Direct current converter and method of manufacturing the same

Abstract

According to an aspect of the present application, there is provided a DC converter including a main housing forming an accommodation space inside, a cooling module coupled to the main housing to divide the accommodation space into a plurality of spaces and to discharge heat generated in the accommodation space to the outside, an inductor module accommodated in any one of the spaces divided into the plurality of spaces and located adjacent to the cooling module, and a capacitor module accommodated in another one of the spaces divided into the plurality of spaces and located adjacent to the cooling module.

Description

Technical Field

[0001] This invention relates to a DC-DC converter and a method for manufacturing the same, and more specifically, to a DC-DC converter and a method for manufacturing the same that can output DC power after receiving a DC power supply and adjusting the voltage, while also achieving miniaturization and improved cooling efficiency. Background Technology

[0002] A DC-DC converter is a device that receives a DC power supply, adjusts the voltage, and then outputs the converter. Recently, due to issues such as power consumption, the technical requirements for devices using DC power supplies are increasing, leading to active research into DC-DC converters.

[0003] Devices equipped with DC-DC converters include, for example, environmentally friendly vehicles such as EVs (electric vehicles), FCEVs (fuel cell electric vehicles), and BEVs (battery electric vehicles). Due to the depletion of fossil fuels and stricter emission controls on carbon and nitrogen oxides produced by fuel combustion, there is increasing attention focused on these environmentally friendly vehicles.

[0004] Currently, DC-DC converters in use typically include devices for energy storage and devices for performing switching. Energy storage devices include capacitors and inductors, while switching devices include semiconductor devices such as SiC (silicon carbide).

[0005] However, the capacitors and inductors used for energy storage generate a significant amount of heat during the operation of the DC-DC converter. Failure to properly dissipate this heat can not only degrade the performance of the DC-DC converter but also damage other components that make up the converter.

[0006] Therefore, a heat transfer fluid can be considered as a solution for quickly and efficiently dissipating the heat generated in the components of a DC converter, such as capacitors and inductors.

[0007] The heat transfer fluid flows into the interior of the DC-DC converter, absorbs the generated heat, and then is discharged again. This method can dissipate the heat inside the DC-DC converter.

[0008] If the heat transfer fluid were to flow arbitrarily within the internal space of the DC-DC converter, operational reliability would be reduced. Therefore, the heat transfer fluid typically flows through a separate channel within the DC-DC converter. To effectively perform this heat dissipation process, capacitors and inductors should be located near the flow path of the heat transfer fluid.

[0009] On the other hand, as mentioned above, miniaturization is required for DC inverters to be installed in environmentally friendly vehicles and other applications. Therefore, the components of DC inverters are typically densely packed without any blind spots.

[0010] However, for effective heat dissipation, all components are positioned near the flow path of the supplied heat transfer fluid. Consequently, existing DC inverters must have a cross-sectional area greater than the sum of the cross-sectional areas of the components, thus limiting the miniaturization of DC inverters.

[0011] Korean Patent No. 10-1204139 discloses a semiconductor device for a DC / DC converter. Specifically, it discloses a semiconductor device for a DC / DC converter whose heat dissipation can be improved by adding heat dissipation fins to the semiconductor device.

[0012] However, this type of semiconductor device can only achieve heat dissipation among the elements constituting a DC / DC converter. That is, the existing literature does not propose a solution for improving the heat dissipation of the DC / DC converter itself, which incorporates semiconductor devices.

[0013] Furthermore, the solutions proposed in the existing literature, namely heat sinks, inevitably lead to an increase in the size of the semiconductor device and the DC-DC converter including the semiconductor device. Therefore, there are limitations in miniaturization, a related issue of DC-DC converters.

[0014] Korean Patent Publication No. 10-2002-0072029 discloses a heat dissipation device for a DC / DC converter. Specifically, it is a heat dissipation device for a DC / DC converter that utilizes an insulating pad and a heat sink mounted on a printed circuit board formed inside an ADSL system to cool the heat generated inside the DC / DC converter.

[0015] However, the heat dissipation device for this type of DC / DC converter must have a separate insulating pad and heat sink. Therefore, there has always been a limitation in miniaturization, a challenge associated with DC / DC converters.

[0016] Korean Patent No. 10-1204139 (November 22, 2012)

[0017] Korean Patent Publication No. 10-2002-0072029 (September 14, 2002) Summary of the Invention

[0018] (a) Technical problems to be solved

[0019] The purpose of this invention is to provide a DC-DC converter and its manufacturing method that can solve the above-mentioned problems.

[0020] Firstly, one object of the present invention is to provide a DC-DC converter that can achieve miniaturization and a method for manufacturing the same.

[0021] In addition, an object of the present invention is to provide a DC-DC converter that can improve the cooling efficiency of components and a method for manufacturing the same.

[0022] In addition, an object of the present invention is to provide a DC-DC converter and a method thereof that can simplify the manufacturing process.

[0023] In addition, an object of the present invention is to provide a DC-DC converter and a method for manufacturing the same, which can improve design freedom.

[0024] (II) Technical Solution

[0025] To achieve the above objectives, the present invention provides a DC-DC converter, comprising: a main housing forming an internal accommodating space; a cooling module, combined with the main housing, dividing the accommodating space into multiple spaces and discharging heat generated in the accommodating space to the outside; an inductor module, housed in any one of the multiple spaces and located adjacent to the cooling module; and a capacitor module, housed in another of the multiple spaces and located adjacent to the cooling module.

[0026] Additionally, the DC-DC converter provided by the present invention includes a cooling module comprising: a cooling plate having a predetermined thickness in the height direction of the main housing and having a cross-section corresponding to the cross-section of the accommodating space to absorb heat generated in the inductor module or the capacitor module; and a flow path formed recessed inside the cooling plate and extending between at least two mutually different corners of the corners of the cooling plate to flow a fluid that absorbs the heat.

[0027] In addition, the DC converter provided by the present invention is such that the cooling plate is spaced apart from one end and the other end in the height direction of the main housing, and either the inductor module or the capacitor module is arranged in the space formed between the cooling plate and the one end, and the other inductor module or the capacitor module is arranged in the space formed between the cooling plate and the other end.

[0028] In addition, the DC converter provided by the present invention includes a cooling module comprising a connecting portion that extends through and is connected to the main housing and is connected to the end of the flow path portion and an external fluid supply source, respectively.

[0029] In addition, the DC converter provided by the present invention has a fluid flowing in the flow path section, and the fluid absorbs the heat generated by the inductor module or the capacitor module.

[0030] Furthermore, the DC-DC converter provided by the present invention includes a semiconductor module housed in any one of the spaces divided into a plurality of spaces, and located adjacent to the capacitor module and the cooling module, respectively. The capacitor module is located on one side biased towards the arbitrary space, and the semiconductor module is located on the other side biased towards the arbitrary space.

[0031] In addition, the present invention can provide a method for manufacturing a DC-DC converter, comprising: (a) forming a plurality of spaces inside a main housing; (b) accommodating a component in one side space inside the main housing; and (c) accommodating a component in the other side space of the main housing.

[0032] In addition, the manufacturing method of the DC converter provided by the present invention includes step (a1), wherein step (a1) is to accommodate a cooling plate in the accommodating space of the housing body to divide the accommodating space into an upper space and a lower space.

[0033] In addition, the method for manufacturing a DC-DC converter provided by the present invention includes step (b) comprising: step (b1), inductor module covering and accommodating a cooling plate inside the main housing while also accommodating the side space; and step (b2), housing cover covering the inductor module and the side space while being coupled to the housing body to seal the side space.

[0034] In addition, the manufacturing method of the DC converter provided by the present invention includes step (c1), wherein step (c1) involves the capacitor module covering the cooling plate housed inside the main housing while also being housed in the space on the other side.

[0035] In addition, the manufacturing method of the DC-DC converter provided by the present invention includes the following steps: (c2) a semiconductor module covering the cooling plate housed inside the main housing and simultaneously housed in the space on the other side; (c3) a shielding module covering the semiconductor module and simultaneously housed in the space on the other side; (c4) a PCB unit covering the shielding module and simultaneously housed in the space on the other side; and (c5) a housing cover covering the capacitor module, the semiconductor module, the shielding module, and the PCB unit and simultaneously attached to the housing body to seal the space on the other side.

[0036] (III) Beneficial Effects

[0037] According to embodiments of the present invention, the following effects can be achieved:

[0038] First, the internal space of the main casing housing the DC inverter is divided into multiple spaces. Relatively large inductor modules and capacitor modules are formed within these components and housed in distinct spaces within the designated areas.

[0039] Therefore, it is not necessary to increase the overall size of the DC-DC converter in order to accommodate the inductor and capacitor modules in a single space. Consequently, the size of the DC-DC inverter can be reduced.

[0040] Additionally, the internal space of the DC-DC converter is divided by a cooling plate. A flow path is formed in the cooling plate to allow the flow of fluid used for heat exchange. The flow path communicates with the outside of the main housing, receiving fluid between heat exchange points and discharging the heat-exchanged fluid.

[0041] In one embodiment, a portion of the components of the DC-DC converter, namely an inductor module or a capacitor module, may be located adjacent to a cooling plate. Heat generated during the operation of the inductor module or capacitor module is transferred to the cooling plate and the fluid flowing on it, thereby cooling the inductor module or capacitor module.

[0042] Furthermore, the inductor module and the capacitor module are arranged facing each other across a cooling plate. That is, the inductor module and the capacitor module are housed in different spaces to physically separate them.

[0043] Therefore, it can not only effectively dissipate the heat generated in the inductor module and the capacitor module, but also ensure that heat generated in one of the inductor module and the capacitor module will not affect the other.

[0044] As a result, the heat generated during the operation of the DC inverter can be effectively dissipated, thus improving the cooling efficiency of each component of the DC inverter.

[0045] Furthermore, the inductor module is housed and fixed in one of the spaces defined by the cooling plate. The capacitor module is housed and fixed in the other space defined by the cooling plate. That is, the inductor module and the capacitor module can be housed in the housing space through separate openings.

[0046] Therefore, a design that does not require accommodating inductor and capacitor modules through identical openings can be eliminated. This simplifies the manufacturing process of the DC-DC converter.

[0047] In addition, relatively large-volume inductor and capacitor modules are housed in physically separated spaces within the components.

[0048] Therefore, it eliminates the need for a complex layout that accommodates all inductor and capacitor modules within a single space. As a result, the design freedom of the DC-DC converter is increased. Attached Figure Description

[0049] Figure 1 This is a perspective view illustrating a DC-DC converter according to an embodiment of the present invention.

[0050] Figure 2 It is shown Figure 1 An exploded perspective view of the components of a DC-DC converter.

[0051] Figure 3 and Figure 4 It is shown in Figure 1 An exploded perspective view of the assembly process of the main housing and cooling module of the DC-DC converter.

[0052] Figure 5 It is shown in Figure 1 An exploded perspective view of the assembly process of the main housing and inductor module of the DC-DC converter configuration.

[0053] Figure 6 It is shown in Figure 1 An exploded perspective view of the assembly process of the main housing and capacitor module of the DC-DC converter configuration.

[0054] Figure 7 It is shown in Figure 1 An exploded perspective view of the assembly process of the main housing and semiconductor modules of the DC-DC converter.

[0055] Figure 8 It is shown in Figure 1 An exploded perspective view of the assembly process of the main housing and shielding module of the DC-DC converter.

[0056] Figure 9 and Figure 10 It is shown in Figure 1 An exploded perspective view of the assembly process of the main housing and power-on module of the DC-DC converter.

[0057] Figure 11 and Figure 12 It is shown in Figure 1 An exploded perspective view of the process of assembling the main body of the DC-DC converter housing with the housing cover.

[0058] Figure 13 This is a flowchart illustrating a method for manufacturing a DC-DC converter according to an embodiment of the present invention.

[0059] Figure 14 It is shown in Figure 13 The flowchart shows the specific process of step S100 in the manufacturing method of a DC-DC converter.

[0060] Figure 15 It is shown in Figure 13The flowchart shows the specific process of step S200 in the manufacturing method of a DC-DC converter. Detailed Implementation

[0061] Hereinafter, the DC converter and its manufacturing method according to embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0062] To clarify the features of the present invention, some descriptions of components may be omitted in the following description.

[0063] 1. Definition of terms

[0064] As used in the following description, “connection” means that one or more components are fluidly connected to each other. In one embodiment, the connection between one or more components can be achieved through components such as pipes or tubes.

[0065] As used in the following description, "energized" means that one or more components are connected to each other in a manner that allows the transmission of current or electrical signals. In one embodiment, the energized state can be achieved via a wired connection using wire components or a wireless connection using Bluetooth, RFID, Wi-Fi, or a similar method.

[0066] For the terms “upper side,” “lower side,” “front side,” “rear side,” “left side,” and “right side” used in the following description, please refer to the references in [the original text]. Figures 1 to 7 and Figure 9 The coordinates shown are for illustrative purposes.

[0067] 2. Explain the structure of the DC-DC converter 10 according to an embodiment of the present invention.

[0068] The DC-DC converter 10 of the present invention can divide the internal space of the main housing 100 used to house components into multiple spaces. At this time, the components that divide the internal space of the main housing 100 can be configured to directly and indirectly contact other components housed in the internal space for heat exchange.

[0069] Therefore, multiple components disposed in the DC-DC converter 10 can be cooled by direct contact with the heat exchange components through multiple surfaces, rather than contact with a single surface. Accordingly, even if some of the components disposed in the DC-DC converter 10 are stacked on top of each other, the generated heat can be effectively dissipated.

[0070] The following is for reference Figures 1 to 2 The structure of the DC converter 10 according to an embodiment of the present invention will be described.

[0071] In the illustrated embodiment, the DC-DC converter 10 includes: a main housing 100, a cooling module 200, an inductor module 300, a capacitor module 400, a semiconductor module 500, a shielding module 600, and a power supply module 700.

[0072] The main housing 100 forms the body of the DC-DC converter 10. A space is formed inside the main housing 100 for mounting the components of the DC-DC converter 10. Each component of the DC-DC converter 10 is housed within the space of the main housing 100, preventing the components from being arbitrarily exposed to the outside.

[0073] In the illustrated embodiment, the main housing 100 includes: housing body 110, housing cover 120, receiving space 130, and support 140.

[0074] The outer casing 110 forms the main body of the main casing 100. In addition, various components constituting the DC-DC converter 10 can be mounted inside the outer casing 110.

[0075] Furthermore, the space for accommodating the member is formed inside the outer shell body 110, and can be configured into any shape that can enclose the space. In the illustrated embodiment, the outer shell body 110 has a cross-section of a right-angled quadrilateral with a length in the left-right direction greater than its length in the front-back direction, and is formed into a quadrilateral prism shape with a height in the vertical direction.

[0076] The outer casing 110 surrounds a portion of the receiving space 130. In the illustrated embodiment, the outer casing 110 is formed to surround the front side, rear side, left side, and right side of the receiving space 130.

[0077] That is, in another part of the receiving space 130, in the illustrated embodiment, openings are formed on the upper and lower sides, through which components of the DC-DC converter 10 can enter the receiving space 130.

[0078] In the illustrated embodiment, the openings of the outer casing 110, both the upper and lower openings, are closed by the outer casing cover 120.

[0079] The outer cover 120 is coupled to the outer cover body 110 to prevent components housed in the receiving space 130 from being arbitrarily exposed to the outside. In one embodiment, the outer cover 120 may be fixedly coupled to the outer cover body 110. The coupling may be achieved by threaded components or the like.

[0080] The outer cover 120 may be formed in a shape corresponding to the cross-section of the outer cover body 110. In the illustrated embodiment, the outer cover body 110 is formed as a right-angled quadrilateral with a front-to-back extension length less than its left-to-right extension length, and the outer cover 120 may also be formed as a right-angled quadrilateral with a front-to-back extension length less than its left-to-right extension length.

[0081] Multiple housing covers 120 can be configured. The multiple housing covers 120 can be configured to close the opening of the housing body 110 at different locations. In the illustrated embodiment, the housing cover 120 includes an upper cover 121 covering the upper opening of the housing body 110, and a lower cover 122 covering the lower opening of the housing body 110.

[0082] As described below, the receiving space 130 formed inside the outer casing 110 can be divided into an upper space 131 and a lower space 132. Accordingly, the outer casing cover 120 can cover the receiving space 130, the upper cover 121 can cover the upper space 131, and the lower cover 122 can cover the lower space 132.

[0083] The accommodating space 130 is a space formed inside the outer shell body 110. The accommodating space 130 is surrounded by the outer shell body 110 and the outer shell cover 120, which can prevent the accommodating space 130 from communicating with the outside in any way.

[0084] In the illustrated embodiment, the horizontal direction of the receiving space 130, namely the front, rear, left, and right sides, is surrounded by the outer shell body 110. Furthermore, the vertical direction of the receiving space 130, namely the upper and lower sides, is surrounded by the upper cover 121 and the lower cover 122, respectively.

[0085] The accommodating space 130 can be configured to accommodate components of the DC-DC converter 10 in any shape. In the illustrated embodiment, the outer shell body 110 surrounding the accommodating space 130 is formed with a right-angled quadrilateral cross-section, and the accommodating space 130 also has a right-angled quadrilateral cross-section, and can be formed as a space in the shape of a quadrilateral prism extending in the vertical direction.

[0086] The accommodating space 130 is communicative to the outside. Through this communication, fluid for cooling components of the DC-DC converter 10 can flow into and out of the accommodating space 130. This communication is achieved through a connecting portion 230 that is connected to the housing body 110.

[0087] The heat exchange configuration and flow process can be achieved through the cooling module 200, which will be described in detail later.

[0088] The housing 130 is energized externally. This energization allows the transmission of current required to operate the DC-DC converter 10, as well as control signals, to the housed component. This energization can be achieved via the connector unit 720 of the energizing module 700, which will be described in detail later.

[0089] The accommodating space 130 can be divided into multiple spaces. These spaces are physically separated from each other, and different components can be installed in each space. At this time, at least one component in each space can come into contact with the cooling module 200 used for cooling.

[0090] The zoning can be achieved through the cooling module 200. Specifically, the cooling plate 210 of the cooling module 200 is housed in the receiving space 130, which can be divided into an upper space 131 and a lower space 132. As the names suggest, the upper space 131 is formed on the upper side of the cooling plate 210. The lower space 132 is formed on the lower side of the cooling plate 210.

[0091] The upper space 131 can accommodate a portion of the components of the DC-DC converter 10. In the illustrated embodiment, the upper space 131 accommodates a capacitor module 400, a semiconductor module 500, and a shielding module 600, etc.

[0092] A portion of the component housed in the upper space 131 may contact the cooling plate 210. In one embodiment, a portion of the component may directly contact the cooling plate 210.

[0093] In the illustrated embodiment, the capacitor module 400 and the semiconductor module 500 may be in contact with the cooling plate 210. Accordingly, the heat generated by operating the capacitor module 400 and the semiconductor module 500 may be transferred to the fluid flowing through the cooling plate 210.

[0094] As a result, cooling the capacitor module 400 and the semiconductor module 500 improves operational reliability.

[0095] The lower space 132 can accommodate the remaining portion of the components of the DC-DC converter 10. In the illustrated embodiment, the lower space accommodates the inductor module 300.

[0096] A remaining portion of the component housed in the lower space 132 may contact the cooling plate 210. In one embodiment, the remaining portion of the component may directly contact the cooling plate 210.

[0097] In the illustrated embodiment, the inductor module 300 may be in contact with the cooling plate 210. Accordingly, the heat generated by operating the inductor module 300 may be transferred to the fluid flowing through the cooling plate 210.

[0098] As a result, cooling the inductor module 300 improves operational reliability.

[0099] Unlike the above, the accommodating space 130 is divided into multiple spaces. In the illustrated embodiment, it is divided into an upper space 131 and a lower space 132. Different components are accommodated in each space 131 and 132 and can contact the cooling plate 210 respectively.

[0100] Therefore, compared to the area required for each component to contact the cooling plate 210 when each component is configured in a single layer, the area required for each component to contact the cooling plate 210 is further reduced.

[0101] Accordingly, the cross-sectional area of ​​the housing space 130 and the cross-sectional area of ​​the outer shell 110 surrounding the housing space 130 are also reduced, thereby miniaturizing the overall size of the DC converter 10.

[0102] The bracket 140 is the part where the DC-DC converter 10 is connected to the outside. In one embodiment, the DC-DC converter 10 can be configured in an EV (electric vehicle), HEV (hybrid electric vehicle), or FCV (fuel cell vehicle), etc. In this case, the DC-DC converter 10 can be fixed and connected to the EV, HEV, or FCV by the bracket 140.

[0103] The bracket 140 extends and includes at least one curved portion. One side of the bracket 140 is coupled to the outer side of the housing body 110. The other side of the bracket 140 can be coupled to a vehicle or the like equipped with a DC-DC converter 10.

[0104] Multiple supports 140 can be configured. The multiple supports 140 can be coupled to the housing body 110 at different positions. In the illustrated embodiment, four supports 140 are configured, which can be coupled to the front and rear ends of the left and right sides, respectively.

[0105] The number and configuration of brackets 140 can be varied to allow for any number and configuration of DC-DC converters 10 to be fixed and combined with any component.

[0106] The cooling module 200 receives heat generated by the components of the DC-DC converter 10 and dissipates it to the outside. The cooling module 200 can dissipate the heat generated when the DC-DC converter 10 is operating to the outside.

[0107] Additionally, the cooling module 200 divides the accommodating space 130 of the main housing 100 into multiple spaces. In the illustrated embodiment, the cooling module 200 is located in the height direction of the accommodating space 130, i.e., in the vertical direction, and similarly, divides the accommodating space 130 into an upper space 131 and a lower space 132.

[0108] The cooling module 200 is integrated with the main housing 100. Specifically, a portion of the components of the cooling module 200 are integrated with the housing body 110, while the remaining portion is housed in the housing space 130.

[0109] In the illustrated embodiment, the cooling module 200 includes a cooling plate 210, a flow path 220, and a connecting portion 230.

[0110] The cooling plate 210 divides the accommodating space 130 into multiple spaces. Furthermore, the cooling plate 210 is configured to directly and indirectly contact the components of the DC-DC converter 10 to receive heat generated by those components. The heat transferred to the cooling plate 210 is transferred to the fluid flowing along the flow path 220 formed on the cooling plate 210, thereby dissipating the heat to the outside.

[0111] As the name suggests, the cooling plate 210 can be configured into a plate shape with a predetermined thickness. The cooling plate 210 can be formed to have a cross-section corresponding to the receiving space 130.

[0112] In the illustrated embodiment, the accommodating space 130 can be understood as a right-angled quadrilateral with a length in the front-to-back direction that is less than its length in the left-to-right direction, and the cooling plate 210 can also be formed as a right-angled quadrilateral plate shape corresponding to the shape described above.

[0113] The cooling plate 210 can be formed of a material with high thermal conductivity. This is to more effectively transfer the heat generated by the various components housed in the housing space 130 to the cooling plate 210.

[0114] The cooling plate 210 can directly and indirectly contact the components housed in the housing space 130. In one embodiment, the cooling plate 210 can directly contact the capacitor module 400 and the semiconductor module 500 housed in the upper space 131. In addition, the cooling plate 210 can directly contact the inductor module 300 housed in the lower space 132.

[0115] A flow path 220 is formed inside the cooling plate 210.

[0116] The flow path 220 forms a path for fluid to flow outward, and the fluid discharges to the outside to transfer heat to the cooling plate 210.

[0117] A flow path 220 is formed on the cooling plate 210. In the illustrated embodiment, the flow path 220 is formed as a groove of a predetermined depth recessed in the surface of the cooling plate 210. To prevent the fluid flowing along the flow path 220 from flowing out arbitrarily, the flow path 220 may be closed by a cover member (not shown in the figures).

[0118] The flow path 220 can extend between the corners of the cooling plate 210, in Figure 2 In the illustrated embodiment, one end of the flow path 220 is located at the left corner of the cooling plate 210. Additionally, the other end of the flow path 220 is located at the front corner of the cooling plate 210.

[0119] The flow path 220 extends inside the cooling plate 210 to form various shapes. The shape increases the flow distance of the fluid flowing along the flow path 220, thereby improving the heat exchange time and efficiency between the heat generated by the component housed in the housing space 130 and the fluid.

[0120] In the illustrated embodiment, the flow path 220 is formed with six bends, extending from one end to the other end while undergoing seven directional changes.

[0121] The flow path 220 is connected to the outside. Specifically, one end of the flow path 220 is connected to an external fluid supply source (not shown), while the other end is connected to an external fluid container (not shown). This connection is achieved through a connecting portion 230 attached to the housing body 110. The flow path 220 is connected to the connecting portion 230.

[0122] The connecting portion 230 is attached to the outer casing body 110 to connect the receiving space 130 with the outside. Specifically, the connecting portion 230 is connected to the end of the flow path portion 220 formed on the cooling plate 210 to connect the flow path portion 220 with the outside.

[0123] The connecting portion 230 is through-connected to the housing body 110. A portion of the connecting portion 230 is exposed outside the housing body 110 and can communicate with an external fluid supply source (not shown) or a fluid reservoir (not shown). Fluid enters through the connecting portion 230 and flows through the flow path portion 220, and can then be discharged again through the connecting portion 230 to the external fluid reservoir (not shown).

[0124] Multiple connecting portions 230 can be configured. These multiple connecting portions 230 can be coupled to the housing body 110 at different locations. Figure 4 In the illustrated embodiment, two connecting portions 230 are configured, which can be respectively configured on the front side and the left side of the outer casing body 110.

[0125] Multiple connecting portions 230 can communicate with the ends of the flow path portion 220 at different locations. In the embodiment, the multiple connecting portions 230 communicate with one end and the other end of the flow path portion 220, respectively.

[0126] Any one of the plurality of connecting portions 230 may be connected to an external fluid supply source (not shown). Another of the plurality of connecting portions 230 is connected to an external fluid container (not shown). In the illustrated embodiment, it can be understood that two connecting portions 230 are configured, with one connecting portion 230 connected to an external fluid supply source (not shown) and the other connecting portion 230 connected to an external fluid container (not shown).

[0127] The inductor module 300, together with the capacitor module 400, stores the applied power, which is then transferred to other components. Since the operation of the inductor module 300 is a well-known technology, a detailed description is omitted.

[0128] The inductor module 300 is housed in the receiving space 130. Specifically, in Figure 2 In the illustrated embodiment, the inductor module 300 is housed in the lower space 132. Thus, the inductor module 300 is physically separated from the capacitor module 400 by the cooling plate 210.

[0129] Furthermore, the inductor module 300 is stacked with the capacitor module 400 across the cooling plate 210. As described above, this configuration reduces the size of the DC-DC converter 10.

[0130] The inductor module 300 can be configured to make direct or indirect contact with the cooling plate 210. In one embodiment, the inductor module 300 can be configured to make direct contact with the cooling plate 210.

[0131] This allows for more effective dissipation of heat generated during the operation of the inductor module 300.

[0132] The inductor module 300 is powered externally. The inductor module 300 can store energy by utilizing the current flowing into it. Furthermore, the inductor module 300 can transfer the stored energy to the outside. This power supply is achieved through the connector unit 720, which will be described later.

[0133] The capacitor module 400, together with the inductor module 300, stores the applied energy, which is then transferred to other components. Since the operation of the capacitor module 400 is a well-known technology, a detailed description is omitted.

[0134] The capacitor module 400 is housed in the housing space 130. Specifically, in Figure 2 In the illustrated embodiment, the capacitor module 400 is housed in the upper space 131. Thus, the capacitor module 400 is physically separated from the inductor module 300 by the cooling plate 210.

[0135] Furthermore, the capacitor module 400 is stacked with the inductor module 300 across the cooling plate 210. As described above, this configuration reduces the size of the DC-DC converter 10.

[0136] The capacitor module 400 can be configured to make direct or indirect contact with the cooling plate 210. In one embodiment, the capacitor module 400 can be configured to make direct contact with the cooling plate 210.

[0137] This allows for more effective dissipation of heat generated during the operation of the capacitor module 400.

[0138] The capacitor module 400 is powered externally. Using the current flowing into the capacitor module 400, energy can be stored. Furthermore, the capacitor module 400 can transfer the stored energy to the outside. This power supply is achieved through the connector unit 720, which will be described later.

[0139] The semiconductor module 500 can convert the applied current into AC power by repeatedly performing switching operations. The power applied through the operation of the semiconductor module 500 can be stored as energy in the inductor module 300 and the capacitor module 400.

[0140] Since the operation of semiconductor module 500 is a well-known technology, this detailed description is omitted.

[0141] The semiconductor module 500 is housed in the housing space 130. Specifically, in Figure 2 In the illustrated embodiment, the semiconductor module 500 is housed in the upper space 131.

[0142] As described above, a capacitor module 400 is also accommodated in the upper space 131. Accordingly, the capacitor module 400 is configured biased toward one side of the upper space 131, which is biased toward the left side in the illustrated embodiment, and the semiconductor module 500 is configured biased toward the other side of the upper space 131, which is biased toward the right side in the illustrated embodiment.

[0143] The semiconductor module 500 is physically separated from the inductor module 300 by a cooling plate 210. Furthermore, the semiconductor module 500 and the inductor module 300 are stacked together with respect to the cooling plate 210. This allows for a reduction in the size of the DC-DC converter 10.

[0144] The semiconductor module 500 can be configured to make direct or indirect contact with the cooling plate 210. In one embodiment, the semiconductor module 500 can make direct contact with the cooling plate 210.

[0145] This allows for more effective dissipation of heat generated during the operation of the semiconductor module 500.

[0146] The shielding module 600 can physically and electrically separate the PCB unit 710 of the semiconductor module 500 and the power supply module 700.

[0147] The shielding module 600 is located between the semiconductor module 500 and the PCB unit 710. The shielding module 600 can be configured to prevent direct contact between the semiconductor module 500 and the PCB unit 710. In addition, the shielding module 600 prevents the semiconductor module 500 and the PCB unit 710 from being powered on, and can electrically separate the semiconductor module 500 and the PCB unit 710.

[0148] The shielding module 600 is housed within the accommodating space 130. Specifically, in Figure 2In the illustrated embodiment, the shielding module 600 is housed in the upper space 131. The shielding module 600 is configured to cover the semiconductor module 500 housed in the upper space 131. In other words, the semiconductor module 500, the shielding module 600, and the PCB unit 710 are stacked sequentially.

[0149] Therefore, it can be understood that the shielding module 600 is configured to be biased towards the other side of the upper space 131, that is, the same as the semiconductor module 500, which is configured to be biased towards the right side of the upper space 131.

[0150] The shielding module 600 may include multiple components. Each component may be configured to physically and electrically separate the semiconductor module 500 and the PCB unit 710.

[0151] In the illustrated embodiment, the shielding module 600 includes a shielding plate 610 and insulating paper 620.

[0152] The shielding plate 610 physically separates the semiconductor module 500 from the PCB unit 710. Through the shielding plate 610, the semiconductor module 500 and the PCB unit 710 do not come into contact with each other.

[0153] The shielding plate 610 covers the semiconductor module 500 and is housed in the upper space 131. The size and shape of the shielding plate 610 can change according to the size and shape of the semiconductor module 500.

[0154] The insulating paper 620 electrically isolates the semiconductor module 500 from the PCB unit 710. Through the insulating paper 620, the semiconductor module 500 and the PCB unit 710 are not energized.

[0155] The insulating paper 620 covers the shielding plate 610 and is accommodated in the upper space. The size and shape of the insulating paper 620 may depend on the size and shape of the shielding plate 610 and the PCB unit 710.

[0156] The power supply module 700 is the part that connects the DC-DC converter 10 to an external power source and load. The power supply module 700 is powered by the external power source and load.

[0157] The power supply module 700 can be energized with components of the DC-DC converter 10, such as the inductor module 300, the capacitor module 400, and the semiconductor module 500. The power supply module 700 can transfer current to the inductor module 300, the capacitor module 400, and the semiconductor module 500.

[0158] The power-on module 700 is integrated into the main housing 100. In the illustrated embodiment, a portion of the components of the power-on module 700 are housed in the housing space 130, while a portion of another component is exposed to the outside of the main housing 100.

[0159] In the illustrated embodiment, the power-on module 700 includes a PCB unit 710 and a connector unit 720.

[0160] The PCB unit 710 operates via control signals transmitted from an external source to control the operation of the inductor module 300, capacitor module 400, and semiconductor module 500. Since the operation of the PCB unit 710 is a well-known technology, a detailed description is omitted.

[0161] The PCB unit 710 is accommodated in the accommodating space 130. Specifically, the PCB unit 710 covers the insulating paper 620 accommodated in the upper space 131 while also being accommodated in the upper space 131. Thus, the PCB unit 710 can cover the semiconductor module 500 while being accommodated in the upper space 131.

[0162] It can be understood that as the PCB unit 710 covers the semiconductor module 500 configuration, the PCB unit 710 can also be configured biased to the other side of the upper space 131, in the illustrated embodiment, located biased to the right.

[0163] The PCB unit 710 is powered on the inductor module 300, capacitor module 400, and semiconductor module 500. The PCB unit 710 can control the inductor module 300, capacitor module 400, and semiconductor module 500 according to the received control signals.

[0164] The current and control signals required for the calculation and drive control signals of PCB unit 710 can be transmitted through connector unit 720. PCB unit 710 is powered on connector unit 720.

[0165] Connector unit 720 is powered by an external power source and load. Additionally, connector unit 720 is powered by PCB unit 710, allowing it to transmit received control signals and power to PCB unit 710.

[0166] The connector unit 720 extends through the housing body 110, with a portion housed in the receiving space 130. That is, a portion of the connector unit 720 is housed in the receiving space 130, while another portion of the connector unit 720 is exposed on the outside of the main housing 100. This can be understood as the other portion being energized by an external power source and load.

[0167] Multiple connector units 720 can be configured. These multiple connector units 720 can be energized with different external power sources and loads. In the illustrated embodiment, the connector units 720 include a pair of connector units 720 located on the front left (i.e., two units) and a connector unit 720 located on the right-hand side, for a total of three connector units 720. The number and configuration of the connector units 720 can be varied.

[0168] Since the process of energizing the connector unit 720 with an external power source and load is a well-known technology, this detailed description is omitted.

[0169] 3. A method for manufacturing the DC-DC converter 10 according to an embodiment of the present invention will be described.

[0170] The DC-DC converter 10 of the embodiment of the present invention is configured to accommodate the above-described components. At this time, the inductor module 300 and capacitor module 400, which have relatively large volumes compared to other components, can be accommodated in the space divided by the cooling plate 210, namely the upper space 131 and the lower space 132, respectively.

[0171] Meanwhile, the inductor module 300 and the capacitor module 400 are respectively in contact with different surfaces of the cooling plate 210 for cooling. Thus, the inductor module 300 and the capacitor module 400 can be effectively cooled while the size of the DC-DC converter 10 can be miniaturized.

[0172] The following is for reference Figures 3 to 15 The manufacturing method of the DC converter 10 according to an embodiment of the present invention will be described in detail.

[0173] In the illustrated embodiment, the method of manufacturing the DC-DC converter 10 includes the steps of accommodating a member in one side space inside the main housing 100 (S100) and accommodating a member in the other side space inside the main housing 100 (S200).

[0174] (1) Explanation of the step of accommodating the component in one side space inside the main housing 100 (S100)

[0175] This step involves dividing the internal space of the main housing 100 into multiple spaces, and accommodating the components of the DC-DC converter 10 in any one of the divided spaces (S100). Hereinafter, refer to... Figures 3 to 5 , Figure 12 and Figure 14 This step (S100) will be explained in detail.

[0176] Reference Figure 3 First, the bracket 140 is attached to the outside of the housing body 110 of the main housing 100 (S110). As this step (S110) is performed, the completed DC-DC converter 10 can be attached to the required position, such as the aforementioned EV, HEV, FCV, etc.

[0177] Then, a plurality of connecting portions 230 are also attached to the outer casing body 110 (S120). As described above, the plurality of connecting portions 230 extend through and are attached to the outer casing body 110, with a portion located in the receiving space 130 and another portion exposed on the outside of the outer casing body 110. Accordingly, the receiving space 130 can communicate with a fluid supply source (not shown) and a fluid receiving portion (not shown) located outside the outer casing body 110.

[0178] Reference Figure 4 The cooling module 200, specifically the cooling plate 210, is accommodated in the receiving space 130 and is combined with the housing body 110 (S130). The cooling plate 210 is located at a position spaced apart from the ends of the receiving space 130 in the height direction, that is, in the illustrated embodiment, it may be located at a position spaced apart from the upper end and the lower end, respectively.

[0179] Accordingly, the accommodating space 130 can be divided into an upper space 131 and a lower space 132, wherein the upper space 131 is located on the upper side of the cooling plate 210 and the lower space 132 is located on the lower part of the cooling plate 210.

[0180] In the illustrated embodiment, the cooling plate 210 is shown to be received in the receiving space 130 through a lower opening of the housing body 110. Alternatively, the cooling plate 210 may be received in the receiving space 130 through an upper opening of the housing body 110.

[0181] The housing cooling plate 210 can be attached to the housing body 110 by a separate fastening component (not shown).

[0182] Reference Figure 5 The inductor module 300 is housed in the housing space 130, specifically in the lower space 132 (S140). At this time, the inductor module 300 covers the cooling plate 210 while being housed in the lower space 132.

[0183] In one embodiment, as described above, the inductor module 300 may be in contact with the cooling plate 210.

[0184] Reference Figure 12 The lower cover 122 covers the inductor module 300 and the lower space 132 that accommodates the inductor module 300, and is attached to the outer casing 110 (S150).

[0185] Accordingly, the lower space 132 is enclosed by the lower cover 122, the cooling plate 210 and the outer shell body 110 to prevent arbitrary communication with the outside.

[0186] (2) The step of accommodating the component in the space on the other side inside the main housing 100 is described (S200).

[0187] This step (S200) involves accommodating the remaining components of the DC-DC converter 10 in another space among the multiple spaces divided within the main housing 100. Hereinafter, refer to... Figures 6 to 11 and Figure 15 This step (S200) will be explained in detail.

[0188] Reference Figure 6The capacitor module 400 is housed in another space among the multiple spaces divided by the cooling plate 210 where the inductor module 300 is not located. In the illustrated embodiment, it is housed in the upper space 131 (S210). At this time, the capacitor module 400 covers a portion of the cooling plate 210 while being housed in the upper space 131.

[0189] This is because the size (i.e., cross-sectional area) of the capacitor module 400 is smaller than the size (i.e., cross-sectional area) of the cooling plate 210, and it is located on one side of the upper space 131 (on the left side in the illustrated embodiment).

[0190] Reference Figure 7 The semiconductor module 500 is housed in the upper space 131 adjacent to the capacitor module 400 (S220). At this time, the semiconductor module 500 is housed in the upper space 131 while covering the remaining part of the cooling plate 210.

[0191] This can be understood as the semiconductor module 500 being smaller than the cooling plate 210 and located on the opposite side of the upper space 131 (the right side in the illustrated embodiment).

[0192] Reference Figure 8 The shielding module 600 covers the semiconductor module 500 and is housed in the upper space 131 (S230). At this time, it can be understood that the semiconductor module 500 is located on the other side of the upper space 131, and therefore the shielding module 600 is also located on the other side of the upper space 131.

[0193] Reference Figure 9 The PCB unit 710 covers the shielding module 600 and the semiconductor module 500 while being housed in the upper space 131 (S240). Similar to the semiconductor module 500 and the shielding module 600, the PCB unit 710 can be understood to be located on the other side of the upper space 131.

[0194] Reference Figure 10 The connector unit 720 is coupled to the housing body 110 to energize the inductor module 300 (S250). A portion of the connector unit 720 is located inside the receiving space 130, while another portion may be located outside the housing body 110. In one embodiment, the connector unit 720 may pass through and be coupled to the housing body 110.

[0195] Connector unit 720 can be powered to inductor module 300. As described above, connector unit 720 is powered to PCB unit 710, which can be powered to inductor module 300, capacitor module 400 and semiconductor module 500 respectively.

[0196] Reference Figure 13 The upper cover 121 covers the capacitor module 400, semiconductor module 500 and shielding module 600 and is combined with the upper space 131 that accommodates these modules and is integrated into the outer shell body 110 (S260).

[0197] Accordingly, the upper space 131 is enclosed by the upper cover 121, the cooling plate 210 and the outer shell body 110 to prevent any communication with the outside.

[0198] The manufacturing method of the DC-DC converter 10 of the present invention described above is based on the premise that the inductor module 300 is first housed in the lower space 132 and then the capacitor module 400, semiconductor module 500 and shielding module 600 are housed in the upper space 131.

[0199] As an alternative, the step of accommodating the component in the upper space 131 (S200) can be performed before the step of accommodating the component in the lower space 132 (S140 and S150).

[0200] However, it should be understood that in the alternative embodiment, the step of dividing the receiving space 130 into an upper space 131 and a lower space 132 by the cooling plate 210 is also performed first (S130).

[0201] The above description refers to preferred embodiments of the present invention. However, those skilled in the art should understand that various modifications and changes can be made to the present invention without departing from the spirit and scope of the invention as set forth in the claims.

[0202] Explanation of reference numerals in the attached figures

[0203] 10: DC-DC converter

[0204] 100: Main Shell

[0205] 110: Outer shell body

[0206] 120: Outer shell cover

[0207] 121: Upper cover

[0208] 122: Lower cover

[0209] 130: Capacity

[0210] 131: Upper Space

[0211] 132: Lower Space

[0212] 140: Stent

[0213] 200: Cooling Module

[0214] 210: Cooling plate

[0215] 220: Flow path part

[0216] 230: Connecting parts

[0217] 300: Inductor Module

[0218] 400: Capacitor Module

[0219] 500: Semiconductor Module

[0220] 600: Shielding module

[0221] 610: Shielding plate

[0222] 620: Insulating paper

[0223] 700: Power-on module

[0224] 710: PCB Unit

[0225] 720: Connector Unit

Claims

1. A DC converter comprising: a main housing that forms an accommodation space inside; a cooling module that is combined to the main housing to divide the accommodation space into two spaces separated in an up-down direction and to discharge heat generated in the accommodation space to the outside; an inductor module that is accommodated in either one of the spaces divided into two spaces and is located in a position adjacent to the cooling module to be in contact with the cooling module and be cooled; and a capacitor module that is accommodated in the other of the spaces divided into two spaces and is located in a position adjacent to the cooling module to be in contact with the cooling module and be cooled; the inductor module accommodated in the either one of the spaces and the capacitor module accommodated in the other of the spaces are disposed facing each other across the cooling module in the up-down direction.

2. The DC converter according to claim 1, wherein the cooling module includes: a cooling plate that is formed in a predetermined thickness in a height direction of the main housing and is formed in a sectional shape corresponding to a sectional shape of the accommodation space to absorb heat generated in the inductor module or the capacitor module; and a flow path portion that is recessed inside the cooling plate and extends between at least two corners different from each other among the corners of the cooling plate to flow a fluid that absorbs heat generated in the inductor module or the capacitor module.

3. The DC converter according to claim 2, wherein the cooling plate is disposed spaced apart from one side end portion and the other side end portion of the height direction of the main housing, respectively; a space formed between the cooling plate and the one side end portion is configured to accommodate either one of the inductor module and the capacitor module; a space formed between the cooling plate and the other side end portion is configured to accommodate the other of the inductor module and the capacitor module.

4. The DC converter according to claim 2, wherein the cooling module includes a communication portion, the communication portion is communicated through and combined to the main housing to be communicated with an end portion of the flow path portion and a fluid supply source outside, respectively.

5. The DC converter according to claim 2, wherein a fluid that flows in the flow path portion absorbs heat generated in the inductor module or the capacitor module, 6. The dc-dc converter of claim 1, wherein, including: a semiconductor module that is accommodated in the either one of the spaces divided into two spaces and is located in a position adjacent to the capacitor module and the cooling module, respectively; the capacitor module is located in a position deviated to one side of the either one of the spaces, the semiconductor module is located in a position deviated to the other side of the either one of the spaces.

7. A manufacturing method of a DC converter comprising: (a) a step of forming two spaces inside a main housing; (b) a step of accommodating a member in a one side space inside the main housing; and (c) a step of accommodating a member in the other side space of the main housing, the (a) step includes: (a1) a step of accommodating a cooling plate in an accommodation space of a main body of a housing to divide the accommodation space into an upper space and a lower space separated in an up-down direction, ​ The (b) step includes: a (bl) step in which the inductor module covers the cooling plate accommodated inside the main case to be in contact with the cooling plate and be cooled while being accommodated in the one-side space, The (c) step includes: a (cl) step in which the capacitor module covers the cooling plate accommodated inside the main case to be in contact with the cooling plate and be cooled while being accommodated in the other-side space, and is disposed to face the inductor module in the up-and-down direction across the cooling plate.

8. The manufacturing method of a DC converter according to claim 7, wherein The (b) step includes, after the (bl) step: a (b2) step in which a case cover covers the inductor module and the one-side space while being coupled to a case body to close the one-side space.

9. The manufacturing method of a DC converter according to claim 7, wherein The (c) step includes: a (c2) step in which a semiconductor module covers the cooling plate accommodated inside the main case while being accommodated in the other-side space; a (c3) step in which a shield module covers the semiconductor module while being accommodated in the other-side space; a (c4) step in which a PCB unit covers the shield module while being accommodated in the other-side space; and a (c5) step in which a case cover covers the capacitor module, the semiconductor module, the shield module, and the PCB unit while being coupled to a case body to close the other-side space.

Images