MEMS switch and manufacturing method thereof

Abstract

The disclosed embodiments relate to a flexible MEMS switch, comprising a MEMS body and an external package, the package comprising a first flexible cover and a second flexible cover, the first and second flexible cover being disposed on opposite sides of the MEMS body, respectively, with a first cavity formed between the first flexible cover and the MEMS body, and a second cavity formed between the second flexible cover and the MEMS body. The disclosed embodiments also relate to a method for manufacturing the flexible MEMS switch.

Description

Technical Field

[0001] The present disclosure relates to the technical field of MEMS devices, and in particular to a MEMS switch and a manufacturing method thereof. Background Art

[0002] There are many types of MEMS (micro-electromechanical system) switches, such as cantilever beams and simply supported beams, which have membrane / bridge structures. These switches generally include a substrate, two ground wires disposed on the substrate, a signal transmission line located between the two ground wires, and an electrode mounted above the signal transmission line, with both ends of the electrode connected to the two ground wires. In a flexible MEMS switch, the entire flexible MEMS switch bends and deforms, and the substrate and the switch also deform accordingly. This changes the spacing between the electrode and the signal line, thus affecting the performance of the flexible MEMS switch. Summary of the Invention

[0003] In order to solve the above technical problems, the present disclosure provides a MEMS switch and a manufacturing method thereof, which solves the problem that the bending deformation of the flexible MEMS switch affects its performance.

[0004] In order to achieve the above-mentioned purpose, the technical solution adopted in the embodiment of the present disclosure is: a flexible MEMS switch, including a MEMS body and a packaging body located outside the MEMS body, the packaging body including a first flexible cover plate and a second flexible cover plate, the first flexible cover plate and the second flexible cover plate are respectively covered on opposite sides of the MEMS body, and a first cavity is formed between the first flexible cover plate and the MEMS body, and a second cavity is formed between the second flexible cover plate and the MEMS body.

[0005] Optionally, the MEMS body is located at a neutral layer position of the package body.

[0006] Optionally, the MEMS body includes a flexible substrate and a functional device located on the flexible substrate, the flexible substrate includes a first part for setting the functional device, and a second part located outside the first part, the second part is a ring structure for connecting to the package body, the first part includes a plurality of side walls facing the second part, the plurality of side walls include at least a first side wall, and a partial area of ​​the first side wall along its extension direction is recessed in a direction away from the second part, so that there is a gap between the first side wall and the corresponding part of the second part.

[0007] Optionally, the plurality of side walls include a first side wall and a second side wall that are arranged opposite to each other, and the first side wall and the second side wall are symmetrically arranged.

[0008] Optionally, the MEMS body includes a flexible substrate and a functional device located on the flexible substrate, the flexible substrate includes a first part for setting the functional device, and a second part located outside the first part, the second part is a ring structure for connecting to the package body, the first part includes a plurality of side walls facing the second part, the plurality of side walls include opposite first and second side walls, there is a gap between the first side wall and the second part, and there is a gap between the second side wall and the second part.

[0009] Optionally, the plurality of side walls include a first side wall and a second side wall that are oppositely disposed, and a third side wall and a fourth side wall that are oppositely disposed;

[0010] The third side wall and the fourth side wall are symmetrically arranged, and a portion of the first side wall along its extension direction is recessed in a direction away from the second portion to form a notch.

[0011] Optionally, the functional device includes three first electrodes, second electrodes and third electrodes arranged side by side on the first part, the first electrode, the second electrode and the third electrode are arranged at intervals, the second electrode is a signal transmission line, the first electrode and the third electrode are both ground lines, and the MEMS body also includes a fourth electrode mounted on the side of the second electrode away from the flexible substrate, and the two ends of the fourth electrode are respectively connected to the first electrode and the third electrode.

[0012] Optionally, an insulating isolation layer is provided on a side of the second electrode away from the flexible substrate.

[0013] The present disclosure also provides a method for manufacturing a MEMS switch, which is used to manufacture the MEMS switch according to any one of claims 1 to 7, and specifically includes:

[0014] A MEMS body, a first flexible cover plate and a second flexible cover plate are formed respectively, and then the first flexible cover plate and the second flexible cover plate are successively connected to opposite sides of the MEMS body.

[0015] Optionally, forming the MEMS body specifically includes:

[0016] forming a flexible substrate on a rigid substrate;

[0017] Depositing metal on the flexible substrate to form a first electrode, a second electrode, and a third electrode arranged side by side, wherein the first electrode, the second electrode, and the third electrode are arranged at intervals;

[0018] forming an insulating isolation layer on the second electrode;

[0019] forming a sacrificial layer on the insulating isolation layer;

[0020] forming a fourth electrode on the sacrificial layer, wherein two ends of the fourth electrode are respectively connected to the first electrode and the third electrode;

[0021] The sacrificial layer is removed.

[0022] Optionally, the process for forming the first flexible cover plate and the second flexible cover plate is the same, and the steps of forming the first flexible cover plate specifically include:

[0023] A flexible material is coated on the rigid substrate, and the first flexible cover is formed by a photolithography process.

[0024] Optionally, the MEMS body includes a flexible substrate and a functional device located on the flexible substrate, and the flexible substrate includes a first portion for arranging the functional device, and a second portion located outside the first portion;

[0025] Connecting the first flexible cover plate and the second flexible cover plate successively to opposite sides of the MEMS body specifically includes:

[0026] Buckling the rigid substrate formed with the first flexible cover plate to the first side formed with the MEMS body, and connecting the end surface of the side wall of the first flexible cover plate to the second portion of the flexible base;

[0027] removing the hard substrate connected to the MEMS body by a laser lift-off process;

[0028] Attaching a rigid substrate having the second flexible cover plate to a second side of the MEMS body opposite to the first side, such that an end surface of a sidewall of the second flexible cover plate is connected to the second portion of the flexible base;

[0029] The hard substrate connected to the first flexible cover plate is removed by a laser lift-off process, and the hard substrate connected to the second flexible cover plate is removed.

[0030] The beneficial effects of the present disclosure are: the MEMS body is suspended in the package, reducing the stress on the MEMS body when the flexible MEMS switch is bent and deformed as a whole, reducing the bending deformation of the MEMS body, and avoiding the problem of poor performance when the flexible MEMS switch is bent and deformed as a whole. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 Schematic diagram of the structure of a MEMS switch in related technology Figure 1 ;

[0032] Figure 2Schematic diagram of the structure of a MEMS switch in related technology Figure 2 ;

[0033] Figure 3 A schematic diagram showing a bending state of a MEMS switch in the related art;

[0034] Figure 4 Schematic diagram showing the structure of the MEMS body in an embodiment of the present disclosure;

[0035] Figure 5 A schematic diagram showing the structure of a flexible MEMS switch in an embodiment of the present disclosure;

[0036] Figure 6 express Figure 5 AA′ cross-sectional view;

[0037] Figure 7 Schematic diagram showing the bending state of the flexible MEMS switch in the embodiment of the present disclosure Figure 1 ;

[0038] Figure 8 express Figure 5 BB′ cross-sectional diagram;

[0039] Figure 9 Schematic diagram showing the bending state of the flexible MEMS switch in the embodiment of the present disclosure Figure 2 ;

[0040] Figure 10 express Figure 4 Schematic diagram of CC′ cross section;

[0041] Figure 11 A schematic diagram showing a change in the distance between the second electrode and the fourth electrode when the MEMS is bent in the related art;

[0042] Figure 12 A schematic diagram showing a change in the spacing between the second electrode and the fourth electrode when the flexible MEMS is bent in an embodiment of the present disclosure;

[0043] Figure 13 A schematic diagram showing the structure of forming the flexible substrate on a hard substrate in an embodiment of the present disclosure;

[0044] Figure 14 A schematic diagram showing a process of forming a first electrode, a second electrode, and a third electrode on the flexible substrate in an embodiment of the present disclosure;

[0045] Figure 15 A schematic diagram showing forming an insulating isolation layer on the second electrode in an embodiment of the present disclosure;

[0046] Figure 16 A schematic diagram showing the formation of a sacrificial layer in an embodiment of the present disclosure;

[0047] Figure 17 A schematic diagram showing the formation of a fourth electrode in an embodiment of the present disclosure;

[0048] Figure 18 A schematic diagram showing the removal of the sacrificial layer to form the MEMS body in an embodiment of the present disclosure;

[0049] Figure 19 A schematic diagram showing a method of forming a first flexible cover on a rigid substrate according to an embodiment of the present disclosure;

[0050] Figure 20 A schematic diagram showing laminating the first flexible cover plate to the MEMS body in an embodiment of the present disclosure;

[0051] Figure 21 A schematic diagram showing an embodiment of the present disclosure in which the hard substrate connected to the MEMS body is removed;

[0052] Figure 22 A schematic diagram showing laminating the second flexible cover plate to the MEMS body in an embodiment of the present disclosure;

[0053] Figure 23 Schematic diagram showing the removal of the hard substrate connected to the first flexible cover plate and the removal of the hard substrate connected to the second flexible cover plate in an embodiment of the present disclosure. DETAILED DESCRIPTION

[0054] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the described embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of the present invention.

[0055] In the description of the present invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate and simplify the description of the present invention. They are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation, and therefore should not be construed as limitations on the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0056] refer to Figure 1-Figure 3In the related art, a MEME switch generally includes a flexible substrate 1, a first electrode 2, a second electrode 3, and a third electrode 4 disposed on the flexible substrate 1, and a fourth electrode 5 disposed above the second electrode 3. The fourth electrode 5 has two ends connected to the first electrode 2 and the third electrode 4, respectively. The first electrode 2 and the third electrode 4 serve as ground lines, and the second electrode 3 serves as a signal transmission line. The operating principle is: a DC bias voltage is applied to the second electrode 3 and the fourth electrode 5, and the distance between the second electrode 3 and the fourth electrode 5 is changed by electrostatic force, thereby changing the capacitance between them, thereby switching the radio frequency signal on and off. For example, during operation, a DC bias voltage is applied to the second electrode 3 and the fourth electrode 5. The static force generated by this bias voltage on the second electrode 3 and the fourth electrode 5 will cause the fourth electrode 5 to bend and pull down, eventually contacting the dielectric layer on the second electrode 3. Due to the initial large distance between the second electrode 3 and the fourth electrode 5, the capacitance is small, and the radio frequency signal will be transmitted along the signal line. However, as the distance between them decreases, the capacitance will increase, and the radio frequency signal will be coupled to the ground line through the gold film, closing the switch. On the contrary, when the bias voltage is removed, the fourth electrode 5 returns to its initial position due to its own elastic restoring force, the distance between the second electrode 3 and the fourth electrode 5 increases, the capacitance decreases, and the RF signal will not be coupled to the ground line but will continue to be transmitted along the signal line, thereby achieving switch disconnection.

[0057] The flexible MEMS switch is bent and deformed as a whole, and the flexible substrate is bent and deformed accordingly, causing the distance between the second electrode and the fourth electrode to change, thereby affecting the performance of the flexible MEMS switch. Figure 3 It shows the overall bending state of the flexible MEMS switch.

[0058] In response to the above problems, an embodiment of the present disclosure provides a flexible MEMS switch, including a MEMS body and a package body 1 located outside the MEMS body, the package body 2 including a first flexible cover plate 40 and a second flexible cover plate 60, the first flexible cover plate 40 and the second flexible cover plate 60 are respectively covered on opposite sides of the MEMS body, and a first cavity 11 is formed between the first flexible cover plate 40 and the MEMS body, and a second cavity 12 is formed between the second flexible cover plate 60 and the MEMS body.

[0059] A first cavity 11 is formed between the first flexible cover plate 40 and the MEMS body, and a second cavity 12 is formed between the second flexible cover plate 60 and the MEMS body, that is, the MEMS body is suspended in the package body 1. The setting of the first cavity 11 and the second cavity 12 reduces the stress on the MEMS body when the flexible MEMS switch is bent and deformed as a whole, reduces the bending deformation of the MEMS body, and makes the MEMS body unaffected by the overall bending deformation of the flexible MEMS switch, effectively solving the problem of functional failure when the flexible MEMS switch is bent and deformed as a whole.

[0060] Figure 11 A schematic diagram showing a change in the distance between the second electrode and the fourth electrode when the MEMS is bent in the related art; Figure 12 Schematic diagram showing the change in the spacing between the second electrode and the fourth electrode when the flexible MEMS is bent in an embodiment of the present disclosure; wherein the horizontal axis is the curvature, the vertical axis is the displacement, the line labeled 100 is the displacement of the second electrode 3, the line labeled 200 is the displacement of the fourth electrode, and the line labeled 300 is the spacing between the second electrode 3 and the fourth electrode 5.

[0061] The mechanical finite element deformation simulation of the flexible MEMS switch shows that when the flexible MEMS switch in the related art is bent with a curvature radius of 5 mm, the distance between the second electrode 3 and the fourth electrode 5 changes from 1.75 μm to 0.86 μm, a change of more than 50%. Figure 10 In this embodiment, the flexible MEMS switch with strain isolation is bent with a curvature radius of 5 mm, and the membrane bridge height changes from 1.75 μm to 1.70 μm, with a change of less than 3%. Figure 12 , which has achieved an ideal strain isolation effect.

[0062] In this embodiment, the MEMS body is illustratively located at the neutral layer of the package body 1 .

[0063] During material bending, the outer layer experiences tension and the inner layer experiences compression. This inevitably creates a transition layer in its cross-section that is neither tensile nor compressive, resulting in a stress level near zero. This transition layer is called the neutral layer of the material. In this embodiment, the MEMS body is located within the neutral layer of the flexible substrate 1. This prevents the flexible MEMS switch from experiencing tensile deformation during bending. The MEMS body is suspended within the package 1, ensuring that deformation of the flexible MEMS switch as a whole does not cause tensile or compressive strain. This ensures that the flexible MEMS switch's functional characteristics, such as its actuation response, are unaffected by bending deformation.

[0064] The MEMS body placed in the neutral layer of the package body 1 does not generate tensile or compressive strain. A first cavity 11 is formed between the MEMS body and the first flexible cover plate 40, and a second cavity 12 is formed between the MEMS body and the second flexible cover plate 60, so that the MEMS body is not affected by the bending deformation of the flexible MEMS switch. Based on the strain isolation structure design of the neutral layer and the cavity structure (i.e., the setting of the first cavity 11 and the second cavity 12), it can be ensured that when the flexible MEMS switch undergoes overall bending deformation, the MEMS body maintains its structural morphology unchanged, thereby achieving the functional characteristics of the flexible MEMS switch, such as the driving response, without being affected by the bending deformation.

[0065] It should be noted that, in this embodiment, the MEMS body includes a flexible substrate 13 and a functional device located on the flexible substrate 13, the functional device is located in the first cavity 11, and there is a gap between the functional device of the MEMS body and the bottom of the first flexible cover plate 40, and there is a gap between the flexible substrate 13 of the MEMS body and the bottom of the second flexible cover plate 60, that is, a first direction from the first flexible cover plate 40 to the second flexible cover plate 60 (reference Figure 6 The MEMS body is suspended in the package body 1 to reduce the influence of the bending deformation of the flexible MEMS switch on the MEMS body.

[0066] Exemplarily in this embodiment, the MEMS body includes a flexible substrate 13 and a functional device located on the flexible substrate 13, the flexible substrate 13 includes a first part 131 for setting the functional device, and a second part 132 located outside the first part 131, the second part 132 is a ring structure for connecting to the package body, the first part 131 includes a plurality of side walls facing the second part 132, the plurality of side walls include at least a first side wall, and a partial area of ​​the first side wall along its extension direction is recessed in a direction away from the second part 132, so that there is a gap between the first side wall and the corresponding part of the second part 132.

[0067] The package body 1 is connected to the second part 132, that is, the end surface of the side wall of the first flexible cover plate 40 is connected to one side of the second part 132, and the end surface of the side wall of the second flexible cover plate 60 is connected to the other side of the second part 132. A portion of the first side wall along its extension direction is recessed in a direction away from the second part 132 to form a notch, thereby reducing the connection area between the first part 131 and the second part 132, and reducing the stress transmitted to the MEMS body by the package body 1 when the flexible MEMS switch is bent and deformed.

[0068] It should be noted that, in a specific implementation of this embodiment, the middle area of ​​the first side wall along its extension direction is recessed in a direction away from the second portion 132 to form a notch.

[0069] The number of side walls forming the notch can be set according to actual needs. In order to improve stress uniformity, in a specific implementation of this embodiment, the multiple side walls include a first side wall and a second side wall arranged opposite to each other, and the first side wall and the second side wall are symmetrically arranged, that is, the first side wall is recessed in a direction away from the second part 132 along a partial area of ​​its extension direction to form a notch, and the second side wall is recessed in a direction away from the second part 132 along a partial area of ​​its extension direction to form a notch.

[0070] Exemplarily in this embodiment, the MEMS body includes a flexible substrate 13 and a functional device located on the flexible substrate 13, the flexible substrate 13 includes a first part 131 for setting the functional device, and a second part 132 located outside the first part 131, the second part 132 is a ring structure for connecting to the package body 1, the first part 131 includes a plurality of side walls facing the second part 132, the plurality of side walls include a first side wall 61 and a second side wall 62 opposite to each other, there is a gap between the first side wall 61 and the second part 132, and there is a gap between the second side wall 62 and the second part 132.

[0071] There is a gap between the first side wall 61 and the second portion 132, and there is a gap between the second side wall 62 and the second portion 132. Figure 4 , effectively reducing the stress on the first part 131.

[0072] In this embodiment, the plurality of side walls include a first side wall 61 and a second side wall 62 that are opposite to each other, and a third side wall 63 and a fourth side wall 64 that are opposite to each other.

[0073] The third side wall 63 and the fourth side wall 64 are symmetrically arranged, and a portion of the first side wall 61 along its extension direction is recessed in a direction away from the second portion 132 to form a notch.

[0074] It should be noted that there is a gap between the first side wall 61 and the second portion 132, and there is a gap between the second side wall 62 and the second portion 132. At this time, the connection between the first portion 131 and the second portion 132 is through the connection between the other two opposite side walls (the third side wall 63 and the fourth side wall 64) on the first portion 131 and the second portion 132. The connection between the corresponding areas of the third side wall 63 and the fourth side wall 64 and the second portion 132 can be a whole surface contact connection or a partial connection, refer to Figure 4 The first part 131 is an I-shaped structure, and notches are provided on the third side wall 63 and the fourth side wall 64, which further reduce the connection area between the first part 131 and the second part 132 and reduce the stress on the first part 131.

[0075] In this embodiment, the notch of the third side wall 63 is located in the middle area of ​​the third side wall 63 along its extension direction, and the notch of the fourth side wall 64 is located in the middle area of ​​the third side wall 63 along its extension direction.

[0076] Exemplarily in this embodiment, the functional device includes three first electrodes 2, second electrodes 3 and third electrodes 4 arranged side by side on the first part 131, the first electrode 2, the second electrode 3 and the third electrode 4 are arranged at intervals, the second electrode 3 is a signal transmission line, the first electrode 2 and the third electrode 4 are both ground lines, and the MEMS body also includes a fourth electrode 5 mounted on the side of the second electrode 3 away from the flexible substrate, and the two ends of the fourth electrode 5 are respectively connected to the first electrode 2 and the third electrode 4.

[0077] In this embodiment, for example, an insulating isolation layer 31 is provided on a side of the second electrode 3 away from the flexible substrate 13 .

[0078] The present disclosure also provides a method for manufacturing a MEMS switch, which is used for the above-mentioned MEMS switch and specifically includes:

[0079] A MEMS body, a first flexible cover plate 40 and a second flexible cover plate 60 are formed respectively, and then the first flexible cover plate 40 and the second flexible cover plate 60 are successively connected to opposite sides of the MEMS body.

[0080] In this embodiment, the formation of the MEMS body specifically includes:

[0081] Forming a flexible substrate on a rigid substrate, refer to Figure 13 ;

[0082] Metal is deposited on the flexible substrate to form a first electrode 2, a second electrode 3 and a third electrode 4 arranged side by side, wherein the first electrode 2, the second electrode 3 and the third electrode 4 are arranged at intervals. Figure 14 ;

[0083] An insulating isolation layer is formed on the second electrode 3. Figure 15 ;

[0084] A sacrificial layer 30 is formed on the insulating isolation layer. Figure 16 ;

[0085] A fourth electrode 5 is formed on the sacrificial layer 30, and both ends of the fourth electrode 5 are connected to the first electrode 2 and the third electrode 4 respectively. Figure 17 ;

[0086] Remove the sacrificial layer 30, refer to Figure 18 .

[0087] In this embodiment, the process of forming the first flexible cover plate 40 and the second flexible cover plate 60 is the same. The steps of forming the first flexible cover plate 40 specifically include:

[0088] The first flexible cover plate 40 is formed by coating a flexible material on the hard substrate and performing a photolithography process. Figure 19 .

[0089] In this embodiment, the first flexible cover plate 40 and the second flexible cover plate 60 are sequentially connected to opposite sides of the MEMS body, specifically including:

[0090] The hard substrate formed with the first flexible cover plate 40 is buckled onto the hard substrate formed with the MEMS body, and the end surface of the side wall of the first flexible cover plate is connected to the second portion 132 of the flexible base 13; Figure 20 ;

[0091] The hard substrate connected to the MEMS body is removed by laser lift-off process. Figure 21 ;

[0092] The hard substrate formed with the second flexible cover 60 is buckled on the side of the MEMS body opposite to the first flexible cover 40, and the end surface of the side wall of the second flexible cover 60 is connected to the second portion 132 of the flexible base 13. Figure 22 ;

[0093] The hard substrate connected to the first flexible cover plate 40 and the hard substrate connected to the second flexible cover plate 60 are removed by laser lift-off process. Figure 23 .

[0094] It should be noted that Figures 19-23 All shown are cross-sectional schematic diagrams.

[0095] It will be understood that the above embodiments are merely exemplary embodiments for illustrating the principles of the present invention, and the present invention is not limited thereto. Those skilled in the art will appreciate that various modifications and improvements can be made without departing from the spirit and substance of the present invention, and such modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A flexible MEMS switch, wherein: The package comprises a MEMS body and a package located outside the MEMS body, the package comprising a first flexible cover plate and a second flexible cover plate, the first flexible cover plate and the second flexible cover plate being respectively disposed on opposite sides of the MEMS body, a first cavity being formed between the first flexible cover plate and the MEMS body, and a second cavity being formed between the second flexible cover plate and the MEMS body; The MEMS body includes a flexible substrate and a functional device located on the flexible substrate. The flexible substrate includes a first part for setting the functional device, and a second part located outside the first part. The second part is an annular structure for connecting to the package body. The first part includes multiple side walls facing the second part, and the multiple side walls include at least a first side wall. A partial area of ​​the first side wall along its extension direction is recessed in a direction away from the second part, so that there is a gap between the first side wall and the corresponding part of the second part.

2. The MEMS switch according to claim 1, wherein: The MEMS body is located at the neutral layer of the package body.

3. The MEMS switch according to claim 1, wherein: The plurality of side walls include a first side wall and a second side wall that are opposite to each other, and the first side wall and the second side wall are symmetrically arranged.

4. The MEMS switch according to claim 1, wherein: The MEMS body includes a flexible substrate and a functional device located on the flexible substrate. The flexible substrate includes a first part for setting the functional device, and a second part located outside the first part. The second part is an annular structure for connecting to the package body. The first part includes multiple side walls facing the second part. The multiple side walls include opposite first and second side walls. There is a gap between the first side wall and the second part, and there is a gap between the second side wall and the second part.

5. The MEMS switch according to claim 4, wherein: The plurality of side walls include a first side wall and a second side wall that are opposite to each other, and a third side wall and a fourth side wall that are opposite to each other; The third side wall and the fourth side wall are symmetrically arranged, and a portion of the first side wall along its extension direction is recessed in a direction away from the second portion to form a notch.

6. The MEMS switch according to claim 1 or 4, wherein: The functional device includes three first electrodes, second electrodes and third electrodes arranged side by side on the first part, the first electrodes, the second electrodes and the third electrodes are arranged at intervals, the second electrode is a signal transmission line, the first electrode and the third electrode are both ground lines, and the MEMS body also includes a fourth electrode mounted on a side of the second electrode away from the flexible substrate, and the two ends of the fourth electrode are respectively connected to the first electrode and the third electrode.

7. The MEMS switch according to claim 6, wherein: An insulating isolation layer is provided on a side of the second electrode away from the flexible substrate.

8. A method for manufacturing a MEMS switch, wherein: Used to manufacture the MEMS switch according to any one of claims 1 to 6, specifically comprising: A MEMS body, a first flexible cover plate and a second flexible cover plate are formed respectively, and then the first flexible cover plate and the second flexible cover plate are successively connected to opposite sides of the MEMS body.

9. The method for manufacturing a MEMS switch according to claim 8, wherein: Forming the MEMS body specifically includes: forming a flexible substrate on a rigid substrate; Depositing metal on the flexible substrate to form a first electrode, a second electrode, and a third electrode arranged side by side, wherein the first electrode, the second electrode, and the third electrode are arranged at intervals; forming an insulating isolation layer on the second electrode; forming a sacrificial layer on the insulating isolation layer; forming a fourth electrode on the sacrificial layer, wherein two ends of the fourth electrode are respectively connected to the first electrode and the third electrode; The sacrificial layer is removed.

10. The method for manufacturing a MEMS switch according to claim 9, wherein: The process of forming the first flexible cover plate and the second flexible cover plate is the same, and the steps of forming the first flexible cover plate specifically include: A flexible material is coated on the rigid substrate, and the first flexible cover is formed by a photolithography process.

11. The method for manufacturing a MEMS switch according to claim 10, wherein: The MEMS body includes a flexible substrate and a functional device located on the flexible substrate, wherein the flexible substrate includes a first portion for arranging the functional device and a second portion located outside the first portion; Connecting the first flexible cover plate and the second flexible cover plate successively to opposite sides of the MEMS body specifically includes: Buckling the rigid substrate formed with the first flexible cover plate to the first side formed with the MEMS body, and connecting the end surface of the side wall of the first flexible cover plate to the second portion of the flexible base; removing the hard substrate connected to the MEMS body by a laser lift-off process; Attaching a rigid substrate having the second flexible cover plate to a second side of the MEMS body opposite to the first side, such that an end surface of a sidewall of the second flexible cover plate is connected to the second portion of the flexible base; The hard substrate connected to the first flexible cover plate is removed by a laser lift-off process, and the hard substrate connected to the second flexible cover plate is removed.

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