Heat dissipation module and projection device

Abstract

A heat dissipation module includes a housing, a cover plate, a pressurizing device, a water pump and a stop valve. The housing includes a bottom plate, and the housing has a water inlet. The cover plate is arranged on one side of the housing relative to the bottom plate. The pressurizing device reciprocates in the housing and has a maximum stroke. The water pump is arranged between the bottom plate and the pressurizing device, wherein the water pump and the pressurizing device are filled with liquid to define a water tank. The stop valve is arranged in the water tank and located between the pressurizing device and the water pump. The maximum stroke of the pressurizing device is the distance between the cover plate and the stop valve. According to the direction, a first height of the water inlet is lower than a second height of the stop valve. The heat dissipation module provided by the present application has a smaller volume and is used for multi-angle flip. The present application also provides a projection device including the heat dissipation module, which has better structural reliability.

Description

TECHNICAL FIELD

[0001] The present application relates to a heat dissipation module and a projection device, and particularly relates to a heat dissipation module with a smaller volume and a projection device using the heat dissipation module. BACKGROUND

[0002] A water-cooling heat dissipation module is composed of a heat sink, a water tank, a water-cooling plate and a water pump. The water pump provides the power source for the whole water-cooling heat dissipation module, so the design of the water pump is very important for the water-cooling heat dissipation module. The water pump and the water tank can be designed as a separated type or an integrated type. If the water pump and the water tank are designed as a separated type, they are independent elements and are connected by a rubber tube or a metal tube. The disadvantage is that a larger space is required. If the water pump and the water tank are designed as an integrated type, the water tank is on the top and the water pump is on the bottom, and they are combined together. The space required for the installation of the water pump and the water tank can be reduced, and thus the volume of the product can be reduced.

[0003] However, no matter whether the water pump and the water tank are designed as an integrated type or a separated type, the fluid level will be reduced due to the dissipation of the pipeline after a long time of operation, and thus the service life of the product with the above-mentioned water-cooling heat dissipation module is reduced. In order to overcome this problem, the volume of the water tank must be increased. This will result in a larger volume of the product, and thus the application range of the water-cooling heat dissipation module and the product thereof is limited. In addition, the design of the water-cooling heat dissipation module is often limited to a single angle application, so when the product has a multi-angle application requirement, the water pump cannot effectively suck the fluid, and thus the water pump is in vain and is burned out.

[0004] The background section is merely intended to help understand the content of the present application, so the content disclosed in the background section can include some known technologies that do not constitute the known technologies known by those skilled in the art. The content disclosed in the background section does not represent that the content or the problems to be solved by one or more embodiments of the present application have been known or recognized by those skilled in the art before the present application is filed. SUMMARY

[0005] The present application provides a heat dissipation module with a smaller volume and used for multi-angle flip.

[0006] The present application also provides a projection device including the above-mentioned heat dissipation module, which has a better structural reliability.

[0007] Other objects and advantages of the present application can be further understood from the technical features disclosed in the present application.

[0008] To achieve one or some or all of the above-mentioned objects, an embodiment of the present application provides a heat dissipation module. The heat dissipation module includes a housing, a cover plate, a pressurizing device, a water pump, and a stop valve. The housing includes a bottom plate, and the housing has a water inlet. The cover plate is disposed on a side of the housing opposite to the bottom plate. The pressurizing device reciprocates in the housing and has a maximum stroke. The water pump is disposed between the bottom plate and the pressurizing device, and a liquid is filled between the water pump and the pressurizing device to define a water tank. The stop valve is disposed in the water tank and located between the pressurizing device and the water pump. The maximum stroke of the pressurizing device is a distance between the cover plate and the stop valve. According to a direction, a first height of the water inlet is lower than a second height of the stop valve.

[0009] To achieve one or some or all of the above-mentioned objects, an embodiment of the present application provides a heat dissipation module. The heat dissipation module includes a housing, a cover plate, a pressurizing device, a water pump, and a stop valve. The housing includes a bottom plate, and the housing has a water inlet. The cover plate is disposed on a side of the housing opposite to the bottom plate. The pressurizing device reciprocates in the housing and has a maximum stroke. The water pump is disposed between the bottom plate and the pressurizing device, and a liquid is filled between the water pump and the pressurizing device to define a water tank. The stop valve is disposed in the water tank and located between the pressurizing device and the water pump. The maximum stroke of the pressurizing device is a distance between the cover plate and the stop valve. According to a direction, a first height of the water inlet is lower than a second height of the stop valve.

[0010] Based on the above, embodiments of the present application have at least one of the following advantages or effects. In the design of the heat dissipation module of the present application, the water pump is disposed between the bottom plate and the pressurizing device, and a liquid is filled between the water pump and the pressurizing device to define a water tank, thereby reducing the space and volume required by the water cooling system. Furthermore, the pressurizing device disposed in the housing can maintain the water tank at a full water level, thereby ensuring that the water pump can effectively suck liquid even during long-term operation. In addition, when the heat dissipation module is applied at multiple angles, because the water tank is always maintained at a full water level, the problem of the water pump being unable to suck liquid and thus being disabled after the water tank is reversed will not occur. In addition, the projection device using the heat dissipation module of the present application can have better structural reliability. BRIEF DESCRIPTION OF DRAWINGS

[0011] Figure 1 is a schematic diagram of a projection device according to an embodiment of the present application.

[0012] Figure 2A is a perspective view of a heat dissipation module in a projection device. Figure 1

[0013] Figure 2B is a perspective view of a heat dissipation module in a projection device. Figure 2A

[0014] Figure 3A is a schematic diagram of a heat dissipation module according to an embodiment of the present application.

[0015] Figure 3B is a schematic diagram of a heat dissipation module according to another embodiment of the present application. DETAILED DESCRIPTION

[0016] The above and other technical contents, features and effects of the present application will be further clarified in the following detailed description of a preferred embodiment with reference to the accompanying drawings. The directional terms mentioned in the following embodiment, such as up, down, left, right, front or back, etc., are only for reference to the directions of the accompanying drawings. Therefore, the directional terms are used for illustration, not for limitation of the present application.

[0017] Figure 1 is a schematic diagram of a projection device according to an embodiment of the present application. Please refer to Figure 1 In the present embodiment, the projection device 10 includes a housing 12, a light source 14, a light engine module 16 and a heat dissipation module 100a. The light source 14 is disposed in the housing 12. The light engine module 16 is disposed in the housing 12, and the light engine module 16 includes a light valve 16a and a projection lens 16b. The light source 14 is used to provide an illumination light beam LI to the light engine module 16. The light valve 16a is used to be disposed on the transmission path of the illumination light beam LI and to convert the illumination light beam LI into an image light beam L2. The projection lens 16b is disposed on the transmission path of the image light beam L2 and is used to project the image light beam L2 out of the projection device 10. That is, the light source 14 is used to emit the illumination light beam LI, and after the conversion by the light valve 16a, the illumination light beam LI is projected out of the projection device 10 through the projection lens 16b to a display screen (not shown). Here, the light source 14 is, for example, a light emitting diode (LED), a laser diode (LD), a high-pressure mercury lamp or other appropriate light source. The heat dissipation module 100a is disposed in the housing 12 and connected to the light engine module 16. In another embodiment, the heat dissipation module 100a can also be connected to the light source 14, which is not limited herein.

[0018] ​​Further, the light valve 16a used in the present embodiment is a reflective light modulator such as a Liquid Crystal On Silicon panel (LCoS panel), a Digital Micro-mirror Device (DMD), and the like. In an embodiment, the light valve 16a is a transmissive light modulator such as a Transparent Liquid Crystal Panel, an Electro-Optical Modulator, a Maganeto-Optic modulator, an Acousto-Optic Modulator (AOM), and the like, but the present embodiment is not limited to the type and kind of the light valve 16a. The method of modulating the illumination beam Ll into the image beam L2 by the light valve 16a can be sufficiently taught, suggested, and implemented by the ordinary knowledge in the art, and thus is not described in detail. In addition, the projection lens 16b includes, for example, one or more optical lenses having a refractive power, such as various combinations of aspherical lenses including a biconcave lens, a biconvex lens, a meniscus lens, a convexo-concave lens, a plano-convex lens, and a plano-concave lens. In an embodiment, the projection lens 16b can also include a planar optical lens to reflect or transmit the image beam L2 from the light valve 16a out of the projection device 10. In this regard, the present embodiment is not limited to the type and kind of the projection lens 16b.

[0019] Figure 2A is a perspective view of a heat dissipation module in a projection device. Figure 1 is a perspective view of the heat dissipation module of Figure 2B Figure 2A is a perspective view of the heat dissipation module of Figure 2A ​In the present embodiment, the heat dissipation module 100a comprises a housing 110, a cover plate 120, a water pump 130, a pressurizing device 140a, and a stop valve 150. The housing 110 comprises a bottom plate 111, and the housing 110 has a water inlet 112. The cover plate 120 is arranged on one side of the housing 110 relative to the bottom plate 111. The housing 110 and the cover plate 120 can be integrally formed or two independent elements, and the present application is not limited thereto. The water pump 130 is arranged between the bottom plate 111 and the pressurizing device 140a, wherein the water pump 130 and the pressurizing device 140a are filled with liquid F to define a water tank W. The pressurizing device 140a reciprocates within the housing 110 and has a maximum stroke. The stop valve 150 is arranged within the water tank W and is located between the pressurizing device 140a and the water pump 130. Here, the maximum stroke of the pressurizing device 140a is the distance T between the cover plate 120 and the stop valve 150. According to the direction D from the bottom plate 111 to the cover plate 120, the first height H1 of the water inlet 112 is lower than the second height H2 of the stop valve 150.

[0020] Further, the housing 110 of the present embodiment further has a water outlet 114, wherein the water outlet 114 is communicated with the water pump 130. Furthermore, the water pump 130 of the present embodiment has a water suction port 132, wherein the water inlet 112 is communicated with the water tank W, and the water inlet 112 is communicated to the water outlet 114 through the water suction port 132. Here, the water pump 130 is, for example, a centrifugal pump, but is not limited thereto.

[0021] Since the present embodiment has the water pump 130 and the water tank W, the heat dissipation module 100a of the present embodiment can be regarded as a water-cooled heat dissipation module. Furthermore, the water pump 130 and the water tank W of the present embodiment are both located within the housing 110, that is, the water pump 130 and the water tank W are combined into one, which can reduce the space and volume required by the water-cooled system. In addition, the present embodiment is provided with the pressurizing device 140a within the housing 110, which can maintain the full water level condition in the water tank W, and can ensure that the water pump 130 can effectively suck the liquid F under long-term operation. In addition, please refer to Figure 2A and Figure 2B When the heat dissipation module 100a is applied at multiple angles, for example, the use range of the heat dissipation module 100a is between 0 and 360 degrees, because the water tank W always maintains the full water level condition, the problem that the water pump can only suck air and thus fails to function after the water tank is reversed and the water level of the water tank decreases and the water pump is located above the water tank will not occur. In other words, the pressurizing device 140a of the present embodiment can maintain the water tank W in the full water state under various angle applications, so that the integrated heat dissipation module 100a can be used under 360-degree operating conditions. On the other hand, the projection device 10 using the heat dissipation module 100a of the present embodiment can have better structural reliability.

[0022] It must be noted that like numerals refer to like elements throughout the several views and embodiments. The embodiments will be described with reference to the figures and will be understood as not limited to the preferred embodiments described, but are applicable to any structure, system and method comprising similar functionalities.

[0023] Figure 3A is a schematic view of a heat dissipation module according to an embodiment of the present application. Please refer to Figure 2A and Figure 3A , the heat dissipation module 100b of the present embodiment is similar to the heat dissipation module 100a of Figure 2A , the difference between them is that in the present embodiment, the pressurizing device 140b of the heat dissipation module 100b comprises a pressurizer 142 and a spring 144, wherein the spring 144 is disposed between the cover plate 120 and the pressurizer 142. When the liquid level P of the liquid F drops, the spring 144 of the pressurizing device 140b is used to apply pressure on the pressurizer 142, and the pressurizer 142 in turn transmits the force to the liquid F. Since the liquid F (for example, water) is an incompressible fluid, after the pressure is applied, a counterforce will be generated, at this time, force balance will be generated on both sides of the pressurizer 142, so that the pressurizer 142 stays at the same height as the liquid level P of the liquid F. Here, the pressurizing device 140b is embodied as a spring type automatic pressurizing device. By the design of the pressurizing device 140b, the water tank W of the heat dissipation module 100b can maintain the full water level condition, which can ensure that the water pump 130 can effectively suck the liquid F under long-term operation.

[0024] Figure 3B is a schematic view of a heat dissipation module according to another embodiment of the present application. Please refer to Figure 2A and Figure 3B , the heat dissipation module 100c of the present embodiment is similar to the heat dissipation module 100a of Figure 2A , the difference between them is that in the present embodiment, the pressurizing device 140c of the heat dissipation module 100c comprises a first magnet 146 and a second magnet 148, wherein the first magnet 146 is disposed between the cover plate 120 and the second magnet 148, and the maximum stroke of the second magnet 148 to the stop valve 150. The first surface S1 of the first magnet 146 and the second surface S2 of the second magnet 148 are opposite to each other and have the same magnetic poles (such as N to N or S to S), wherein through the principle of magnetic repulsion of the same phase, the first magnet 146 and the second magnet 148 can generate a thrust, so that the second magnet 148 stays at the same height as the liquid level P of the liquid F. Here, the pressurizing device 140c is embodied as a magnetic levitation type automatic pressurizing device. By the design of the pressurizing device 140c, the water tank W of the heat dissipation module 100c can maintain the full water level condition, which can ensure that the water pump 130 can effectively suck the liquid F under long-term operation.

[0025] In summary, the embodiments of the present application have at least one of the following advantages or effects. In the design of the heat dissipation module of the present application, the water pump is arranged between the bottom plate and the pressurizing device, and the water pump and the pressurizing device are filled with liquid to define a water tank, thereby reducing the space and volume required by the water cooling system. Furthermore, the pressurizing device arranged in the housing can maintain the full water level in the water tank, which can ensure that the water pump can effectively suck liquid under long-term operation. In addition, when the heat dissipation module is applied at multiple angles, because the water tank always maintains a full water level state, the problem of the water pump being unable to suck liquid and thus losing function due to the water level in the water tank dropping and the water pump being located above the water tank after the known heat dissipation module is reversed will not occur. In addition, the projection device using the heat dissipation module of the present application can have better structural reliability.

[0026] The above description is only the preferred embodiments of the present application, and cannot limit the scope of the present application. Any simple equivalent changes and modifications made according to the claims and the content of the present application are still within the scope of the present application. In addition, any embodiment or claim of the present application does not need to achieve all the purposes, advantages or features disclosed in the present application. In addition, the abstract and title (invention name) are only used to assist patent document retrieval, and are not used to limit the scope of the present application. In addition, the terms "first", "second", etc. mentioned in the specification or claims are only used to name elements or distinguish different embodiments or ranges, and are not used to limit the upper or lower limit of the number of elements.

[0027] Explanation of reference signs:

[0028] 10: projection device

[0029] 12: housing

[0030] 14: light source

[0031] 16: optical engine module

[0032] 16a: optical engine module

[0033] 16b: projection lens

[0034] 100a, 100b, 100c: heat dissipation module

[0035] 110: housing

[0036] 111: bottom plate

[0037] 112: water inlet

[0038] 114: water outlet

[0039] 120: cover plate

[0040] 130: water pump

[0041] 132: water suction port

[0042] 140a, 140b, 140c: pressurizing device

[0043] 142: pressure generator

[0044] 144: spring

[0045] 146: first magnet

[0046] 148: second magnet

[0047] 150: stop valve

[0048] D: direction

[0049] F: liquid

[0050] H1: first height

[0051] H2: second height

[0052] L1: illumination beam

[0053] L2: image beam

[0054] P: liquid surface

[0055] S1: first surface

[0056] S2: second surface

[0057] T: distance

[0058] W: water tank

Claims

1. A heat dissipation module, characterized by, The heat dissipation module comprises a housing, a cover plate, a pressurizing device, a water pump and a stop valve, wherein: The housing comprises a bottom plate, and the housing has a water inlet and a water outlet, and the water outlet of the housing is communicated with the water pump; The cover plate is arranged on one side of the housing relative to the bottom plate, and the water pump, the stop valve and the pressurizing device are sequentially arranged in the housing along the direction from the bottom plate to the cover plate; The pressurizing device reciprocates in the housing and has a maximum stroke; The water pump is arranged between the bottom plate and the pressurizing device, wherein the space between the water pump and the pressurizing device is filled with liquid, and part of the housing, the water pump and the pressurizing device define a water tank; and The stop valve is arranged in the water tank and located between the pressurizing device and the water pump, wherein the maximum stroke of the pressurizing device is the distance between the cover plate and the stop valve, and along the direction from the bottom plate to the cover plate, the first height of the water inlet relative to the bottom plate is lower than the second height of the stop valve relative to the bottom plate, and the height of the water outlet relative to the bottom plate is lower than the first height.

2. The heat dissipation module of claim 1, wherein, The water pump has a water suction inlet, the water inlet is communicated with the water tank, and the water inlet is communicated to the water outlet through the water suction inlet.

3. The heat dissipation module of claim 1, wherein, The pressurizing device comprises a pressurizer and a spring, the spring is arranged between the cover plate and the pressurizer, and the spring is used to apply pressure on the pressurizer to keep the pressurizer at the same level as the liquid surface.

4. The heat dissipation module of claim 3, wherein, The pressurizing device is a spring type automatic pressurizing device.

5. The heat dissipation module of claim 1, wherein, The pressurizing device comprises a first magnet and a second magnet, and the first surface of the first magnet and the second surface of the second magnet are opposite to each other and have the same magnetic pole.

6. The heat dissipation module of claim 5, wherein, The first magnet is arranged between the cover plate and the second magnet, and the second magnet is kept at the same level as the liquid surface.

7. The heat dissipation module of claim 5, wherein, The pressurizing device is a magnetic suspension type automatic pressurizing device.

8. The heat dissipation module of claim 1, wherein, The water pump comprises a centrifugal pump.

9. The heat dissipation module of claim 1, wherein, The heat dissipation module is used in the range of 0 to 360 degrees.

10. A projection apparatus, characterized by, The projection device comprises a housing, a light source, a light machine module and a heat dissipation module, wherein: The light source is arranged in the housing; The light machine module is arranged in the housing, and the light machine module comprises a light valve and a projection lens, wherein the light source is used to provide an illumination light beam to the light machine module, the light valve is arranged in the transmission path of the illumination light beam and used to convert the illumination light beam into an image light beam, and the projection lens is arranged in the transmission path of the image light beam and used to project the image light beam out of the projection device; and The heat dissipation module is arranged in the housing and connected to the light source or the light machine module, and the heat dissipation module comprises a housing, a cover plate, a pressurizing device, a water pump and a stop valve, wherein: The housing comprises a bottom plate, and the housing has a water inlet and a water outlet, and the water outlet of the housing is communicated with the water pump; The cover is arranged on one side of the housing opposite to the base plate, and the water pump, the stop valve and the pressurizing device are sequentially arranged in the housing along a direction from the base plate to the cover; The pressurizing device reciprocates in the housing and has a maximum stroke; The water pump is arranged between the base plate and the pressurizing device, wherein the water pump and the pressurizing device are filled with liquid, and part of the housing, the water pump and the pressurizing device define a water tank; and The stop valve is arranged in the water tank and located between the pressurizing device and the water pump, wherein the maximum stroke of the pressurizing device is a distance between the cover and the stop valve, and along the direction from the base plate to the cover, a first height of the water inlet relative to the base plate is lower than a second height of the stop valve relative to the base plate, and a height of the water outlet relative to the base plate is lower than the first height.

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