Production tooling and preparation method for polishing pills
By designing a polishing pill production tooling and preparation method, combined with grinding and kneading mechanisms, a new type of polishing pill is produced, which solves the problems of high cost, low efficiency or difficult precision in the existing technology, realizes the combination of efficient grinding and polishing, and improves the precision and efficiency of the chip manufacturing process.
Patent Information
- Application Number
- CN202211560988.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-12-07
- Publication Date
- 2025-09-05
- Estimated Expiration
- 2042-12-07
AI Technical Summary
Existing polishing methods have problems such as high cost, low efficiency or difficulty in ensuring accuracy. Especially in the chip manufacturing process, when diamond resin pellets or polishing sheets are used alone, each has its own defects.
A polishing pill production tooling is used, combined with grinding and kneading mechanisms. Through the linkage of the grinding and kneading mechanisms, the actuator and buffer chamber design are optimized to produce a new type of polishing pill. Combined with the specific ratio of cerium oxide and copper powder, a close combination of powder materials is achieved, thereby improving grinding efficiency and polishing effect.
It achieves a combination of efficient grinding and polishing, avoids the tedious step-by-step operations in traditional methods, reduces costs and improves the polishing accuracy and efficiency of chips.
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Figure CN115716248B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of polishing materials and related manufacturing equipment, and in particular to a production tool and a preparation method for polishing pills. Background Art
[0002] The photolithography machine can also be called a mask alignment exposure machine, exposure system, photolithography system, etc. It is an indisputable fact that the most difficult technology to overcome among the current domestic technologies is the photolithography machine technology. The importance of the photolithography machine lies in its ability to perform photolithography on high-precision chips. At the same time, photolithography is also the most valuable process in the chip manufacturing process.
[0003] When or before photolithography of high-precision chips, polishing and grinding the chips will directly affect the various performance of the chips. At present, there are usually three ways to select materials for polishing and grinding domestic chips: the first is to directly use diamond resin pellets to polish and grind the chip surface; the second is to directly use polishing sheets or polishing leather to polish and grind the chip surface; the third is to first use diamond resin pellets to grind the chip (rough grinding), and then polish the chip with polishing sheets or polishing leather (fine polishing).
[0004] However, the problems with the above three polishing and grinding methods are: although the first two methods save costs (i.e., only one polishing and grinding material needs to be selected), there is still a difference between diamond resin pellets and polishing sheets (polishing leather). Diamond resin pellets are mainly used for rough grinding of precision parts (i.e., chips). If diamond resin pellets are always used for synchronous grinding and polishing of precision parts, the accuracy of the precision parts will be difficult to guarantee. If polishing sheets (polishing leather) are always used for synchronous grinding and polishing of precision parts, the grinding rate will be seriously slowed down; the third method uses different materials to realize the processing mode of first grinding and then polishing precision parts. Although it can ensure the accuracy of tight parts and the grinding rate is not affected, it is necessary to use two materials at the same time and grind and polish the precision parts in steps. On the one hand, the cost is increased, and on the other hand, the grinding and polishing time is prolonged. Summary of the Invention
[0005] In view of this, the purpose of the present invention is to provide a production tooling and preparation method for polishing pills. By combining the tooling and preparation method for producing the polishing pills, as well as the components of the polishing pills, it is ensured that the polishing pills of the present application can not only meet the high-efficiency grinding of diamond resin pills, but also have the fine polishing properties of polishing sheets (polishing leather).
[0006] In the first aspect, the present invention discloses a production tool for polishing pills, including a grinding mechanism and a kneading mechanism, the grinding mechanism is used to grind and grind the powder in a soft inlet pipe; the grinding mechanism is provided with a kneading mechanism, the kneading mechanism is used to rub and grind the powder in a soft outlet pipe; the inlet end of the soft inlet pipe is used to connect to a mixer, the outlet end of the soft inlet pipe is used to communicate with a buffer chamber, the other end of the buffer chamber is used to communicate with the soft outlet pipe, and the other end of the soft outlet pipe is used to face the mold.
[0007] As an optimization solution for the grinding mechanism and the kneading mechanism: the grinding mechanism includes a support body, a carrier is vertically and slidingly connected to the support part of the support body, at least two rollers are provided on one side of the carrier, and the gap between adjacent rollers is used for the soft inlet tube to pass through; the kneading mechanism includes a sliding body, at least one side of the carrier is provided with a sliding body; a kneading arm is connected to the sliding body, and the claw of the kneading arm is used to be opposite to the adjacent side of the soft outlet tube; an actuator is provided on the sliding body, and the actuator is used to drive the kneading arm to rotate.
[0008] As a further optimization of the kneading mechanism: the kneading mechanism includes two sliding bodies, and the two sliding bodies are arranged on opposite sides of the carrier.
[0009] The present application designs a new type of actuator. Specifically, the actuator includes a tooth plate and a gear. A special-shaped groove is formed vertically on the support part of the support body. The oblique end of the special-shaped groove is opposite to the soft outlet tube. A horizontal column is connected to the sliding body. The horizontal column is slidably adapted to the special-shaped groove. The sliding body is slidably connected to the adjacent side of the carrier.
[0010] As a further limitation of the actuator, a gear is fixed on the transition point between the sliding body and the kneading arm, and a toothed plate is provided on the adjacent side of the gear and the carrier body, and the toothed plate is meshed with the gear.
[0011] As an optimization solution of the present application: a pushing body is connected to the sliding body, a blocking plate is slidingly adapted in the buffer cavity, a side block is provided on at least one side of the blocking plate, the side block is elastically connected to the proximal side of the buffer cavity, and the side block is opposite to the pushing body on the proximal side; when the pushing body is used to push the side block to move, the side block drives the blocking plate to move, and the blocking plate forms a discharge space with the buffer cavity.
[0012] As another embodiment of the present application: a seat frame is detachably connected to the buffer chamber, a mounting port for placing high-precision parts is formed on the seat frame, and a locking plate for fixing the high-precision parts is connected to the mounting port.
[0013] In a second aspect, the present invention discloses a method for preparing polishing pills, using a production tool for polishing pills, which mainly includes the following steps:
[0014] S1, mixing 99-99.5% cerium oxide and 1-0.5% copper powder in a blender for 0.5-1 hour, wherein the particle size of the cerium oxide is 50-200 times that of the copper powder, to obtain a mixed powder;
[0015] S2: The mixed powder obtained in S1 is then put into the production tooling for polishing pills for kneading and grinding, and the processing time is 1 hour;
[0016] S3: heating the mixed powder obtained in S2 to 300-400°C;
[0017] S4: The mixed powder obtained in S3 is transferred to a mold and pressed by external pressure with a pressing force of 100 kg / 0.785 cm².
[0018] Furthermore, the particle size of the copper powder is 0.2-0.6 μm, and the particle size of the cerium oxide is 50-200 μm.
[0019] Furthermore, the weight ratio of cerium oxide is preferably 99.5%, and the weight ratio of copper powder is preferably 0.5%.
[0020] The beneficial effects of the present invention are as follows:
[0021] First, the present application combines a grinding mechanism and a kneading mechanism to make the adhesion of the powder for producing polishing pills stronger, wherein, during the rubbing of the grinding mechanism and the kneading of the kneading mechanism, the large-particle components in the powder are first brought close to the small-particle components, and then the large-particle components are squeezed into the gaps between the small-particle components; after the powder components are processed by the present application, the large and small-particle powders are more tightly combined, and the gaps between the large and small-particle powders become smaller, making the surface of the formed polishing pills denser; therefore, compared with traditional diamond resin pills, the polishing effect is improved, and the performance of the polishing pills produced by the present application is relatively close to that of the polishing sheets; the polishing pills produced by the present application can realize the grinding and polishing of high-precision parts (chips, etc.), avoiding the tedious two-step grinding and polishing in traditional technology, and avoiding the defects of poor polishing effect or long time consumption when using only one of the diamond resin pills or polishing sheets. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] Figure 1 Schematic diagram of the assembly structure of the grinding mechanism.
[0023] Figure 2 Schematic diagram of the assembly structure of the kneading mechanism.
[0024] Figure 3 Schematic diagram of the three-dimensional structure of the kneading arm.
[0025] Figure 4 It is a schematic diagram of the assembly structure of the grinding mechanism and the kneading mechanism.
[0026] Figure 5 It is a schematic diagram of the assembly structure of the grinding mechanism, kneading mechanism and actuator.
[0027] Figure 6 This is a schematic diagram of the local structure of this application.
[0028] Figure 7 It is a schematic diagram of the installation structure of the pusher and the structure inside the buffer cavity.
[0029] Figure 8 Schematic diagram of the three-dimensional structure of the buffer chamber.
[0030] Figure 9 This is a schematic diagram of the assembly structure of another roller and the mounting plate.
[0031] Figure 10 This is a schematic diagram of the installation structure of the polishing pill assembly rack.
[0032] Figure 11 This is a physical picture of the polished pills produced through this application.
[0033] In the figure, there are grinding mechanism 1, support body 101, carrier body 102, roller 103, soft inlet pipe 2, buffer chamber 3, soft outlet pipe 4, kneading mechanism 5, sliding body 501, kneading arm 502, actuator 6, tooth plate 601, gear 602, special-shaped groove 7, horizontal column 8, push body 9, blocking plate 10, side stop 11, mounting plate 12, seat frame 13, and locking plate 14. DETAILED DESCRIPTION
[0034] In order to clearly understand the technical solution of the present application, the production tooling and preparation method of a polishing pill provided by the present application will be described in detail below with reference to specific embodiments and drawings.
[0035] The terms used in the following examples are for the purpose of describing specific embodiments only and are not intended to limit the present application. As used in the specification and claims of this application, the singular expressions "a," "an," "above," "the," and "this" are intended to include expressions such as "one or more," unless the context clearly indicates otherwise. It should also be understood that in the following examples of this application, "at least one," "one or more" refer to one, two, or more than two.
[0036] References to "one embodiment" or "some embodiments" in this specification mean that a particular feature, structure, or characteristic described in conjunction with that embodiment is included in one or more embodiments of the present application. Thus, phrases such as "one embodiment," "some embodiments," "in other embodiments," and "in other embodiments" appearing in various places in this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "including," "comprising," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.
[0037] Example 1
[0038] This embodiment provides a production tool for polishing pills, which includes a grinding mechanism 1, a reference Figure 1 The figure shows a schematic diagram of the assembly structure of the grinding mechanism 1. As shown in the figure, the grinding mechanism 1 further includes a support body 101, and a seat is formed at the bottom of the support body 101. The seat is mainly used for stable placement, and a support portion is extended above the seat portion to form a support portion, and the seat portion and the support portion together constitute the support body 101; a carrier 102 is vertically slidably connected to the support portion of the support body 101, and a bearing foot is connected to the left side of the carrier 102. A roller 103 is connected to the end edge of the bearing foot, and another roller 103 is provided on one side of the roller 103. A gap is formed between the two rollers 103, and the purpose of the above gap is: the soft inlet pipe 2 can pass through it, and the soft inlet pipe 2 can be deformed by adjusting the size of the gap. The raw materials for manufacturing polished tiles first enter the soft inlet pipe 2 (the soft inlet pipe 2, the buffer chamber 3, and the soft outlet pipe 4 together constitute the material delivery pipeline), and the powder therein is squeezed by the deformed soft inlet pipe 2; in order to facilitate the staff to The carrier 102 is lifted up and down more smoothly on the support part of the support body 101. A lifting handle is fixed on the carrier 102. By moving the carrier 102 up and down, the roller 103 connected to the carrier 102 can be raised or lowered. The moving roller 103 can roll and grind the powder in the soft inlet pipe 2 (Note: the roller 103 referred to here will only move up and down within a small range. Therefore, the other roller 103 only needs to be fixed. The gap between the two rollers 103 can still achieve continuous squeezing of the powder in the soft inlet pipe 2); the gap between the two rollers 103 squeezes the powder in the soft inlet pipe 2, and the movement of one roller 103 achieves rolling and grinding of the powder in the soft inlet pipe 2 (the other roller plays a supporting role for the soft inlet pipe 2 at this time). The squeezing and rolling act together on the powder in the soft inlet pipe 2, and the moving roller 103 achieves rolling and grinding of the powder in the soft inlet pipe 2.
[0039] Among them, the inlet end of the soft inlet pipe 2 is connected to a small mixer (the mixer is a common existing technology on the market, the model can be JW350, which is not shown in the figure), the outlet end of the soft inlet pipe 2 is connected to the upper part of the buffer chamber 3, and the lower part of the buffer chamber 3 is connected to the soft outlet pipe 4.
[0040] refer to Figure 2 As shown, it is a schematic diagram of the assembly structure of the kneading mechanism 5. As can be seen from the figure, the kneading mechanism 5 includes two sliding bodies 501, which are respectively arranged on both sides of the carrier 102 in a parallel and opposite manner. The sliding bodies 501 are connected with kneading arms 502 ( Figure 3 The figure shows a three-dimensional structural diagram of the kneading arm 502. The claw of the kneading arm 502 is opposite to the adjacent side of the soft outlet tube 4. The sliding body 501 is equipped with an actuator 6 for braking the kneading arm 502 to rotate. When the kneading arm 502 is driven to flip by the actuator 6, the claw of the kneading arm 502 presses the soft outlet tube 4 until it is deformed. The gradually deformed soft outlet tube 4 presses the powder inside it. On the other hand, while the kneading arm 502 presses the powder, the carrier 102 indirectly drives the kneading arm 502 to rotate. 02 moves up and down on the surface of the soft outlet tube 4, and the kneading arm 502 that moves up and down can knead the powder in the soft outlet tube 4; therefore, the kneading arm 502 is directly driven by the rotation of the actuator 6 and the indirect up and down movement of the carrier 102, so that the kneading arm 502 can produce a rubbing and kneading effect on the powder in the soft outlet tube 4. During the rubbing and kneading process of the powder, the large particle components originally gathered around the small particle components are squeezed into the gaps between the small particle components, so that the large and small particle components are more closely combined and the adhesion between the particles is stronger.
[0041] In order to better understand the assembly relationship between the grinding mechanism 1 and the kneading mechanism in this application, refer to Figure 4 As shown, it is a schematic diagram of the assembly structure of the grinding mechanism 1 and the kneading mechanism 5, and the two sliding bodies 501 are connected to the two sides of the carrying body 102.
[0042] The working principle of the overall structure of the present application is as follows: first, the powder processed by the small mixer enters the soft inlet pipe 2 (the material of the soft inlet pipe 2 and the outlet pipe can be ABS plastic, etc.), and at the same time, the support body 101 is pushed to move in the direction close to the soft inlet pipe 2, and the gap formed by the roller 103 on the support body 101 and the other roller 103 gradually shrinks, and the soft inlet pipe 2 in the gap is compressed and deformed, and the large and small particle sizes of the powder components in the soft inlet pipe 2 are aggregated; then, the powder discharged from the soft inlet pipe 2 enters the buffer chamber 3 for temporary storage, and then the powder enters the soft outlet pipe 4; finally, at the same time as the powder enters the soft outlet pipe 4, under the joint action of the actuator 6 and the carrier 102, the claws of the kneading mechanism 5 can rub and knead the soft outlet pipe 4, so that the large-particle powder components enter the small-particle powder components.
[0043] By combining the grinding mechanism 1 and the kneading mechanism 5, the present application can make the adhesion of the powder for producing polishing pills stronger, wherein, during the rubbing of the grinding mechanism 1 and the kneading of the kneading mechanism 5, the large-particle components in the powder are first brought close to the small-particle components, and then the large-particle components are squeezed into the gaps between the small-particle components; after the powder components are processed by the present application, the large and small-particle powders are more tightly combined, and the gaps between the large and small-particle powders become smaller, making the surface of the formed polishing pills denser; therefore, compared with traditional diamond resin pills, the polishing effect is improved, and the performance of the polishing pills produced by the present application is relatively close to that of the polishing sheets; the polishing pills produced by the present application can realize the grinding and polishing of high-precision parts (chips, etc.), avoiding the tedious two-step grinding and polishing in traditional technology, and avoiding the defects of poor polishing effect or long time consumption when using only one of the diamond resin pills or polishing sheets.
[0044] Furthermore, after the powder in the soft inlet pipe 2 is ground and milled by the grinding mechanism 1, the powder enters the buffer chamber 3 for temporary storage, and then the powder in the buffer chamber 3 is placed into the soft outlet pipe 4. Finally, with the cooperation of the actuator 6, the kneading mechanism 5 rubs and kneads the powder in the soft outlet pipe 4 to complete the above-mentioned grinding action, discharging of the buffer chamber 3, and kneading action. Separate operations are required, and the operation process is cumbersome, time-consuming and labor-intensive. Based on this, the present invention designs a new actuator 6 and improves the parts of the grinding mechanism 1 and the kneading mechanism 5. The specific structure is as follows.
[0045] refer to Figure 5 , shows the assembly structure diagram of the grinding mechanism 1, kneading mechanism 5, and actuator 6, and combined with Figure 6 ,in, Figure 6A schematic diagram of the local structure of the present application is shown, in which the actuator 6 includes a tooth plate 601 and a gear 602. A special-shaped groove 7 is formed vertically on the supporting portion of the support body 101. The special-shaped groove 7 consists of a vertical portion and an oblique portion. The end of the oblique portion of the special-shaped groove 7 faces the direction of the soft outlet pipe 4. A horizontal column 8 is connected between the two sliding bodies 501, and the horizontal column 8 can be slidably adapted in the special-shaped groove 7; the sliding body 501 and the adjacent side of the carrier 102 are slidably adapted in the horizontal direction. When the carrier 102 moves vertically along the support portion of the support body 101, the horizontal column 8 first moves along the vertical portion of the special-shaped groove 7. At this time, the sliding body 501 does not move on the carrier 102. When the carrier 102 continues to move vertically along the support portion of the support body 101, the horizontal column 8 slides out of the vertical portion of the special-shaped groove 7 and enters the oblique portion. As the horizontal column 8 gradually moves toward the end of the oblique portion, the horizontal column 8 correspondingly drives the sliding body 501 to move on the carrier 102 (towards the direction where the soft outlet tube 4 is located). The sliding body 501 drives the claws of the kneading arm 502 to rub the surface of the soft outlet tube 4 along the direction a. Continue to combine Figure 5 A gear 602 is fixed on the transition point between the sliding body 501 and the kneading arm 502, and a toothed plate 601 is horizontally fixed on the adjacent side of the gear 602 and the carrier 102. The toothed plate 601 is meshed with the gear 602. Therefore, when the sliding body 501 moves on the carrier 102, the gear 602 rotates accordingly due to the meshing of the toothed plate 601 and the gear 602, and then the claw of the kneading arm 502 can rub on the surface of the soft outlet tube 4 along the direction b. The present application combines the actuator 6, the special-shaped groove 7 and the horizontal column 8 to ensure that the claws of the kneading workpiece can rub the surface of the soft outlet tube 4 in two directions (a, b). On the other hand, when the claws of the kneading workpiece rub the soft outlet tube 4 along the b direction, it also has a function of kneading and pinching the surface of the soft outlet tube 4 (the two claws of the kneading workpiece produce a kneading and pinching effect in the process of squeezing and releasing the soft outlet tube 4); the present application also ensures that the grinding mechanism 1 and the kneading workpiece have linkage. When the horizontal column 8 moves in the vertical part of the special-shaped groove 7, the wheel 103 of the grinding mechanism 1 grinds and grinds the surface of the soft inlet tube 2 accordingly. Once the horizontal column 8 enters the oblique part of the special-shaped groove 7, the wheel 103 of the grinding mechanism 1 gradually breaks away from contact with the soft inlet tube 2. At the same time, the kneading mechanism 5 turns to rub and pinch the soft outlet tube 4, thereby greatly improving work efficiency. There is no need for the grinding mechanism 1 and the kneading mechanism 5 to be operated separately.
[0046] Furthermore, when the kneading mechanism 5 needs to operate the powder in the soft outlet tube 4, the powder in the buffer chamber 3 needs to be put into the soft outlet tube 4 first, but the staff still needs to discharge the powder separately, which is inefficient and prone to staff miscontrol of the timing. Based on this, Figure 7 、 Figure 8 As shown, Figure 7 A schematic diagram showing the installation structure of the pusher 9 and the structure inside the buffer chamber 3 is shown. Figure 8 The schematic diagram of the three-dimensional structure of the buffer chamber 3 is shown. A pusher 9 is connected to the sliding body 501. A blocking plate 10 is horizontally and slidably adapted in the buffer chamber 3. Side blocks 11 are connected to both sides of the blocking plate 10. The side blocks 11 are elastically connected (e.g., springs) to the nearest side of the buffer chamber 3 and face the pusher 9 on the nearest side. When the end edge of the pusher 9 is not in contact with the side block 11, the blocking plate 10 seals the interior of the buffer chamber 3. When the end edge of the pusher plate gradually contacts the side block 11 and pushes the side block 11 to move, the blocking plate 10 no longer seals the buffer chamber 3. At this time, a discharge space is created between the blocking plate 10 and the buffer chamber 3, allowing the powder in the buffer chamber 3 to smoothly enter the soft outlet tube 4. The present application further combines the design of the pusher 9 and the corresponding buffer chamber 3 to ensure that the discharge of the buffer chamber 3 can be linked again with the grinding mechanism 1 and kneading mechanism 5 described above, using mechanical methods to replace manual discharge, thereby improving work efficiency and reducing the error rate.
[0047] Furthermore, in order to ensure that the soft inlet pipe 2 between the two rollers 103 is easily replaced and the gap is further fine-tuned; Figure 9 As shown, a schematic diagram of the assembly structure of another roller 103 and the mounting plate 12 is shown. The mounting plate 12 is fixed on the buffer cavity 3, and the other roller 103 is slidably connected to the mounting plate 12. A lock for locking the roller 103 is installed on the mounting plate 12 (a spring can be directly selected here, which is not shown in the figure).
[0048] Example 2
[0049] The powder discharged from the soft outlet pipe 4 in Example 1 directly enters the mold for molding. The mold is placed below the soft outlet pipe 4. The mold is not shown in the figure and will not be described here. After the powder is formed into polishing pellets in the mold, the traditional practice is to directly use the polishing pellets to polish the high-precision parts manually, or to load them into another grinding machine to polish the high-precision parts. Both methods require manual or mechanical operation of the polishing pellets, which is time-consuming, labor-intensive and costly. For this reason, Figure 10As shown, a schematic diagram of the installation structure of the polishing pill assembly rack is shown. A seat frame 13 is detachably connected above the buffer chamber 3 (of course, the seat frame 13 is installed after the soft inlet pipe 2 is removed). A mounting port is formed on the seat frame 13, which is used to place high-precision parts. A locking plate 14 for fixing the high-precision parts is connected above the mounting port. The plate surface of the locking plate 14 is in contact with the high-precision parts. A bolt is quasi-connected on the locking plate 14, and the other end of the bolt is threadedly connected to the seat frame 13; the seat frame 13 is located between the two rollers 103, which facilitates the subsequent rollers 103 to polish the high-precision parts on the seat frame 13. The present application has a wider range of applications by using a dual-purpose machine. It can be used as a machine for manufacturing polishing pills, as well as a clamping tool for loading polishing pills and a grinding tool for high-precision parts.
[0050] Example 3
[0051] After the upgrade of the production tooling for polishing pellets (of course, without changing the composition of the powder, the production tooling for polishing pellets can still make the polishing tiles achieve the characteristics of polishing and grinding), the composition and processing conditions of the polishing pellets have also been optimized accordingly, specifically including the following ingredients (by weight ratio):
[0052] Cerium oxide 99-99.5%;
[0053] Copper powder 1-0.5%.
[0054] Based on the above polishing pill production tooling and the components of the polishing pill, the present invention further designs a preparation method of the polishing pill, which mainly comprises the following steps:
[0055] Based on 1KG of powder:
[0056] Step 1: Mix 99-99.5% cerium oxide with 1-0.5% copper powder in a blender for 0.5-1 hour, wherein the particle size of the cerium oxide is 50-200 times that of the copper powder, to obtain a mixed powder;
[0057] Step 2: The mixed powder obtained in the first step is then put into the production tooling for polishing pills for kneading and grinding, and the processing time is 1 hour;
[0058] Step 3: heating the mixed powder obtained in step 2 to 300-400°C;
[0059] Step 4: Move the mixed powder obtained in the third step into a mold and press the mixed powder by external pressure with a pressing force of 100kg / 0.785cm².
[0060] Furthermore, the particle size of the copper powder is 0.2-0.6 μm, and the particle size of the cerium oxide is 50-200 μm.
[0061] Furthermore, the weight ratio of cerium oxide is preferably 99.5%, and the weight ratio of copper powder is preferably 0.5%.
[0062] in, Figure 11 Shown are polished pellets produced by this application.
Claims
1. A production tool for polishing pills, characterized by: The invention comprises a grinding mechanism (1) and a kneading mechanism (5), wherein the grinding mechanism (1) is used to grind and grind the powder in the soft inlet pipe (2); the kneading mechanism (5) is provided on the grinding mechanism (1), and the kneading mechanism (5) is used to grind and grind the powder in the soft outlet pipe (4); the inlet end of the soft inlet pipe (2) is used to connect to the mixer, the outlet end of the soft inlet pipe (2) is used to communicate with the buffer chamber (3), and the other end of the buffer chamber (3) is used to communicate with the soft outlet pipe (4). (4) The other end is used to face the mold; the grinding mechanism (1) includes a support body (101), a carrier (102) is vertically and slidably connected to the support portion of the support body (101), and at least two rollers (103) are provided on one side of the carrier (102), and the gap between adjacent rollers (103) is used for the soft inlet tube (2) to pass through; the kneading mechanism (5) includes two sliding bodies (501), and the two sliding bodies (501) are provided on opposite sides of the carrier (102); the sliding body ( The kneading arm (502) is connected to the sliding body (501), and the claw of the kneading arm (502) is used to face the adjacent side of the soft outlet tube (4); the sliding body (501) is provided with an actuator (6), and the actuator (6) is used to drive the kneading arm (502) to rotate; the actuator (6) includes a tooth plate (601) and a gear (602); a special-shaped groove (7) is formed on the support portion of the support body (101) along the vertical direction, and the end of the oblique part of the special-shaped groove (7) is in contact with the soft outlet tube (4). The outlet pipe (4) is opposite to the outlet pipe (4), and a horizontal column (8) is connected to the sliding body (501), and the horizontal column (8) is slidably matched with the special-shaped groove (7). The sliding body (501) is slidably connected to the adjacent side of the carrier (102); a gear (602) is fixed on the transition point between the sliding body (501) and the kneading arm (502), and a tooth plate (601) is provided on the adjacent side of the gear (602) and the carrier (102), and the tooth plate (601) is meshed with the gear (602).
2. The production tool for polishing pills according to claim 1, characterized in that: A pushing body (9) is connected to the sliding body (501), and a blocking plate (10) is slidingly adapted in the buffer chamber (3). A side block (11) is provided on at least one side of the blocking plate (10), and the side block (11) is elastically connected to the near side of the buffer chamber (3). The side block (11) is opposite to the pushing body (9) on the near side; when the pushing body (9) is used to push the side block (11) to move, the side block (11) drives the blocking plate (10) to move, and the blocking plate (10) and the buffer chamber (3) form a discharge space.
3. The production tool for polishing pills according to claim 1, characterized in that: The buffer chamber (3) is detachably connected to a seat frame (13), a mounting opening for placing a high-precision component is formed on the seat frame (13), and a locking plate (14) for fixing the high-precision component is connected to the mounting opening.
4. A method for preparing a polished pill, characterized in that: The production tooling for polishing pills according to any one of claims 1 to 3 comprises the following steps: S1, mixing 99-99.5% cerium oxide and 1-0.5% copper powder in a blender for 0.5-1 hour, wherein the particle size of the cerium oxide is 50-200 times that of the copper powder, to obtain a mixed powder; S2: The mixed powder obtained in S1 is then put into the production tooling of the polishing pills for grinding and kneading, and the processing time is 1 hour; S3: heating the mixed powder obtained in S2 to 300-400°C; S4: The mixed powder obtained in S3 is transferred to a mold and pressed by external pressure with a pressing force of 100 kg / 0.785 cm².
5. The method for preparing the polishing pill according to claim 4, wherein: The particle size of the copper powder is 0.2-0.6 μm, and the particle size of the cerium oxide is 50-200 μm.
6. The method for preparing the polishing pill according to claim 4, wherein: The weight ratio of cerium oxide is 99.5%, and the weight ratio of copper powder is preferably 0.5%.
Citation Information
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