Circuit board for light emitting diode assembly, backlight unit including the same, and image display apparatus including the same

Abstract

A circuit board for a light emitting diode assembly, a backlight unit including the same, and an image display apparatus including the backlight unit are provided. The circuit board for a light emitting diode assembly includes a substrate layer, a light modulation zone column arranged on one surface of the substrate layer, the light modulation zone column including light modulation zones each of which includes a predetermined number of LED bonding pads, wherein the light modulation zones include a predetermined number of first light modulation zones and a predetermined number of second light modulation zones, a first common wiring commonly connected to the first light modulation zones and disposed on a first side of the light modulation zone column in a row direction, a second common wiring connected to the second light modulation zones and disposed on a second side of the light modulation zone column opposite to the first side in the row direction, and individual wirings connected to the light modulation zones, respectively.

Description

[0001] Cross-reference and priority claims of related applications

[0002] This application claims priority to Korean Patent Application No. 10-2021-0104331, filed with the Korean Intellectual Property Office (KIPO) on August 9, 2021, the entire disclosure of which is incorporated herein by reference. Technical Field

[0003] This invention relates to a circuit board for a light-emitting diode (LED) assembly, a backlight unit including the circuit board, and an image display device including the backlight unit. More specifically, this invention relates to a circuit board for an LED assembly including a substrate and circuit wiring, a backlight unit including the circuit board, and an image display device including the backlight unit. Background Technology

[0004] Cold cathode fluorescent lamps (CCFLs) are commonly used as backlights for liquid crystal display (LCD) devices. However, CCFLs use mercury gas, which can lead to environmental pollution and may be detrimental in terms of response speed and color reproduction. Furthermore, CCFLs are disadvantageous in the manufacture of thin LCD panels.

[0005] Therefore, light-emitting diodes (LEDs) are used as the backlight. LEDs are environmentally friendly light sources and can provide high-speed response and high-brightness color reproduction. In addition, brightness, color temperature, etc. can be adjusted by controlling the amount of light from red, green, and blue LEDs, and LEDs can be used to manufacture small, thin LCD panels.

[0006] LED light sources can be mounted on a circuit board to define a backlight unit, which can be positioned below the LCD panel.

[0007] The bonding pads on which multiple LEDs are mounted can be set on the circuit board, and wiring can be arranged for power supply to the bonding pads and the operating controller.

[0008] Because a circuit board includes a large number of bonding pads, it may not be possible to provide a consistent channel resistance for each LED, and efficient circuit design may not be possible due to the high circuit density. Furthermore, as disclosed in Korean Patent Publication No. 10-1303188, when wiring is placed on both surfaces of the circuit board, additional vias or contacts are required, leading to a decrease in the reliability of the circuit board's connections. Summary of the Invention

[0009] According to one aspect of the invention, a circuit board for a light-emitting diode assembly is provided, which provides improved electrical performance and luminous efficiency.

[0010] According to one aspect of the present invention, a circuit board module for a light-emitting diode assembly is provided, the circuit board module providing improved electrical performance and luminous efficiency.

[0011] According to one aspect of the present invention, a backlight unit is provided that provides improved electrical performance and luminous efficiency.

[0012] According to one aspect of the present invention, an image display device including a backlight unit is provided.

[0013] (1) A circuit board for a light-emitting diode assembly, comprising: a substrate layer; a dimming zone column disposed on a surface of the substrate layer, the dimming zone column including dimming zones, each of the dimming zones including a predetermined number of LED bonding pads, wherein the dimming zones include a predetermined number of first dimming zones included in the upper part of the dimming zone column in a plan view and a predetermined number of second dimming zones included in the lower part of the dimming zone column in a plan view; a first common wiring, the first common wiring being commonly connected to the first dimming zone and disposed on a first side in the row direction of the dimming zone column; a second common wiring, the second common wiring being connected to the second dimming zone and disposed on a second side in the row direction of the dimming zone column opposite to the first side; and individual wiring, the individual wiring being connected to each of the dimming zones.

[0014] (2) The circuit board for a light-emitting diode assembly as described in (1) above, wherein the individual wiring includes: a first individual wiring disposed on the second side of the dimming zone column; and a second individual wiring disposed on the first side of the dimming zone column.

[0015] (3) The circuit board for the light-emitting diode assembly as described in (2) above, wherein the first individual wiring is connected to the first dimming zone and the second individual wiring is connected to the second dimming zone.

[0016] (4) The circuit board for the light-emitting diode assembly as described in (2) above, wherein the number of the first dimming area is the same as the number of the second dimming area, or the difference between the number of the first dimming area and the number of the second dimming area is 1.

[0017] (5) The circuit board for the light-emitting diode assembly as described in (4) above, wherein the number of the second individual wirings disposed on the first side is the same as the number of the first individual wirings disposed on the second side, or the difference between the number of the second individual wirings disposed on the first side and the number of the first individual wirings disposed on the second side is 1.

[0018] (6) The circuit board for a light-emitting diode assembly as described in (1) above, wherein the LED bonding pad, the first common wiring, the second common wiring and the individual wiring are all disposed in a single conductive layer.

[0019] (7) The circuit board for the light-emitting diode assembly as described in (6) above further includes connection pads formed at the respective terminals of the first common wiring, the second common wiring and the individual wiring.

[0020] (8) The circuit board for the light-emitting diode assembly as described in (1) above further includes an insulating layer formed on the substrate layer to cover the first common wiring, the second common wiring and the individual wiring, the insulating layer including openings that partially expose the respective LED bonding pads.

[0021] (9) The circuit board for a light-emitting diode assembly as described in (8) above, wherein the dual-layer structure consists of a single conductive circuit layer and a single insulating layer, the single conductive circuit layer including the LED bonding pad, the first common wiring, the second common wiring and the individual wiring, and the single insulating layer stacked on one surface of the substrate layer.

[0022] (10) The circuit board for the light-emitting diode assembly as described in (9) above further includes an intermediate layer formed between the conductive circuit layer and the substrate layer.

[0023] (11) A circuit board for a light-emitting diode assembly as described in (10) above, wherein the intermediate layer includes a seed layer or an adhesive layer.

[0024] (12) The circuit board for a light-emitting diode assembly as described in (1) above, wherein each of the LED bonding pads includes a first bonding pad and a second bonding pad, the first bonding pad and the second bonding pad being physically separate from each other and having different polarities.

[0025] (13) The circuit board for a light-emitting diode assembly as described in (12) above, wherein each of the dimming zones further includes a connection wiring that connects the first bonding pad and the second bonding pad, which are included in adjacent different LED bonding pads, to each other.

[0026] (14) A circuit board for a light-emitting diode assembly as described in (1) above, wherein a plurality of the dimming zone columns are repeatedly arranged along the row direction.

[0027] (15) The circuit board for a light-emitting diode assembly as described in (1) above, wherein the substrate layer comprises a glass substrate, an organic polymer substrate or an inorganic insulating substrate.

[0028] (16) A circuit board module for a light-emitting diode assembly, comprising a circuit board for a light-emitting diode assembly according to the above embodiment, wherein a plurality of the circuit boards for the light-emitting diode assembly are arranged in a tiled manner along the row and column directions.

[0029] (17) A backlight unit comprising: a circuit board for a light-emitting diode assembly according to the above embodiment; and a light-emitting diode mounted on the circuit board for the light-emitting diode assembly.

[0030] (18) An image display device, comprising: a backlight unit according to the above embodiment; and a liquid crystal panel disposed on the backlight unit.

[0031] According to an exemplary embodiment, common wiring and individual wiring can be arranged together on both sides of the dimming zone column. Therefore, periodicity of the LED array can be achieved, and dead zones in the array substrate can be reduced. Consequently, LED mounting efficiency, integration, and luminous performance can be improved, as well as space efficiency.

[0032] In an exemplary embodiment, the upper and lower portions of the dimming zone array can be separated, and the common wiring connected to the upper portion and the common wiring connected to the lower portion can be respectively disposed on both sides of the dimming zone array. Furthermore, separate wiring connected to the upper portion and separate wiring connected to the lower portion can be respectively disposed on both sides of the dimming zone array.

[0033] Dimming zones can be repeatedly arranged in the row direction, thus the wiring space located on both sides of the dimming zone column or on the outermost part of the circuit board can be used evenly. Therefore, even in tiled large-area module products, the same LED periodicity as in individual products can be maintained, and uniform and enhanced luminous performance can be provided.

[0034] In an exemplary embodiment, the LED bonding pads, common wiring, and individual wiring that form dimming blocks or dimming zones can all be distributed on the same layer or at the same level on one surface of the substrate layer.

[0035] Therefore, it can prevent increased resistance due to contact or via connections and achieve improved electrical connection reliability. Thus, the desired high color reproduction and high brightness can be effectively achieved through the dimming zone. Attached Figure Description

[0036] Figure 1 and Figure 2This is a schematic cross-sectional view of a circuit board for a light-emitting diode assembly according to an exemplary embodiment.

[0037] Figure 3 This is a schematic plan view of a circuit board for a light-emitting diode assembly according to an exemplary embodiment.

[0038] Figure 4 This is a schematic plan view showing the connection between the dimming zone array and the common wiring according to an exemplary embodiment.

[0039] Figure 5 This is a schematic plan view showing the connection between the dimming zone array and individual wiring according to an exemplary embodiment.

[0040] Figure 6 This is a schematic plan view showing the dimming zone array connected together with common wiring / separate wiring according to an exemplary embodiment.

[0041] Figure 7 This is a schematic partially enlarged plan view showing the connection pads included in a circuit board for a light-emitting diode assembly according to an exemplary embodiment.

[0042] Figure 8 This is a schematic plan view of a circuit board module for a light-emitting diode assembly according to an exemplary embodiment.

[0043] Figure 9 This is a schematic diagram illustrating a backlight unit and an image display device according to an exemplary embodiment. Detailed Implementation

[0044] According to an exemplary embodiment of the present invention, a circuit board for a light-emitting diode (LED) assembly is provided, comprising LED bonding pads forming a dimming area and wiring connected to the dimming area. According to an exemplary embodiment of the present invention, a backlight unit and an image display device comprising the circuit board for the LED assembly are also provided.

[0045] In an exemplary embodiment, the circuit board for the light-emitting diode assembly may be a glass-based circuit board for the mini-LED assembly.

[0046] The invention will now be described in detail with reference to the accompanying drawings. However, those skilled in the art will recognize that these embodiments described with reference to the drawings are provided to further understand the spirit of the invention, and are not intended to limit the subject matter to be protected as disclosed in the detailed description and appended claims.

[0047] Figure 1 and Figure 2 This is a schematic cross-sectional view of a circuit board for a light-emitting diode assembly according to an exemplary embodiment.

[0048] Reference Figure 1 and Figure 2 The circuit board for the light-emitting diode assembly (hereinafter referred to as the circuit board) may include a substrate layer 100 and a conductive circuit layer 120 formed on one surface of the substrate layer 100. An insulating layer 130 including an opening 135 configured as a bonding hole may be formed on the substrate layer 100.

[0049] The substrate layer 100 may include an insulating material used as a substrate or core layer of a printed circuit board. For example, the substrate layer 100 may be an inorganic insulating substrate comprising a transparent inorganic material (e.g., silicon oxide, silicon nitride, etc.) or an organic substrate comprising a transparent polymer material (e.g., polyimide, cyclic olefin polymer (COP), etc.). Preferably, the substrate layer 100 may be a glass substrate.

[0050] The substrate layer 100 may include a first surface 100a and a second surface 100b. The first surface 100a and the second surface 100b may face each other. For example, the first surface 100a and the second surface 100b may correspond to the top surface and the bottom surface of the substrate layer 100, respectively.

[0051] The conductive circuit layer 120 may be formed on the first surface 100a of the substrate layer 100. In an exemplary embodiment, the conductive circuit layer 120 may be formed only on the first surface 100a of the substrate layer 100, and may not be formed on the second surface 100b.

[0052] Therefore, the circuit board according to the exemplary embodiment can be provided as a substantially single-sided circuit board.

[0053] In some implementations, the conductive circuit layer 120 may be formed as a substantially single layer. For example, multilayer circuit structures with vias or contacts may be excluded.

[0054] The conductive circuit layer 120 may include metals such as copper (Cu), nickel (Ni), palladium (Pd), chromium (Cr), etc.

[0055] Intermediate layers 110a and 110b may be formed between the conductive circuit layer 120 and the first surface 100a of the substrate layer 100.

[0056] like Figure 1 As shown, in some embodiments, the intermediate layer 110a may be a seed layer. In this case, the conductive circuit layer 120 may be a plating layer formed using the intermediate layer 110a as a seed.

[0057] For example, the intermediate layer 110a may include a metal, such as titanium (Ti), copper (Cu), chromium (Cr), palladium (Pd), etc. The intermediate layer 110a may be formed by, for example, electroless plating or deposition processes.

[0058] In one embodiment, the intermediate layer 110a may include a copper seed layer, and the conductive circuit layer 120 may be a copper layer formed by electroplating using the copper seed layer.

[0059] The intermediate layer 110a and the conductive circuit layer 120 can be patterned together to form a circuit pattern.

[0060] like Figure 2 As shown, in some embodiments, the intermediate layer 110b may be an adhesive layer. In this case, the conductive circuit layer 120 may be formed of a metal foil (e.g., copper foil). For example, the intermediate layer 110b and the conductive circuit layer 120 may be formed of a single-sided copper-clad laminate (CCL) including a substrate layer 100. The intermediate layer 110b may be formed entirely on the first surface 100a of the substrate layer 100 and may be exposed between the patterns of the conductive circuit layer 120.

[0061] In some embodiments, intermediate layers 110a and 110b may be in direct contact with the first surface 100a of the substrate layer 100. The conductive circuit layer 120 may be in direct contact with intermediate layers 110a and 110b.

[0062] An insulating layer 130 that partially covers the conductive circuit layer 120 may be formed on the first surface 100a of the substrate layer 100. In an exemplary embodiment, the insulating layer 130 may be used as a solder resist (SR) layer for mounting a light-emitting diode (LED).

[0063] In some embodiments, the insulating layer 130 may be formed of a highly reflective material with a light reflectance greater than or equal to 80%. For example, the insulating layer 130 may have a reflectance greater than or equal to 80% for visible light. In one embodiment, the insulating layer 130 may have a reflectance greater than or equal to 80% for the D65 light source in the International Commission on Illumination (CIE) standard light source.

[0064] Therefore, LED light reflected from the top of the backlight unit, including the circuit board, and re-incidentally onto the circuit board can be reflected again. This improves the light efficiency in the backlight unit and the image display device.

[0065] Insulating layer 130 may include exposed LED bonding pads 122 (see...) Figure 3 The opening 135 allows each LED to be connected or mounted on the LED bonding pad 122.

[0066] Figure 3 This is a schematic plan view of a circuit board for a light-emitting diode assembly according to an exemplary embodiment.

[0067] Reference Figure 3 The conductive circuit layer 120 may include LED bonding pads 122, common wiring 124, and individual wiring 126. The conductive circuit layer 120 may also include connection wiring 121 that connects adjacent LED bonding pads 122 to each other.

[0068] LED bonding pads 122 may include a first bonding pad 122a and a second bonding pad 122b with different polarities. For example, the first bonding pad 122a and the second bonding pad 122b may be semi-circular, and the straight side surfaces of the first bonding pad 122a and the second bonding pad 122b may face each other.

[0069] Each light-emitting diode 180 can be mounted on an LED bonding pad 122. The light-emitting diode 180 can be connected to a first bonding pad 122a and a second bonding pad 122b with different polarities and extend across the first bonding pad 122a and the second bonding pad 122b.

[0070] For reference Figure 1 and Figure 2 As described, the first bonding pad 122a and the second bonding pad 122b of the LED bonding pad 122 can be partially exposed through the opening 135 of the insulating layer 130. Therefore, the light-emitting diode 180 can be mounted on the circuit board through the opening 135.

[0071] The insulation layer 130 can completely cover the common wiring 124, the individual wiring 126 and the connecting wiring 121.

[0072] A predetermined number of LED bonding pads 122 can be connected by connecting wires 121 to form a dimming zone DZ. For example, a first bonding pad 122a and a second bonding pad 122b, which are included in adjacent different LED bonding pads 122, can be connected to each other by connecting wires 121.

[0073] Dimming zones (DZs) can be used as light-emitting units in LED assemblies. For example, the brightness and color of each dimming zone (DZ) can be controlled individually.

[0074] Considering the size of the image display device and the integration level of the light-emitting diodes, the number of LED bonding pads 122 included in a dimming zone DZ can be appropriately changed. For example, for ease of description, Figure 3 The diagram shows a dimming zone DZ comprising 12 LED bonding pads 122. However, the number of LED bonding pads 122 included in the dimming zone DZ can be further increased (e.g., 24, 36, 48, 72, etc.).

[0075] Multiple dimming zones DZ can be arranged on the first surface 100a of the substrate layer 100. The dimming zones DZ can be repeatedly arranged along the row and column directions of the substrate layer 100 to form a component or array.

[0076] In an exemplary embodiment, the wiring may be disposed between adjacent dimming zones DZ in the horizontal direction. As described above, the wiring may include a common wiring 124 and a separate wiring 126.

[0077] Common wiring 124 can be connected together to a predetermined number of dimming zones DZ. Individual wiring 126 can be connected independently to each dimming zone DZ.

[0078] For example, common wiring 124 can be provided as the cathode wiring of the circuit board. Separate wiring 126 can be provided as the anode wiring of the circuit board.

[0079] In an exemplary embodiment, a plurality of dimming zones DZ can be arranged in the column direction to define dimming zone columns DZC. The plurality of dimming zone columns DZC can be arranged in the row direction. Wiring 124 and 126 can extend along the column direction between adjacent dimming zone columns in the row direction.

[0080] As described above, the common wiring 124, the individual wiring 126, and the LED bonding pad 122 can be included together in the conductive circuit layer 120 to form a single circuit layer.

[0081] Therefore, channel resistance can be reduced compared to circuit boards with multi-layer structures using through-holes or contacts. Furthermore, a single circuit layer can be used, allowing all circuit patterns to be formed using low-resistance copper foil or low-resistance plating. Thus, channel resistance can be further reduced.

[0082] Therefore, the wiring, including the common wiring 124 and the individual wiring 126, can be arranged between the dimming zone columns, making it easy to achieve a regular or periodic arrangement and electrical connection of the LEDs or LED bonding pads 122. Thus, high luminous efficiency can be obtained, and the luminous performance can be controlled by a backlight unit including a highly reliable circuit board.

[0083] For example, a wiring harness 123 may be defined, including a common wiring 124 and individual wiring 126. Multiple wiring harnesses 123 may be arranged in the space between dimming zone columns.

[0084] In one embodiment, a wiring harness 123 may include a plurality of individual wirings 126. In one embodiment, a wiring harness 123 may include at least two or more common wirings 124. In one embodiment, the number of individual wirings 126 included in a wiring harness 123 may be greater than the number of common wirings 124. For example, as Figure 3As shown, the two common wirings 124 can be included in a wiring harness 123.

[0085] In some implementations, the wiring harness 123 may also include a dummy electrode 129. Areas of wiring connected to different dimming zone columns DZCs may be separated and divided from each other by the dummy electrode 129.

[0086] Figure 4 This is a schematic plan view showing the connection between the dimming zone array and the common wiring according to an exemplary embodiment. Figure 5 This is a schematic plan view showing the connection between the dimming zone array and individual wiring according to an exemplary embodiment. Figure 6 This is a schematic plan view showing the dimming zone array connected together with common wiring / separate wiring according to an exemplary embodiment.

[0087] For ease of description, Figures 4 to 6 The illustrations of the LED bonding pads 122 and connecting wires 121 included in each dimming zone DZ are omitted.

[0088] Reference Figure 4 As mentioned above, multiple dimming zones DZ can be arranged in the column direction to form a dimming zone column DZC.

[0089] The dimming zone column DZC can include settings for dimming zones. Figure 4 The predetermined number of first dimming zones DZ1 at the top of the plan and the settings Figure 4 The predetermined number of second dimming zones DZ2 at the bottom of the plan view.

[0090] In one embodiment, the number of first dimming zones DZ1 and the number of second dimming zones DZ2 can be the same (e.g., when the dimming zone column DZC includes an even number of dimming zones DZ). In another embodiment, the difference between the number of first dimming zones DZ1 and the number of second dimming zones DZ2 can be 1 (e.g., when the dimming zone column DZC includes an odd number of dimming zones DZ).

[0091] In an exemplary embodiment, the common wiring 124 may include a first common wiring 124a and a second common wiring 124b. The first common wiring 124a and the second common wiring 124b may be respectively disposed on both sides of the row direction of the dimming zone column DZC.

[0092] like Figure 4As shown, the first common wiring 124a can be disposed on one side of the dimming zone column DZC (hereinafter referred to as the first side). The first common wiring 124a can be disposed on the first side to extend in the column direction and can be commonly connected to the first dimming zone DZ1. For example, a plurality of first connection portions extending in the row direction can protrude from the first common wiring 124a to be electrically connected to the first dimming zone DZ1. For example, the first connection portions can be connected to the LED bonding pads 122 included in the first dimming zone DZ1.

[0093] The second common wiring 124b can be disposed on the other side of the dimming zone column DZC (hereinafter referred to as the second side). The second common wiring 124b can be disposed on the second side to extend in the column direction and can be commonly connected to the second dimming zone DZ2. For example, a plurality of second connections extending in the row direction can protrude from the second common wiring 124b to be electrically connected to the second dimming zone DZ2. For example, the second connections can be connected to the LED bonding pads 122 included in the second dimming zone DZ2.

[0094] Reference Figure 5 Individual wiring 126 may include a first individual wiring 126a and a second individual wiring 126b.

[0095] A first individual wiring 126a may be disposed on the second side of the dimming zone column DZC. The first individual wiring 126a may be connected to each of the first dimming zones DZ1. For example, the first individual wiring 126a may extend in the column direction on the second side, and a first individual connection may protrude from each first individual wiring 126a in the row direction to electrically connect to each of the first dimming zones DZ1. For example, the first individual connection may be connected to an LED bonding pad 122 included in the first dimming zone DZ1.

[0096] The second individual wiring 126b can be disposed on the first side of the dimming zone column DZC. The second individual wiring 126b can be connected to each of the second dimming zones DZ2. For example, the second individual wiring 126b can extend in the column direction on the first side, and the second individual connection portion can protrude from each of the second individual wiring 126b in the row direction to electrically connect to each of the second dimming zones DZ2. For example, the second individual connection portion can be connected to the LED bonding pad 122 included in the second dimming zone DZ2.

[0097] Reference Figure 6 , as reference Figures 1 to 3 As described, the dimming zone column DZC, common wiring 124, and individual wiring 126 can be arranged together on a single layer.

[0098] In an exemplary embodiment, the first common wiring 124a and the second separate wiring 126b can be arranged together on the first side of the dimming zone column DZC. Therefore, a common connection to the first dimming zone DZ1 and a separate connection to the second dimming zone DZ2 can be implemented on the first side.

[0099] The second common wiring 124b and the first individual wiring 126a can be arranged together on the second side of the dimming zone column DZC. Therefore, a common connection to the second dimming zone DZ2 and a separate connection to the first dimming zone DZ1 can be achieved on the second side.

[0100] According to the exemplary embodiment described above, the upper and lower parts of the dimming zone column can be separated, and the common wiring connected to the upper part and the common wiring connected to the lower part can be respectively distributed on both sides of the dimming zone column. Furthermore, the individual wiring connected to the upper part and the individual wiring connected to the lower part can also be respectively arranged on both sides of the dimming zone column.

[0101] Furthermore, the upper common wiring and the lower individual wiring can be arranged together on the first side, and the lower common wiring and the upper individual wiring can be arranged together on the second side.

[0102] Based on the above wiring layout and connection structure, although the number of dimming zones DZ included in a dimming zone column DZC increases, the space efficiency of the wiring can be improved to provide LED components that are advantageous for large area.

[0103] Multiple dimming zone columns (DZCs) can be arranged repeatedly in the row direction. Therefore, the common wiring 124 and individual wiring 126 can be arranged together on the first and second sides in the space between adjacent dimming zone columns (DZCs).

[0104] Therefore, the periodicity of wirings 124 and 126 and the dimming zone DZ can be maintained throughout the entire circuit board, and the dimming zone DZ can be arranged efficiently with consistent periodicity even in large tile-type backlight units.

[0105] In some implementations, the area occupied by the wiring on the first side and the wiring on the second side can be substantially the same.

[0106] like Figure 3 As shown, the virtual electrode 129 can be disposed between adjacent first and second sides. In one embodiment, the virtual electrode 129 may not be disposed on the outermost side of the circuit board. Therefore, the wiring space or wiring area can be easily designed.

[0107] In some embodiments, a first common wiring 124a and a second common wiring 124b may be provided on a first side and a second side, respectively. In one embodiment, the number of second individual wirings 126b provided on the first side and the number of first individual wirings 126a provided on the second side may be the same (e.g., in the case where the dimming zone column DZC includes an even number of dimming zones DZ).

[0108] In one embodiment, the difference between the number of second individual wirings 126b provided on the first side and the number of first individual wirings 126a provided on the second side can be 1 (for example, in the case where the dimming zone column DZC includes an odd number of dimming zones DZ).

[0109] Figure 7 This is a schematic partially enlarged plan view showing the connection pads included in a circuit board for a light-emitting diode assembly according to an exemplary embodiment.

[0110] Reference Figure 7 One end of the substrate layer 100 can be used as an external connection region 105. For example, the terminal portions of the aforementioned wirings 124 and 126 can be assembled in the external connection region 105.

[0111] The connection pads can be connected to the terminations of wires 124 and 126. The first common connection pad 125a and the second common connection pad 125b can be connected to the terminations of the first common wire 124a and the second common wire 124b, respectively. The first individual connection pad 127a and the second individual connection pad 127b can be connected to the terminations of the first individual wire 126a and the second individual wire 126b, respectively.

[0112] In one embodiment, the terminal portions of wires 124 and 126 can be used as connection pads 125 and 127.

[0113] The terminations of wirings 124a, 124b, 126a, and 126b can be separated in the upper and lower regions of the plan view and connected to the connection pads 125a, 125b, 127a, and 127b. Therefore, the space arrangement efficiency of the terminations included in the wiring can be improved, and resistance variation can be reduced.

[0114] External circuit structure 190 can be electrically connected to conductive circuit layer 120 via external connection area 105. For example, external circuit structure 190 may include a driver integrated circuit chip or an external power supply. External connection area 105 may be provided as an adhesive area for electrically connecting external circuit structure 190 to LED bonding pad 122.

[0115] In one embodiment, the external circuit structure 190 may further include an intermediate circuit structure such as a flexible circuit board and a connector for connecting the circuit board to the driver integrated circuit.

[0116] The external circuit structure 190 can supply common and individual signals to the dimming zone DZ via wirings 124 and 126 through connection pads 125a, 125b, 127a and 127b.

[0117] According to the above exemplary embodiments, all wiring or conductive patterns included in the circuit board can be arranged on the first surface 100a of the substrate layer 100 and can substantially form a single-layer circuit.

[0118] For example, the aforementioned LED bonding pads 122, common wiring 124, individual wiring 126, and connecting pads 125a, 125b, 127a, and 127b can all be placed on the same layer or at the same level.

[0119] Figure 8 This is a schematic plan view of a circuit board module for a light-emitting diode assembly according to an exemplary embodiment.

[0120] For ease of description, references will be omitted. Figures 1 to 7 A diagram illustrating the detailed connection structure of the dimming zone DZC, wiring harness 123, and external connection area 105.

[0121] Reference Figure 8 A circuit board module can be formed by assembling units with the above-described circuit board structure into a tiled configuration. For example, refer to... Figures 1 to 7 The circuit board described can define a tiled unit 50.

[0122] In an exemplary embodiment, multiple tiled units 50 may be repeatedly arranged along the row and column directions to form a circuit board module.

[0123] The aforementioned connection structure of the dimming zone DZC and wiring 124 and 126 can be adopted to maintain the periodicity of LED arrangement even when manufacturing large-size flat circuit board modules, and to improve the space efficiency of wiring.

[0124] Figure 9 This is a schematic diagram illustrating a backlight unit and an image display device according to an exemplary embodiment.

[0125] Reference Figure 9 ,like Figure 3 As shown, the light-emitting diode 180 can be combined with a circuit board to define a backlight unit BLU. This backlight unit can be provided as a mini-LED backlight unit. In one embodiment, the backlight unit BLU may also include an optical film, such as a light guide plate or a diffuser plate.

[0126] The backlight unit (BLU) can be disposed below the TFT array substrate 220. The polarizing plate 210 below it can be disposed between the TFT array substrate 220 and the backlight unit (BLU).

[0127] The liquid crystal cell 230 can be disposed on the TFT array substrate 220, thereby providing an LCD device on which a mini LED backlight unit according to an exemplary embodiment is applied. The liquid crystal panel can be defined by the TFT array substrate 220 and the liquid crystal cell 230.

[0128] A color filter 240 can be disposed on the liquid crystal cell 230, and a cover glass 250 can be disposed on the color filter 240. A polarizing plate can also be disposed between the color filter 240 and the cover glass 250.

Claims

1. A circuit board for a light-emitting diode assembly, comprising: Substrate layer; A dimming zone array is disposed on one surface of the substrate layer. The dimming zone array includes dimming zones, each of which includes a predetermined number of LED bonding pads. The dimming zones include a predetermined number of first dimming zones in the upper part of the dimming zone array in the plan view and a predetermined number of second dimming zones in the lower part of the dimming zone array in the plan view. The first common wiring is connected to the first dimming zone and is disposed on the first side in the row direction of the dimming zone column; A second common wiring, the second common wiring being connected to the second dimming zone and disposed on the second side of the dimming zone column opposite the first side in the row direction; and Individual wiring is provided, and the individual wiring is connected to each of the dimming zones. The individual wiring includes: a first individual wiring disposed on the second side of the dimming zone column; and a second individual wiring disposed on the first side of the dimming zone column.

2. The circuit board for a light-emitting diode assembly as described in claim 1, wherein, The first individual wiring is connected to the first dimming zone, and the second individual wiring is connected to the second dimming zone.

3. The circuit board for a light-emitting diode assembly as described in claim 1, wherein, The number of the first dimming zone is the same as the number of the second dimming zone, or the difference between the number of the first dimming zone and the number of the second dimming zone is 1.

4. The circuit board for a light-emitting diode assembly as described in claim 3, wherein, The number of second individual wirings provided on the first side is the same as the number of first individual wirings provided on the second side, or the difference between the number of second individual wirings provided on the first side and the number of first individual wirings provided on the second side is 1.

5. The circuit board for a light-emitting diode assembly as described in claim 1, wherein, The LED bonding pad, the first common wiring, the second common wiring, and the individual wiring are all disposed in a single conductive layer.

6. The circuit board for a light-emitting diode assembly as claimed in claim 5, further comprising connection pads formed at the respective terminals of the first common wiring, the second common wiring, and the individual wiring.

7. The circuit board for a light-emitting diode assembly as claimed in claim 1, further comprising an insulating layer formed on the substrate layer to cover the first common wiring, the second common wiring and the individual wiring, the insulating layer including openings that partially expose the respective LED bonding pads.

8. The circuit board for a light-emitting diode assembly as described in claim 7, wherein, The dual-layer structure consists of a single conductive circuit layer and a single insulating layer. The single conductive circuit layer includes the LED bonding pad, the first common wiring, the second common wiring, and the individual wiring. The single insulating layer is stacked on one surface of the substrate layer.

9. The circuit board for a light-emitting diode assembly as claimed in claim 8, further comprising an intermediate layer formed between the conductive circuit layer and the substrate layer.

10. The circuit board for a light-emitting diode assembly as described in claim 9, wherein, The intermediate layer includes a seed crystal layer or an adhesive layer.

11. The circuit board for a light-emitting diode assembly as claimed in claim 1, wherein, Each LED bonding pad in the LED bonding pads includes a first bonding pad and a second bonding pad, which are physically separate from each other and have different polarities.

12. The circuit board for a light-emitting diode assembly as described in claim 11, wherein, Each dimming zone in the dimming zone also includes a connection wiring that connects the first bonding pad and the second bonding pad, which are located in adjacent different LED bonding pads, to each other.

13. The circuit board for a light-emitting diode assembly as claimed in claim 1, wherein, Multiple dimming zone columns are repeatedly arranged along the row direction.

14. The circuit board for a light-emitting diode assembly as claimed in claim 1, wherein, The substrate layer includes an organic polymer substrate or an inorganic insulating substrate.

15. A circuit board module for a light-emitting diode assembly, comprising the circuit board for a light-emitting diode assembly as described in claim 1. in, Multiple circuit boards for the light-emitting diode assembly are arranged in a tiled repeating pattern along the row and column directions.

16. A backlight unit, comprising: The circuit board for a light-emitting diode assembly as described in claim 1; as well as The light-emitting diode is mounted on the circuit board for the light-emitting diode assembly.

17. An image display device, comprising: The backlight unit as described in claim 16; as well as The liquid crystal panel is disposed on the backlight unit.

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