Charging control circuit, method, apparatus, and storage medium

Abstract

The present disclosure relates to a charging control circuit, method, device and storage medium. The charging control method comprises: determining a first temperature corresponding to a terminal; determining a second temperature corresponding to each charge pump chip in a charge pump chip set included in the terminal, and determining a target charging current to be distributed to the charge pump chip based on the first temperature and the second temperature; and adjusting the resistance value of a resistor connected in series with each charge pump chip in the charge pump chip set to drive the current of the charge pump chip to reach the target charging current. The charging control method provided by the embodiments of the present disclosure can reduce the charging temperature and improve the charging efficiency.

Description

Technical Field

[0001] This disclosure relates to the field of electronic device charging technology, and in particular to charging control circuits, methods, apparatus and storage media. Background Technology

[0002] Factors affecting terminal charging speed mainly include temperature limitations, battery charge / discharge rate, circuit current carrying capacity, and chip conversion capabilities. Among these, temperature limitations significantly impact the charging capacity of the terminal's charging architecture, and excessively high terminal temperatures severely affect user experience. This is especially true when users are charging the terminal while using high-power applications, causing the terminal temperature to rise further. Therefore, there is an urgent need for a technical solution to improve charging efficiency, reduce terminal heat generation, thereby saving energy, improving charging speed, and enhancing user experience.

[0003] In related technologies, two or more charge pump chips are connected in parallel to avoid the heat source of the terminal and the charging method of the charge pump chips is constantly switched to charge the battery, so as to reduce heat generation and improve charging efficiency. However, the charging method of using two or more charge pump chips in parallel, with the charge pumps frequently turning on and off, will cause the charging curve to oscillate frequently, which will reduce the battery life and the upper limit of the charging current is relatively low, making it unsuitable for terminals with high charging power. Summary of the Invention

[0004] To overcome the problems existing in related technologies, this disclosure provides a charging control circuit, method, apparatus and storage medium.

[0005] According to a first aspect of the present disclosure, a charging control circuit is provided, comprising:

[0006] Charge pump chipset;

[0007] The resistor is connected in series with each charge pump chip in the charge pump chipset.

[0008] A power control circuit is used to adjust the current input to each charge pump chip in the charge pump chip group by adjusting the resistance value of the resistors connected in series with each charge pump chip.

[0009] In one embodiment, the charge pump chipset includes a plurality of charge pump chips connected in parallel, and each of the plurality of charge pump chips connected in parallel corresponds to a resistor connected in series.

[0010] Each series-connected resistor and charge pump chip forms a branch, and multiple branches are connected in parallel.

[0011] According to a second aspect of the present disclosure, a charging control method is provided, comprising:

[0012] Determine the first temperature corresponding to the terminal;

[0013] For each charge pump chip in the charge pump chip group included in the terminal, a second temperature corresponding to the charge pump chip is determined, and based on the first temperature and the second temperature, a target charging current to be allocated to the charge pump chip is determined.

[0014] For each charge pump chip in the charge pump chip group, the resistance value of the resistor connected in series with the charge pump chip is adjusted to drive the current of each charge pump chip to reach the target charging current.

[0015] In one implementation, determining the target charging current to be allocated to the charge pump chip based on the first temperature and the second temperature includes:

[0016] Based on the first temperature, the heating temperatures of the charge pump chips are obtained respectively;

[0017] Based on the second temperature and the heating temperature, proportional-integral-derivative incremental control fitting is performed to obtain the current change value corresponding to the charge pump chip;

[0018] The current change value is compensated for by the current charging current of the charge pump chip to obtain the target current to be allocated to the charge pump chip.

[0019] In one embodiment, obtaining the heating temperature of the charge pump chip based on the first temperature includes:

[0020] Based on the first temperature, determine the current overall input current of the charge pump chipset;

[0021] Based on the current overall input current and the transfer function, the heating temperature of the charge pump chip corresponding to the current overall input current is determined. The input of the transfer function is current, and the output is heating temperature.

[0022] In one embodiment, the step of performing proportional-integral-derivative incremental control fitting based on the second temperature and the heating temperature to obtain the current change value corresponding to the charge pump chip includes:

[0023] The temperature difference is determined based on the second temperature and the heating temperature;

[0024] The current change value is obtained by fitting the temperature difference.

[0025] In one embodiment, adjusting the resistance value of the resistor connected in series with each charge pump chip in the charge pump chipset to drive the current of the charge pump chip to reach the target charging current includes:

[0026] Determine the overall input current allocated to the charge pump chipset, and the target charging current to be allocated to the charge pump chip;

[0027] Based on the overall input current and the target charging current, determine the target resistance values ​​of the resistors connected in series with the charge pump chip.

[0028] The resistance of the resistor connected in series with the charge pump chip is adjusted to the target resistance value so that the current of the charge pump chip can reach the target charging current.

[0029] According to a third aspect of the present disclosure, a charging control device is provided, comprising:

[0030] A determining unit is used to determine the first temperature corresponding to the terminal;

[0031] The determining unit further determines the second temperature corresponding to each charge pump chip in the charge pump chip group included in the terminal, and determines the target charging current to be allocated to the charge pump chip based on the first temperature and the second temperature.

[0032] The distribution unit is used to adjust the resistance value of the resistor connected in series with each charge pump chip in the charge pump chip group, so as to drive the current of the charge pump chip to reach the target charging current.

[0033] In one implementation, the determining unit determines the target charging current to be allocated to the charge pump chip based on the first temperature and the second temperature in the following manner:

[0034] Based on the first temperature, the heating temperatures of the charge pump chips are obtained respectively;

[0035] Based on the second temperature, proportional-integral-derivative incremental control fitting is performed to obtain the current change value corresponding to the charge pump chip;

[0036] The current change value is compensated for by the current current of the charge pump chip to obtain the target charging current to be allocated to the charge pump chip.

[0037] In one embodiment, the determining unit obtains the heating temperature of the charge pump chip based on the first temperature in the following manner:

[0038] Based on the first temperature, determine the current overall input current of the charge pump chipset;

[0039] Based on the current overall input current and the transfer function, the heating temperature of the charge pump chip corresponding to the current overall input current is determined. The input of the transfer function is current, and the output is heating temperature.

[0040] In one embodiment, the determining unit performs proportional-integral-derivative incremental control fitting based on the second temperature and the heating temperature to obtain the current change value corresponding to the charge pump chip:

[0041] The temperature difference is determined based on the second temperature and the heating temperature;

[0042] The current change value is obtained by fitting the temperature difference.

[0043] In one embodiment, the distribution unit adjusts the resistance value of the resistor connected in series with each charge pump chip in the charge pump chipset to drive the current of the charge pump chip to reach the target charging current:

[0044] Determine the overall input current allocated to the charge pump chipset, and the target charging current to be allocated to the charge pump chip;

[0045] Based on the overall input current and the target charging current, determine the target resistance values ​​of the resistors connected in series with the charge pump chip.

[0046] The resistance of the resistor connected in series with the charge pump chip is adjusted to the target resistance value so that the current of the charge pump chip can reach the target charging current.

[0047] According to a fourth aspect of the present disclosure, a charging control device is provided, comprising:

[0048] processor;

[0049] Memory used to store processor-executable instructions;

[0050] The processor is configured to execute the method described in the second aspect or any embodiment of the second aspect.

[0051] According to a fifth aspect of the present disclosure, a non-transitory computer-readable storage medium is provided, wherein when instructions in the storage medium are executed by a processor of a mobile terminal, the mobile terminal is enabled to perform the method described in the second aspect or any embodiment of the second aspect.

[0052] The technical solutions provided by the embodiments of this disclosure can include the following beneficial effects: determining a first temperature corresponding to the terminal, and for each charge pump chip in the charge pump chipset included in the terminal, determining a second temperature corresponding to the charge pump chip, and determining the target charging current to be allocated to the charge pump chip based on the first and second temperatures, so as to ensure that the charge pump chip is in a good working state, without overheating, while ensuring the charging efficiency of the charge pump chip. For each charge pump chip in the charge pump chipset, adjusting the resistance value connected in series with the charge pump chip to drive the current of the charge pump chip to reach the target charging current, thereby realizing the adjustment of the target charging current based on the temperature collected by each temperature sensor in the terminal and the temperature of the charge pump chip, ensuring that the charge pump chip is not at an excessively high temperature during operation, while ensuring the charging efficiency of the charge pump chip, thereby enabling the charge pump chipset to perform high-power charging. Through the embodiments of this disclosure, the heating temperature during charging can be reduced, while the charging efficiency can be improved.

[0053] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0054] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0055] Figure 1 A flowchart of a method for charging two charge pump chips in parallel is shown.

[0056] Figure 2 A schematic diagram of a charging control circuit is shown according to an exemplary embodiment.

[0057] Figure 3 This is a flowchart illustrating a charging control method according to an exemplary embodiment.

[0058] Figure 4 This is a flowchart illustrating a method for determining a target charging current to be allocated to a charge pump chip according to an exemplary embodiment.

[0059] Figure 5 This is a flowchart illustrating a method for controlling charging according to an exemplary embodiment.

[0060] Figure 6 This is a flowchart illustrating a charging control method according to an exemplary embodiment.

[0061] Figure 7 This is a flowchart illustrating a PID incremental control fitting method according to an exemplary embodiment.

[0062] Figure 8 This is a flowchart illustrating a method for allocating target charging current to each charge pump chip according to an exemplary embodiment.

[0063] Figure 9 This is a flowchart illustrating a charging control method according to an exemplary embodiment.

[0064] Figure 10 This is a block diagram illustrating a charging control device according to an exemplary embodiment.

[0065] Figure 11 This is a block diagram illustrating a device for charging control according to an exemplary embodiment. Detailed Implementation

[0066] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure.

[0067] This disclosure provides a charging control circuit and method applied to a terminal charging scenario. This can be a scenario where the terminal is undergoing high-voltage charging.

[0068] When a device is charging, its performance is limited by factors such as temperature, battery charge / discharge rate, circuit current carrying capacity, and chip conversion capabilities. Among these, temperature limitations significantly affect the theoretical charging capacity of the device's charging architecture, and excessively high temperatures can also negatively impact the user experience.

[0069] A charge pump chip is a switched-capacitor voltage converter that uses a "fast" or "pumping" capacitor, rather than an inductor or transformer, to store energy. It can raise or lower the input power supply voltage, enabling fast charging as a component of the charging module in a terminal. However, the capabilities of charge pump chips are limited. Exceeding their charging capacity results in significant conversion losses, causing a rapid increase in internal temperature and impacting user experience. Connecting charge pump chips in parallel to meet the high-voltage charging environment requires high-voltage components, occupying a large physical layout space and hindering the internal layout of the terminal.

[0070] In related technologies, two or more charge pump chips are connected in parallel to improve the terminal charging power and reduce the temperature rise. Figure 1 A flowchart illustrating a method for charging two charge pump chips in parallel is shown. (See also...) Figure 1As can be seen, the two charge pump chips are placed on the motherboard and the small board respectively, and the charge pump chips on the motherboard and the small board are connected in parallel. When the internal temperature of the terminal rises, a current reduction is triggered to determine the main heat source inside the terminal. If the motherboard is the main heat source, the charge pump chip on the motherboard is turned off, and the charge pump chip on the small board is switched to charge the terminal. If the small board is the main heat source, the charge pump chip on the small board is turned off, and the charge pump chip on the motherboard is switched to charge the terminal. Distributing the heat source is beneficial to improving charging performance; however, placing charge pump chips on the motherboard and the small board respectively will greatly limit the physical layout of the terminal. For higher input voltages or higher power charging, setting up three or more charge pump chips will no longer be suitable. Furthermore, in order to avoid the main heat source, frequently switching the working state of the charge pump chip will cause frequent oscillations in the charging curve, affecting the efficiency of the overall charging process and reducing the battery life. At the same time, the capability of a single charge pump chip is limited by the charging power.

[0071] In view of this, embodiments of this disclosure provide a charging control circuit. The charging control circuit is not limited by the physical layout space within the terminal. By executing the charging control method through the charging control circuit provided in this disclosure, it can allocate current to only multiple charge pump chips, ensuring that each charge pump chip operates within its optimal temperature and efficiency range. For charge pump chips located near major heat sources such as the terminal's Central Processing Unit (CPU), Graphics Processing Unit (GPU), and Display Driver IC (DDIC), the amount of current to be allocated is reduced, while the allocated current is increased for charge pump chips located away from heat sources within the terminal, achieving a dynamic balance between temperature and target charging current throughout the terminal.

[0072] Figure 2 A schematic diagram of a charging control circuit is shown according to an exemplary embodiment. Figure 2 As shown, taking a programmable resistor as an example, the charging control circuit includes a charge pump chipset, programmable resistors R1, R2, and R3, and a power management IC (PMIC). The programmable resistors are connected in series with each charge pump chip in the charge pump chipset. The power management IC adjusts the current input to each charge pump chip in the charge pump chipset by adjusting the resistance value of the resistors connected in series with each charge pump chip. Figure 2 The solid lines represent the charging path, and the dashed lines represent the power supply path.

[0073] In this embodiment of the disclosure, the charge pump chipset includes multiple charge pump chips connected in parallel. Each charge pump chip in the multiple parallel-connected charge pump chips is connected in series with a resistor. Each series-connected resistor and charge pump chip form a branch, and multiple branches are connected in parallel.

[0074] In this embodiment, a charging voltage is input to the charge pump chipset via a power supply. The PMIC controls the charge pump chipset to perform charging. The charge pump chipset includes multiple charge pump chips arranged in parallel, and each charge pump chip corresponds to a resistor. The current to be allocated to the branch where each charge pump chip is located is determined based on the temperature of each charge pump chip. By adjusting the resistance value, the current in each branch is allocated to the appropriate level, achieving dynamic balance in the charging circuit and supporting high-power charging.

[0075] Figure 3 This is a flowchart illustrating a charging control method according to an exemplary embodiment. Figure 3 As shown, the charging control method includes the following steps.

[0076] In step S11, the first temperature corresponding to the terminal is determined.

[0077] In this embodiment of the disclosure, a first temperature is obtained by fitting the temperatures collected by each temperature sensor in the terminal. The temperatures collected by each temperature sensor in the terminal include the temperature of the charge pump chip and the temperatures collected by each sensor in the terminal. The collected temperatures are fitted and weighted to obtain the first temperature.

[0078] In one exemplary embodiment, taking a terminal including 8 temperature sensors as an example, the temperatures collected by the 8 sensors are weighted, and the temperatures of more important locations in the terminal are assigned higher weight values. For example, the temperature corresponding to the battery, the temperature corresponding to the CPU, and the temperature corresponding to the GPU are assigned higher weight values ​​than the temperature weight values ​​collected by other temperature sensors in the terminal. The weighted calculation is performed to obtain the first temperature.

[0079] In step S12, for each charge pump chip in the charge pump chip group included in the terminal, the second temperature corresponding to the charge pump chip is determined, and based on the first temperature and the second temperature, the target charging current to be allocated to the charge pump chip is determined.

[0080] In this embodiment of the disclosure, the input current of the charge pump chipset is determined based on a first temperature obtained through fitting. The target charging current to be allocated to the charge pump chips is determined based on a second temperature corresponding to each charge pump chip in the charge pump chipset.

[0081] In one exemplary embodiment, a correspondence between a first temperature and the input current of the charge pump chipset is predetermined. For example, when the first temperature is 30° to 31°, the input current is 12A (amperes). Based on a second temperature, a target charging current is determined for the charge pump chips to be allocated to each branch in the charging control circuit.

[0082] In step S13, for each charge pump chip in the charge pump chip group, the resistance value of the resistor connected in series with the charge pump chip is adjusted to drive the current of the charge pump chip to reach the target charging current.

[0083] In this embodiment of the disclosure, the resistance value of the resistor connected in series with each charge pump chip is adjusted according to the target charging current to be allocated to the charge pump chip, so as to realize the current shunting of the branch and thus the current value of the branch where the corresponding charge pump chip is located reaches the target charging current.

[0084] The charging control method provided by this disclosure can adjust the organization of the resistors connected in series with each charge pump chip according to the temperature collected by each temperature sensor in the terminal and the temperature of the charge pump chip itself, so that the current in each branch of the charging control circuit reaches the target charging current.

[0085] In the charging control method of this disclosure, the target charging current allocated to each charge pump chip can be determined based on the first temperature and the second temperature collected and fitted by each temperature sensor of the terminal.

[0086] Figure 4 This is a flowchart illustrating a method for determining a target charging current to be allocated to a charge pump chip, according to an exemplary embodiment. Figure 4 As shown, the target charging current to be allocated to the charge pump chip is determined based on a first temperature and a second temperature, including the following steps.

[0087] In step S21, the heating temperature of the charge pump chip is obtained based on the first temperature.

[0088] In this embodiment of the disclosure, the temperature collected by each temperature sensor in the terminal is weighted and calculated. The weighted calculation process is a fitting process. The fitting result is determined as the first temperature. Based on the first temperature, the heating temperature of the charge pump chip is obtained.

[0089] In step S22, proportional-integral-derivative (PID) incremental control is fitted based on the second temperature and the heating temperature to obtain the current change value corresponding to the charge pump chip.

[0090] In this embodiment of the disclosure, for each charge pump chip, PID incremental control fitting is performed based on the collected temperature to obtain the current change value.

[0091] Formula 1 is used to fit the collected temperature data using PID incremental control to obtain the current change value. Formula 1 is:

[0092]

[0093] in, K represents the change in current. p K is the proportionality coefficient. i K is the integration time constant. d The differential time constant is This represents the difference between the temperature of the charge pump chip during this temperature measurement and the temperature calculated based on the transfer function. This is the difference between the temperature of the charge pump chip in the previous temperature measurement and the temperature calculated based on the transfer function. This is the difference between the temperature of the charge pump chip in the previous temperature acquisition and the temperature calculated based on the transfer function.

[0094] Among them, K p K i K d The value needs to be determined in advance.

[0095] In one exemplary embodiment, K is predetermined. p After determining the value, K is determined sequentially according to Formula 1. i K d The value of K is predetermined. p The method is: to set K p K i K d Set K to 0 and continuously increase it. p The value of K is maintained. i K d The value of K is 0, leading to frequent oscillations in the charging curve. At this point, continuously decreasing K... p The value of K remains unchanged. i K d The value of K is 0, and the oscillation amplitude of the charging curve is within the first preset range. At this point, K is determined. p The value of is used as the proportional coefficient K for fitting the PID incremental control. p Predetermine K i The method is as follows: Determine K p After the value of K, i Adjusting it to within a preset threshold causes the charging curve to oscillate frequently, continuously reducing K. i The value of K is determined when the oscillation amplitude of the charging curve is within the second preset range.i The value of is used as the integral time constant K for fitting the PID incremental control. i Predetermine K d The method is as follows: Given a determined K... p K i Based on this, K d Adjusting it to within a preset threshold causes the charging curve to oscillate frequently, continuously reducing K. d The value of K is determined when the oscillation amplitude of the charging curve is within the third preset range. d The value of is used as the differential time constant for fitting the PID incremental control.

[0096] Continuing with the previous example, the first preset range is larger than the second preset range, and the second preset range is larger than the third preset range. If K is adjusted... i Afterwards, if the oscillation amplitude of the charging curve is actually within the third preset range, then K is not adjusted. d Keep K d The value is 0, thus determining the PID incremental control fit. The third preset range is the range corresponding to when the charging curve produces almost no oscillations.

[0097] In one exemplary embodiment, the PID incremental control fitting is performed periodically. For example, in this cycle, the temperature value corresponding to the charge pump chip is calculated based on the transfer function, and the temperature value of the charge pump chip is obtained from the temperature sensor. The difference between the two is then calculated to obtain the result. It can be seen that, The same calculation method is used to obtain the PID incremental control fit.

[0098] In step S23, the current change value of the current compensation for the current of the charge pump chip is calculated to obtain the target charging current to be allocated to the charge pump chip.

[0099] In this embodiment of the disclosure, the charging current compensation current change value of the charge pump chip in each branch of the charging control circuit is adjusted according to the current change value based on the current current of the charge pump chip, so that the charge pump chip in each branch charges according to the target charging current allocated to the charge pump chip.

[0100] The charging control method provided in this disclosure determines the current change value only by relating it to the error values ​​of the charge pump chips in recent cycles, reducing the impact of calculation errors when determining the current change value. Furthermore, by utilizing the PID incremental algorithm, it is easier to derive the position algorithm u(k) = u(k-1) + Δu(k), thereby compensating for the current change value of the current charging current and ensuring that the current of each branch charge pump chip reaches the allocated target current. In the position algorithm, u(k) is the target charging current corresponding to each charge pump chip, u(k-1) is the target charging current corresponding to each charge pump chip in the previous cycle, and Δu(k) is the current change value corresponding to each charge pump chip in the current cycle. The target charging current corresponding to each charge pump chip in the current cycle is obtained by adding the current change value corresponding to each charge pump chip in the current cycle to the target charging current corresponding to each charge pump chip in the previous cycle.

[0101] Figure 5 This is a flowchart illustrating a controlled charging method according to an exemplary embodiment. Figure 5 As shown, the heating temperature of the charge pump chip is obtained based on the first temperature, including the following steps.

[0102] In step S31, the current overall input current of the charge pump chipset is determined based on the first temperature.

[0103] In this embodiment of the disclosure, the temperature collected by each temperature sensor in the terminal is weighted and calculated. The weighting value is determined according to the different components in the terminal corresponding to each temperature sensor. The weighting calculation process is a fitting process. The fitting result is determined as the first temperature. The current overall input current of the charge pump chip group is determined according to the first temperature.

[0104] In step S32, the heating temperature of the charge pump chip corresponding to the current overall input current is determined based on the current overall input current and the transfer function.

[0105] The input to the transfer function is the current, and the output is the heating temperature.

[0106] In this embodiment of the disclosure, the heating temperature of each charge pump chip is determined by the transfer function and the overall input current of the current charge pump chip group under the current overall charging current.

[0107] The transfer function is shown in Equation 2:

[0108] f(t) = i 2 Formula 2: ×R×t×(1-η)+h(t)

[0109] Where f(t) is the heating temperature of each charge pump chip determined according to the transfer function, i is the overall input current to the charge pump chip group, R is the resistance value of the resistor connected in series with the charge pump chip in the branch where the charge pump chip is located, t is the period time, η is the conversion efficiency of each charge pump chip, and h(t) is the perturbation constant.

[0110] Figure 6 This is a flowchart illustrating a charging control method according to an exemplary embodiment. Figure 6 As shown, proportional-integral-derivative incremental control fitting is performed based on the second temperature and the heating temperature to obtain the current change value corresponding to the charge pump chip, including the following steps.

[0111] In step S41, the temperature difference is determined based on the second temperature and the heating temperature.

[0112] In this embodiment of the disclosure, the temperature difference between the collected temperatures of each charge pump chip and the heating temperature output by the transfer function is used as the temperature difference of the charge pump chip.

[0113] Here, it can be understood that the second temperature is the actual temperature of the charge pump chip, while the heating temperature determined by the transfer function is the theoretical temperature of the charge pump chip.

[0114] In step S42, the current change value is obtained by fitting the temperature difference value.

[0115] In this embodiment, the temperature difference is used as the input for PID incremental control fitting. The current change value is obtained through PID incremental control fitting. The current change value is then compensated for by increasing or decreasing the current change value based on the current charging current of each charge pump chip, so that each charge pump chip operates with the compensated charging current.

[0116] Figure 7 This is a flowchart illustrating a PID incremental control fitting method according to an exemplary embodiment. For example... Figure 7 As shown, based on the temperatures collected by the temperature sensors in the terminal, the PID controller controls the current controller, thereby adjusting the temperature within the terminal to achieve closed-loop control. The control method in the PID controller is consistent with the control method in the above embodiment. In the PID controller, the content corresponding to P is the same as K in Formula 1. p The corresponding parts are consistent, that is, K p e(t) is the value in formula 1 The proportional component used to characterize the fitting of the PID incremental control is calculated to react instantaneously to current deviations. The content corresponding to I is the same as K in Formula 1. i The corresponding parts are consistent, that is, For formula 1 The integral part of the calculation is used to characterize the fitting of the PID incremental control, in order to eliminate the static error of the PID incremental algorithm. The content corresponding to D is the same as K in Formula 1. d The corresponding parts are consistent, that is, For formula 1 The differential part of the PID incremental control fitting is used to characterize the system's adjustment process, thus accelerating the system's adjustment. Through PID incremental control fitting, an immediate response (the proportional part) can be made to the deviation at the moment it occurs or changes, and appropriate corrections can be provided in advance based on the trend of deviation changes.

[0117] Continuing with the previous example, the temperatures of each temperature sensor in the terminal are fitted, and the temperatures of each charge pump chip are simultaneously input to the PID controller. The PID controller determines the overall input current of the charge pump chip group based on the fitted temperatures, and simultaneously determines the current to be allocated to each charge pump chip based on the temperature of each charge pump chip and the overall input current of the charge pump chip group. The current controller adjusts the resistance of the resistor connected in series with the charge pump chip to the target resistance value based on the current to be allocated to each charge pump chip determined by the PID controller, so that the current in the corresponding branch of the adjusted charge pump chip reaches the target charging current. Each charge pump chip charges the terminal according to the target charging current. The temperature sensors in the terminal continuously collect temperature data, and the above steps are repeated until charging is stopped, to achieve closed-loop control and ensure that each charge pump chip is charged in the optimal state.

[0118] The charging control method provided by this disclosure can determine the current change value by means of the transfer function and the real-time temperature of the charge pump chip, so as to ensure that the charge pump chip is in good working condition, reduce the heat generated by the charge pump chip, and improve the efficiency of the control charging circuit.

[0119] The embodiments disclosed herein control the current of each branch through resistors, so that the branch where the charge pump chip is located achieves the target charging current.

[0120] Figure 8 This is a flowchart illustrating a method for allocating target charging current to each charge pump chip according to an exemplary embodiment. Figure 8 As shown, for each charge pump chip in the charge pump chipset, the resistance value of the resistor connected in series with the charge pump chip is adjusted to drive the current of the charge pump chip to reach the target charging current, including the following steps.

[0121] In step S51, the overall input current allocated to the charge pump chipset and the target charging current to be allocated to the charge pump chip are determined.

[0122] In this embodiment, the overall input current allocated to the charge pump chipset is determined based on a first temperature obtained through fitting. A second temperature is obtained based on the temperature corresponding to each charge pump chip in the charge pump chipset. A current compensation value is obtained based on the second temperature, PID incremental control fitting, and transfer function. This current compensation value is then increased or decreased to determine the target charging current to be allocated to the charge pump chips.

[0123] In one exemplary embodiment, a correspondence between a first temperature and the input current of the charge pump chipset is predetermined. For example, when the first temperature is above 33°C, the input current is 5A (amperes). Based on a second temperature, a target charging current is determined for the charge pump chips to be allocated to each branch in the charging control circuit.

[0124] In step S52, the target resistance values ​​of the resistors connected in series with the charge pump chip are determined based on the overall input current and the target charging current.

[0125] In this embodiment of the disclosure, the target resistance value of the resistors connected in series with the charge pump chip is determined based on the overall input current allocated to the charge pump chip group and the target charging current of the charge pump chip.

[0126] In one exemplary embodiment, taking a charge pump chipset comprising three charge pump chips, with resistors on each branch having resistance values ​​of R1, R2, and R3, and target charging currents of I1, I2, and I3 for each charge pump chip as an example, the target resistance values ​​of the resistors connected in series with each charge pump chip are determined using Formula 3. Formula 3 is shown below:

[0127]

[0128]

[0129]

[0130] Where I is the total input current allocated to the charge pump chipset.

[0131] In step S53, the resistance of the resistor connected in series with the charge pump chip is adjusted to the target resistance value so that the current of the charge pump chip can reach the target charging current.

[0132] In this embodiment, the resistance value of the resistor connected in series with each charge pump chip is adjusted according to the target resistance value, so that the adjusted resistance value of the resistor connected in series with each charge pump chip is equal to the target resistance value, thereby allocating the target charging current to the charge pump chip and making the current in the corresponding branch where the charge pump chip is located reach the target charging current.

[0133] The charging control method provided by the embodiments of this disclosure can control the distribution of current in each branch of the charging circuit by adjusting the resistance value.

[0134] Figure 9 This is a flowchart illustrating a charging control method according to an exemplary embodiment. Figure 9 As shown, the temperature in the fitting terminal is used to determine the current of the charge pump chip group, and the temperature of each charge pump chip is obtained. The target charging current allocated to each charge pump chip is determined by the PID incremental control fitting method. Based on the output current of the charge pump chip group, the resistance value of each branch is calculated, and the resistance value of each branch is adjusted to the calculated resistance value to control the charging current of each charge pump chip to reach the target charging current until charging is cut off.

[0135] The charging control method provided by the embodiments of this disclosure can intelligently allocate the current of each charge pump chip, so that each charge pump chip is in the best working state, achieve dynamic balance, and improve charging efficiency.

[0136] Based on the same concept, embodiments of this disclosure also provide a charging control device.

[0137] It is understood that the charging control device provided in this disclosure includes hardware structures and / or software modules corresponding to each function in order to achieve the above-mentioned functions. In conjunction with the units and algorithm steps of the various examples disclosed in this disclosure, this disclosure can be implemented in hardware or a combination of hardware and computer software. Whether a function is executed by hardware or by computer software driving hardware depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of the technical solution of this disclosure.

[0138] Figure 10 This is a block diagram illustrating a charging control device according to an exemplary embodiment. (Refer to...) Figure 10 The charging control device 100 includes a determining unit 101 and an allocating unit 103.

[0139] Determining unit 101 is used to determine the first temperature corresponding to the terminal;

[0140] The determining unit 101 is further configured to determine the second temperature corresponding to each charge pump chip in the charge pump chip group included in the terminal, and to determine the target charging current to be allocated to the charge pump chip based on the first temperature and the second temperature.

[0141] The distribution unit 103 is used to adjust the resistance value of the resistor connected in series with each charge pump chip in the charge pump chipset, so as to drive the current of the charge pump chip to reach the target charging current.

[0142] In one embodiment, the determining unit 101 determines the target charging current to be allocated to the charge pump chip based on a first temperature and a second temperature in the following manner:

[0143] Based on the first temperature, the heating temperatures of the charge pump chips are obtained respectively;

[0144] Based on the second temperature, proportional-integral-derivative incremental control fitting is performed to obtain the current change value corresponding to the charge pump chip.

[0145] The target charging current to be allocated to the charge pump chip is obtained by compensating for the current change value of the current at the current of the charge pump chip.

[0146] In one embodiment, the determining unit 101 obtains the heating temperature of the charge pump chip based on a first temperature in the following manner:

[0147] Based on the first temperature, determine the current overall input current of the charge pump chipset;

[0148] Based on the current overall input current and the transfer function, the heating temperature of the charge pump chip corresponding to the current overall input current is determined. The input of the transfer function is the current, and the output is the heating temperature.

[0149] In one embodiment, the determining unit 101 performs proportional-integral-derivative incremental control fitting based on the second temperature and the heating temperature to obtain the current change value corresponding to the charge pump chip:

[0150] The temperature difference is determined based on the second temperature and the heating temperature;

[0151] The current change value is obtained by fitting the temperature difference.

[0152] In one embodiment, the distribution unit 103 adjusts the resistance value of the resistor connected in series with each charge pump chip in the charge pump chipset in the following manner to drive the current of the charge pump chip to reach the target charging current:

[0153] Determine the overall input current allocated to the charge pump chipset, and the target charging current to be allocated to the charge pump chips;

[0154] Based on the overall input current and the target charging current, determine the target resistance values ​​of the resistors connected in series with the charge pump chip.

[0155] Adjust the resistance of the resistor connected in series with the charge pump chip to the target resistance value so that the current driving the charge pump chip reaches the target charging current.

[0156] Figure 11 This is a block diagram illustrating a charging control device 200 according to an exemplary embodiment. For example, device 200 may be a mobile phone, computer, digital broadcasting terminal, messaging device, game console, tablet device, medical device, fitness equipment, personal digital assistant, etc.

[0157] Reference Figure 11 The device 200 may include one or more of the following components: processing component 202, memory 204, power component 206, multimedia component 208, audio component 210, input / output (I / O) interface 212, sensor component 214, and communication component 216.

[0158] Processing component 202 typically controls the overall operation of device 200, such as operations associated with display, telephone calls, data communication, camera operation, and recording. Processing component 202 may include one or more processors 220 to execute instructions to perform all or part of the steps of the methods described above. Furthermore, processing component 202 may include one or more modules to facilitate interaction between processing component 202 and other components. For example, processing component 202 may include a multimedia module to facilitate interaction between multimedia component 208 and processing component 202.

[0159] Memory 204 is configured to store various types of data to support the operation of device 200. Examples of such data include instructions for any application or method operating on device 200, contact data, phonebook data, messages, pictures, videos, etc. Memory 204 can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic storage, flash memory, magnetic disk, or optical disk.

[0160] The power supply component 206 provides power to the various components of the device 200. The power supply component 206 may include a power management system, one or more power sources, and other components associated with generating, managing, and distributing power to the device 200.

[0161] Multimedia component 208 includes a screen that provides an output interface between the device 200 and the user. In some embodiments, the screen may include a liquid crystal display (LCD) and a touch panel (TP). If the screen includes a touch panel, the screen may be implemented as a touchscreen to receive input signals from the user. The touch panel includes one or more touch sensors to sense touches, swipes, and gestures on the touch panel. The touch sensors may sense not only the boundaries of the touch or swipe action but also the duration and pressure associated with the touch or swipe operation. In some embodiments, multimedia component 208 includes a front-facing camera and / or a rear-facing camera. When the device 200 is in an operating mode, such as a shooting mode or a video mode, the front-facing camera and / or the rear-facing camera may receive external multimedia data. Each front-facing camera and rear-facing camera may be a fixed optical lens system or have focal length and optical zoom capabilities.

[0162] Audio component 210 is configured to output and / or input audio signals. For example, audio component 210 includes a microphone (MIC) configured to receive external audio signals when device 200 is in an operating mode, such as call mode, recording mode, and voice recognition mode. The received audio signals may be further stored in memory 204 or transmitted via communication component 216. In some embodiments, audio component 210 also includes a speaker for outputting audio signals.

[0163] I / O interface 212 provides an interface between processing component 202 and peripheral interface modules, such as keyboards, click wheels, buttons, etc. These buttons may include, but are not limited to, home buttons, volume buttons, power buttons, and lock buttons.

[0164] Sensor assembly 214 includes one or more sensors for providing status assessments of various aspects of device 200. For example, sensor assembly 214 may detect the on / off state of device 200, the relative positioning of components such as the display and keypad of device 200, changes in the position of device 200 or a component of device 200, the presence or absence of user contact with device 200, the orientation or acceleration / deceleration of device 200, and temperature changes of device 200. Sensor assembly 214 may include a proximity sensor configured to detect the presence of nearby objects without any physical contact. Sensor assembly 214 may also include a light sensor, such as a CMOS or CCD image sensor, for use in imaging applications. In some embodiments, sensor assembly 214 may also include an accelerometer, a gyroscope, a magnetometer, a pressure sensor, or a temperature sensor.

[0165] Communication component 216 is configured to facilitate wired or wireless communication between device 200 and other devices. Device 200 can access wireless networks based on communication standards, such as WiFi, 2G, or 3G, or combinations thereof. In one exemplary embodiment, communication component 216 receives broadcast signals or broadcast-related information from an external broadcast management system via a broadcast channel. In one exemplary embodiment, communication component 216 also includes a near-field communication (NFC) module to facilitate short-range communication. For example, the NFC module may be implemented based on radio frequency identification (RFID) technology, Infrared Data Association (IrDA) technology, ultra-wideband (UWB) technology, Bluetooth (BT) technology, and other technologies.

[0166] In an exemplary embodiment, the apparatus 200 may be implemented by one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field-programmable gate arrays (FPGAs), controllers, microcontrollers, microprocessors, or other electronic components to perform the methods described above.

[0167] In an exemplary embodiment, a non-transitory computer-readable storage medium including instructions is also provided, such as a memory 204 including instructions, which can be executed by a processor 220 of the device 200 to perform the above-described method. For example, the non-transitory computer-readable storage medium may be a ROM, random access memory (RAM), CD-ROM, magnetic tape, floppy disk, and optical data storage device, etc.

[0168] It is understood that in this disclosure, "multiple" refers to two or more, and other quantifiers are similar. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, and B alone. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship. The singular forms "a," "the," and "the" are also intended to include the plural forms unless the context clearly indicates otherwise.

[0169] It is further understood that the terms "first," "second," etc., are used to describe various types of information, but this information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another, and do not indicate a specific order or degree of importance. In fact, the expressions "first," "second," etc., are completely interchangeable. For example, without departing from the scope of this disclosure, first information can also be referred to as second information, and similarly, second information can also be referred to as first information.

[0170] It can be further understood that, unless otherwise specified, "connection" includes both direct connections where no other components exist between the two parties and indirect connections where other components exist between them.

[0171] It is further understood that although operations are described in a specific order in the accompanying drawings in the embodiments of this disclosure, this should not be construed as requiring these operations to be performed in the specific order or serial order shown, or requiring all of the shown operations to be performed to obtain the desired result. In certain environments, multitasking and parallel processing may be advantageous.

[0172] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein.

[0173] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

Claims

1. A charging control circuit, characterized in that, include: Charge pump chipset; The resistor is connected in series with each charge pump chip in the charge pump chipset. A power control circuit is used to adjust the current input to each charge pump chip by adjusting the resistance value of the resistor connected in series with each charge pump chip; The charge pump chipset includes multiple charge pump chips connected in parallel, and each of the multiple charge pump chips connected in parallel corresponds to a resistor connected in series. Each series-connected resistor and charge pump chip forms a branch, and multiple branches are connected in parallel. The step of adjusting the current input to each charge pump chip by adjusting the resistance value of the resistor connected in series with each charge pump chip includes: Determine the first temperature corresponding to the terminal, which is obtained by fitting the temperatures collected by each temperature sensor of the terminal. For each charge pump chip in the charge pump chipset included in the terminal, a second temperature corresponding to the charge pump chip is determined, and based on the first temperature and the second temperature, a current change value corresponding to the charge pump chip is determined, and based on the current change value, a target charging current to be allocated to the charge pump chip is determined. For each charge pump chip in the charge pump chip group, the resistance value of the resistor connected in series with the charge pump chip is adjusted to drive the current of the charge pump chip to reach the target charging current.

2. A charging control method, characterized in that, include: Determine the first temperature corresponding to the terminal, which is obtained by fitting the temperatures collected by each temperature sensor of the terminal. For each charge pump chip in the charge pump chipset included in the terminal, a second temperature corresponding to the charge pump chip is determined, and based on the first temperature and the second temperature, a current change value corresponding to the charge pump chip is determined, and based on the current change value, a target charging current to be allocated to the charge pump chip is determined. For each charge pump chip in the charge pump chip group, the resistance value of the resistor connected in series with the charge pump chip is adjusted to drive the current of the charge pump chip to reach the target charging current.

3. The method according to claim 2, characterized in that, The step of determining the target charging current to be allocated to the charge pump chip based on the first temperature and the second temperature includes: Based on the first temperature, the heating temperatures of the charge pump chips are obtained respectively; Based on the second temperature and the heating temperature, proportional-integral-derivative incremental control fitting is performed to obtain the current change value corresponding to the charge pump chip; The current change value is compensated for by the current current of the charge pump chip to obtain the target charging current to be allocated to the charge pump chip.

4. The method according to claim 3, characterized in that, The step of obtaining the heating temperature of the charge pump chip based on the first temperature includes: Based on the first temperature, determine the current overall input current of the charge pump chipset; Based on the current overall input current and the transfer function, the heating temperature of the charge pump chip corresponding to the current overall input current is determined. The input of the transfer function is current, and the output is heating temperature.

5. The method according to claim 3, characterized in that, The step of performing proportional-integral-derivative incremental control fitting based on the second temperature and the heating temperature to obtain the current change value corresponding to the charge pump chip includes: The temperature difference is determined based on the second temperature and the heating temperature; The current change value is obtained by fitting the temperature difference.

6. The method according to claim 2, characterized in that, The step of adjusting the resistance value of the resistor connected in series with each charge pump chip in the charge pump chipset to drive the current of the charge pump chip to reach the target charging current includes: Determine the overall input current allocated to the charge pump chipset, and the target charging current to be allocated to the charge pump chip; Based on the overall input current and the target charging current, determine the target resistance values ​​of the resistors connected in series with the charge pump chip. The resistance of the resistor connected in series with the charge pump chip is adjusted to the target resistance value so that the current of the charge pump chip can reach the target charging current.

7. A charging control device, characterized in that, include: The determining unit is used to determine the first temperature corresponding to the terminal, which is obtained by fitting the temperatures collected by each temperature sensor of the terminal. The determining unit is further configured to determine a second temperature corresponding to each charge pump chip in the charge pump chip group included in the terminal, and based on the first temperature and the second temperature, determine a current change value corresponding to the charge pump chip, and based on the current change value, determine a target charging current to be allocated to the charge pump chip. The distribution unit is used to adjust the resistance value of the resistor connected in series with each charge pump chip in the charge pump chip group, so as to drive the current of the charge pump chip to reach the target charging current.

8. The apparatus according to claim 7, characterized in that, The determining unit determines the target charging current to be allocated to the charge pump chip based on the first temperature and the second temperature in the following manner: Based on the first temperature, the heating temperatures of the charge pump chips are obtained respectively; Based on the second temperature and the heating temperature, proportional-integral-derivative incremental control fitting is performed to obtain the current change value corresponding to the charge pump chip; The current change value is compensated for by the current current of the charge pump chip to obtain the target charging current to be allocated to the charge pump chip.

9. The apparatus according to claim 8, characterized in that, The determining unit obtains the heating temperature of the charge pump chip based on the first temperature in the following manner: Based on the first temperature, determine the current overall input current of the charge pump chipset; Based on the current overall input current and the transfer function, the heating temperature of the charge pump chip corresponding to the current overall input current is determined. The input of the transfer function is current, and the output is heating temperature.

10. The apparatus according to claim 8, characterized in that, The determining unit uses a proportional-integral-derivative incremental control fitting method based on the second temperature and the heating temperature to obtain the current change value corresponding to the charge pump chip: The temperature difference is determined based on the second temperature and the heating temperature; The current change value is obtained by fitting the temperature difference.

11. The apparatus according to claim 7, characterized in that, The distribution unit adjusts the resistance value of the resistor connected in series with each charge pump chip in the charge pump chip group in the following manner to drive the current of the charge pump chip to reach the target charging current: Determine the overall input current allocated to the charge pump chipset, and the target charging current to be allocated to the charge pump chip; Based on the overall input current and the target charging current, determine the target resistance values ​​of the resistors connected in series with the charge pump chip. The resistance of the resistor connected in series with the charge pump chip is adjusted to the target resistance value so that the current of the charge pump chip can reach the target charging current.

12. A charging control device, characterized in that, include: processor; Memory used to store processor-executable instructions; The processor is configured to perform the method described in any one of claims 2 to 6.

13. A storage medium, characterized in that, The storage medium stores instructions that, when executed by a processor, enable the processor to perform the method described in any one of claims 2 to 6.

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