A method of forming a silicone gel on a PC film
By molding silicone onto PC film, the problem of bonding silicone to PC material is solved, achieving high adhesion and efficient production, which is suitable for electronic product casings.
Patent Information
- Application Number
- CN202211355654.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-11-01
- Publication Date
- 2025-11-28
- Estimated Expiration
- 2042-11-01
AI Technical Summary
In existing technologies, silicone and PC materials are difficult to bond effectively, resulting in low glue spraying efficiency, easy scratching of the glue layer surface, and poor adhesion, leading to a large number of defective powder and granule products.
After mixing raw silicone rubber with compounding agents and fiber materials, the mixture is plasticized and compounded, adhesive is sprayed onto a PC film, and then it is molded with silicone using a hydraulic device, combined with constant temperature and humidity testing and thermal shock testing.
It achieves a stable bond between PC and silicone, improves adhesion, reduces scratches and defective products, adapts to various environments, reduces production costs, and improves production efficiency.
Smart Images

Figure CN115674530B_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of silica gel forming, in particular to a method for forming silica gel on PC film. BACKGROUND
[0002] Silica gel is widely used in the field of electronic components and is well known, and PC material is also widely used, and the shells of most electronic products are also made of PC material.
[0003] In the prior art, it is difficult to combine silica gel and PC, and the most common process for realizing the combination between the two is glue spraying, that is, spraying an adhesive on the PC material and then forming silica gel on the adhesive, but this process has the defects of low glue spraying efficiency, easy scratching of the surface of the glue spraying layer, poor adhesion, and many powder and particle defective products.
[0004] Therefore, it is necessary to invent a method for forming silica gel on PC film to solve the above problems. SUMMARY
[0005] In view of the above problems, the present application provides the following technical scheme: a method for forming silica gel on PC film, comprising the following steps:
[0006] Step one, preparation: mixing silica rubber raw rubber with compounding agent, fiber material and heavy metal material;
[0007] Step two, plasticizing: plasticizing the mixed silica rubber raw rubber in step one by a hot plasticizing device;
[0008] Step three, mixing: mixing the plasticized silica rubber raw rubber in step three by a rubber mixing machine to completely and uniformly disperse the compounding agent, thereby obtaining a mixed rubber;
[0009] Step four, spraying: uniformly spraying an adhesive on the surface of the PC film;
[0010] Step five, forming: oil pressure vulcanization forming the mixed rubber obtained in step three and the PC film sprayed with the adhesive in step four by an oil pressure device within a certain time;
[0011] Step six, quality inspection: the oil pressure vulcanization formed product in step five is subjected to peeling test, constant temperature and humidity test, cold and hot impact test, and water boiling test.
[0012] Preferably, the fiber material in step one is one of cotton, hemp, wool and artificial fiber, and the metal material is one of steel wire and copper wire.
[0013] Preferably, in the step two, the temperature inside the plasticizing device is controlled below 50 DEG C, the time is controlled between 10-20 minutes, and the rotation speed ratio of the plasticizing shaft is 1:(1.1-1.2) when plasticizing is performed by using the plasticizing device.
[0014] Preferably, the mixing temperature in the step three is controlled below 45 DEG C, and the mixing time is controlled between 20-40 minutes.
[0015] Preferably, the composition and proportion of the adhesive in the step four are 22 parts of butyl ester solvent, 22 parts of low-temperature silica gel base material, 2.2 parts of acrylic resin, 2.1 parts of silane coupling agent, and 0.5 parts of curing agent.
[0016] Preferably, the butyl ester solvent is one of dibutyl phthalate and tributyl phosphate, and the curing agent is one of diethylaminomethyl triethoxysilane and condensation type two-component silicone rubber crosslinking agent.
[0017] Preferably, the thickness of the adhesive sprayed on the surface of the PC film in the step four is 5-10 microns.
[0018] Preferably, the temperature of the oil pressure vulcanization forming in the step five is controlled between 90-120 DEG C.
[0019] Technical effects and advantages of the present application:
[0020] 1. The present application can realize the oil pressure forming of PC and silica gel, can be used for the shell of electronic products such as mobile phones, notebook computers, household appliances, etc. to increase the silica gel forming, improve the quality and use performance of the products, and can effectively improve the problems of easy scratching of the adhesive layer surface and many particle defective products, stabilize the production, and ensure that the silica gel and the PC film have good adhesion.
[0021] 2. The PC and silica gel product made by the present application can adapt to various use environments, ensure that the silica gel and the PC film have good adhesion, can withstand multiple high-strength tests, and has the characteristics of low production cost and high production efficiency.
[0022] Other features and advantages of the present application will be set forth in the following description of the application, and in part will become apparent to those skilled in the art from the description, or can be learned by practice of the application. The objects and other advantages of the present application can be realized and obtained by the structure indicated in the specification and the drawings. BRIEF DESCRIPTION OF DRAWINGS
[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings described below are only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor based on these drawings.
[0024] Figure 1 is a flow chart of the present application. DETAILED DESCRIPTION
[0025] In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.
[0026] In the description of the present application, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application. In addition, in the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise explicitly and specifically limited.
[0027] Embodiment one, as shown in the figure; a method for forming silica gel on PC film, the method comprising the following steps: Figure 1
[0028] Step one, preparation: mixing and stirring the raw silicone rubber with the compounding agent, fiber material and heavy metal material;
[0029] Step two, plasticizing: the mixed raw silicone rubber in step one is plasticized by a hot plasticizing device;
[0030] Step three, mixing: the plasticized raw silicone rubber in step three is mixed by a rubber mixing machine, and the rubber mixing machine is used to completely and uniformly disperse the compounding agent, so as to obtain the mixed rubber;
[0031] Step four, spraying: uniformly spraying the adhesive on the surface of the PC film;
[0032] Step five, molding: the rubber compound obtained in step three and the PC film sprayed with the adhesive in step four are oil pressure vulcanized and molded by an oil pressure device within a certain time;
[0033] Step six, quality inspection: the finished product obtained in step five is subjected to peeling test, constant temperature and humidity test, cold and hot impact test and water boiling test.
[0034] The fiber material in step one is one of cotton, hemp, wool and man-made fiber, and the metal material is one of steel wire and copper wire.
[0035] In step two, the temperature inside the plasticizing device is controlled below 45℃, the time is controlled within 18-22 min, and the rotating speed ratio of the plasticizing shaft is 1:(1.5-1.7).
[0036] The mixing temperature in step three is controlled below 55℃, and the mixing time is controlled within 25-40 min.
[0037] The composition and ratio of the adhesive in step four are 22 parts of butyl ester solvent, 22 parts of low temperature silica gel base, 2.2 parts of acrylic resin, 2.1 parts of silane coupling agent and 0.5 parts of curing agent.
[0038] The butyl ester solvent is dibutyl phthalate, and the curing agent is diethylaminomethyl triethoxysilane.
[0039] The thickness of the adhesive sprayed on the surface of the PC film in step four is 7-10μm.
[0040] The temperature of oil pressure vulcanization in step five is controlled within 130-145℃, the vulcanization repair pressure is 1-2Mpa, and the heating plate heating time is <30min.
[0041] Example two, as shown in Figure 1 A method for molding silica gel on a PC film, comprising the following steps:
[0042] Step one, preparation: the raw silica rubber is mixed with the compounding agent, fiber material and heavy metal material;
[0043] Step two, plasticizing: the mixed raw silica rubber in step one is plasticized by a hot plasticizing device;
[0044] Step three, mixing: the plasticized raw silica rubber in step three is stirred and mixed with the compounding agent completely and uniformly by a rubber mixing mill, so as to obtain a rubber compound;
[0045] Step four, spraying: the surface of the PC film is uniformly sprayed with an adhesive;
[0046] Step five, molding: the rubber compound obtained in step three and the PC film sprayed with the adhesive in step four are oil pressure vulcanized and molded by an oil pressure device within a certain time;
[0047] Step six, quality inspection: the finished product oil pressure vulcanized and molded in step five is subjected to peeling test, constant temperature and humidity test, cold and hot impact test, and water boiling test by the staff.
[0048] The fiber material in step one is one of cotton, hemp, wool, and man-made fiber, and the metal material is one of steel wire and copper wire.
[0049] In step two, when the plasticizing device is used for plasticizing, the temperature inside the plasticizing device is controlled below 75℃, the time is controlled within 8-16 min, and the rotating speed ratio of the plasticizing shaft is 1:(1.7-2).
[0050] The mixing temperature in step three is controlled below 60℃, and the mixing time is controlled within 15-35 min.
[0051] The composition and ratio of the adhesive in step four are 22 parts of butyl ester solvent, 22 parts of low-temperature silica gel base material, 2.2 parts of acrylic resin, 2.1 parts of silane coupling agent, and 0.5 parts of curing agent.
[0052] The butyl ester solvent is tributyl phosphate, and the curing agent is a condensation type two-component silicone rubber crosslinking agent.
[0053] The thickness of the adhesive sprayed on the surface of the PC film in step four is 5-7μm.
[0054] The temperature of the oil pressure vulcanization molding in step five is controlled within 120-130℃, the vulcanization repair pressure is 1.3-2Mpa, and the heating plate warming-up time is <25 min.
[0055] Although the present application is described in detail with reference to the foregoing embodiments, those skilled in the art should understand that the technical solutions recorded in the foregoing embodiments can be modified, or some technical features can be replaced by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.
Claims
1. A method for molding silicone on a PC film, characterized in that: The method includes the following steps; Step 1: Material preparation: Mix the raw silicone rubber with compounding agents, fiber materials and heavy metal materials; Step 2, Plasticizing: The mixed raw silicone rubber from Step 1 is plasticized using a thermoplasticizer. Step 3, Mixing: Put the silicone rubber raw rubber that has been plasticized in Step 2 into a rubber mixing mill and stir it in the rubber mixing mill until it is completely and evenly dispersed with the compounding agent to obtain the compounded rubber. Step 4: Spraying: Spray adhesive evenly onto the surface of the PC film; Step 5, Molding: The compound obtained in Step 3 and the PC film coated with adhesive in Step 4 are subjected to hydraulic vulcanization molding using a hydraulic device within a predetermined time. Step Six: Perform peel test, constant temperature and humidity test, thermal shock test, and boiling water test on the finished product formed by hydraulic vulcanization in Step Five above. The fiber material in step one is one of cotton, linen, wool, and synthetic fiber, and the metal material is one of steel wire and copper wire. In step two, when using the plasticizing device for plasticizing, the internal temperature of the plasticizing device is controlled below 50℃, the time is controlled between 10-20 minutes, and the rotation speed ratio of the plasticizing shaft is 1:(1.1-1.2). In step three, the mixing temperature is controlled below 45°C, and the mixing time is controlled between 20 and 40 minutes.
2. The method for molding silicone on a PC film according to claim 1, characterized in that: The adhesive in step four above consists of 22 parts butyl ester solvent, 22 parts low-temperature silicone base, 2.2 parts acrylic resin, 2.1 parts silane coupling agent, and 0.5 parts curing agent.
3. The method for molding silicone on a PC film according to claim 2, characterized in that: Its butyl ester solvent is one of dibutyl phthalate and tributyl phosphate, and its curing agent is one of diethylaminomethyltriethoxysilane and condensation-type two-component silicone rubber crosslinking agent.
4. The method for molding silicone on a PC film according to claim 1, characterized in that: In step four, the thickness of the adhesive sprayed onto the PC film surface is 5-10 μm.
5. A method for molding silicone on a PC film according to claim 2, characterized in that: In step five, the temperature of hydraulic vulcanization molding is controlled at 90-120℃.
Citation Information
Patent Citations
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Process for forming mobile phone protective sleeve by using 3D PE thin film and silica gel
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