Multilayer ceramic capacitors and methods for fabricating multilayer ceramic capacitors

CN122136179APending Publication Date: 2026-06-02SAMSUNG ELECTRO MECHANICS CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SAMSUNG ELECTRO MECHANICS CO LTD
Filing Date
2025-06-03
Publication Date
2026-06-02

AI Technical Summary

Technical Problem

Existing multilayer ceramic capacitors suffer from insufficient reliability and low resistance characteristics during miniaturization and high capacitance processes, posing challenges, especially in high-reliability applications.

Method used

By introducing an interface region between conductive metal and glass, including Ag and Pd, into a multilayer ceramic capacitor, the adhesion strength between the conductive metal and glass is improved, and the connectivity and density between the inner electrode layer and the outer electrode layer are enhanced by adjusting the composition of the interface region through alloys and oxides.

Benefits of technology

This improves the reliability and structural stability of multilayer ceramic capacitors, reduces resistance characteristics, and enhances their performance in high-reliability applications.

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Abstract

This disclosure provides a multilayer ceramic capacitor and a method for fabricating a multilayer ceramic capacitor. The multilayer ceramic capacitor may include: a capacitor body comprising a dielectric layer and an inner electrode layer; and an outer electrode located on the outer surface of the capacitor body, comprising a conductive metal and glass, wherein the glass may include a first interface region in contact with the conductive metal, and wherein the first interface region may include at least one of Ag and Pd.
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