Multilayer ceramic electronic component

Abstract

Provided is a multilayer ceramic electronic component including: a ceramic main body including dielectric layers and first and second internal electrodes, the dielectric layers being disposed between the first and second internal electrodes, the first and second internal electrodes being alternately stacked and respectively exposed to one side surface and another side surface; and first and second external electrodes disposed on an outer surface of the ceramic main body to be respectively connected to the first and second internal electrodes, wherein the ceramic main body includes an overlapping region in which the first and second internal electrodes overlap in a thickness direction, an edge region, and / or a coverage region, and the edge region and / or the coverage region in a width direction includes a phosphoric acid group second phase.

Description

[0001] This application is a divisional application of the invention patent application "Multilayer Ceramic Electronic Components" filed on December 13, 2018, with application number 201811523884.3. Technical Field

[0002] This disclosure relates to multilayer ceramic electronic components. Background Technology

[0003] Multilayer ceramic electronic components have been widely used as information technology (IT) components in computers, personal digital assistants (PDAs), cellular phones, etc., because of their small size, high capacitance, ease of installation, and high reliability and strength.

[0004] The moisture resistance and hardness of the ceramic body, including in multilayer ceramic electronic components, may deteriorate due to shrinkage after the internal electrodes are sintered. Summary of the Invention

[0005] One aspect of this disclosure provides a multilayer ceramic electronic component that includes a second phase in a region (edge ​​region and / or coverage region in the width direction) closer to the outside of the ceramic body than the inner electrode. Based on the physical crosslinking effect of the second phase and the low-temperature chemical sintering effect of the phosphate group, the moisture resistance reliability and hardness can be improved.

[0006] According to one aspect of this disclosure, a multilayer ceramic electronic component may include: a ceramic body including a dielectric layer and a first inner electrode and a second inner electrode, the dielectric layer being disposed between the first inner electrode and the second inner electrode, the first inner electrode and the second inner electrode being alternately stacked and exposed on one side surface and the other side surface, respectively; and a first outer electrode and a second outer electrode disposed on the outer surface of the ceramic body to be connected to the first inner electrode and the second inner electrode, respectively, wherein the ceramic body includes an overlapping region of the first inner electrode and the second inner electrode in the thickness direction, and an edge region in the width direction located on one side and the other side of the overlapping region, and the edge region in the width direction includes a phosphate-based second phase.

[0007] According to another aspect of this disclosure, a multilayer ceramic electronic component may include: a ceramic body including a dielectric layer and a first inner electrode and a second inner electrode, the dielectric layer being disposed between the first inner electrode and the second inner electrode, the first inner electrode and the second inner electrode being alternately stacked and exposed on one side surface and the other side surface, respectively; and a first outer electrode and a second outer electrode disposed on the outer surface of the ceramic body to be connected to the first inner electrode and the second inner electrode, respectively, wherein the ceramic body includes an overlapping region of the first inner electrode and the second inner electrode in the thickness direction, and a covering region located on one side and the other side of the overlapping region in the thickness direction, and the covering region including a phosphate-based second phase. Attached Figure Description

[0008] The above and other aspects, features and advantages of this disclosure will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0009] Figure 1 This is a perspective view showing a multilayer ceramic electronic assembly according to exemplary embodiments of the present disclosure;

[0010] Figure 2 It is along Figure 1 A cross-sectional view taken from line A-A';

[0011] Figure 3 yes Figure 2 A magnified view of region S;

[0012] Figures 4A to 4G This is a diagram illustrating various distributions of the second phase in a multilayer ceramic electronic assembly according to exemplary embodiments of the present disclosure;

[0013] Figure 5 This is a perspective view showing the mounting configuration of a multilayer ceramic electronic assembly according to exemplary embodiments of the present disclosure;

[0014] Figure 6A This is a scanning electron microscope (SEM) image showing the edge region in the width direction excluding the phosphate-based second phase;

[0015] Figure 6B This is a SEM image showing the edge region in the width direction, including the phosphate-based second phase;

[0016] Figure 6C This is an electron probe microanalysis (EPMA) map showing the coverage area excluding the phosphate-based second phase; and

[0017] Figure 6D This is an EPMA map showing the covered region including the phosphate-based second phase. Detailed Implementation

[0018] In the following, exemplary embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0019] Figure 1 This is a perspective view illustrating a multilayer ceramic electronic assembly according to exemplary embodiments of the present disclosure. Figure 2 It is along Figure 1 The cross-sectional view taken by line A-A', and Figure 3 yes Figure 2 A magnified view of region S.

[0020] Reference Figures 1 to 3 The multilayer ceramic electronic assembly 100 according to an exemplary embodiment of the present disclosure may include a ceramic body 110 and a first external electrode 131 and a second external electrode 132.

[0021] The ceramic body 110 can be formed into a hexahedron having two sides in the length direction L, two sides in the width direction W, and two sides in the thickness direction T. The ceramic body 110 can be formed by stacking a plurality of dielectric layers 111 along the thickness direction T and then sintering the plurality of dielectric layers 111. The shape and size of the ceramic body 110 and the number (one or more) of the stacked dielectric layers 111 are not limited to those shown in the exemplary embodiments of this disclosure.

[0022] The plurality of dielectric layers 111 disposed in the ceramic body 110 may be in a sintered state. Adjacent dielectric layers 111 may be integrated with each other, such that the boundaries between dielectric layers are not obvious without the use of a scanning electron microscope (SEM).

[0023] For example, the ceramic body 110 can be formed as a hexahedron with eight circular vertices. Therefore, the durability and reliability of the ceramic body 110 can be improved, and the structural reliability of the first external electrode 131 and the second external electrode 132 at the corners can be improved.

[0024] The thickness of the dielectric layer 111 can be arbitrarily varied according to the capacitance design of the multilayer ceramic electronic component (e.g., a multilayer ceramic capacitor) 100, and the dielectric layer 111 may comprise a high-k (dielectric constant) ceramic powder, such as barium titanate (BaTiO3)-based powder or strontium titanate (SrTiO3)-based powder. However, the material of the dielectric layer 111 is not limited to this. Furthermore, for the purposes of this disclosure, various ceramic additives, organic solvents, plasticizers, binders, dispersants, etc., may be added to the ceramic powder.

[0025] The average particle size of the ceramic powder used to form the dielectric layer 111 is not particularly limited, but can be adjusted to achieve the purposes of this disclosure. For example, the average particle size of the ceramic powder can be adjusted to 400 nm or less. Therefore, the multilayer ceramic electronic component 100 according to exemplary embodiments of this disclosure can be used as a component (such as an IT component) with high requirements for miniaturization and high capacity.

[0026] For example, the dielectric layer 111 can be formed by coating a slurry made from powder such as barium titanate (BaTiO3) onto a carrier film and drying the slurry. The ceramic sheet can be manufactured by mixing ceramic powder, binder and solvent to make the slurry and forming the slurry into a sheet with a thickness of a few μm by a doctor blade, but the method of manufacturing the ceramic sheet is not limited to this.

[0027] The first internal electrode 121 and the second internal electrode 122 may have at least one first internal electrode 121 and at least one second internal electrode 122, wherein the at least one first internal electrode 121 and the at least one second internal electrode 122 have different polarities from each other, and the first internal electrode 121 and the second internal electrode 122 may be formed to have a predetermined thickness, and the plurality of dielectric layers 111 stacked along the thickness direction T of the ceramic body 110 are respectively disposed between the first internal electrode 121 and the second internal electrode 122.

[0028] The first inner electrode 121 and the second inner electrode 122 can be formed by printing a conductive paste including a conductive metal, such that the first inner electrode 121 and the second inner electrode 122 are alternately stacked along the stacking direction of the dielectric layer 111 and exposed on one side and the other side of the ceramic body 110 in the length direction L, respectively, and the first inner electrode 121 and the second inner electrode 122 are electrically insulated from each other by the dielectric layer 111 disposed between the first inner electrode 121 and the second inner electrode 122.

[0029] That is, the first inner electrode 121 and the second inner electrode 122 can be electrically connected to the first outer electrode 131 and the second outer electrode 132 respectively by exposing corresponding portions of the two sides of the ceramic body 110 in the length direction, the first outer electrode 131 and the second outer electrode 132 forming on the two sides of the ceramic body 110 in the length direction.

[0030] For example, the first inner electrode 121 and the second inner electrode 122 may be formed using a conductive paste for the inner electrodes, the conductive paste comprising conductive metal powder having an average particle size of 0.1 μm to 0.2 μm and 40% to 50% by weight, but the first inner electrode 121 and the second inner electrode 122 do not necessarily have to be formed as described above.

[0031] Conductive paste for the internal electrodes can be applied to a ceramic sheet using printing methods to form an internal electrode pattern. Methods for printing the conductive paste include screen printing and gravure printing. However, the method for printing the conductive paste is not limited to these. Ceramic sheets with the internal electrode pattern printed on them can be stacked in 200 to 300 layers, and then compressed and sintered to manufacture the ceramic body 110.

[0032] Therefore, if a voltage is applied to the first external electrode 131 and the second external electrode 132, charge can accumulate between the first internal electrode 121 and the second internal electrode 122, which face each other. In this case, the capacitance of the multilayer ceramic electronic component 100 can be proportional to the area of ​​the region where the first internal electrode 121 and the second internal electrode 122 overlap.

[0033] In other words, even in electronic components of the same size (e.g., capacitors), the capacitance can be as large as possible when the area of ​​the region where the first internal electrode 121 and the second internal electrode 122 overlap each other is as large as possible.

[0034] The average thickness of each of the first inner electrode 121 and the second inner electrode 122 can be determined according to the application, and the average thickness of each of the first inner electrode 121 and the second inner electrode 122 can be, for example, 0.4 μm or less. Furthermore, the number of layers of the first inner electrode 121 and the second inner electrode 122 can be 400 layers or more. Therefore, the multilayer ceramic electronic component 100 according to exemplary embodiments of the present disclosure can be used as a component (such as an IT component) with high requirements for miniaturization and high capacitance.

[0035] The average thickness of dielectric layer 111 can be determined according to the application, and the average thickness of dielectric layer 111 can be, for example, 0.4 μm or less. Since the thickness of dielectric layer 111 corresponds to the gap between the first inner electrode 121 and the second inner electrode 122, the capacitance of multilayer ceramic electronic component 100 can increase as the thickness of dielectric layer 111 decreases.

[0036] Meanwhile, the conductive metal included in the conductive paste forming the first inner electrode 121 and the second inner electrode 122 can be formed individually or by alloying nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), lead (Pb), platinum (Pt), etc. However, the conductive metal is not limited to these.

[0037] Each of the first external electrode 131 and the second external electrode 132 may be disposed on the outer surface of the ceramic body 110 so as to be connected to the first internal electrode 121 and the second internal electrode 122 respectively, and may be configured to make electrical connections between the first internal electrode 121 and the substrate and between the second internal electrode 122 and the substrate respectively.

[0038] For structural reliability, ease of mounting on a substrate, durability against external factors, heat resistance, and at least some of the equivalent series resistance (ESR), each of the first external electrode 131 and the second external electrode 132 may include a first plating layer 131c and a second plating layer 132c.

[0039] For example, the first plating layer 131c and the second plating layer 132c can be formed by sputtering or electrolytic deposition. However, the first plating layer 131c and the second plating layer 132c do not necessarily have to be formed as described above.

[0040] For example, the first plating layer 131c and the second plating layer 132c may contain the most nickel, and the first plating layer 131c and the second plating layer 132c may be formed individually or in alloys thereof using copper (Cu), palladium (Pd), platinum (Pt), gold (Au), silver (Ag) or lead (Pb), but are not limited thereto.

[0041] Meanwhile, the first external electrode 131 and the second external electrode 132 may also include a first base electrode layer 131a and a second base electrode layer 132a, respectively. The first base electrode layer 131a is disposed between the first internal electrode 121 and the first plating layer 131c, and at least partially contacts the outer side of the ceramic body 110. The second base electrode layer 132a is disposed between the second internal electrode 122 and the second plating layer 132c, and at least partially contacts the outer side of the ceramic body 110.

[0042] The first base electrode layer 131a and the second base electrode layer 132a can be easily bonded to the first inner electrode 121 and the second inner electrode 122 relative to the first plating layer 131c and the second plating layer 132c, so that the contact resistance to the first inner electrode 121 and the second inner electrode 122 can be reduced.

[0043] The first base electrode layer 131a may be disposed in the region inside the first plating layer 131c in the first external electrode 131, and the second base electrode layer 132a may be disposed in the region inside the second plating layer 132c in the second external electrode 132.

[0044] For example, the first base electrode layer 131a can be covered by a first plating layer 131c (or the first plating layer 131c and other conductive layers) so that the first base electrode layer 131a is not exposed to the outside of the multilayer ceramic electronic component 100, and the second base electrode layer 132a can be covered by a second plating layer 132c (or the second plating layer 132c and other conductive layers) so that the second base electrode layer 132a is not exposed to the outside of the multilayer ceramic electronic component 100.

[0045] For example, the first base electrode layer 131a and the second base electrode layer 132a can be formed by printing a conductive paste comprising a conductive metal on at least one surface in the thickness direction T of the ceramic body 110 or by impregnating a paste comprising a metal component. The first base electrode layer 131a and the second base electrode layer 132a can also be formed by sheet transfer and pad transfer methods.

[0046] For example, the first base electrode layer 131a and the second base electrode layer 132a can be formed individually or by alloying copper (Cu), nickel (Ni), palladium (Pd), platinum (Pt), gold (Au), silver (Ag), lead (Pb), etc.

[0047] The first external electrode 131 may further include a first conductive resin layer 131b disposed between the first base electrode layer 131a and the first plating layer 131c, and the second external electrode 132 may further include a second conductive resin layer 132b disposed between the second base electrode layer 132a and the second plating layer 132c.

[0048] Since the first conductive resin layer 131b and the second conductive resin layer 132b have relatively higher flexibility than the first plating layer 131c and the second plating layer 132c, the first conductive resin layer 131b and the second conductive resin layer 132b can protect the multilayer ceramic electronic component 100 from external physical impact or bending impact, and prevent the external electrode from breaking by absorbing the stress or tensile stress applied during mounting on the substrate.

[0049] For example, the first conductive resin layer 131b and the second conductive resin layer 132b may have a structure in which conductive particles (such as copper (Cu), nickel (Ni), palladium (Pd), gold (Au), silver (Ag) and lead (Pb)) are contained in a resin (such as glass and epoxy resin) with high flexibility, and thus can have high flexibility and high conductivity.

[0050] The first external electrode 131 may further include a first tin plating layer 131d disposed on the outer surface of the first plating layer 131c, and the second external electrode 132 may further include a second tin plating layer 132d disposed on the outer surface of the second plating layer 132c. The first tin plating layer 131d and the second tin plating layer 132d may further improve at least some of the following: structural reliability, ease of mounting on a substrate, durability against external factors, heat resistance, and equivalent series resistance value.

[0051] Figures 4A to 4G This is a diagram illustrating various distributions of the second phase in a multilayer ceramic electronic assembly according to exemplary embodiments of the present disclosure.

[0052] Figure 4B , Figure 4D and Figure 4F It is along Figure 4A The cross-sectional view taken by line I-I', and Figure 4C , Figure 4E and Figure 4G It is along Figure 4A The cross-sectional view taken from line II-II'.

[0053] Reference Figure 4A and Figure 4B The ceramic body 110 includes: an overlapping region La where the first inner electrode 121 and the second inner electrode 122 overlap in the thickness direction, and an edge region Mw located on one side and the other side of the overlapping region La in the width direction.

[0054] The edge region Mw in the width direction may include a phosphate-based second phase Sw. For example, the edge region Mw in the width direction may have a small thickness in the width direction (e.g., 10 μm or less). When the thickness of the edge region Mw in the width direction is small, the area ratio of the overlapping region La to the ceramic body 110 can be increased, and therefore the capacitance of the multilayer ceramic electronic component 100 can be increased.

[0055] When the thickness of the edge region Mw in the width direction is small, the moisture resistance reliability and hardness of the edge region Mw in the width direction generally deteriorate. However, the multilayer ceramic electronic component according to an exemplary embodiment of the present disclosure includes an edge region Mw in the width direction comprising a phosphate-based second phase Sw, such that even if the thickness of the edge region Mw in the width direction is small, the deterioration of moisture resistance reliability and hardness can be prevented.

[0056] The phosphate-based second phase Sw can physically intersect with adjacent phosphate-based second phases to physically associate them. Therefore, the ceramic body 110 can withstand external physical impacts well and can block the permeation path of moisture into the ceramic body 110.

[0057] Furthermore, based on the low-temperature chemical sintering effect of phosphoric acid, the phosphate-based second phase Sw can increase the grain density of the ceramic body 110. Therefore, the ceramic body 110 can withstand external physical impacts well and can block the penetration path of moisture into the ceramic body 110.

[0058] In other words, the phosphate-based second phase Sw can improve the moisture resistance and hardness of the ceramic body 110 to a greater extent than other second phases.

[0059] The phosphate-based second phase Sw can have a needle-like or rhomboid shape, wherein the needle-like or rhomboid shape has a major axis D1 and a minor axis D2. When the length of the major axis D1 is greater than or equal to 0.5 μm and less than or equal to 2 μm, the phosphate-based second phase Sw can greatly improve the moisture-proof reliability and hardness of the ceramic body 110.

[0060] For example, the length of the long axis D1 of the phosphate-based second phase Sw can be adjusted by regulating the oxygen partial pressure during the formation of the ceramic body 110, but is not limited thereto. For example, the length of the long axis D1 of the phosphate-based second phase Sw can be adjusted by regulating the content of P and / or the content of the added elements according to the amount of added elements (such as Ba and Si).

[0061] The phosphate-based second phase Sw may also include Ba and Si, wherein Ba and Si can improve the length of the major axis D1 of the phosphate-based second phase Sw and / or the control reliability of the distribution rate of the phosphate-based second phase Sw. The distribution rate of the phosphate-based second phase can refer to the amount of phosphate-based second phase in a unit volume.

[0062] The ceramic body 110 may include a covering region Lc, which is located on one side and the other side of the overlapping region La in the thickness direction.

[0063] Reference Figure 4C The covering region Lc may include the phosphate-based second phase Sc. For example, the covering region Lc may have a small thickness in the thickness direction (e.g., 20 μm or less). When the thickness of the covering region Lc in the thickness direction is small, the area ratio of the overlapping region La to the ceramic body 110 can be increased, and therefore the capacitance of the ceramic body 110 can be increased.

[0064] When the thickness of the covered region Lc in the thickness direction is small, the moisture resistance reliability and hardness of the covered region Lc generally deteriorate. However, the multilayer ceramic electronic assembly according to an exemplary embodiment of the present disclosure includes a covered region Lc comprising a phosphate-based second phase Sc, such that even when the thickness of the covered region Lc in the thickness direction is small, the deterioration of moisture resistance reliability and hardness can be prevented.

[0065] The principle of improving the moisture-proof reliability and hardness of the phosphate-based second phase Sc included in the coverage area Lc, the length of the long axis, and the added elements can be similar to the principle of improving the moisture-proof reliability and hardness of the phosphate-based second phase Sw included in the edge area Mw in the width direction, the length of the long axis, and the added elements.

[0066] Reference Figure 4D and Figure 4E The ceramic body 110 includes: an edge region Mw in the width direction containing a phosphate-based second phase Sw, a covering region Lc containing a phosphate-based second phase Sc, and an edge region M in the length direction. LThe edge region M in the length direction L In the middle, only the first inner electrodes 121 overlap each other or only the second inner electrodes 122 overlap each other. Edge region M L It may include phosphate-based second phase S L This makes even the edge region M L The thickness along the length is relatively small, so the moisture-proof reliability and hardness will not deteriorate.

[0067] Therefore, the moisture-proof reliability and hardness of the ceramic body 110 can be further improved.

[0068] Reference Figure 4F and Figure 4G The distribution rate of the phosphate-based second phase Sw in the edge region Mw in the width direction and / or the distribution rate of the phosphate-based second phase Sc in the covering region Lc in the thickness direction are greater than the distribution rate of the phosphate-based second phase Sa in the overlapping region La, and / or the distribution rate of the edge region M in the length direction is greater than the distribution rate of the phosphate-based second phase Sa in the overlapping region La, and / or the distribution rate of the phosphate-based second phase Sc in the edge region Mw in the length direction are greater than the distribution rate of the phosphate-based second phase Sc in the overlapping region Lc in the thickness direction. L Phosphate-based second phase S L The distribution rate of the second phase Sa with phosphoric acid is greater than that of the region where the first internal electrode 121 and the second internal electrode 122 overlap.

[0069] Therefore, the improvement rate of moisture resistance reliability and hardness relative to the cost of the phosphate-based second phase used to form the ceramic body 110 can be further increased.

[0070] Meanwhile, the thickness of the first external electrode 131 and the second external electrode 132 can be as small as 20 μm or less. As a result, multilayer ceramic electronic components can be miniaturized, and the manufacturing cost of multilayer ceramic electronic components can be reduced.

[0071] When the thickness of the first external electrode 131 and the second external electrode 132 is small, the moisture-proof reliability and hardness of the ceramic body 110 usually deteriorate. However, the ceramic body 110 includes a phosphate-based second phase, which prevents the deterioration of moisture-proof reliability and hardness even when the thickness of the first external electrode 131 and the second external electrode 132 is small.

[0072] Figure 5 This is a perspective view showing the mounting configuration of a multilayer ceramic electronic assembly according to an exemplary embodiment of the present disclosure.

[0073] Reference Figure 5 According to an exemplary embodiment of the present disclosure, a multilayer ceramic electronic component 100 can be electrically connected to a substrate 210, the substrate 210 including a first solder and a second solder 230 respectively connected to a first external electrode 131 and a second external electrode 132.

[0074] For example, the substrate 210 may include a first electrode pad 221 and a second electrode pad 222, and the first solder and the second solder 230 may be respectively disposed on the first electrode pad 221 and the second electrode pad 222.

[0075] If the corners of the ceramic body 110 are rounded, the first solder and the second solder 230 can be securely connected to the first external electrode 131 and the second external electrode 132 when the first solder and the second solder 230 fill the additional gaps corresponding to the rounded corners of the ceramic body 110.

[0076] According to the reflow soldering process, the first solder and the second solder 230 can also be securely bonded to the first external electrode 131 and the second external electrode 132. The multilayer ceramic electronic assembly 100 according to an exemplary embodiment of the present disclosure can have mounting reliability, while also having relatively thin first external electrodes 131 and second external electrodes 132 to prevent the first solder and the second solder 230 from disconnecting during reflow soldering.

[0077] Figure 6A This is a scanning electron microscope (SEM) image showing the edge region in the width direction excluding the phosphate-based second phase. Figure 6B This is a SEM image showing the edge region in the width direction, including the phosphate-based second phase. Figure 6C This is an electron probe microanalysis (EPMA) map showing the coverage area excluding the phosphate-based second phase, and... Figure 6D This is an EPMA map showing the covered region including the phosphate-based second phase.

[0078] Due to certain areas within the ceramic body (e.g., according to...) Figure 6B The edge region in the width direction and according to Figure 6D The phosphate-based second phase in the covered region, therefore, respectively with Figure 6A and Figure 6C Compared to the examples shown, multilayer ceramic electronic components offer improved moisture resistance, reliability, and hardness.

[0079] As described above, according to exemplary embodiments of the present disclosure, by including a phosphate-based second phase in a region (edge ​​region and / or covered region) closer to the outside than the inner electrode in the ceramic body, the multilayer ceramic electronic component can improve moisture resistance reliability and hardness based on the physical crosslinking effect of the phosphate-based second phase and the low-temperature chemical sintering effect of the phosphate type.

[0080] While exemplary embodiments have been shown and described above, it will be apparent to those skilled in the art that modifications and variations may be made without departing from the scope of the invention as defined by the appended claims.

Claims

1. A multilayer ceramic electronic component, comprising: A ceramic body includes a dielectric layer and a first inner electrode and a second inner electrode, the dielectric layer being disposed between the first inner electrode and the second inner electrode, the first inner electrode and the second inner electrode being alternately stacked and respectively exposed on one side surface and the other side surface of the ceramic body in the length direction; as well as A first external electrode and a second external electrode are disposed on the outer surface of the ceramic body to be connected to the first internal electrode and the second internal electrode, respectively. The ceramic body includes an overlapping region where the first inner electrode and the second inner electrode overlap in the thickness direction, and edge regions in the width direction located on one side and the other side of the overlapping region. The edge region in the width direction contains a phosphate-based second phase. The dielectric layer disposed between the first inner electrode and the second inner electrode has an average thickness of 0.4 μm or less. The length of the major axis of the phosphate-based second phase is greater than or equal to 0.5 μm and less than or equal to 2 μm.

2. A multilayer ceramic electronic component, comprising: A ceramic body includes a dielectric layer and a first inner electrode and a second inner electrode, the dielectric layer being disposed between the first inner electrode and the second inner electrode, the first inner electrode and the second inner electrode being alternately stacked and respectively exposed on one side surface and the other side surface of the ceramic body in the length direction; as well as A first external electrode and a second external electrode are disposed on the outer surface of the ceramic body to be connected to the first internal electrode and the second internal electrode, respectively. The ceramic body includes an overlapping region where the first inner electrode and the second inner electrode overlap in the thickness direction, and edge regions in the width direction located on one side and the other side of the overlapping region. The edge region in the width direction contains a phosphate-based second phase. The average thickness of each of the first inner electrode and the second inner electrode is 0.4 μm or less. The length of the major axis of the phosphate-based second phase is greater than or equal to 0.5 μm and less than or equal to 2 μm.

3. A multilayer ceramic electronic component, comprising: A ceramic body includes a dielectric layer and a first inner electrode and a second inner electrode, the dielectric layer being disposed between the first inner electrode and the second inner electrode, the first inner electrode and the second inner electrode being alternately stacked and respectively exposed on one side surface and the other side surface of the ceramic body in the length direction; as well as A first external electrode and a second external electrode are disposed on the outer surface of the ceramic body to be connected to the first internal electrode and the second internal electrode, respectively. The ceramic body includes an overlapping region where the first inner electrode and the second inner electrode overlap in the thickness direction, and edge regions in the width direction located on one side and the other side of the overlapping region. The overlapping region and the edge region in the width direction each contain a phosphate-based second phase. The dielectric layer disposed between the first inner electrode and the second inner electrode has an average thickness of 0.4 μm or less. The distribution rate of the phosphate-based second phase in the edge region along the width direction is greater than that in the overlapping region.

4. A multilayer ceramic electronic component, comprising: A ceramic body includes a dielectric layer and a first inner electrode and a second inner electrode, the dielectric layer being disposed between the first inner electrode and the second inner electrode, the first inner electrode and the second inner electrode being alternately stacked and respectively exposed on one side surface and the other side surface of the ceramic body in the length direction; as well as A first external electrode and a second external electrode are disposed on the outer surface of the ceramic body to be connected to the first internal electrode and the second internal electrode, respectively. The ceramic body includes an overlapping region where the first inner electrode and the second inner electrode overlap in the thickness direction, and edge regions in the width direction located on one side and the other side of the overlapping region. The overlapping region and the edge region in the width direction each contain a phosphate-based second phase. The average thickness of each of the first inner electrode and the second inner electrode is 0.4 μm or less. The distribution rate of the phosphate-based second phase in the edge region along the width direction is greater than that in the overlapping region.

5. The multilayer ceramic electronic component according to any one of claims 1-4, wherein, The edge region in the width direction has a thickness of 10 μm or less in the width direction.

6. The multilayer ceramic electronic component according to any one of claims 1-4, wherein, The ceramic body also includes covering areas on one and the other side of the overlapping region in the thickness direction, and The covered region contains a phosphate-based second phase.

7. A multilayer ceramic electronic component, comprising: A ceramic body includes a dielectric layer and a first inner electrode and a second inner electrode, the dielectric layer being disposed between the first inner electrode and the second inner electrode, the first inner electrode and the second inner electrode being alternately stacked and respectively exposed on one side surface and the other side surface of the ceramic body in the length direction; as well as A first external electrode and a second external electrode are disposed on the outer surface of the ceramic body to be connected to the first internal electrode and the second internal electrode, respectively. The ceramic body includes an overlapping region where the first inner electrode and the second inner electrode overlap in the thickness direction, and covering regions located on one side and the other side of the overlapping region in the thickness direction. The covered region contains a phosphate-based second phase. The dielectric layer disposed between the first inner electrode and the second inner electrode has an average thickness of 0.4 μm or less. The length of the major axis of the phosphate-based second phase is greater than or equal to 0.5 μm and less than or equal to 2 μm.

8. A multilayer ceramic electronic component, comprising: A ceramic body includes a dielectric layer and a first inner electrode and a second inner electrode, the dielectric layer being disposed between the first inner electrode and the second inner electrode, the first inner electrode and the second inner electrode being alternately stacked and respectively exposed on one side surface and the other side surface of the ceramic body in the length direction; as well as A first external electrode and a second external electrode are disposed on the outer surface of the ceramic body to be connected to the first internal electrode and the second internal electrode, respectively. The ceramic body includes an overlapping region where the first inner electrode and the second inner electrode overlap in the thickness direction, and covering regions located on one side and the other side of the overlapping region in the thickness direction. The covered region contains a phosphate-based second phase. The average thickness of each of the first inner electrode and the second inner electrode is 0.4 μm or less. The length of the major axis of the phosphate-based second phase is greater than or equal to 0.5 μm and less than or equal to 2 μm.

9. A multilayer ceramic electronic component, comprising: A ceramic body includes a dielectric layer and a first inner electrode and a second inner electrode, the dielectric layer being disposed between the first inner electrode and the second inner electrode, the first inner electrode and the second inner electrode being alternately stacked and respectively exposed on one side surface and the other side surface of the ceramic body in the length direction; as well as A first external electrode and a second external electrode are disposed on the outer surface of the ceramic body to be connected to the first internal electrode and the second internal electrode, respectively. The ceramic body includes an overlapping region where the first inner electrode and the second inner electrode overlap in the thickness direction, and covering regions located on one side and the other side of the overlapping region in the thickness direction. The covered region contains a phosphate-based second phase. The dielectric layer disposed between the first inner electrode and the second inner electrode has an average thickness of 0.4 μm or less. The distribution rate of the phosphate-based second phase in the covered region is greater than that in the overlapping region.

10. A multilayer ceramic electronic component, comprising: A ceramic body includes a dielectric layer and a first inner electrode and a second inner electrode, the dielectric layer being disposed between the first inner electrode and the second inner electrode, the first inner electrode and the second inner electrode being alternately stacked and respectively exposed on one side surface and the other side surface of the ceramic body in the length direction; as well as A first external electrode and a second external electrode are disposed on the outer surface of the ceramic body to be connected to the first internal electrode and the second internal electrode, respectively. The ceramic body includes an overlapping region where the first inner electrode and the second inner electrode overlap in the thickness direction, and covering regions located on one side and the other side of the overlapping region in the thickness direction. The covered region contains a phosphate-based second phase. The average thickness of each of the first inner electrode and the second inner electrode is 0.4 μm or less. The distribution rate of the phosphate-based second phase in the covered region is greater than that in the overlapping region.

11. The multilayer ceramic electronic component according to any one of claims 7-10, wherein, The covered area has a thickness of 20 μm or less.

12. The multilayer ceramic electronic component according to claim 11, wherein, The thickness of the covered area is greater than the thickness of the first external electrode and the thickness of the second external electrode, respectively.

13. The multilayer ceramic electronic assembly according to any one of claims 1-4 and 7-10, wherein, The phosphate-based second phase also includes Ba and Si.

14. The multilayer ceramic electronic assembly according to any one of claims 1-4 and 7-10, wherein, The phosphate-based second phase is physically associated with another phosphate-based second phase.

15. The multilayer ceramic electronic assembly according to any one of claims 1-4 and 7-10, wherein, The first inner electrode and the second inner electrode have 400 or more layers.

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