A tray structure, a thin film deposition device and a method

Abstract

The present invention discloses a tray structure, a thin film deposition device and a method, wherein the tray structure comprises: a main carrier plate, the upper surface of which comprises a plurality of downwardly depressed portions; a plurality of bearing assemblies, respectively disposed in the depressed portions; a plurality of planetary disks, supported on the bearing assemblies, the planetary disks being used to carry wafers to be processed; a driving gas channel, disposed in the main carrier plate, for providing driving gas to drive the planetary disks to rotate along the bearing assemblies; a cleaning gas channel, disposed in the main carrier plate, for providing cleaning gas to the depressed portions to clean the interior of the depressed portions. The advantages are: the main carrier plate, the planetary disk, the bearing assemblies, the driving gas channels and the cleaning gas channels are combined, and the rotation and revolution of the planetary disks are directly or indirectly realized, which helps to improve the uniformity of thin film deposition of the wafers, and the cleaning gas channels ensure the cleanliness of the environment at the bottom of the planetary disks, and avoid the generation of particle pollutants when the planetary disks and the bearing assemblies rotate to pollute the environment in the cavity.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor equipment, and in particular to a tray structure, a thin film deposition device and a method. Background Art

[0002] In the production process of semiconductor chips, a large amount of micro-processing is required, among which the commonly used method is to use vapor deposition or plasma treatment process to process semiconductor wafers using the principle of its vacuum reaction chamber. Depending on whether the deposition process contains chemical reactions, vapor deposition can be divided into physical vapor deposition (PVD) and chemical vapor deposition (CVD). Among them, CVD is currently the most widely used technology in the semiconductor industry for depositing a variety of materials, including a wide range of insulating materials, most metal materials and metal alloy materials.

[0003] Chemical vapor deposition refers to a method of synthesizing coatings or nanomaterials by reacting chemical gases or vapors on the surface of wafers. The principle is: two or more gaseous raw materials are introduced into a reaction chamber, and then they react chemically with each other to form a new material, which is deposited on the surface of the wafer. During the entire process, the temperature uniformity of the wafer material itself, the concentration and distribution of the reaction gas, the uniformity of the reaction field above the wafer, etc. have a huge impact on the wafer film deposition effect, which directly determines the quality of the film deposited on the wafer.

[0004] In order to improve the influence of the above-mentioned factors on thin film deposition, researchers have proposed a variety of methods to improve the uniformity of thin film deposition quality. For example, multi-zone resistance wire heating technology is used to ensure the temperature uniformity of the base, thereby improving the stability and uniformity of the film growth temperature; or the outer walls around the reaction chamber are heated to maintain the temperature stability around the wafer. In addition, the researchers also used planetary turntable technology to set up multiple small trays carrying wafers on the large tray. The large tray rotates to drive the small turntable to revolve, and the small turntable can also rotate to ensure that the concentration distribution of the reaction gas in contact with the wafers in the same orientation is the same, so as to ensure the uniformity of thin film deposition. However, the existing planetary turntable technology is usually suspended and rotated, which has a complex structure, cumbersome use process and difficult to guarantee process stability. Summary of the invention

[0005] The object of the present invention is to provide a tray structure, a thin film deposition device and a method. The tray structure combines a main carrier plate, a planetary plate, a bearing assembly, a driving gas channel and a clean gas channel, and drives the planetary plate through the driving gas of the driving gas channel to make it rotate along the bearing assembly, thereby ensuring the uniformity of thin film deposition on the wafer on the planetary plate. At the same time, the clean gas channel is used to provide clean gas to ensure the cleanliness of the environment at the bottom of the recessed portion, thereby effectively ensuring the cavity environment in the reaction chamber during wafer etching.

[0006] In order to achieve the above object, the present invention is implemented by the following technical solutions:

[0007] A tray structure, comprising:

[0008] A main carrier plate, the upper surface of which includes a plurality of downwardly recessed portions;

[0009] A plurality of bearing assemblies are respectively disposed in the recessed portions;

[0010] A plurality of planetary disks are supported on the bearing assembly, and the planetary disks are used to carry wafers to be processed;

[0011] A driving gas channel is provided in the main bearing plate and is used to provide driving gas to drive the planetary plate to rotate along the bearing assembly;

[0012] The cleaning gas channel is disposed in the main carrier plate and is used to provide cleaning gas to the recessed portion to clean the interior of the recessed portion.

[0013] Optionally, the driving gas channel includes a plurality of driving gas flow channels for supplying driving gas to the recessed portions and a plurality of driving gas exhaust channels for exhausting driving gas from the recessed portions, and the number of the driving gas flow channels and the driving gas exhaust channels is the same as the number of the recessed portions;

[0014] And / or, the clean gas channel includes a plurality of clean gas flow channels for supplying clean gas to the recessed portions and clean gas exhaust channels for discharging clean gas from the recessed portions, and the number of the clean gas flow channels and the clean gas exhaust channels is the same as the number of the recessed portions.

[0015] Optionally, the driving gas flow channel and the driving gas exhaust channel are obliquely connected to the recessed portion;

[0016] And / or, the clean gas flow channel and the clean gas exhaust channel are connected to the recessed portion along a direction perpendicular to the tangent line of the planetary disk.

[0017] Optionally, a thin film deposition device comprises:

[0018] Reaction chamber;

[0019] A main carrier plate is located inside the reaction chamber, and its upper surface includes a plurality of downwardly recessed portions;

[0020] A plurality of bearing assemblies are respectively disposed in the recessed portions;

[0021] A plurality of planetary disks are supported on the bearing assembly, and the planetary disks are used to carry wafers to be processed;

[0022] A first driving module, used for driving the main carrier plate to rotate;

[0023] A second driving module, comprising a driving gas channel, disposed in the main carrier plate, the driving gas channel being used to provide driving gas to drive the planetary plate to rotate along the bearing assembly;

[0024] The cleaning gas channel is disposed in the main carrier plate and is used to provide cleaning gas to the recessed portion to clean the interior of the recessed portion.

[0025] Optionally, a plurality of impeller blades are arranged on the outer side of the planetary disk, and the gas ejected from the driving gas outlet provided by the second driving module is directed toward the impeller blades, so that the driving gas pushes the planetary disk to rotate along the bearing assembly.

[0026] Optionally, the bearing assembly comprises:

[0027] An annular upper bearing sliding cover connected to the bottom of the planetary disk;

[0028] An annular lower bearing slide rail fixed on the main bearing plate;

[0029] A plurality of balls are arranged between the upper bearing slide cover and the lower bearing slide rail, and the upper bearing slide cover and the lower bearing slide rail restrict the balls within the covering range of the upper bearing slide cover and the lower bearing slide rail.

[0030] Optionally, the clean gas channel is used to provide clean gas, the space between the side wall area of ​​the bearing assembly and the side wall of the recessed portion toward which the gas outlet of the clean gas channel faces forms a clean gas groove, and the clean gas channel is connected to the clean gas groove.

[0031] Optionally, the bearing assembly is connected to a plurality of impeller blades, and the gas ejected from the driving gas outlet provided by the second driving module is directed toward the impeller blades, so that the driving gas drives the bearing assembly to rotate and further drives the planetary disk to rotate.

[0032] Optionally, the bearing assembly comprises:

[0033] An annular upper bearing sliding cover is connected to the bottom of the planetary disk, and each of the impeller blades is connected to the upper bearing sliding cover;

[0034] An annular lower bearing slide rail fixed on the main bearing plate;

[0035] A plurality of balls are arranged between the upper bearing slide cover and the lower bearing slide rail, and the upper bearing slide cover and the lower bearing slide rail restrict the balls within the covering range of the upper bearing slide cover and the lower bearing slide rail.

[0036] Optionally, the clean gas channel is used to provide clean gas, and the space between the planetary disk sidewall area and the recessed portion sidewall toward which the gas outlet of the clean gas channel faces forms a clean gas groove, and the clean gas channel is connected to the clean gas groove.

[0037] Optionally, the groove width of the cleaning gas groove is greater than the distance from the gas outlet of the driving gas channel to the impeller blade.

[0038] Optionally, the upper bearing slide cover and the lower bearing slide rail are both semi-elliptical structures, the ball is arranged between the two, and the diameter of the ball is greater than the minor axis length corresponding to the semi-ellipse.

[0039] Optionally, the upper bearing slide cover is a cover plate structure, the lower bearing slide rail is a groove structure, the ball is arranged in the groove structure, and the diameter of the ball is greater than the groove depth of the groove structure.

[0040] Optionally, the inner bottom of the groove structure is further provided with a plurality of supporting parts on the periphery of the ball, and the supporting parts are used to fix the ball;

[0041] And / or, a plurality of supporting parts are further arranged at the bottom of the cover plate structure on the periphery of the ball, and the supporting parts are used to fix the ball.

[0042] Optionally, the upper bearing slide cover includes a first inclined rolling portion on the outer side and a first supporting portion on the inner side, and the lower bearing slide rail includes a second supporting portion on the outer side and a second inclined rolling portion on the inner side. When the upper bearing slide cover does not apply pressure to the lower bearing slide rail, the ball is located on the second supporting portion due to the influence of gravity. When the upper bearing slide cover applies pressure to the lower bearing slide rail, the first inclined rolling portion drives the ball to move upward from the second supporting portion to the second inclined rolling portion.

[0043] Optionally, a method of the thin film deposition device comprises:

[0044] Drive the main carrier plate to rotate by a first driving module;

[0045] The planetary disk is driven to rotate along the bearing assembly by driving gas provided by the second driving module;

[0046] The clean gas passage provides clean gas to clean the bottom of the planetary disk.

[0047] Optionally, the gas flow rate of the cleaning gas is smaller than the gas flow rate of the driving gas.

[0048] Compared with the prior art, the present invention has the following advantages:

[0049] In a tray structure and a thin film deposition device thereof of the present invention, the tray structure combines a main carrier plate, a planetary plate, a bearing assembly, a driving gas channel and a clean gas channel, and drives the planetary plate through the driving gas of the driving gas channel to make it rotate along the bearing assembly, thereby ensuring the uniformity of thin film deposition on the wafer on the planetary plate. At the same time, the clean gas channel is used to provide clean gas to ensure the cleanliness of the environment at the bottom of the recessed portion, effectively ensuring the cavity environment in the reaction chamber when the wafer is etched.

[0050] Furthermore, the thin film deposition device combines a main carrier disk, a planetary disk, a bearing assembly, a first drive module, a second drive module and a clean gas channel, and drives the main carrier disk to rotate by the first drive module to realize the revolution of the planetary disk. The driving gas of the second drive module directly or indirectly drives the planetary disk to rotate along the bearing assembly, thereby ensuring the uniformity of thin film deposition on the wafers on the planetary disk, and the bearing assembly ensures the stability of the planetary disk during rotation. At the same time, a clean gas channel is used to provide clean gas to ensure the cleanliness of the environment at the bottom of the planetary disk, thereby avoiding particulate contaminants generated when the planetary disk and the bearing assembly rotate to pollute the cavity environment. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] Figure 1 A schematic diagram of a tray structure of the present invention;

[0052] Figure 2 A top view of a main carrier plate of the present invention;

[0053] Figure 3 It is a partial schematic diagram of a thin film deposition device of the present invention;

[0054] Figure 4 A schematic diagram of a driving gas channel of the present invention;

[0055] Figure 5 A schematic diagram of a clean gas passage of the present invention;

[0056] Figure 6 A bearing assembly of the present invention;

[0057] Figure 7 A bearing assembly according to the present invention;

[0058] Figure 8 A bearing assembly with a support portion according to the present invention;

[0059] Fig. 9Another bearing assembly with a support portion of the present invention;

[0060] Fig.10 A bearing assembly according to the present invention;

[0061] Fig.11 It is another schematic diagram of the structure of a tray of the present invention;

[0062] Fig.12 A partial schematic diagram of another thin film deposition device of the present invention;

[0063] Fig.13 It is a schematic diagram of the working method of the thin film deposition device of the present invention. DETAILED DESCRIPTION

[0064] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0065] It should be noted that, in this article, the terms "include", "comprises", "has" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or terminal device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or terminal device. In the absence of further restrictions, the elements defined by the sentence "includes..." or "comprising..." do not exclude the existence of other elements in the process, method, article or terminal device including the elements.

[0066] It should be noted that the drawings are all in very simplified form and use inaccurate ratios, and are only used to conveniently and clearly assist in explaining an embodiment of the present invention.

[0067] Embodiment 1

[0068] like Figure 1 and Figure 2As shown in combination, a tray structure of the present invention comprises: a main carrier plate 110, a plurality of planetary plates 120, a plurality of bearing assemblies 130, a driving gas channel 151 and a cleaning gas channel 160. The upper surface of the main carrier plate 110 comprises a plurality of downwardly concave portions 111, each bearing assembly 130 is respectively arranged in the concave portion 111, each planetary plate 120 is respectively supported on the bearing assembly 130, and the planetary plate 120 is used to carry the wafer to be processed. The driving gas channel 151 is arranged in the main carrier plate 110, and is used to provide driving gas to drive the planetary plate 120 to rotate along the bearing assembly 130. The cleaning gas channel 160 is arranged in the main carrier plate 110, and is used to provide cleaning gas to the concave portion 111 to clean the inside of the concave portion 111. The tray structure directly or indirectly drives the planetary disk 120 to rotate along the bearing assembly 130 by driving the driving gas of the gas channel 151, thereby ensuring the uniformity of thin film deposition on the wafers on the planetary disk 120, and the bearing assembly 130 ensures the stability of the planetary disk 120 during its rotation. At the same time, the clean gas channel 160 is used to provide clean gas to ensure the cleanliness of the environment at the bottom of the planetary disk 120, i.e., the bottom of the recessed portion 111, to avoid particulate contaminants generated when the planetary disk 120 and the bearing assembly 130 rotate to pollute the environment inside the cavity.

[0069] like Figure 3 and Figure 4 As shown in combination, it is a partial schematic diagram of a thin film deposition device 100 of the present invention, and the device includes the tray structure, specifically, the device includes: a reaction chamber, a main carrier plate 110, a plurality of planetary plates 120, a plurality of bearing assemblies 130, a first driving module 140, a second driving module 150 and a clean gas channel 160. The main carrier plate 110 is located inside the reaction chamber, and its upper surface includes a plurality of downwardly concave portions 111, the bearing assembly 130 is disposed in the concave portion 111, the planetary plate 120 is supported on the bearing assembly 130, the planetary plate 120 can rotate along the bearing assembly 130, and the planetary plate 120 is used to carry the wafer to be processed.

[0070] The first driving module 140 is used to drive the main carrier plate 110 to rotate, thereby driving the planetary disk 120 on the main carrier plate 110 to rotate, that is, the main carrier plate 110 drives the planetary disk 120 to revolve. The second driving module 150 includes a driving gas channel 151, and the driving gas channel 151 is used to provide driving gas to directly or indirectly drive the planetary disk 120 to rotate along the bearing assembly 130, that is, the planetary disk 120 can rotate under the action of the driving gas. The planetary disk 120 rotates along the bearing assembly 130. The bearing assembly 130 rotates multiple times and may wear and produce particulate contaminants. In order to avoid contamination of the reaction chamber, the clean gas channel 160 provides clean gas to clean the bottom of the planetary disk 120. Even if particulate contaminants are generated, they will be discharged from the reaction chamber with the clean gas flow, effectively ensuring a clean environment in the reaction chamber, and further ensuring that the thin film deposition is not disturbed.

[0071] In this embodiment, if Figure 4 As shown, the driving gas channel 151 includes a driving gas supply pipeline 152 located at the center side of the main carrier disk 110, a plurality of driving gas flow channels 153 extending from the driving gas supply pipeline 152 to the recessed portion 111, and a plurality of driving gas exhaust channels 154 between the recessed portion 111 and the outer wall of the main carrier disk 110, wherein the driving gas flow channel 153 is used to provide driving gas to the recessed portion 111, and the driving gas exhaust channel 154 is used for the recessed portion 111 to discharge driving gas to the outside of the main carrier disk 110. Specifically, the driving gas supply pipeline 152 is a circular channel, and the number of the driving gas flow channels 153 and the driving gas exhaust channels 154 is the same as the number of the planetary disks 120 / recessed portions 111, so that each planetary disk 120 can realize rotation while orbiting. Preferably, the driving gas flow channel 153 is obliquely connected to the recessed portion 111 to obliquely input the driving gas into the recessed portion 111, so as to more efficiently use the driving force of the driving gas to drive the planetary disk 120 to rotate. The driving gas exhaust channel 154 is obliquely connected to the recessed portion 111 so that the driving gas in the recessed portion 111 is discharged outside the main carrier disk 110. Optionally, the first driving module 140 is a mechanical driving device, for example, a motor and a transmission shaft are used to realize the rotation of the main carrier disk 110, and the first driving module 140 is not limited here.

[0072] like Figure 5As shown, the clean gas channel 160 includes a clean gas supply pipeline 161 located at the center side of the main carrier 110, a plurality of clean gas flow channels 162 extending from the clean gas supply pipeline 161 to the recessed portion 111, and a plurality of clean gas exhaust channels 163 between the recessed portion 111 and the outer wall of the main carrier 110. The clean gas flow channel 162 is used to supply clean gas to the recessed portion 111, and the clean gas exhaust channel 163 is used for the recessed portion 111 to exhaust clean gas to the outside of the main carrier 110. The space between the side wall area of ​​the bearing assembly 130 and the side wall of the recessed portion 111, which the clean gas outlet of the clean gas flow channel 162 faces, forms a clean gas groove 164. In this embodiment, the clean gas supply pipeline 161, the clean gas flow channel 162, the clean gas groove 164 of the recessed portion 111, and the clean gas exhaust channel 163 are connected so that the clean gas is input into the recessed portion 111 and discharged into the space outside the outer wall of the main carrier. Further, the number of the clean gas flow channels 162 and the clean gas exhaust channels 163 is the same as the number of the planetary disks 120 / recesses 111, so as to clean the bottom of each planetary disk 120, that is, the bottom space of the recesses 111. Preferably, the clean gas flow channels 162 and the clean gas exhaust channels 163 are connected to the recesses 111 in a direction perpendicular to the tangent of the planetary disk 120, that is, the two channels are facing the planetary disk 120, so as to better clean the bottom space of the recesses 111.

[0073] In this embodiment, the cleaning gas outlet is arranged opposite to the bearing assembly 130, and the gas flow rate of the cleaning gas is much smaller than the gas flow rate of the driving gas. This can be achieved by setting the diameter of the cleaning gas channel 160 to be smaller than the diameter of the driving gas channel 151 of the second driving module 150, or by setting the flow rates of each gas from the gas supply device.

[0074] In this embodiment, the bearing assembly 130 is fixed to the main carrier plate 110 through a groove structure to ensure the stability of the bottom of the bearing assembly 130, so that the bearing assembly 130 will not be offset due to the rotation of the planetary plate 120, thereby ensuring the film deposition effect. Of course, the fixing of the bearing assembly 130 is not limited to the above, and other methods can be used as long as the bottom of the bearing assembly 130 can be always fixed on the main carrier plate 110. For example, in another embodiment, the bottom of the bearing assembly 130 is welded to the main carrier plate 110.

[0075] Furthermore, a plurality of impeller blades 170 are provided on the outer side of the planetary disk 120, and the gas ejected from the driving gas outlet provided by the second driving module 150 is directed toward the impeller blades 170, so that the driving gas directly drives the planetary disk 120 to rotate along the bearing assembly 130. In this embodiment, the driving gas of the second driving module 150 directly acts on the impeller blades 170 on the outer side of the planetary disk 120 to directly drive the planetary disk 120 to rotate, thereby reducing the loss of driving force. Since the bottom of the planetary disk 120 is a slidable bearing assembly 130, the planetary disk 120 can realize self-rotation under the action of the driving gas.

[0076] In this embodiment, the driving gas channel 151 is located above the cleaning gas channel 160. The groove width of the cleaning gas groove 164 is greater than the width of the space 155 from the driving gas outlet to the impeller blade 170, so that the planetary disk 120 obtains a larger driving force, realizes the maximum utilization of the driving force, and ensures that the cleaning gas smoothly transports the particles to the outside of the main carrier disk 110, and does not carry a large amount of particles upward to the wafer, thereby avoiding affecting the driving effect of the driving gas and also avoiding particle contamination of the reaction chamber.

[0077] In the present embodiment, the impeller blade 170 is made of the same material as the planetary disk 120 so that the two can be better connected and the structural stability can be enhanced. The material of the bearing assembly is not limited. Preferably, the impeller blade 170 and the planetary disk 120 are integrally formed to reduce the assembly process. Of course, the materials used to make the two can also be different, and the assembly of the two can be achieved by mechanical connection or welding. In the present embodiment, the mechanical strength and thermal conductivity of the bearing assembly 130, the planetary disk 120 and the impeller blade 170 are quite different. Specifically, the planetary disk 120 and the impeller blade 170 are made of graphite and SiC, and the bearing assembly 130 is made of SiN and ruby. The bearing assembly 130 has sufficient mechanical strength to support the planetary disk 120.

[0078] Optionally, each of the impeller blades 170 is connected vertically or obliquely to the planetary disk 120. In this embodiment, each of the impeller blades 170 is connected obliquely to the planetary disk 120 and has the same oblique angle. The driving gas outlet provided by the second driving module 150 blows air toward the oblique impeller blades 170, so that the planetary disk 120 can obtain more driving force with the help of the impeller blades 170 and then rotate. Furthermore, each of the impeller blades 170 is evenly arranged on the outside of the planetary disk 120, so that the driving force obtained by each direction of the planetary disk 120 is the same, which is conducive to ensuring the stability of the rotation speed of the planetary disk 120.

[0079] In this embodiment, the bearing assembly 130 includes: an annular upper bearing slide cover 131 , an annular lower bearing slide rail 132 and a plurality of balls 133 .

[0080] Specifically, the upper bearing slide cover 131 is connected to the bottom of the planetary disk 120, the lower bearing slide rail 132 is fixed on the main carrier disk 110, and the ball 133 is arranged between the upper bearing slide cover 131 and the lower bearing slide rail 132. The upper bearing slide cover 131 and the lower bearing slide rail 132 restrict the ball 133 within the covering range of the upper bearing slide cover 131 and the lower bearing slide rail 132, and the ball 133 makes the upper bearing slide cover 131 and the lower bearing slide rail 132 non-contact in the initial state. In this embodiment, the ball 133 is always between the upper bearing slide cover 131 and the lower bearing slide rail 132, and the ball 133 makes there is no contact between the upper bearing slide cover 131 and the lower bearing slide rail 132 in the initial state. When the driving gas of the second driving module 150 drives the planetary disk 120 to rotate, it also drives the upper bearing slide cover 131 connected thereto to rotate. When the upper bearing slide cover 131 rotates, there is no friction between it and the lower bearing slide rail 132, and there is only a small friction between the upper bearing slide cover 131 and the ball 133, so that the driving force of the driving gas can fully act on the rotation of the planetary disk 120.

[0081] In order to ensure that the upper bearing slide cover 131 rotates with the planetary disk 120, balls 133 are arranged in the 70-80% coverage range between the upper bearing slide cover 131 and the lower bearing slide rail 132. In this range, there are enough balls 133 to support the upper bearing slide cover 131, and the space between the upper bearing slide cover 131 and the lower bearing slide rail 132 is such that there is no blockage between the balls 133 to affect the rotation of the upper bearing slide cover 131.

[0082] The bearing assembly may adopt different structures according to different usage scenarios. Figure 6 As shown, in one embodiment, the upper bearing slide cover 131 and the lower bearing slide rail 132 are both semi-elliptical structures, the upper bearing slide cover 131 is connected to the planetary disk 120, and the ball 133 is arranged between the two. The diameter of the ball 133 is larger than the short axis length corresponding to the semi-ellipse, so that when the upper bearing slide cover 131 rotates with the planetary disk 120, it does not contact the lower bearing slide rail 132, thereby avoiding the generation of friction between the two and realizing the maximum use of driving force.

[0083] like Figure 7As shown, in another embodiment, the upper bearing slide cover 131 is a cover plate structure, the cover plate is connected to the planetary disk 120, the lower bearing slide rail 132 is a groove structure, the ball 133 is arranged in the groove structure, and the diameter of the ball 133 is greater than the groove depth of the groove structure. When the driving gas drives the planetary disk 120 to rotate, the cover plate structure rotates with the planetary disk 120, and the ball 133 in the groove structure enables the cover plate structure to roll better, and the diameter of the ball 133 is greater than the groove depth of the groove structure, that is, the cover plate structure and the groove structure have no contact in the initial state, avoiding the generation of friction between the two and reducing the loss of driving force.

[0084] Furthermore, the bottom of the groove structure is provided with a plurality of support portions 138 on the periphery of the ball 133, and the support portions 138 are used to fix the ball 133. In this embodiment, the support portion 138 includes an annular inclined support surface, and the inclined support surface is in contact with the ball 133. Figure 8 As shown, the bottom of the groove structure is provided with support parts 138 on both sides of the ball 133. When the ball 133 rolls in the groove structure, it moves along the path between the two support parts 138 to reduce the uncertainty of the path of the ball 133 in the groove structure, and avoid the micro-deviation of the cover plate structure's rotation caused by the micro-deviation of the path of the ball 133. Based on the same principle, further, the bottom of the cover plate structure is further provided with a plurality of support parts 138 on the periphery of the ball 133, and the support parts 138 are used to fix the ball 133. Fig. 9 As shown, in Figure 8 On the basis of the above, the bottom of the cover plate structure is provided with support parts 138 on both sides of the ball 133 to further fix the rolling path of the ball 133 and improve the stability of the rotation of the cover plate structure. In practical applications, the bearing assembly can be provided with a plurality of support parts 138 on the cover plate structure and / or the groove structure according to actual needs, and the specific setting position and number of the support parts 138 are not limited here.

[0085] like Fig.10As shown, in another embodiment, the upper bearing slide cover 131 includes an outer first inclined rolling portion 134 and an inner first supporting portion 135, and the lower bearing slide rail 132 includes an outer second supporting portion 136 and an inner second inclined rolling portion 137. When the upper bearing slide cover 131 does not apply pressure to the lower bearing slide rail 132, the ball is located on the second supporting portion 136 due to the influence of gravity, and when the upper bearing slide cover 131 applies pressure to the lower bearing slide rail 132, the first inclined rolling portion 134 drives the ball to move upward from the second supporting portion 136 to the second inclined rolling portion 137, and the upper bearing slide cover 131 can be displaced relative to the lower bearing slide rail 132, that is, rotated. When the upper bearing slide cover 131 rotates with the planetary disk 120, the ball 133 is always between the first inclined rolling portion 134 and the second inclined rolling portion 137, and the ball 133 rolls between the upper bearing slide cover 131 and the lower bearing slide rail 132 as the upper bearing slide cover 131 rotates, so that the upper bearing slide cover 131 slides better.

[0086] Embodiment 2

[0087] Based on the structural characteristics of the tray structure and the thin film deposition device 200 of the first embodiment, this embodiment makes some changes to the tray structure and the thin film deposition device 200, mainly to the impeller blades 270. Fig.11 and Fig.12 The figure shows a partial structural diagram of the tray structure and the thin film deposition device 200 of this embodiment.

[0088] In this embodiment, the bearing assembly 230 is connected to a plurality of impeller blades 270, and each impeller blade 270 is respectively arranged on the outside of the bearing assembly 230. The driving gas outlet provided by the driving gas channel 251 of the second driving module 250 sprays gas toward the impeller blade 270, so that the driving gas pushes the bearing assembly 230 to rotate and then drives the planetary disk 220 to rotate.

[0089] In this embodiment, the first driving module 240 is used to drive the main carrier disk 210 to rotate, and the main carrier disk 210 rotates to drive the planetary disk 220 to revolve. The driving gas provided by the driving gas channel 251 of the second driving module 250 indirectly drives the planetary disk 220 to rotate along the bearing assembly 230. When the planetary disk 220 rotates along the bearing assembly 230, wear and tear may occur to produce particulate pollutants. The clean gas channel 260 provides clean gas to clean the bottom of the planetary disk 220. Even if particulate pollutants are generated, they will be discharged from the reaction chamber with the clean gas flow, effectively ensuring that the environment in the reaction chamber is clean and tidy, so that the film deposition is not disturbed. Further, in this embodiment, the impeller blade 270 is connected to the bearing assembly 230. When the impeller blade 270 is worn, it is only necessary to reprocess the bearing assembly 230, avoiding the processing of the planetary disk 220, reducing the processing difficulty, and facilitating practical applications.

[0090] In this embodiment, the clean gas outlet is located above the driving gas outlet, and the gas flow rate of the clean gas is much lower than that of the driving gas. The driving gas drives the bearing assembly 230 with the impeller blade 270 and the planetary disk 220 to rotate, which may generate particle pollutants at the bottom of the planetary disk 220. The clean gas channel 260 above the driving gas outlet prevents the particle pollutants from drifting above the planetary disk 220, thereby avoiding contamination of the reaction chamber and ensuring the film deposition environment.

[0091] Furthermore, a clean gas groove 264 is formed in the space between the side wall area of ​​the planetary disk 220 and the side wall of the recessed portion 211 toward which the clean gas outlet of the clean gas channel 260 faces, and the clean gas channel 260 is connected to the clean gas groove 264. The groove width of the clean gas groove 264 is greater than the width of the space 255 from the driving gas outlet to the impeller blade 270, so that the bearing assembly 230 obtains a larger driving force, realizes the maximum utilization of the driving force, and ensures that the clean gas channel 260 does not affect the driving effect of the driving gas.

[0092] Furthermore, the bearing assembly 230 includes: an annular upper bearing slide cover, an annular lower bearing slide rail and a plurality of balls.

[0093] The upper bearing slide cover is connected to the planetary disk 220, each of the impeller blades 270 is connected to the upper bearing slide cover, and the lower bearing slide rail is fixed on the main carrier disk 210. Each ball is arranged between the upper bearing slide cover and the lower bearing slide rail, and the upper bearing slide cover and the lower bearing slide rail restrict the ball within the covering range of the upper bearing slide cover and the lower bearing slide rail. The ball makes the upper bearing slide cover and the lower bearing slide rail non-contact in the initial state, and the upper bearing slide cover can slide relative to the lower bearing slide rail. When the upper bearing slide cover slides, it drives the planetary disk 220 connected thereto to move.

[0094] In actual use, the ball bearings are always between the upper bearing slide cover and the lower bearing slide rail, and the ball bearings make the upper bearing slide cover and the lower bearing slide rail non-contact in the initial state, and the driving gas of the second driving module 250 applies driving force to the impeller rotor 270 to cause the upper bearing slide cover connected thereto to rotate, thereby driving the planetary disk 220 connected to the upper bearing slide cover to rotate along the bearing assembly 230. When the upper bearing slide cover rotates, there is no friction between it and the lower bearing slide rail, and only a small friction exists between the upper bearing slide cover and the ball bearings, so as to reduce the loss of the driving force applied by the driving gas.

[0095] In this embodiment, the bearing assembly 230 may adopt different structures according to different usage scenarios. As described in the first embodiment, the bearing assembly 230 may be a combination of a cover plate structure, a ball bearing and a groove structure, or a combination of two semi-elliptical structures and a ball bearing, which will not be limited or elaborated herein.

[0096] In this embodiment, a plurality of impeller blades 270 are arranged on the outer side of the upper bearing slide cover, and the driving gas outlet provided by the second driving module 250 is arranged opposite to the impeller blades 270, and the driving gas is used to directly drive the upper bearing slide cover and the planetary disk 220 to rotate along the bearing assembly 230. In this embodiment, the driving gas of the second driving module 250 directly acts on the impeller blades 270 on the outer side of the upper bearing slide cover to indirectly drive the planetary disk 220 to rotate.

[0097] In this embodiment, the impeller rotor 270 and the upper bearing slide cover are made of the same material so that the two can be better connected and the structural stability can be enhanced. The material of the lower bearing slide rail is not limited. Preferably, the impeller rotor 270 and the upper bearing slide cover are integrally formed to reduce the assembly process. Of course, the materials of the two can also be different, and the two can be assembled by mechanical connection or welding.

[0098] Optionally, each of the impeller blades 270 is connected vertically or obliquely to the upper bearing slide cover. In this embodiment, each of the impeller blades 270 is connected obliquely to the upper bearing slide cover and has the same oblique angle, and the driving gas outlet provided by the second driving module 250 blows air toward the oblique impeller blades 270, so that the upper bearing slide cover can obtain more driving force with the help of the impeller blades 270 and then drive the planetary disk 220 to rotate. Furthermore, each of the impeller blades 270 is evenly arranged on the outside of the upper bearing slide cover, so that the driving force obtained by the upper bearing slide cover and the planetary disk 220 in each direction is the same, which is conducive to ensuring the stability of the rotation speed of the planetary disk 220.

[0099] In addition, other structures and working modes of each component of this embodiment, such as the working mode of the first driving module 240, the setting of the driving gas channel 251, the cleaning gas channel 260 and the fixing method of the bearing assembly 230, are the same as those in the first embodiment and will not be repeated here.

[0100] like Fig.13 As shown, based on the same inventive concept, the present invention also provides a working method of the thin film deposition device 100, the method comprising:

[0101] The main carrier plate 110 is driven to rotate by the first driving module 140, and the rotation of the main carrier plate 110 drives the planetary plate 120 to revolve;

[0102] The planetary disk 120 is driven to rotate along the bearing assembly 130 by the driving gas provided by the second driving module 150. The bearing assembly 130 provides a fixed rotation track for the planetary disk 120, so that the planetary disk 120 can be displaced relative to the main bearing disk 110, and the planetary disk 120 can rotate under the driving force of the driving gas;

[0103] The clean gas channel 160 provides clean gas to clean the bottom of the planetary disk 120 , thereby ensuring the cleanliness of the environment at the bottom of the planetary disk 120 and avoiding particle pollution and metal pollution.

[0104] In order to ensure that the driving force of the driving gas is not affected by external forces, the gas flow rate of the cleaning gas is much smaller than the gas flow rate of the driving gas. The gas flow rate of the cleaning gas is only enough to bring the impurities generated when the bearing assembly or the planetary disk 120 rotates out of the reaction chamber, so that the thin film deposition is not disturbed, thereby ensuring the quality of the thin film deposition.

[0105] To summarize, in a tray structure, a thin film deposition device 100 and a method of the present invention, the tray structure combines a main carrier plate 110, a planetary disk 120, a bearing assembly 130, a driving gas channel 151 and a clean gas channel 160, and drives the planetary disk 120 through the driving gas of the driving gas channel 151 to rotate along the bearing assembly 130, thereby ensuring the uniformity of thin film deposition on the wafer on the planetary disk 120. At the same time, the clean gas channel 160 is used to provide clean gas to ensure the cleanliness of the environment at the bottom of the recess 111, thereby effectively ensuring the cavity environment in the reaction chamber during wafer etching.

[0106] Furthermore, the thin film deposition device 100 of the present invention combines a main carrier plate 110, a planetary plate 120, a bearing assembly 130, a first drive module 140, a second drive module 150 and a clean gas channel 160, etc. The main carrier plate 110 is driven to rotate by the first drive module 140 to realize the revolution of the planetary plate 120, and the planetary plate 120 is directly or indirectly driven to rotate along the bearing assembly 130 by the driving gas of the second drive module 150. The bearing assembly 130 ensures the stability of the planetary plate 120 during its rotation. At the same time, the clean gas channel 160 is used to provide clean gas to ensure the cleanliness of the environment at the bottom of the planetary plate 120, so as to avoid particulate pollutants generated when the planetary plate 120 and the bearing assembly 130 rotate to pollute the cavity environment.

[0107] Although the content of the present invention has been described in detail through the above preferred embodiments, it should be appreciated that the above description should not be considered as a limitation of the present invention. After reading the above content, it will be apparent to those skilled in the art that various modifications and substitutions of the present invention will occur. Therefore, the protection scope of the present invention should be limited by the appended claims.

Claims

1. A tray structure, characterized in that: Include: A main carrier plate, the upper surface of which includes a plurality of downwardly recessed portions; A plurality of bearing assemblies are respectively disposed in the recessed portions; A plurality of planetary disks are supported on the bearing assembly, and the planetary disks are used to carry wafers to be processed; Wherein, the bearing assembly comprises: An annular upper bearing sliding cover connected to the bottom of the planetary disk; An annular lower bearing slide rail fixed on the main bearing plate; A plurality of balls are arranged between the upper bearing slide cover and the lower bearing slide rail, and the upper bearing slide cover and the lower bearing slide rail restrict the balls within the covering range of the upper bearing slide cover and the lower bearing slide rail; A driving gas channel is provided in the main bearing plate and is used to provide driving gas to drive the planetary plate to rotate along the bearing assembly; The cleaning gas channel is disposed in the main carrier plate and is used to provide cleaning gas to the recessed portion to clean the interior of the recessed portion.

2. The tray structure according to claim 1, characterized in that: The driving gas channel comprises a plurality of driving gas flow channels for supplying driving gas to the recessed portions and a plurality of driving gas exhaust channels for exhausting driving gas from the recessed portions, and the number of the driving gas flow channels and the driving gas exhaust channels is the same as the number of the recessed portions; And / or, the clean gas channel includes a plurality of clean gas flow channels for supplying clean gas to the recessed portions and clean gas exhaust channels for discharging clean gas from the recessed portions, and the number of the clean gas flow channels and the clean gas exhaust channels is the same as the number of the recessed portions.

3. The tray structure according to claim 2, characterized in that: The driving gas flow channel and the driving gas exhaust channel are obliquely connected to the recessed portion; And / or, the clean gas flow channel and the clean gas exhaust channel are connected to the recessed portion along a direction perpendicular to the tangent line of the planetary disk.

4. A thin film deposition device, characterized in that: Include: Reaction chamber; A main carrier plate, located inside the reaction chamber, and having an upper surface including a plurality of downwardly recessed portions; A plurality of bearing assemblies are respectively disposed in the recessed portions; A plurality of planetary disks are supported on the bearing assembly, and the planetary disks are used to carry wafers to be processed; Wherein, the bearing assembly comprises: An annular upper bearing sliding cover connected to the bottom of the planetary disk; An annular lower bearing slide rail fixed on the main bearing plate; A plurality of balls are arranged between the upper bearing slide cover and the lower bearing slide rail, and the upper bearing slide cover and the lower bearing slide rail restrict the balls within the covering range of the upper bearing slide cover and the lower bearing slide rail; A first driving module, used for driving the main carrier plate to rotate; A second driving module, comprising a driving gas channel, disposed in the main carrier plate, the driving gas channel being used to provide driving gas to drive the planetary plate to rotate along the bearing assembly; The cleaning gas channel is disposed in the main carrier plate and is used to provide cleaning gas to the recessed portion to clean the interior of the recessed portion.

5. The thin film deposition device according to claim 4, characterized in that: A plurality of impeller blades are arranged outside the planetary disk, and the gas ejected from the driving gas outlet provided by the second driving module is directed toward the impeller blades, so that the driving gas drives the planetary disk to rotate along the bearing assembly.

6. The thin film deposition device according to claim 5, characterized in that: The clean gas channel is used to provide clean gas, and the space between the side wall area of ​​the bearing assembly and the side wall of the recessed portion, to which the gas outlet of the clean gas channel faces, forms a clean gas groove, and the clean gas channel is connected to the clean gas groove.

7. The thin film deposition device according to claim 4, characterized in that: The bearing assembly is connected to a plurality of impeller blades, and the gas ejected from the driving gas outlet provided by the second driving module is directed toward the impeller blades, so that the driving gas drives the bearing assembly to rotate and then drives the planetary disk to rotate.

8. The thin film deposition device according to claim 7, characterized in that: Each of the impeller blades is connected to the upper bearing sliding cover.

9. The thin film deposition device according to claim 7, characterized in that: The clean gas channel is used to provide clean gas, and the space between the planetary disk sidewall area and the recessed portion sidewall toward which the gas outlet of the clean gas channel faces forms a clean gas groove, and the clean gas channel is connected to the clean gas groove.

10. The thin film deposition device according to claim 6 or 9, characterized in that: The groove width of the cleaning gas groove is greater than the distance from the gas outlet of the driving gas channel to the impeller blade.

11. The thin film deposition device according to claim 4, characterized in that: The upper bearing slide cover and the lower bearing slide rail are both semi-elliptical structures, the ball is arranged between the two, and the diameter of the ball is greater than the minor axis length corresponding to the semi-ellipse.

12. The thin film deposition device according to claim 4, characterized in that: The upper bearing slide cover is a cover plate structure, the lower bearing slide rail is a groove structure, the ball is arranged in the groove structure, and the diameter of the ball is greater than the groove depth of the groove structure.

13. The thin film deposition device according to claim 12, characterized in that: The inner bottom of the groove structure is also provided with a plurality of supporting parts on the periphery of the ball, and the supporting parts are used to fix the ball; And / or, a plurality of supporting parts are further arranged at the bottom of the cover plate structure on the periphery of the ball, and the supporting parts are used to fix the ball.

14. The thin film deposition device according to claim 4, characterized in that: The upper bearing slide cover includes a first inclined rolling portion on the outer side and a first supporting portion on the inner side, and the lower bearing slide rail includes a second supporting portion on the outer side and a second inclined rolling portion on the inner side. When the upper bearing slide cover does not apply pressure to the lower bearing slide rail, the ball is located on the second supporting portion due to the influence of gravity. When the upper bearing slide cover applies pressure to the lower bearing slide rail, the first inclined rolling portion drives the ball to move upward from the second supporting portion to the second inclined rolling portion.

15. A method for operating a thin film deposition device according to any one of claims 4 to 14, characterized in that: Include: Drive the main carrier plate to rotate by a first driving module; The planetary disk is driven to rotate along the bearing assembly by driving gas provided by the second driving module; The clean gas passage provides clean gas to clean the bottom of the planetary disk.

16. The operating method of the thin film deposition device according to claim 15, characterized in that: A gas flow rate of the cleaning gas is lower than a gas flow rate of the driving gas.

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