Miniaturized ceramic dielectric chip
By using a cubic ceramic dielectric substrate and curved silver electrodes, the problems of large size, unreasonable electric field distribution, and stress concentration in traditional disc ceramic capacitors have been solved, achieving miniaturization and improved electrical performance.
CN224288019UActive Publication Date: 2026-05-26SHAANXI HUAXING ELECTRONICS DEV
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHAANXI HUAXING ELECTRONICS DEV
- Filing Date
- 2025-06-05
- Publication Date
- 2026-05-26
Smart Images
Figure CN224288019U_ABST
Abstract
This utility model discloses a miniaturized ceramic dielectric chip, belonging to the field of capacitor technology, to solve the problem that when the edge of a disc ceramic capacitor contacts the circuit board, stress concentration easily leads to edge breakage, which not only reduces the product yield but may also affect the reliability and service life of the entire circuit system. This utility model uses Y5U ceramic material with a dielectric constant of 8500-9200 as the ceramic dielectric substrate. Its shape is a cube with dimensions of 7×5×1.2mm. The four corners of both the front and back sides are chamfered, and the ends of the vertical edges on all four sides are rounded at the chamfer connections, with an arc length of 0.4mm-0.5mm. Within this arc range, the stress concentration problem during mounting is effectively alleviated, the structural stability of the chip is ensured, and the electric field distribution is optimized.
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