Electromagnetic shielding packaging structure, packaging method and electronic product combined with board-level packaging

Abstract

The present invention discloses an electromagnetic shielding packaging structure, a packaging method and an electronic product combined with board-level packaging. The electromagnetic shielding packaging structure comprises: a first substrate and a chip fixedly mounted on the first substrate, a hollowed-out second substrate and a shielding welding wire; wherein the second substrate covers the chip, one end of the shielding welding wire is bonded to the upper surface of the second substrate, and the other end passes through the hollowed-out area of ​​the second substrate and is bonded to the first substrate to achieve electrical connection. The present invention uses the second substrate to cover the entire substrate and then cuts it into pieces, thereby improving production efficiency and packaging quality, and the shielding welding wire is wired through the second substrate, which can make the line shape more stable.

Description

Technical Field

[0001] The present invention relates to an electromagnetic shielding packaging structure combined with board-level packaging, and also relates to a corresponding electromagnetic shielding packaging method and an electronic product including the electromagnetic shielding packaging structure, belonging to the technical field of chip packaging. Background Art

[0002] With the rapid development of semiconductor technology, some products require electromagnetic shielding of chips within packages, or the isolation of different chips within a package through separate chambers. Furthermore, wire bonding has become a mainstream approach to separate chambers for electromagnetic shielding within packages due to its advantages in process compatibility, flexibility, and low cost.

[0003] Wire bonding technology is to bond metal wires on the package substrate of the chip that needs to be shielded. The specific bonding method is to bond wires from the ground signal pad on one side of the chip, across the back side of the chip (the surface without electrodes), to the ground signal pad on the other side of the chip, and repeat the bonding to form a comb-shaped or mesh-shaped metal wire electromagnetic shielding structure surrounding the chip.

[0004] Figure 1 Figure 1 shows a typical electromagnetic shielding package structure in the prior art. In this package structure, metal wire bonding is first performed on the package substrate of the chip to be shielded. The bonding method is to cross the signal pads on one side of the chip and then to the signal pads on the other side. Repeated wire bonding forms a comb-like or mesh-like metal wire electromagnetic shielding structure surrounding the chip. However, this solution has a large wire bond span, is difficult to operate, and is prone to wire collision during the subsequent packaging process.

[0005] Figure 2 Another typical electromagnetic shielding package structure in the prior art is shown. This package structure features a metal sheet attached to the chip to be shielded, serving as an adapter plate for wire bonding. However, this solution is incompatible with conventional chip-on-chip assembly processes, and the metal sheet itself requires plating, which limits its mass production capabilities. Summary of the Invention

[0006] The primary technical problem to be solved by the present invention is to provide an electromagnetic shielding packaging structure combined with board-level packaging.

[0007] Another technical problem to be solved by the present invention is to provide an electromagnetic shielding packaging method combined with board-level packaging.

[0008] Another technical problem to be solved by the present invention is to provide an electronic product including the above-mentioned electromagnetic shielding packaging structure.

[0009] In order to achieve the above object, the present invention adopts the following technical solutions:

[0010] According to a first aspect of an embodiment of the present invention, there is provided an electromagnetic shielding packaging structure combined with board-level packaging, comprising a first substrate and a chip fixedly mounted on the first substrate, a hollowed-out second substrate, and shielding wires; wherein,

[0011] The second substrate covers the chip, one end of the shielding wire is bonded to the upper surface of the second substrate, and the other end passes through the hollow area of ​​the second substrate and is bonded to the first substrate to achieve electrical connection.

[0012] Preferably, the second substrate is one of a hollow metal lead frame, a ceramic substrate or a PCB substrate.

[0013] Preferably, the hollow area is located between the chips.

[0014] Preferably, the second substrate is exposed from a sidewall of the package body.

[0015] Preferably, the chip is a flip-chip bonding chip or a metal wire bonding chip.

[0016] Preferably, the first substrate is electrically connected to the chip through patch bonding or wire bonding.

[0017] Preferably, the shielding welding wire is a silver wire or a silicon aluminum wire.

[0018] According to a second aspect of an embodiment of the present invention, there is provided an electromagnetic shielding packaging method combined with board-level packaging, comprising the following steps:

[0019] Step 1: Electrically connect the chip to the first substrate;

[0020] Step 2: Covering the non-hollowed area of ​​the second substrate on the upper surface of the chip;

[0021] Step 3: One end of the shielding wire is bonded to the conductive portion on the upper surface of the second substrate, and the other end passes through the hollow area of ​​the second substrate and is bonded to the pad of the first substrate to achieve electrical connection;

[0022] Step 4: performing plastic encapsulation to form a plastic encapsulation body, and performing thinning to expose the shielding welding wire from the upper surface of the plastic encapsulation body;

[0023] Step 5: Cut into individual packages.

[0024] According to a third aspect of an embodiment of the present invention, there is provided an electromagnetic shielding packaging method combined with board-level packaging, comprising the following steps:

[0025] Step 1: Electrically connect the chip to the first substrate and perform wire bonding on the functional signal lines;

[0026] Step 2: Attaching an adhesive material to the upper surface of the chip and bonding the second substrate to the upper surface of the chip so that the non-hollowed-out area covers the upper surface of the chip and the functional signal lines are located in the hollowed-out area;

[0027] Step 3: Bond one end of the shielding wire to the upper surface of the second substrate, and the other end passes through the hollow area of ​​the second substrate and is bonded to the pad of the first substrate;

[0028] Step 4: performing plastic encapsulation to form a plastic encapsulation body, and performing thinning to expose the shielding welding wire from the upper surface of the plastic encapsulation body;

[0029] Step 5: Cut into individual packages.

[0030] According to a fourth aspect of the embodiments of the present invention, there is provided an electronic product, comprising the above-mentioned electromagnetic shielding packaging structure combined with board-level packaging.

[0031] Compared with the prior art, the present invention has the following technical effects:

[0032] 1. The simultaneous operation of the entire substrate solves the problems of high difficulty in large-span wire bonding and easy wire collision in the subsequent packaging process in the existing technology, improves production efficiency and packaging quality, simplifies the process, and reduces costs;

[0033] 2. The shielding wire can be bonded through the second substrate to make the line shape more stable, reduce the difficulty of operation, and is less likely to cause wire punching problems in the subsequent packaging process. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 This is a schematic diagram of a typical electromagnetic shielding packaging structure in the prior art;

[0035] Figure 2 Schematic diagram of another typical electromagnetic shielding packaging structure in the prior art;

[0036] Figure 3 A side perspective view of an electromagnetic shielding packaging structure in an embodiment of the present invention;

[0037] Figure 4 This is a top view of the electromagnetic shielding wire after bonding is completed in an embodiment of the present invention;

[0038] Figure 5 This is a schematic diagram of a strip-shaped second substrate in an embodiment of the present invention;

[0039] Figure 6 This is a side view of a chip assembly during fabrication of an electromagnetic shielding packaging structure in an embodiment of the present invention;

[0040] Figure 7This is a top view of chip assembly during fabrication of an electromagnetic shielding packaging structure according to an embodiment of the present invention;

[0041] Figure 8 This is a side view of the second substrate assembly during the manufacture of the electromagnetic shielding packaging structure in an embodiment of the present invention;

[0042] Figure 9 This is a side view after the shielding wires are bonded during the manufacture of the electromagnetic shielding packaging structure according to an embodiment of the present invention;

[0043] Figure 10 This is a top view of the shielding wires after bonding during the manufacture of the electromagnetic shielding packaging structure in an embodiment of the present invention;

[0044] Figure 11 This is a side view of the electromagnetic shielding packaging structure after packaging in an embodiment of the present invention;

[0045] Figure 12 This is a schematic diagram of cutting the electromagnetic shielding packaging structure after packaging in an embodiment of the present invention;

[0046] Figure 13 This is a side perspective view of the electromagnetic shielding packaging structure after cutting in an embodiment of the present invention;

[0047] Figure 14 This is a top perspective view of the electromagnetic shielding packaging structure after cutting in an embodiment of the present invention;

[0048] Figure 15 This is a side view of the electromagnetic shielding packaging structure after cutting in an embodiment of the present invention. DETAILED DESCRIPTION

[0049] The technical content of the present invention is described in detail below with reference to the accompanying drawings and specific embodiments.

[0050] <First embodiment>

[0051] like Figures 3 to 5 As shown, the first embodiment of the present invention discloses an electromagnetic shielding packaging structure combined with board-level packaging, which includes a first substrate 1 and a chip 3 fixedly mounted on the first substrate, a second substrate 2 mounted on the upper surface of the chip 3, and a plurality of shielding wires 4. One end of the shielding wire 4 is bonded to the conductive portion 21 on the upper surface of the second substrate 2, and the other end passes through the hollow area of ​​the second substrate 2 and is bonded to the pad 5 of the first substrate 1 to form electromagnetic shielding. Compared with Figure 1 Compared with the prior art shown in the figure, the technical solution of the present invention can make the line shape of the shielding wire 4 more stable, and is less likely to cause problems such as wire punching in the subsequent packaging process. Figure 2 The prior art shown here has higher efficiency in the entire substrate operation and saves packaging costs.

[0052] To achieve effective electromagnetic shielding, the second substrate 2 includes, but is not limited to, a metal lead frame, a ceramic substrate, or a PCB substrate. A conductive portion 21 is provided on the side of the second substrate 2 facing away from the chip 3, for connection to the shielding bond wire 4. In a preferred embodiment of the present invention, the conductive portion extends to the side of the package body, exposing the side of the package after the package body is cut.

[0053] The second substrate 2 includes a hollowed-out area 9 and a non-hollowed-out area 8. Depending on the circuit layout design of the first substrate 1 for a specific application, the hollowed-out area 9 and non-hollowed-out area 8 are designed so that the portion of the second substrate 2 located above the chip 3 can be larger than, equal to, or smaller than the chip 3's dimensions parallel to the first substrate 1. On the chip's edges with solder joints, the second substrate 2 is smaller than the chip's dimensions; on the chip's edges without solder joints, the second substrate 2 can be larger than the chip's dimensions, typically with a thickness of 80 to 300 microns. The non-hollowed-out area 8 of the second substrate 2 can be larger than, equal to, or smaller than the chip's dimensions parallel to the first substrate 1.

[0054] The first substrate 1 and the second substrate 2 are strip-shaped. In this embodiment, the area of ​​the second substrate 2 is larger than the size of the chip in the direction parallel to the first substrate 1 (hereinafter referred to as: the size of the chip), so that the second substrate 2 can be exposed on the side of the package when the package is cut, thereby connecting to the electromagnetic shielding layer.

[0055] In a preferred embodiment of the present invention, the size of the non-hollowed area 8 of the second substrate 2 is larger than the size of the chip and can be any shape, such as a rectangle. The non-hollowed area is surrounded by hollowed areas 9. The area and layout of each non-hollowed area are designed to be aligned one by one with each chip on a strip so as to cover the corresponding chip, making it easier for the shielding wire 4 to be exposed from the hollowed area for the wire bonding process. Since one end of the shielding wire 4 is located on the second substrate, and the second substrate is located on the upper surface of the chip, the distance from this end of the shielding wire 4 to the upper surface of the plastic package body is reduced, thereby enhancing the ability of the shielding wire 4 to resist molding in the plastic packaging process and preventing wire punching.

[0056] In one embodiment of the present invention, the chip 3 is packaged in a flip-chip soldered form, and the first substrate 1 is connected to the chip 2 in a patch form.

[0057] In another embodiment of the present invention, the chip 3 is packaged as a metal wire bond chip, and the first substrate 1 is connected to the chip 2 by wire bonding. Similarly, the shielding wire 4 can be made of copper wire, gold wire, silver wire, aluminum wire, alloy wire, plated wire, or other conductive materials that can meet the requirements of electromagnetic shielding.

[0058] <Second embodiment>

[0059] Combine Figures 6 to 15 As shown, the second embodiment of the present invention discloses an electromagnetic shielding packaging method combined with board-level packaging, which includes the following steps:

[0060] Step 1: Electrically connect the chip 3 to the first substrate 1 by mounting. The chip 3 includes but is not limited to a flip-chip bonding chip or a metal wire bonding chip. In this embodiment, a flip-chip bonding chip is used.

[0061] Step 2: Attach an adhesive material, such as glue 7 , to the upper surface of the chip 3 , and adhere the second substrate 2 to the upper surface of the chip 3 so that the non-hollowed-out area just covers the upper surface of each chip 3 .

[0062] Step 3: Bond one end of the shielding wire 4 to the conductive portion 21 on the upper surface of the second substrate 2 , and the other end passes through the hollow area 9 of the second substrate 2 and is bonded to the pad 5 of the first substrate 1 .

[0063] In this embodiment, a conventional wire bonding machine is used to implement the bonding process. Because the soldering needle tip is relatively small, it will not come into contact with the non-hollowed area 8 of the substrate 2 and can easily pass through the hollowed area 9.

[0064] Step 4: perform plastic encapsulation to form a plastic encapsulation body 6 , and perform thinning to expose the shielding welding wires from the upper surface of the plastic encapsulation body 6 .

[0065] Step 5: Cut into individual packages.

[0066] After singulation, the second substrate is exposed from the sidewalls of the package. Because multiple chips on the entire substrate are covered by the same second substrate 2 in the same step, the second substrate is exposed after singulation. This simultaneous operation of the entire substrate improves production efficiency, simplifies the process, and reduces costs.

[0067] The electromagnetic shielding packaging method provided by the present invention does not require an additional metal shielding layer, and can replace the existing technology of covering the metal shielding layer.

[0068] <Third embodiment>

[0069] The electromagnetic shielding packaging method provided by the embodiments of the present invention can be implemented in a variety of ways. One approach involves bonding all wires after attaching the substrate 2, ensuring that the portion of the substrate 2 above the chip exposes the chip's solder joints, allowing for a single bonding step. Another approach involves first bonding the signal wires, then wrapping the signal wires with adhesive using the substrate 2, and then bonding the shielding wires.

[0070] Combine Figures 6 to 15As shown, the third embodiment of the present invention discloses another electromagnetic shielding packaging method combined with board-level packaging.

[0071] Unlike the second embodiment, after the chip 3 is mounted on the first substrate 1, the second substrate is first pasted and then the functional signal bonding is performed. In this embodiment, the functional signal bonding of the chip 3 is first performed and then the second substrate is pasted, and then the shielding bonding wire is bonded.

[0072] Step 1: Electrically connect the chip 3 to the first substrate 1 by wire bonding, and perform functional signal line bonding;

[0073] Step 2: Attach an adhesive material, such as glue 7, to the upper surface of the chip 3, and adhere the second substrate 2 to the upper surface of the chip 3 so that the non-hollow area just covers the upper surface of each chip 3, and the functional signal line is located in the hollow area.

[0074] Step 3: Bond one end of the shielding wire 4 to the conductive portion 21 on the upper surface of the second substrate 2 , and the other end passes through the hollow area 9 of the second substrate 2 and is bonded to the pad 5 of the first substrate 1 .

[0075] Step 4: perform plastic encapsulation to form a plastic encapsulation body 6 , and perform thinning to expose the shielding welding wires from the upper surface of the plastic encapsulation body 6 .

[0076] Step 5: Cutting into individual packages so that the second substrate is exposed from the sidewalls of the package.

[0077] The present invention utilizes a second substrate with a hollowed-out area, allowing each shielding wire to pass through the hollowed-out area and be wire-bonded to the chip upper surface and the first substrate, thereby reducing the relative height of the shielding wires and avoiding wire punching during the plastic packaging process.

[0078] In this invention, multiple chips on an entire substrate strip are covered with a single second substrate 2 in the same process, and then singulated. This simultaneous operation of the entire substrate strip improves production efficiency and packaging quality, simplifies the process, and reduces costs. Furthermore, the use of a second substrate shortens shielding wire lengths, preventing wire overlap and improving quality.

[0079] <Fourth embodiment>

[0080] The present invention also provides an electronic product comprising the aforementioned electromagnetic shielding packaging structure combined with board-level packaging. The electronic product may be a wireless communication device, a wearable electronic device, an unmanned aerial vehicle, an electric vehicle, or the like.

[0081] Compared with the prior art, the present invention has the following technical effects:

[0082] 1. The simultaneous operation of the entire substrate solves the problems of high difficulty in large-span wire bonding and easy wire collision in the subsequent packaging process in the existing technology, improves production efficiency and packaging quality, simplifies the process, and reduces costs;

[0083] 2. The shielding wire can be bonded through the second substrate to make the line shape more stable, reduce the difficulty of operation, and is less likely to cause wire punching problems in the subsequent packaging process.

[0084] The electromagnetic shielding packaging structure, packaging method, and electronic product combined with board-level packaging provided by the present invention are described in detail above. For those skilled in the art, any obvious modification without departing from the essence of the present invention would constitute an infringement of the patent rights of the present invention and would result in corresponding legal liability.

Claims

1. An electromagnetic shielding packaging method combined with board-level packaging, characterized in that The steps include: Step 1: electrically connecting the chip to the first substrate; Step 2: Covering the non-hollowed-out area of ​​the second substrate on the upper surface of the chip; Step 3: bonding one end of the shielding wire to the conductive portion on the upper surface of the second substrate, and bonding the other end of the shielding wire to the pad of the first substrate through the hollow area of ​​the second substrate to achieve electrical connection; Step 4: performing plastic encapsulation to form a plastic encapsulation body, and performing thinning to expose the shielding welding wire from the upper surface of the plastic encapsulation body; Step 5: Cut into individual packages. Wherein, the second substrate includes a hollow area and a non-hollow area; In step 2, the area and layout of each non-hollow area are designed to be aligned one by one with each chip on a strip so that each non-hollow area covers the upper surface of the corresponding chip, and in step 3, the shielding welding wire is exposed from the hollow area for wire bonding process.

2. An electromagnetic shielding packaging method combined with board-level packaging, characterized in that The steps include: Step 1: electrically connect the chip to the first substrate and perform wire bonding on the functional signal lines; Step 2: attaching an adhesive material to the upper surface of the chip, and bonding the second substrate to the upper surface of the chip, so that the non-hollow area covers the upper surface of the chip, and the functional signal line is located in the hollow area; Step 3: bonding one end of the shielding welding wire to the upper surface of the second substrate, and the other end passing through the hollow area of ​​the second substrate and bonding to the welding pad of the first substrate; Step 4: performing plastic encapsulation to form a plastic encapsulation body, and performing thinning to expose the shielding welding wire from the upper surface of the plastic encapsulation body; Step 5: Cut into individual packages; In step 2, the area and layout of each non-hollow area are designed to be aligned one by one with each chip on a strip so that each non-hollow area covers the upper surface of the corresponding chip, and in step 3, the shielding welding wire is exposed from the hollow area for wire bonding process.

3. An electromagnetic shielding packaging structure combined with board-level packaging, comprising a first substrate and a chip fixedly mounted on the first substrate, characterized in that It also includes a hollowed-out second substrate and a shielding welding wire; wherein, The second substrate covers the chip, one end of the shielding wire is bonded to the upper surface of the second substrate, and the other end passes through the hollow area of ​​the second substrate and is bonded to the first substrate to achieve electrical connection. The second substrate is exposed from the side wall of the package body and connected to the electromagnetic shielding layer; The hollow area is located between the chips; The electromagnetic shielding packaging structure combined with board-level packaging is manufactured by the electromagnetic shielding packaging method combined with board-level packaging according to claim 1 or 2.

4. The electromagnetic shielding packaging structure combined with board-level packaging as claimed in claim 3, characterized in that: The second substrate is one of a hollow metal lead frame, a ceramic substrate or a PCB substrate.

5. The electromagnetic shielding packaging structure combined with board-level packaging as claimed in claim 3, characterized in that: The electromagnetic shielding packaging structure is obtained by first completing signal wire bonding, bonding the second substrate with adhesive to wrap the signal wire, and then performing shielding wire bonding.

6. The electromagnetic shielding packaging structure combined with board-level packaging as claimed in any one of claims 3 to 5, characterized in that: The chip is a flip-chip bonding chip or a metal wire bonding chip.

7. The electromagnetic shielding packaging structure combined with board-level packaging as claimed in any one of claims 3 to 5, characterized in that: The first substrate is electrically connected to the chip through patch or wire bonding.

8. The electromagnetic shielding packaging structure combined with board-level packaging as claimed in any one of claims 3 to 5, characterized in that: The shielding welding wire is a silver wire or a silicon aluminum wire.

9. An electronic product, characterized in that It includes the electromagnetic shielding packaging structure combined with board-level packaging as described in any one of claims 3 to 8.

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