

[0308] 3. Fully automated production line

[0309] Reference Figure 26-28 An example of a fully automated production line 310 for embedding, grinding, and polishing samples is shown. The automated production line 310 specifically includes the aforementioned automated embedding press 110 and the aforementioned automated grinding and polishing equipment 210.

[0310] The samples 142, embedded by the automatic embedding press 110 and ejected from the sample ejector 147 of the embedding press 110, are individually, without being in multiple sample holders, conveyed from the automatic embedding press 110 to the automatic grinding and polishing equipment 210, particularly sequentially. For this purpose, the first conveying device 312 can be, for example, formed as a sample chute or a motor-driven conveyor belt. Some of the embedded samples 142 can be temporarily buffered on the first conveying device 312. In any case, the first conveying device 312 conveys the embedded samples 142 to the sample removal position 214 of the automatic grinding and polishing equipment 210, so that the embedded samples 142 can be individually and sequentially grasped by the sample holder 222 for the aforementioned grinding, polishing, and / or cleaning processes. Once the embedded samples 142 are prepared, they are stored by the sample holder 222 at the sample placement position 284.

[0311] exist Figure 26 In the example shown, the fully prepared embedded samples 142 are individually, without being in the multiple sample holders, conveyed from the sample placement position 284 to the sample collection device 316 via the second conveyor 314, particularly sequentially. The second conveyor 314 can also be designed as, for example, a chute or a motor-driven conveyor belt. Thus, the prepared embedded samples 142 are sequentially fed into the sample collection device 316, such that all the samples 126 to be embedded from the automated production line 310 exist individually in the sample collection device 316 in an embedded, prepared form, and are then sent by the operator for further determination.

[0312] If the fully prepared (ground, polished, and / or etched) embedded sample 142 is to slide on the slide, it is preferable to flip the fully prepared embedded sample 142 over beforehand, or to hollow out the slide in the middle so that the fully prepared embedded sample 142 is supported only on the outer edge. This prevents damage to the polished bottom surface of the sample 126, such as scratches.

[0313] Reference Figure 27 and 28The sample collection device 316 can be configured as a box 322 having multiple sample placement positions 324, wherein a single prepared embedded sample 142 is stored in a sample placement position 324 of the box 322. The box 322 can be configured to be movable, for example as a sample placement stage, particularly having sample placement positions 324 arranged side-by-side, wherein an empty sample placement position 324 is moved to a sample placement position 284 under program control, so that each fully prepared embedded sample 142 can be stored in the empty sample placement position 324 currently located at the sample placement position 284 of the grinding and polishing apparatus 210. In the next cycle, the next empty sample placement position 324 is then moved to the sample placement position 284. In other words, the operation of placing the sample in the sample placement position 324 using the sample clamp 222 is performed synchronously with the grinding and / or polishing process, or during the sample processing cycle of the automated grinding and polishing apparatus 210. Figure 27 and 28 In the example shown, the sample collection device 316, which serves as the platform box 322, includes a rotary table having, for example, 32 peripheral sample placement positions 324, corresponding to the sample loading stage 122. Of course, an etching module 710 could also be included here.

[0314] In the preparation step, the operator places all the samples 126 to be embedded into the loading positions 124 of the sample loading table 122, and then starts the fully automated production line 310. In this production line, the samples are first automatically embedded by the embedding press 110 under program control, then conveyed by the first conveyor 312 to the grinding and polishing equipment 210, where they are ground, polished, and cleaned, and then conveyed by the second conveyor 314 to the sample collection device 316 or stored there. The preparatory loading step can be performed by the operator, for example, at night. After a fully automated, program-controlled operation, all samples are embedded and prepared the following morning, i.e., ground, polished, and cleaned, and individually placed in the sample collection device 316. Throughout the production process, the embedded samples 142 are handled individually and loosely, such as conveying, gripping, grinding, polishing, cleaning, etching, and / or finally stored.

[0315] The entire production line 310 can be controlled by, for example, program controllers 111 and 211 running on a central computer 318.

[0316] The exemplary production line 310 is sized with a length less than 4.8 m and a depth less than 90 cm, allowing it to be placed in a standard laboratory compartment (90 cm deep). (See reference...) Figure 28 Production line 310 can be enclosed in safety enclosure 386, where the front access port 388 is monitored by laser grating 390 to ensure emergency shutdown.

[0317] Reference Figure 31 An embodiment of an automated method for producing multiple embedded and surface-processed samples 142 includes providing multiple samples 126 to be embedded in step 602 and the following program-controlled method steps:

[0318] Step 604: The sample 126 to be embedded and the embedding material 117 are heat-embedded and pressed in the pressing cylinder 132 of the embedding press 110 to produce the embedded sample 142.

[0319] Step 606: Pop the embedded sample 142 out of the compression cylinder 132.

[0320] Step 608: The embedded sample 142 is transported from the embedding press 110 to the surface processing equipment 210.

[0321] Step 610: Use the sample clamp 222 of the surface processing equipment 210 to pick up a single embedded sample 142.

[0322] Step 612: Use sample clamp 222 to approach the surface processing stations 256 and 276 of the surface processing equipment 210 to process the sample bottom surface 142a of the embedded sample 142 in the surface processing stations 256 and 276. If necessary, use sample clamp 222 to approach the cleaning station 268 of the surface processing equipment 210 to clean the embedded sample 142.

[0323] If necessary, step 614: Repeat step 612 once or more at other surface processing stations 256, 276 of the surface processing equipment 210 and, if necessary, at other cleaning stations 268 of the surface processing equipment 210.

[0324] Step 616: Approach the sample placement position 284 with the sample clamp 222 and open the sample clamp 222 to release and store the embedded, surface-processed sample 142 at the sample placement position 284.

[0325] Steps 604-608 and 610-616 are repeated multiple times under program control, wherein the embedded sample can be buffered between steps 608 and 610.

[0326] In summary, the present invention relates to an automatic embedding press 110, an automatic grinding and polishing apparatus 210, and an automatic production line 310 including the embedding press 110 and the grinding and polishing apparatus 210. Therefore, all features relating to the embedding press 110 and the grinding and polishing apparatus 210 are also considered to be disclosed for the production line 310, and vice versa. All disclosed features relating to the embedding press are also considered to be disclosures of related methods, and vice versa. All disclosed features relating to the grinding and / or polishing apparatus are also considered to be disclosures of related methods, and vice versa. All disclosed features relating to the production line are also considered to be disclosures of related methods, and vice versa.

[0327] It will be apparent to those skilled in the art that the above embodiments should be understood as exemplary, and that the invention is not limited thereto, but can be varied in various ways without departing from the scope of the claims. Furthermore, it is obvious that the features disclosed in the specification, claims, drawings, or other aspects also individually define the essential components of the invention, even if they are described together with other features.

Claims

1. An embedding press (110) for embedding a sample (126) in an embedding material (117), comprising: A pressing unit (134) having a pressing cylinder (132). A batching device (115) for metering the feed embedding material (117). A sample loading stage (122) with multiple loading positions (124) allows the operator to place the sample to be embedded (126) at each loading position. A control device (111) is configured to automatically control the embedding press (110) in a programmed manner, specifically controlling at least the sample loading stage (122), the pressing unit (134), and the dispensing device (115), so that multiple embedding pressing processes can be performed sequentially and completely automatically after multiple samples (126) to be embedded are loaded on the sample loading stage (122) without intermediate operator intervention. The control device (111) is designed to automatically control the embedding press (110) in multiple cycle cycles, each cycle having the following cycle steps: a) The sample loading stage (122) moves one of the loading positions (124) with one of the samples (126) to be embedded to the sample receiving position (136) of the pressing unit (134). b) The sample (126) to be embedded is introduced into the pressing cylinder (132) from the sample receiving position (136), and the embedding material (117) is metered and fed into the pressing cylinder (132). c) Perform an embedding and pressing process to produce embedded samples (142). d) The sample (142) thus embedded is ejected from the compression cylinder (132). In this process, repeated steps a) to d) are used to embed multiple samples.

2. The embedding press (110) according to claim 1. The sample loading stage (122) is designed as a rotary table, and the loading position (124) is arranged in the annular area (123) surrounding the sample loading stage.

3. The embedding press (110) according to claim 1. The pressing cylinder (132) has a first opening at the bottom and a second opening at the top (132a, b), and the sample (126) is introduced into the pressing cylinder (132) through the first opening at the bottom (132a), and the embedding material (117) is metered into the pressing cylinder (132) through the second opening at the top (132b).

4. The embedding press (110) according to claim 3. The pressing unit (134) has an upper closed slider (140), and the control device (111) is adapted to control the upper closed slider (140) so that the upper closed slider (140) closes the second opening (132b) at the top of the pressing cylinder (132) after the embedding material (117) is metered and fed, so that the embedding pressing process can be carried out subsequently.

5. The embedding press (110) according to claim 1. In the loading position (124), there are pistons (128) for placing the sample (126) to be embedded, and the pressing unit (134) has a piston drive device (138), and in the sample receiving position (136), the piston drive device (138) is coupled to each corresponding piston (128) so as to lift the piston (128) with the sample (126) to be embedded out of the loading position (124) and push it into the pressing cylinder (132).

6. The embedding press (110) according to claim 5. After the embedding and pressing process, the embedded sample (142) is moved upward out of the pressing cylinder (132) by the piston drive device (138) and the piston (128), and the pressing unit (134) has a sample ejector (144) that ejects the embedded sample (142) that has been moved upward out of the pressing cylinder (132) from the pressing unit (134).

7. The embedding press (110) according to claim 6. The sample ejector (144) pushes the embedded sample (142) transversely to the axis of the pressing cylinder (132) from the upward-moving piston (128) so as to eject the embedded sample (142).

8. The embedding press (110) according to claim 6 or 7. After the embedded sample (142) is ejected, the piston drive (138) moves down with the piston (128) again, and before the next loading position (124) with the next piston (128) and the next sample (126) moves to the sample receiving position (136), the empty piston (128) is placed back into the loading position (124) of the sample loading stage (122) to start the next cycle.

9. The embedding press (110) according to claim 1. The embedding press (110) has an inlet (152) under the pressing cylinder (132), and the sample loading stage (122) moves at least partially in the inlet and cyclically introduces the loading position (124) with the sample to be embedded (126) into the inlet in order to move the sample to be embedded (126) under the pressing cylinder (132) in sequence.

10. The embedding press (110) according to claim 1. At least one first storage container and a second storage container (114) for storing different first and second embedding materials (117) are connected to a dispensing device (115), whereby the dispensing device (115) meter feeds the embedding material (117) from the first storage container and from the second storage container (114) into the pressing cylinder (132), and wherein the metering feeding of the first and second embedding materials (117) is controlled by a control device (111) to automatically meter feed the first and / or second embedding materials (117) into the pressing cylinder (132) in predetermined amounts, respectively.

11. A method for embedding multiple samples in embedding material using an embedding press (110), wherein, In the preparation step, a sample loading stage (122) with multiple loading positions (124) is loaded with multiple samples (126) to be embedded, and after the sample loading stage (122) is loaded with multiple samples (126) to be embedded, these samples are automatically embedded sequentially in a cycle controlled by a program, the cycle having the following cycle steps: a) Move the loading position (124) on which the sample (126) to be embedded is loaded to the sample receiving position (136) of the pressing unit (134). b): The sample (126) from step a) is introduced from the loading position (124) into the pressing cylinder (132) of the pressing unit (134), and the embedding material (117) is metered and fed into the pressing cylinder (132). c): The embedding material (117) and the sample (126) are pressed in a pressing cylinder (132) to produce an embedded sample (142). d): The embedded sample (142) is ejected from the compression cylinder (132). The process involves repeating a periodic cycle with periodic steps a) to d) to embed multiple samples.

12. The method according to claim 11, The sample (126) is introduced into the pressing cylinder (132) from below, and the embedding material (117) is metered into the pressing cylinder (132) from above.

13. The method according to claim 12, After metering and feeding the embedding material (117), the pressing cylinder (132) is closed at its upper end in a program-controlled manner so that the embedding and pressing process can be carried out automatically in a program-controlled manner.

14. The method according to claim 11, The samples (126) to be embedded are placed on their respective pistons (128) at the loading position (124), and the samples (126) together with their respective pistons (128) are axially pushed into the pressing cylinder (132) from below.

15. The method according to claim 11, After the embedding and pressing process, the embedded sample (142) is moved upward out of the pressing cylinder (132) and pushed down from the piston (128) by the sample ejector (144) transverse to the axis of the pressing cylinder (132) to eject the embedded sample (142).

16. The method according to claim 11, After the embedded sample (142) is ejected, the empty piston (128) moves downward again, and before the next loading position (124) with the next piston (128) and the next sample (126) moves to the sample receiving position (136), the empty piston (128) is placed back into the loading position (124) to start the next cycle.

17. The method according to claim 11, The sample loading stage (122) cyclically moves the loading position (124) with the piston (128) and the sample (126) to be embedded thereon to the pressing cylinder (132) so that the piston (128) with the sample (126) placed thereon is axially introduced into the pressing cylinder (132) respectively, and / or after the embedding pressing process is completed, the piston (128) is again axially moved downward out of the pressing cylinder (132) and placed on the loading position (124) again before the next loading position (124) with the next piston (128) and the next sample (126) is moved under the pressing cylinder (132) in the next cycle.

18. The method according to claim 11, In this process, at least two different embedding materials (117) are automatically metered and fed into the pressing cylinder (132) in sequence using a program control method.

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