Inspection device, component assembly system, and substrate manufacturing method

Abstract

It is determined whether the identification information (first identification information) of the component position detection method used when the inspection device detects the position of the mounted component and the identification information (second identification information) of the component position detection method used when the component mounting device detects the position of the held component are consistent. If the first identification information and the second identification information are consistent, the action parameters when the mounting head mounts the component on the substrate are corrected based on the position deviation calculated by the inspection device, but if the first identification information and the second identification information are inconsistent, the position deviation of the inconsistent component is not used as data for calculating the correction value of the action parameter.

Description

Technical Field

[0001] The present disclosure relates to an inspection device for inspecting a component mounted on a substrate, a component mounting system including the inspection device, and a substrate manufacturing method based on the component mounting system. Background Art

[0002] In the past, a component assembly system is known, which includes: a component assembly device that holds (picks up) components by an assembly head and assembles them on a substrate; and an inspection device that receives the substrate on which the components are assembled by the component assembly device and inspects the components. In the component assembly system, the component assembly device detects the position of the component held by the assembly head as the held component position, and assembles the component on the substrate based on the detected held component position. In addition, the inspection device detects the position of the component assembled on the substrate as the assembled component position, and judges the quality of the assembly state based on the positional offset of the detected assembled component position from the reference position (the target assembly coordinate set on the substrate). The positional offset calculated by the inspection device is fed back to the component assembly device, and is used to correct the motion parameters of the assembly head when the component assembly device assembles the component on the substrate (for example, refer to the following patent document 1).

[0003] Prior Art Literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2019-134051 Summary of the invention

[0006] An inspection device according to one embodiment of the present invention inspects a component mounted on a substrate, the inspection device comprising: an assembly component position detection unit, which detects the position of the component mounted on the substrate as an assembly component position; a position offset calculation unit, which calculates the position offset of the assembly component position detected by the assembly component position detection unit from a predetermined reference position; a quality judgment unit, which judges the quality of the assembly state of the component based on the position offset calculated by the position offset calculation unit; and a first output unit, which outputs identification information of a component position detection method used when detecting the assembly component position by the assembly component position detection unit, namely, first identification information, and the position offset calculated by the position offset calculation unit.

[0007] Another embodiment of a component assembly system disclosed herein comprises: a component assembly device that holds a component by an assembly head and assembles the held component on a substrate; and an inspection device that inspects the component assembled on the substrate by the component assembly device, the inspection device comprising: an assembly component position detection unit that detects the position of the component assembled on the substrate as an assembly component position; a position offset calculation unit that calculates the position offset of the assembly component position detected by the assembly component position detection unit from a predetermined reference position; a quality judgment unit that judges the quality of the assembly state of the component based on the position offset calculated by the position offset calculation unit; and a first output unit that outputs identification information of a component position detection method used when detecting the assembly component position by the assembly component position detection unit, namely, first identification information, and the position offset calculated by the position offset calculation unit.

[0008] Another aspect of the present invention provides a substrate manufacturing method for manufacturing a mounting substrate on which components are assembled on the substrate, the substrate manufacturing method comprising: a component holding step, in which a component is held by an assembly head; a component holding position detection step, in which the position of the component held by the assembly head in the component holding step is detected as a held component position; a component assembling step, in which the assembly head is moved based on an action parameter of the held component position detected in the component holding position detection step, so as to assemble the component held by the assembly head on the substrate; an assembly component position detection step, in which the position of the component assembled on the substrate through the component assembling step is detected as an assembly component position; a position offset calculation step, in which a position offset of the assembly component position detected in the assembly component position detection step from a predetermined reference position is calculated; and a quality judgment step, in which, based on the position offset calculated in the position offset calculation step, Determine the quality of the assembly state of the component; a first output process, outputting the identification information of the component position detection method used when detecting the position of the assembly component, that is, the first identification information, and the position offset calculated in the position offset calculation process; an identification information judgment process, judging whether the first identification information output in the first output process is consistent with the identification information of the component position detection method used when detecting the position of the holding component in the holding component position detection process, that is, the second identification information; and a correction processing process, when it is judged in the identification information judgment process that the first identification information is consistent with the second identification information, using the correction value obtained based on the position offset calculated in the position offset calculation process to correct the action parameter, and when the component assembly process corrects the action parameter in the correction processing process, the component is assembled on the substrate using the corrected action parameter.

[0009] Another aspect of the present invention discloses a substrate manufacturing method for manufacturing an installed substrate on which components are assembled on the substrate, the substrate manufacturing method comprising: a component holding step, in which a component is held by an assembly head; a component holding position detection step, in which the position of the component held by the assembly head in the component holding step is detected as a held component position; a component assembling step, in which the assembly head is moved based on an action parameter of the holding component position detected in the component holding position detection step, so as to assemble the component held by the assembly head on the substrate; an assembly component position detection step, in which the position of the component assembled on the substrate through the component assembly step is detected as an assembly component position; a position offset calculation step, in which the position offset of the assembly component position detected in the assembly component position detection step from a predetermined reference position is calculated; and a quality judgment step, based on the The position offset calculated in the position offset calculation process is used to judge the quality of the assembly state of the component; a first output process is used to output the identification information of the component position detection method used when detecting the position of the assembled component, that is, the first identification information, and the position offset calculated in the position offset calculation process; an identification information judgment process is used to judge whether the first identification information output in the first output process is the specified identification information; and a correction processing process is used. When it is judged in the identification information judgment process that the first identification information is the specified identification information, the correction value obtained based on the position offset calculated in the position offset calculation process is used to correct the action parameter. When the component assembly process corrects the action parameter in the correction processing process, the component is assembled on the substrate using the corrected action parameter.

[0010] According to the present disclosure, it is possible to correct the operation parameters when assembling components without reducing the assembly accuracy of the components. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 It is a configuration diagram of a component assembly system in Embodiment 1 of the present disclosure.

[0012] Figure 2 It is a perspective view of a component mounting device constituting the component mounting system in Embodiment 1 of the present disclosure.

[0013] Figure 3 This is a block diagram showing a control system of the component mounting device in Embodiment 1 of the present disclosure.

[0014] Figure 4 This is a diagram showing an example of a component position detection method used in the component mounting system in Embodiment 1 of the present disclosure.

[0015] Figure 5It is a diagram showing an example of assembly data stored in the component assembly device in Embodiment 1 of the present disclosure.

[0016] Figure 6 It is a perspective view of an inspection device constituting the component assembly system in Embodiment 1 of the present disclosure.

[0017] Figure 7 This is a block diagram showing a control system of the inspection device in Embodiment 1 of the present disclosure.

[0018] Figure 8 This is a diagram showing an example of inspection reference data stored in the inspection device in Embodiment 1 of the present disclosure.

[0019] Fig. 9 This is a diagram for explaining the positional deviation amount of a component calculated by the inspection device in Embodiment 1 of the present disclosure.

[0020] Fig.10 This is a diagram showing an example of positional deviation amount data output by the inspection device in Embodiment 1 of the present disclosure.

[0021] Fig.11 This is a block diagram showing a control system of the management device in Embodiment 1 of the present disclosure.

[0022] Fig.12 This is a flowchart showing the flow of component assembly work performed by the component assembly device in Embodiment 1 of the present disclosure.

[0023] Fig.13 This is a flowchart showing the flow of the inspection work performed by the inspection device in Embodiment 1 of the present disclosure.

[0024] Fig.14 This is a flowchart showing the flow of management work executed by the management device in Embodiment 1 of the present disclosure.

[0025] Fig.15 This is a flowchart showing the flow of the operation parameter correction work performed in the correction processing step by the component mounting device in the first embodiment of the present disclosure.

[0026] Fig.16 This is a flowchart showing the flow of component assembly work performed by the component assembly device in Embodiment 2 of the present disclosure.

[0027] Fig.17 This is a flowchart showing the flow of management work executed by the management device in Embodiment 2 of the present disclosure.

[0028] Fig.18 This is a flowchart showing the flow of the operation parameter correction work performed by the component mounting device in the second embodiment of the present disclosure. DETAILED DESCRIPTION

[0029] (Implementation Method 1)

[0030] Prior to describing the embodiments of the present disclosure, a problem in the existing device will be briefly described. In the existing component assembly system, the component assembly device and the inspection device each use their own component position detection method to detect the position of the component. For example, the component assembly device uses the center of gravity position of a plurality of leads possessed by the component as the representative position of the component to detect the position of the holding component, and the inspection device uses the center of gravity position of the main body of the component as the representative position of the component to detect the position of the assembled component. However, in the case where the component position detection method used by the inspection device when detecting the position of the assembled component is different from the component position detection method used by the component assembly device when detecting the position of the holding component, if the position offset calculated by the inspection device is directly fed back to the component assembly device and the action parameters are corrected, there is a concern that the assembly accuracy of the component will be reduced.

[0031] Therefore, an object of the present disclosure is to provide an inspection device, a component assembly system, and a substrate manufacturing method that can correct operation parameters during component assembly without reducing component assembly accuracy.

[0032] Hereinafter, one embodiment of the present disclosure will be described in detail using the drawings. Figure 1 FIG. 2 shows the structure of the component assembly system 1 in the first embodiment of the present disclosure. Figure 1 In the embodiment, the component assembly system 1 includes a component assembly device 11 , an inspection device 12 , and a management device 13 .

[0033] The component assembly device 11 performs a component assembly operation of receiving the substrate KB from an upstream device (e.g., a solder printing device) and assembling the component BH on the substrate KB. In this component assembly operation, after holding the component BH by the assembly head 23, the component assembly device 11 detects the position of the held component BH (i.e., before being assembled on the substrate KB), i.e., the held component position, and assembles the component BH so that the detected held component position coincides with the target assembly coordinates set on the substrate KB.

[0034] The inspection device 12 is arranged at the downstream side of the component assembly device 11, and performs an inspection operation of receiving the substrate KB unloaded from the component assembly device 11 and inspecting the assembly state of the component BH assembled on the substrate KB. In this inspection operation, the inspection device 12 detects the position of each component BH assembled on the substrate KB, that is, the assembly component position, and after detecting the positional deviation of the detected assembly component position from the target assembly coordinate (reference position) set on the substrate KB, determines the quality of the assembly state in the substrate KB.

[0035] The management device 13 is connected to the component mounting device 11 and the inspection device 12 in a communicable state. The management device 13 obtains information from the component mounting device 11 and the inspection device 12 and manages each operation.

[0036] Figure 2 FIG. 1 is a perspective view of a component assembly device 11 constituting the component assembly system 1. Figure 1 as well as Figure 2 In the figure, the component assembly device 11 includes: a substrate conveying path 21, a component supply unit 22, an assembly head 23, a head moving mechanism 24, a component recognition camera 25, an assembly device display input unit 26, and an assembly device control unit 27. The substrate conveying path 21 carries out the loading, positioning, and unloading of the substrate KB. The component supply unit 22 includes, for example, a belt feeder, and supplies the component BH to a specified position. The assembly head 23 includes a nozzle 23N extending downward. The assembly head 23 can raise and lower the nozzle 23N and rotate it around the vertical axis, and can adsorb the component BH supplied by the component supply unit 22 to the lower end of the nozzle 23N.

[0037] exist Figure 2 In the embodiment, the head moving mechanism 24 includes an XY beam mechanism including a fixed beam 24a and a movable beam 24b that is freely movable relative to the fixed beam 24a. The head moving mechanism 24 moves the assembly head 23 in a horizontal plane by combining an action of moving the movable beam 24b relative to the fixed beam 24a and an action of moving the assembly head 23 relative to the movable beam 24b. The assembly head 23 holds (picks up) the component BH supplied by the component supply unit 22 and assembles the held component BH onto the substrate KB by performing a movement action in a horizontal plane, a lifting and rotating action of the nozzle 23N, and an adsorption and release action of the component BH by the nozzle 23N.

[0038] exist Figure 1 as well as Figure 2 In the embodiment, the component recognition camera 25 is disposed between the substrate conveying path 21 and the component supply unit 22 with the photographing field of view directed upward. The component recognition camera 25 photographs the component BH from below when the assembly head 23, which adsorbs the component BH to the lower end of the nozzle 23N, passes above. The image of the component BH obtained by photographing the component recognition camera 25, that is, the image of the component BH held by the assembly head 23 (held component image), is used for detecting the position of the component BH based on the holding state of the assembly head 23 (held component position) and recognizing the component BH.

[0039] The mounting device display input unit 26 includes, for example, a touch panel. The mounting device display input unit 26 receives input operations by the operator and notifies the operator of operations to be performed and various information through a screen, sound, and the like.

[0040] Figure 3 This is a block diagram showing a control system for a component assembly device. Figure 3 In the embodiment, the assembly device control unit 27 includes an assembly device storage unit 31, an assembly processing unit 32, a holding component position calculation unit 33, a feedback processing unit 34, and an assembly device communication unit 35. Figure 3 As shown, the assembly device storage unit 31 stores production data 41. The production data 41 includes component data 41a, an assembly program 41b, second identification information 41c, and assembly data 41d.

[0041] The component data 41a is data that specifies the target assembly coordinates of the component BH set on the substrate KB, the type of component BH to be assembled at the target assembly coordinates, the assembly direction, etc. The assembly program 41b is a control program that causes each part of the component assembly device 11 (component supply part 22, assembly head 23, head moving mechanism 24, component recognition camera 25, etc.) to operate in order to assemble a component BH of a specified type at the target assembly coordinates in a specified assembly direction.

[0042] The second identification information 41c is identification information of a component position detection method used when detecting the position of the component BH held by the mounting head 23, i.e., the held component position (information for identifying it as another component position detection method). The component position detection method is a method for detecting a representative position of the component BH required when detecting the position of the component BH. Figure 4 1 is a diagram showing an example of a component position detection method used in the component assembly system 1. In the first embodiment, as Figure 4 As shown, there are prepared a detection method for the "electrode position", "shape" or "body" of a chip component based on the presence of two electrodes DK at both ends of the main body BD of the component BH, a detection method for the "lead number" or "body" of a lead component based on a plurality of leads RD extending to the side of the main body BD of the component BH, etc.

[0043] exist Figure 4Among them, the component position detection method based on the "electrode position" of the chip component is a component position detection method that uses the midpoint position between the center of gravity positions of the two electrodes DK possessed by the chip component as the representative position of the component BH, and is assigned the number "0001" as identification information. The component position detection method based on the "outer shape" of the chip component is a component position detection method that uses the center of gravity position of the overall outer shape of the chip component as the representative position of the component, and is assigned the number "0002" as identification information. The component position detection method based on the "main body" of the chip component is a component position detection method that uses the center of gravity position of the main body BD of the chip component as the representative position of the component BH, and is assigned the number "0003" as identification information. The component position detection method based on the "lead number" of the lead component is a component position detection method that uses the center of gravity position of multiple leads RD with specific numbers among the multiple leads RD possessed by the lead component as the representative position of the component BH, and is assigned the number "0004" as identification information. The component position detection method based on the "body" of the lead component is a component position detection method in which the center of gravity position of the body BD is used as the representative position of the component BH, and a number "0005" is allocated as identification information.

[0044] Figure 5 An example of assembly data 41d is shown. The assembly data 41d includes the number of the component BH to be assembled (serial number: A001, A002, ...), the target assembly coordinates (Xn, Yn) (n = 1, 2, 3, ...) corresponding to the number of the component BH, the assembly program number Sn (n = 0001, 0002, 0003, ...), and identification information (second identification information 41c). That is, in this embodiment, the component position detection method used for detecting the position of the component BH is determined for each component BH, and the determined component position detection method is read through the second identification information 41c.

[0045] exist Figure 3 In the assembly device storage unit 31, the positional deviation amount data 42 is stored. The positional deviation amount data 42 is data calculated by the inspection device 12 and sent by the management device 13 as described later.

[0046] The assembly processing unit 32 operates the substrate conveying path 21, the component supply unit 22, the assembly head 23, and the head moving mechanism 24 based on the assembly program 41b stored in the assembly device storage unit 31. Thus, the substrate conveying path 21 carries in and positions the substrate KB, the component supply unit 22 supplies the component BH, and the head moving mechanism 24 operates in conjunction with the assembly head 23 to repeatedly perform the assembly cycle. Thus, the components BH are mounted on the substrate KB one by one.

[0047] In one assembly cycle, the assembly head 23 sequentially performs the actions of holding the component BH (component holding action), passing over the component recognition camera 25 (camera over-passing action), and assembling the component BH (assembly action). In the component holding action, the assembly head 23 moves above the component supply unit 22 and adsorbs the component BH supplied by the component supply unit 22 through the nozzle 23N. In the camera over-passing action, the assembly head 23 passes over the component recognition camera 25, so that the component recognition camera 25 photographs the component BH adsorbed on the nozzle 23N from below. In this camera over-passing action, an image of the component BH held by the assembly head 23 is acquired (a holding component image), and the component BH is recognized. In the assembly action, the assembly head 23 moves above the substrate KB, and assembles the component BH at the target assembly coordinates on the substrate KB based on the recognition result of the component BH.

[0048] The held component position calculation unit 33 calculates the position (representative position) of the component BH based on the held component image acquired by the imaging of the component recognition camera 25. The position of the component BH is calculated by using one component position detection method selected from the plurality of component position detection methods. Thus, the component recognition camera 25 and the held component position calculation unit 33 constitute a held component position detection unit 45 that detects the position of the component BH held by the mounting head 23, that is, the held component position.

[0049] The feedback processing unit 34 performs feedback processing based on the feedback information output from the inspection device 12. The main content of the feedback processing is the correction of the action parameters of the assembly head 23 when the component assembly device 11 assembles the component BH on the substrate KB. Here, the so-called "action parameters" are control data for causing the assembly head 23 to operate so that the component BH is assembled at the target assembly coordinates on the substrate KB. The feedback processing unit 34 will be described after the description of the inspection device 12 and the management device 13.

[0050] The assembly device communication unit 35 is connected to both the management device 13 and the inspection device 12 so as to be communicable (see Figure 3 ). The assembly device communication unit 35 receives the information detected by the inspection device 12 via the management device 13 .

[0051] Figure 6 FIG. 1 is a perspective view of the inspection device 12 constituting the component assembly system 1. Figure 1 as well as Figure 6 In the inspection device 12, there is a substrate conveyor 51, an inspection camera 52, a camera moving mechanism 53, an inspection device display input unit 54, and an inspection device control unit 55. The substrate conveyor 51 carries out the loading, positioning, and unloading of the substrate KB. The inspection camera 52 directs the imaging field downward.

[0052] The camera moving mechanism 53 includes an XY beam mechanism having a fixed side beam 53a and a movable side beam 53b that is freely movable relative to the fixed side beam 53a. The camera moving mechanism 53 moves the inspection camera 52 in a horizontal plane by combining the action of moving the movable side beam 53b relative to the fixed side beam 53a and the action of moving the inspection camera 52 relative to the movable side beam 53b, so that the inspection camera 52 can be photographed from above each component BH assembled on the substrate KB by the component assembly device 11.

[0053] The inspection device display input unit 54 includes, for example, a touch panel. The inspection device display input unit 54 receives input operations by the operator and notifies the operator of operations to be performed and various information through a screen, sound, and the like.

[0054] Figure 7 is a block diagram showing a control system of the inspection device 12. Figure 7 As shown in FIG. 1 , the inspection device control unit 55 includes an inspection device storage unit 61, an inspection processing unit 62, an assembly component position calculation unit 63, a position deviation amount calculation unit 64, a quality judgment unit 65, and an inspection device communication unit 66 (first output unit). The inspection device storage unit 61 stores inspection data 71. The inspection data 71 includes inspection component data 71a, an inspection program 71b, first identification information 71c, and inspection reference data 71d.

[0055] The inspection component data 71a is the same data as the component data 41a of the production data 41 stored in the inspection device storage unit 61. The inspection program 71b is a control program for operating the various parts of the inspection device 12 (substrate conveying unit 51, inspection camera 52, camera moving mechanism 53, etc.) in order to inspect whether each component BH mounted on the substrate KB by the component mounting device 11 is mounted at the target mounting coordinate in a predetermined direction.

[0056] The first identification information 71c is identification information of a component position detection method used when detecting the position of the component BH mounted on the substrate KB, that is, the mounted component position. Here, the component position detection method used when detecting the mounted component position is different from the component position detection method used when detecting the holding component position ( Figure 4 ) are the same, but the component position detection method used when detecting the assembly component position and the component position detection method used when detecting the holding component position can be at least partially consistent (common).

[0057] Figure 8 This is a diagram showing an example of inspection reference data stored in the inspection device. Figure 8An example of the inspection reference data 71d is shown. In the inspection reference data 71d, the number of the component BH to be inspected (serial number: A001, A002, ...), the coordinates (Xn, Yn) of the reference position corresponding to the number of the component BH (n = 1, 2, 3, ...), the inspection program number Pn (n = 0001, 0002, 0003, ...), and the identification information (first identification information) are written. In this way, the first identification information 71c (i.e., the component position detection method) is defined for each component BH in the inspection reference data 71d.

[0058] The inspection processing unit 62 acquires an image (inspection image) for each component BH by photographing all of the plurality of components BH mounted on the substrate KB using the inspection camera 52. At this time, the inspection processing unit 62 moves the inspection camera 52 above the substrate KB positioned by the substrate conveying unit 51 based on the inspection program 71b stored in the inspection device storage unit 61, and causes the inspection camera 52 to repeatedly perform photographing actions.

[0059] The mounting component position calculation unit 63 calculates the position of the component BH (mounting component position) based on the inspection image acquired by the inspection camera 52. The component position detection method used when detecting the mounting component position of the component BH is specified for each component BH (see Figure 8 The "Identification Information" column in the Component Position Detection Method is read and used.

[0060] In this way, the inspection camera 52 and the assembly component position calculation unit 63 of the inspection device control unit 55 constitute an assembly component position detection unit 67 for detecting the position of the component BH mounted on the substrate KB, that is, the assembly component position. The assembly component position detection unit 67 detects the assembly component position of each component BH by a component position detection method corresponding to the first identification information 71c specified in the inspection reference data 71d.

[0061] The positional deviation amount calculation unit 64 calculates the positional deviation amount of the mounted component positions of the components BH on the substrate KB detected by the mounted component position detection unit 67 from the predefined reference positions MZ (target mounting coordinates) of the components BH (stored in the inspection device storage unit 61 ). Fig. 9 This is a diagram for explaining the positional deviation amount of a component calculated by the inspection device 12 . Fig. 9 is an example of the inspection image GZ, showing a state in which the representative position ZP of the target component BH is offset from the reference position MZ. Fig. 9In the figure, if the reference position MZ on the substrate KB is represented by the coordinates of the X-axis and the Y-axis which are orthogonal within the plane of the substrate KB, the position offset (DX, DY) of the component BH is obtained based on the difference in the X-axis direction (DX) and the difference in the Y-axis direction (DY) between the representative position ZP of the component BH and the reference position MZ.

[0062] Fig.10 An example of the positional deviation data 42 output by the inspection device 12 is shown. The positional deviation data 42 includes the number of the component BH to be inspected (serial number: A001, A002, ...), the inspection result corresponding to the number of the component BH, that is, the positional deviation (ΔXn, ΔYn) (n=1, 2, 3, ...) of the detected component BH, and identification information (first identification information). Here, the positional deviation itself is shown, but it may also be shown by the coordinates of the position (mounted component position) of the detected component BH, and the positional deviation of the component BH may be obtained based on the difference between the mounted component position and the reference position MZ.

[0063] The quality judgment unit 65 judges the quality of each component BH (whether the assembly state is good or not) based on the positional deviation amount calculated by the positional deviation amount calculation unit 64. Specifically, the positional deviation amount of the component BH calculated by the positional deviation amount calculation unit 64 is compared with the allowable value determined corresponding to the component BH to judge whether the positional deviation amount is less than the allowable value.

[0064] Specifically, the quality judgment unit 65 judges that the assembly state of the component BH is good when the position deviation of the component BH is below the allowable value, and judges that the assembly state of the component BH is unqualified when the position deviation of the component BH exceeds the allowable value. Fig. 9 In the example of , if the allowable values ​​of the positional deviation are RX for the X-axis direction and RY for the Y-axis direction, the quality judgment unit 65 judges that the assembly state of the component BH is good when DX≤RX and DY≤RY. On the other hand, the quality judgment unit 65 judges that the assembly state of the component BH is unacceptable when DX>RX or DY>RY. In addition, the data of the allowable values ​​of each component BH are stored in the inspection device storage unit 61.

[0065] The inspection device communication unit 66 is connected to both the management device 13 and the component mounting device 11 so as to be communicable (see Figure 7). In addition to the identification information of the component position detection method used by the assembly component position detection unit 67 when detecting the assembly component position, i.e., the first identification information 71c, and the position shift amount data 42 for each component BH calculated by the position shift amount calculation unit 64, the inspection device communication unit 66 also outputs information on the quality judgment result of each component BH on the substrate KB judged by the quality judgment unit 65 (sent to the management device 13).

[0066] Fig.11 1 is a block diagram showing a control system of the management device 13. Fig.11 In the embodiment, the management device 13 includes a management device storage unit 81, an identification information determination unit 82, a management device communication unit 83, and a management device display input unit 84. The management device storage unit 81 stores production master data 91, which is the master data of the production data 41 stored in the assembly device storage unit 31 of the component assembly device 11, and inspection master data 92, which is the master data of the inspection data 71 stored in the inspection device storage unit 61 of the inspection device 12.

[0067] The identification information determination unit 82 acquires the first identification information 71c output from the inspection device 12 and acquires the second identification information 41c output from the component mounting device 11. Then, by comparing the first identification information 71c with the second identification information 41c, the first identification information 71c and the second identification information 41c are determined to be consistent with each other.

[0068] like Fig.11 As shown, the management device storage unit 81 stores inspection information 93 and identification information judgment results 94. The inspection information 93 is data of the inspection results (positional deviation data 42 about each component BH, results of quality judgment), etc. obtained by the inspection device 12, and the identification information judgment results 94 are data of the results (identification information judgment results) judged by the identification information judgment unit 82.

[0069] The management device communication unit 83 is communicably connected to both the component mounting device 11 and the inspection device 12. The management device communication unit 83 transmits (transmits) information such as the positional deviation amount data 42 detected and sent by the inspection device 12 to the component mounting device 11.

[0070] Next, the feedback processing unit 34 included in the assembly device control unit 27 of the component assembly device 11 will be described. Figure 3 As shown, the feedback processing unit 34 includes a correction unit 43 and an information statistics unit 44. The correction unit 43 obtains a correction value of an action parameter when the assembly head 23 assembles the substrate KB to the component BH based on the position deviation sent by the management device 13 (i.e., calculated by the inspection device 12), and uses the obtained correction value to correct the action parameter.

[0071] The result of the judgment (identification information judgment result) in the identification information judgment unit 82 of the management device 13 is sent to the correction unit 43 of the component assembly device 11. When the correction unit 43 receives the result of judgment that the first identification information 71c and the second identification information 41c are consistent from the management device 13, it calculates the correction value of the action parameter based on the position deviation amount sent from the management device 13, and corrects the action parameter using the calculated correction value. On the other hand, when the correction unit 43 receives the result of judgment that the first identification information 71c and the second identification information 41c are inconsistent from the management device 13, it does not use the position deviation amount data 42 of the component BH judged to be inconsistent as data for calculating the correction value of the action parameter.

[0072] Here, as described above, the identification information judgment result 94 is stored in the management device storage unit 81. Therefore, when it is judged that the first identification information 71c and the second identification information 41c are inconsistent, the operator can confirm these judgment results. In addition, here, the management device storage unit 81 stores the identification information judgment result 94, but it can also be stored in other storage units.

[0073] The information statistics unit 44 uses the positional deviation data 42 of each component BH sent from the inspection device 12 via the management device 13 to count the information related to the assembly accuracy of the component BH. Specifically, the information statistics unit 44 uses the information of the positional deviation data 42 of the component BH sent from the inspection device 12 to count the information related to the assembly accuracy of the component BH for the component BH determined by the identification information determination unit 82 as the first identification information 71c and the second identification information 41c are consistent. On the other hand, the information statistics unit 44 does not use the positional deviation information of the component BH sent from the inspection device 12 as data for counting the information related to the assembly accuracy of the component BH for the component BH determined by the identification information determination unit 82 as the first identification information 71c and the second identification information 41c are inconsistent.

[0074] Fig.12 The flowchart shown represents the process of the component assembly operation (substrate manufacturing method for manufacturing a mounting substrate in which a component BH is assembled on a substrate KB) performed by the component assembly device 11 in the component assembly system 1. The component assembly device 11 first receives the substrate KB sent from the upstream side through the substrate conveying path 21, and positions it at a specified component assembly operation position (step ST1). When the substrate KB is received from the upstream side, an identifier mounted on the surface of the substrate KB is read and stored. Then, if the substrate KB is positioned through the substrate conveying path 21, the assembly head 23 is moved above the component supply part 22, and the component BH supplied by the component supply part 22 is held (picked up) by the nozzle 23N (step ST2. Component holding process).

[0075] After the component BH is held by the nozzle 23N, the mounting head 23 is moved and passes over the component recognition camera 25, so that the component recognition camera 25 acquires an image of the component BH (held component image) (step ST3). After the component recognition camera 25 acquires the held component image, the second recognition information 41c corresponding to the component BH photographed in the held component image is acquired (step ST4).

[0076] After the component assembly device 11 acquires the second identification information 41c, the position of the component BH held by the assembly head 23, i.e., the held component position, is detected by the component position detection method corresponding to the acquired second identification information 41c (step ST5. Component position detection process). Then, after correcting the action parameters under prescribed conditions (step ST6. Correction processing process), the component BH held by the assembly head 23 is assembled at the target assembly coordinates on the substrate KB (step ST7. Component assembly process).

[0077] After assembling the component BH held by the assembly head 23 at the target assembly coordinates on the substrate KB, the component assembly device 11 outputs the identification information of the component position detection method used by the holding component position detection unit 45 when detecting the holding component position in step ST5, i.e., the second identification information 41c, together with the information of the identifier of the substrate KB read in step ST1, to the management device 13 (step ST8. Second output process). Then, if all the components BH to be assembled on the substrate KB are assembled, the substrate KB is moved to the inspection device 12 on the downstream side (step ST9), and the component assembly operation of a substrate KB is completed.

[0078] Fig.13 The flowchart shown in FIG. 1 shows the flow of the inspection operation performed by the inspection device 12. When performing the inspection operation, the inspection device 12 first receives and carries in the substrate KB from the component mounting device 11 and positions it at a predetermined inspection operation position ( Fig.13 The inspection device 12 reads and stores the identifier mounted on the surface of the substrate KB when receiving the substrate KB from the component mounting device 11. Then, when the substrate KB is positioned, the inspection camera 52 is moved by the camera moving mechanism 53 to obtain an image (inspection image) of the component BH mounted on the substrate KB (step ST12). After obtaining the inspection image GZ for the component BH, the inspection device 12 obtains the identification information (first identification information 71c) corresponding to the component position detection method corresponding to the component BH of which the inspection image is obtained (step ST13).

[0079] If the inspection device 12 acquires the first identification information 71c, the position of the component BH mounted on the substrate KB, i.e., the mounted component position, is detected based on the inspection image by the component position detection method corresponding to the acquired first identification information 71c (step ST14. Mounted component position detection process). Then, if the mounted component position is detected, the positional offset of the detected mounted component position from the predetermined reference position (target assembly coordinate) is calculated (step ST15. Positional offset calculation process).

[0080] If the inspection device 12 calculates the position shift amount, the quality of the assembly state of the component BH on the substrate KB is judged in the quality judgment section 65 based on the calculated position shift amount (step ST16. Quality judgment process). If the quality of the assembly state of the component BH is judged, the judgment result of the quality of each component, the identification information of the component position detection method used when detecting the assembly component position (first identification information 71c), the information of the position shift amount calculated by the position shift amount calculation section 64 in the position shift calculation process, and the information of the identifier of the substrate KB read in step ST11 are output from the inspection device communication section 66 to the management device 13 (step ST17. First output process). Then, if all the components BH to be inspected on the substrate KB are inspected, the substrate KB is moved to the downstream side (step ST18), and the inspection operation of a substrate KB is completed.

[0081] Fig.14 The flowchart shown shows the flow of the management operation performed by the management device 13. When performing the management operation, the management device 13 first obtains (receives) the first identification information 71c and the information on the positional offset of the component BH output by the inspection device 12 in step ST17 (step ST21). At this time, the identifier of the substrate KB is also obtained at the same time. Then, if the first identification information 71c and the information on the positional offset are obtained, the second identification information 41c output by the component assembly device 11 in the second output process of step ST8 is obtained (step ST22). At this time, the identifier of the substrate KB is also obtained at the same time. The order of these steps ST21 and step ST22 may also be reversed.

[0082] When the management device 13 obtains the first identification information 71c and the second identification information 41c, after confirming that the identifiers of the substrate KB are the same, it determines whether the first identification information 71c and the second identification information 41c are consistent (step ST23. Identification information determination process). Then, the result obtained by the determination (identification information determination result 94) and the information on the positional deviation of the component BH obtained in step ST17 are sent (output) to the component assembly device 11 (step ST24).

[0083] Fig.15The flowchart shown shows the flow of the correction operation of the action parameters performed by the component assembly device 11 in the step ST6 (correction processing step). When the component assembly device 11 performs the correction operation of the action parameters, first, the identification information judgment result 94 output by the management device 13 in step ST24, that is, the judgment result of whether the first identification information 71c and the second identification information 41c are consistent and the information on the positional deviation of the component BH (step ST31). The identification information judgment result 94 and the information on the positional deviation of the component BH obtained here are information (identification information judgment result 94 and positional deviation information) for the substrate KB processed before the substrate KB on which the component assembly device 11 performs the component assembly operation or the inspection device 12 performs the inspection operation at this time.

[0084] When the component assembly device 11 obtains the identification information judgment result 94 and the information of the positional deviation of the component BH in step ST31, it is determined whether the identification information judgment result 94 indicates that "the first identification information and the second identification information are consistent" (step ST32). As a result, if the identification information judgment result 94 indicates that "the first identification information and the second identification information are consistent" (yes (Y) in step ST32), the information of the positional deviation is stored as feedback data (step ST33). Then, it is determined whether the required number of data is collected (step ST34). As a result, if the required number of data is collected (yes (Y) in step ST34), the correction value of the action parameter is calculated and the action parameter is corrected (step ST35), and the information on the assembly accuracy of the component BH is statistically analyzed using the information of the positional deviation (step ST36).

[0085] Here, the judgment in step ST34 may be based on whether the number of substrates KB on which the component BH is mounted and inspected has reached a certain number, or may be based on whether the number of substrates KB whose positional deviation exceeds a predetermined reference has reached a certain number. In step ST35, the correction value of the action parameter is calculated by taking the average of the positional deviation of the number of data reaching a certain number, and the action parameter is corrected based on the correction value. In step ST36, for example, the change in the positional deviation is counted in time series, and data that can confirm the state in which the positional deviation is gradually reduced is created by correcting the action parameter.

[0086] When step ST36 is completed, the component mounting device 11 returns to Fig.12, but in step ST32, when the identification information judgment result 94 does not indicate that "the first identification information is consistent with the second identification information", steps ST33 to ST36 are skipped and the main route is returned. Therefore, in step ST32, when the identification information judgment result 94 does not indicate that "the first identification information is consistent with the second identification information" (No (N) in step ST32), that is, when the component position detection method used when the assembly component position of component BH is detected in the inspection device 12 is different from the component position detection method used when the holding component position of component BH is detected in the component assembly device 11, the position offset of the component BH judged to be inconsistent is not used as data for calculating the correction value of the action parameter in the component assembly device 11.

[0087] This is to avoid the following situation: although the component position detection method used when the assembly component position of component BH is detected in the inspection device 12 is different from the component position detection method used when the holding component position of component BH is detected in the component assembly device 11, the position offset of component BH detected in the inspection device 12 is still used to correct the action parameters, which means that the position offset is incorrect for the component assembly device 11 to correct the action parameters, so the position offset becomes larger than before the correction. In addition, even if the incorrect position offset for the component assembly device 11 is used to perform statistics on the information related to the assembly accuracy of component BH, the statistical result will become incorrect, so the statistics itself are not performed.

[0088] In this way, the inspection device 12 of the component assembly system 1 in the first embodiment outputs the identification information (first identification information 71c) of the component position detection method used when detecting the position of the component BH mounted on the substrate KB (mounted component position) together with the position offset of the mounted component position from the reference position (target assembly coordinate). The management device 13 compares the first identification information 71c output from the inspection device 12 and the identification information (second identification information 41c) of the component position detection method used when the component assembly device 11 detects the position of the component BH held by the assembly head 23 (held component position), and determines whether the first identification information 71c and the second identification information 41c are consistent (step ST32). Then, if the judgment result indicates that the first identification information 71c and the second identification information 41c are consistent, the action parameter is corrected using the correction value obtained based on the position offset of the component BH calculated by the inspection device 12 (step ST35). On the other hand, when the determination result does not indicate that the first identification information 71c and the second identification information 41c coincide with each other, the positional deviation amount of the component BH is not used as data for calculating the correction value of the operation parameter.

[0089] Therefore, in the component assembly system 1 in embodiment 1, the action parameters can be corrected only when the first identification information 71c is consistent with the second identification information 41c, and the action parameters during component assembly can be corrected without reducing the assembly accuracy of the component BH in the component assembly device 11.

[0090] (Implementation Method 2)

[0091] Next, the component mounting system in Embodiment 2 of the present disclosure is described. The component mounting system in Embodiment 2 differs from the component mounting system 1 in Embodiment 1 only in part of the content of the component mounting work performed by the component mounting device 11 and part of the content of the management work performed by the management device 13.

[0092] In the second embodiment, the component mounting device 11 is Fig.16 The component assembly operation is performed by the process shown in the flowchart of Fig.13 The management device 13 performs the inspection operation by the process shown in the flowchart of Fig.17 The management operation is performed by the process shown in the flowchart of Fig.18 The operation parameters are corrected according to the process shown in the flowchart.

[0093] Fig.16 1 is a flowchart showing the flow of the component assembly work performed by the component assembly device 11. Fig.16 As shown in the flowchart, when performing a component assembly operation, first, as in the case of Embodiment 1, the substrate KB sent from the upstream side is received through the substrate conveying path 21 and positioned at a specified component assembly operation position (step ST41). If the substrate KB is positioned through the substrate conveying path 21, the assembly head 23 is moved above the component supply unit 22, and the component BH supplied by the component supply unit 22 is held (picked up) by the nozzle 23N (step ST42. Component holding process). Then, the assembly head 23 is moved and passes above the component recognition camera 25, so that the component recognition camera 25 obtains an image of the component BH (holding the component image) (step ST43). Then, if the component recognition camera 25 obtains the held component image, the second identification information 41c corresponding to the component BH photographed in the held component image is obtained (step ST44).

[0094] If the component assembly device 11 obtains the second identification information 41c, the position of the component BH held by the assembly head 23, i.e., the held component position, is detected by the component position detection method corresponding to the obtained second identification information 41c (step ST45. Component position detection process). Then, after correcting the action parameters under prescribed conditions (step ST46. Correction processing process), the component BH held by the assembly head 23 is assembled at the target assembly coordinates on the substrate KB (step ST47. Component assembly process).

[0095] When all the components BH to be mounted on the substrate KB are mounted by the component mounting device 11, the substrate KB is carried out to the inspection device 12 on the downstream side (step ST48), and the component mounting operation of one substrate KB is completed. Thus, in the second embodiment, there is no second output process (step ST8) corresponding to the first embodiment. Fig.12 ) process, the second identification information 41c, which is the identification information of the component position detection method used when detecting the holding component position, is not output to the management device 13.

[0096] Fig.17 FIG. 1 is a flowchart showing the flow of management operations performed by the management device. Fig.17 As shown in the flowchart of FIG. 1 , when performing management operations, first, the inspection device 12 is obtained (received) in the first output process of step ST17 (refer to FIG. 1 ). Fig.13 ) and the information on the positional deviation of the component BH output in step ST51. If the management device 13 obtains the first identification information 71c in step ST51, it determines whether the first identification information 71c is the specified identification information corresponding to the specific component detection method (step ST52. Identification information determination process). Then, the result obtained by the determination (identification information determination result 94) and the information on the positional deviation of the component BH obtained in step ST17 are sent (output) to the component assembly device 11 (step ST53).

[0097] Thus, in the second embodiment, in step ST52 corresponding to step ST23 in the first embodiment, it is not determined whether the first identification information 71c and the second identification information 41c are consistent as in the case of the first embodiment, but it is determined whether the first identification information 71c is the prescribed identification information. In addition, the "prescribed identification information" is usually set to the identification information indicating the component position detection method corresponding to the second identification information 41c in the first embodiment, and the data is stored in the management device storage unit 81.

[0098] Fig.18 FIG. 1 is a flowchart showing the flow of the operation parameter correction operation performed by the component assembly device 11. Fig.18 As shown in the flowchart of , when the operation parameter correction operation is performed, first, the identification information judgment result (i.e., the judgment result of whether the first identification information 71c is the specified identification information) output in step ST53 based on the management operation of the management device 13 and the information on the positional deviation of the component BH are obtained (step ST61). The identification information judgment result 94 and the information on the positional deviation of the component BH obtained here are the information (identification information judgment result 94 and positional deviation information) on the substrate KB processed before the substrate KB on which the component assembly device 11 performs the component assembly operation or the inspection device 12 performs the inspection operation at that time, as in the case of the first embodiment.

[0099] When the component assembly device 11 obtains the identification information judgment result and the positional deviation information of the component BH in step ST61, it is determined whether the identification information judgment result indicates that "the first identification information is the prescribed identification information" (step ST62). As a result, if the identification information judgment result indicates that "the first identification information is the prescribed identification information" (yes in step ST62), the positional deviation information is stored as feedback data (step ST63). Then, it is determined whether the required number of data is collected (step ST64). As a result, if the required number of data is collected (yes in step ST64), the correction value is calculated and the action parameter is corrected (step ST65), and the positional deviation information is used to calculate the information related to the assembly accuracy of the component BH (step ST66). The judgment method in step ST64 is the same as that in the first embodiment.

[0100] When step ST66 is completed, the component assembly device 11 returns to Fig.16 , but in step ST62, when the identification information judgment result 94 does not indicate that "the first identification information is the prescribed identification information" (No in step ST62), steps ST63 to ST66 are skipped and the main route is returned. Therefore, in step ST62, when the identification information judgment result 94 does not indicate that "the first identification information is the prescribed identification information" (No in step ST62), that is, when the component position detection method used in the inspection device 12 when detecting the assembly component position of the component BH is different from the component position detection method used in the component assembly device 11 when detecting the holding component position of the component BH, the position offset of the component BH judged to be not the prescribed identification information is not used as data for calculating the correction value of the action parameter in the component assembly device 11, nor is it used as data for statistical information related to the assembly accuracy of the component BH.

[0101] In the second embodiment, the management device storage unit 81 stores the inspection information 93 and the identification information determination result 94. Therefore, when it is determined that the first identification information 71c does not match the predetermined identification information, the operator can confirm these determination results.

[0102] Thus, the inspection device 12 of the component assembly system 1 in the second embodiment outputs the identification information (first identification information 71c) of the component position detection method used when detecting the position of the component BH assembled on the substrate KB (assembly component position) together with the position offset of the assembly component position from the reference position (target assembly coordinate). The management device 13 compares the first identification information 71c output from the inspection device 12 with the predetermined identification information, and determines whether the first identification information 71c is the predetermined identification information (step ST62). Then, in the case where the judgment result is that the first identification information 71c is the content of the predetermined identification information, the action parameter is corrected using the correction value obtained based on the position offset of the component BH calculated in the inspection device 12 (step ST65). On the other hand, in the case where the judgment result is not that the first identification information 71c is the predetermined identification information, the position offset of the component BH is not used as data for calculating the correction value of the action parameter.

[0103] Therefore, in the component assembly system 1 in the second embodiment, the action parameters can be corrected only when the first identification information 71c matches the specified identification information, and the action parameters during component assembly can be corrected without reducing the assembly accuracy of the component BH in the component assembly device 11.

[0104] As described above, in the first and second embodiments, the identification information (first identification information) of the component position detection method used when the inspection device 12 detects the position of the assembly component is output, and it is determined whether the first identification information is consistent with the identification information (second identification information) of the component position detection method used when the component assembly device 11 detects the position of the holding component, or whether it is the specified identification information. Then, when the first identification information is consistent with the second identification information, or when the first identification information is the specified identification information, the action parameters when the assembly head 23 assembles the component BH on the substrate KB are corrected, but when the first identification information is inconsistent with the second identification information, or when the first identification information is not the specified identification information, the information of the position deviation amount of the component BH determined to be inconsistent or determined not to be the specified identification information is not used as data for calculating the correction value of the action parameter. Therefore, the action parameters can be corrected only when the component position detection method used when the inspection device 12 detects the position of the assembly component is consistent with the component position detection method used when the component assembly device 11 detects the position of the holding component, and the action parameters when the component assembly is corrected without reducing the assembly accuracy of the component BH.

[0105] So far, the embodiments of the present disclosure have been described, but the present disclosure is not limited to the above, and various modifications are possible. For example, in the above-mentioned embodiments, the information on the positional offset is stored in the storage unit (assembly device storage unit 31) of the component assembly device 11, but the information on the positional offset may also be stored in other devices, such as the storage unit (management device storage unit 81) of the management device 13. In addition, in the above-mentioned embodiments, the management device 13 is provided with the identification information judgment unit 82, but it may also be provided in the component assembly device 11. In addition, the management device 13 is not necessarily provided, and the same effect can be obtained by giving the functions of the management device 13 to the component assembly device 11.

[0106] In addition, in the above-mentioned embodiments, each structural element is constituted by dedicated hardware, but it can also be implemented by executing a software program suitable for each structural element. Each structural element can also be implemented by a program execution unit such as a CPU (Central Processing Unit) or a processor reading and executing a software program recorded in a recording medium such as a hard disk or a semiconductor memory.

[0107] Industrial Applicability

[0108] Provided are an inspection device, a component assembly system, and a substrate manufacturing method capable of correcting motion parameters during component assembly without reducing component assembly accuracy.

[0109] -Explanation of symbols-

[0110] 1 Component assembly system

[0111] 11 Component assembly device

[0112] 12 Inspection device

[0113] 23 Assembly head

[0114] 41c Second identification information

[0115] 43 Correction Department

[0116] 45 Holding component position detection unit

[0117] 64 Position deviation calculation unit

[0118] 65 Pros and Cons Judgment Department

[0119] 66 Inspection device communication unit (1st output unit)

[0120] 67 Assembly part position detection unit

[0121] 71 Check data

[0122] 71c First identification information

[0123] 81 Management device storage unit (storage unit)

[0124] 82 Identification information judgment unit

[0125] BH Parts

[0126] ZP stands for Position

[0127] DK Electrode

[0128] BD Main Body

[0129] RD lead

[0130] KB Substrate

[0131] MZ reference position.

Claims

1. An inspection device for inspecting a component mounted on a substrate, the inspection device comprising: a mounting component position detection unit that detects a position of the component mounted on the substrate as a mounting component position; a position deviation amount calculation unit that calculates a position deviation amount of the mounting component position detected by the mounting component position detection unit from a predetermined reference position; a quality judging section that judges the quality of the assembly state of the component based on the positional deviation amount calculated by the positional deviation amount calculating section; and a first output unit that outputs first identification information that is identification information of a component position detection method used when the mounting component position detection unit detects the mounting component position and the position shift amount calculated by the position shift amount calculation unit, The component position detection method is a method of detecting a representative position of the component based on any one of the position of the electrode of the component, the outer shape of the component, the main body of the component, and the positions of a plurality of leads extending to the side of the component.

2. The inspection device according to claim 1, wherein: The inspection device has inspection data defining the first identification information for each component, and the mounted component position detection unit detects the mounted component position based on a component position detection method corresponding to the first identification information defined in the inspection data.

3. A component assembly system, comprising: a component assembly device that holds a component by an assembly head and assembles the held component on a substrate; and an inspection device that inspects the component assembled on the substrate by the component assembly device. The inspection device comprises: a mounting component position detecting unit that detects a position of the component mounted on the substrate as a mounting component position; a position deviation amount calculation unit that calculates a position deviation amount of the mounting component position detected by the mounting component position detection unit from a predetermined reference position; a quality judging section that judges the quality of the assembly state of the component based on the positional deviation amount calculated by the positional deviation amount calculating section; and a first output unit that outputs first identification information that is identification information of a component position detection method used when the mounting component position detection unit detects the mounting component position and the position shift amount calculated by the position shift amount calculation unit, The component position detection method is a method of detecting a representative position of the component based on any one of the position of the electrode of the component, the outer shape of the component, the main body of the component, and the positions of a plurality of leads extending to the side of the component.

4. The component assembly system according to claim 3, wherein: The component mounting device includes: a holding component position detection unit that detects the position of the component held by the mounting head as a holding component position; The component mounting device mounts a component on a substrate based on the holding member position detected by the holding member position detection unit.

5. The component assembly system according to claim 4, wherein: The component assembly system also includes: an identification information determination unit for determining whether the first identification information output from the inspection device is consistent with second identification information which is identification information of a component position detection method used when the holding component position detection unit detects the position of the holding component; and A correction unit corrects an operation parameter when the mounting head mounts the component on the substrate based on the positional deviation amount calculated by the inspection device when the identification information determination unit determines that the first identification information and the second identification information are consistent.

6. The component assembly system according to claim 5, wherein: When the identification information determination unit determines that the first identification information and the second identification information do not match, the correction unit does not use the positional deviation amount of the component determined to be inconsistent as data for calculating the correction value of the motion parameter.

7. The component assembly system according to claim 5 or 6, wherein: The component mounting system further includes a storage unit that stores a determination result when the identification information determination unit determines that the first identification information and the second identification information do not coincide with each other.

8. The component assembly system according to claim 4, wherein: The component assembly system also includes: an identification information determination unit for determining whether the first identification information output from the inspection device is specified identification information corresponding to a specific component position detection method; and A correction unit corrects an operation parameter when the mounting head mounts the component on the substrate based on the positional deviation amount calculated by the inspection device when the identification information determination unit determines that the first identification information is the predetermined identification information.

9. The component assembly system according to claim 8, wherein: When the identification information determination unit determines that the first identification information is not the predetermined identification information, the correction unit does not use the positional deviation amount of the component determined not to be the predetermined identification information as data for calculating the correction value of the motion parameter.

10. The component assembly system according to claim 8 or 9, wherein: The predetermined identification information is identification information indicating a component position detection method corresponding to second identification information which is identification information of a component position detection method used when the holding member position detection unit detects the holding member position.

11. The component assembly system according to claim 8 or 9, wherein: The component mounting system further includes a storage unit that stores a determination result when the identification information determination unit determines that the first identification information is not the predetermined identification information.

12. A method for manufacturing a substrate, comprising manufacturing a mounting substrate on which components are mounted, the method comprising: The component holding process uses the assembly head to hold the component; a component holding position detection step of detecting the position of the component held by the assembly head in the component holding step as a component holding position; a component assembling step of operating the assembling head based on the motion parameters of the holding component position detected in the holding component position detecting step, thereby assembling the component held by the assembling head on the substrate; a mounting component position detection step of detecting a position of the component mounted on the substrate through the component mounting step as a mounting component position; a position offset calculation step of calculating a position offset of the assembly component position detected in the assembly component position detection step from a predetermined reference position; a quality judging step of judging the quality of the assembly state of the component based on the position offset calculated in the position offset calculating step; a first output step of outputting first identification information, which is identification information of a component position detection method used when detecting the position of the assembly component, and the position shift amount calculated in the position shift amount calculation step; an identification information judging step of judging whether the first identification information outputted in the first outputting step is consistent with the second identification information which is the identification information of the component position detecting method used when detecting the position of the holding component in the holding component position detecting step; and a correction processing step of correcting the motion parameter using a correction value obtained based on the position shift amount calculated in the position shift amount calculation step when it is determined in the identification information determination step that the first identification information and the second identification information are consistent with each other, In the component mounting step, when the operation parameter is corrected in the correction processing step, the component is mounted on the substrate using the corrected operation parameter. The component position detection method is a method of detecting a representative position of the component based on any one of the position of the electrode of the component, the outer shape of the component, the main body of the component, and the positions of a plurality of leads extending to the side of the component.

13. The method for manufacturing a substrate according to claim 12, wherein: In the correction processing step, when the first identification information and the second identification information are determined to be inconsistent in the identification information determination step, the positional deviation amount of the component determined to be inconsistent is not used as data for calculating the correction value of the motion parameter.

14. A method for manufacturing a substrate, comprising manufacturing a mounting substrate on which components are mounted, the method comprising: The component holding process uses the assembly head to hold the component; a component holding position detection step of detecting the position of the component held by the assembly head in the component holding step as a component holding position; a component assembling step of operating the assembling head based on the motion parameters of the holding component position detected in the holding component position detecting step, thereby assembling the component held by the assembling head on the substrate; a mounting component position detection step of detecting a position of the component mounted on the substrate through the component mounting step as a mounting component position; a position offset calculation step of calculating a position offset of the assembly component position detected in the assembly component position detection step from a predetermined reference position; a quality judging step of judging the quality of the assembly state of the component based on the position offset calculated in the position offset calculating step; a first output step of outputting first identification information, which is identification information of a component position detection method used when detecting the position of the assembly component, and the position shift amount calculated in the position shift amount calculation step; an identification information judging step of judging whether the first identification information outputted in the first outputting step is predetermined identification information; and a correction processing step of correcting the motion parameter using a correction value obtained based on the position shift amount calculated in the position shift amount calculation step when the first identification information is determined to be the predetermined identification information in the identification information determination step, In the component mounting step, when the operation parameter is corrected in the correction processing step, the component is mounted on the substrate using the corrected operation parameter. The component position detection method is a method of detecting a representative position of the component based on any one of the position of the electrode of the component, the outer shape of the component, the main body of the component, and the positions of a plurality of leads extending to the side of the component.

15. The method for manufacturing a substrate according to claim 14, wherein: In the correction processing step, when the first identification information is judged not to be the prescribed identification information in the identification information judging step, the positional offset of the component judged not to be the prescribed identification information is not used as data for calculating the correction value of the action parameter.

16. The method for manufacturing a substrate according to claim 14 or 15, wherein: The predetermined identification information is identification information indicating a component position detection method corresponding to the second identification information.

Images