Electronic device comprising a colored glass-based component

Abstract

An electronic device including a colored glass-based component is provided. Components formed from colored glass-based materials are disclosed. A cover member formed from a colored glass-based material can be positioned over one or more device components, such as components of a wireless communication or charging system. The cover member can have optical, electrical, magnetic, and / or mechanical properties that are compatible with the requirements of the one or more device components. In some cases, different portions of the cover member can be configured to have different optical and / or electrical properties.

Description

[0001] Cross-references to related applications

[0002] This patent application is a non-provisional patent application claiming the benefit of U.S. Provisional Patent Application No. 63 / 235,956 entitled “Electronic Devices Including Colored Glass-Based Components”, the entire disclosure of which is incorporated herein by reference. Technical Field

[0003] The embodiments described generally relate to components for electronic devices, including colored glass-based materials. More specifically, embodiments of the invention relate to colored glass and glass-ceramic housing components. Background Technology

[0004] Some modern portable electronic devices may include wireless communication systems and / or wireless charging systems. Typically, such wireless communication and / or charging systems are located within the housing of the electronic device. The embodiments described herein relate to electronic device housings that include colored glass-based housing components and offer advantages compared to some conventional electronic device housings. Summary of the Invention

[0005] The embodiments described herein generally relate to components for electronic devices, which include colored glass-based materials. Components including colored glass-based materials can be housing components of electronic devices, such as cover members. In some embodiments, the components are colored glass components or colored glass-ceramic components.

[0006] In one embodiment, the colored glass base material can be either a colored glass material or a colored glass-ceramic material. In another embodiment, the component may include both colored glass material and colored glass-ceramic material. The color of the housing component is visible when viewed perpendicular to the front surface and when viewed from the side. A coating including a color layer may also be coupled to the rear surface of the housing component. In some cases, the coating may be configured as a neutral color, or the components of the coating and housing component may be given a color different from the color of the housing component, such as relative to the color of the housing component. Figure 1B and Figure 2 Further detailed explanation.

[0007] In this embodiment, a housing component comprising a colored glass-based material is configured to provide specific optical properties to an electronic device. For example, the housing component comprising a colored glass-based material may have optical properties suitable for use with one or more internal components of an electronic device. These optical properties may include one or more of color values, transmittance values, or absorption values. Transmittance values ​​may be measured in the visible wavelength range or the infrared (IR) wavelength range.

[0008] In some embodiments, the housing component includes a thinner portion and a thicker portion, and the optical properties of the thinner portion differ from those of the thicker portion. The colored glass substrate material and the housing component can be configured such that the change in optical properties between the thinner and thicker portions of the housing component is large enough to be perceptible, but not large enough to produce a discordant effect. In some cases, the optical properties of the thinner and / or thicker portions can be configured to be suitable for use with internal components such as sensors.

[0009] Housing components, including those made of colored glass-based materials, can also be configured to have electrical and / or magnetic properties suitable for use as internal components in electronic devices. For example, colored glass-based materials can be configured to have dielectric properties suitable for components used in wireless communication systems. Furthermore, colored glass-based materials can be configured to have magnetic properties suitable for components used in wireless charging systems. For example, colored glass-based materials can be substantially non-magnetic.

[0010] Additionally, housing components comprising colored glass-based materials can be configured to provide mechanical properties that offer resistance to breakage and scratches. For example, the colored glass-based material can be chemically strengthened to create a compressive stress layer along one or more surfaces of the housing component. In another example, the internal structure of the colored glass-ceramic material can be configured to provide the housing component with additional toughness and impact resistance.

[0011] Additionally, this disclosure provides an electronic device including a display and a housing. The housing includes: a housing component; a front cover assembly coupled to the housing component and including a front cover member positioned above the display; and a rear cover assembly coupled to the housing component and including a rear cover member and a coating, the rear cover member being formed of a glass material comprising metal nanoparticles configured to impart color to the glass, the coating being disposed along an inner surface of the rear cover member. The rear cover member includes a first portion and a second portion, the first portion defining a first thickness and characterized by a first color, the second portion defining a second thickness greater than the first thickness and characterized by a second color different from the first color.

[0012] This disclosure provides an electronic device including a housing. The housing includes: a housing member defining a side surface of the electronic device; a front cover assembly coupled to the housing member, defining a front surface of the electronic device, and including a front cover member; and a rear cover assembly coupled to the housing member, defining a rear surface of the electronic device, and including a rear cover member. The rear cover member is formed of a colored glass material having a dielectric constant of 5 to 6.5 in a frequency band of 5 GHz to 40 GHz and an optical coating disposed along an inner surface of the rear cover member. At least a portion of the rear cover member has an average visible light transmittance greater than 75% and a chromaticity value of at least 1.75. The electronic device also includes a display positioned below the front cover assembly and a transceiver component of a wireless communication system positioned below the rear cover assembly.

[0013] This disclosure also provides an electronic device including a display, a rear-facing camera array including a camera module array, and a housing. The housing includes: a housing member defining a side surface of the electronic device; a first cover assembly defining a front surface of the electronic device, the cover assembly including a first cover member positioned above the display; and a second cover assembly defining a rear surface of the electronic device and including a second cover member formed of colored glass, a first portion of the second cover member having a first L* value, and a second portion of the second cover member having a second L* value less than the first L* value and defining a through-hole array, each camera module in the camera module array extending into a corresponding through-hole in the through-hole array. The second cover assembly also includes a coating disposed along an inner surface of the second cover member. Attached Figure Description

[0014] This disclosure will be more readily understood from the following detailed description taken in conjunction with the accompanying drawings, wherein similar reference numerals denote similar elements.

[0015] Figure 1A and Figure 1B A view of an exemplary electronic device is shown.

[0016] Figure 2 An exemplary cross-sectional view of an electronic device including a rearward sensing array is shown.

[0017] Figure 3 An exemplary partial cross-sectional view of an electronic device is shown.

[0018] Figure 4 A partial cross-sectional view of an exemplary cover component assembly for an electronic device is shown.

[0019] Figure 5 The dielectric constant values ​​of a set of colored glass compositions suitable for use in housing components are schematically shown.

[0020] Figure 6 A cross-sectional view of another exemplary cover component assembly for an electronic device is shown.

[0021] Figure 7 A cross-sectional view of another exemplary cover component assembly for an electronic device is shown.

[0022] Figure 8 A block diagram of an example electronic device incorporating colored glass-based components is shown.

[0023] The use of crosshairs or shading in the accompanying drawings is generally provided to clarify the boundaries between adjacent elements and also to improve the readability of the drawings. Therefore, the presence or absence of crosshairs or shading does not indicate or suggest any preference or requirement for a particular material, material properties, element proportions, element dimensions, commonalities of similar illustrated elements, or any other feature, property, or characteristic of any element shown in the accompanying drawings.

[0024] Additionally, it should be understood that the proportions and dimensions (relative or absolute) of the various features and elements (as well as their sets and groups), and the boundaries, spacing, and positional relationships therebetween, are provided in the accompanying drawings solely to facilitate understanding of the various embodiments described herein, and may therefore be unnecessarily presented or shown for scaling and are not intended to indicate any preference or requirement for the illustrated embodiments to exclude embodiments in conjunction with them. Detailed Implementation

[0025] Reference will now be made specifically to the representative embodiments shown in the accompanying drawings. It should be understood that the following description is not intended to limit the embodiments to a single preferred embodiment. Rather, the embodiments are intended to cover alternatives, modifications, and equivalents that may be included within the scope and spirit of this disclosure and the appended claims.

[0026] The following disclosure generally relates to components for electronic devices, including colored glass-based materials. Components including colored glass-based materials may be described as housing components, such as cover members. This disclosure also relates to housings including these components and electronic devices including these housings.

[0027] In some cases, a product line of electronic devices may have housing components formed from a set of colored glass-based material components. Each component in this set can be configured to provide a housing component that meets one or more performance specifications while also providing a specific color. For example, the housing component may need to meet technical specifications for one or more electrical characteristics, which ensures that the housing component allows for reliable wireless transmission. Furthermore, the housing component may need to meet technical specifications for light transmission, intensity, etc., as described in more detail below.

[0028] In implementations, a housing component comprising a colored glass-based material is configured to provide specific optical properties to an electronic device. These optical properties may include one or more of a color value, a transmittance value, an absorptivity value, or a color value. The color of the housing component may be characterized in several ways, such as by coordinates in the CIEL*a*b* (CIELAB) color space, coordinates in the L*C*h color space, or both. In some examples, the color of the housing component is characterized by an a* value having a magnitude greater than or equal to 0.5, greater than or equal to 0.75, or greater than or equal to 1. In other examples, the color of the housing component is characterized by a b* value having a magnitude greater than or equal to 1, greater than or equal to 1.5, or greater than or equal to 2. In still other examples, the color of the housing component is characterized by a C* value greater than 1.75, greater than 2, or greater than 2.5. Relative to Figure 4 An additional description of the color space parameters is provided, and this description generally applies herein.

[0029] Transmittance values ​​can be measured in the visible or infrared (IR) wavelength range. For example, a colored glass-based housing component may have a transmittance in the visible light range of 75% to 95%, 80% to 90%, or 80% to 95%. As another example, a colored glass-based housing component may have a transmittance in the IR light range of 70% to 95%, or 80% to 95%. Each of these transmittance values ​​may be an average transmittance value. In some cases, the colored glass-based housing component has an IR transmittance value suitable for use in an optical module configured to operate in the IR wavelength range. Furthermore, relative to... Figure 4 Additional descriptions of the provided transmittance parameters generally apply herein.

[0030] In some embodiments, the housing component includes a thinner portion and a thicker portion, and the optical properties of the thinner portion differ from those of the thicker portion. The colored glass substrate material and the housing component can be configured such that the change in optical properties between the thinner and thicker portions of the housing component is large enough to be perceptible, but not large enough to produce a discordant effect. Relative to Figure 4 Further description is provided of the variations in optical properties of housing components having thinner and thicker portions, and this description generally applies herein. The thicker portion may also be referred to herein as a thick portion, and the thinner portion may also be referred to herein as a thin portion.

[0031] Housing materials, including colored glass-based materials, can also be configured to have electrical and / or magnetic properties suitable for internal components of electronic devices. In some cases, colored glass-based materials can be configured to have dielectric properties suitable for components used in wireless communication systems. For example, colored glass-based materials may have dielectric constants of 3 to 7, 4 to 8, 4 to 6.5, 5 to 7, 5 to 6.5, or 6 to 7 in radio frequency bands (such as bands from about 5 GHz to about 40 GHz). Furthermore, colored glass-based materials can be configured to have magnetic properties suitable for components used in wireless charging systems. For example, colored glass-based materials can be substantially non-magnetic. (Relative to...) Figure 4 The description of the electrical and magnetic properties of the colored glass-based materials provided is generally applicable herein and will not be repeated here.

[0032] Additionally, housing components comprising colored glass-based materials can be configured to provide mechanical properties that offer resistance to breakage and scratches. For example, the colored glass-based material can be chemically strengthened to create a compressive stress layer along one or more surfaces of the housing component. In another example, the internal structure of the colored glass-ceramic material (e.g., the size, amount, and distribution of crystals) can be configured to provide additional toughness and impact resistance to the housing component.

[0033] In some cases, housing components or other parts of electronic devices are formed from one of a set of colored glass-based material compositions. Each component in this composition can produce a different color for the housing component. This composition can be selected such that the housing component also possesses optical properties (e.g., IR transmittance), electrical properties (e.g., dielectric constant), or both, within a specified range, in addition to color. This uniformity of optical and / or electrical properties allows housing components of different colors to have similar performance when placed above internal components (such as components or sensors in wireless communication or charging systems), such as relative to... Figure 3 A more detailed explanation.

[0034] In some embodiments, the colored glass-based material can be a colored glass material or a colored glass-ceramic material. In other embodiments, the component can include both colored glass materials and colored glass-ceramic materials. For example, the component can be formed from a crystallizable colored glass material that is subsequently crystallized to form a colored glass-ceramic material. In some cases, the color of the colored glass-based material originates from elements incorporated into the crystalline phase of the glass and / or material. Alternatively or additionally, the color of the colored glass-based material originates from elements that form different nanophases (e.g., metallic nanoparticles) within the crystalline phase of the glass and / or material. Relative to Figure 4 The description of suitable elements for imparting color to glass-based materials is generally applicable herein and will not be repeated here.

[0035] The composition of glass-based materials containing "coloring" elements can affect not only the color of housing components but also other optical and / or electrical or magnetic properties. For example, including coloring elements in a glass material can modify the dielectric constant of the glass compared to the "base" glass material. Therefore, in some cases, the colored glass-based material composition used in the housing components described herein can provide a balance between desired color and desired electrical and / or magnetic properties. Relative to Figure 4 The description of the balance between color and electrical and / or magnetic properties provided is generally applicable herein and will not be repeated here. In some cases, a set of glass-based material compositions can be established such that different colors of housing components can be produced while providing an acceptable level of uniformity in electrical, magnetic, and / or other optical properties.

[0036] The composition of glass-based materials containing "coloring" elements can also affect mechanical, optical, and electrical and / or magnetic properties. For example, including a stretchable nanophase (such as metallic nanoparticles) in a glass-based material can increase its toughness. Therefore, in some cases, the colored glass-based material composition used in the housing components described herein provides a balance between desired color, other desired optical properties, desired electrical and / or magnetic properties, and desired mechanical properties. Relative to Figure 4 The description of the balance between electrical and mechanical properties provided is generally applicable here and will not be repeated.

[0037] In some embodiments, the housing component is part of the assembly, and the optical properties of the component comprising a colored glass-based material affect the optical properties of the assembly. In other embodiments, the cover assembly may include a cover member formed of a colored glass-based material and a coating coupled to the rearward surface of the housing component. The coating can affect the amount of light transmitted back through the cover member and is therefore referred to as an optical coating. The optical properties of both the cover member and the coating can affect the optical properties of the assembly. The coating may be configured to be a neutral (or near-neutral) color, or it may be configured to give the assembly a different color than the housing component. Relative to Figure 2 Additional descriptions of the effects of the coating on the perceived color of the cover assembly are generally applicable herein.

[0038] The following text is for reference only. Figures 1A to 8 These and other implementation schemes are discussed. However, those skilled in the art will readily understand that the detailed descriptions given herein with respect to the accompanying drawings are for illustrative purposes only and should not be construed as limiting.

[0039] Figure 1A and Figure 1BAn example of an electronic device, or simply "device," 100, is shown. For the purposes of this disclosure, device 100 may be a portable electronic device, including, for example, a mobile phone, tablet computer, portable computer, laptop computer, wearable electronic device, portable music player, health monitoring device, portable terminal, wireless charging device, device accessory, or other portable or mobile device.

[0040] like Figure 1A and Figure 1B As shown, the electronic device 100 includes a housing 105. The housing 105 includes a front cover assembly 122, a rear cover assembly 124, and a housing component 110. The internal components of the device may be at least partially enclosed by the front cover assembly 122, the rear cover assembly 124, and the housing component 110, and in some cases, may be positioned within the housing (e.g., Figure 2 Within the internal cavity defined by 201). Figure 1A and Figure 1B The example is not limiting, and in other examples, the internal components of the device may be enclosed by a housing component combined with a single cover or any other suitable construction.

[0041] The housing 105 includes one or more components having a colored glass-based material. In some cases, these components are formed of a colored glass-based material. In embodiments, the components including the colored glass-based material are in the form of a cover member included in the rear cover assembly 124. The components including the colored glass-based material may be positioned above one or more internal components of the electronic device 100, such as a radio frequency (RF) antenna assembly (which may be a directional antenna assembly), components for an inductively coupled wireless charging system, etc. The components including the colored glass-based material may also define an opening above one or more internal components of the electronic device, such as the optical module of a camera assembly or sensor assembly.

[0042] In some embodiments, the colored glass-based material is a colored glass material. In other embodiments, the colored glass-based material is a colored glass-ceramic material or a combination of colored glass materials and colored glass-ceramic materials. Relative to Figure 4 Additional descriptions of the composition of the colored glass-based material are provided, and for the sake of brevity, these descriptions will not be repeated here.

[0043] The front cover assembly 122 may at least partially define the front surface 102 of the electronic device. Figure 1A In the example shown, the front cover assembly defines substantially the entire front surface 102 of the electronic device. Figure 1AIn the example, the front cover assembly 122 includes a cover member 132 (also referred to herein as the front cover member). The cover member 132 may extend laterally across the cover assembly 122 (e.g., substantially across the width and length of the cover assembly). For example, the front cover assembly 122 may include an external coating such as an oleophobic coating and / or an anti-reflective coating. The front cover assembly 122 may also define an opening, such as an opening 135, which may be positioned above a speaker or another internal device. Alternatively or additionally, the front cover assembly 122 may include an internal coating, such as a mask layer that provides an opaque portion of the front cover assembly 122. These external and / or internal coatings may be applied to the cover member 132. Furthermore, the front cover assembly may include a mounting frame coupled to an inner surface of the cover member 132 and coupled to the housing member 110.

[0044] In some embodiments, the front cover assembly 122 is substantially transparent or includes one or more substantially transparent portions above the display 142 and / or is configured to operate in the visible wavelength range (e.g., the optical components of the camera assembly 144). As mentioned herein, a component or material is substantially transparent when light is transmitted through it and the degree of scattering is low. The front cover assembly 122 may also be configured to have electrical and / or magnetic properties compatible with one or more components of an electronic device.

[0045] Typically, the cover member 132 is substantially transparent or comprises one or more substantially transparent portions above a display and / or optical components configured to operate in the visible wavelength range. The cover member 132 may also include one or more translucent and / or opaque portions combined with the one or more substantially transparent portions. For example, the transmittance of the cover member 132 (or its transparent portions) in the visible wavelength range (e.g., the visible spectrum) may be at least 85%, 90%, or 95%, and the haze may be less than about 5% or 1%. This transmittance value may be an average value.

[0046] Additionally, the cover member 132, or the portion of the cover member 132 positioned above the display or optical module, may be configured with a sufficiently neutral color such that the optical input to the optical module and / or the optical output provided by the display 142 does not significantly degrade. For example, these portions of the front cover member may be described by an L* value of 90 or greater, an a* value having a magnitude less than 0.5, and a b* value having a magnitude less than 1. In some embodiments, tinted glass, as described herein, may define other portions of the cover member 132, such as the peripheral portion of the cover member.

[0047] The cover member 132 may also be configured to have additional optical, electrical, and / or magnetic properties compatible with one or more components of an electronic device. For example, the cover member 132 may also be configured to provide infrared (IR) transmittance suitable for use in optical components configured to generate images from infrared light (e.g., near-IR light). In some cases, the cover member 132 may have a transmittance value of at least 85%, 90%, or 95% within an infrared wavelength range (e.g., 770 nm to 1000 nm). These transmittance values ​​may be averages over the infrared wavelength range. As another example, the cover member 132 may be configured to provide electrical properties suitable for use in components (such as component 181) of a wireless communication system. For example, the cover member 132 may be a dielectric cover member and may be formed of a material having a sufficiently low dielectric constant and dissipation factor to allow RF or IR (e.g., near-infrared) signal transmission through the cover member.

[0048] In some cases, the cover member 132 may be formed of a glass material, a glass-ceramic material, or a combination thereof. In additional cases, the cover member 132 may be formed of one or more layers, such as a glass layer, a glass-ceramic layer, a ceramic layer, or a polymer layer. In some embodiments, the cover member 132 has a thickness of less than 3 mm, less than or equal to 2 mm, less than or equal to 1 mm, about 250 micrometers to about 1 mm, or about 500 micrometers to about 1 mm.

[0049] The rear cover assembly 124 at least partially defines the rear surface 104 of the electronic device. Figure 1B In the example shown, the back cover assembly 124 defines substantially the entire rear surface 104 of the electronic device. The back cover assembly 124 includes a cover member 134. In some cases, the back cover assembly 124 also includes at least one (optically) clear window member. The back cover assembly 124 may also include one or more coatings. For example, the back cover assembly 124 may include an external coating, such as a stain-resistant (e.g., oleophobic) coating. Alternatively or additionally, the back cover assembly 124 may include one or more internal coatings, such as a color layer, a multilayer interference laminate, or a metallic layer, to provide a decorative effect. (Relative to...) Figure 2 Additional description of the internal coatings is provided. These external and / or internal coatings may be applied to the cover member 134. Furthermore, the rear cover assembly 124 may include a mounting frame coupled to the inner surface of the cover member 134 and to the housing member 110. Figure 1B In the example, the back cover assembly 124 is positioned above the device component 182, which can be a wireless charging component, and the device component 183, which can be a wireless communication component.

[0050] In some cases, the back cover assembly 124 may be characterized by color, such as a color other than a neutral color. The color of the back cover assembly may be characterized by coordinates in the CIEL*a*b* (CIELAB) color space. Alternatively or otherwise, the color of the back cover assembly may be characterized by coordinates in the L*C*h color space. In one embodiment, the perceived color of the back cover assembly 124 is at least partially attributed to the color of a corresponding portion of the back cover member 134. In another embodiment, the perceived color of the back cover assembly 124 is attributed to both the color of a corresponding portion of the back cover member 134 and the optical properties of the internal coating.

[0051] The back cover assembly 124 may also include one or more substantially transparent portions (e.g., above an optical component 177 configured to operate in the visible wavelength range). The back cover assembly 124 may also include one or more translucent and / or opaque portions combined with the one or more substantially transparent portions. For example, the back cover assembly 124 may include a translucent and / or opaque portion above a device component configured to operate in a range other than the visible wavelength or frequency range (e.g., the infrared (IR) wavelength range or the radio frequency (RF) range). Similarly, the back cover assembly 124 may include a translucent or opaque portion above a device component 182 of an inductively coupled wireless charging system.

[0052] In the embodiments described herein, different portions of the back cover assembly 124 have different optical properties, such as different light transmittance and / or color values. Differences in the light transmittance and / or color values ​​of the back cover assembly can be attributed to differences in the light transmittance and / or color values ​​of different portions of the cover member 134. For example, portions of the cover member 134 with different thicknesses, curvatures, etc., can produce differences in the perceived color of the back cover assembly 124. Changes in viewing angle can also produce differences in the perceived color of the back cover assembly 124. Figure 2 , Figure 4 and Figures 6 to 7 An example of a cover component with thinner and thicker sections is shown, while Figure 4 , Figure 6 and Figure 7 An example of a cover component with varying curvature is shown in the figure.

[0053] exist Figure 1B In the example, the back cover assembly 124 defines a thinner portion 125 and a thicker portion 127. For example... Figure 1BAs shown, the thicker portion 127 of the cover assembly 124 protrudes or is offset relative to the thinner portion 125 of the cover assembly 124. The thicker portion 127 may define a raised surface 128 (also referred to as a top surface or platform) and a side surface 129, while the thinner portion 125 may define a surface 126. In an embodiment, the cover member 134 also defines a thinner portion located at the location of the thinner portion 125 and a thicker portion located at the location of the thicker portion 127. An example of a cover member having a thinner portion and a thicker portion is shown in... Figure 2 and Figure 4 The descriptions of the dimensions and optical, electrical and / or magnetic properties provided in these figures are generally applicable herein.

[0054] As previously discussed, the back cover assembly 124 includes a cover member 134 (also referred to herein as the back cover member). In an embodiment, the cover member 134 is formed of a colored glass-based material. The description of the composition and optical properties of the cover member 134 applies to the optical properties of the cover member 134 and will not be repeated here for the sake of brevity.

[0055] In some cases, cover member 134 may define corresponding thicker and thinner portions, wherein the thicker portion and the thinner portion are integrally formed. The description of the dimensions of cover member 134 applies to cover member 134 and will not be repeated here. In additional cases, the thinner portion 125 may be provided by cover member 134, while the thicker portion 127 may be provided at least partially by an additional cover member coupled to the thinner portion.

[0056] The thicker portion 127 may accommodate one or more components of the sensing array 170. For example, the sensing array 170 may include multiple camera assemblies. Each camera assembly may include optical components, such as optical component 177 or optical component 178. Optical component 177 may be at least partially positioned within an opening in the thicker portion 127, as for... Figure 2 The optical component 277 is shown in the diagram. Optical component 177 can be a camera module, while optical component 178 can be an illumination module.

[0057] Furthermore, the sensing array 170 may include one or more sensor components, such as sensor component 179. In some embodiments, sensor component 179 may include one or more optical modules. For example, the sensor component may include a transmitter module, a receiver module, or both. In some cases, sensor component 179 may measure the distance to a target, such as a lidar sensor component configured to illuminate an object with light and then detect the reflected light to determine or estimate the distance between an electronic device and an object (e.g., a time-of-flight (TOF) sensor). In some examples, sensor component 179 may be positioned below cover member 134 (and cover member 134 may act as a window to sensor component 179). In these examples, the optical characteristics of cover member 134 may be adapted for one or more optical components of the sensor component. For example, one or more optical components may operate within one or more specified wavelength ranges, and cover member 134 may be configured to have suitable transmittance / transmittance within these wavelength ranges. In other examples, cover member 134 may define an opening above the sensor component, and an additional cover member may be placed in or above the opening (and act as a window to the sensor component).

[0058] The thicker portion 127 may also include a sensor assembly 180 other than optical components. For example, the sensor assembly 180 may be a microphone, which may be at least partially located within or below an opening in the thicker portion 127. In specific embodiments where the thicker portion 127 serves to protect one or more sensor modules or components, the thicker portion 127 and / or the protruding areas of the thicker portion 127 may be referred to as sensor features, camera features, sensor arrays, camera panels, and / or camera bumps.

[0059] Each of the front cover assembly 122 and the rear cover assembly 124 is coupled to the housing member 110. The housing member 110 may at least partially define a side surface 106 of the electronic device 100, and may also be referred to herein as a housing. Figure 1A and Figure 1B As shown, the housing component used in conjunction with the front cover assembly and the rear cover assembly may also be referred to as a belt. Housing component 110 may include one or more members. Figure 1A and Figure 1BIn one example, the housing component includes multiple members (e.g., one or more metal segments) formed of a metallic material. Specifically, housing component 110 is formed of a series of metal segments (112a, 112b, 112c, and 112d) separated by dielectric segments (114a, 114b, 114c, and 114d), which provide a degree of electrical isolation between adjacent metal segments (e.g., by preventing electrical conduction through the dielectric segments). For example, a polymer segment (114b) may be disposed between a pair of adjacent metal segments (112a, 112c). One or more of the metal segments may be coupled to the internal circuitry of electronic device 100 and may be used as an antenna for transmitting and receiving wireless communications. In an alternative embodiment, housing component 110 may include one or more members formed of a glass material, one or more members formed of a ceramic material, one or more members formed of a glass-ceramic material, a combination of these, or a combination of these with one or more members formed of a metallic material. Figure 1A and Figure 1B The implementation is not limited, and in other examples, housing component 110 may have a different number of components or may have a single construction (e.g., monolithic). In further examples, the front cover assembly and the rear cover assembly may at least partially define the side surfaces of the electronic device. As mentioned herein, housing components or components formed of a particular material such as a metallic material may also include relatively thin coatings of different materials along one or more surfaces, such as anodized layers, physical vapor deposition coatings, paint coatings, primer coatings (which may include coupling agents), etc.

[0060] Housing component 110 may define one or more openings or ports. Figure 1A and Figure 1B In the example, the metal segment 112c of the housing component 110 defines openings 116 and 117. Opening 116 allows (audio) input or output from device components such as a microphone or speaker. Opening 117 may contain an electrical port or connector. Furthermore, the electronic device 100 may include one or more input devices. Figure 1A and Figure 1B In the example, input devices 152 and 154 are in the form of buttons and extend through additional openings in housing component 110. In some cases, electronic device 100 also includes a support plate and / or other internal structural components for supporting internal electronic circuitry or electronic components.

[0061] In some cases, housing component 110 may include one or more components 115 positioned within a metallic component (e.g., 112a). In some cases, component 115 may provide a window for device component 185, may define a portion of a waveguide, and / or allow beamforming or beam guiding functions. For example, component 115 may define an antenna window for transmitting and receiving wireless signals. Component 115 may be configured to transmit wireless signals at one or more of the frequencies previously discussed relative to device components 181, 183, and 185. For example, component 115 may be configured to transmit wireless signals in a frequency band between about 25 GHz and about 39 GHz.

[0062] Component 115 may include cover component 136. Cover component 136 may be formed of a dielectric material. In some cases, cover component 136 may be formed of a glass-ceramic material, and may include one or more glass-ceramic portions, or may be formed of a combination of glass-ceramic layers and one or more of glass layers, ceramic layers, or polymer layers. In additional cases, cover component 136 may be formed of glass material, ceramic material, polymer material, or a combination thereof. Cover component 136 may be substantially transparent, translucent, opaque, or include transparent, translucent, and / or opaque portions. Furthermore, component 115 may also include one or more coatings along the interior and / or exterior of cover component 136. These coatings may be similar to those described with respect to cover components 132 and 134.

[0063] In another embodiment, the electronic device may include a one-piece cover member formed from a single material (instead of separate cover members 122 and 124 coupled to housing member 110). Such a one-piece cover member may also be referred to as a monolithic cover member and may include a colored glass-based material.

[0064] Electronic device 100 includes: a display 142; and a front cover assembly 122 positioned above the display 142. As previously discussed, the front cover assembly 122 may be substantially transparent, or include one or more substantially transparent portions above the display and / or be configured to operate in the visible wavelength range. A housing 105 may at least partially surround and enclose the display 142. The display 142 may generate graphic output emitted through the substantially transparent portion of the front cover assembly. In some cases, the display 142 is a touch-sensitive display. The display 142 may be a liquid crystal display (LCD), a light-emitting diode (LED) display, an LED-backlit LCD display, an organic light-emitting diode (OLED) display, an active-matrix organic light-emitting diode (AMOLED) display, etc. In some embodiments, the display 142 may be attached to (or adjacent to) the front cover assembly 122.

[0065] Electronic device 100 also includes multiple sensing arrays. As mentioned herein, the sensing arrays may include one or more camera components (e.g., a camera array), one or more sensor components (e.g., a sensor array), illumination components, or combinations thereof. The front sensing array 118 includes a forward-facing camera component 144 and a forward-facing sensor component 146. The front sensing array may also include another sensor component 145, which may in some cases be an ambient light sensor. The rear sensing array 170 includes a rear-facing camera component array and at least one sensor component, as described in more detail below. Illumination components typically include light sources such as floodlights or other emitters, capable of enabling various sensing modes such as facial recognition and digital photography. For example, one or more emitters may emit an array of beams of light reflected from various parts of the face. These reflected beams can be used to create a dot map or depth map of the face and for user authentication.

[0066] The sensing assembly may include one or more optical modules. An optical module may include a photodetector and / or image sensor, associated electronics, one or more optical lenses, an optical cover, a cylinder or shield, and associated optical elements. For example, the optical module may be a camera module, an illumination module, or a sensor module. The sensing assembly may define any number of optical modules, such as one, two, three, four, five, or six optical modules.

[0067] like Figure 1A and Figure 1B As shown, the electronic device 100 includes multiple camera components. For example, the electronic device 100 may include a forward-facing camera component 144 and a rearward-facing camera array. Each camera component may include a camera module (e.g., Figure 1B The optical module 177 shown is an example. A camera module array (also referred to herein as a camera array) typically includes multiple camera modules and one or more illumination modules. When the camera array includes multiple camera modules, each camera module may have a different field of view or other optical characteristics. For example, a camera module may be configured to generate an image from visible or infrared light. Multiple camera modules may also be referred to as a group of camera modules, and in some cases may form a camera module array. In some cases, a camera module includes an optical sensor array and / or optical components such as lenses, filters, or windows. In additional cases, a camera module includes an optical sensor array, optical components, and a camera module housing surrounding the optical sensor array and optical components. A camera module may also include a focusing component. For example, a focusing component may include an actuator for moving a lens of the camera module. In some cases, the optical sensor array may be a complementary metal-oxide-semiconductor (CMOS) array, etc.

[0068] The electronic device 100 also includes one or more sensor components. For example... Figure 1AAs shown, the electronic device 100 includes one or more forward sensor assemblies 146. The device 100 also includes, as relative to... Figure 1B One or more backward sensor components described in more detail. Sensor components may also be referred to simply as sensors herein. Examples of sensors (components) include, but are not limited to, proximity sensors, light sensors (e.g., ambient light sensors), biometric sensors (e.g., facial or fingerprint recognition sensors or health monitoring sensors), depth sensors, or imaging sensors. Other examples of sensors include microphones or similar audio sensing devices, radio frequency identification chips, touch sensors, force sensors, accelerometers, gyroscopes, magnetometers (such as Hall effect sensors or other magnetic sensors), or similar position / orientation sensing devices. When the sensor is an optical sensor, it may operate within a specific wavelength range, such as the visible light wavelength range, the infrared light wavelength range, or the ultraviolet light wavelength range. In some cases, optical sensors are reflective sensors. The electronic device may also include a processing unit (also called a processor) that calculates values ​​based on signals from the sensor.

[0069] In some cases, one or more sensors may be grouped with one or more camera components. For example, these sensors may be depth sensors (e.g., time-of-flight sensors), ambient light sensors, face recognition sensors, infrared sensors, ultraviolet light sensors, health monitoring sensors, biometric sensors (e.g., fingerprint sensors), etc. These sensors may be positioned near one or more optical modules of the camera array, such as... Figure 1B As shown. Relative to Figure 8 Additional descriptions of the provided sensor components, camera components, and processors generally apply herein.

[0070] Furthermore, electronic device 100 may include one or more device components, such as device components 181, 183, and 185, which may be part of a wireless communication system. For example, the wireless communication system may be an RF or IR communication system. In some cases, device components 181, 183, and 185 are antenna transmitting modules that may include one or more antenna assemblies, and are also simply referred to herein as antennas. The RF communication system may operate in one or more of the following frequency ranges: “low frequency band” (e.g., less than 1 GHz, such as about 400 MHz to less than 1 GHz, about 600 MHz to about 900 MHz, or 600 MHz to 700 MHz), “mid frequency band” (e.g., about 1 GHz to about 6 GHz, such as about 1 GHz to about 2.6 GHz, about 2 GHz to about 2.6 GHz, about 2.5 GHz to about 3.5 GHz, or about 3.5 GHz to about 6 GHz), or “high frequency band” (e.g., about 24 GHz to about 40 GHz, about 57 GHz to about 64 GHz, or about 64 GHz to about 71 GHz), or about 1 GHz to about 10 GHz. As previously discussed, components of an RF communication system may include an RF antenna configured to radiate radio frequency (RF) signals. This RF antenna may be configured to operate within one or more desired RF frequency ranges or RF bands.

[0071] In some cases, electronic device 100 may include one or more antennas comprising elements configured to communicate via 5G wireless protocols, including millimeter-wave and / or 6GHz communication signals. 5G communication can be implemented using various different communication protocols. For example, 5G communication may utilize communication protocols employing frequency bands below 6GHz (also known as sub-6GHz spectrum). Alternatively, 5G communication may utilize communication protocols employing frequency bands above 24GHz (also known as millimeter-wave spectrum). Furthermore, the specific frequency band of any given 5G implementation may differ from other implementations. For example, different wireless communication providers may use different frequency bands in the millimeter-wave spectrum (e.g., one provider may use frequencies of approximately 28GHz to implement a 5G communication network, while another provider may use frequencies of approximately 39GHz). The antenna array may be configured to allow communication via one or more frequency bands in the frequency bands used to implement 5G communication.

[0072] In some cases, electronic device 100 includes one or more directional antennas (or high-gain antennas). Therefore, the antenna gain of the directional antenna can be highest along a specific direction. The directional antenna may include an array of transceiver elements used to form the shape and orientation of the antenna's radiation pattern (or lobes), and the antenna may be a millimeter-wave antenna. (As relative to...) Figure 3 To further explain, the electronic device 100 may include multiple directional antennas with different main transmission directions.

[0073] Figure 2 An exemplary cross-sectional view of an electronic device including a rearward sensing array is shown. The electronic device 200 includes a housing 205, which includes a front cover assembly 222 and a rear cover assembly 224. The rear cover assembly 224 may include or be formed of a colored glass-based material. The front cover assembly 222 may include a cover member 232, a display 264, and a touch sensor 262. The electronic device also includes a housing component 210 defining a side surface of the electronic device. The housing component may include a member 212. Figure 2 It can be along Figure 1B An exemplary cross-sectional view of AA, and the front cover assembly 222 and the rear cover assembly 224 and their respective elements can be viewed as previously described relative to... Figure 1A and Figure 1B As stated above.

[0074] Electronic device 200 includes a sensing array 270 located at the rear of the electronic device 200. The sensing array 270 (which can also be described as a rearward sensing array) includes rearward optical modules 277 and 278. Figure 2 In the example, rear-facing optical modules 277 and 278 are part of a rear-facing camera array 275, as described in more detail below. At least some elements of the camera array 275 are located within an internal cavity 201 of the electronic device. The electronic device 200 may also include components of a wireless communication and / or charging system, such as... Figure 1B and Figure 3 As shown.

[0075] Rear cover assembly 224 includes cover member 234. Figure 2 In this example, the back cover member 234 does not extend above the optical modules 277 and 278. Instead, the cover member 234 defines through-holes 267 and 268, and the optical modules 277 and 278 extend at least partially into these through-holes. Windows 287 and 288 extend above the optical modules 277 and 278 (and above the through-holes 267 and 268). Windows 287 and 288 may be formed of clear glass ceramic, clear ceramic such as sapphire, or glass. The back cover member 234 may extend above components of the wireless communication and / or charging system, such as... Figure 1B and Figure 3 As shown.

[0076] exist Figure 2In the example, cover assembly 224 includes a thicker portion 227 and a thinner portion 225, and sensing array 270 is generally located near the thicker portion 227. The thicker portion 227 is at least partially defined by the thicker portion 237 of cover member 234, and the thinner portion 225 is at least partially defined by the thinner portion 235 of cover member 234. The thicker portion 227 also defines a feature 257 that protrudes relative to the thinner portion 225. Feature 257 is also generally referred to herein as a protruding region, a protruding feature, a platform region, or a feature or bump.

[0077] The thinner portion 225 of the cover assembly 224 defines an outer surface 226 (also referred to herein as a base surface). The thicker portion 227 of the cover assembly 224 defines an outer surface 228 (also referred to herein as a raised surface or top surface). For example, the outer surface 228 may substantially define a platform. Such an outer surface may also be referred to herein as a (raised) platform surface. The feature portion 257 protrudes relative to the outer surface portion 226.

[0078] exist Figure 2 In the example, through-holes 267 and 268 extend through the thicker portion 227 of the cover assembly 224. For clarity, the dimensions of through-holes 267 and 268 are enlarged. The openings of these holes are located in the outer surface 228. These through-holes may be referred to as a set of through-holes and, in some cases, may define an array of through-holes. Similarly, the openings may be referred to as a set of openings and, in some cases, may define an array of openings. Modules such as camera modules, sensor modules, or lighting modules may be positioned below or within each opening of this set of openings. Furthermore, at least some of the modules may extend into the corresponding through-holes in this set of through-holes. One end of one or more modules may protrude above the outer surface 228.

[0079] Figure 2 A cross-sectional view shows two optical modules (277, 278) of the camera array 275. The camera array 275 also includes a support structure 271. The support structure 271 can be configured to hold various elements of the camera array 275 in place. For example, one of the optical modules 277 and 278 can be mounted to the support structure 271. Figure 2 In the example, the support structure 271 includes a bracket 272 with a non-planar profile. The shape of the bracket 272 is not limited to... Figure 2 This is an example, and in other examples it may have the form of a flat element. The bracket 272 may be coupled to the inner surface of the cover assembly 224. Figure 2In the example, the support structure 271 also includes a frame 273 that is at least partially nested within the bracket 272 and supports a circuit assembly 274 that can be mounted on a printed circuit board. However, this example is not limiting, and in additional embodiments, the frame 273 may be omitted. The coupling between the support structure 271 and the camera array 275 and the inner surface 242 of the cover assembly 224 may be configured to limit the bending of the cover member 234 near the protruding feature. In some cases, at least one optical module of the optical module of the camera array 275 is configured to operate in the visible wavelength range.

[0080] As previously relative Figure 1A and Figure 1B The optical module may include a camera module, an illumination module, an optical sensor, etc. Typically, the camera array 275 includes at least one camera module and may include two, three, four, or five camera modules. The camera modules are electrically connected to the circuit assembly 274. Figure 2 As shown, separate windows 287 and 288 are positioned above through-holes 267 and 268, and retaining member 286 holds windows 287 and 288 in place. For example, retaining member 286 may be a ring, such as a metal ring, surrounding an end of the optical module. Alternatively, the optical module may include windows that are part of its optical components, wherein the windows are positioned within its housing. The windows may protect underlying components (e.g., cameras, lenses, other sensors) and may define a portion of the outer surface 244 of the cover assembly 224.

[0081] In some embodiments, the cover member 234 comprises a colored glass-based material. In some cases, the cover member 234 is formed of a colored glass-based material. As previously discussed, the optical properties of the rear cover member 234 generally affect the optical properties of the rear cover assembly 224. The description of the colored glass-based material and the optical properties of the colored glass-based material provided with respect to the cover member 434 generally apply herein and will not be repeated here.

[0082] In this embodiment, the optical properties of the thicker portion 237 of the cover member 234 differ from those of the thinner portion 235. For example, the average transmittance in the visible range of the thinner portion 235 may be greater than that in the thicker portion 237. Additionally, the color of the thicker portion 237 may differ from that of the thinner portion 235, such as relative to... Figure 4 The description of the color variations between different portions of the cover member provided with respect to cover member 434 is generally applicable herein and will not be repeated here.

[0083] like Figure 2 As shown, the inner coating 260 is disposed along the inner surface of the cover member 234. In some embodiments, as previously described relative to... Figure 1BThe external coating (such as an anti-fouling coating) may be applied along the outer surface of the cover member 234. The optical properties of the coating 260 can affect the optical properties of the rear cover assembly. For example, the coating can affect the amount of light transmitted back through the cover member to an observer, and thus may be referred to as an optical coating. In some embodiments, the coating 260 is configured to at least partially reflect visible light transmitted through the rear cover member and incident on the coating. In other words, the coating 260 is at least partially reflective. Visible light reflected from the coating sends the reflected light back through the cover member. The reflected light leaving the cover member (and the cover assembly) produces the perceived color of the cover assembly.

[0084] Regarding its optical properties, the coating does not need to affect the optical properties of the cover assembly like a mirror. As an example, a partially reflective coating can simply be white or light-colored. Additionally, coating 260 can absorb at least some wavelengths of light that are transmitted through the back cover member 234 and incident on the coating, and thus can affect the spectrum or light reflected back through the back cover member 234. In some cases, the spectrum of light reflected from the coating is similar to the spectrum of light incident on the coating (e.g., for a neutral coating with a* and b* close to zero). In other cases, the coating selectively absorbs some incident light, such that the color of the back cover assembly 224 may differ from the color of the back cover member 234 (without coating). For example, the perceived color of the back cover assembly 224 may differ from the color of the back cover member 234 in terms of chromaticity and / or hue.

[0085] Coating 260 may include a color layer, a multilayer interference stack, or both. When the coating includes both a color layer and a multilayer interference stack, the perceived color of the back cover assembly 224 in the region where the multilayer interference stack is present may differ from that in the region where the multilayer interference stack is not present. The color layer may be polymer-based and include a colorant (e.g., a pigment or dye). As used herein, the color layer may have different hues or may be close to neutral colors (where a* and b* are close to zero, such as white). Coating 260 may include multiple polymer base layers, wherein at least one layer is a color layer. Coating 260 may include an optically dense layer, which may be placed behind the color layer or the multilayer interference stack. In some cases, the entire coating may be optically dense.

[0086] When coating 260 includes a multilayer interference stack, the multilayer interference stack can be used to define a decorative logo or other symbol. The multilayer interference stack may include multiple dielectric layers configured to produce optical interference. The multilayer interference stack may also be referred to herein as an optical interference stack or an optical interference coating (or coating element). In some embodiments, the multilayer interference stack may include a first layer comprising a first inorganic dielectric material and a second layer comprising a second inorganic dielectric material. For example, the coating may comprise metal oxides, metal nitrides, and / or metal oxide nitrides. Suitable metal oxides include, but are not limited to, silicon oxide (e.g., SiO2), niobium oxide (e.g., Nb2O5), titanium oxide (e.g., TiO2), tantalum oxide (e.g., Ta2O5), zirconium oxide (e.g., ZrO2), magnesium oxide (e.g., MgO), etc. Suitable metal nitrides include, but are not limited to, silicon nitride (SiN... x ), silicon oxynitride (e.g., SiO2) x N y The layers of the first and second inorganic dielectric materials can be thin and can be deposited using physical vapor deposition or similar techniques. The description of coating 260 generally applies herein and is not limited to... Figure 2 Examples.

[0087] Cover member 234 may be positioned over one or more internal components of electronic device 200 and may also be configured to allow electromagnetic signals to be transmitted to and / or from the internal components. For example, the colored glass substrate material of cover member 234 may be configured to be RF-transmissive and may have a dielectric constant suitable for use in an RF antenna or wireless charging system. In some cases, the material or combination of materials of cover member 234 may have a dielectric constant (also referred to as relative dielectric constant) of 3 to 7, 4 to 8, 4 to 6.5, 5 to 7, 5 to 6.5, or 6 to 7 in the RF band. In some cases, these values ​​are maximum values, while in others, these values ​​are measured within the frequency range of interest. For example, the frequency range of interest may be about 5 GHz to about 40 GHz or about 25 GHz to about 39 GHz. These values ​​may be measured at room temperature. As another example, the colored glass substrate material of cover member 234 may have a sufficiently low permeability such that it does not interfere with the transmission of the magnetic field generated by the inductively coupled wireless charging system. In some cases, cover member 234 may be substantially nonmagnetic.

[0088] Figure 3 An exemplary partial cross-sectional view of an electronic device is shown. (As shown) Figure 3As shown, the electronic device 300 includes internal device components 381, 382, ​​and 383 positioned within an internal cavity 301. For example, device components 381 and 383 may be part of a wireless communication system, and device component 382 may be part of a wireless charging system. In some cases, the electronic device 300 may include additional device components (not shown in this cross-section) that are part of a wireless communication system, which may be similar to... Figure 1A Component 185. Additional device components 399 are schematically indicated by dashed lines and may include components relative to... Figure 8 One or more of the components mentioned above. Figure 3 Can be along Figure 1B An example of a partial cross-sectional view of BB.

[0089] The housing 305 of the electronic device 300 includes a cover assembly 322 having a cover member 332. The cover member 332 extends over internal device components 381 and may be a front cover member. The electronic device also includes a display 364, which may include a touch-sensing layer. The housing 305 also includes a cover assembly 324 having a cover member 334. The cover member 334 extends over internal device components 382 and 383 and may be a rear cover member. An internal coating 360 is coupled to the inner surface of the cover member 334. Cover assemblies 322 and 324 are coupled to a member 312b of the housing component 310. Coating 360 may be similar to coating 260 in composition and optical properties, and for the sake of brevity, this description will not be repeated here.

[0090] Device component 383 may be part of a wireless communication system and, in some cases, may be a directional antenna (assembly). By way of example, device component 383 may have a main transmission direction substantially perpendicular to the rear surface of the electronic device. Therefore, cover member 334 may be configured to provide electrical characteristics suitable for use in a wireless communication system. For example, cover member 334 may be a dielectric cover member and may be formed of a material having a sufficiently low dielectric constant and dissipation factor to allow RF or IR (e.g., near-infrared) signal transmission through the cover member. Cover member 334 may have dielectric characteristics similar to those of cover members 234 and 434, and for the sake of brevity, this description will not be repeated here. Device components 381 and 383 may be similar to device components 181, 183, and 185 and may operate in similar frequency ranges. For example, device components 381 and 383 may be compatible with 5G wireless protocols, including millimeter-wave and / or 6GHz communication signals. In some cases, device components 381 and 383 can be configured to transmit wireless signals in a frequency band between approximately 25 GHz and 39 GHz.

[0091] When device component 382 is part of an inductively coupled wireless charging system, cover component 334 may be configured to have a sufficiently low magnetic permeability so as not to interfere with the emission of the magnetic field generated by the inductively coupled wireless charging system. For example, components of the inductively coupled wireless charging system may include wireless receiver components, such as wireless receiver coils or other features of the wireless charging system.

[0092] Device component 381 may also be part of a wireless communication system and, in some cases, may be a directional antenna (assembly). By way of example, device component 381 may have a main transmission direction substantially perpendicular to the front surface of the electronic device. Therefore, cover member 332 may be configured to provide electrical characteristics suitable for a component used in a wireless communication system, and may have electrical characteristics similar to those described relative to cover member 334, and may have characteristics similar to those previously described relative to... Figure 1A The components described in the cover component 132.

[0093] Figure 4 A partial cross-sectional view of an exemplary cover member assembly 424 of an electronic device is shown. The cover member assembly 424 includes a cover member 434 and a coating 460 along the rear surface of the cover member 434. The coating 460 may be similar to the coating 260 in composition and optical properties, and for the sake of brevity, its description will not be repeated here.

[0094] exist Figure 4 In the example, portion 436 of the cover member 434 is thicker than portion 438. In some cases, the thicker portion of the housing member will have different optical, electrical, and / or magnetic properties compared to the thinner portion of the housing member, as described in more detail below. Figure 4 As shown, portion 436 has a thickness T2, and portion 438 has a thickness T1. Cover member 434 may be an example of cover member 134, cover member 234, or any other cover member described herein. Figure 4 The examples are not limiting, and additional examples of cover members with two parts of different thicknesses are provided. Figure 6 and Figure 7 As shown in the image.

[0095] In some embodiments, the thinner portion 438 of the cover member 434 is positioned above components of the wireless communication system. Therefore, the thinner portion 438 of the cover member 434 can be configured to allow the transmission of electromagnetic signals to and / or from components of the wireless communication system. Alternatively or otherwise, the thinner portion 438 of the cover member 434 may be positioned above a wireless charging system. Furthermore, the thinner portion 438 of the cover member 434 may have a sufficiently low permeability so that it does not interfere with the transmission of the magnetic field generated by the inductively coupled wireless charging system.

[0096] The combined thickness of portion 436 of the cover member 434 may be greater than the thickness of portion 438, and may be at least 10%, 25%, or 50% thicker than the thickness of portion 438, and more than about 100%, about 200%, or about 250%. For example, the percentage difference between the thickness of portion 436 and the thickness of portion 438 ranges from 50% to 200%, wherein the percentage difference is calculated as the thickness difference between the thicker and thinner portions divided by the thickness of the thinner portion. In some cases, the thickness of the thicker portion 436 of the cover member is greater than about 1 mm and less than or equal to about 2 mm or about 2.5 mm. The thickness of the thinner portion 438 may be greater than about 0.3 mm and less than about 0.75 mm, or greater than about 0.5 mm and less than about 1 mm. The amount of protrusion or offset between surface region 456 and surface region 458 may be from about 0.5 mm to about 1.5 mm or from about 0.75 mm to about 2 mm. The dimensions of feature 437 may depend at least in part on the dimensions of the camera assembly or other device components beneath the thicker portion 436. In some embodiments, the lateral dimension (e.g., width) of the thicker portion 436 may be about 5 mm to about 30 mm, about 10 mm to about 20 mm, or about 15 mm to about 30 mm.

[0097] A portion 438 of the cover member 434 extending from the outer surface 454 to the inner surface 452 defines a region 458 of the outer surface 454. Region 458 may also be referred to herein as surface region 458, outer surface region 458, or a first or base surface region. A portion 436 of the cover member 434, similarly extending from the outer surface 454 to the inner surface 452, defines a region 456 of the outer surface 454. Region 456 may also be referred to herein as surface region 456, outer surface region 456, or a second or raised surface region. Surface region 459 joins surface region 456 and surface region 458.

[0098] The thicker portion 436 can be described as defining a feature 437 that protrudes relative to the surface region 458. The feature 437 defines the surface region 456. Figure 4 In the example, surface region 456 defines the substantially plateau-shaped top of feature 437, and vias 467 and 468 extend through the thicker portion 436 and the protruding feature 437. The optical module of the electronic device extends at least partially into these vias, as previously described relative to... Figure 2 As stated above.

[0099] In some cases, at least some portions of the cover member 434 may have a smooth texture, such as a polished texture. For example, a polished texture may have a root-mean-square height of about 1 nm to about 125 nm, about 1 nm to about 100 nm, about 1 nm to about 75 nm, about 1 nm to about 50 nm, about 1 nm to about 25 nm, or about 1 nm to about 10 nm. In other cases, at least some portions of the cover member 434 may have a texture that is coarser than a polished texture. For example, this texture may be configured to modify optical properties, tactile properties, and / or the cleanability of the textured surface. As a specific example, the difference in texture may be configured to provide optical contrast between different portions of the cover member 434, such as the polished surface of the thicker portion 436 and the coarser surface of the thinner portion 438. For example, the root-mean-square height of a surface configured to have a texture that is coarser than a polished surface may be about 0.1 μm to about 2 μm, about 0.1 μm to about 1.5 μm, or about 0.1 μm to about 1.25 μm. About 0.1 micrometer to about 1.0 micrometer, about 0.25 micrometer to about 2 micrometer, about 0.25 micrometer to about 1.5 micrometer, about 0.25 micrometer to about 1.25 micrometer, about 0.25 micrometer to about 1.0 micrometer.

[0100] The cover member 434 may be characterized by its transmittance within a specified range (such as the visible light spectrum (about 380 nm to 700 nm) or a range such as about 380 nm to 800 nm). In some cases, the average visible light transmittance of at least a portion of the cover member is at least 75%, at least 80%, 75% to 95%, 80% to 90%, or 80% to 95%. In other cases, the transmittance of at least a portion of the cover member in the IR light range is at least 70%, at least 75%, at least 80%, 70% to 95%, or 80% to 95%. The IR light range may be the near-infrared range, such as 770 nm to 1000 nm, or one or more sub-ranges within this range, such as 900 nm to 1000 nm or 920 nm to 960 nm. The cover member 434 is also characterized by its color. When the housing member is formed of a colored glass-based material, the housing member may appear colored when viewed perpendicular to the forward surface. When viewed from another angle or from the side, the housing components may also appear to have color.

[0101] The color of the cover component 434 may be characterized in several ways. For example, the color of the component may be characterized by coordinates in the CIEL*a*b* (CIELAB) color space. In the CIEL*a*b* (CIELAB) color space, L* represents lightness, a* represents the position between red / magenta and green, and b* represents the position between yellow and blue. Alternatively or otherwise, the color of the back cover assembly may be characterized by coordinates in the L*C*h* color space, where C* represents chromaticity, and h... abThis represents the hue angle (in degrees). The chromaticity C* is related to a* and b*, as follows: In addition, the hue angle h ab Related to a* and b*, as follows: Broadband or semi-broadband illuminators can be used to determine the color of a portion of the cover member or cover assembly. For example, a CIE illuminator or other reference illuminator can be used. In some cases, the color of the cover member 434 can be determined from light transmitted through the cover member. In other cases, the color of the cover member 434 can be determined from light reflected back through the cover member (e.g., using a white background). The CIELAB or L*C*h coordinates of a given illuminator can be measured using equipment such as a colorimeter or spectrophotometer, or calculated from the transmitted or reflected spectra.

[0102] In some examples, the color of a housing component, such as cover member 434, is characterized by an a* value greater than or equal to 0.25, greater than or equal to 0.5, greater than or equal to 0.75, or greater than or equal to 1. In other examples, the color of a housing component is characterized by a b* value greater than or equal to 1, greater than or equal to 1.5, or greater than or equal to 2. In still other examples, the color of a housing component, such as cover member 434, may have an L* value of at least 80, at least 85, or at least 90. Additionally, the color of a housing component may be characterized by a C* value greater than 1.75, greater than 2, or greater than 2.5.

[0103] As previously discussed, in some embodiments, different portions of the housing component may have different colors. Examples of housing components with thicker and thinner portions are shown in... Figure 4 As shown, the thicker portion may have a different color than the thinner portion, which is at least partly due to the greater thickness of the glass substrate material that interacts with light in the thicker portion. For example, vertical light entering the cover member 434 and reflected from the coating 460 will have a greater path length in the thicker portion 436 than in the thinner portion 438 (e.g., for a double T-shape of light reflected from the top surface of the coating, the paths are double T2 and double T1, respectively).

[0104] Color differences can be characterized by differences in one or more individual parameters, such as ΔL. * , Δa * Δb *Or C*. In one embodiment, the L* value of the thicker portion may be less than the L* value of the thinner portion. For example, the difference in L* values ​​between the thicker and thinner portions is at least 5, at least 10, at least 15, at least 20, or 10 to 40. In another embodiment, the C* value of the thicker portion may be greater than the C* value of the thinner portion. For example, the C* value of the thicker portion may be at least 20, 25, 30, 35, or 40. The chromaticity difference (ΔC*) between the two portions may be in the range of at least 10, at least 15, at least 20, at least 25, or 15 to 50.

[0105] Color differences at two locations on a component such as cover member 434 can also be characterized in another way. For example, the color difference in the L*a*b* color space can be characterized by a single value as specified in Equation 1.

[0106] Equation 1: In addition, the color difference in the L*C*h* color space can be characterized by the hue difference specified in Equation 2.

[0107] Equation 2: In some implementations, the hue difference (ΔH*) between two locations (and two colors) is less than 15 degrees or less than 10 degrees. Relatively small hue differences (such as 15 degrees or less) between different parts of the cover member (and cover assembly) can produce a harmonious effect.

[0108] In some cases, the color of colored glass-based materials originates from elements incorporated into the glass phase and / or the crystalline phase of the material. Coloring elements can be configured to produce a desired color when visible light is transmitted through the material (e.g., the coloring element can be in a suitable oxidation state and present in a suitable amount). Suitable elements for coloring (also known as staining) glass-based materials include, but are not limited to, rare earth elements and transition metal elements. Transition metal elements include, but are not limited to, titanium, chromium, vanadium, manganese, iron, cobalt, nickel, copper, silver, gold, etc. Rare earth metals or transition metal elements can be incorporated into the glass phase as glass network modifiers, glass network formers, or combinations thereof. Rare earth metals or transition metal elements can be incorporated into the crystalline phase of glass ceramics.

[0109] Alternatively or otherwise, the color of colored glass-based materials originates from one or more elements that form different nanophases within the glass and / or crystalline phase of the material. The coloring elements can be configured to produce a desired color when visible light is transmitted through the material (e.g., the nanophases may have suitable composition and size and be present in suitable amounts). For example, when the nanophases are in the form of nanoparticles, one or more of the size, shape, and concentration of the nanoparticles can affect the color of the capping member or other portions formed from the colored glass-based material. Suitable elements for forming different nanophases within the glass-based material include, but are not limited to, transition metals such as titanium, chromium, vanadium, manganese, iron, cobalt, nickel, copper, silver, gold, etc., or rare earth oxides such as lanthanides (e.g., cerium, praseodymium, neodymium). When the element is metallic, the nanophase may take the form of metallic nanoparticles. In some additional cases, one or more of these elements may combine with oxygen, nitrogen, or both to form compounds such as metal oxides or metal nitrides. As mentioned in this article, nanophases or nanoparticles may have sizes of less than 1 micrometer, such as 10 nm to less than 1 micrometer, 15 nm to 200 nm, 15 nm to 100 nm, 50 nm to 150 nm, or 100 nm to 200 nm.

[0110] In some embodiments, the glass-based material comprises multiple nanophases. For example, the glass-based material may include two or more nanophases that differ in composition, such as a first group of nanoparticles formed of a first metal and a second group of nanoparticles formed of a second metal different from the first metal. As another example, the glass-based material may include a first nanophase and a second nanophase that generally have the same composition but differ in one or more aspects of size, shape, or concentration. As a specific example, two different groups of nanoparticles formed of the same metal but with different shapes may produce different colors in an article formed of the glass-based material. These two different groups of nanoparticles may be located in different regions of the article formed of the glass-based material, in overlapping regions of the article, or in the same region of the article. In some cases, the first group of nanoparticles may have a generally spherical shape, and the second group of nanoparticles may have different shapes, such as elongated shapes.

[0111] In this embodiment, the nanoparticles are distributed substantially uniformly within the glass substrate. For example, the concentration of nanoparticles may be similar throughout the entire thickness of the article formed from the glass substrate. This concentration distribution may be achieved, at least in part, by using a heat treatment process that heats the entire article formed from the glass substrate for a sufficient time to allow for substantially uniform formation of the nanoparticles.

[0112] The composition of colored glass-based materials can affect not only the color of housing components but also other optical and / or electrical or magnetic and / or mechanical properties. In some cases, the properties of a glass-based material containing one or more "coloring" elements can be compared to those of a "base" glass-based material that is compositionally similar but does not contain coloring elements. For example, the inclusion of one or more coloring elements (e.g., transition metal elements contained in and / or forming metal nanoparticles within the glass phase) can modify the dielectric constant of the glass-based material compared to the "base" glass-based material. In some cases, the dielectric constant of the colored glass-based material is higher than that of the "base" glass-based material, making it possible to unduly increase the dielectric constant by adding more coloring elements to the base composition. The glass-based material composition used in the housing components described herein can provide a balance between desired color (e.g., chromaticity) and / or other optical properties and desired electrical and / or magnetic properties. In some cases, within the radio frequency band (e.g., from about 5 GHz to about 40 GHz or from 25 GHz to 39 GHz), the dielectric constant has values ​​of 3 to 7, 4 to 8, 4 to 6.5, 5 to 7, 5 to 6.5, or 6 to 7. In these cases, the C* chromaticity value may have a value greater than 1.75, greater than 2, or greater than 2.5.

[0113] In the implementation, the nanophase can improve the toughness of the colored glass matrix material compared to the "base" glass matrix material. In some cases, increased particle size and / or decreased spacing between particles can achieve enhanced toughness. However, when the nanophase contains metallic particles, increasing the concentration of nanoparticles can also increase the dielectric constant. Therefore, the glass matrix material composition that can be used for the housing components described herein can provide a balance between desired color (e.g., chromaticity) and / or other optical properties, desired electrical and / or magnetic properties, and desired mechanical properties.

[0114] Colored glass materials can be silicate glasses, such as aluminosilicate glasses or borosilicate glasses. As used herein, aluminosilicate glasses include the elements aluminum, silicon, and oxygen, but may also include other elements. Similarly, borosilicate glasses include the elements boron, aluminum, silicon, and oxygen, but may also include other elements. For example, aluminosilicate glasses or borosilicate glasses may also contain phosphorus and / or alkaline earth metals. As another example, aluminosilicate glasses or borosilicate glasses may also contain monovalent or divalent ions that compensate for the charge resulting from the substitution of silicon ions by aluminum ions. Suitable monovalent ions include, but are not limited to, alkali metal ions, such as Li. + Na + Or K + Suitable divalent ions include alkaline earth ions, such as those found in alkali-containing aluminosilicate glasses. 2+ or Mg 2+Such as in alkaline earth aluminosilicate glasses. In embodiments, the colored glass material is ion-exchangeable.

[0115] In another embodiment, the colored glass-based material may be a colored glass-ceramic material or a combination of colored glass and colored glass-ceramic materials. As mentioned herein, the glass-ceramic material includes one or more crystalline phases (e.g., crystals) formed by the crystallization of the (precursor) glass material. These crystalline phases may contribute to the advantageous mechanical properties of the glass-ceramic material. The glass-ceramic may also include an amorphous (glassy) phase, and crystals may be dispersed within the glassy phase. In some examples, the amount of crystalline phase by weight is greater than 10%, 20% to 90%, 30% to 90%, 40% to 90%, 50% to 90%, 60% to 90%, 70% to 90%, 20% to 40%, 20% to 60%, 20% to 80%, 30% to 60%, or 30% to 80% of the glass-ceramic material. In some cases, these values ​​may correspond to the average or local amount of crystalline phase in the glass-ceramic component. Residual glassy phase may form the remainder of the material.

[0116] By way of example, glass-ceramic materials can be basic silicates, alkaline earth silicates, aluminosilicates, boroaluminosilicates, perovskite glass-ceramics, silicate phosphates, iron silicates, fluorosilicates, phosphates, or glass-ceramic materials from another glass-ceramic composition system. In some embodiments, the glass-ceramic material includes aluminosilicate glass-ceramics or boroaluminosilicate glass-ceramics. Aluminosilicate glasses can form several types of crystalline phases, including β-quartz solid solution crystals, hydrothermal quartz solid solution crystals (β-spodumene solid solution crystals), penelandite crystals, lithium disilicate crystals, and various other silicates. Other silicates include, but are not limited to, silicates comprising aluminum and optionally other elements (such as lithium, sodium, potassium, etc.). Examples of such silicates include lithium orthoclase, lithium orthosilicate, (Li, Al, Na) orthosilicate (e.g., α or β lithium octanoate), and lithium metasilicate.

[0117] In addition to the primary elements of the glass-ceramic material (e.g., aluminum, silicon, and oxygen for aluminosilicates), glass-ceramic materials may also include other elements. For example, the glass-ceramic material (and precursor glass) may include elements from the nucleating agent of the glass-ceramic material, such as metal oxides (Ti, Zr) or other suitable oxide materials. Aluminosilicate and borosilicate glass-ceramics may also include elements similar to those described for aluminosilicate and borosilicate glasses (e.g., monovalent or divalent ions). Suitable monovalent ions include, but are not limited to, alkali metal ions, such as Li. + Na + Or K + Suitable divalent ions include alkaline earth ions, such as Ca2+. 2+ or Mg 2+Colored glass-ceramic materials can be ion-exchangeable. As previously mentioned, colored glass-ceramic materials typically also include one or more elements for imparting color.

[0118] In some cases, colored glass-based materials are chemically strengthened through ion exchange. For example, ion-exchangeable glass or glass-ceramic materials may include monovalent or divalent ions, such as alkali metal ions (e.g., Li₂). + Na + or K + ) or alkaline earth ions (e.g., Ca) 2+ or Mg 2+ The smaller ion in the glass or glass-ceramic material can exchange with other alkali metal ions or alkaline earth ions. If the glass or glass-ceramic material includes sodium ions, the sodium ions can exchange with potassium ions. Similarly, if the glass or glass-ceramic material includes lithium ions, the lithium ions can exchange with sodium ions and / or potassium ions. The exchange of smaller ions in the glass or glass-ceramic material for larger ions can form a compressive stress layer along the surface of the glass or glass-ceramic material. The formation of such a compressive stress layer can increase the hardness and impact resistance of the glass or glass-ceramic material. In some cases, chemically strengthened components formed from colored glass-based materials are configured to have a stable composition under typical operating conditions of electronic devices and under processing conditions experienced after chemical strengthening (e.g., during subsequent coating operations). For example, chemically strengthened components may include a compressive stress layer having a surface compressive stress of 400 MPa to 700 MPa or 500 MPa to 700 MPa and a total compressive depth of 75 micrometers to 150 micrometers or 100 micrometers to 175 micrometers. In some cases, the ion exchange region of the component is enriched with potassium near the surface and sodium at a greater depth, and the resulting compressive stress layer includes a region with higher compressive stress that may be relatively shallow near the surface (e.g., at a depth of about 3 micrometers to about 20 micrometers).

[0119] In some cases, housing components or other parts of electronic devices are formed from one of a set of colored glass-based material compositions. Each component in this composition can produce a different color for the housing component. This composition can be selected such that the housing component has another optical property (e.g., IR transmittance), electrical property (e.g., dielectric constant), or both, within a specified range. The uniformity of optical and / or electrical properties allows housing components of different colors to have similar performance when placed above internal components (such as components of wireless communication or charging systems, or IR sensors).

[0120] Figure 5The dielectric constant values ​​of a set of colored glass components suitable for use in housing components as described herein are schematically illustrated. Each glass component in this set produces housing components of different colors and dielectric constants falling within the range indicated by the horizontal dashed lines. The uniformity of the dielectric constant of housing components of different colors exhibits similar performance when placed above internal components such as components of a wireless communication system (e.g., radio frequency (RF) antenna assemblies). Relative to Figure 1A , Figure 1B and Figure 3 The descriptions of the wireless communication system components provided are generally applicable herein and will not be repeated here.

[0121] exist Figure 5 In the example, each glass component (1 to 4) in this group of glass compositions has been adjusted to produce different colors and dielectric constants ranging from 5 to 7. As previously discussed, these dielectric constant values ​​are applicable to a frequency range from approximately 5 GHz to approximately 40 GHz. In some cases, the dielectric constant values ​​may vary within this frequency range. Figure 5 In the example, solid data points indicate the median dielectric constant in the middle of the frequency range, and bars extending from the data points indicate the maximum and minimum dielectric constant values ​​in the frequency range. Figure 5 The ranges shown are exemplary and not limiting, and in other examples, the dielectric constant may be in the range of 3 to 7, 4 to 8, 4 to 6.5, 5 to 6.5, or 6 to 7, as relative to... Figure 2 and Figure 4 To be discussed in more detail.

[0122] Figure 6 A cross-sectional view of another exemplary cover member assembly for an electronic device is shown, the assembly having a varying thickness. Cover member assembly 604 includes a cover member 620 and a coating 660 along the rear surface of the cover member 634. Coating 660 may be similar to coating 260 in composition and optical properties, and for the sake of brevity, its description will not be repeated here.

[0123] exist Figure 6 In the example, at least a portion of the peripheral portion 694 of the cover member 620 is thinner than the central portion 692. For example... Figure 6 As shown, the peripheral portion 694 has a minimum thickness T3, and the central portion 692 has a thickness T4. When the cover member 620 is formed of a colored glass-based material, the peripheral portion 694 may have one or more optical properties, such as color, different from the central portion 692. In some cases, the curvature in the peripheral portion 694 of the front surface may also affect the color in these areas.

[0124] exist Figure 6In the example, the central portion 692 and the peripheral portion 694 are continuous. The central portion 692 includes a central outer surface 622a and a central inner surface 624a. Figure 6 In the example, the central outer surface 622a and the central inner surface 624a are generally planar in the central portion of the cover. The peripheral portion 694 includes a peripheral outer surface 622b, a side surface 626, and a peripheral inner surface 624b. The peripheral outer surface 622b includes a curve that curves generally toward the interior of the electronic device. In other words, the curve defined by the peripheral outer surface 622b is convex.

[0125] Figure 7 A cross-sectional view of another exemplary cover member assembly for an electronic device is shown, the assembly having a varying thickness. Cover member assembly 704 includes a cover member 700 and a coating 760 along the rear surface of the cover member 700. Coating 760 may be similar to coating 260 in composition and optical properties, and for the sake of brevity, this description will not be repeated here.

[0126] exist Figure 7 In the example, at least a portion of the peripheral portion 725 of the cover member 700 is thicker than the central portion 720. When the cover member 700 is formed of a colored glass-based material, the peripheral portion 725 may have one or more optical properties, such as color, that are different from those of the central portion 720. In some cases, the curvature in the peripheral portion 725 of the front surface may also affect the color in these areas.

[0127] The outer surface of the peripheral portion 725 includes a generally flat first peripheral outer surface 702b and a curved second peripheral outer surface 702c. As shown, the thickness of the peripheral portion 725 varies, but at least some sections of the peripheral portion are thicker than the thickness T5 of the central portion 720.

[0128] One measure of the thickness in the peripheral portion is the distance from the inner peripheral surface 704c to the first outer peripheral surface 702b along a perpendicular line from the inner peripheral surface 704c. Figure 7 The central marking is T6. The lateral thickness in the peripheral portion is measured as the distance between the inner transition surface 704b and the side surface 708 along a perpendicular line from the inner transition surface 704b. Figure 7 The middle part is marked as X6. Each of X6 and T6 can be greater than the thickness T5, such as... Figure 7 As shown. When a glass article has a generally flat external area (such as...) Figure 7 As shown), the axis aligned with the outer region of the general plane can be referred to as the horizontal axis. In this case, X6 can be referred to as the thickness in the horizontal direction, and T6 can be referred to as the thickness in the vertical direction. Figure 7 The distance X5 between the transition inner surfaces 704b is also shown.

[0129] The curve defined by the second peripheral outer surface 702c can span a substantial portion of the peripheral region thickness. For example, the horizontal distance spanned by the curve can be at least 30%, 40%, or 50% of the distance X6. Furthermore, the vertical distance spanned by the curve can be at least 20%, 30%, or 40% of the distance T6. Figure 7 As shown, the second peripheral outer surface 702c may be adjacent to the side surface 708. Alternatively, the second peripheral outer surface 702c may be adjacent to the peripheral inner surface 704c.

[0130] As shown in the figure, the peripheral portion 725 descends in a stepped manner (e.g., a thickness transition) to the central portion 720, wherein the thickness transition runs along the inner surface of the glass article. The inner surface of the article includes a central inner surface 704a in the central portion, a peripheral inner surface 704c in the peripheral portion, and a transition inner surface 704b at the thickness transition between the central portion and the peripheral portion. The central outer surface 702a is generally opposite to the central inner surface 704a.

[0131] Figure 8 A block diagram of an example electronic device incorporating components including a colored glass-based material is shown. Figure 8 The schematic diagram depicted in the diagram can correspond to the above. Figures 1A to 7 The components of the device depicted in the text. However, Figure 8 It can also be used more generally to refer to other types of electronic devices as described herein that have components including colored glass-based materials.

[0132] In an implementation, electronic device 800 may include sensor 820 to provide information about the configuration and / or orientation of the electronic device in order to control the output of the display. For example, when all or part of the visible area of ​​display 808 is blocked or substantially obscured, a portion of display 808 may be turned off, disabled, or placed in a low-power state. As another example, display 808 may be adapted to rotate the display of graphic output based on a change in the orientation of device 800 (e.g., 90 degrees or 180 degrees) in response to rotation of device 800.

[0133] Electronic device 800 also includes a processor 806 operatively connected to computer-readable storage 802. Processor 806 may be operatively connected to storage components of storage 802 via an electronic bus or bridge. Processor 806 may be implemented as one or more computer processors or microcontrollers configured to perform operations in response to computer-readable instructions. Processor 806 may include a central processing unit (CPU) of device 800. Additionally and / or alternatively, processor 806 may include other electronic circuitry located within device 800, including application-specific integrated circuits (ASICs) and other microcontroller devices. Processor 806 may be configured to perform the functions described in the above examples.

[0134] Memory 802 may include various types of non-transitory computer-readable storage media, including, for example, read-access memory (RAM), read-only memory (ROM), erasable programmable memory (e.g., EPROM and EEPROM), or flash memory. Memory 802 is configured to store computer-readable instructions, sensor values, and other persistent software elements.

[0135] Electronic device 800 may include control circuitry 810. Control circuitry 810 may be implemented in a single control unit and need not be implemented as a separate circuit element. As used herein, "control unit" will be used synonymously with "control circuitry". Control circuitry 810 may receive signals from processor 806 or from other elements of electronic device 800.

[0136] like Figure 8 As shown, electronic device 800 includes a battery 814 configured to provide power to components of electronic device 800. Battery 814 may include one or more power storage units linked together to provide an internal power supply. Battery 814 is operatively coupled to power management circuitry configured to provide appropriate voltage and power levels to various components or groups of components within electronic device 800. Battery 814 may be configured via the power management circuitry to receive power from an external power source, such as an AC power outlet. Battery 814 may store the received power, enabling electronic device 800 to operate for extended periods, ranging from several hours to several days, without connection to an external power source.

[0137] In some embodiments, electronic device 800 includes one or more input devices 818. Input device 818 is a device configured to receive input from a user or environment. For example, input device 818 may include, for example, a push-button, a touch-activated button, a capacitive touch sensor, a touchscreen (e.g., a touch-sensitive display or force-sensitive display), a capacitive touch button, a dial pad, a crown, etc. In some embodiments, input device 818 may provide dedicated or primary functions, including, for example, a power button, volume buttons, a home button, a scroll wheel, and a camera button.

[0138] Device 800 may also include one or more sensors or sensor modules 820, such as force sensors, capacitive sensors, accelerometers, barometers, gyroscopes, proximity sensors, light sensors, etc. In some cases, device 800 includes a sensor array (also referred to as a sensing array) comprising multiple sensors 820. For example, a sensor array associated with a protruding feature of the cover member may include an ambient light sensor, a lidar sensor, and a microphone. As previously mentioned relative to... Figure 1BAs discussed, one or more camera modules may also be associated with the protruding feature. Sensor 820 may be operatively coupled to processing circuitry. In some embodiments, sensor 820 may detect deformation and / or changes in configuration of the electronic device and is operatively coupled to processing circuitry that controls the display based on sensor signals. In some specific embodiments, the output from sensor 820 is used to reconfigure the display output to correspond to the orientation or folded / unfolded configuration or state of the device. Exemplary sensors 820 for this purpose include accelerometers, gyroscopes, magnetometers, and other similar types of positioning / orientation sensing devices. Furthermore, sensor 820 may include microphones, acoustic sensors, light sensors (including ambient light, infrared (IR) light, ultraviolet (UV) light), optical facial recognition sensors, depth measurement sensors (e.g., time-of-flight sensors), health monitoring sensors (e.g., electrocardiogram (ERG) sensors, heart rate sensors, photoplethysmography (PPG) sensors, pulse oximeters), biometric sensors (e.g., fingerprint sensors), or other types of sensing devices.

[0139] In some embodiments, electronic device 800 includes one or more output devices 804 configured to provide output to a user. Output device 804 may include a display 808 that presents visual information generated by processor 806. Output device 804 may also include one or more speakers to provide audio output. Output device 804 may also include one or more tactile devices configured to generate tactile or haptic outputs along an outer surface of device 800.

[0140] Display 808 may include a liquid crystal display (LCD), a light-emitting diode (LED) display, an LED-backlit LCD display, an organic light-emitting diode (OLED) display, an active-matrix organic light-emitting diode (AMOLED) display, an organic electroluminescent (EL) display, an electrophoretic ink display, etc. If display 808 is a liquid crystal display or an electrophoretic ink display, it may also include a backlight component controllable to provide a variable display brightness level. If display 808 is an organic light-emitting diode or organic electroluminescent display, the brightness of display 808 can be controlled by modifying the electrical signals provided to the display element. Furthermore, information regarding the configuration and / or orientation of the electronic device can be used to control the output of the display, as described with respect to input device 818. In some cases, the display is integrated with a touch sensor and / or force sensor to detect touch and / or force applied along the outer surface of device 800.

[0141] Electronic device 800 may also include a communication port 812 configured to transmit and / or receive signals or electrical communications from external or separate devices. Communication port 812 may be configured to couple to an external device via a cable, adapter, or other type of electrical connector. In some embodiments, communication port 812 may be used to couple electronic device 800 to a host computer.

[0142] The electronic device 800 may also include at least one accessory 816, such as a camera, a flash for the camera, or other such device. The camera may be part of a camera array or sensor array that can be connected to other parts of the electronic device 800, such as control circuitry 810.

[0143] As used herein, the terms “about,” “approximately,” “substantially,” “similar,” etc., are used to describe relatively small variations, such as + / -10%, + / -5%, + / -2%, or + / -1%. Furthermore, the term “about” may be used with respect to the endpoints of a range to indicate variations of + / -10%, + / -5%, + / -2%, or + / -1% in the endpoint values. Additionally, disclosing a range in which at least one endpoint is described as “about” a specific value includes disclosing a range in which the endpoint is equal to the specific value.

[0144] As used herein, the phrase "one or more of" or "at least one of" following a series of items separated by the terms "and" or "or" modifies the list as a whole, not each member of the list. The phrase "one or more of" or "at least one of" does not require selection of at least one of each of the listed items; rather, it allows for the inclusion of at least one of any item in the list and / or at least one of any combination of items and / or at least one of each item in the list. For example, the phrases "one or more of A, B, and C" or "one or more of A, B, or C" each refer to only A, only B, or only C; any combination of A, B, and C; and / or one or more of each of A, B, and C. Similarly, it is to be understood that the order of elements presented with respect to the combined or separate lists provided herein should not be construed as limiting this disclosure to the order provided.

[0145] The following discussion applies to the electronic devices described herein, and its scope extends to devices that can be used to acquire personally identifiable information data. It is well known that the use of personally identifiable information should comply with privacy policies and practices that are generally recognized as meeting or exceeding industry or governmental requirements for protecting user privacy. Specifically, personally identifiable information data should be managed and processed to minimize the risk of unintentional or unauthorized access or use, and the nature of authorized use should be clearly explained to the user.

[0146] For illustrative purposes, the foregoing description uses specific names to provide a thorough understanding of the described embodiments. However, it will be apparent to those skilled in the art that specific details are not required to practice the described embodiments. Therefore, the foregoing description of specific embodiments described herein is presented for purposes of illustration and description. They are not intended to be exhaustive or to limit the embodiments to the precise forms disclosed. It will be apparent to those skilled in the art that many modifications and variations are possible in light of the teachings above.

Claims

1. An electronic device, comprising: monitor; and Housing, the housing comprising: A housing component that defines a side surface of the electronic device; A front cover assembly, the front cover assembly being coupled to the housing component and including a front cover member positioned above the display; Rear cover assembly, the rear cover assembly being coupled to the housing component and comprising: A back cover component, the back cover component being formed of a glass material comprising metal nanoparticles configured to impart color to the glass material and the back cover component having a dielectric constant of 5 to 7 in a frequency band from 5 GHz to 40 GHz, the back cover component comprising: A first portion, the first portion defining a first thickness and a flat outer surface along a first direction and having a first color; and The second part, which defines a second thickness greater than the first thickness along the first direction and has a second color different from the first color, has an outer surface defined as a platform protruding in the first direction, the platform extending beyond the flat outer surface of the first part; and A coating is provided along the inner surface of the rear cover member.

2. The electronic device according to claim 1, wherein: The electronic device further includes a rear camera array, which includes a camera module array; The second portion of the rear cover member defines an array of through holes; and Each camera module of the camera module array extends into a corresponding through-hole of the through-hole array.

3. The electronic device of claim 1, wherein the electronic device further comprises an RF antenna assembly configured to operate in the frequency band.

4. The electronic device according to claim 1, wherein: The first part has an L* value of at least 90; and The L* difference between the first part and the second part is at least 10.

5. The electronic device of claim 1, wherein the chromaticity difference between the second portion and the first portion is at least 10.

6. The electronic device according to claim 5, wherein: The percentage difference between the second thickness and the first thickness ranges from 50% to 200%; and The chromaticity difference between the second part and the first part is 15 to 50.

7. An electronic device, comprising: Housing, the housing comprising: A housing component that defines a side surface of the electronic device; A front cover assembly, coupled to the housing component, defining the front surface of the electronic device, and including a front cover member; and A rear cover assembly, coupled to the housing component, defining a rear surface of the electronic device, and comprising: A rear cover component, the rear cover component being formed of a colored glass material and having a dielectric constant of 5 to 6.5 in the frequency band of 5 GHz to 40 GHz, the rear cover component comprising: The first part, the first part having: Average transmittance of visible light greater than 75%; A chromaticity value of at least 1.75; First thickness along the first direction; and Flat outer surface; and The second part has a second thickness along the first direction that is greater than the first thickness, and the outer surface of the second part defines a platform that protrudes in the first direction relative to the flat outer surface; An optical coating is provided along the inner surface of the rear cover member; The display is positioned below the front cover assembly; and A transceiver component of a wireless communication system, the transceiver component being positioned below the rear cover assembly.

8. The electronic device according to claim 7, wherein: The second portion of the rear cover member has: The average transmittance of visible light is less than the average transmittance of visible light in the first portion; and A chromaticity value that is greater than the chromaticity value of the first part.

9. The electronic device of claim 8, wherein the chromaticity value of the second portion of the rear cover member is at least 25.

10. The electronic device of claim 7, wherein at least a portion of the optical coating has an L* value of 90 or greater, an a* value of less than 0.5, and a b* value of less than 1.

11. The electronic device of claim 7, wherein the optical coating further comprises a multilayer interference stack, the multilayer interference stack comprising a plurality of dielectric layers configured to generate optical interference.

12. The electronic device of claim 7, wherein the transceiver component is a directional antenna configured to transmit wireless signals, and the frequency band of the directional antenna is between 25 GHz and 39 GHz.

13. The electronic device of claim 7, wherein the colored glass material comprises a transition metal element incorporated into the glass phase of the colored glass material.

14. An electronic device comprising: monitor; A rear-facing camera array, the rear-facing camera array comprising a camera module array; and Housing, the housing comprising: A housing component that defines a side surface of the electronic device; A first cover assembly defining a front surface of the electronic device, the first cover assembly including a first cover member positioned above the display; and A second cover assembly, the second cover assembly defining the rear surface of the electronic device and comprising: A second cover member, formed of colored glass, has a first portion having a first L* value and a first thickness in a first direction and defining a first flat outer surface, and a second portion having a second L* value less than the first L* value and a second thickness in the first direction greater than the first thickness and defining: A second flat outer surface, the second flat outer surface being offset relative to the first flat outer surface and parallel to the first flat outer surface; and Through-hole array, wherein each camera module in the camera module array extends into a corresponding through-hole in the through-hole array; and A coating is provided along the inner surface of the second cover member.

15. The electronic device of claim 14, wherein the second portion of the second cover member has a visible light transmittance of less than 75%.

16. The electronic device of claim 14, wherein the hue difference (ΔH*) between the first portion and the second portion is less than 15 degrees.

17. The electronic device according to claim 16, wherein: The first portion of the second cover member has a first hue; and The coating is configured such that a corresponding portion of the second cover assembly has a second hue that is different from the first hue.

18. The electronic device according to claim 14, wherein: The first thickness is greater than 0.3 mm and less than 0.75 mm; and The second thickness is greater than 1 mm and less than or equal to 2 mm.

19. The electronic device according to claim 14, wherein the colored glass is an ion-exchanged alkali-containing aluminosilicate glass.

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