Airflow sensor for a loudspeaker

Abstract

This application relates to airflow sensors for loudspeakers. Aspects of the subject technology relate to electronic devices that have loudspeakers and airflow sensors for those loudspeakers. In one or more implementations, the airflow sensor can be formed in part by a mesh structure that spans a port in an outer case of the electronic device. In one or more implementations, the airflow sensor can be formed in part by an exposed portion of a conductive trace of the loudspeaker.

Description

Technical Field

[0001] This specification relates in its entirety to electronic devices having audio transducers including, for example, airflow sensors for loudspeakers. Background Technology

[0002] Electronic devices (such as computers, media players, cell phones, wearable devices, and headphones) typically include speakers for generating audio output from the device. However, integrating speakers that produce high-quality sound into electronic devices, especially into compact devices such as portable electronic devices, can be challenging. Attached Figure Description

[0003] Some features of this subject matter are shown in the appended claims. However, for illustrative purposes, several aspects of this subject matter are set forth in the following figures.

[0004] Figure 1 A perspective view of an exemplary electronic device with an airflow sensor according to various aspects of the subject matter is shown.

[0005] Figure 2 A cross-sectional side view of a portion of an exemplary electronic device having a speaker and an airflow sensor, according to various aspects of the subject matter, is shown.

[0006] Figure 3 A schematic diagram of an electronic device with a speaker and an airflow sensor, according to various aspects of the subject matter, is shown.

[0007] Figure 4 A perspective view of a mesh structure of an electronic device according to various aspects of the subject matter is shown.

[0008] Figures 5-7 Various exemplary measurable effects of airflow on the mesh structure of electronic devices according to various aspects of the subject matter are shown.

[0009] Figure 8 A portion of an exemplary airflow sensor according to various aspects of the subject matter is shown, the exemplary airflow sensor including a piezoelectric mount of a mesh structure for an electronic device.

[0010] Figure 9 and Figure 10 A portion of another exemplary airflow sensor according to various aspects of the subject matter is shown, the exemplary airflow sensor including a piezoelectric mount of a mesh structure for an electronic device.

[0011] Figure 11A portion of another exemplary airflow sensor according to various aspects of the subject matter is shown, the exemplary airflow sensor including a piezoelectric mount of a mesh structure for an electronic device.

[0012] Figure 12 A portion of an exemplary airflow sensor according to various aspects of the subject matter is shown, the exemplary airflow sensor including a capacitive sensor with a mesh structure for use in electronic devices.

[0013] Figure 13 A portion of an exemplary airflow sensor according to various aspects of the subject matter is shown, the exemplary airflow sensor including an anemometer partially formed by a mesh structure for electronic devices.

[0014] Figure 14 A portion of an exemplary electronic device incorporating an airflow sensor according to various aspects of the subject matter is shown, the airflow sensor including an anemometer partially formed by a mesh structure.

[0015] Figure 15 A portion of an exemplary airflow sensor according to various aspects of the subject matter is shown, the exemplary airflow sensor including an anemometer having a heating element coupled to a heat pipe.

[0016] Figure 16 A portion of an exemplary airflow sensor according to various aspects of the subject matter is shown, the exemplary airflow sensor including a portion of the conductive traces of an audio transducer.

[0017] Figure 17 This illustrates various aspects of the technology according to this subject matter. Figure 16 A cross-sectional side view of an exemplary airflow sensor.

[0018] Figure 18 A flowchart illustrating an exemplary process for operating an electronic device with an airflow sensor, according to various aspects of the subject matter, is shown.

[0019] Figure 19 An electronic system that can implement one or more specific embodiments of the technology of this subject is shown. Detailed Implementation

[0020] The specific embodiments shown below are intended to describe various configurations of the subject matter and are not intended to represent the only configuration in which the subject matter can be practiced. The accompanying drawings are incorporated herein and form part of the detailed description. The detailed description includes specific details intended to provide a thorough understanding of the subject matter. However, it will be clear and apparent to those skilled in the art that the subject matter is not limited to the specific details shown herein and can be practiced without such specific details. In some cases, well-known structures and components are shown in block diagram form in order to avoid obscuring the concepts of the subject matter.

[0021] Portable electronic devices (such as mobile phones, portable music players, tablet computers, and laptop computers) and wearable devices (such as smartwatches, headphones, earbuds, and other wearable devices) typically include one or more audio transducers, such as microphones for receiving sound input or speakers for generating sound.

[0022] However, when attempting to implement audio transducer modules (e.g., speakers or speaker modules) in a device, challenges may arise when constraints on spatial integration with other device components, decorative constraints, and / or other constraints compete with audio quality constraints. These challenges can be particularly difficult when attempting to implement audio transducer modules in compact devices such as portable or wearable devices.

[0023] For example, a speaker component installed within an electronic device can route sound generated by the moving diaphragm of the speaker component to the external environment of the electronic device via an output port. However, in many specific embodiments, including those in compact devices, the cross-sectional area of ​​the airflow path from the front cavity of the speaker to the output port may be significantly narrowed, which may generate high-speed airflow through the output port. In some cases, this high-speed airflow can be heard and / or felt by the user of the device, which may be undesirable, especially if the sound of the airflow can be heard at the desired audio output from the speaker component.

[0024] One option to reduce the impact of high-speed airflow through the output port is to use a static equalizer to modify the audio output, such as by reducing the frequencies of sounds expected to produce such high-speed airflow. However, without real-time information about the airflow generated by the specific audio content, this type of static equalization may undesirably overcorrect the audio output in some scenarios (e.g., including scenarios where correction is not required), and / or may undercorrect the audio output in other scenarios.

[0025] According to various aspects disclosed in this subject matter, the electronic device with a speaker also includes an airflow sensor. The electronic device can obtain airflow measurements of the airflow passing through the speaker's output port in real time, while simultaneously generating audio output using the speaker. The electronic device can modify the audio output generated by the speaker based on the real-time airflow measurements from the airflow sensor. As described in further detail below, in various embodiments, the airflow sensor may be incorporated into a mesh structure of the electronic device, may include piezoelectric components, may include capacitive sensing components, may form an anemometer, may include a heat pipe, and / or may include exposed portions of the speaker's conductive traces.

[0026] Figure 1 The image shows an exemplary electronic device including a speaker. Figure 1 In the example, electronic device 100 (e.g., electronic device) has been implemented using a housing that is small enough to be portable and carried by the user (e.g., Figure 1 The electronic device 100 may be a handheld electronic device such as a tablet computer, cellular phone, or smartphone. Figure 1 As shown, electronic device 100 includes a display, such as display 110 mounted on the front of housing 106. Electronic device 100 includes one or more input / output devices (such as a touchscreen integrated into display 110), buttons or switches (such as button 104), and / or other input / output components disposed above or behind display 110 or above or behind other portions of housing 106. Display 110 and / or housing 106 include one or more openings to accommodate button 104, a speaker, a light source, or a camera.

[0027] exist Figure 1 In the example, housing 106 includes two openings 108 on the bottom sidewall of housing 106. One or more of the openings 108 form ports for audio components. For example, one opening 108 may form a speaker port for a speaker disposed within housing 106, and the other opening 108 may form a microphone port for a microphone disposed within housing 106. The openings 108 may be open ports, or may be completely or partially covered by a permeable membrane or mesh structure that allows air and sound to pass through the opening. Although in Figure 1Two openings 108 are shown, but this is merely illustrative. One, two, or more openings 108 may be provided on the bottom sidewall (as shown), on another sidewall (e.g., the top sidewall, left sidewall, or right sidewall), on the rear surface of housing 106, and / or on the front surface of housing 106 or display 110. In some embodiments, one or more sets of openings 108 in housing 106 may be aligned with a single port of an audio component within housing 106. Housing 106, sometimes referred to as a shell, may be formed of plastic, glass, ceramic, fiber composite material, metal (e.g., stainless steel, aluminum, etc.), other suitable materials, or any combination of two or more of these materials.

[0028] Figure 1 The configuration of the electronic device 100 is merely illustrative. In other embodiments, the electronic device 100 may be a computer, such as a computer integrated into a display (such as a computer monitor), a laptop computer, a wearable device (such as a smartwatch, a lanyard device, or other wearable or micro-device), a media player, a gaming device, a navigation device, a computer monitor, a television, headphones, earphones, or other electronic equipment.

[0029] In some embodiments, electronic device 100 may be provided in the form of a wearable device such as a smartwatch. In one or more embodiments, housing 106 may include one or more interfaces for mechanically attaching housing 106 to a strap or other structure for securing housing 106 to a wearer. Electronic device 100 may include one, two, three, or more than three audio components, each mounted adjacent to one or more openings in opening 108.

[0030] A speaker disposed within housing 106 transmits sound through at least one associated opening 108. A microphone may also be disposed within housing 106, receiving sound through at least one associated opening in housing 106. In one or more embodiments, a speaker (e.g., a speaker module) may be mounted such that the speaker's output port is mounted adjacent to and aligned with the corresponding opening 108. The speaker may include a front cavity, a diaphragm, and an output port, and may include or incorporate a portion of an airflow sensor, as described in further detail below.

[0031] Figure 2 A cross-sectional view of a portion of an electronic device 100 in which audio components are mounted is shown. Figure 2In the example, electronic device 100 includes a loudspeaker 200 (also referred to herein as a loudspeaker module or loudspeaker component). The loudspeaker 200 includes a housing 202 mounted adjacent to at least one opening 108 in the housing 106 of electronic device 100. The housing 202 (e.g., the loudspeaker housing of a loudspeaker module) may be formed of one or more materials such as plastic and / or metal. As shown, the loudspeaker 200 may include a front cavity 208 and a rear cavity 212 separated by a structure 210. The structure 210 may include a diaphragm 214 actuated to produce sound; and a structure 216 (e.g., an inner wall to which the diaphragm 214 is mounted) that at least partially separates the front cavity 208 and the rear cavity 212.

[0032] The circuitry 221 of the loudspeaker 200 (e.g., including one or more magnets and a voice coil for actuating the diaphragm 214 to generate sound) may be coupled to device circuitry, such as device circuitry 299 (e.g., one or more processors of the device), via connector 215. Connector 215 may include a flexible integrated circuit or another flexible or rigid conductive connector. In one or more embodiments, circuitry 221 may be coupled to loudspeaker circuitry 219 (e.g., one or more integrated circuits and / or other processing circuitry within the loudspeaker 200 for processing audio content from device circuitry 299 and / or airflow feedback from an airflow sensor, and / or for operating circuitry 221 to move the diaphragm), which is coupled to circuitry 221. In one or more other embodiments, device circuitry 299 may be directly coupled to circuitry 221.

[0033] As shown, the loudspeaker 200 may include an output port 211 acoustically coupled to the front cavity 208 and aligned with and mounted adjacent to the opening 108, such that sound generated by the diaphragm 214 (e.g., in response to a control signal received from control circuitry such as device circuitry 299) can be transmitted to the external environment through the opening 108. For example, the output port 211 may be sealed to the opening 108 using a sealing material 279. The opening 108 may be an open port or may be covered by a mesh structure 289 spanning the opening 108 and permeable to sound and air. In various specific embodiments, the mesh structure 289 may primarily be: a decorative mesh structure preventing the interior of the loudspeaker 200 and / or housing 106 from being seen through the opening 108; a passively functional mesh structure preventing dust and / or other debris from entering the interior of the loudspeaker 200 and / or housing 106 through the opening 108; and / or an actively functional mesh structure forming part of an airflow sensor for the electronic device 100.

[0034] For example, such as Figure 2As shown, the electronic device 100 may include an airflow sensor 203 at least partially disposed within the output port 211. In one or more embodiments, the mesh structure 289 may be part of the airflow sensor 203, or may be separate from the airflow sensor 203. Figure 2 In the example, arrow 217 indicates an airflow path that, when diaphragm 214 is actuated to produce sound, diaphragm 214 can push air from front cavity 208 along this airflow path through output port 211 and opening 108. The narrower cross-sectional area of ​​output port 211 relative to the cross-sectional area of ​​front cavity 208 causes the airflow to accelerate along the airflow path indicated by arrow 217. Airflow sensor 203 can obtain airflow measurement data corresponding to the speed of airflow through output port 211 and provides sensor signals (e.g., airflow measurement results, and / or sensor signals from which speaker circuit 219 and / or device circuit 299 derive the airflow measurement results) to speaker circuit 219 and / or device circuit 299.

[0035] For example, Figure 3 A schematic diagram of an electronic device 100 is shown, illustrating audio output correction operation using airflow feedback from an airflow sensor 203. (See diagram for reference.) Figure 3 As shown, the electronic device 100 may include an audio processor 300 (e.g., Figure 2 The specific implementation of speaker circuit 219 and / or device circuit 299, and / or implemented in software running on speaker circuit 219 and / or device circuit 299. As shown, audio processor 300 may receive audio content (e.g., music content, audio portion of video content, podcasts, or any other audio content) from device memory or from device circuit 299, and may also receive sensor signals from airflow sensor 203. In one or more implementations, audio processor 300 may generate an audio output signal and provide the audio output signal to speaker 200. Speaker 200 (e.g., speaker circuit 219 and / or circuit 221) can then be activated by making... Figure 2 The diaphragm 214 moves to generate audio output (e.g., sound), and directs the audio output to the external environment of the electronic device 100 via output port 211. In one or more embodiments, the audio processor 300 may also adjust and / or otherwise modify the audio output signal based on sensor signals from the airflow sensor 203.

[0036] For example, when a sensor signal from airflow sensor 203 indicates that the speed and / or amount of airflow through output port 211 is above a threshold, audio processor 300 may reduce the power of one or more frequencies of the audio output signal. In various specific implementations, the threshold may be a fixed predetermined value, or the threshold may be an adaptive threshold that depends on the audio content and / or one or more output settings, such as the amount of audio output.

[0037] As mentioned above Figure 2 As discussed, in one or more specific embodiments, the mesh structure 289 spanning the opening 108 may form part of the airflow sensor 203. For example, as Figure 4 As shown, the mesh structure 289 may include a mesh of braided wire structure 404. In one or more embodiments, the mesh structure 289 may also include a frame structure 406. Figure 4 In the example, frame structure 406 is shown as two opposite long edges along mesh structure 289. However, in various embodiments, frame structure 406 may extend along any portion or any number of portions of mesh structure 289, or extend continuously around the entire perimeter of mesh structure 289. In one or more embodiments, openings between braided wire structures 404 may allow sound and airflow (e.g., sound and airflow generated by the operation of speaker 200) to pass through mesh structure 289.

[0038] However, the mesh structure 289 also blocks airflow in the direction indicated by arrow 217, causing the air pressure (Pin) on the inner side 400 of the mesh structure 289 to increase or decrease by an amount corresponding to an increase or decrease in airflow than the pressure (Pout) on the outer side 402 of the mesh structure 289. In one or more embodiments, this pressure difference across the entire mesh structure 289 caused by the airflow generated by the speaker 200 may cause a measurable deflection and / or deformation of the mesh structure 289.

[0039] As an example, Figure 5 , Figure 6 and Figure 7 An exemplary effect of airflow on the mesh structure 289 is shown, and these effects can be measured to measure the airflow path through the output port 211 of the speaker 200 and the opening 108 in the housing 106. As an example, Figure 5 The following specific embodiment is shown: a first mounting structure 506 (e.g., part of frame structure 406) on a first end of mesh structure 289 is fixed (e.g., fixed to the inner edge of opening 108 in housing 106), and a second mounting structure 508 (e.g., part of frame structure 406) on the opposite second end of mesh structure 289 is movable. Figure 5As shown, in this specific embodiment, the higher pressure Pin on the inner side 400 of the mesh structure 289 can cause the mesh structure 289 to rotate in a cantilever motion around the fixed end of the mesh structure, as indicated by arrow 500.

[0040] As another example, Figure 6 The following specific implementation is shown: a first mounting structure 506 (e.g., part of frame structure 406) on a first end of mesh structure 289 and a second mounting structure 508 (e.g., part of frame structure 406) on the opposite second end of mesh structure 289 are both movable (e.g., movably mounted on or near the opposite side of the inner edge of opening 108), such that the entire mesh structure is movable, as indicated by arrow 600. As another example, Figure 7 The following specific implementation is shown: a first mounting structure 506 (e.g., part of frame structure 406) on a first end of mesh structure 289 and a second mounting structure 508 (e.g., part of frame structure 406) on the opposite second end of mesh structure 289 are both fixed (e.g., fixedly mounted on or near the opposite side of the inner edge of opening 108), such that the entire mesh structure is fixed, and one or more braided structures in braided wire structure 404 are able to deform or deflect due to the airflow / pressure difference of the entire mesh structure, as indicated by arrow 700.

[0041] In order to measure, such as Figure 5 or Figure 6 The deflection of the mesh structure 289 shown or as Figure 7 The example illustrates how deformation or deflection of the mesh structure 289 can integrate it into an airflow sensor. For example, the mesh structure 289 can be integrated into the airflow sensor 203 by coupling it to one or more electrical (conductive) leads and / or by mounting and / or supporting it using piezoelectric materials. For example, in various specific embodiments, electronic device 100 (see...) Figure 1 The device may include a housing 106 that houses and has: an opening 108; a mesh structure 289 that spans the opening 108; a speaker 200 disposed within the housing 106 and having an output port 211 aligned with the opening 108 in the housing 106; and an airflow sensor 203 that is at least partially formed by the mesh structure 289.

[0042] For example, Figure 8 The following specific implementation is shown: where the airflow sensor 203 includes a piezoelectric mount 900 that couples the edge of the mesh structure 289 to the inner edge 905 of the opening 108. For example, the piezoelectric mount 900 may be a frame structure 406 using a piezoelectric material (e.g., Figure 8In a specific implementation (as in the example), the piezoelectric mount 900 may be mounted to the frame structure 406 (e.g., between the frame structure 406 and the inner edge 905 of the opening 108). Figure 8 In the example, the piezoelectric mount 900 can be a single-crystal piezoelectric structure (e.g., a piezoelectric structure that generates a signal when deformed in one direction). Figure 8 As illustrated, when one or more braided structures in braided structure 404 deform or deflect (as indicated by arrow 700), the deformation or deflection can pull on piezoelectric mount 900, causing a corresponding deformation of piezoelectric mount 900, as indicated by arrow 903. As shown, airflow sensor 203 may include one or more electrical leads 902 (e.g., conductive leads) coupled to piezoelectric mount 900 for reading an electrical response to deformation of piezoelectric mount 900, which can be used to determine the velocity and / or amount of airflow. In various specific embodiments, electrical leads 902 may be implemented as wire leads or may be embedded in a structure or substrate, such as in a flexible printed circuit, and one or more piezoelectric mounts in piezoelectric mount 900 may be communicatively coupled to speaker circuitry 219 and / or device circuitry 299. Electronic device 100 (e.g., audio processor 300) can then adjust the audio output of speaker 200 based on the measured velocity and / or amount of airflow. It should be understood that Figure 7 and Figure 8 The deformation and / or deflection of the braided wire structure 404 shown are enlarged for illustrative purposes and may be smaller than depicted in these figures in the implemented device (e.g., in some specific implementations so small that they are not noticeable without the use of strain gauges and / or piezoelectric sensing elements).

[0043] exist Figure 8 In the example, the two ends of the mesh structure 289 are fixed (e.g., fixed to the inner edge 905 of the frame structure 406 and / or the opening 108), and the deformation and / or deflection of the braided wire structure 404 are detectable due to the force (tension) generated on the fixed piezoelectric mount 900. Figure 9 and Figure 10 Another example is shown, in which the mesh structure 289 includes a piezoelectric mount 1004 that is rotatably supported and / or attached to a first end of the mesh structure 289 adjacent to a first side of the opening 108 (e.g., at a first mounting structure 506, which may be implemented as a first part of a frame structure 406)).

[0044] In this example, the first end of the mesh structure 289 is rotatably attached to the piezoelectric mount 1004, and the opposite second end of the mesh structure (e.g., at the second mount 508, as shown) Figure 5(As shown) can move relative to the second side opposite to the opening (as shown) Figure 5 (As indicated by arrow 500 in the image). In this example, the piezoelectric mount 1004 may be formed of a bicrystalline piezoelectric structure including a first piezoelectric layer 1006 and a second piezoelectric layer 1007. Figure 9 and Figure 10 As shown, the tension / compression axes on the first piezoelectric layer 1006 and the second piezoelectric layer 1007 can be adjusted according to the movement of the opposite second ends of the mesh structure 289 (e.g., Figure 5 The rotation of the mesh structure 289 caused by (as indicated by arrow 500) (e.g., as...) Figure 9 and Figure 10 (As indicated by arrow 600 in the diagram) and offset. In one or more embodiments, the electrical signals generated by the first piezoelectric layer 1006 and the second piezoelectric layer 1007 due to the compressive and tensile forces shown can be used to detect rotation of the bending detection mesh structure 289 based on the detected piezoelectric mount 1004. For example, in Figure 9 In this configuration, the rotation of the mesh structure 289 causes compression of the first piezoelectric layer 1006 and tension on the second piezoelectric layer 1007. This compression and tension generate corresponding electrical signals, which can be read out by the electrical (conductive) lead 902. Figure 10 In the example, the opposite rotation of the mesh structure 289 can cause tension on the first piezoelectric layer 1006 and compression on the second piezoelectric layer 1007. This tension and compression can generate corresponding electrical signals, which can be read by the electrical (conductive) lead 902. Because the rotation of the mesh structure 289 depends on the speed and / or amount of airflow through the mesh structure generated by the speaker 200, the electrical signal from the piezoelectric mount 1004 can be used to determine the speed and / or amount of airflow through the airflow path including the output port 211 and the opening 108. The electronic device 100 (e.g., the audio processor 300) can then adjust the audio output of the speaker 200 based on the measured speed and / or amount of airflow.

[0045] exist Figure 9 and Figure 10 In the example, the piezoelectric mount 1004 is mounted to the fixed end of the mesh structure 289 (with opposite movable ends) such that tension and compression of the piezoelectric mount 1004 are generated at or near the axis of rotation of the cantilever movement of the mesh structure (e.g., rotational movement about the piezoelectric mount 1004).

[0046] exist Figure 9 and Figure 10 In the example, the piezoelectric mount 1004 on one side of the mesh structure 289 is used to measure the rotational deflection of the mesh structure 289. However, as... Figure 11As shown, in one or more other embodiments, the piezoelectric mount 1004 can be used to mount the two ends of the mesh structure 289 adjacent to the opening 108 (e.g., adjacent to the inner edge 905 of the opening). In this embodiment, the layers of the piezoelectric mount 1004 (such as...) Figure 9 and Figure 10 Tension and / or compression on the first piezoelectric layer 1006 and / or the second piezoelectric layer 1007 (shown) can generate electrical signals that can be used to measure the overall deflection of the mesh structure 289 (as indicated by arrow 600). Figure 9 , Figure 10 and Figure 11 In the example, the piezoelectric mount 1004 is disposed between the edge of the mesh structure 289 and the inner edge 905 of the opening 108. In one or more other embodiments, the piezoelectric mount 1004 may be coupled to the mesh structure 289 in other arrangements such as being coupled to the top surface of the end of the mesh structure 289 or the bottom surface of the end of the mesh structure 289, or any other arrangement in which rotation and / or linear deflection of the mesh structure 289 causes a response in the piezoelectric material of the piezoelectric mount.

[0047] exist Figures 8-11 The example describes an arrangement in which one or more portions of the mesh structure 289 are mounted to or near the opening 108 by one or more piezoelectric mounts. However, it should also be understood that piezoelectric structures and / or materials may be coupled to the mesh structure 289 for detecting deflection of the mesh structure 289 and / or a portion thereof, without using piezoelectric material as the mounting structure (e.g., mounting the mesh structure 289 at, near, or within the opening 108 by using mounting structures and / or materials other than the piezoelectric material coupled to the mesh structure for sensing).

[0048] Figure 12 Another exemplary embodiment of the airflow sensor 203 is shown, wherein the airflow sensor 203 includes one or more capacitive sensors that are separate from and / or spaced apart from the movable ends of the mesh structure 289. For example, as Figure 12As shown, a first mounting structure 506 (which may be implemented as part of a frame structure 406) can be mounted to an elastomeric structure 1202 that elastically couples the movable end of the mesh structure 289 to the fixedly positioned capacitive sensor 1200. In this example, a second mounting structure 508 (which may be implemented as part of a frame structure 406) can be mounted to the elastomeric structure 1202 that elastically couples the movable end of the mesh structure 289 to the fixedly positioned capacitive sensor 1200. The elastomeric structure 1202 may be formed of an elastomeric insulating material (e.g., rubber or foam) or an elastomeric dielectric material that enhances the capacitance change between the first mounting structure 506, the second mounting structure 508, and the corresponding capacitive sensor 1200. In one or more other embodiments, the elastomeric material may be disposed between the end of the mesh structure 289 and the inner edge 905 of the opening 108, and the first mounting structure 506 and the second mounting structure 508 may be separated from the corresponding capacitive sensor 1200 by an air gap.

[0049] exist Figure 12 In the example, the overall movement of the mesh structure 289 (e.g., due to airflow generated by the speaker 200) can cause the elastomeric structure 1202 to stretch (e.g., as indicated by arrow 1204) and allow the first mounting structure 506 and the second mounting structure 508 to move away from and / or toward the capacitive sensor 1200 (e.g., as indicated by arrow 600). In a specific embodiment where the first mounting structure 506 and the second mounting structure 508 are formed of a conductive material (e.g., metal), the resulting change in the distance between the first mounting structure 506 and the second mounting structure 508 and the corresponding capacitive sensor 1200 can cause a change in capacitance between the first mounting structure 506 and the second mounting structure 508 and the corresponding capacitive sensor 1200, which can be detected using the electrical lead 902. Because the movement of the mesh structure 289 depends on the velocity and / or amount of airflow generated by the speaker 200 through the mesh structure, the electrical signal from the capacitive sensor 1200 can be used to determine that the velocity and / or amount of airflow through the airflow path including the output port 211 and the opening 108 is measurable. Then, the electronic device 100 (e.g., the audio processor 300) can adjust the audio output of the speaker 200 based on the measured speed and / or amount of airflow.

[0050] exist Figures 9-12 In one example, deformation and / or deflection of the mesh structure 289 can be measured to determine the speed and / or amount of airflow through the mesh structure (e.g., and therefore through the airflow path including the output port 211 and the opening 108). However, other specific implementations are also contemplated, in which the mesh structure 289 is substantially fixed and non-deformable and forms part of an airflow sensor for the speaker 200 and / or electronic device 100.

[0051] For example, Figure 13 This illustrates a specific implementation where the airflow sensor 203 is implemented as an anemometer partially formed by a mesh structure 289. Figure 13 In this example, the heating element 1300 (e.g., a drawn wire element) extends across the airflow path indicated by arrow 217 at a location inside the mesh structure 289 (e.g., on the inner side 400 of the mesh structure 289). In this example, the heating element 1300 may be mounted in the front cavity 208 of the mesh structure 289 and the speaker 200 (see [link to previous example]). Figure 2 The airflow path is located between the output port 211 and the opening 108 in the housing 106.

[0052] For example, Figure 14 A cross-sectional side view of a portion of an electronic device 100 is shown. In an exemplary embodiment, a heating element 1300 is mounted in a front cavity 208 disposed between the mesh structure 289 and the speaker 200 (see [link]). Figure 2 At the location between ), and across the airflow path including the output port 211 and the opening 108 in the housing 106. Figure 14 In the example, conductive lead 1304 is formed from conductive traces in flexible circuit 1402. Conductive lead 1304 can couple mesh structure 289 to a circuit (e.g., speaker circuit 219 and / or device circuit 299) configured to measure the change in resistance in mesh structure 289 due to heat transfer from heating element to mesh structure caused by airflow through the airflow path indicated by arrow 217.

[0053] In this example, the flexible circuit 1402 may also include traces that provide current through the heating element 1300. For example, the heating element 1300 may be an exposed, drawn, and / or thinned portion of the conductive traces of the flexible circuit 1402, which generates heat due to the received current and the relative thinness of the heating element 1300 relative to the thickness of the traces in the flexible circuit. In this example, the mesh structure 289 and / or the heating element 1300 may be supported by a mounting structure 1400 (e.g., an insulating structure separating the mesh structure 289 from the heating element 1300). However, this is merely illustrative, and in other specific embodiments, the mesh structure may be mounted directly to or near the inner edge of the opening 108, and the heating element 1300 may be mounted separately across the airflow path.

[0054] exist Figure 13 and Figure 14In the example, heat generated by heating element 1300 can be transferred to air passing through heating element 1300 toward mesh structure 289 in the direction indicated by arrow 217. The heated air can then transfer a portion of its heat to mesh structure 289. The amount of heat transferred from heating element 1300 to mesh structure 289 by the airflow will increase or decrease accordingly with an increase or decrease in airflow. Therefore, in these specific embodiments, the velocity and / or amount of airflow can be measured by measuring changes in the temperature of mesh structure 289. The temperature of mesh structure can be measured by a temperature sensor (e.g., a thermistor) directly coupled to mesh structure, or by measuring changes in the electrical characteristics (e.g., resistance) of mesh structure using conductive leads 1304 (e.g., conductive locations coupled at a distance from each other on mesh structure). In various specific implementations, the conductive lead 1304 may be an electrical wire lead or may be embedded in a structure such as a flexible printed circuit, and may communicatively couple one or more conductive portions of the mesh structure 289 to the speaker circuit 219 and / or the device circuit 299.

[0055] In various embodiments, the heat generated by the heating element 1300 may be generated by current flowing through the heating element 1300, such as via conductive traces in the flexible circuit 1402 or via other conductive leads to the heating element 1300. However, in one or more other embodiments, the heating element 1300 may be heated via heat transfer from another location in the speaker 200 and / or electronic device 100.

[0056] For example, Figure 15 An example is shown in which the loudspeaker 200 includes a heat pipe structure 1500 that thermally couples the heating element 1300 to the circuitry 221 of the loudspeaker 200 (e.g., the loudspeaker's drive circuitry). Figure 15 The example shows a top view of the speaker 200 and illustrates the possible paths of the heat pipe structure 1500.

[0057] For example, during operation of the loudspeaker 200, the current through the voice coil of circuit 221 and / or the movement of the voice coil relative to one or more magnets in circuit 221 can generate heat. In some embodiments, this heat generated by the drive circuit of the loudspeaker 200 can be dissipated to other structures of the loudspeaker 200 and / or electronic device 100 (e.g., radiated as waste heat or transferred outside the electronic device by conduction or convection). However, in one or more embodiments, a heat pipe structure 1500 (e.g., a thermally conductive structure) can extend from the heating drive circuit of the loudspeaker to the heating element 1300, and thereby conduct heat to the heating element 1300 when the loudspeaker is in operation. Similar to the electrothermal embodiment of the heating element 1300, the heating element 1300 heated via the heat pipe structure 1500 can transfer heat to an airflow moving across the heating element 1300 toward the mesh structure 289, thereby causing measurable temperature changes in the mesh structure 289, which can be measured to determine the speed and / or amount of airflow generated by the loudspeaker 200. The electronic device 100 (e.g., audio processor 300) can then adjust the audio output of the speaker 200 based on the measured speed and / or amount of airflow. Although various examples of sensors in which the mesh structure 289 forms an anemometer embodiment for the airflow sensor 203 are described herein, in other embodiments, sensor lines or other sensing elements may be disposed separately from the heating element 1300, one or both of which may be disposed within the output port 211 of the speaker 200, between the output port 211 and the opening 108, and / or within the opening 108.

[0058] Various examples have been described herein in which the airflow sensor is partly formed by a mesh structure spanning an audio port within the housing of an electronic device. However, other specific implementations of the airflow sensor for electronic devices with speakers are envisioned herein. For example, Figure 16 A top view of a loudspeaker 200 is shown. In a specific embodiment, the airflow sensor 203 for the loudspeaker 200 is partially formed by a conductive trace 1600 having a first portion 1601 and a second portion 1602. The first portion is disposed in the rear cavity and parallel to the front cavity 208 of the loudspeaker 200 (in... Figure 16 (visible in top view) and posterior cavity 212 (see Figure 2The second portion extends from the first side of the separated structure 216, and is disposed in an airflow path (e.g., an airflow path including output port 211 and opening 108). In this example, the first portion 1601 of the conductive trace 1600 may be coupled to speaker circuitry, such as speaker circuitry 219 and / or circuitry 221. For example, the conductive trace 1600 (e.g., including the first portion 1601 and the second portion 1602) may conduct control signals from device circuitry 299 to speaker circuitry 219, from speaker circuitry 219 to circuitry 221 (e.g., to the voice coil of the speaker), and / or from device circuitry 299 to circuitry 221.

[0059] Figure 17 It shows Figure 16 A cross-sectional side view of a portion of the speaker 200. Figure 17 In this example, the conductive trace 1600 includes a third portion 1700 that extends from the rear cavity 212 through the structure 216 to the front cavity 208 at a first location. In this example, the conductive trace 1600 also includes a fourth portion 1702 that extends from the front cavity 208 through the structure 216 to the rear cavity 212 at a second location. As shown, in this specific embodiment, the first portion 1601 is disposed in the rear cavity 212 and parallel to the front cavity 208 of the speaker 200 (in... Figure 16 (visible in top view) and posterior cavity 212 (see Figure 2 The first side 1706 of the separated structure 216 extends, the second part 1602 extends along a portion of the opposite second side 1708 of the structure 216, the third part 1700 extends through the structure 216 in a first position between the first part 1601 and the second part 1602, and the fourth part 1702 extends through the structure 216 in a second position between the first part 1601 and the second part 1602.

[0060] As shown in the figure, in one or more embodiments, the second portion 1602 may be separated from (e.g., spaced apart from) the second side 1708 of the structure 216 to allow airflow above and below the second portion 1602, such that the second portion 1602 is positioned within an airflow path (e.g., an airflow path including the output port 211 and the opening 108). However, in other embodiments, the second portion 1602 may contact and / or be partially embedded within the second side 1708 of the structure 216 along the surface of the second side 1708. In one or more embodiments, the third portion 1700 and the fourth portion 1702 may be segments comprising a continuous trace of the first portion 1601 and the second portion 1602. In one or more other embodiments, the third portion 1700 and the fourth portion 1702 may be formed by conductive vias or other vertical conductive structures within the structure 216 coupled to the first portion 1601 and the second portion 1602 on opposite sides of the structure 216.

[0061] exist Figure 16 and Figure 17 In the example, the airflow through output port 211 can convectively cool the second portion 1602 of conductive trace 1600, corresponding to the speed and / or amount of the airflow. This convective cooling of the second portion 1602 of conductive trace 1600 can cause a measurable resistance change in the second portion 1602, which can be measured to determine the amount of airflow through output port 211. For example, a pilot tone can be applied to measure the heating and / or cooling of the second portion 1602 using knowledge of the delivered power and current resistance of conductive trace 1600. Electronic device 100 (e.g., audio processor 300) can then adjust the audio output of speaker 200 based on the measured speed and / or amount of airflow.

[0062] refer to Figure 2 and Figure 16 Both, such as electronic device 100, may include: a housing 106 having an opening 108; a speaker 200 disposed within the housing 106 and having an output port 211 aligned with the opening 108 in the housing 106; and an airflow sensor 203 disposed in an airflow path including the output port 211 and the opening 108. In this example, speaker 200 includes: a front cavity 208; a rear cavity 212; a structure 216 separating the front cavity 208 and the rear cavity 212; speaker circuitry (e.g., speaker circuitry 219 and / or circuitry 221) disposed in the rear cavity 212; a conductive trace 1600 coupled to the speaker circuitry and having a first portion 1601 and a second portion 1602, the first portion being disposed in the rear cavity 212 and extending parallel to a first side 1706 of the structure 216 separating the front cavity 208 and the rear cavity 212, the second portion being disposed in the airflow path.

[0063] In this example, the electronic device 100 may also include an audio processor 300 (e.g., implemented using speaker circuitry 219 and / or device circuitry 299). The audio processor 300 may measure the velocity of airflow through the airflow path based on resistance changes in the second portion 1602 of the conductive trace 1600. The audio processor 300 may also adjust the audio output of the speaker 200 based on the measured velocity (e.g., by modifying one or more frequencies corresponding to the audio content of the audio output).

[0064] Figure 18 A flowchart illustrating an exemplary process 1800 for operating an electronic device according to a specific implementation of the subject matter is shown. For illustrative purposes, this document primarily refers to... Figures 1-17The process 1800 is described using electronic devices 100, a speaker 200, and an airflow sensor 203. However, the process 1800 is not limited to... Figures 1-17 The process 1800 includes electronic device 100, speaker 200, and airflow sensor 203, and one or more blocks (or operations) of process 1800 may be performed by one or more other components of other suitable devices, including speakers implemented in other electronic devices and / or audio transducers other than speakers. Further for illustrative purposes, some blocks of process 1800 are described herein as occurring sequentially or linearly. However, multiple blocks of process 1800 may occur in parallel. Furthermore, the blocks of process 1800 need not be performed in the order shown, and / or one or more blocks of process 1800 need not be performed and / or may be replaced by other operations.

[0065] like Figure 18 As shown, at block 1802, one or more processors of an electronic device (such as electronic device 100) can operate a speaker (e.g., speaker 200) to produce audio output through the speaker's output port (e.g., output port 211) and through an opening (e.g., opening 108) in the housing of the electronic device (e.g., housing 106), which is aligned with the speaker's output port.

[0066] At block 1804, the electronic device can measure airflow (e.g., airflow velocity and / or airflow amount) in the airflow path, which includes an output port and an opening, using an airflow sensor (e.g., airflow sensor 203). In one or more embodiments, the airflow sensor includes a mesh structure (e.g., mesh structure 289) that spans the opening in the housing. For example, an airflow sensor including a mesh structure may be used as described herein. Figures 8-15 The implementation is described in any of the examples. In one or more other specific embodiments, the airflow sensor may include a portion of a conductive trace comprising another portion disposed in the rear cavity of the speaker. For example, an airflow sensor partially formed by a portion of a conductive trace may be as described herein. Figure 16 and Figure 17 The example implementation is described below.

[0067] At block 1806, the electronic device may provide an airflow signal (e.g., from airflow sensor 203) to one or more processors of the electronic device. The airflow signal may be a raw analog or digital signal (e.g., resistance, voltage, capacitance, current, temperature, etc.) from the airflow sensor from which the speed and / or amount of airflow can be derived, or it may be a processed airflow signal that includes measurements of the speed and / or amount of airflow.

[0068] At block 1808, one or more processors may modify the audio output based on an airflow signal. For example, when a high-speed airflow (e.g., an airflow with a measured velocity exceeding a velocity threshold) is detected using an airflow sensor and / or an airflow signal, one or more processors may apply damping or filtering to one or more frequencies of the audio output to reduce the gain of the audio output, or may otherwise modify the audio output to reduce the velocity and / or amount of air propelled through the output port and / or openings in the device housing. In one or more embodiments, one or more processors may continuously measure the airflow using an airflow sensor during subsequent operation of the speaker and further modify (e.g., increase or decrease the modification) the audio output based on continuous airflow sensor feedback from the airflow sensor.

[0069] Figure 19 An electronic system 1900 is shown that can be used to implement one or more specific embodiments of the subject matter. The electronic system 1900 may be... Figure 1 One or more of the illustrated electronic devices 100, and / or a portion thereof. Electronic system 1900 may include various types of computer-readable media and interfaces for various other types of computer-readable media. Electronic system 1900 includes a bus 1908, one or more processing units 1912, system memory 1904 (and / or buffers), ROM 1910, persistent storage device 1902, input device interface 1914, output device interface 1906, and one or more network interfaces 1916, or subsets and variations thereof.

[0070] Bus 1908 generally represents all system, peripheral, and chipset buses that communicatively connect numerous internal devices of electronic system 1900. In one or more embodiments, bus 1908 communicatively connects one or more processing units 1912 to ROM 1910, system memory 1904, and permanent storage device 1902. One or more processing units 1912 retrieve instructions to be executed and data to be processed from these various memory units in order to perform the processes disclosed in this subject matter. In different embodiments, one or more processing units 1912 may be a single processor or a multi-core processor.

[0071] ROM 1910 stores static data and instructions required by one or more processing units 1912 and other modules of electronic system 1900. On the other hand, persistent storage device 1902 can be a read-write memory device. Persistent storage device 1902 can be a non-volatile memory cell that stores instructions and data even when electronic system 1900 is powered off. In one or more embodiments, mass storage devices (such as magnetic disks or optical disks and their corresponding disk drives) can be used as persistent storage device 1902.

[0072] In one or more embodiments, a removable storage device (such as a floppy disk, flash drive, and its corresponding disk drive) may be used as persistent storage device 1902. Like persistent storage device 1902, system memory 1904 may be a read-write memory device. However, unlike persistent storage device 1902, system memory 1904 may be volatile read-write memory, such as random access memory. System memory 1904 may store any instructions and data that one or more processing units 1912 may need during operation. In one or more embodiments, the processes disclosed in this subject matter are stored in system memory 1904, persistent storage device 1902, and / or ROM 1910. One or more processing units 1912 retrieve instructions to be executed and data to be processed from these various memory units in order to execute the processes of one or more embodiments.

[0073] Bus 1908 is also connected to input device interface 1914 and output device interface 1906. Input device interface 1914 enables a user to transmit information and select commands to electronic system 1900. Input devices that can be used with input device interface 1914 may include, for example, an alphanumeric keypad and pointing devices (also known as "cursor control devices"). Output device interface 1906 enables, for example, the display of images produced by electronic system 1900. Output devices that can be used with output device interface 1906 may include, for example, printers and display devices such as liquid crystal displays (LCDs), light-emitting diode (LED) displays, organic light-emitting diode (OLED) displays, flexible displays, flat panel displays, solid-state displays, projectors, speakers or speaker modules, or any other device for outputting information. One or more embodiments may include devices that act as both input and output devices, such as touchscreens. In these embodiments, the feedback provided to the user can be any form of sensory feedback, such as visual feedback, auditory feedback, or tactile feedback; and input from the user can be received in any form, including acoustic, voice, or tactile input.

[0074] Finally, as Figure 19 As shown, bus 1908 also couples electronic system 1900 to one or more networks and / or one or more network nodes via one or more network interfaces 1916. In this way, electronic system 1900 may be part of a computer network (such as a LAN, wide area network (“WAN”), or intranet), or may be part of a network of networks (such as the Internet). Any or all components of electronic system 1900 may be used in conjunction with the disclosure of this subject matter.

[0075] According to some aspects disclosed in this subject matter, an electronic device is provided, comprising: a housing having an opening; a mesh structure extending across the opening; a speaker disposed within the housing and having an output port aligned with the opening in the housing; and an airflow sensor formed at least partially by the mesh structure.

[0076] According to other aspects disclosed in this subject matter, an electronic device is provided, comprising: a housing having an opening; a speaker disposed within the housing and having an output port aligned with the opening in the housing; and an airflow sensor disposed in an airflow path including the output port and the opening. The speaker includes: a front cavity; a rear cavity; a structure separating the front cavity and the rear cavity; speaker circuitry disposed in the rear cavity; and a conductive trace coupled to the speaker circuitry and having a first portion and a second portion, the first portion being disposed in the rear cavity and extending parallel to a first side of the structure separating the front cavity and the rear cavity, and the second portion being disposed in the airflow path.

[0077] According to other aspects of this disclosure, a method for operating a speaker of an electronic device is provided, the method comprising: operating the speaker by one or more processors of the electronic device to generate an audio output through an output port of the speaker and through an opening in a housing of the electronic device, the opening being aligned with the output port of the speaker; measuring airflow in an airflow path using an airflow sensor disposed in an airflow path including the output port and the opening; providing an airflow signal to the one or more processors of the electronic device; and modifying the audio output by the one or more processors based on the airflow signal.

[0078] The embodiments within the scope of this disclosure may be implemented, in whole or in part, using a tangible computer-readable storage medium (or multiple tangible computer-readable storage media of one or more types) on which one or more instructions are written. The tangible computer-readable storage medium may also be substantially non-transitory.

[0079] Computer-readable storage media can be any storage medium that can be read, written, or otherwise accessed by general-purpose or special-purpose computing devices, including any processing electronics and / or processing circuits capable of executing instructions. For example, without limitation, computer-readable media can include any volatile semiconductor memory, such as RAM, DRAM, SRAM, T-RAM, Z-RAM, and TTRAM. Computer-readable media can also include any non-volatile semiconductor memory, such as ROM, PROM, EPROM, EEPROM, NVRAM, flash memory, nvSRAM, FeRAM, FeTRAM, MRAM, PRAM, CBRAM, SONOS, RRAM, NRAM, track memory, FJG, and Millipede memory.

[0080] Furthermore, computer-readable storage media may include any non-semiconductor memory, such as optical disc storage devices, magnetic disk storage devices, magnetic tape, other magnetic storage devices, or any other medium capable of storing one or more instructions. In one or more embodiments, the tangible computer-readable storage medium may be directly coupled to a computing device, while in other embodiments, the tangible computer-readable storage medium may be indirectly coupled to a computing device, for example, via one or more wired connections, one or more wireless connections, or any combination thereof.

[0081] Instructions can be directly executable or can be used to develop executable instructions. For example, instructions can be implemented as executable or non-executable machine code, or as high-level language instructions that can be compiled to produce executable or non-executable machine code. Furthermore, instructions can also be implemented as data, or may include data. Computer executable instructions can also be organized in any format, including routines, subroutines, programs, data structures, objects, modules, applications, applets, functions, etc. As those skilled in the art will recognize, details including, but not limited to, the number, structure, sequence, and organization of instructions can vary significantly without altering the underlying logic, functionality, processing, and output.

[0082] While the above discussion primarily concerns microprocessors or multi-core processors that execute software, one or more specific implementations are executed by one or more integrated circuits such as ASICs or FPGAs. In one or more specific implementations, such integrated circuits execute instructions stored on the circuit itself.

[0083] The various functions described above can be implemented in digital electronic circuits, computer software, firmware, or hardware. This technology can be implemented using one or more computer program products. Programmable processors and computers can be included in or packaged as mobile devices. The process and logic flow can be executed by one or more programmable processors and one or more programmable logic circuits. General-purpose and special-purpose computing devices, as well as storage devices, can be interconnected via communication networks.

[0084] Some specific implementations include electronic components, such as microprocessors, storage devices, and memories, that store computer program instructions in machine-readable or computer-readable media (or computer-readable storage media, machine-readable media, or machine-readable storage media). Examples of such computer-readable media include RAM, ROM, read-only optical discs (CD-ROM), recordable optical discs (CD-R), rewritable optical discs (CD-RW), read-only digital versatile optical discs (e.g., DVD-ROM, dual-layer DVD-ROM), various recordable / rewritable DVDs (e.g., DVD-RAM, DVD-RW, DVD+RW, etc.), flash memory (e.g., SD cards, mini-SD cards, micro-SD cards, etc.), magnetic and / or solid-state hard disk drives, high-density optical discs, any other optical or magnetic media, and floppy disks. Computer-readable media may store computer programs that can be executed by at least one processing unit and include a set of instructions for performing various operations. Examples of computer programs or computer code include machine code, such as machine code generated by a compiler, and files that include higher-level code that can be executed by a computer, electronic components, or microprocessor using an interpreter.

[0085] While the above discussion primarily concerns microprocessors or multi-core processors that execute software, some implementations are performed by one or more integrated circuits such as application-specific integrated circuits (ASICs) or field-programmable gate arrays (FPGAs). In some implementations, such integrated circuits execute instructions stored on the circuit itself.

[0086] As used in this specification and any claim of this patent application, the terms "computer," "processor," and "memory" refer to electronic or other technical devices. These terms exclude persons or groups of persons. For the purposes of this specification, the terms "display" or "being displayed" mean display on an electronic device. As used in this specification and any claim of this patent application, the terms "computer-readable medium" and "computer-readable media" are entirely limited to tangible, touchable objects that store information in a form readable by a computer. These terms do not include any wireless signals, wired download signals, or any other transient signals.

[0087] Many of the features and applications described above can be implemented as software processes that specify a set of instructions to be recorded on a computer-readable storage medium (also referred to as a computer-readable medium). When these instructions are executed by one or more processing units (e.g., one or more processors, processor cores, or other processing units), the instructions cause the one or more processing units to perform the actions indicated in the instructions. Examples of computer-readable media include, but are not limited to, CD-ROMs, flash drives, RAM chips, hard disk drives, EPROMs, etc. Computer-readable media do not include carrier waves and electrical signals transmitted wirelessly or via wired connections.

[0088] In this specification, the term "software" is intended to include firmware residing in read-only memory or applications stored in magnetic storage devices, which can be read into memory for processing by a processor. Similarly, in some embodiments, multiple software aspects disclosed herein may be implemented as sub-parts of a larger program while retaining the different software aspects disclosed herein. In some embodiments, multiple software aspects may also be implemented as independent programs. Finally, any combination of independent programs that collectively implement the software aspects described herein is within the scope of this disclosure. In some embodiments, when installed to run on one or more electronic systems, a software program defines one or more specific machine implementations that execute and perform the operations of the software program.

[0089] Computer programs (also known as programs, software, software applications, scripts, or code) can be written in any programming language, including compiled or interpreted languages, declarative or procedural languages, and can be deployed in any form, including as standalone programs or as modules, components, subroutines, objects, or other units suitable for use in a computing environment. Computer programs may, but do not necessarily, correspond to files in a file system. A program may be stored as a part of a file containing other programs or data (e.g., one or more scripts stored in a markup language document), in a single file dedicated to the program in its description, or in multiple coordinating files (e.g., a file storing one or more modules, subroutines, or code sections). Computer programs can be deployed to execute on a single computer or on multiple computers located at the same site or distributed across multiple sites and interconnected via a communication network.

[0090] It should be understood that the specific order or hierarchical structure of the blocks in the process disclosed in this invention is an example of an exemplary method. Based on design preferences, it should be understood that the specific order or hierarchical structure of the blocks in the process may be rearranged or all illustrated blocks may be executed. Some of these blocks may be executed simultaneously. For example, in some cases, multitasking and parallel processing may be advantageous. Furthermore, the division of various system components in the above embodiments should not be construed as requiring such division in all embodiments, and it should be understood that program components and systems can generally be integrated together in a single software product or packaged into multiple software products.

[0091] The preceding descriptions are provided to enable those skilled in the art to practice the various aspects described herein. Various modifications to these aspects will be apparent to those skilled in the art, and the general principles defined herein may be applied to other aspects. Therefore, this claim is not intended to be limited to the aspects shown herein, but rather to be consistent with the language of the claim, wherein references to elements in singular values ​​are not intended to mean “one and only one,” but rather “one or more,” unless specifically indicated. Unless otherwise specifically stated, the term “some” means one or more. Male pronouns (e.g., his) include female and neutral pronouns (e.g., her and its), and vice versa. Titles and subtitles (if any) are used for convenience only and do not limit the disclosure of this subject matter.

[0092] The predicates “configured to,” “capable of operating,” and “programmed to” do not imply any specific tangible or intangible modification to a particular subject but are intended to be used interchangeably. For example, a component or a processor configured to monitor and control operations may also mean that the processor is programmed to monitor and control operations or that the processor is operable to monitor and control operations. Similarly, a processor configured to execute code can be interpreted as either programmed to execute code or operable to execute code.

[0093] The phrase "aspect" does not imply that this aspect is essential to the present subject matter or that this aspect applies to all configurations of the present subject matter. Disclosures relating to an aspect may apply to all configurations, or one or more configurations. The phrase "aspect" may refer to one or more aspects, and vice versa. The phrase "configuration" does not imply that this configuration is essential to the present subject matter or that this configuration applies to all configurations of the present subject matter. Disclosures relating to a configuration may apply to all configurations, or one or more configurations. The phrase "configuration" may refer to one or more configurations, and vice versa.

[0094] The word “example” is used in this document to mean “used as an example or illustration.” Any aspect or design described in this document as an “example” is not necessarily to be construed as superior or advantageous to any other aspect or design.

[0095] On one hand, the term "coupled" can refer to direct coupling. On the other hand, the term "coupled" can refer to indirect coupling.

[0096] Terms such as top, bottom, front, back, side, horizontal, and vertical refer to any frame of reference, not the usual gravitational frame of reference. Therefore, such terms can extend upward, downward, diagonally, or horizontally within a gravitational frame of reference.

[0097] All structural and functional equivalents of elements throughout the various aspects described herein that are known or later become apparent to those skilled in the art are expressly incorporated herein by reference and are intended to be covered by the claims. Furthermore, nothing disclosed herein is intended to be made public, regardless of whether such disclosure is expressly stated in the claims. No claim element should be interpreted in accordance with 35 U.S.SC §112(f) unless the element is expressly stated using the phrase “means for…” or, in the case of a method claim, using the phrase “steps for…”. Furthermore, terms such as “comprising,” “having,” etc., are used to a certain extent in the specification or claims, and such terms are intended to be included in a manner similar to how the term “comprising” is interpreted when used as a transitional word in a claim.

Claims

1. An electronic device, comprising: The housing has an opening; A mesh structure that spans the opening; A loudspeaker, the loudspeaker being disposed within the housing and having an output port aligned with the opening in the housing; An airflow sensor, the airflow sensor being at least partially formed by the mesh structure; as well as One or more processors are configured to modify the output of the loudspeaker in response to determining that the speed and / or amount of airflow generated by the loudspeaker and measured by the airflow sensor is higher than an airflow threshold, in order to reduce the speed and / or amount of the airflow.

2. The electronic device according to claim 1, wherein the mesh structure comprises a plurality of braided wire structures.

3. The electronic device of claim 1, wherein the airflow sensor includes a piezoelectric mount that couples the edge of the mesh structure to the inner wall of the opening.

4. The electronic device according to claim 3, wherein the piezoelectric mounting element is a single-crystal piezoelectric structure.

5. The electronic device of claim 1, wherein the airflow sensor includes a piezoelectric mount that is rotatably capable of supporting a first end of the mesh structure adjacent to a first side of the opening.

6. The electronic device of claim 5, wherein the opposite second ends of adjacent mesh structures are movable relative to the opposite second side of the opening.

7. The electronic device of claim 6, wherein the piezoelectric mounting component comprises a bicrystalline piezoelectric structure.

8. The electronic device of claim 1, wherein the airflow sensor includes at least one capacitive sensor separate from the movable end of the mesh structure.

9. The electronic device according to claim 8, further comprising: An elastomer structure that elastically couples the movable end of the mesh structure to the at least one capacitive sensor.

10. The electronic device of claim 1, wherein the airflow sensor comprises an anemometer partially formed by the mesh structure.

11. The electronic device of claim 10, wherein the anemometer includes a heating element disposed between the mesh structure and the front cavity of the speaker and spanning an airflow path including the output port and the opening in the housing.

12. The electronic device according to claim 11, further comprising: At least one conductive lead is coupled between the mesh structure and the circuit, the circuit being configured to measure the change in resistance in the mesh structure caused by heat transfer from the heating element to the mesh structure due to airflow passing through the airflow path.

13. The electronic device of claim 11, wherein the loudspeaker further comprises a heat pipe structure that thermally couples the heating element to the drive circuit of the loudspeaker.

14. An electronic device, comprising: The housing has an opening; and A loudspeaker, the loudspeaker being disposed within the housing and having an output port aligned with the opening in the housing; An airflow sensor is disposed in an airflow path including the output port and the opening, wherein the speaker includes: Anterior cavity; Postcavitary space; A structure that separates the front cavity and the rear cavity; A speaker circuit, wherein the speaker circuit is disposed in the rear cavity; A conductive trace coupled to the speaker circuit and having a first portion and a second portion, the first portion being disposed in the rear cavity and extending parallel to a first side of the structure separating the front cavity and the rear cavity, and the second portion being disposed in the airflow path; An audio processor, the audio processor being configured to: The velocity and / or amount of airflow through the airflow path are measured based on the resistance change in the second portion of the conductive trace; and The speaker's audio output is adjusted based on the measured speed and / or amount to reduce the speed and / or amount of airflow through the airflow path.

15. The electronic device of claim 14, wherein the conductive trace includes a third portion that extends from the rear cavity through the structure to the front cavity at a first location.

16. The electronic device of claim 15, wherein the conductive trace further comprises a fourth portion, the fourth portion extending from the rear cavity through the structure to the front cavity at a second location.

17. A method for operating a speaker of an electronic device, the method comprising: The speaker is operated by one or more processors of the electronic device to produce audio output through the speaker's output port and through an opening in the housing of the electronic device, the opening being aligned with the speaker's output port; The velocity and / or amount of airflow in the airflow path is measured using an airflow sensor disposed in the airflow path including the output port and the opening; Providing an airflow signal to the one or more processors of the electronic device, wherein the airflow signal is based on the speed and / or amount of the airflow; and The audio output is modified by the one or more processors based on the airflow signal to reduce the airflow when the speed and / or amount of airflow is above an airflow threshold, depending on the amount of audio output generated by the speaker.

18. The method of claim 17, wherein the airflow sensor includes a mesh structure that spans the opening in the housing.

19. The method of claim 17, wherein the airflow sensor includes a first portion of a conductive trace, the conductive trace including a second portion disposed in the rear cavity of the speaker.

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