Diagnostic disc with high-vacuum and high-temperature resistant power source

Abstract

A diagnostic disc includes a disc-shaped body having a raised wall encircling an interior of the disc-shaped body and at least one protrusion extending outwardly from the disc-shaped body. The raised wall of the disc-shaped body defines a cavity of the disc-shaped body. A non-contact sensor is attached to each of the at least one protrusion. A printed circuit board (PCB) is positioned within the cavity formed on the disc-shaped body. A vacuum and high temperature resistant power source and a wireless charger and circuitry coupled to each non-contact sensor and including at least a wireless communication circuit and a memory are disposed on the PCB. A cover is positioned over the cavity of the disc-shaped body and shields the PCB, circuitry, power source, and at least a portion of the wireless charger within the cavity from an external environment.

Description

Technical Field

[0001] Some embodiments of this disclosure generally relate to a diagnostic disk having at least one embedded non-contact sensor that allows for in-situ measurements within a vacuum processing chamber and wireless communication with a remote host. Some embodiments of this disclosure generally relate to a power source that is vacuum- and high-temperature resistant and can be used in the diagnostic disks described herein. Background Technology

[0002] Semiconductor substrates are typically processed in vacuum processing systems. These systems include one or more processing chambers, each performing substrate processing operations such as etching, chemical vapor deposition, or physical vapor deposition, which may include heating or cooling the substrate and plasma to aid the processing. Such processing conditions, such as thermal cycling and corrosive plasma, can etch or erode exposed portions of chamber components within the processing chamber. Etched or corroded chamber components are periodically maintained (e.g., cleaned or replaced) after multiple processing cycles (e.g., several hours of processing, referred to as radio frequency (RF) hours) before these components cause inconsistent or undesirable processing results and before particulate contamination of the chamber from component corrosion leads to particulate defects on the substrate. Traditionally, to determine whether to begin maintenance of certain chamber components, the processing chamber is vented and opened to provide access to various chamber components. This venting and disassembly is not only labor-intensive but also results in several hours of lost productivity of the substrate processing equipment during the procedure. Furthermore, exposure inside the processing chamber can cause internal contamination, thus requiring a lengthy requalification process for the processing chamber after it has been opened. Summary of the Invention

[0003] Some embodiments described herein relate to a diagnostic disc, comprising: a disc-shaped body; at least one protrusion extending outwardly from the disc-shaped body; a non-contact sensor attached to each of the at least one protrusion; and a cover. In some embodiments, the disc-shaped body includes a raised wall surrounding the interior of the disc-shaped body, wherein the raised wall of the disc-shaped body defines a cavity in the disc-shaped body. In some embodiments, the diagnostic disc further includes a printed circuit board (PCB) positioned within the cavity in the disc-shaped body; a circuit system disposed on the PCB and coupled to each non-contact sensor; a power source disposed on the PCB; and a wireless charger disposed on the PCB. In some embodiments, the circuit system disposed on the PCB includes at least wireless communication circuitry and memory. In some embodiments, the cover of the diagnostic disc is positioned over the cavity of the disc-shaped body, wherein the cover shields at least a portion of the PCB, circuit system, power source, and wireless charger within the cavity from the external environment.

[0004] Some embodiments described herein relate to a method of operating a diagnostic disc. In some embodiments, the method includes the step of establishing a secure wireless connection with a computing system using the diagnostic disc's wireless communication circuitry before or after placing the diagnostic disc into a processing chamber. In some embodiments, the method further includes the step of generating sensor data of a component disposed within the processing chamber using at least one non-contact sensor of the diagnostic disc. In some embodiments, the method further includes the step of storing the sensor data in the diagnostic disc's memory. In some embodiments, the method further includes the step of wirelessly transmitting the sensor data to the computing system using the wireless communication circuitry. In some embodiments, the method further includes the step of terminating the secure wireless connection with the computing system. In some embodiments, the method further includes the step of clearing the sensor data from the diagnostic disc's memory.

[0005] Some embodiments described herein relate to a method of operating a computing system that wirelessly communicates with a diagnostic disc. In some embodiments, the method includes the step of establishing a wireless connection with the diagnostic disc via the computing system. In some embodiments, the method further includes the step of placing the diagnostic disc into a processing chamber using a robotic arm within a transfer chamber. In some embodiments, the method further includes the step of causing the diagnostic disc to generate sensor data of components in the processing chamber using one or more non-contact sensors of the diagnostic disc. In some embodiments, the method further includes the step of receiving sensor data from the diagnostic disc via the wireless connection via the computing system. In some embodiments, the method further includes the step of analyzing the sensor data via the computing system to determine at least one of component alignment, concentricity, cleanliness, or corrosion. In some embodiments, the method further includes at least one of the following: initiating automatic correction of component alignment or concentricity in response to determining alignment or concentricity misalignment; initiating automatic cleaning of the component in response to determining cleanliness has reached a contamination threshold; or initiating automatic replacement of the component in response to determining corrosion has reached a lifespan end threshold.

[0006] Some embodiments described herein relate to a power unit comprising: a printed circuit board (PCB); a power source coupled to the PCB; and a housing encapsulating at least the power source. In some embodiments, the PCB includes a power management circuitry disposed on the PCB. In some embodiments, the power source has a height of up to about 6 mm. In some embodiments, the power unit is configured to operate in a vacuum of about 0.1 mTorr to about 50 mTorr and a temperature of about -20°C to about 120°C without cracking or exploding.

[0007] Some embodiments described herein relate to a diagnostic disk comprising: a disk-shaped body; a printed circuit board (PCB); a power source coupled to the PCB; a housing encapsulating at least the power source; and a cover positioned above the PCB and the power source. In some embodiments, the power source has a height of up to about 6 mm. In some embodiments, the power source can operate in a vacuum of about 0.1 mTorr to about 50 mTorr and at a temperature of about -20°C to about 120°C without cracking or exploding. In some embodiments, the cover shields the PCB and power source within the interior formed by the disk-shaped body and the cover from the environment outside the disk-shaped body.

[0008] Some embodiments described herein relate to a method of operating a diagnostic disk. In some embodiments, the method includes the step of establishing a secure wireless connection with a computing system using the diagnostic disk's wireless communication circuitry before or after placing the diagnostic disk into a processing chamber. In some embodiments, the method further includes the step of generating sensor data of components disposed within the processing chamber using at least one non-contact sensor of the diagnostic disk, at a vacuum of about 0.1 mTorr to about 50 mTorr and a temperature of about -20°C to about 120°C. In some embodiments, the method further includes the step of wirelessly transmitting the sensor data to the computing system using the wireless communication circuitry. In some embodiments, the diagnostic disk includes: a disk-shaped body; a printed circuit board (PCB); a power source coupled to the PCB; a housing encapsulating at least the power source; and a cover positioned above the PCB and the power source. In some embodiments, the power source has a height of up to about 6 mm. In some embodiments, the power source can operate at a vacuum of about 0.1 mTorr to about 50 mTorr and a temperature of about -20°C to about 120°C without cracking or exploding. In some embodiments, the cover shields the PCB and power source inside the interior formed by the disc-shaped body and the cover from the environment outside the disc-shaped body. Attached Figure Description

[0009] The invention is illustrated by way of example rather than limitation in the accompanying drawings, wherein like reference numerals indicate like elements. It should be noted that different references to "a" or "an" embodiment in this disclosure do not necessarily refer to the same embodiment, and such references mean at least one.

[0010] Figure 1A A simplified top view of an example processing system according to an embodiment of the present disclosure is illustrated.

[0011] Figure 1B The illustration shows an embodiment according to the present disclosure. Figure 1A A schematic cross-sectional side view of the processing chamber.

[0012] Figure 2AThe illustration shows a perspective view of an open diagnostic disk according to an embodiment of the present disclosure.

[0013] Figure 2A1 An enlarged view of a protrusion and a non-contact sensor attached thereto, according to an embodiment of the present disclosure, is illustrated.

[0014] Figure 2B The illustration shows a bottom view of a diagnostic disc according to an embodiment of the present disclosure.

[0015] Figure 2C A side cross-sectional view of a diagnostic disc according to some embodiments of the present disclosure is illustrated.

[0016] Figure 2D The illustration shows a perspective top view of a shielded diagnostic disc according to an embodiment of the present disclosure.

[0017] Figure 2E The illustration shows a side cross-sectional view of a kinematic coupling element in a diagnostic disk for engaging an electrostatic chuck (ESC) wafer lifting rod according to an embodiment of the present disclosure.

[0018] Figure 2F The illustration shows a diagnostic disc positioned downwards on the ESC, a chip lifting lever, and a low-contact area between the kinematic coupling and the ESC, according to one embodiment of the present disclosure.

[0019] Figure 2G The illustration shows a schematic diagram depicting the positions of four non-contact sensors on a diagnostic panel according to an embodiment of the present disclosure.

[0020] Figure 3A The illustration shows a top view of a power source according to an embodiment of the present disclosure.

[0021] Figure 3B The illustration shows a perspective top view of a power source according to an embodiment of the present disclosure.

[0022] Figure 4 This is a flowchart of a diagnostic disk operation method according to an embodiment of the present disclosure.

[0023] Figure 5 This is a flowchart of an operation method of a computing system according to an embodiment of the present disclosure.

[0024] Figure 6A The illustration shows a side cross-sectional view of a diagnostic disk placed on a wafer lifting rod of an electrostatic chuck (ESC) in a processing chamber, according to an exemplary embodiment of the present disclosure.

[0025] Figure 6B This is based on exemplary embodiments of the present disclosure. Figure 6A An exploded view of a portion of the diagnostic disc, where a high-resolution camera captures sensor data from the edges and support rings.

[0026] Figure 6C It is based on the example of this disclosure. Figure 6A An exploded view of a portion of the diagnostic disc, where non-contact sensors capture sensor data from the edges and support rings.

[0027] Figure 7A The illustration shows a top plan view of one of the non-contact sensors disclosed herein, surrounding an edge ring and a support ring of an electrostatic chuck, according to an embodiment of the present disclosure.

[0028] Figure 7B The illustration shows a diagnostic disc with a plurality of non-contact sensors placed thereon, according to an embodiment of the present disclosure, and a perspective view of the line of sight from the non-contact sensors to the chamber component below.

[0029] Figure 8 This is an example computing device that can be used as a controller for operating an electronic device processing system according to embodiments of the present disclosure. Detailed Implementation

[0030] Embodiments of this disclosure provide diagnostic disks and methods for performing in-situ diagnostic scanning of components within a processing chamber without venting the processing chamber or opening the processing chamber lid. Such embodiments benefit from in-situ diagnostic methods to determine what maintenance (if any) should be performed on the components scanned within the processing chamber. This in-situ diagnostics provides improved processing results without interrupting the processing of the substrate processing system or the processing chamber and / or disassembling the substrate processing system or the processing chamber. This process saves valuable man-hours and avoids downtime for the substrate processing system. Furthermore, the embodiments prevent the interior of the processing chamber from being exposed to the atmosphere or the external environment, thus mitigating contamination of the processing chamber.

[0031] In-situ diagnostic scanning generates sensor data about various components within the processing chamber using non-contact sensors (e.g., cameras, position sensors, etc.) on a diagnostic panel. The sensor data can be wirelessly transmitted to a computing system using the diagnostic panel, which analyzes the data and determines subsequent actions. For example, the generated sensor data can provide information about the components, such as: placement (alignment and / or concentricity and / or gap measurement), cleanliness, corrosion, metrological data, component damage, and component jamming. Based on this sensor data, the computing system can initiate automatic component placement correction, automatic component cleaning, and automatic component replacement.

[0032] In this document, the term "in situ" means "in place," implying that the processing chamber remains intact and does not need to be disassembled or exposed to the atmosphere in order to perform the disclosed diagnostic scans. In situ diagnostic scans can be performed between substrate processing steps.

[0033] The ability to perform in-situ diagnostic scans and, in some cases, in-situ subsequent maintenance improves wafer yield and tooling time utilization in customer manufacturing facilities (fabs). Furthermore, in-situ diagnostics can track the condition of various components within the processing chamber and initiate appropriate component maintenance at the right time based on empirical data rather than guesswork.

[0034] In some embodiments, the diagnostic disk described herein is capable of communicating with a designated computing system. In embodiments, the diagnostic disk establishes a secure wireless connection with the designated computing system using wireless communication circuitry within the diagnostic disk, generates sensor data for components located within the processing chamber using non-contact sensors on the diagnostic disk, optionally stores the sensor data in the diagnostic disk's memory, wirelessly transmits the sensor data to the designated computing system using the wireless communication circuitry, terminates the secure wireless connection with the designated computing system, and clears the sensor data from the diagnostic disk's memory. In some embodiments, the diagnostic disk includes a security feature according to which, after a secure wireless connection with the designated computing system has been established and after the secure wireless connection has been terminated, the diagnostic disk can be operated by receiving software from the designated computing system. The diagnostic disk can erase itself (i.e., the sensor data and the software received from the designated computing system, if applicable) so that the sensor data generated by the diagnostic disk cannot be retrieved. If the diagnostic disk receives software from the designated computing system, such software is responsive to commands from its designated computing system.

[0035] The diagnostic disc described herein may include a disc-shaped body comprising a raised wall surrounding the interior of the disc-shaped body, wherein the raised wall defines a cavity in the disc-shaped body. At least one protrusion may extend generally horizontally from the disc-shaped body. At least one non-contact sensor may be attached to each of the at least one protrusion. The diagnostic disc may further include built-in illumination. The cavity of the disc-shaped body may include a printed circuit board (PCB) having at least a power source, a wireless charger, and a circuit system disposed thereon.

[0036] The power source within the disk-shaped body is resistant to vacuum and / or high temperatures, and will not deform, crack, or explode upon exposure to such conditions. The power source itself, or together with the PCB, may be further encapsulated in a hermetically sealed housing to minimize outgassing and / or prevent contamination of the processing chamber. If the power source fails and cracks under vacuum and / or high temperatures, the structural materials of the power source may remain contained within the housing rather than contaminating the processing chamber or diagnostic disk. The power source may also be free of heavy metals (such as lithium), allowing for easy cleaning of the power source's structural materials from the processing chamber or diagnostic disk even if the power source fails and cracks under vacuum and / or high temperatures, contaminating the diagnostic disk and / or processing chamber.

[0037] The power source can be placed within the cavity formed by the disc-shaped body and the cover of the diagnostic disc described herein, thereby separating the power source from the high-vacuum, high-temperature, and corrosive environment in which the diagnostic disc can operate. Containing the power source within the internal cavity of the diagnostic disc and further encapsulating it within a housing (e.g., a semi-rigid insulator) advantageously controls the outflow or leakage of electrolytes or other materials from the power source structure into the surrounding environment (minimizing potential stress by contaminating devices approaching the power source).

[0038] In some embodiments, the power source may include multiple capacitors arranged in parallel, series, or a combination of the foregoing. Therefore, the power source can be scalable and designed to achieve target properties such as output voltage, energy density, runtime, charge-to-run time ratio, internal series resistivity, dimensions (e.g., width, length, and height), weight, operating parameters (e.g., temperature and pressure), capacitance, charging current, discharging current, discharging voltage, leakage current, minimum stored energy, etc. In some embodiments, the power source may be wirelessly charged or wired. In some embodiments, the power source may have a charge-to-run time ratio of about 1:2 to about 3:2 to charge sufficiently quickly while also providing sufficient power to any of the diagnostic panels described herein for a duration of about 15 minutes to about 60 minutes during its operation. The charge-to-run time ratio should not be construed as limiting. In some embodiments, the charging time to running time ratio may be within a range of about 1:100, about 1:75, about 1:50, about 1:25, about 1:10, about 1:10, about 1:5, or about 1:1 to about 5:1, about 10:1, about 15:1, about 25:1, about 50:1, about 75:1, or about 100:1, or any subrange or a single value thereof.

[0039] In this embodiment, the power source is non-toxic, travel-on-air, durable to provide a long life cycle, and / or removable for easy maintenance and / or replacement.

[0040] The size and mass of the diagnostic tray described herein are similar to those of the wafers processed in the wafer processing system, allowing the diagnostic tray to be transported through the wafer processing system in the same manner as the wafers are transported through it. The structural materials of the diagnostic tray and the coatings disposed thereon are designed to withstand the vacuum and / or high temperature and / or corrosive environment of the processing chamber.

[0041] At least one protrusion and at least one non-contact sensor on the diagnostic tray described herein can be positioned in a location that allows the diagnostic tray to be picked up and transferred via a wafer processing system using existing robotic arms (e.g., existing factory interface robotic arms and existing transfer chamber robotic arms). Another consideration for the positioning of the protrusion and at least one non-contact sensor is to provide a clear line of sight from at least one non-contact sensor to at least a portion of the scanned component.

[0042] Figure 1A A simplified top view of an example processing system 100 according to an embodiment of the present disclosure is illustrated. The processing system 100 includes a factory interface 91 to which multiple substrate cassettes 102 (e.g., front-opening standard bays (FOUPs) and side-storage bays (SSPs)) are coupled for transferring substrates (e.g., wafers, such as silicon wafers) into the processing system 100. In an embodiment, in addition to wafers, the substrate cassettes 102 include a diagnostic disk 110. The diagnostic disk 110 can be used to generate data regarding various components within one or more processing chambers 107 (such as, but not limited to, alignment, concentricity, etching, cleanliness, metering data, whether components are damaged or stuck, etc.). In one embodiment, the diagnostic disk 110 can be used to generate data related to the placement or maintenance of a processing kit ring (not shown). The factory interface 91 can also use the same functions explained for transferring wafers to transfer the diagnostic disk 110 into and out of the processing system 100. Similarly, the factory interface 91 can use the same functions used for transferring wafers to transfer certain replacement parts (e.g., processing kit rings) into and out of the processing system 100.

[0043] The processing system 100 may also include first vacuum ports 103a and 103b, which couple the factory interface 91 to corresponding stations 104a and 104b, which may be, for example, degassing chambers and / or loading locks. Second vacuum ports 105a and 105b are coupled to corresponding stations 104a and 104b and are disposed between stations 104a and 104b and transfer chamber 106 to facilitate substrate transfer into transfer chamber 106. Transfer chamber 106 includes a plurality of processing chambers 107 (also referred to as processing chambers) disposed around and coupled to transfer chamber 106. Processing chambers 107 are coupled to transfer chamber 106 via corresponding ports 108 (such as slit valves).

[0044] Processing chamber 107 may include one or more of the following: etching chamber, deposition chamber (including atomic layer deposition, chemical vapor deposition, physical vapor deposition, or plasma-enhanced versions thereof), annealing chamber, etc. Processing chamber 107 may include components that occasionally undergo replacement, alignment and / or concentricity correction, maintenance, etc. Currently, certain actions within the processing chamber (e.g., replacing certain components, correcting the alignment and / or concentricity of certain components, assessing corrosion, or assessing cleanliness and initiating cleaning of the processing chamber) may involve an operator disassembling the processing chamber to facilitate said actions. Processing system 100 is configured to facilitate some of these actions without requiring an operator to disassemble processing chamber 107.

[0045] In various embodiments, the factory interface 91 includes a factory interface robot 111. The factory interface robot 111 may include a robotic arm and may be or include a Selective Compliant Component Arm (SCARA) robot, such as a 2-link SCARA robot, a 3-link SCARA robot, a 4-link SCARA robot, etc. The factory interface robot 111 may include an end effector at the end of the robotic arm. The end effector may be configured to pick up and handle specific objects, such as wafers. Alternatively, the end effector may be configured to handle objects, such as diagnostic disks. In some embodiments, the end effector may be configured to handle chamber components requiring maintenance or placement correction, such as handling kit rings. The factory interface robot 111 may be configured to transfer objects between substrate cassette 102 (e.g., FOUP and / or SSP) and stations 104a, 104b.

[0046] The transfer chamber 106 includes a transfer chamber manipulator 112. The transfer chamber manipulator 112 may include a robotic arm with an end effector at its end. The end effector may be configured to handle specific objects, such as wafers and diagnostic discs. The transfer chamber manipulator 112 may be a SCARA manipulator, but in some embodiments may have fewer links and / or fewer degrees of freedom than the factory interface manipulator 111.

[0047] Controller 109 (also referred to herein as a “computing system” or “designated computing system”) controls various aspects of processing system 100 and may include or be coupled to wireless access point (WAP) device 129. WAP device 129 may include wireless technology and one or more antennas for communicating with diagnostic disk 110. Controller 109 may be and / or include a computing system such as a personal computer, server computer, programmable logic controller (PLC), microcontroller, etc. Controller 109 may include one or more processing devices, such as microprocessors, central processing units, etc. More specifically, the processing device may be a complex instruction set computing (CISC) microprocessor, a reduced instruction set computing (RISC) microprocessor, a very long instruction word (VLIW) microprocessor, or a processor implementing other instruction sets or a combination of instruction sets. The processing device may also be one or more special-purpose processing devices, such as application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), digital signal processors (DSPs), network processors, etc.

[0048] Although not illustrated, controller 109 may include data storage devices (e.g., one or more disk drives and / or solid-state drives), main memory, static memory, network interface, and / or other components. Controller 109 may execute instructions to perform any one or more of the methods and / or embodiments described herein, including image or sensor data processing and analysis, image processing algorithms, machine learning (ML) algorithms that generate one or more trained machine learning models, deep ML algorithms, and other imaging algorithms for analyzing sensor data to detect, for example, alignment, concentricity, corrosion, cleanliness, whether components within processing chamber 107 are stuck or damaged, etc. Instructions may be stored on a computer-readable storage medium, including main memory, static memory, secondary storage, and / or processing means (during instruction execution). In some embodiments, training data for training ML models may be obtained by imaging components that have undergone some type of maintenance (position correction, replacement, cleaning, etc.) using a scanning device or other type of sensor or camera.

[0049] Figure 1B The illustration shows an embodiment according to the present disclosure. Figure 1A A schematic cross-sectional side view of a processing chamber 107. The processing chamber 107 includes a chamber body 101 that together defines an internal volume 130 and a cover 133 disposed thereon. The chamber body 101 is typically coupled to an electrical ground 137. A substrate support assembly 180 is disposed within the internal volume to support a substrate thereon during processing. The processing chamber 107 also includes an inductively coupled plasma device 142 for generating plasma 132 within the processing chamber 107, and an example controller 155 suitable for controlling the processing chamber 107.

[0050] The substrate support assembly 180 includes one or more electrodes 153 coupled to a bias source 119 via a matching network 127 to facilitate biasing of the substrate during processing. The bias source 119 is illustratively a source of RF energy up to about 1000W (but not limited to about 1000W) at a frequency of, for example, about 13.56MHz, although other frequencies and powers may be provided as needed for a particular application. The bias source 119 is capable of generating either continuous or pulsed power, or both. In some examples, the bias source 119 may be a DC or pulsed DC source. In some examples, the bias source 119 is capable of providing multiple frequencies. One or more electrodes 153 may be coupled to an adsorption power source 160 to facilitate adsorption of the substrate during processing.

[0051] An inductively coupled plasma device 142 is disposed above a cover 133 and configured to inductively couple RF power into a processing chamber 107 to generate plasma within the processing chamber 107. The inductively coupled plasma device 142 includes a first coil 116 and a second coil 118 disposed above the cover 133. The relative position, diameter ratio, and / or number of turns in each coil 116, 118 can be adjusted as needed to control the profile or density of the formed plasma. Each of the first coil 116 and the second coil 118 is coupled to an RF power supply 138 via an RF feed structure 136 and a matching network 114. The RF power supply 138 is illustratively capable of generating up to approximately 4000 W (but not limited to approximately 4000 W) at tunable frequencies ranging from 50 kHz to 13.56 MHz, although other frequencies and powers may be used as required by a particular application.

[0052] In some examples, a power divider 135 (such as a split capacitor) may be provided between the RF feed structure 136 and the RF power supply 138 to control the relative amount of RF power supplied to the respective first and second coils. In some examples, the power divider 135 may be incorporated into the matching network 114.

[0053] A heater element 113 may be disposed on top of a cover 133 to facilitate heating of the interior of the processing chamber 107. The heater element 113 may be disposed between the cover 133 and a first coil 116 and a second coil 118. In some examples, the heater element 113 may include a resistance heating element and may be coupled to a power source 115, such as an AC power source, configured to provide sufficient energy to control the temperature of the heater element 113 within a desired range.

[0054] During operation, a substrate (such as a semiconductor wafer or other substrate suitable for plasma processing) is placed on a substrate support assembly 180, and processing gas is supplied from a gas panel 120 via an inlet port 121 into the internal volume of the chamber body 101. The processing gas is ignited into plasma 132 in the processing chamber 107 by applying power from an RF power source 138 to a first coil 116 and a second coil 118. In some examples, power from a bias source 119 (such as an RF or DC source) may also be supplied to electrodes 153 within the substrate support assembly 180 via a matching network 127. The pressure inside the processing chamber 107 can be controlled using a valve 129 and a vacuum pump 122. The temperature of the chamber body 101 can be controlled using a liquid-containing conduit (not shown) that runs through the chamber body 101.

[0055] Processing chamber 107 includes a controller 155 to control the operation of processing chamber 107 during processing. Controller 155 includes a central processing unit (CPU) 123, memory 124, and support circuitry 125 for the CPU 123 and facilitating the control of components in processing chamber 107. Controller 155 can be one of any type of general-purpose computer processor suitable for industrial environments for controlling various chambers and subprocessors. Memory 124 stores software (source code or object code) that can be executed or invoked to control the operation of processing chamber 107 in the manner described herein.

[0056] The diagnostic disc, described in more detail below, can generate sensor data for various components within the processing chamber 107, such as, but not limited to, the substrate support assembly 180, electrostatic chuck 150, rings (e.g., processing kit rings or individual rings), chamber walls, substrate, gas distribution plate, nozzles, gas lines, gas inlet port 121, nozzles, chamber cover 133, gaskets, gasket kits, shielding, plasma screen, plasma generation unit 142, RF feed structure 136, electrodes 153, diffuser, flow equalizer, cooling substrate, chamber observation port, etc. Some exemplary sensor data for these components may include, but are not limited to, alignment, concentricity, corrosion, cleanliness, measurement data, component damage or jamming, and component maintenance due.

[0057] Figure 2A The illustration shows a perspective view of an open diagnostic tray 110 according to an embodiment of the present disclosure. The diagnostic tray 110 may include a tray-shaped body 210 having a raised wall 202 surrounding the interior of the tray-shaped body 210 and at least one protrusion extending outwardly from the tray-shaped body 210. In an embodiment, the raised wall 202 may extend to at least one protrusion. Each of the protrusions extends horizontally or substantially horizontally from the tray-shaped body 210 and is positioned vertically or substantially vertically to the circumference of the tray-shaped body 210.

[0058] In some embodiments, there are four protrusions, such as a first protrusion 204A, a second protrusion 204B, a third protrusion 204C, and a fourth protrusion 204D. In the depicted embodiment, the four protrusions are spaced apart at a position that allows the end effector of the robotic arm 112 to pick up the diagnostic tray and place it in the processing chamber 107. The four protrusions can also be positioned such that a clear line of sight is maintained between the non-contact sensor attached to each protrusion and the component being diagnosed when the diagnostic tray is held by the end effector or when the diagnostic tray is placed on top of the wafer lifting rod (e.g., ...). Figures 2E to 2F neutralization Figure 7B (As depicted in the text).

[0059] In various embodiments, the diagnostic disk 110 includes more or fewer protrusions. In alternative embodiments, the diagnostic disk 110 has no protrusions and is shaped as a solid disk similar to a wafer. In some embodiments, one or more protrusions project outward from the periphery of the disk-shaped body 210 (e.g., as shown in the image). Figure 2B (As shown in the bottom view depicting the second protrusion 204B, the third protrusion 204C, and the fourth protrusion 204D). In some embodiments, one or more of the protrusions do not project outward from the periphery of the disc-shaped body 210 and are flush with the periphery of the disc-shaped body 210 (e.g., as shown in the bottom view depicting the second protrusion 204B, the third protrusion 204C, and the fourth protrusion 204D). Figure 2B (As shown in the bottom view depicting the first protrusion 204A).

[0060] In some embodiments, the raised wall 202 of the disc-shaped body 210 defines a cavity 208 of the disc-shaped body. In an embodiment, the diagnostic disc 110 further includes a printed circuit board (PCB) 203 disposed within the cavity 208 formed by the raised wall 202. Multiple components, such as a circuit system 205, a power source 207, and a wireless charger 209 (e.g., a Qi charger), may be disposed on the PCB 203 and / or within the cavity 208. The circuit system 205 may include multiple components, such as, for example, wireless communication circuitry and memory. The circuit system 205 may be coupled to at least one non-contact sensor 230 (e.g., a wireless communication circuit) attached to each of at least one protrusion in the disc-shaped body 210. Figure 2B (As shown in the diagram). In some embodiments, one or more of these components may not be inside cavity 208, but may be outside the diagnostic panel and may be coupled to the diagnostic panel via wires(s).

[0061] Power source 207 may include a battery (such as a lithium-ion polymer battery) or an alternative power source (such as a supercapacitor-type power source, as discussed below). Figures 3A to 3B (Further detailed description).

[0062] In some embodiments, the diagnostic disc 110 may further include a cover positioned over the cavity 208 of the disc-shaped body 210. The cover 220 may shield at least a portion of the PCB 203 and certain components within the cavity 208 from the external environment. In some embodiments, the cover 220 may shield at least a portion of the PCB 203, circuitry 205, power source 207, and wireless charger 209 within the cavity 208 from the external environment. The cover may be designed with various pockets to create gaps between components on the PCB 203. For example, the cover may include cutouts for placement of the wireless charger 209, for placement of the circuitry 205, for placement of the power source 207, and optionally additional cavities for future changes to the circuitry. In some embodiments, the cover 220 may be used to vacuum-seal the PCB 203, circuitry 205, power source 207, and wireless charger 209 from the external environment within the cavity 208.

[0063] Figure 2B The illustration shows a bottom view of a diagnostic disc according to an embodiment of the present disclosure. In various embodiments, a non-contact sensor is attached to each of at least one of the protrusions. For example, the diagnostic disc 110 may further include a plurality of non-contact sensors, such as a first non-contact sensor 230A, a second non-contact sensor 230B, a third non-contact sensor 230C, and a fourth non-contact sensor 230D, respectively attached to four protrusions 204A, 204B, 204C, and 204D. In some embodiments, each non-contact sensor may be attached to the underside of its respective protrusion, such as... Figure 2B As depicted in the text.

[0064] The non-contact sensor can be attached to each of the at least one protrusion via any suitable attachment mechanism (such as, but not limited to, via epoxy resin, via a spiral coil, etc.). In some embodiments, the non-contact sensor is attached to each of the at least one protrusion via an attachment mechanism that allows for easy maintenance (e.g., easy removal and replacement in the event of a failure of the non-contact sensor). In some embodiments, the non-contact sensor and / or the attachment mechanism to which the non-contact sensor is coupled may have a width that allows it to be supported by a portion of the raised wall 202. For example, Figure 2A1 The illustration shows an enlarged view of the protrusion 204D. Figure 2A1 In the cavity 208, a portion of the raised wall 202 extending from the circumference of the cavity 208 toward the protrusion 204D supports the non-contact sensor 230D and / or the attachment mechanism coupled to the non-contact sensor 230D via support tabs 206A and 206B.

[0065] In embodiments without protrusions, each non-contact sensor may be attached to the underside of the periphery of the diagnostic disc 110. In some embodiments, each non-contact sensor may be attached to other sides of the diagnostic disc, such as, but not limited to, the upper side of each protrusion (e.g., on the cover 220), the edge of the diagnostic disc 110 (e.g., on the cover 220 or on the periphery of the disc-shaped body 210), etc.

[0066] Each non-contact sensor can be oriented in a direction that allows it to generate sensor data for a component. For example, each non-contact sensor can be oriented above an edge ring, processing ring, electrostatic chuck, etc., to generate sensor data for the alignment or concentricity of the edge ring or processing ring (e.g., based on gap measurements between them or between the electrostatic chuck and the processing ring) or for the corrosion or cleanliness of the edge ring or processing ring. In another example, each non-contact sensor can be oriented in a direction that allows it to generate sensor data for a processing chamber cover or nozzle. In some embodiments, the non-contact sensors can be oriented to form a clear line of sight toward certain chamber components. In alternative embodiments, the entire diagnostic disk can be oriented to form a clear line of sight toward certain chamber components. For example, the diagnostic disk can be inverted on a wafer lift rod such that the non-contact sensors attached to the underside of each protrusion have a clear line of sight toward the top side of the processing chamber (e.g., for diagnostic scanning of the nozzle or processing chamber cover).

[0067] Each non-contact sensor may be coupled to circuitry 205, for example, via a connection on PCB 203. Each non-contact sensor may be configured to acquire sensor data (e.g., location, texture, and / or roughness information indicating alignment, concentricity, cleanliness, corrosion, etc.) of components used in any given processing chamber 107. Wireless communication circuitry may include or be coupled to an antenna to wirelessly transmit sensor data to controller 109. In some embodiments, sensor data is temporarily stored in the memory of a diagnostic disk, wirelessly transmitted to controller 109 using wireless communication circuitry, and the sensor data is cleared from the memory of the diagnostic disk once the secure wireless connection between the diagnostic disk and the controller is terminated.

[0068] In varying embodiments, the non-contact sensor is an image sensor, such as a camera zoom with at least four times magnification (e.g., 4x, 6x, 8x, or more). For example, the non-contact sensor may be or include a charge-coupled device (CCD) camera and / or a complementary metal-oxide (CMOS) camera or a high-resolution camera. Alternatively, the camera may have other zoom capabilities. In some embodiments, the non-contact sensor may be a position sensor. Alternatively, the non-contact sensor may be a miniature radar sensor capable of scanning the surface of a component. Furthermore, the non-contact sensor may include an x-ray emitter (e.g., an x-ray laser) and an x-ray detector. The non-contact sensor may alternatively be or include one or more pairs of laser emitters that generate laser beams and laser receivers that receive laser beams. Sensor measurements can be generated by a pair of laser emitters and laser receivers when the laser beams are reflected off the surface of the component. In some embodiments, the non-contact sensor may further include illumination capabilities integrated thereon or coupled to an illumination tool. In various embodiments, these sensor measurements may be converted into sensor data by circuitry 205 and / or controller 109.

[0069] In one embodiment, the non-contact sensor is a camera having a focusing range of about 25mm to about 45mm, about 30mm to about 40mm, about 33mm to about 37mm, or about 35mm. The camera may have a resolution of at least 3 megapixels, at least 4 megapixels, or at least 5 megapixels to enable the camera to focus on a component and obtain its sharp edges. The camera may have a field of view (FOV) of about 25mm to about 45mm, ranging from about 33,000μm × about 24,000μm to about 60,000μm × about 45,000μm. In some embodiments, a suitable camera may have autofocus operable via an autofocus algorithm. In some embodiments, a suitable camera does not have autofocus features to extend the lifespan of the power source (e.g., the operating time obtained from the power source). In some embodiments, the camera may have any combination of the features described in Table 1 below.

[0070] Table 1 - Specifications of an exemplary camera for a diagnostic disc according to an embodiment

[0071]

[0072]

[0073] In a variation of the embodiment, the diagnostic disc 110 may further include at least one illumination component attached to each of at least one of the protrusions. For example, in Figure 2B In the embodiment depicted, lighting component 232B is attached to protrusion 204B, lighting component 232C is attached to protrusion 204C, and lighting component 232D is attached to protrusion 204D. Although Figure 2BIn the embodiments depicted, the non-contact sensor 230A does not have an illumination component, but in some embodiments, the non-contact sensor 230A does have an illumination component. A circuit system 205 disposed on PCB 203 may be coupled to each of at least one illumination component (e.g., 232A, 232B, 232C). Each illumination component may be configured to illuminate at least a portion of the components used in any given processing chamber 107, such that each non-contact sensor can acquire sensor data of the illuminated portion of the component. Exemplary illumination components may include, but are not limited to, light-emitting diodes (LEDs).

[0074] Figure 2C The illustrations depict some aspects according to this disclosure. Figure 2A A side cross-sectional view of the diagnostic disc 110 along line “2A”. Figure 2D The illustration shows a perspective top view of a shielded diagnostic disc according to an embodiment of the present disclosure.

[0075] For further reference Figure 2A The diameter (DIA) of the diagnostic disc 110 can be defined by two points on the outer periphery of the disc-shaped body 210, said two points being 180 degrees apart from each other. One of the points defining the diameter DIA can be the edge of at least one protrusion. For example, the diameter DIA of the disc-shaped body 210 (and the diagnostic disc 110) can be from the edge of the first protrusion 204A to point 212 (point 212 can be a notch) on the outer periphery of the disc-shaped body 210. In a similar manner, the diameter of the diagnostic disc can be from the edge of one of the second protrusion 204B, the third protrusion 204C, or the fourth protrusion 204D to a corresponding point on the periphery of the disc-shaped body 210 located at a 180-degree angle to the corresponding edge of one of said protrusions. In some embodiments, the diameter can be in the range of about 310 mm to about 320 mm, or within 10% to 15% of about 310 mm to about 320 mm. The diameter should not be construed as limiting. In some embodiments, the diameter may be within the range of about 310 mm, about 315 mm, about 320 mm, about 325 mm, about 330 mm, about 335 mm, about 340 mm, about 345 mm or about 350 mm, to about 355 mm, about 360 mm, about 365 mm, about 370 mm, about 375 mm, about 380 mm, about 385 mm, about 390 mm, about 395 mm or about 400 mm, or any subrange or single value thereof.

[0076] Furthermore, in some embodiments, each non-contact sensor may be positioned such that a gap is formed between the non-contact sensor and the bottom of the disc-shaped body 210. For example, each non-contact sensor may be positioned on the underside of a corresponding protrusion such that the vertical distance between the non-contact sensor and the bottom of the disc-shaped body 210 causes the non-contact sensor to be displaced from the surface on which the diagnostic disc is placed. The height of the diagnostic disc 110 may be defined by the height (H) of the raised wall 202, which may be up to about 15 mm, about 14 mm, about 13 mm, about 12 mm, about 11 mm, about 10 mm, about 9 mm, about 8 mm, about 7 mm, or about 6 mm.

[0077] In varying embodiments, the disc body 210 (including the raised wall 202) and the cover 220 may be made of at least one of polyetheretherketone (PEEK), aluminum alloy, carbon fiber, or aluminum. In some embodiments, the disc body and / or cover are coated. In embodiments, the coating is configured to give the diagnostic disc 110 at least one of the following: vacuum resistance, high temperature resistance, scratch resistance, or a combination of the above. In embodiments, the coating is reflective and / or transparent to counteract any infrared radiation that the diagnostic disc 110 may be exposed to. For example, in one embodiment, the coating is infrared transparent to allow the surface finish of the coating to reflect the infrared radiation that may be exposed. Reflecting infrared radiation without absorbing it (or minimizing its absorption) minimizes the heat transferred to the diagnostic disc. In some embodiments, the coating is highly polished. In some embodiments, the coating has a surface roughness finish in the range of about 2 microinches to about 20 microinches, from about 4 microinches to about 16 microinches, from about 6 microinches to about 12 microinches, or any subrange or single value thereof.

[0078] In some embodiments, the coating comprises a material operable at a temperature of at least 50°C while maintaining its integrity without peeling, to avoid introducing particulate contaminants into the processing chamber. The coating may be erosion-resistant and / or corrosion-resistant. Exemplary coating materials that can be used to coat the disc-shaped body 210 and the cover 220 include, but are not limited to, at least one of the following: anodized aluminum, aluminum alloy, or yttrium oxide.

[0079] In some embodiments, the diagnostic disk 110 further includes a plurality of kinematic coupling interfaces 235 disposed on the bottom surface of the disk-shaped body 210. The plurality of kinematic coupling interfaces 235 may be configured to interact with a substrate support assembly (such as...) in the processing chamber. Figure 1B The registration feature of the substrate support assembly 180 in the processing chamber 107 is engaged. The engagement of multiple kinematic coupling interfaces 235 with the registration feature enables the diagnostic disk 110 to achieve target position and target orientation in the processing chamber 107.

[0080] For example, multiple kinematic coupling interfaces 235 may be configured as angled holes or slots to receive (or engage) the wafer lifting rod of the electrostatic chuck (ESC) 150 located within the processing chamber 107. Figure 2F (253 in the middle). Figure 2E The diagram shows Figure 2A A side cross-sectional view of an example of multiple kinematic couplers 235 in the diagnostic disk 110. A kinematic coupler is a fixture designed to accurately constrain a part (e.g., a wafer lift rod) by providing precise and defined positioning. The multiple kinematic couplers 235 thus allow the diagnostic disk 110 to be centered above or below the part, such that the non-contact sensor is generally oriented in the direction of the part being imaged or scanned.

[0081] Figure 2F The illustration shows a diagnostic disc 110 positioned downwards on an ESC 150 with a wafer lift lever 253 and a plurality of kinematic couplings 235 and a low contact area (LCA) 250 between the wafer lift lever 253 and the ESC 150, according to one embodiment of the present disclosure. As shown, in one embodiment, the plurality of kinematic couplings 235 provide a forged draft angle for easy lifting and lowering engagement via the lift lever 253. In various embodiments, the kinematic couplings are made of one of the following: copper, stainless steel, Cirlex, Vaspel, carbon fiber, Rexolite, or polyetheretherketone (PEEK). Because the kinematic couplings 235 are not metallic and contact the surface of the ESC 150, the diagnostic disc 110 avoids scratching or damaging the ESC 150. The materials of the LCA 250 and the kinematic couplings 235 also help reduce particle generation and contamination.

[0082] In various embodiments, controller 109 (e.g., a computing system) may receive signals from and send controls to the factory interface robot 111, the wafer transfer chamber robot 112, and / or each non-contact sensor. In this way, controller 109 may initiate diagnostics, whereby a component in, for example, one of the processing chambers 107 has been operated for a certain number of hours. Controller 109 may send a signal to the factory interface robot 111 to pick up one of the diagnostic trays 110 from one of the substrate cassettes 102 and transfer the diagnostic tray 110 to, for example, station 104b, which may be a loading lock or degassing chamber. Subsequently, the transfer chamber robot 112 may, for example, use an end effector of its robotic arm to pick up the diagnostic tray 110 and place it in the processing chamber 107, where the diagnostic tray 110 can acquire sensor data of the component. Sensor data may be wirelessly transmitted to controller 109 via a WAP device 129, for example, using wireless communication circuitry.

[0083] Figure 2GThe illustration shows a schematic depiction of the positions of four non-contact sensors on a diagnostic disc according to an embodiment of the present disclosure. In the depicted embodiment, the disc body 210 includes a notch at a first position 221 on the circumference of the disc body. The first position 221 may be referred to as a 0-degree starting angle. The notch may be used in conjunction with a pre-aligner, allowing the diagnostic disc 110 to be placed at a selected position within the processing chamber 107 and / or picked up by a terminal actuator.

[0084] In the depicted embodiment, a first non-contact sensor 230A may be attached to a first protrusion 204A, which is positioned at an angle of approximately 170 to 180 degrees with respect to a first position of the notch. In the depicted embodiment, a second non-contact sensor 230B may be attached to a second protrusion 204B, which is positioned at an angle of approximately 225 to 235 degrees with respect to the first position of the notch. In the depicted embodiment, a third non-contact sensor 230C may be attached to a third protrusion 204C, which is positioned at an angle of approximately 295 to 305 degrees with respect to the first position of the notch. In the depicted embodiment, a fourth non-contact sensor 230D may be attached to a fourth protrusion 204D, which is positioned at an angle of approximately 55 to 65 degrees with respect to the first position of the notch.

[0085] The first non-contact sensor 230A can be attached to the first protrusion 204A at a distance of approximately 295 mm to approximately 305 mm from the outer periphery of the disc-shaped body 210. The second non-contact sensors 230B, the third non-contact sensor 230C, and the fourth non-contact sensor 230D, which are respectively attached to the second protrusion 204B, the third protrusion 204C, and the fourth protrusion 204D, can be positioned at a distance of approximately 310 mm to approximately 320 mm from the outer periphery of the disc-shaped body 210.

[0086] The positions of the second protrusion 204B, the third protrusion 204C, and the fourth protrusion 204D, and the corresponding second non-contact sensor 230B, third non-contact sensor 230C, and fourth non-contact sensor 230D (as per relevant information) Figure 2G The above should not be construed as limiting, as their positions may vary depending on the processing chamber used, the main frame robot used, the transfer chamber robot used, the end effector of the robot, etc. At least one protrusion and a non-contact sensor attached thereto may be arranged at other angles or in other locations, provided that the non-contact sensor has a gap (e.g., through the end effector) to view the components or areas within the processing chamber being diagnosed.

[0087] exist Figure 2A , 2BIn the embodiments depicted in 2C, 2D, 2G, and 7B, the first non-contact sensor 230A (e.g., a first camera) is positioned such that the first non-contact sensor 230A is in the flat region 222 (also in... Figure 7A The edge of the center (800) and the starting point of the circular edge of ESC 150 are centered. In the depicted embodiment, the second non-contact sensor 230B (e.g., a second camera), the third non-contact sensor 230C (e.g., a third camera), and the fourth non-contact sensor 230D (e.g., a fourth camera) are positioned within the ring segments of the observation processing suite (e.g., edge ring 90 and support ring 390). According to the following... Figures 7A to 7B In a further detailed description of the embodiments, the positioning of the non-contact sensors 230A, 230B, 230C, and 230D in the depicted embodiments allows for the measurement of the gap between the ESC 150 and the processing kit ring to determine the alignment and concentricity of the processing kit ring.

[0088] In an embodiment, the diagnostic disk 110 can be moved within the wafer processing system using the same robotic arm as the wafer. Therefore, the diagnostic disk may have certain properties that enable it to move through wafer processing, such as certain target dimensions (e.g., height and width), target weight, target center of mass, etc. Height and width may have the properties described above herein. Figure 2C The dimensions described in DIA and H are as follows. In some embodiments, the mass of the diagnostic disc 110 may range from about 500g to about 700g, from about 530g to about 650g, or from about 550g to about 600g. In some embodiments, the center of mass of the diagnostic disc 110 may be about 0.05 to about 0.15, about -0.15 to about 0.0, or about 0.0 to about 0.15 (X, Y, Z) from the center of diameter. In some embodiments, the center of mass of the diagnostic disc 110 may be about 0.10 to about 0.13, about -0.10 to about -0.05, or about 0.05 to about 0.10 (X, Y, Z) from the center of diameter.

[0089] Various components within the internal cavity 208 of the diagnostic panel 110 (such as at least the PCB 203, circuitry 205, and wireless charger 209) may be made of a glass-reinforced epoxy laminate (e.g., FR-4) and copper. In some embodiments, the weight of the PCB 203 may range from about 40g to about 70g, from about 45g to about 65g, or from about 50g to about 60g. In some embodiments, the weight of the wireless charger 209 may range from about 5g to about 20g, from about 8g to about 17g, or from about 10g to about 15g. In some embodiments, the weight of the circuitry 205 may range from about 10g to about 20g, from about 12g to about 18g, or from about 14g to about 16g.

[0090] Any of the diagnostic panels described herein can be transmitted to a processing chamber (such as processing chamber 107) to generate sensor data in situ without venting the processing chamber. Therefore, diagnostic panel 110 can be exposed to high vacuum and / or high temperature and / or corrosive environments. Existing power sources (such as lithium batteries) may leak, expand, or even explode in vacuum and / or high temperature environments.

[0091] In embodiments, this disclosure pertains to a power source coupled to a PCB having a power management circuitry system disposed thereon to form a power unit. In embodiments, the power unit is configured to operate under high vacuum and high temperature without deformation (e.g., without bulging), cracking, or explosion. High vacuum may include pressures up to about 50 mTorr (e.g., from about 0.1 mTorr to about 50 mTorr, from about 15 mTorr to about 50 mTorr, or from about 30 mTorr to about 50 mTorr). High temperature may include temperatures from about 50°C to about 120°C, from about 65°C to about 120°C, from about 80°C to about 120°C, from about 50°C to about 80°C, or from about 65°C to about 80°C. In some embodiments, the power source may operate at temperatures ranging from about -20°C to about 120°C, from about 0°C to about 120°C, from about 20°C to about 120°C, from about 50°C to about 85°C, or any single value or subrange thereof.

[0092] Figure 3A The illustration shows a top view of a power unit that can be used in a diagnostic panel 110 according to an embodiment of the present disclosure. The power unit 300 includes a PCB 203 and a supercapacitor 310 (e.g., in...). Figure 3A (Combinations of 310A, 310B, and 310C in the embodiments depicted), the supercapacitor 310 includes a plurality of capacitors connected in parallel and series. Figure 3A In the embodiment depicted, three groups 310A, 310B and 310C of the six capacitors are connected in series and the three groups (310A, 310B and 310C) are connected in parallel. Figure 3A The arrangements depicted herein should not be construed as limiting. Those skilled in the art will understand that various arrangements, including parallel, series, and combinations thereof, can be used to arrange different numbers of capacitors to achieve the desired power properties.

[0093] In some embodiments, the supercapacitor 310 may be coupled to the PCB 203. Alternatively, the supercapacitor 310 may be an integral part of the PCB 203. For example, Figure 3B The illustration shows a perspective top view of a power unit of a supercapacitor 320, which is an integral part of a PCB 203 according to another embodiment of the present disclosure and can be used in a diagnostic panel 110. Figure 3B In the embodiments depicted, PCB 203 may be a double-layer PCB. Figure 3BThe supercapacitor 320 formed on the double-layer PCB 203 of the embodiment depicted includes eight groups connected in parallel (four groups on each side of the PCB). Figure 3B The image shows only four groups (320A, 320B, 320C, 320D) on one side, and each group includes six capacitors connected in series.

[0094] In some embodiments, regardless of the arrangement of the supercapacitor (e.g., 310 or 320 or other arrangements not shown) and PCB 203, the power unit 300 may further include a hermetically sealed housing such that if the power source fails under high vacuum and / or high temperature conditions, the material of the power source is retained and will not contaminate the diagnostic panel 110 or the processing chamber 107. The housing for the power unit also provides vacuum protection and / or electrical isolation for the power unit.

[0095] exist Figure 3A In the embodiments depicted, the supercapacitor 310 is encapsulated in a hermetically sealed housing made of silicon. In some embodiments, the housing may be made of metal. The hermetically sealed housing may conformally encapsulate the power source or the entire power unit (e.g., at least the power source along with the PCB). A hermetically sealed environment can be formed on the power source or the entire power unit by placing the power source or power unit in a form (e.g., a mold) and flooding the form with a housing material (e.g., silicon). Other methods for hermetically sealing the power source or the entire power unit may also be suitably used.

[0096] exist Figure 3A In the embodiments depicted, multiple capacitors include sodium chloride. In some embodiments, sodium chloride is advantageously more stable in high vacuum and high temperature environments compared to some materials currently used in power sources, such as lithium. Lithium is a self-oxidizing agent, and in high temperature and high vacuum environments, lithium may ignite, produce its own oxygen, and explode. Lithium is also a heavy metal, and if lithium contaminates either the diagnostic panel or the processing chamber, it cannot be cleaned from either the diagnostic panel or the processing chamber. In contrast, if a supercapacitor containing sodium chloride fails and breaks in the high temperature and high vacuum environment of the processing chamber, the sodium can be easily cleaned off. In some embodiments, the power source does not contain heavy metals. In one embodiment, the power source does not contain lithium. In one embodiment, the power source does not contain copper.

[0097] In some embodiments, the power source may include lithium, provided that the power unit is configured to operate under high vacuum and high temperature without bursting or exploding and optionally without deforming.

[0098] In various embodiments, the power source may have a low profile, such as a height of up to about 6 mm, about 5.5 mm, or about 5 mm, so that it can be fitted inside, shielded inside, and isolated from the environment outside the disc-shaped body by the interior formed by the disc-shaped body and the cover. In embodiments, the power source may have a width ranging from about 45 mm to about 50 mm, from about 46 mm to about 49 mm, or from about 47 mm to about 48 mm, and a length ranging from about 50 mm to about 200 mm, from about 65 mm to about 185 mm, or from about 80 mm to about 170 mm. In embodiments, the weight of the power source may range from about 40 g to about 60 g, from about 45 g to about 55 g, or from about 48 g to about 52 g. In some embodiments, these dimensions refer to the supercapacitor itself without a PCB. In other embodiments, these dimensions refer to the supercapacitor with a PCB.

[0099] In some embodiments, a single series connection of a supercapacitor (e.g., each of six capacitors connected in series, such as in...) Figure 3A and Figure 3B The 310A or 320A supercapacitors may have certain target attributes. For example, a single series connection of supercapacitors may have one or more of the following: an output voltage of about 8.4V, a capacitance of about 15F, a height of about 2mm to about 3mm, a width of about 12mm to about 16mm, a length of about 70mm to about 75mm, a mass of about 8g to about 10g, a minimum stored energy of about 105W, an operating temperature range of about -20°C to about 120°C, an equivalent series resistance (ESR) of about 15 ohms, a 24-hour leakage current of about 0.10 to about 0.15mA, a maximum charging current of about 50mA, a maximum discharging current of about 70mA, and a minimum discharging voltage of about 4.8V.

[0100] In one embodiment, the power source may include keying features (such as mechanical features on a PCB or etched connectors with keys) to ensure that the power source is properly positioned.

[0101] In various embodiments, the power source can be charged using charging circuitry on the PCB, which limits the voltage at the top and bottom and protects the power source from overcharging or undercharging. The power source can be charged at atmospheric pressure and room temperature (e.g., about 20°C to about 30°C) or in a vacuum. In some embodiments, the power source can be wirelessly charged by placing a diagnostic pad next to a charging block or charging plate. In some embodiments, the diagnostic pad 110 may include a charging location identifier for wireless charging thereon. Alternatively, a USB cable can be used to charge the power source.

[0102] During a diagnostic scan, multiple diagnostic disks 110 are rotatable, such that when the power source of the first diagnostic disk is charged, the second diagnostic disk performs a diagnostic scan. Subsequently, the two diagnostic disks can be interchanged, allowing the power source of the second diagnostic disk to be charged while the first diagnostic disk performs a diagnostic scan.

[0103] In some embodiments, the power source has a charging time to runtime ratio of about 1:2 to about 3:2 or about 1:1. As used herein, a 1:1 charging time to runtime ratio means that charging the power source for about 30 minutes will be sufficient to power the diagnostic disk 110 for about 30 minutes. As used herein, a 1:2 charging time to runtime ratio means that charging the power source for about 30 minutes will be sufficient to power the diagnostic disk 110 for about 60 minutes. As used herein, a 3:2 charging time to runtime ratio means that charging the power source for about 30 minutes will be sufficient to power the diagnostic disk 110 for about 20 minutes. In some embodiments, the power source is sufficient to power the diagnostic disk and its operation (e.g., image capture) for a runtime of about 15 minutes to about 60 minutes, about 20 minutes to about 50 minutes, or about 25 minutes to about 45 minutes.

[0104] The charging time to runtime ratios listed herein should not be construed as limiting. In some embodiments, the charging time to runtime ratio may be within a range of about 1:100, about 1:75, about 1:50, about 1:25, about 1:10, about 1:10, about 1:5, or about 1:1, to about 5:1, about 10:1, about 15:1, about 25:1, about 50:1, about 75:1, or about 100:1, or any subrange or single value thereof.

[0105] In some embodiments, the power source has a voltage output of about 3.7V and a current usage in the range of about 300mA to about 1200mA, about 350mA to about 800mA, or about 400mA to about 600mA. In some embodiments, the power source has a current capacity in the range of about 400mAh to about 600mAh, about 450mAh to about 650mAh, or about 480mAh to about 620mAh.

[0106] In some embodiments, the power source is durable and has a lifespan of at least about 350 cycles, at least about 400 cycles, at least about 450 cycles, or at least about 500 cycles at 1°C. The term "lifespan" refers to the number of cycles the power source can be used until it has about 80% of its remaining capacity, where a single cycle refers to the power source charging, the power source powering a diagnostic scan using any of the diagnostic disks described herein, and the power source discharging. In one embodiment, a diagnostic scan within a single cycle may include multiple multi-minute measurements (e.g., 12 three-minute measurements or four measurements capturing eight images in each measurement) that generate sensor data during the cycle.

[0107] The power sources described herein can be non-toxic and safe for unregulated travel in aircraft without the special classifications found in conventional lithium batteries. Therefore, the power sources described herein comply with safety regulations UL 2054, IEC 62133, Second Edition, and UN 38.3.

[0108] A suitable power source may have certain target properties (such as, but not limited to, voltage output, current usage, energy density, equivalent series resistance, mass, etc.) to form a power unit capable of achieving the target duration of use with the diagnostic panel 110 and without deforming, exploding, cracking, or contaminating the processing chamber under high temperature and high vacuum conditions. Exemplary properties for the power source according to the embodiments are summarized in Table 2 below.

[0109] Table 2 - Exemplary properties of power sources according to embodiments

[0110]

[0111]

[0112] Although this article is about Figure 3A and Figure 3B The power sources described herein are depicted using a diagnostic panel, but those skilled in the art will understand that similar power sources can be used to power other devices in the wafer processing system 100 or processing chamber 107. These power sources are particularly advantageous because they do not require power to wafer processing system components via wires. The power sources described herein also offer advantages such as low cost, improved performance, low toxicity, durability under high / low temperature / vacuum conditions and corrosive environments, high cycle life, scalability, a favorable charge-to-run time ratio, and ease of transport by air.

[0113] Figure 4 According to various embodiments of this disclosure, a diagnostic disc is used to obtain information about the treatment chamber (such as...). Figure 1BA flowchart of a method 400 for processing sensor data of components within a processing chamber 107. Some operations of method 400 can be performed by processing logic, which may include hardware (circuit systems, dedicated logic, etc.), software (such as running on a general-purpose computer system or a dedicated machine), firmware, or some combination thereof. It can be performed by a computing device (such as...) Figure 1A The computing device controls the robotic arm and / or non-contact sensors via a controller 109 to perform some operations of method 400. For example, the processing logic for performing one or more operations of method 400 may be executed on the controller 109.

[0114] For the sake of simplicity, the method is depicted and described as a series of actions. However, the actions according to this disclosure can occur in various orders and / or simultaneously, and together with other actions not presented and described herein. Furthermore, not all illustrated actions can be performed to implement the method according to the disclosed subject matter. Moreover, those skilled in the art will understand and appreciate that the method may alternatively be represented by a state diagram or events as a series of interrelated states.

[0115] refer to Figure 4 Method 400 may begin with processing logic loading one or more diagnostic disks 110 into a substrate housing 102 (such as a FOUP or SSP) (405). In one embodiment, one or more diagnostic disks are stored in a FOUP, which also includes an edge ring, or more generally, a processing kit ring. In one embodiment, multiple diagnostic disks are stored in a FOUP designed to house the diagnostic disks. Method 400 may continue by determining, based on the number of RF operating hours of the processing chamber within the substrate processing system (410) and / or based on other criteria (e.g., the amount of time elapsed since the last analysis was performed on a component in the processing chamber), that a particular component in the processing chamber 107 should be subjected to a diagnostic scan. The processing logic may also determine the type of diagnostic scan for said component (i.e., the type of sensor data to be generated, such as metrological data, gap measurements, etc.) (410).

[0116] Method 400 may continue with the following operation: the processing logic causes one of the diagnostic disks 110 to be moved from the FOUP (or SSP) to the processing chamber (415) with a movement similar to that used for moving a wafer. In an embodiment, this includes enabling the factory interface area (such as...) Figure 1A The robotic arm within 91) moves the diagnostic disk 110 from the wafer storage area and loads the diagnostic disk 110 into the loading lock of the substrate processing system (e.g., via a factory interface robotic arm 111). In embodiments, this may further include moving the transfer chamber area (such as...) Figure 1AThe robotic arm within the transfer chamber 106 retrieves the diagnostic tray 110 from the loading lock into the processing chamber (e.g., via a transfer chamber robotic arm 112). This may include causing the end effector of the robotic arm within the transfer chamber 106 to move in a manner similar to that used for moving a wafer to pick up and place the diagnostic tray 110 into the processing chamber 107.

[0117] Optionally, method 400 may continue with the following operation: the processing logic causes the transfer chamber robot 112 to transfer the diagnostic tray 110 from the end effector of the robot arm to the wafer lifting rod 253 of the ESC 150. Figure 2F In one embodiment, method 400 may further include raising a plurality of wafer lifting rods of a substrate support assembly in the processing chamber, such that a plurality of kinematic coupling interfaces of the diagnostic disk 110 (e.g., Figure 2E 235) engages with multiple wafer lift rods to give the diagnostic disk 110 a target position and target orientation. In one embodiment, method 400 may further include lowering multiple wafer lift rods of the substrate support assembly in the processing chamber, for example, to position the diagnostic disk 110 on the ESC (420).

[0118] Method 400 may proceed to: establishing a wireless connection (420) between the processing logic and at least one of the diagnostic disks 110. The wireless connection may be a secure wireless connection. The wireless connection may be established before or after the diagnostic disk 110 is placed in the processing chamber. After establishing the wireless connection, method 400 may proceed to: loading a script onto the diagnostic disk 110, the script causing the diagnostic disk 110 to monitor temperature, control illumination, and generate sensor data according to a diagnostic scanning algorithm.

[0119] Method 400 may further include the following operation: processing logic causes the diagnostic disc 110 to generate sensor data (425) of a component of the processing chamber using one or more non-contact sensors of the diagnostic disc. For example, causing the diagnostic disc 110 to generate sensor data may include causing the non-contact sensors of the diagnostic disc to generate sensor data depicting multiple multi-minute measurements. In one embodiment, causing a camera on the diagnostic disc 110 to generate sensor data may include causing the camera to autofocus, illuminate, and capture a first image of a portion of the component, subsequently causing the camera to autofocus, illuminate, and capture a second image of said portion of the component, and subsequently causing the camera to autofocus, illuminate, and capture a third image of said portion of the component.

[0120] Method 400 may further include receiving sensor data from the diagnostic disk via a wireless connection (430). Sensor data can be received when the diagnostic disk 110 is positioned on the blade of the robotic arm and within the processing chamber, when the diagnostic disk is on the chip lifting rod 253, or after the diagnostic disk 110 has been lowered to ESC 150.

[0121] For further reference Figure 4 In various embodiments, method 400 further includes processing logic to analyze sensor data to determine at least one of the following: component alignment, concentricity, cleanliness, corrosion, whether the component is damaged, and whether the component is stuck (435).

[0122] If method 400 determines that the alignment or concentricity is correct (440) and the processing logic determines that there is no misalignment or concentricity, then method 400 may continue with the following operation: the processing logic causes the transfer chamber robot to move the diagnostic disk 110 from the processing chamber back to the loading lock. Method 400 may further continue with the following operation: the processing logic determines that no additional maintenance is required and causes the factory interface robot to move the diagnostic disk 110 from the loading lock back to the storage area (e.g., FOUP or SSP) (450). Method 400 may further continue with the following operation: the processing logic causes the substrate processing to continue for an additional number of RF hours before initiating another diagnostic scan of the component (455).

[0123] However, if the alignment or concentricity of the components is off, method 400 may continue with the following operation: the processing logic initiates automatic correction of the alignment or concentricity of the components (445).

[0124] If method 400 determines cleanliness (460) and the processing logic determines that the cleanliness has not reached the contamination threshold, then method 400 may continue with the following operation: the processing logic causes the transfer chamber robot to move the diagnostic tray 110 from the processing chamber back to the loading lock. Method 400 may further continue with the following operation: the processing logic determines that no additional maintenance is required and causes the factory interface robot to move the diagnostic tray 110 from the loading lock back to the storage area (e.g., FOUP or SSP) (450). Method 400 may further continue with the following operation: the processing logic causes the substrate processing to continue for an additional number of RF hours (455) before initiating another diagnostic scan of the component to determine cleanliness.

[0125] However, if the cleanliness of the component reaches the contamination threshold, method 400 may continue with the following operation: the processing logic initiates automatic cleaning of the component (465).

[0126] If method 400 determines the corrosion level (470) and the processing logic determines that the corrosion level has not reached the end-of-life threshold, then method 400 may continue with the following operation: the processing logic causes the transfer chamber robot to move the diagnostic disk 110 from the processing chamber back to the loading lock. Method 400 may further continue with the following operation: the processing logic determines that no additional maintenance is required and causes the factory interface robot to move the diagnostic disk 110 from the loading lock back to the storage area (e.g., FOUP or SSP) (450). Method 400 may further continue with the following operation: the processing logic causes the substrate processing to continue for an additional number of RF hours (455) before initiating another diagnostic scan of the component to determine the corrosion level.

[0127] However, if the corrosion level of a component reaches its end-of-life threshold, method 400 may proceed to: the processing logic initiates an automatic replacement of the component (475). Component replacement may include removing the worn component (e.g., a processing kit ring) from the processing chamber and returning it to a storage area (e.g., a FOUP or SSP). Component replacement may further optionally include flushing away residue and particles around the worn component using a pressurized gas source (e.g., nitrogen) from the processing chamber. Component replacement may further include moving a new component from the storage area into the processing chamber as a replacement for the worn component. Component replacement may further include placing the new component into the processing chamber using robotic blades.

[0128] If method 400 identifies a damaged or stuck component (480) and the processing logic determines that the component is not damaged or stuck, method 400 may continue with the following operation: the processing logic causes the transfer chamber robot to move the diagnostic disk 110 from the processing chamber back to the loading lock. Method 400 may further continue with the following operation: the processing logic determines that no additional maintenance is required and causes the factory interface robot to move the diagnostic disk 110 from the loading lock back to the storage area (e.g., FOUP or SSP) (450). Method 400 may further continue with the following operation: the processing logic causes the board processing to continue for an additional number of RF hours (455) before initiating a diagnostic scan of the component again to identify the damaged or stuck component.

[0129] However, if a component is damaged, method 400 may proceed as follows: the processing logic initiates an automatic replacement of the component, similar to replacing a worn component as described above (485). If a component is stuck, method 400 may proceed as follows: the processing logic initiates an automatic movement of the component (485).

[0130] The function of method 400 can be repeated for additional components in additional processing chambers (490). The function of method 400 can also be repeated to diagnose other problems associated with components in the processing chambers, which can be diagnosed by any of the diagnostic disks described herein and / or the problems can be automatically resolved using a robot in the processing chamber (such as the transfer chamber robot 112).

[0131] In an embodiment, the sensor data generated by the diagnostic disc may include image data. In an embodiment, the processing logic for analyzing the sensor data includes applying one of an image processing algorithm or a trained machine learning model to determine at least one of the following aspects of the sensor data regarding the diagnosed component: alignment, concentricity, cleanliness, corrosion, whether the component is damaged, whether the component is stuck, etc.

[0132] Figure 5 This is a flowchart of a method 500 that uses an in-situ non-contact sensor (e.g., non-contact sensor 230) of a diagnostic disk to generate sensor data and wirelessly transmit said sensor data to a controller 109 (e.g., a computing system). Some operations of method 500 can be performed by processing logic, which may include hardware (circuit systems, dedicated logic, etc.), software (e.g., running on a general-purpose computer system or a dedicated machine), firmware, or some combination of the foregoing. Some operations of method 500 can be performed via the diagnostic disk 110 before or after the diagnostic disk 110 is placed into the processing chamber.

[0133] For the sake of simplicity, the method is depicted and described as a series of actions. However, the actions according to this disclosure can occur in various orders and / or simultaneously, and together with other actions not presented and described herein. Furthermore, not all illustrated actions can be performed to implement the method according to the disclosed subject matter. Moreover, those skilled in the art will understand and appreciate that the method may alternatively be represented by a state diagram or events as a series of interrelated states.

[0134] refer to Figure 5 Method 500 may begin with the diagnostic panel 110 using the diagnostic panel's wireless circuitry to establish a secure wireless connection with the computing system (510). This can be achieved by the diagnostic panel entering the processing chamber (e.g., Figure 1A A secure wireless connection between the diagnostic disk and the computing system can be established before or after the processing chamber 107. This secure wireless connection can be established when the diagnostic disk is held by the robotic arm of the transfer robot 112, when the diagnostic disk is placed on the wafer rod 253, or when the diagnostic disk is placed on the ESC 250.

[0135] Method 500 may continue with the following operations: the diagnostic panel receives a script from the computing system, via which the diagnostic panel 110 may be instructed to, for example, monitor temperature, control lighting, and generate sensor data.

[0136] Method 500 may continue with the following operation: at least one non-contact sensor (e.g., 230A, 230B, 230C, or 230D) of the diagnostic disk 110 generates sensor data (520) of at least a portion of a component disposed within a processing chamber (e.g., processing chamber 107). The generation of sensor data of at least a portion of the component may be performed at pressures and temperatures similar to those present in the processing chamber during wafer processing. For example, sensor data may be generated in the processing chamber at a vacuum (e.g., about 0.1 mTort to about 50 mTort, about 15 mTort to about 50 mTort, or about 30 mTort to about 50 mTort) and / or at a temperature range of about -20°C to about 120°C, about 0°C to about 120°C, about 50°C to about 85°C, about 50°C to about 120°C, about 65°C to about 120°C, about 80°C to about 120°C, about 50°C to about 80°C, or about 65°C to about 80°C.

[0137] Generating sensor data may include multiple multi-minute measurements performed by a non-contact sensor on the diagnostic disc. In one embodiment, a camera on the diagnostic disc 110 generates sensor data by autofocusing on a portion of a component (e.g., an edge ring, a processing kit ring, or an ESC), illuminating, and capturing a first image of the portion of the component; subsequently autofocusing, illuminating, and capturing a second image of the portion of the component; and subsequently autofocusing, illuminating, and capturing a third image of the portion of the component. In some embodiments, the diagnostic disc 110 may generate sensor data without autofocusing and / or without illuminating the portion of the component before capturing images.

[0138] At least one non-contact sensor of the diagnostic panel 110 can generate sensor data for various components within the processing chamber. Some exemplary components include, but are not limited to: processing kit ring, single ring, substrate support assembly, electrostatic chuck (ESC), chamber wall, substrate, gas line, gas distribution plate, panel, nozzle, spray head, cap, liner, liner kit, shield, plasma screen, remote plasma source, flow equalizer, cooling substrate, chamber observation port, or chamber cap.

[0139] Continue to refer to Figure 5Method 500 may continue with the following operation: storing sensor data in the memory of the diagnostic disk (530). Method 500 may further continue with the following operation: wireless communication circuitry of the diagnostic disk wirelessly transmits the sensor data to a computing system (540). In some embodiments, the diagnostic disk may only transmit sensor data to the computing system without storing the sensor data in the memory of the diagnostic disk. The sensor data may include image data to be analyzed by the computing system to determine at least one of the following regarding the component: alignment, concentricity, cleanliness, corrosion, whether the component is damaged, whether the component is stuck, etc.

[0140] Method 500 may proceed to: terminating the secure wireless connection with the computing system (550). Method 500 may further proceed to: clearing sensor data from the diagnostic disk's memory (560). In some embodiments, the diagnostic disk will also clear any scripts received from the computing system after terminating the secure wireless connection with the computing system. In some embodiments, the diagnostic disk will turn off its contactless sensors and / or its illumination components after terminating the secure wireless connection with the computing system.

[0141] The function of method 500 can be repeated for additional components in additional processing chambers (570). The function of method 500 can also be repeated to diagnose other problems associated with components in the processing chambers, which can be diagnosed by any of the diagnostic disks described herein and / or the problems can be automatically resolved using a robot in the processing chamber, such as the transfer chamber robot 112.

[0142] Example

[0143] The following examples are provided to aid in understanding this disclosure and should not be construed as specifically limiting the disclosure described and claimed herein. Such variations of this disclosure, including any and all now-known or hereafter developed equivalents that would fall within the scope of those skilled in the art, as well as minor changes in architecture, operation, design, or attributes, should be considered to fall within the scope of this disclosure incorporated herein.

[0144] Example 1 – Diagnostic scan to determine corrosion levels at the edges and support rings.

[0145] Figure 6A The illustration shows a side cross-sectional view of a diagnostic disk (e.g., 110) placed on a wafer lifting rod (e.g., 253) of an ESC (e.g., 150) within a processing chamber (e.g., 107) according to an embodiment of the present disclosure. The diagnostic disk is illustrated as being positioned on top of an end effector (e.g., a manipulator blade) of the robotic arm of a transfer chamber manipulator (e.g., 112) located within a transfer chamber (e.g., 106). A region 311, residing around a portion of the edge ring in the ESC (e.g., 150), is circled. Figures 6B to 6C The image is magnified.

[0146] Figure 6B This is an exploded view of a portion of the diagnostic disc (e.g., 110) of FIG3 according to an exemplary embodiment of the present disclosure, wherein the non-contact sensor 230 is a high-resolution camera that captures sensor data of the edges and support rings. Elevable Figure 6A The wafer lifting lever (e.g., 253) illustrated in the figure, and the end effector of the robotic arm of the transfer chamber manipulator (e.g., 112), can position a diagnostic disk (e.g., 110) downwards onto the wafer lifting lever (e.g., 253). A kinematic coupling (e.g., 235) on the diagnostic disk ensures that the wafer lifting lever is forced to center the diagnostic disk on the ESC (e.g., 150), such that each non-contact sensor 230 is vertically positioned on top of the edge ring 90. In one embodiment, the wafer lifting lever (e.g., 253) is only slightly raised, leaving a small gap between the non-contact sensor 230 and the edge ring 90. When the diagnostic disk (e.g., 110) is positioned on the wafer lifting lever (e.g., 253), the non-contact sensor 230 can generate sensor data indicating the degree of corrosion of the edge ring 90 and wirelessly transmit said sensor data to a controller (e.g., 109).

[0147] Figure 6C This is based on exemplary embodiments of the present disclosure. Figure 6A An exploded view of a portion of a diagnostic disk (e.g., 110), wherein each non-contact sensor 230 captures sensor data from the edge ring 90 and the support ring 390. In this embodiment, the wafer lift bar (e.g., 253) may be lowered so that the diagnostic disk 110 is positioned on top of the ESC (e.g., 150). In another embodiment, other mechanisms are used to guide the diagnostic disk (e.g., 110) onto the ESC (e.g., 150), such as using sensor data from the non-contact sensors. Each non-contact sensor 230 is positioned immediately adjacent to the edge ring 90, but a gap is maintained between the non-contact sensor 230 and the edge ring 90. When the diagnostic disk (e.g., 110) is positioned on the ESC (e.g., 150), the non-contact sensors 230 may generate sensor data indicating the degree of corrosion of the edge ring and / or support ring and wirelessly transmit said sensor data to a controller (e.g., 109).

[0148] like Figures 6B to 6C As observed, when the corrosion of the edge ring 90 is deep enough, the support ring 390 located below the edge ring 90 and between the edge ring 90 and ESC 150 may also be corroded (or worn). Accordingly, when the edge ring 90 is replaced, the support ring 390 may also be replaced simultaneously, for example, as a treatment kit ring.

[0149] Example 2 – Diagnostic scan for determining the alignment of the processing kit ring

[0150] Figure 7A The illustration shows a top plan view of an edge ring 90 and a support ring 390 surrounding an electrostatic chuck (ESC) 150 according to one embodiment of the present disclosure. The ESC 150 may include a flat region 800 (or other notch or registration feature) along the circumference of the edge of the ESC 150 for aligning a wafer placed thereon. Similarly, the support ring 390 may include a corresponding flat region (or notch or registration feature) such that when the support ring 390 and edge ring 90 are replaced with a ring kit, the entire ring kit can be oriented along the flat region 800, thus properly secured to a position centered on the ESC 150 of the processing chamber 107.

[0151] In embodiments of this disclosure, controller 109 may receive sensor data from any of the non-contact sensors described herein, wherein controller 109 may determine from the sensor data whether the flat areas are aligned with each other during ring kit replacement. If the flat areas are not properly aligned, controller 109 may signal to transfer chamber robot 112 to remove the ring kit from processing chamber 107, and then realign it at the end effector of the robot before reinserting it into processing chamber 107.

[0152] For example, controller 109 can determine a rotational error, which could be the rotational angle between the target orientation and the current orientation of the ring assembly. Controller 109 can send a command to transfer chamber robot 112 to rotate the end effector (and the ring assembly supported on the end effector) by a specified amount to correct and eliminate the rotational error. Transfer chamber robot 112 can then place the edge ring 90 into processing chamber 107 via a corresponding port 108 with corrected orientation. Accordingly, the degrees of freedom of transfer chamber robot 112 can be used to eliminate the rotational error of the edge ring 90 without using an alignment station.

[0153] In some embodiments, the transfer chamber robot 112 can correct for a threshold amount of rotational error up to the edge ring 90. For example, one transfer chamber robot 112 may be able to correct for a rotational error of up to 5 degrees, while other plant transfer chamber robots 112 may be able to correct for a rotational error of up to 3 degrees, 7 degrees, or some other amount. If the detected rotational error is greater than the threshold amount of rotational error that can be corrected by the transfer chamber robot 112, the transfer chamber robot 112 may place the ring assembly at an intermediate station (not shown), reposition the end effector, and then retrieve the ring assembly in a manner that eliminates or reduces the rotational error, such that the rotational error is less than or equal to the threshold amount of rotational error that can be corrected based on the rotation of the end effector.

[0154] In other embodiments of this disclosure, controller 109 may receive sensor data from any of the non-contact sensors described herein, wherein controller 109 may determine from the sensor data whether the processing kit ring has shifted (i.e., decentered) during ring kit replacement. The alignment and concentricity of the processing kit ring may be determined by analyzing the gap between edge ring 90 and support ring 390 or between edge ring 90 and ESC 150. To generate sensor data indicating the gap between edge ring 90 and support ring 390 or between edge ring 90 and ESC 150, one non-contact sensor (e.g., a camera) may be positioned to provide a clear line of sight to the edge of plane 800 and the beginning of the circular edge of ESC 150, and the remaining non-contact sensors (e.g., cameras) may be positioned to provide a clear line of sight to the ring segments of edge ring 90 and support ring 390.

[0155] Processing the sensor data generated by these cameras can provide at least some of the following information: the ring is in the correct position, the ring is made of the correct material, the rotation angle between the ESC plane and the ring plane, processing four points of the gap between the inner edge of the ring and the outer edge of the ESC 150, concentricity, etc.

[0156] For example, if the flat area of ​​the ESC and the ring kit are not properly centered, the controller 109 can signal the transfer chamber robot 112 to remove the ring kit from the processing chamber 107, and then realign it at the end effector of the robot before reinserting it into the processing chamber 107.

[0157] For example, controller 109 can determine a placement error, which could be a gap between the edge ring and the support ring outside the target gap range. Controller 109 can send a command to transfer chamber robot 112 to move the end effector (and the ring assembly supported on the end effector) by a specified amount in a specified direction to correct and eliminate the placement error. Transfer chamber robot 112 can then place the edge ring 90 into processing chamber 107 via a corresponding port 108 with corrected orientation. Accordingly, the degrees of freedom of transfer chamber robot 112 can be used to eliminate the placement error of edge ring 90 without using an alignment station.

[0158] In some embodiments, the transfer chamber robot 112 can correct for a placement error up to a threshold amount of the edge ring 90. If the detected placement error is greater than the threshold amount of placement error that can be corrected by the transfer chamber robot 112, the transfer chamber robot 112 can place the ring assembly at an intermediate station (not shown), reposition the end effector, and then retrieve the ring assembly in a manner that eliminates or reduces the placement error, such that the placement error is less than or equal to the threshold amount of placement error that can be corrected based on the movement of the end effector.

[0159] Figure 7B The illustration depicts the observation position of a diagnostic disk (e.g., 110) configured to observe the positioning (such as alignment and concentricity) of a processing kit ring according to an embodiment of the present disclosure. The diagnostic disk is illustrated at a vertical distance above an ESC (e.g., 150). The diagnostic disk (e.g., 110) may reach the depicted observation position when located in the arm of a transfer robot (e.g., an end effector such as transfer robot 112) or when located on a wafer lifting rod (e.g., 253).

[0160] In the depicted embodiment, according to an exemplary embodiment of this disclosure, the diagnostic disc has four high-resolution cameras (i.e., non-contact sensors) that capture sensor data of the edges and curvature of the processing kit ring. In the depicted viewing position, the first camera 730A is positioned above a flat area 800 of the ESC 150, where its line of sight captures the starting point of the curvature of the kit ring on the flat area 800. In the depicted viewing position, the second camera 730B, the third camera 730C, and the fourth camera 730D are all positioned above the edge of the kit ring diameter. This sensor data helps the controller 109 determine the alignment and concentricity of the ring kit, for example, as described above regarding… Figure 7A As stated above.

[0161] Figure 8 It can be used as a processing system according to embodiments of this disclosure (e.g., Figure 1A Example computing device 1400 operates as a system controller of a processing system 100. Computing device 1400 is a machine in which a set of instructions can be executed to cause the machine to perform any or more of the methods discussed herein. In alternative embodiments, the machine may be connected (e.g., network-connected) to other machines in a local area network (LAN) 1464, intranet, extranet, or the Internet. The machine may operate as a server or client machine in a client-server network environment, or as a peer machine in a peer-to-peer (or distributed) network environment. The machine may be a personal computer (PC), tablet computer, network appliance, server, network router, switch, or bridge, or any machine capable of executing a set of instructions (sequentially or otherwise) to specify actions to be taken by that machine. Furthermore, although only a single machine is illustrated, the term "machine" should also be considered as any collection of machines (e.g., computers) that individually or jointly execute a set of instructions (or multiple sets of instructions) to perform any or more of the methods discussed herein. In embodiments, computing device 1400 corresponds to Figure 1A The system controller 109. In one embodiment, the system controller 109 is a component of the computing device 1400.

[0162] Example computing device 1400 includes processing device 1402, main memory 1404 (e.g., read-only memory (ROM), flash memory, dynamic random access memory (DRAM) (such as synchronous DRAM (SDRAM) or Rambus DRAM (RDRAM)), etc.), static memory 1406 (e.g., flash memory, static random access memory (SRAM), etc.), and auxiliary memory (e.g., data storage device 1412), which communicate with each other via bus 1408.

[0163] Processing device 1402 represents one or more general-purpose processors, such as microprocessors, central processing units, etc. More specifically, processing device 1402 may be a Complex Instruction Set Computing (CISC) microprocessor, a Reduced Instruction Set Computing (RISC) microprocessor, a Very Long Instruction Word (VLIW) microprocessor, a processor implementing other instruction sets, or a processor implementing a combination of instruction sets. Processing device 1402 may also be one or more special-purpose processing devices, such as application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), digital signal processors (DSPs), network processors, etc. Processing device 1402 is configured to execute processing logic (instructions 1426) for performing the operations discussed herein. In one embodiment, system controller 109 corresponds to processing device 1402. In an embodiment, processing device 1402 executes instructions 1426 to implement method 400 of the embodiments.

[0164] The computing device 1400 may further include a network interface device 1408. The computing device 1400 may also include a video display unit 1410 (e.g., a liquid crystal display (LCD) or a cathode ray tube (CRT)), an alphanumeric input device 1412 (e.g., a keyboard), a cursor control device 1414 (e.g., a mouse), and a signal generation device 1420 (e.g., a speaker).

[0165] Data storage device 1428 may include machine-readable storage medium (or more specifically, computer-readable storage medium) 1424, on which one or more instruction sets 1426 embodying any one or more methods or functions described herein are stored. Instructions 1426 may also reside wholly or at least partially within main memory 1404 and / or processing device 1402 during execution by computer system 1400, which also constitute machine-readable storage media.

[0166] The computer-readable storage medium 1424 can also be used to store instructions 1426 for analyzing sensor data and / or characteristic error values ​​1450 to detect, for example, alignment, concentricity, corrosion, cleanliness, or jamming or damage of components within the processing chamber 107. While the computer-readable storage medium 1424 is shown as a single medium in the example embodiment, the term "computer-readable storage medium" should be considered as encompassing a single or multiple media (e.g., a centralized or distributed database and / or associated caches and servers) storing one or more sets of instructions. The term "computer-readable storage medium" should also be considered as any medium other than a carrier wave capable of storing or encoding sets of instructions for machine execution and causing the machine to perform any or more of the methods described herein. Accordingly, the term "computer-readable storage medium" should be considered as encompassing, but not limited to, non-transient media including solid-state memory, as well as optical and magnetic media.

[0167] To provide a good understanding of several embodiments of the invention, the foregoing description sets forth numerous specific details, such as examples of particular systems, components, methods, etc. However, it will be apparent to those skilled in the art that at least some embodiments of the invention may be practiced without these specific details. In other instances, well-known components or methods have not been described in detail or presented in a simple block diagram format to avoid unnecessarily obscuring the invention. Therefore, the specific details set forth are merely exemplary. Specific implementations may vary from these exemplary details and are still considered to be within the scope of the invention.

[0168] Throughout this specification, references to "an embodiment" or "an embodiment" mean that a particular feature, structure, or characteristic described in connection with an embodiment is included in at least one embodiment. Therefore, the phrases "in one embodiment" or "in an embodiment" appearing throughout this specification do not necessarily refer to the same embodiment. Furthermore, the term "or" is intended to indicate an inclusive "or" rather than an exclusive "or." When the terms "about" or "approximately" are used herein, this is intended to indicate that the presented nominal value is exactly within ±10%.

[0169] Although the operations of the methods described herein are shown and described in a specific order, the order of operations of each method may be changed so that some operations can be performed in reverse order, or that some operations can be performed at least partially concurrently with other operations. In another embodiment, the instructions or sub-operations of different operations may be intermittent and / or alternating. In one embodiment, multiple metal bonding operations are performed as a single step.

[0170] It should be understood that the above description is intended to be illustrative and not restrictive. Many other embodiments will be apparent to those skilled in the art upon reading and understanding the above description. Therefore, the scope of the invention should be determined by reference to the appended claims and the full scope of their equivalents.

Claims

1. A power unit, comprising: A printed circuit board (PCB), the PCB including a power management circuitry system disposed on the PCB; A power source coupled to the PCB, the power source having a height of up to 6 mm, wherein the power source includes at least one capacitor; as well as A housing that encloses at least the power source; The power unit is configured to operate in a vacuum of 0.1 mTorr to 50 mTorr and at a temperature of -20°C to 120°C without cracking or exploding.

2. The power unit of claim 1, wherein the at least one capacitor comprises a plurality of capacitors connected in parallel, in series, or in a combination thereof.

3. The power unit of claim 2, wherein the at least one capacitor comprises sodium chloride.

4. The power unit as claimed in claim 1, wherein the power source itself or together with the PCB is hermetically sealed in the housing.

5. The power unit of claim 1, wherein the power source has a load of 300 mA to 1200 mA.

6. The power unit of claim 1, wherein the power source is capable of operating at a pressure of 30 to 50 millitors.

7. The power unit of claim 1, wherein the power source is capable of operating at temperatures from 0°C to 120°C.

8. The power unit of claim 1, wherein the power source has a mass of 40 g to 60 g.

9. The power unit of claim 1, wherein the power source has an operating time of 15 minutes to 60 minutes.

10. The power unit of claim 9, wherein the power source has a charging time to operating time ratio in the range of 0.5 to 1.

5.

11. The power unit of claim 1, wherein the power source has an energy density of 9 Ws / g to 13 Ws / g.

12. The power unit of claim 1, wherein the power source has an equivalent series resistance (ESR) of up to 1.5 ohms.

13. The power unit as claimed in claim 1, wherein the power source does not deform under vacuum.

14. The power unit of claim 1, wherein the power source is free of heavy metals and lithium.

15. A diagnostic panel, comprising: Disc-shaped main body; A printed circuit board (PCB), the PCB including a circuit system positioned on the PCB; A power source coupled to the PCB, the power source having a height of up to 6 mm, wherein the power source includes at least one capacitor, and wherein the power source is capable of operating in a vacuum of 0.1 mTorr to 50 mTorr and at a temperature of -20°C to 120°C without cracking or exploding; Housing, the housing encapsulating at least the power source; as well as A cover, positioned above the PCB and the power source, wherein the cover shields the PCB and the power source within the interior formed by the disc-shaped body and the cover from the environment outside the disc-shaped body.

16. The diagnostic disc as described in claim 15, The at least one capacitor includes a plurality of capacitors connected in parallel, in series, or in a combination thereof; The at least one capacitor comprises sodium chloride; and The power source is hermetically sealed in the housing, either by itself or together with the PCB.

17. The diagnostic panel of claim 15, wherein the power source has a charging time to running time ratio in the range of 0.5 to 1.

5.

18. A method for operating a diagnostic panel, the method comprising the following steps: Before or after the diagnostic disc is placed into the processing chamber, a secure wireless connection to the computing system is established using the wireless communication circuitry of the diagnostic disc. Sensor data of components disposed in the processing chamber are generated by at least one non-contact sensor of the diagnostic disk under a vacuum of 0.1 mTorr to 50 mTorr and a temperature of -20°C to 120°C. as well as The sensor data is wirelessly transmitted to the computing system via the secure wireless connection using the wireless communication circuit. The diagnostic panel includes: Disc-shaped main body; A printed circuit board (PCB), the PCB including a circuit system disposed on the PCB; A power source coupled to the PCB, the power source having a height of up to 6 mm, wherein the power source includes at least one capacitor, and wherein the power source is capable of operating in a vacuum of 0.1 mTorr to 50 mTorr and at a temperature of -20°C to 120°C without cracking or exploding; Housing, the housing encapsulating at least the power source; and A cover, positioned above the PCB and the power source, wherein the cover shields the circuitry and the power source within the interior formed by the disc-shaped body and the cover from the environment outside the disc-shaped body.

19. The operating method as described in claim 18, further comprising the following steps: The power source is wirelessly charged within the diagnostic disc-shaped body.

20. The operating method of claim 19, wherein the power source has a charging time to operating time ratio in the range of 0.5 to 1.5.

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