Display backplane and electronic device

Abstract

The embodiment of the present application provides a display backboard and an electronic device, wherein the display backboard comprises: an identification area sensing module and a reference area sensing module, the identification area sensing module and the reference area sensing module are arranged in the same layer and have the same electrical characteristics, the identification area sensing module is used for outputting a sensing signal, and the reference area sensing module is used for outputting a reference signal; and a light shielding layer, the identification area sensing module and the reference area sensing module are located in the light shielding layer or a layer adjacent to the light shielding layer, the light shielding layer is made of a light shielding material and is used for making the reference area sensing module have no light response. According to the technical scheme of the embodiment of the present application, not only the signal-to-noise ratio of the output signal can be improved, and the fingerprint detection accuracy is improved, but also the uniformity of the sensing module in the display backboard is improved.

Description

Technical Field

[0001] This application relates to the field of display device technology, and more particularly to a display backplane and electronic device. Background Technology

[0002] In related technologies, when an optical fingerprint recognition module is incorporated into an OLED (Organic Light-Emitting Diode) screen, the sensor array includes not only the sensing pixel units in the fingerprint recognition area but also a reference area sensing pixel unit. This reference area sensing pixel unit is used to perform noise reduction processing on the signal output from the fingerprint recognition area sensing pixel unit based on the signal output from the reference area sensing pixel unit. However, this design suffers from poor uniformity between the reference area and the recognition area, thus affecting the display effect. Summary of the Invention

[0003] This application provides a display backplane and an electronic device to solve or alleviate one or more technical problems in the prior art.

[0004] In a first aspect, embodiments of this application provide a display back panel, comprising:

[0005] The system includes an identification area sensing module and a reference area sensing module, both located on the same layer and possessing identical electrical characteristics. The identification area sensing module outputs a sensing signal, while the reference area sensing module outputs a reference signal.

[0006] The light-shielding layer, the identification area sensing module, and the reference area sensing module are located in the light-shielding layer or in a layer adjacent to the light-shielding layer. The light-shielding layer is made of light-shielding material and is used to prevent the reference area sensing module from responding to light.

[0007] In one implementation, the identification area sensing module and the reference area sensing module are integrally formed or formed separately.

[0008] In one embodiment, the identification area sensing module and the reference area sensing module each include:

[0009] Multiple column read lines arranged side-by-side and spaced apart along a first direction;

[0010] Multiple row drive lines arranged side-by-side and spaced apart along a second direction; and,

[0011] Multiple sensing units are included, each comprising a photodiode and a TFT switch. The TFT switch is electrically connected to the column readout line and the row drive line, and is used to switch the on / off state of the photodiode.

[0012] In one embodiment, the photodiode includes an upper electrode, a PIN junction, and a lower electrode, wherein the upper electrode forms a bias terminal and the lower electrode forms a signal readout terminal; wherein the upper electrode is made of a transparent material.

[0013] In one embodiment, at least a portion of the identification area sensing module and the reference area sensing module are located in the planarization layer, and a pixel definition layer is provided on the side of the planarization layer facing away from the substrate. At least one of the planarization layer and the pixel definition layer is made of a light-shielding material to form a light-shielding layer.

[0014] In one embodiment, the display back panel further includes:

[0015] Substrate; and,

[0016] A passivation layer, an inorganic insulating layer, a planarization layer, and a pixel definition layer are sequentially stacked in the direction away from the substrate.

[0017] In this design, the upper electrode and PIN junction of the identification area sensing module and the reference area sensing module are located on the planarization layer, while the lower electrode is located on the inorganic insulating layer.

[0018] In one embodiment, the reference area sensing module further includes an anode metal layer electrically connected to the upper electrode, the anode metal layer being located in the pixel definition layer, and the orthogonal projection area of ​​the anode metal layer in the plane where the PIN junction is located covering the PIN junction.

[0019] In one embodiment, the pixel definition layer and the planarization layer are provided with light-transmitting holes, which are positioned directly opposite the recognition area sensing module.

[0020] In one embodiment, the display back panel further includes:

[0021] The noise reduction processing module is used to receive the sensing signal and the reference signal, and to perform noise reduction processing on the sensing signal according to a preset algorithm based on the reference signal, and output the identification signal.

[0022] Secondly, embodiments of this application also provide an electronic device, including a display back panel of any of the above embodiments of this application.

[0023] According to the technical solution of this application embodiment, by setting a reference area sensing module, the electrical characteristics of the reference area sensing module are the same as those of the recognition area sensing module. Furthermore, by setting a light-shielding layer to prevent light response in the reference area sensing module, on the one hand, the reference signal output by the reference area sensing module can be used as a base signal to denoise the sensing signal output by the recognition area sensing module, thereby improving the signal-to-noise ratio of the useful signal in the sensing signal and reducing noise. This helps to improve the sensing accuracy of the recognition area sensing module and enhance the recognition accuracy in fingerprint recognition scenarios. On the other hand, by setting a light-shielding layer with light-shielding properties, the light reflection performance of both the recognition area sensing module and the reference area sensing module can be reduced, improving the uniformity of the two modules and thus enhancing the display effect of the display back panel.

[0024] The above overview is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of this application will become readily apparent from the accompanying drawings and the following detailed description. Attached Figure Description

[0025] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the various drawings denote the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings depict only some embodiments disclosed in this application and should not be construed as limiting the scope of this application.

[0026] Figure 1 and Figure 2 A schematic diagram of the structure of a display backplate used for fingerprint recognition in related technologies is shown.

[0027] Figure 3 A schematic diagram of the structure of the display back panel according to an embodiment of this application is shown.

[0028] Figure 4 This diagram illustrates the arrangement of the identification area sensing module and the reference area sensing module according to an embodiment of this application.

[0029] Figure 5 This is a schematic diagram of the structure of the identification area sensing module according to an embodiment of this application.

[0030] Figure 6 This is a schematic diagram of the structure of the reference area sensing module according to an embodiment of this application.

[0031] Figure 7 A schematic diagram of the structure of a display back panel according to another embodiment of this application is shown.

[0032] Figure 8 A schematic diagram of the structure of a display back panel according to another embodiment of this application is shown.

[0033] Figure 9 A schematic diagram of the structure of a display back panel according to another embodiment of this application is shown.

[0034] Figure 10 A schematic diagram of the structure of a display back panel according to another embodiment of this application is shown. Detailed Implementation

[0035] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of this application. Therefore, the drawings and description are considered to be exemplary in nature and not restrictive.

[0036] In the description of this specification, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0037] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0038] In the embodiments of this application, the shape and size of each area in the accompanying drawings do not reflect the actual proportions of the display back panel structure, and are only used to illustrate the content of the embodiments of this application.

[0039] Figure 1 and Figure 2 The structure of a display backplate used for fingerprint recognition in related technologies is shown. For example... Figure 1 and Figure 2As shown, in addition to the sensing pixel unit 10' in the fingerprint recognition area, a sensing pixel unit 20' in the reference area is also added to the sensing array. The electrical characteristics of the sensing pixel unit 10' in the fingerprint recognition area and the sensing pixel unit 20' in the reference area are quite similar, making the common-mode noise of the reference signal collected by the sensing pixel unit 20' in the reference area similar to that of the sensing signal collected by the sensing pixel unit 10' in the fingerprint recognition area. Based on this, the reference signal collected by the sensing pixel unit 20' in the reference area can be used as the base signal. Through a noise reduction algorithm, the sensing signal collected by the pixel sensing unit in the fingerprint recognition area is processed using the base signal to reduce noise, thereby obtaining a high signal-to-noise ratio signal with common-mode noise removed.

[0040] To make the electrical common-mode noise of the reference signal collected by the sensing pixel unit 20' in the reference area more similar to that of the sensing signal collected by the sensing pixel unit 10' in the fingerprint recognition area, it is necessary to reduce the light response of the pixel sensing unit in the reference area. In some designs, a light-shielding metal layer is used to block the photodiode of the pixel sensing unit in the reference area to reduce the light response. However, this design is less effective because the light-shielding metal layer is prone to reflection, making the reference area visible. In other designs, the sensing pixel unit 20' in the reference area is integrated into the display area, which suffers from poor uniformity between the sensing pixel unit 20' in the reference area and the sensing pixel unit 10' in the fingerprint recognition area, thus affecting the display effect. In still other designs, the reference area is designed as a capacitor. However, the upper electrode of a capacitor is generally metal, which has high reflectivity, similarly resulting in poor uniformity between the sensing pixel unit 20' in the reference area and the sensing pixel unit 10' in the fingerprint recognition area, also affecting the display effect.

[0041] To address the problems existing in the aforementioned related technologies, embodiments of this application provide a display backplane and an electronic device. The display backplane of this application not only improves the signal-to-noise ratio of the sensing signal and enhances the accuracy of fingerprint detection, but also helps to improve the uniformity of the sensing module within the display backplane.

[0042] This application provides a display backplane that can be applied to any sensing and recognition scenario, such as fingerprint recognition. More specifically, the display backplane of this application can integrate a photodiode 41 into an OLED (Organic Light-Emitting Diode) screen to achieve optical fingerprint recognition within the OLED screen. The display backplane process of the OLED screen can employ LTPS (Low Temperature Polycrystalline Silicon) or LTPO (Low Temperature Polycrystalline Oxide) processes, or other processes. In the following description of this application, a scenario of fingerprint recognition within an OLED screen using a display backplane employing LTPS technology will be used as an example for detailed explanation.

[0043] Figure 3 A schematic diagram of the structure of a display back panel according to an embodiment of this application is shown. Figure 3 As shown, the display back panel of this embodiment includes an identification area sensing module 10, a reference area sensing module 20, and a light-shielding layer 30.

[0044] Specifically, the identification area sensing module 10 and the reference area sensing module 20 are arranged on the same layer and have the same electrical characteristics. The identification area sensing module 10 is used to output a sensing signal, and the reference area sensing module 20 is used to output a reference signal. The identification area sensing module 10 and the reference area sensing module 20 are located in the light-shielding layer 30 or in a layer adjacent to the light-shielding layer 30. The light-shielding layer 30 is made of light-shielding material and is used to prevent the reference area sensing module 20 from having a light response.

[0045] In this embodiment, the identification area sensing module 10 and the reference area sensing module 20 can adopt the same array design. Furthermore, the identification area sensing module 10 and the reference area sensing module 20 can be integrally formed, or they can be separately processed using the same technology and process.

[0046] For example, the identification area sensing module 10 and the reference area sensing module 20 are disposed in the same layer of the display back panel, for example, they can be disposed together in the planarization layer 53 of the display back panel. The identification area sensing module 10 and the reference area sensing module 20 can be arranged adjacently or spaced apart in the planarization layer 53, and this embodiment does not specifically limit this arrangement.

[0047] In one example, the identification area sensing module 10 and the reference area sensing module 20 may each include multiple sensing units arranged in an array. Preferably, the sensing unit includes a photodiode 41. More preferably, the sensing unit may include a PIN photodiode 41.

[0048] Understandably, the PIN photodiode 41 incorporates a layer of I-type semiconductor (i.e., the I layer, intrinsic semiconductor) with a very low concentration in the middle of the PN junction (between the P-type and N-type semiconductors). Since the I-type semiconductor is a high-resistivity region relative to the P- and N-regions, the internal electric field of the PN junction is essentially concentrated entirely within the I-type semiconductor. Therefore, the PIN photodiode 41 can increase the width of the depletion region, reduce the influence of diffusion, and improve the response speed.

[0049] It should be noted that since the identification area sensing module 10 and the reference area sensing module 20 adopt the same structure and array configuration, their electrical characteristics are identical, and their signal fluctuation patterns are consistent. Consequently, the sensing signal output by the identification area sensing module 10 and the reference signal output by the reference area sensing module 20 contain the same common-mode noise. Therefore, by using the reference signal output by the reference area sensing module 20 as the base signal to remove the common-mode noise in the sensing signal, noise reduction can be achieved. To ensure that the reference signal output by the reference area sensing module 20 contains only common-mode noise and no photoelectric signal, it is necessary to ensure that the reference area sensing module 20 does not exhibit a photoresponse.

[0050] Based on this, the present application embodiment provides a light-shielding layer 30 in the display back panel, and the light-shielding layer 30 is made of a light-shielding material, which can prevent light from entering the sensing unit of the reference area sensing module 20, thereby ensuring that the reference area sensing module 20 does not participate in the light reaction.

[0051] For example, the material of the light-shielding layer 30 can be a black organic material, such as chromium (Cr), chromium oxide (CrOx), black resin, or graphene.

[0052] In one example, the identification area sensing module 10 and the reference area sensing module 20 can be arranged in the same layer and jointly disposed in the light-shielding layer 30. The light-shielding layer 30 can be formed by a planarization layer 53 made of a light-shielding material.

[0053] In another example, the light-shielding layer 30 can be formed in a layer adjacent to the planarization layer 53 where the recognition area sensing module 10 and the reference area sensing module 20 are located. For example, the light-shielding layer 30 can be formed by a pixel definition layer 54 adjacent to the planarization layer 53. Specifically, to prevent light from entering the photodiode 41 from the side of the upper electrode of the sensing unit of the reference area sensing module 20, the light-shielding layer 30 can be located on the side of the upper electrode of the sensing unit of the reference area sensing module 20.

[0054] According to the display back panel of this application embodiment, a reference area sensing module 20 is provided, whose electrical characteristics are the same as those of the recognition area sensing module 10. Furthermore, a light-shielding layer 30 is provided to prevent the reference area sensing module 20 from responding to light. Therefore, on the one hand, the reference signal output by the reference area sensing module 20 can be used as a base signal to denoise the sensing signal output by the recognition area sensing module 10, thereby improving the signal-to-noise ratio of the useful signal in the sensing signal and reducing noise. This helps to improve the sensing accuracy of the recognition area sensing module 10 and enhance the recognition accuracy in fingerprint recognition scenarios. On the other hand, by providing the light-shielding layer 30, the light reflection performance of the recognition area sensing module 10 and the reference area sensing module 20 can be reduced, improving the uniformity of the two modules and thus enhancing the display effect of the display back panel.

[0055] In one embodiment, the identification area sensing module 10 and the reference area sensing module 20 are integrally formed or separately formed.

[0056] Preferably, such as Figure 4 As shown, the identification area sensing module 10 and the reference area sensing module 20 are integrally formed. Specifically, the identification area sensing module 10 and the reference area sensing module 20 are adjacent to each other, and there are two reference area sensing modules 20, which are located on opposite sides of the identification area sensing module 10.

[0057] In addition, in other examples of this application, the identification area sensing module 10 and the reference area sensing module 20 can also be manufactured separately using the same process and technology.

[0058] The above-described embodiments can reduce the processing difficulty of the identification area sensing module 10 and the reference area sensing module 20, improve processing efficiency, and reduce processing costs.

[0059] In one implementation, such as Figure 5 and Figure 6 As shown, the identification area sensing module 10 and the reference area sensing module 20 each include multiple column read lines, multiple row drive lines, and multiple sensing units.

[0060] Specifically, multiple column readout lines are arranged side-by-side and spaced apart along a first direction, and multiple row drive lines are arranged side-by-side and spaced apart along a second direction. The sensing unit includes a photodiode 41 and a TFT (Thin Film Transistor) switch. The TFT switch 42 is electrically connected to the column readout lines and the row drive lines, and is used to switch the on / off state of the photodiode 41.

[0061] For example, such as Figure 5As shown, in the identification area sensing module 10, there are four row driving lines, designated Gate1, Gate2, Gate3, and Gate4, extending along the row direction and spaced apart side-by-side in the column direction (first direction). There are n column read lines, designated R1, R2, ..., Rn, extending along the column direction and spaced apart side-by-side along the row direction (second direction). Each row driving line and each column read line corresponds to a sensing unit, and the sensing unit is electrically connected to the row driving lines and column read lines via a TFT switch 42.

[0062] For example, such as Figure 6 As shown, in the reference area sensing module 20, there are four row driving lines, designated Gate1, Gate2, Gate3, and Gate4, extending along the row direction and spaced apart side-by-side in the column direction (first direction). There are n column read lines, designated N1, N2, ..., Nn, extending along the column direction and spaced apart side-by-side along the row direction (second direction). Each row driving line and each column read line corresponds to a sensing unit, and the sensing unit is electrically connected to the row driving lines and column read lines via a TFT switch 42.

[0063] In one embodiment, the photodiode 41 includes an upper electrode, a PIN junction, and a lower electrode, with the upper electrode forming a bias terminal and the lower electrode forming a signal readout terminal. The upper electrode is made of a transparent material.

[0064] Understandably, the bias terminal formed by the upper electrode is used to receive the bias signal, and the signal reading terminal formed by the lower electrode is connected to the TFT switch 42 to read the switching signal of the TFT switch 42.

[0065] For example, the upper electrode can be made of transparent indium tin oxide (ITO) material. This configuration helps to improve the light transmittance of the photodiode 41 of the identification area sensing module 10 and enhances its sensitivity to light intensity.

[0066] In one embodiment, at least a portion of the identification area sensing module 10 and the reference area sensing module 20 are located in the planarization layer 53, and a pixel definition layer 54 is provided on the side of the planarization layer 53 facing away from the substrate. At least one of the planarization layer 53 and the pixel definition layer 54 is made of a light-shielding material to form a light-shielding layer 30.

[0067] Optionally, such as Figure 3 , Figure 7 and Figure 8As shown, the display backplane also includes a substrate 50 and a passivation layer 51, an inorganic insulating layer 52, a planarization layer 53, and a pixel definition layer 54, which are sequentially stacked in a direction away from the substrate 50. The upper electrode and PIN junction of the identification area sensing module 10 and the reference area sensing module 20 are located in the planarization layer 53, and the lower electrode is located in the inorganic insulating layer 52.

[0068] For example, the identification area sensing module 10 and the reference area sensing module 20 are disposed on the side of the passivation layer 51 facing away from the substrate 50, and the inorganic insulating layer 52 is disposed on the side of the passivation layer 51 facing away from the substrate 50 and covers the identification area sensing module and the reference area sensing module 20. The planarization layer 53 is disposed on the side of the inorganic insulating layer 52 facing away from the substrate 50, and the pixel definition layer 54 is disposed on the side of the inorganic insulating layer 52 facing away from the substrate 50. To ensure the planarity of the planarization layer 53, the material of the planarization layer 53 can be silicate glass (SOG).

[0069] In a specific example, such as Figure 3 As shown, the light-shielding layer 30 is formed on the planarization layer 53, and the material of the light-shielding layer 30 is a black organic material. Thus, the light-shielding layer 30 formed by the planarization layer 53 can block ambient light as well as light generated by the display back panel itself and entering the reference area sensing module 20.

[0070] In another specific example, such as Figure 7 As shown, the light-shielding layer 30 is formed on the pixel definition layer 54, and the material of the light-shielding layer 30 is a black organic material. This setting can also achieve the effect of light-shielding the reference area sensing module 20, ensuring that the reference area sensing module 20 has no light response.

[0071] In another specific example, such as Figure 8 As shown, the light-shielding layer 30 is formed by the planarization layer 53 and the pixel definition layer 54, and the light-shielding layer 30 is made of black organic material. This configuration can minimize the amount of light entering the reference area sensing module 20, thereby significantly improving the noise reduction effect on the sensing signal output by the recognition area sensing module 10.

[0072] In one implementation, such as Figure 3 , Figure 7 and Figure 8 As shown, the display back panel also includes a COE (Color filter On Encapsulation) structure, wherein the black matrix film layer 55 of the COE structure covers the reference area module setting in the orthogonal projection area on the plane where the reference area sensing module 20 is located.

[0073] Understandably, the COE structure, also known as the Pol-less structure, can reduce ambient light reflection. After the display backplane is encapsulated with thin film, the Color Filter process is then performed to deposit R, G, and B color filters on the R, G, and B pixels, with these color filters spaced apart by black matrix layers 55.

[0074] According to the above implementation, by setting the black matrix film layer 55 of the COE structure directly opposite the reference area sensing module 20, the reference area sensing module 20 can be shielded to a certain extent, thereby further ensuring that the reference area sensing module 20 has no light response.

[0075] In one implementation, such as Figure 9 and Figure 10 As shown, the reference area sensing module 20 also includes an anode metal layer 43 electrically connected to the upper electrode. The anode metal layer 43 is located in the pixel definition layer 54, and the orthogonal projection area of ​​the anode metal layer 43 in the plane where the PIN junction is located covers the PIN junction.

[0076] It is understood that the anode metal layer 43, also known as the stable anode, is a coating of platinum group metal (e.g., ruthenium) oxide and valve metal (e.g., titanium) oxide mixed crystal structure deposited on a titanium matrix using a thermal decomposition method. The anode metal layer 43 has certain light-shielding properties. By aligning the anode metal layer 43 with the PIN junction of the reference area sensing module 20, a certain light-shielding effect can be achieved on the reference area sensing module 20, thereby further ensuring that the reference area sensing module 20 has no light response.

[0077] In a specific example, such as Figure 9 As shown, the planarization layer 53 and the inorganic insulating layer 52 share a first via, which penetrates both the planarization layer 53 and the inorganic insulating layer 52. The anode metal layer 43 located in the pixel definition layer 54 is electrically connected to the upper electrode of the photodiode 41 through the first via. The orthographic projection area of ​​the anode metal layer 43 on the plane of the PIN junction is directly opposite to the planar area of ​​the PIN junction, and the area of ​​the orthographic projection area of ​​the anode metal layer 43 is larger than the planar area of ​​the PIN junction, so that the orthographic projection area of ​​the anode metal layer 43 can cover the PIN junction, thereby providing light shielding for the reference area sensing module 20. Furthermore, the black matrix film layer 55 of the COE structure is directly opposite to the reference area sensing module 20, also providing some light shielding for the reference area sensing module 20.

[0078] In another specific example, such as Figure 10 As shown, based on the aforementioned example, the planarization layer 53 and the pixel definition layer 54 together form the light-shielding layer 30 to further enhance the light-shielding effect on the reference area sensing module 20.

[0079] In one embodiment, the pixel definition layer 54 and the planarization layer 53 are provided with light-transmitting holes, which are positioned directly opposite the recognition area sensing module 10.

[0080] For example, the light-transmitting hole can be filled with a transparent material to allow ambient light and light generated by the display back panel itself to enter the recognition area sensing module 10.

[0081] In one embodiment, the display back panel further includes a noise reduction processing module for receiving sensing signals and reference signals, and performing noise reduction processing on the sensing signals based on the reference signals according to a preset algorithm, and outputting an identification signal.

[0082] For example, the identification area sensing module 10 and the reference area sensing module 20 output a sensing signal and a reference signal, respectively, and the two signals are differential signals. Since differential signals are a pair of symmetrical signals of equal magnitude but opposite polarity, they are used to transmit useful signals. It is understood that differential signals can be used to identify small signals, and differential signals are highly immune to external electromagnetic interference. When using a pair of differential signals for signal transmission, the common-mode noise in the two signals is eliminated when the differential signals are finally synthesized into a single-ended signal, while the useful signal carried by the differential mode is retained, thereby achieving the purpose of reducing interference and improving the signal-to-noise ratio.

[0083] This application also provides an electronic device that includes the display backplane described in the above embodiments. The electronic device can be any suitable product or component such as a tablet computer, laptop computer, camera, or navigator. In a specific application example, the electronic device may include an OLED display screen, and the OLED uses the display backplane of any of the above embodiments of this application. The technical effects of this electronic device can be found in the technical effects of the display backplane described in the above embodiments, and will not be repeated here.

[0084] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0085] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0086] The foregoing disclosure provides many different implementations or examples for carrying out different structures of this application. To simplify the disclosure, specific examples of components and arrangements are described above. Of course, these are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various implementations and / or arrangements discussed.

[0087] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various variations or substitutions within the technical scope disclosed in this application, and these should all be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A display backplane, characterized by, The display backplane comprises: a recognition area sensing module and a reference area sensing module, the recognition area sensing module and the reference area sensing module are arranged in the same layer and have the same electrical characteristics, the recognition area sensing module is configured to output a sensing signal, and the reference area sensing module is configured to output a reference signal; and a light shielding layer, the recognition area sensing module and the reference area sensing module are arranged in the light shielding layer or a layer adjacent to the light shielding layer, the light shielding layer is made of a light shielding material, and the light shielding layer is configured to make the reference area sensing module have no light response. At least part of the recognition area sensing module and the reference area sensing module are arranged in a planarization layer, a pixel definition layer is arranged on a side of the planarization layer away from a substrate, and at least one of the planarization layer and the pixel definition layer is made of a light shielding material to form the light shielding layer.

2. The display backplane of claim 1, wherein, The recognition area sensing module and the reference area sensing module are integrally formed or separately formed.

3. The display backplane of claim 1, wherein, The recognition area sensing module and the reference area sensing module each comprise: a plurality of column read lines arranged side by side and spaced apart in a first direction; a plurality of row drive lines arranged side by side and spaced apart in a second direction; and a plurality of sensing units, each of the sensing units comprising a photodiode and a TFT switch, the TFT switch being electrically connected to the column read line and the row drive line, and the TFT switch being configured to switch on and off the photodiode.

4. The display backplane of claim 3, wherein, The photodiode comprises an upper electrode, a PIN junction, and a lower electrode, the upper electrode forms a bias terminal, and the lower electrode forms a signal reading terminal; and the upper electrode is made of a transparent material.

5. The display backplane of claim 1, wherein, The display backplane further comprises: a substrate; and a passivation layer, an inorganic insulating layer, the planarization layer, and the pixel definition layer are sequentially arranged in a direction away from the substrate; wherein the upper electrode and the PIN junction of the recognition area sensing module and the reference area sensing module are arranged in the planarization layer, and the lower electrode is arranged in the inorganic insulating layer.

6. The display backplane of claim 5, wherein, The reference area sensing module further comprises an anode metal layer electrically connected to the upper electrode, the anode metal layer is arranged in the pixel definition layer, and a projection area of the anode metal layer in a plane in which the PIN junction is arranged covers the PIN junction.

7. The display backplane of claim 5, wherein, The pixel definition layer and the planarization layer are provided with a light transmission hole, and the light transmission hole is arranged opposite to the recognition area sensing module.

8. The display backplane of any of claims 1 to 4, wherein, The display backplane further comprises: a noise reduction processing module configured to receive the sensing signal and the reference signal, perform noise reduction processing on the sensing signal based on the reference signal according to a preset algorithm, and output an identification signal.

9. An electronic device, comprising: The display backplate comprises any one of claims 1 to 8.

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