Multilayer electronic component

Abstract

The disclosure provides a multilayer electronic component including a main body including a dielectric layer and internal electrodes alternately disposed with the dielectric layer in a thickness direction, the main body having a first surface and a second surface opposite to each other in the thickness direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in a length direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and opposite to each other in a width direction; and an external electrode disposed on the third surface and the fourth surface, wherein the internal electrodes are disposed to be spaced apart from the fifth surface and the sixth surface, and a marginal portion is interposed between the internal electrodes and the fifth surface and between the internal electrodes and the sixth surface, wherein a first dummy electrode including a dielectric accommodation portion is disposed in the marginal portion.

Claims

1. A multilayer electronic component, comprising: The body includes a dielectric layer and internal electrodes alternately disposed with the dielectric layer in the thickness direction. The body has a first surface and a second surface opposite to each other in the thickness direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in the length direction, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface and the fourth surface and opposite to each other in the width direction. as well as External electrodes are disposed on the third surface and the fourth surface. The inner electrode is configured to be spaced apart from the fifth surface and the sixth surface, and its edge portion is located between the inner electrode and the fifth surface and between the inner electrode and the sixth surface. A first dummy electrode, including a dielectric accommodating portion, is provided in the edge portion.

2. The multilayer electronic assembly according to claim 1, further comprising a second dummy electrode disposed in the edge portion and stacked with the dielectric receptacle in the thickness direction.

3. The multilayer electronic component according to claim 2, wherein, The multilayer electronic component includes a plurality of first dummy electrodes and a plurality of second dummy electrodes.

4. The multilayer electronic component according to claim 3, wherein, At least a portion of the plurality of first dummy electrodes are alternately disposed with at least a portion of the plurality of second dummy electrodes in the thickness direction.

5. The multilayer electronic component according to claim 3, wherein, A portion of the plurality of first dummy electrodes is alternately disposed with a portion of the plurality of second dummy electrodes in the length direction.

6. The multilayer electronic component according to claim 5, wherein, The plurality of first dummy electrodes and the plurality of second dummy electrodes are not disposed in the central portion of the edge portion in the length direction.

7. The multilayer electronic component according to claim 3, wherein, A portion of the plurality of first dummy electrodes is alternately disposed with a portion of the plurality of second dummy electrodes in the width direction.

8. The multilayer electronic component according to claim 3, wherein, A portion of the plurality of first dummy electrodes is alternately disposed with a portion of the plurality of second dummy electrodes in the length direction and the width direction.

9. The multilayer electronic component according to claim 1, wherein, The first dummy electrode further includes a dummy conductor portion, which surrounds the dielectric receptacle portion in a cross-section of the first dummy electrode in the length direction and the width direction.

10. The multilayer electronic assembly according to claim 1, wherein, The first dummy electrode further includes a dummy conductor portion, which is annular in the cross-section of the first dummy electrode in the length direction and the width direction.

11. The multilayer electronic assembly according to claim 1, wherein, The dielectric housing accommodates a portion of the edge portion.

12. The multilayer electronic component according to claim 2, wherein, The dielectric containment portion and the second dummy electrode have circular cross-sections in the length direction and the width direction, respectively. The diameter of the cross section of the dielectric containment is greater than the diameter of the cross section of the second dummy electrode.

13. The multilayer electronic assembly according to claim 11, wherein, The cross-section of the first dummy electrode in the length and width directions is rectangular.

14. The multilayer electronic assembly according to claim 2, wherein, The cross-section of the second dummy electrode in the length and width directions is smaller than the cross-section of the dielectric receptacle in the length and width directions, and The entire cross-section of the second dummy electrode in the length and width directions overlaps with the cross-section of the dielectric receptacle in the length and width directions in the thickness direction.

15. The multilayer electronic assembly according to claim 2, wherein, The cross-section of the second dummy electrode in the length and width directions has a shape substantially the same as that of the cross-section of the dielectric receptacle in the length and width directions, and has a smaller dimension than that of the cross-section of the dielectric receptacle in the length and width directions.

16. The multilayer electronic assembly according to claim 1, wherein, The multilayer electronic assembly includes a plurality of first dummy electrodes disposed along the thickness direction, and the plurality of first dummy electrodes are configured to be misaligned with the first dummy electrodes adjacent in the thickness direction in a direction perpendicular to the thickness direction.

17. The multilayer electronic assembly according to claim 1, wherein, The multilayer electronic assembly includes a plurality of first dummy electrodes disposed along the thickness direction, and the plurality of first dummy electrodes are configured not to overlap with first dummy electrodes adjacent to each other in the thickness direction.

18. The multilayer electronic assembly according to claim 1, wherein, The multilayer electronic assembly includes a plurality of first dummy electrodes, and the plurality of first dummy electrodes are arranged along the length direction and / or the width direction.

19. A multilayer electronic component, comprising: A capacitor forming portion includes a dielectric layer and an inner electrode, the dielectric layer extending in a length-width plane, the inner electrode extending in the length-width plane, and the dielectric layer being interposed between the inner electrodes in a thickness direction to be stacked in the thickness direction; An edge portion is disposed on the opposing surfaces of the capacitor forming portion in the width direction and extends along the thickness direction; as well as A first dummy electrode is disposed in the edge portion and spaced apart from the inner electrode, and includes a dielectric receiving portion and a dummy conductor portion, wherein the dielectric receiving portion receives a portion of the edge portion.

20. The multilayer electronic component of claim 19, wherein the multilayer electronic component further comprises a second dummy electrode.

21. The multilayer electronic assembly according to claim 20, wherein, At least a portion of the first dummy electrode is alternately disposed with at least a portion of the second dummy electrode in the thickness direction.

22. The multilayer electronic component according to claim 20, wherein, The diameter of the cross-section of the dielectric reservoir in the length and width directions is greater than the diameter of the cross-section of the second dummy electrode in the length and width directions.

23. The multilayer electronic component according to claim 20, wherein, A portion of the first dummy electrode is alternately disposed with a portion of the second dummy electrode in one or both of the length and width directions.

24. The multilayer electronic assembly according to claim 19, wherein, In the cross-section of the first dummy electrode in both the length and width directions, the dummy conductor portion surrounds the dielectric receptacle portion.

25. A multilayer electronic component, comprising: Capacitor forming section; as well as An edge portion is disposed on an opposing surface in the width direction of the capacitor forming portion, the edge portion including at least one first dummy electrode, each first dummy electrode having a dielectric receptacle portion and a dummy conductor portion surrounding the dielectric receptacle portion, the dummy conductor portion being spaced apart from the capacitor forming portion.

26. The multilayer electronic component according to claim 25, wherein, The capacitor forming portion includes an inner electrode extending in a length-width plane and a dielectric layer disposed between adjacent inner electrodes in the thickness direction, wherein the at least one first dummy electrode extends in the length-width plane.

27. The multilayer electronic assembly according to claim 25, wherein, The material of the dielectric receptacle is the same as the material of the edge portion.

28. The multilayer electronic component according to claim 25, wherein, The at least one first dummy electrode is not disposed in the central portion of the edge portion along its length.

29. The multilayer electronic component of claim 25, further comprising a second dummy electrode. in, At least a portion of the at least one first dummy electrode is alternately disposed with at least a portion of the second dummy electrode in the thickness direction, and Wherein, in the cross-sections of the at least one first dummy electrode in the length direction and the width direction, and in the cross-sections of the second dummy electrode in the length direction and the width direction, the diameter of at least one of the dielectric receptacles is greater than the diameter of the corresponding second dummy electrode in the second dummy electrode.

30. The multilayer electronic assembly of claim 25, further comprising a second dummy electrode, wherein the at least one first dummy electrode and the second dummy electrode are stacked in a direction perpendicular to the thickness direction.

31. The multilayer electronic assembly according to claim 25, wherein, In the cross-section of the at least one first dummy electrode in the length direction and the width direction, the dummy conductor portion surrounds the dielectric receptacle portion.

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