Method of manufacturing light source bi-color process

Abstract

The present application relates to the technical field of light source, disclose a light source double color process manufacturing method, including the following manufacturing steps: 1), utilize spray head to spray fluorescent glue on the upper surface of the expansion crystal film, form first fluorescent glue layer;2), provide substrate, the substrate has light emitting area, the outer periphery of the light emitting area has dam, dam is enclosed to form surrounding area;The die bonding has a plurality of first light emitting chips and a plurality of second light emitting chips in the light emitting area;The first fluorescent glue layer is attached to the upper surface of the first light emitting chip;3), the second fluorescent glue layer is formed in the surrounding area, the second fluorescent glue layer first light emitting chip, first fluorescent glue layer and second light emitting chip;The peak wavelength of first fluorescent glue layer is different from the peak wavelength of second fluorescent glue layer;The first fluorescent glue layer is attached to the first light emitting chip, subsequent only need to be coated with second fluorescent glue layer in the surrounding area, then, achieve the effect of multicolor light source, without coating fluorescent glue on both sides in the surrounding area, the process is simple.

Description

Technical Field

[0001] This invention relates to the technical field of light sources, and more specifically, to a method for manufacturing a two-color light source. Background Technology

[0002] A light source is a light-emitting element in various lamps. A light source includes a substrate with a light-emitting area. A light-emitting chip is die-bonded in the light-emitting area. A phosphor layer is coated on the light-emitting area, covering the light-emitting chip. The light emitted by the light-emitting chip is transmitted through the phosphor layer.

[0003] For some light sources, to form a multi-color light source, at least two layers of phosphor adhesive are required to be coated in the light-emitting area. In this way, some light-emitting chips are transmitted through one layer of phosphor adhesive, while others are transmitted through multiple layers of phosphor adhesive. Thus, the light transmitted from multiple light-emitting chips through the phosphor adhesive layers forms a multi-color effect.

[0004] In existing technologies, the dual-color light source process requires at least two coatings of fluorescent adhesive layer in the light-emitting area, which is a complex process. Summary of the Invention

[0005] This invention provides a method for manufacturing a dual-color light source, aiming to solve the problem of complex processes in the existing dual-color light source technology.

[0006] This invention is implemented as follows: a dual-color light source manufacturing method includes the following manufacturing steps:

[0007] 1) Apply fluorescent adhesive to the upper surface of the expanded film using a spray head to form the first fluorescent adhesive layer;

[0008] 2) A substrate is provided, wherein a light-emitting area is provided on the substrate, and a dam is provided around the periphery of the light-emitting area, the dam surrounding the periphery of the light-emitting area to form an enclosing area; a plurality of first light-emitting chips and a plurality of second light-emitting chips are die-bonded in the light-emitting area; and a first phosphor layer is attached to the upper surface of the first light-emitting chip.

[0009] 3) Spray a second fluorescent adhesive into the enclosed area to form a second fluorescent adhesive layer. The second fluorescent adhesive layer covers the light-emitting area, the first light-emitting chip, the first fluorescent adhesive layer, and the second light-emitting chip. The peak wavelength of the first fluorescent adhesive layer is different from the peak wavelength of the second fluorescent adhesive layer.

[0010] Furthermore, in manufacturing step 1), after spraying fluorescent adhesive onto the upper surface of the expanded film using a spray head to form a first fluorescent adhesive layer, the first fluorescent adhesive layer is cut to form multiple first fluorescent adhesive layers.

[0011] Furthermore, in manufacturing step 1), fluorescent adhesive is sprayed onto the upper surface of the expanded film using a spray head to form a first fluorescent adhesive layer. After the first fluorescent adhesive layer is baked for a set time, it is then cut.

[0012] Furthermore, in manufacturing step 2), the lower surface of the expanded film is attached and fixed to the upper surface of the first light-emitting chip.

[0013] Furthermore, in manufacturing step 2), after the first fluorescent adhesive layer is attached to the upper surface of the first light-emitting chip, the top of the first fluorescent adhesive layer is lower than the top of the dam.

[0014] Furthermore, after a second fluorescent adhesive layer is applied to the enclosed area, the top of the second fluorescent adhesive layer is flush with the top of the dam.

[0015] Furthermore, in manufacturing step 1), the lower surface of the expanded film is covered with a transparent adhesive layer, and in manufacturing step 2), the adhesive layer is used to attach to the upper surface of the first light-emitting chip to fix the first fluorescent adhesive layer to the upper surface of the first light-emitting chip.

[0016] Furthermore, in manufacturing step 1), the expansion film in the first fluorescent adhesive layer extends outward around its periphery to form an annularly arranged outer extension; in manufacturing step 2), after the lower surface of the expansion film on the first fluorescent adhesive layer is attached to the first light-emitting chip, the outer extension is bent downward and attached to the outer periphery of the first light-emitting chip.

[0017] Furthermore, in manufacturing step 1), the expanded film is placed on a horizontally arranged flat platform with its upper surface facing upward; a template is placed on the upper surface of the expanded film, and the template has a plurality of spaced-apart enclosing grooves, which are isolated from each other; the outer periphery of the enclosing groove has an enclosing frame, which isolates adjacent enclosing grooves.

[0018] The first fluorescent adhesive is sprayed onto the template using a spray nozzle until the first fluorescent adhesive fills multiple enclosing grooves. When the first fluorescent adhesive in the enclosing grooves overflows onto the enclosing frame to form an overflow adhesive layer, the spray nozzle stops spraying.

[0019] A pressure plate that moves up and down is arranged on the template. The pressure plate has a downwardly protruding cutting frame, which is arranged in a closed ring. When the spray head stops spraying, the pressure plate is moved downward toward the template. The cutting frame is inserted into the enclosing groove, and the cutting frame abuts against the inner sidewall of the enclosing frame. After the first fluorescent adhesive and the overflow adhesive layer in the enclosing groove are cut and separated, the pressure plate is moved upward away from the template, and the template, along with the overflow adhesive layer, is moved upward away from the expanding film. The first fluorescent adhesive is located on the expanding film.

[0020] The fitting frame has an outwardly arranged outer peripheral wall and an inwardly arranged inner peripheral wall. The lower part of the outer peripheral wall forms a longitudinally flat insertion section, and the upper part of the outer peripheral wall forms an inclined section. Along the bottom-up direction, the inclined section is inclined outward, and the inner peripheral wall is inclined inward. When the fitting frame is inserted into the enclosing groove until the entire insertion section abuts against the inner sidewall of the enclosing groove, the inclined section squeezes the overflow adhesive layer away from the enclosing groove, and the inner peripheral wall squeezes the first fluorescent adhesive in the enclosing groove inward.

[0021] After the template is separated from the expanding film, a plurality of spacer slots corresponding to the enclosure frame are formed on the expanding film. The spacer slots are arranged on the outer periphery of the first fluorescent adhesive. The expanding film is cut along the spacer slots to form a plurality of the first fluorescent adhesive layers.

[0022] Furthermore, the spray head is connected to the glue supply tube, and the spray head is provided with a transversely arranged extrusion chamber. The rear end of the extrusion chamber is formed with a plurality of glue inlet holes for the first fluorescent glue to pass through, and the plurality of glue inlet holes are arranged at intervals along the transverse direction of the extrusion chamber. The front end of the extrusion chamber is formed with a flat glue nozzle, and the glue nozzle extends along the transverse direction of the extrusion chamber.

[0023] Along the direction from back to front of the extrusion cavity, the extrusion cavity is shaped like a large middle and a small two ends; the extrusion cavity is provided with two elastic film layers, which are arranged opposite each other and located on both sides of the spray nozzle, and the two film layers enclose a space for receiving adhesive; the two ends of the film layer are fixedly connected to the inner sidewall of the extrusion cavity, and there is a deformation space between the middle of the film layer and the inner sidewall of the extrusion cavity; air inlets are provided on both sides of the spray head, and the air inlets are connected to the deformation space and connected to a fan through a pipe;

[0024] In manufacturing step 1), during the process of conveying the first fluorescent adhesive to the adhesive space through the adhesive delivery pipe, the blower injects gas at a set pressure into the deformation space through the pipeline, drives the diaphragm to deform toward the adhesive space, and at the same time squeezes the first fluorescent adhesive in the adhesive space to be continuously extruded through the adhesive nozzle, and sprays the first fluorescent adhesive extruded through the adhesive nozzle onto the expanded film.

[0025] Compared with the prior art, the present invention provides a method for manufacturing a dual-color light source. By spraying a first fluorescent adhesive onto a die-expanding film to form a first fluorescent adhesive layer, and then directly attaching the first fluorescent adhesive layer to the first light-emitting chip, it is only necessary to coat a second fluorescent adhesive layer in the surrounding area. The second fluorescent adhesive layer covers the first fluorescent adhesive layer on the first light-emitting chip and the second light-emitting chip, achieving the effect of a multi-color light source. It is not necessary to coat fluorescent adhesive on both sides of the surrounding area, and the process is simple. Attached Figure Description

[0026] Figure 1 This is a front view schematic diagram of the dual-color light source provided by the present invention;

[0027] Figure 2 This is a cross-sectional schematic diagram of the dual-color light source provided by the present invention;

[0028] Figure 3 This is a cross-sectional schematic diagram of the first light-emitting chip and the first phosphor layer provided by the present invention after being combined;

[0029] Figure 4 This is a front view schematic diagram of the template provided by the present invention;

[0030] Figure 5 This is a front view schematic diagram of the pressure plate provided by the present invention;

[0031] Figure 6 This is a schematic diagram of the internal structure of the spray head provided by the present invention. Detailed Implementation

[0032] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0033] The implementation of the present invention will be described in detail below with reference to specific embodiments.

[0034] In the accompanying drawings of this embodiment, the same or similar reference numerals correspond to the same or similar components. In the description of this invention, it should be understood that if terms such as "upper," "lower," "left," and "right" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, they are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the drawings are only for illustrative purposes and should not be construed as limiting this invention. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0035] Please refer to Figure 1-6 The image shown is a preferred embodiment of the present invention.

[0036] The manufacturing method for a dual-color light source includes the following manufacturing steps:

[0037] 1) Using a spray head 800, fluorescent adhesive is sprayed onto the upper surface of the expanded film 501 to form the first fluorescent adhesive layer 500;

[0038] 2) A substrate 100 is provided, the substrate 100 has a light-emitting area, and a dam 200 is provided around the periphery of the light-emitting area. The dam 200 surrounds the periphery of the light-emitting area and forms an enclosing area. A plurality of first light-emitting chips 301 and a plurality of second light-emitting chips 302 are die-bonded in the light-emitting area. A first phosphor layer 500 is attached to the upper surface of the first light-emitting chip 301.

[0039] 3) Spray a second fluorescent adhesive into the enclosed area to form a second fluorescent adhesive layer 402. The second fluorescent adhesive layer 402 covers the light-emitting area, the first light-emitting chip 301, the first fluorescent adhesive layer 500, and the second light-emitting chip 302. The peak wavelength of the first fluorescent adhesive is different from that of the second fluorescent adhesive.

[0040] The above-mentioned dual-color light source manufacturing method involves spraying a first fluorescent adhesive onto the expanded film 501 to form a first fluorescent adhesive layer 500, and then directly attaching the first fluorescent adhesive layer 500 to the first light-emitting chip 301. Subsequently, only a second fluorescent adhesive layer 402 needs to be coated on the surrounding area. The second fluorescent adhesive layer 402 covers the first fluorescent adhesive layer 500 on the first light-emitting chip 301 and the second light-emitting chip 302, achieving the effect of a multi-color light source. It is not necessary to coat fluorescent adhesive on both sides of the surrounding area, making the process simple.

[0041] In addition, it is not necessary to coat both sides with fluorescent adhesive separately, which can avoid cross-mixing between different fluorescent adhesives and affect the luminous effect of the dual-color light source.

[0042] In this embodiment, in manufacturing step 1), after spraying fluorescent adhesive onto the upper surface of the expanded film 501 using the spray head 800, a first fluorescent adhesive layer 500 is formed. The first fluorescent adhesive layer 500 is then cut to form multiple first fluorescent adhesive layers 500. In this way, multiple first fluorescent adhesive layers 500 can be formed at one time, greatly improving manufacturing efficiency.

[0043] In manufacturing step 1), fluorescent adhesive is sprayed onto the upper surface of the expanded film 501 using a spray head 800 to form a first fluorescent adhesive layer 500. The first fluorescent adhesive layer 500 is then baked for a set time before being cut. Baking the first fluorescent adhesive layer 500 cures it, making subsequent cutting easier.

[0044] In this embodiment, in manufacturing step 2), the lower surface of the expanded film 501 is attached and fixed to the upper surface of the first light-emitting chip 301.

[0045] In manufacturing step 2), after the first fluorescent adhesive layer 500 is attached to the upper surface of the first light-emitting chip 301, the top of the first fluorescent adhesive layer 500 is lower than the top of the dam 200. In this way, after the second fluorescent adhesive layer 402 is subsequently coated, the second fluorescent adhesive layer 402 can cover the first fluorescent adhesive layer 500.

[0046] After the second fluorescent adhesive layer 402 is set in the enclosed area, the top of the second fluorescent adhesive layer 402 is arranged flush with the top of the dam 200 to prevent the second fluorescent adhesive layer 402 from overflowing to the outer periphery of the dam 200.

[0047] In this embodiment, in manufacturing step 1), the lower surface of the expanded film 501 is covered with a transparent adhesive layer. In manufacturing step 2), the adhesive layer is attached to the upper surface of the first light-emitting chip 301 to fix the first fluorescent adhesive layer 500 to the upper surface of the first light-emitting chip 301.

[0048] In manufacturing step 1), the diffusion film 501 in the first phosphor layer 500 extends outwards to form an annularly arranged outer extension portion 502. In manufacturing step 2), after the lower surface of the diffusion film 501 on the first phosphor layer 500 is attached to the first light-emitting chip 301, the outer extension portion 502 is bent downwards and attached to the outer periphery of the first light-emitting chip 301. In this way, the first phosphor layer 500 can be more firmly fixed to the first light-emitting chip 301.

[0049] In this embodiment, a transparent adhesive layer 401 covers the light-emitting area, with the top of the transparent adhesive layer 401 extending to the middle of the first light-emitting chip 301, and the bottom of the second fluorescent adhesive layer 402 abutting against the top of the transparent adhesive layer 401. By providing the transparent adhesive layer 401, the light emitted by the first light-emitting chip 301 and the second light-emitting chip 302 can be better transmitted.

[0050] The transparent adhesive layer 401 wraps around the lower outer periphery of the first light-emitting chip 301 and abuts against the outer extension 502. The abutment between the transparent adhesive layer 401 and the outer extension 502 makes the first fluorescent adhesive layer 500 more firmly placed on the first light-emitting chip 301.

[0051] In this embodiment, in manufacturing step 1), the expanded film 501 is placed on a horizontally arranged flat platform with its upper surface facing upward; a template is placed on the upper surface of the expanded film 501, and the template is provided with a plurality of spaced enclosing grooves 600, with adjacent enclosing grooves 600 being isolated from each other; the outer periphery of the enclosing groove 600 has an enclosing frame 601, which isolates adjacent enclosing grooves 600.

[0052] The first fluorescent adhesive is sprayed onto the template using the spray head 800 until the first fluorescent adhesive fills the multiple enclosing grooves 600. When the first fluorescent adhesive in the enclosing grooves 600 overflows onto the enclosing frame 601 and forms an overflow adhesive layer, the spray head 800 stops spraying.

[0053] A pressure plate 700 that moves up and down is arranged on the template. The pressure plate 700 has a downwardly protruding longitudinal fitting frame 701, which is arranged in a closed ring. When the spray head 800 stops spraying, the pressure plate 700 is moved downward toward the template. The fitting frame 701 is inserted into the enclosing groove 600 and abuts against the inner side wall of the enclosing frame 601. After the first fluorescent adhesive and the overflow adhesive layer in the enclosing groove 600 are cut and separated, the pressure plate 700 is moved upward away from the template, and the template, along with the overflow adhesive layer, is moved upward away from the expanding film 501. The first fluorescent adhesive is located on the expanding film 501.

[0054] The fitting frame 701 has an outwardly arranged outer peripheral wall and an inwardly arranged inner peripheral wall 704. The lower part of the outer peripheral wall forms a longitudinally flat insertion section 702, and the upper part forms an inclined section 703. Along the bottom-up direction, the inclined section 703 is inclined outwards, and the inner peripheral wall 704 is inclined inwards. When the fitting frame 701 is inserted into the enclosing groove 600 until the entire insertion section 702 abuts against the inner wall of the enclosing groove 600, the inclined section 703 pushes the overflow adhesive layer away from the enclosing groove 600, and the inner peripheral wall 704 pushes the first fluorescent adhesive in the enclosing groove 600 inwards.

[0055] After the template separates from the expanding film 501, multiple spacer slots corresponding to the enclosure frame 601 are formed on the expanding film 501. The spacer slots are arranged on the outer periphery of the first fluorescent adhesive. The expanding film 501 is cut along the spacer slots to form multiple first fluorescent adhesive layers 500.

[0056] The first fluorescent adhesive is sprayed onto the template using the spray head 800, filling the enclosing groove 600. An overflow adhesive layer will also form on the enclosing frame 601. The first fluorescent adhesive in the enclosing groove 600 is cut and separated from the overflow adhesive layer on the enclosing frame 601 using the cutting frame 701 on the pressure plate 700, facilitating template separation.

[0057] Secondly, by setting the shape of the inner peripheral wall 704 and the outer peripheral wall on the cutting frame 701, the first fluorescent adhesive can be better separated from the overflow adhesive layer when the cutting frame 701 cuts the first fluorescent adhesive in the enclosing groove 600.

[0058] In this embodiment, the spray head 800 is connected to the glue supply tube. The spray head 800 is provided with a transversely arranged extrusion chamber. The rear end of the extrusion chamber is formed with a plurality of glue inlet holes 803 for the first fluorescent glue to pass through. The plurality of glue inlet holes 803 are arranged at intervals along the transverse direction of the extrusion chamber. The front end of the extrusion chamber is formed with a flat glue spray nozzle 804, which extends along the transverse direction of the extrusion chamber.

[0059] Along the direction from back to front of the extrusion chamber, the extrusion chamber is shaped like a large middle and small ends; the extrusion chamber is provided with two elastic film layers 801, which are arranged opposite each other and located on both sides of the glue spray nozzle 804, and the two film layers enclose a glue-containing space 805; the two ends of the film layer 801 are fixedly connected to the inner sidewall of the extrusion chamber, and there is a deformation space 802 between the middle of the film layer 801 and the inner sidewall of the extrusion chamber; air inlets are provided on both sides of the spray head 800, and the air inlets are connected to the deformation space 802, and the air inlets are connected to the fan through pipes.

[0060] In manufacturing step 1), during the process of conveying the first fluorescent adhesive to the adhesive-containing space 805 through the adhesive delivery pipe, the blower injects gas at a set pressure into the deformation space 802 through the pipe, driving the diaphragm to deform toward the adhesive-containing space 805, and at the same time squeezing the first fluorescent adhesive in the adhesive-containing space 805 to be continuously extruded through the adhesive nozzle 804, and the first fluorescent adhesive extruded through the adhesive nozzle 804 is sprayed onto the crystal expansion film 501.

[0061] During the process of spraying the first fluorescent adhesive, as the first fluorescent adhesive is injected into the adhesive space 805 and extruded toward the spray nozzle 804, the diaphragm is also deformed toward the adhesive space 805 under the drive of the gas at a set pressure, which squeezes the first fluorescent adhesive in the adhesive space 805, making the first fluorescent adhesive in the adhesive space 805 more compact, and the first fluorescent adhesive sprayed from the spray nozzle 804 is sprayed continuously.

[0062] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A method of manufacturing a light source bi-color process, characterized in that, The manufacturing steps include: 1) spraying fluorescent glue on the upper surface of the expanded crystal film by using a spraying head to form a first fluorescent glue layer; 2) providing a substrate, the substrate has a light emitting area, the outer periphery of the light emitting area has a dam, the dam surrounds the outer periphery of the light emitting area, and the dam forms an enclosed area; a plurality of first light emitting chips and a plurality of second light emitting chips are die-bonded in the light emitting area; the first fluorescent glue layer is attached to the upper surface of the first light emitting chip; 3) spraying a second fluorescent glue in the enclosed area to form a second fluorescent glue layer, the second fluorescent glue layer covers the light emitting area, the first light emitting chip, the first fluorescent glue layer and the second light emitting chip; the peak wavelength of the first fluorescent glue layer is different from the peak wavelength of the second fluorescent glue layer; In the manufacturing step 1), after spraying the fluorescent glue on the upper surface of the expanded crystal film by using the spraying head to form the first fluorescent glue layer, the first fluorescent glue layer is cut to form a plurality of first fluorescent glue layers; In the manufacturing step 1), the four sides of the expanded crystal film in the first fluorescent glue layer extend outward to form an annular extension; in the manufacturing step 2), after the lower surface of the expanded crystal film on the first fluorescent glue layer is attached to the first light emitting chip, the outer extension is bent downward and attached to the outer periphery of the first light emitting chip; In the manufacturing step 1), the expanded crystal film is placed on a horizontally arranged flat table, and the upper surface of the expanded crystal film is arranged upward; a template is placed on the upper surface of the expanded crystal film, the template is provided with a plurality of spaced-arranged enclosing grooves, and adjacent enclosing grooves are isolated; the enclosing grooves have enclosing frames on the outer periphery, and the enclosing frames isolate adjacent enclosing grooves; The first fluorescent glue is sprayed onto the template by using the spraying head until the first fluorescent glue fills the plurality of enclosing grooves, and when the first fluorescent glue in the enclosing grooves overflows onto the enclosing frame to form an overflow glue layer, the spraying head stops spraying; A vertically moving pressing plate is arranged on the template, the pressing plate has a downward longitudinally protruding cutting frame, and the cutting frame is arranged in a closed ring shape; after the spraying head stops spraying, the pressing plate is moved downward toward the template, the cutting frame is inserted into the enclosing groove, and the cutting frame abuts against the inner side wall of the enclosing frame to cut and separate the first fluorescent glue in the enclosing groove from the overflow glue layer; then the pressing plate is moved upward away from the template, and the template with the overflow glue layer is moved upward away from the expanded crystal film, and the first fluorescent glue is located on the expanded crystal film; The cutting frame has an outer peripheral wall arranged outward and an inner peripheral wall arranged inward, the lower part of the outer peripheral wall forms an insertion section arranged longitudinally and flat, and the upper part of the outer peripheral wall forms an inclined section; in the direction from bottom to top, the inclined section is arranged outwardly inclined, and the inner peripheral wall is arranged inwardly inclined; when the cutting frame is inserted into the enclosing groove until the entire insertion section abuts against the inner side wall of the enclosing groove, the inclined section extrudes and deviates the overflow glue layer from the enclosing groove, and the inner peripheral wall extrudes the first fluorescent glue in the enclosing groove inwardly. When the template is separated from the wafer film, a plurality of interval groove frames corresponding to the enclosing frames are formed on the wafer film, and the interval groove frames are arranged at the outer periphery of the first fluorescent glue layer; The spraying head is connected with the glue conveying pipe, and the spraying head is provided with an extrusion cavity arranged in the transverse direction. A plurality of glue inlet holes for the first fluorescent glue to pass through are formed at the rear end of the extrusion cavity, and the plurality of glue inlet holes are arranged at intervals along the transverse direction of the extrusion cavity. A flat glue outlet is formed at the front end of the extrusion cavity, and the glue outlet extends along the transverse direction of the extrusion cavity. Along the direction from the rear to the front of the extrusion cavity, the extrusion cavity is large in the middle and small at both ends. Two elastic film layers are arranged in the extrusion cavity, the two film layers are arranged opposite to each other, and are respectively located on both sides of the glue outlet. A glue containing space is formed between the two film layers. The two ends of the film layer are fixedly connected with the inner side wall of the extrusion cavity, and the middle part of the film layer has a deformation space with the inner side wall of the extrusion cavity. Air inlet holes are arranged on both sides of the spraying head, the air inlet holes are communicated with the deformation space, and the air inlet holes are connected with the fan through pipelines. In the manufacturing step 1), during the process of conveying the first fluorescent glue into the glue containing space through the glue conveying pipe, the fan injects gas with a set pressure into the deformation space through the pipeline, drives the film sheet to deform towards the glue containing space, and at the same time extrudes the first fluorescent glue in the glue containing space to continuously extrude the glue outlet, and sprays the first fluorescent glue extruded through the glue outlet on the wafer film.

2. The light source two-color process fabrication method of claim 1, wherein, In the manufacturing step 1), after the first fluorescent glue layer is formed on the upper surface of the wafer film by using the spraying head, the first fluorescent glue layer is baked for a set time, and then the first fluorescent glue layer is cut.

3. The light source two-color process fabrication method of claim 1, wherein, In the manufacturing step 2), the lower surface of the wafer film is attached and fixed on the upper surface of the first light emitting chip.

4. The light source two-color process fabrication method of claim 1, wherein, In the manufacturing step 2), after the first fluorescent glue layer is attached on the upper surface of the first light emitting chip, the top of the first fluorescent glue layer is lower than the top of the dam.

5. The light source two-color process fabrication method of claim 4, wherein, After the second fluorescent glue layer is arranged in the surrounding area, the top of the second fluorescent glue layer is flush with the top of the dam.

6. The light source two-color process fabrication method of claim 1, wherein, In the manufacturing step 1), the lower surface of the wafer film is covered with a transparent adhesive layer, and in the manufacturing step 2), the first fluorescent glue layer is fixed on the upper surface of the first light emitting chip by using the adhesive layer to attach on the upper surface of the first light emitting chip.

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