An automatic glue coating device

Abstract

The present disclosure relates to an automatic glue coating device, belonging to the technical field of glue coating. The automatic glue coating device includes: a positioning part for positioning profiles; a colloid homogenization part connected to the positioning part. A first channel for the profile to pass through and a colloid homogenization flow channel for the colloid to flow through are provided in the colloid homogenization part. The first channel is located in the colloid homogenization flow channel, and the colloid homogenization flow channel is used for uniformly distributing the colloid; a glue coating part in which a glue coating flow channel for the profile to pass through is provided. The glue coating flow channel is communicated with the colloid homogenization flow channel, and the glue coating flow channel is used for coating the profile with glue. The automatic glue coating device of the present disclosure performs uniform distribution treatment on the colloid by setting the colloid homogenization part. The colloid after the uniform distribution treatment coats the profile in the glue coating part, so that the colloid is uniformly distributed on the surface of the profile. Moreover, the uniform distribution treatment process and the glue coating process are carried out separately without interference, ensuring the glue coating effect.

Description

Technical Field

[0001] The present disclosure relates to the field of gluing technology, and particularly to an automatic gluing device. Background Art

[0002] Profiles are objects with a certain geometric shape made of iron or steel and materials with certain strength and toughness (such as plastics, aluminum, fiberglass, etc.) through processes such as rolling, extrusion, and casting. However, after the profile processing is completed, the surface of the profile is rough and has poor weather resistance. In related technologies, gluing is performed on the surface of the profile to make the surface of the profile smooth and enhance the weather resistance. However, the existing gluing methods have unsatisfactory gluing effects and low gluing efficiency. Summary of the Invention

[0003] To overcome the problems existing in the related technologies, the present disclosure provides an automatic gluing device.

[0004] In a first aspect of the present disclosure, an automatic gluing device is proposed, and the automatic gluing device includes:

[0005] A positioning part for positioning the profile;

[0006] A colloid homogenization part connected to the positioning part. A first channel for the profile to pass through and a colloid homogenization flow channel for the colloid to flow through are provided in the colloid homogenization part. The first channel is located in the colloid homogenization flow channel, and the colloid homogenization flow channel is used for uniformly distributing the colloid;

[0007] A gluing part. A gluing flow channel for the profile to pass through is provided in the gluing part. The gluing flow channel is communicated with the colloid homogenization flow channel, and the gluing flow channel is used for gluing the profile.

[0008] In some embodiments of the present disclosure, the structure of the first channel and / or the gluing flow channel is adapted to the structure of the profile.

[0009] In some embodiments of the present disclosure, the positioning part includes at least one set of positioning wheel groups; the positioning wheel group includes a plurality of positioning wheels, and the plurality of positioning wheels are used for clamping and positioning the opposite sides of the profile;

[0010] The positioning part includes a positioning bracket, a positioning opening is provided on the positioning bracket, and the plurality of positioning wheels are arranged in the positioning opening;

[0011] In the gluing state, the profile passes through the positioning opening, and the plurality of positioning wheels clamp and position the opposite sides of the profile in the positioning opening;

[0012] The distance between the positioning wheel and the inner wall surface of its corresponding positioning opening is adjustable.

[0013] In some embodiments of the present disclosure, the colloid homogenizing unit includes:

[0014] A glue-introducing cover plate, the glue-introducing cover plate is connected to the positioning portion; a profile inlet is arranged on the glue-introducing cover plate, the first channel is arranged on a side of the glue-introducing cover plate away from the positioning portion, and the first channel is communicated with the profile inlet;

[0015] A flow channel block, wherein the flow channel block is connected to the glue inlet cover plate, and a second channel for accommodating the first channel is formed in the flow channel block; the colloid homogenizing flow channel is formed between the outer wall surface of the first channel and the inner wall surface of the second channel; a glue injection port is also provided on the flow channel block, and the glue injection port is connected to the colloid homogenizing flow channel.

[0016] In some embodiments of the present disclosure, a buffer cavity is provided on one side of the runner block close to the glue injection cover plate, and the entrance of the second channel is accommodated in the buffer cavity; a glue injection channel is formed inside the runner block, and the glue injection channel connects the glue injection port with the buffer cavity; the plane where the second channel is located is a preset plane, and the glue injection channel is at a preset inclination angle with the preset plane;

[0017] A plurality of glue inlet grooves are arranged on the peripheral wall of the entrance of the second channel, and the plurality of glue inlet grooves connect the buffer cavity with the colloid homogenizing flow channel; the plurality of glue inlet grooves are arranged to be inclined in the clockwise direction, or the plurality of glue inlet grooves are arranged to be inclined in the counterclockwise direction;

[0018] The inclination direction of the glue inlet channel is the same as the inclination direction of the glue inlet groove opposite thereto.

[0019] In some embodiments of the present disclosure, the glue coating unit includes:

[0020] A glue coating block is connected to the flow channel block; the glue coating flow channel is arranged in the glue coating block and passes through the glue coating block; the inlet of the glue coating flow channel is connected to the outlet of the second channel.

[0021] In some embodiments of the present disclosure, the size of the second channel is larger than that of the glue coating channel, and a conical transition is formed between the outlet of the second channel and the inlet of the glue coating channel.

[0022] In some embodiments of the present disclosure, the gluing device further includes a cooling unit, and the cooling unit is used to cool the profile after gluing.

[0023] In some embodiments of the present disclosure, the cooling portion includes a cooling channel, and the cooling channel is disposed in the glue coating block;

[0024] The cooling channel is arranged close to the outlet of the glue coating channel, and the cooling channel is arranged in a ring on the outer wall surface of the glue coating channel;

[0025] A cooling medium outlet and a cooling medium inlet are provided on the glue application block, and both the cooling medium outlet and the cooling medium inlet are communicated with the cooling flow channel.

[0026] In some embodiments of the present disclosure, the automatic glue application device further includes a traction mechanism, and the traction mechanism is used to drive the profile to move sequentially in the positioning part, the colloid homogenizing part, and the glue application part.

[0027] The technical solutions provided by the embodiments of the present disclosure may include the following beneficial effects: The automatic glue application device of the present disclosure performs a uniform distribution process on the colloid by setting a colloid homogenizing part, and the colloid after the uniform distribution process performs a glue application process on the profile in the glue application part, so that the colloid is evenly distributed on the surface of the profile, and the uniform distribution process and the glue application process are carried out separately without interference, ensuring the glue application effect. The entire glue application process can be automated, improving the glue application efficiency.

[0028] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The drawings herein are incorporated into the specification and constitute a part of this specification, showing embodiments consistent with the present invention, and are used together with the specification to explain the principles of the present invention.

[0030] Figure 1 is a schematic diagram of an automatic glue application device shown according to an exemplary embodiment.

[0031] Figure 2 is a cross-sectional view of a colloid homogenizing part and a glue application part shown according to an exemplary embodiment.

[0032] Figure 3 is a schematic diagram of a positioning device shown according to an exemplary embodiment.

[0033] Figure 4 is a front view of a positioning device shown according to an exemplary embodiment.

[0034] Figure 5 is a schematic diagram of a glue inlet cover plate shown according to an exemplary embodiment.

[0035] Figure 6 is a schematic diagram of a glue inlet cover plate shown according to an exemplary embodiment.

[0036] Figure 7 is a schematic diagram of a flow channel block shown according to an exemplary embodiment.

[0037] Figure 8 is a perspective view of a flow channel block shown according to an exemplary embodiment.

[0038] Figure 9 It is a schematic diagram of a glue - applying block shown according to an exemplary embodiment.

[0039] Figure 10 It is a schematic diagram of a glue - applying block shown according to an exemplary embodiment.

[0040] Figure 11 It is a cross - sectional view of a glue - applying block shown according to an exemplary embodiment.

[0041] Wherein: 10 - positioning part; 20 - colloid homogenizing part; 30 - glue - applying part; 40 - profile; 50 - glue injection pipe; 60 - cooling part; 70 - base; 80 - heat dissipation holes; 101 - positioning wheel; 102 - positioning bracket; 103 - positioning port; 104 - positioning bolt; 105 - threaded hole; 201 - glue inlet cover plate; 202 - first channel; 203 - profile inlet; 204 - runner block; 205 - buffer cavity; 206 - second channel; 207 - colloid homogenizing runner; 2061 - glue inlet groove; 2041 - glue injection port; 2042 - glue inlet channel; 301 - glue - applying block; 302 - glue - applying runner; 3011 - cover plate; 601 - cooling runner; 602 - cooling medium inlet; 603 - cooling medium outlet. Detailed implementation manners

[0042] Here, the exemplary embodiments will be described in detail, and the examples are shown in the drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The implementation manners described in the following exemplary embodiments do not represent all implementation manners consistent with the present invention. On the contrary, they are merely examples of devices and methods consistent with some aspects of the present invention as detailed in the appended claims.

[0043] In the related art, the surface of the profile is coated with glue to make the profile surface smooth and enhance the weather resistance. However, the existing glue - applying methods have unsatisfactory glue - applying effects and low glue - applying efficiency.

[0044] To solve the above technical problems, the present disclosure proposes an automatic glue coating device. A first channel for the profile to pass through and a glue homogenization flow channel for the glue to flow through are provided in the glue homogenization part of the automatic glue coating device. The first channel is located within the glue homogenization flow channel, and the glue homogenization flow channel is used to evenly distribute the glue. A glue coating flow channel for the profile to pass through is provided in the glue coating part of the automatic glue coating device. The glue coating flow channel is communicated with the glue homogenization flow channel, and the glue coating flow channel is used to coat the profile with glue. The automatic glue coating device of the present disclosure evenly distributes the glue by providing a glue homogenization part, and the evenly distributed glue coats the profile in the glue coating part, so that the glue is evenly distributed on the surface of the profile. Moreover, the even distribution process and the glue coating process are carried out separately without interference, ensuring the glue coating effect. The entire glue coating process can be automated, improving the glue coating efficiency.

[0045] The technical solution information of the present disclosure will be described in detail with reference to the accompanying drawings

[0046] According to an exemplary embodiment of the present disclosure, as Figures 1-11 shown, this embodiment proposes an automatic glue coating device, which is used to automatically coat the surface of the profile 40. The type of glue applicable to the automatic glue coating device in this embodiment is not limited and can be determined according to the performance required by the profile 40. For example, when it is necessary to increase the weather resistance of the profile 40, the automatic glue coating device coats a glue with weather resistance on the surface of the profile 40. Weather resistance refers to the ability to withstand the tests of the climate, such as the combined damage caused by light, heat and cold, wind and rain, bacteria, etc. The temperature of the glue applicable to the automatic glue coating device is also not limited and can be high-temperature glue, low-temperature glue, or normal-temperature glue.

[0047] Referring to Figure 1 and Figure 2, the automatic glue coating device of this embodiment includes a positioning part 10, and the positioning part 10 is used to position the profile 40 to ensure that the profile 40 will not shift during the glue coating process of the profile 40, and ensure that the glue is evenly coated on the surface of the profile 40. The automatic glue coating device further includes a glue homogenization part 20. The glue homogenization part 20 is connected to the positioning part 10. A first channel 202 for the profile 40 to pass through and a glue homogenization flow channel 207 for the glue to flow are provided in the glue homogenization part 20. The first channel 202 is located in the glue homogenization flow channel 207. After the glue enters the glue homogenization flow channel 207, it flows along the outer wall surface of the first channel 202 and is evenly distributed on the outer wall surface of the long and narrow first channel 202, thereby realizing the even distribution treatment of the glue. The structure of the first channel 202 is not limited, as long as it can accommodate the profile 40 and allow the profile 40 to move in the first channel 202. Preferably, the structure of the first channel 202 is adapted to the structure of the profile 40, so that the glue is evenly distributed on the outer wall surface of the first channel 202 in a form adapted to the structure of the profile 40, thereby obtaining a better glue coating effect. The movement of the profile 40 in the first channel 202 can be manually pushed or pulled, or a power mechanism can be set to push or pull the profile 40 to move.

[0048] The automatic glue coating device further includes a glue coating part 30. A glue coating flow channel 302 for the profile 40 to pass through is provided in the glue coating part 30. The glue coating flow channel 302 is communicated with the glue homogenization flow channel 207. The glue evenly distributed by the glue homogenization flow channel 207 enters the glue coating flow channel 302, and the glue coating flow channel 302 is used to perform glue coating treatment on the profile 40. The structure of the glue coating flow channel 302 is not limited, as long as it can accommodate the profile 40 and allow the profile 40 to move in the glue coating flow channel 302. Preferably, the structure of the glue coating flow channel 302 is adapted to the structure of the profile 40, so that the glue performs glue coating treatment on the profile 40 in a form adapted to the structure of the profile 40, thereby obtaining a better glue coating effect. The flow direction of the glue in the automatic glue coating device refers to Figure 2 the direction indicated by the arrow in

[0049] In some embodiments, referring to Figure 1 , the automatic glue coating device further includes a base 70. The positioning part 10, the glue homogenization part 20 and the glue coating part 30 are all arranged on the base 70. The base 70 supports the positioning part 10, the glue homogenization part 20 and the glue coating part 30, and at the same time ensures the balance between the components.

[0050] In some embodiments, the automatic glue coating device further includes a traction mechanism (not shown in the figure). The traction mechanism is used to drive the profile 40 to move successively in the positioning part 10, the glue homogenization part 20 and the glue coating part 30, thereby realizing an automatic glue coating operation and improving the glue coating efficiency.

[0051] According to an exemplary embodiment of the present disclosure, the automatic gluing device of this embodiment includes all the contents of the above embodiments. The difference is that the positioning device of this embodiment includes at least one set of positioning wheel groups, and each positioning wheel group includes a plurality of positioning wheels 101. The plurality of positioning wheels 101 are used to clamp and position the opposite sides of the profile 40. The positioning wheel group of this embodiment includes at least two positioning wheels 101 arranged oppositely. The two positioning wheels 101 clamp and position the opposite sides of the profile 40. When the profile 40 moves, the two oppositely arranged positioning wheels 101 roll along with it, and the positioning effect on the profile 40 can also be ensured during the rolling process. In one example, referring to Figures 1-3 , the positioning wheel group includes four positioning wheels 101, and every two positioning wheels 101 are arranged oppositely to clamp and position the four sides of the profile 40. The number of the positioning wheel groups in this embodiment is not limited. It can be one or multiple. When multiple positioning wheel groups are provided, the multiple positioning wheel groups are arranged along the moving direction of the profile 40. In one example, referring to Figure 1 , Figure 3 and Figure 4 , the automatic gluing device is provided with two positioning wheel groups, and the two positioning wheel groups are arranged along the moving direction of the profile 40. Each positioning wheel group includes four positioning wheels 101, and the four positioning wheels 101 clamp and position the four sides of the profile 40.

[0052] In some embodiments, referring to Figure 3 and Figure 4 , the positioning part 10 includes a positioning bracket 102. A positioning port 103 is provided on the positioning bracket 102. A plurality of positioning wheels 101 are arranged in the positioning port 103, and every two positioning wheels 101 are located on the inner wall surfaces of the opposite sides of the positioning port 103. In the gluing state, the profile 40 passes through the positioning port 103, and the plurality of positioning wheels 101 clamp and position the opposite sides of the profile 40 in the positioning port 103. The distance between the plurality of positioning wheels 101 and the inner wall surface of the corresponding positioning port 103 is adjustable. In one example, referring to Figure 4 , the positioning part 10 includes a plurality of positioning bolts 104. The plurality of positioning bolts 104 correspond to the plurality of positioning wheels 101, and the positioning wheels 101 are rotatably arranged at one end of the positioning bolts 104. Threaded holes 105 are provided at the positions of the positioning bracket 102 corresponding to the positioning wheels 101. The positioning bolts 104 are matched with the threaded holes 105. By screwing the positioning bolts 104 into and out of the threaded holes 105, the distance between the positioning wheels 101 and the inner wall surface of the corresponding positioning port 103 is adjusted, so that the gluing thickness of the profile 40 on different sides can be adjusted as needed.

[0053] According to an exemplary embodiment of the present disclosure, referring to Figure 1 , Figure 2 , Figures 5-8This embodiment includes all the contents of the above embodiments, and the difference is that the colloid homogenizing part 20 of this embodiment includes a glue entry cover plate 201 and a flow channel block 204, and the glue entry cover plate 201 is connected to the positioning part 10; a profile inlet 203 is arranged on the glue entry cover plate 201, and a first channel 202 is arranged on a side of the glue entry cover plate 201 away from the positioning part 10, and the first channel 202 is connected to the profile inlet 203. The profile 40 enters the first channel 202 through the profile inlet 203 and moves along the length direction of the first channel 202. The flow channel block 204 is connected to the glue inlet cover plate 201, and a second channel 206 for accommodating the first channel 202 is formed in the flow channel block 204. The colloid homogenization flow channel 207 is formed between the outer wall surface of the first channel 202 and the inner wall surface of the second channel 206. The flow channel block 204 is also provided with a glue injection port 2041, and the glue injection port 2041 is connected to the glue injection tube 50. The glue injection port 2041 is connected to the colloid homogenization flow channel 207. The colloid is injected into the colloid homogenization flow channel 207 through the glue injection port 2041 from the glue injection tube 50. The first colloid flows in the colloid homogenization flow channel 207 under the driving action of the continuously injected colloid. The flow direction of the colloid in the colloid homogenization flow channel 207 is referenced to Figure 1 In the direction indicated by the arrow in the middle. During the flow of the colloid, the outer wall surface of the first channel 202 is wrapped and evenly distributed on the outer wall surface of the first channel 202, thereby achieving the effect of uniform distribution of the colloid. This embodiment does not limit the structure of the flow channel block 204, and can be flexibly designed according to needs. For example, refer to Figure 7 The flow channel block 204 has a cubic structure.

[0054] In some embodiments, reference Figure 7 and Figure 8, a buffer cavity 205 is provided on one side of the runner block 204 close to the glue inlet cover plate 201. The buffer cavity 205 can be provided independently of the runner block 204 or integrally formed with the runner block 204. Exemplarily, the buffer cavity 205 is a concave cavity formed by inward depression on one side of the runner block 204 close to the glue inlet cover plate 201. The inlet of the second channel 206 is accommodated in the buffer cavity 205. An injection channel 2042 is formed inside the runner block 204. The injection channel 2042 connects the injection port 2041 with the buffer cavity 205. The colloid enters the injection channel 2042 through the injection port 2041, and then enters the buffer cavity 205 through the injection channel 2042. The plane where the second channel 206 is located is set as a preset plane. The injection channel 2042 forms a preset inclination angle with the preset plane. The size of the preset inclination angle can be determined according to the properties of the colloid and the desired glue coating effect. The size of the preset inclination angle is greater than 0 degrees and less than 180 degrees, and the preset inclination angle is not 90 degrees. For example, the preset inclination angle is 60 degrees. In this embodiment, by setting the injection channel 2042 to form a preset inclination angle with the plane where the second channel 206 is located, the colloid does not immediately enter the colloid homogenization channel 207 after entering the buffer cavity 205, but preferentially fills the buffer cavity 205 and then enters the colloid homogenization channel 207, which has a preliminary homogenization effect on the colloid. The glue inlet cover plate 201 and the runner block 204 are assembled integrally. The first channel 202 is accommodated in the second channel 206. The glue inlet cover plate 201 seals the buffer cavity 205 to prevent the colloid flowing into the buffer cavity 205 from overflowing.

[0055] In some embodiments, referring to Figure 7 and Figure 8 , a plurality of glue injection grooves 2061 are provided on the peripheral wall of the inlet of the second channel 206. The plurality of glue injection grooves 2061 are arranged along the circumferential direction of the second channel 206. The plurality of glue injection grooves 2061 connect the buffer cavity 205 with the colloid homogenization channel 207. The colloid filled in the buffer cavity 205 can enter the colloid homogenization channel 207 through the glue injection grooves 2061. The plurality of glue injection grooves 2061 are all inclined in the clockwise direction, or the plurality of glue injection grooves 2061 are all inclined in the counterclockwise direction, and the inclination direction of the injection channel 2042 is the same as the inclination direction of the glue injection groove 2061 opposite thereto. Preferably, the inclination angle of the injection channel 2042 is the same as the inclination angle of the glue injection groove 2061 opposite thereto, so that the colloid advances in a spiral manner in the colloid homogenization channel 207, thereby obtaining a better encapsulation effect.

[0056] According to an exemplary embodiment of the present disclosure, referring to Figures 9-11, This embodiment includes all the contents of the above embodiments. The difference is that the gluing part 30 of this embodiment includes a gluing block 301. The gluing block 301 is connected to the runner block 204. A gluing runner 302 is arranged in the gluing block 301 and penetrates through the gluing block 301. The inlet of the gluing runner 302 is docked with the outlet of the second channel 206 so that the gluing runner 302 is communicated with the colloid homogenizing runner 207. The colloid after being evenly distributed by the colloid homogenizing runner 207 enters the gluing runner 302. The profile 40 enters the gluing runner 302 from the first channel 202. The flow direction of the colloid in the gluing block 301 refers to Figure 2 the direction indicated by the arrow in Figure 9 and Figure 10 . The gluing block 301 is in the shape of a cube.

[0057] In an exemplary embodiment according to the present disclosure, referring to Figure 10 and Figure 11 , this embodiment includes all the contents of the above embodiments. The difference is that the automatic gluing device of this embodiment further includes a cooling part 60. The cooling part 60 is used to cool the profiled material 40 after gluing. When the temperature of the colloid is relatively high, the high-temperature colloid needs to be cooled after being coated on the profiled material 40. The cooling of the profiled material 40 by the cooling part 60 not only ensures the rapid cooling of the glue layer, but also ensures the thickness of the glue layer and the smoothness of the surface of the glue layer. The cooling part 60 of this embodiment can be independently arranged from the gluing part 30 or can be located in the gluing part 30. In one example, referring to Figure 11 , the cooling part 60 includes a cooling runner 601. The cooling runner 601 is arranged in the gluing block 301. The cooling runner 601 is arranged near the outlet of the gluing runner 302. The cooling runner 601 is arranged around the outer wall surface of the gluing runner 302 to cool the part of the profiled material 40 that has completed the gluing process. A cooling medium outlet 603 and a cooling medium inlet 602 are arranged on the gluing block 301. Both the cooling medium outlet 603 and the cooling medium inlet 602 are communicated with the cooling runner 601. The cooling medium enters the cooling runner 601 from the cooling inlet to cool the profiled material 40 located in the gluing runner 302. The cooling medium that has absorbed the heat of the profiled material 40 is finally discharged from the cooling medium outlet 603. The flow path of the cooling medium refers to Figure 11The direction indicated by the arrow. In this embodiment, the type of the cooling medium is not limited. Exemplarily, the cooling medium is water. Refer to Figure 10 , a cover plate 3011 is arranged on the outer edge of the peripheral wall of the outlet of the glue application runner 302. The cover plate 3011 blocks the cooling runner 601 to prevent the cooling medium from overflowing.

[0058] In some embodiments, a plurality of heat dissipation holes 80 are further provided on the glue inlet cover plate 201, the runner block 204 and the glue application block 301 to accelerate the heat dissipation on the glue inlet cover plate 201, the runner block 204 and the glue application block 301, avoid the overhigh temperature of the automatic glue injection device, and meanwhile reduce the weight of the whole automatic glue application device.

[0059] Those skilled in the art will readily conceive of other embodiments of the present invention after considering the specification and practicing the embodiments disclosed herein. This application is intended to cover any variations, uses, or adaptations of the present disclosure, which follow the general principles of the present disclosure and include common general knowledge or conventional technical means in the technical field not disclosed herein. The specification and embodiments are only regarded as exemplary, and the true scope and spirit of the present invention are pointed out by the following claims.

[0060] It should be understood that the present invention is not limited to the exact structures described above and shown in the drawings, and various modifications and changes can be made without departing from its scope. The scope of the present invention is only limited by the appended claims.

Claims

1. An automatic glue coating device, characterized in that, The glue coating device comprises: A positioning portion, the positioning portion is used to position the profile; A colloid homogenizing portion, the colloid homogenizing portion is connected to the positioning portion, the colloid homogenizing portion is provided with a first channel for the profile to pass through and a colloid homogenizing flow channel for the colloid to flow, the first channel is located in the colloid homogenizing flow channel, and the colloid homogenizing flow channel is used to evenly distribute the colloid; The gluing part has a gluing channel for the profile to pass through, the gluing channel is connected with the colloid homogenizing channel, and the gluing channel is used for gluing the profile.

2. An automatic gluing device according to claim 1, characterized in that, The structure of the first channel and / or the glue coating flow channel is adapted to the structure of the profile.

3. An automatic glue coating device according to claim 1, characterized in that, The positioning part includes at least one set of positioning wheel groups; the positioning wheel group includes a plurality of positioning wheels, and the plurality of positioning wheels are used to clamp and position the two opposite sides of the profile; The positioning part comprises a positioning bracket, a positioning opening is arranged on the positioning bracket, and a plurality of positioning wheels are arranged in the positioning opening; In the glue-coated state, the profile passes through the positioning opening, and the plurality of positioning wheels clamp and position the two opposite sides of the profile in the positioning opening; The distance between the positioning wheel and the inner wall surface of the corresponding positioning opening is adjustable.

4. An automatic glue coating device according to claim 1, characterized in that, The colloid homogenizing unit comprises: A glue-introducing cover plate, the glue-introducing cover plate is connected to the positioning portion; a profile inlet is arranged on the glue-introducing cover plate, the first channel is arranged on a side of the glue-introducing cover plate away from the positioning portion, and the first channel is communicated with the profile inlet; A flow channel block, wherein the flow channel block is connected to the glue inlet cover plate, and a second channel for accommodating the first channel is formed in the flow channel block; the colloid homogenizing flow channel is formed between the outer wall surface of the first channel and the inner wall surface of the second channel; a glue injection port is also provided on the flow channel block, and the glue injection port is connected to the colloid homogenizing flow channel.

5. An automatic gluing device according to claim 4, characterized in that, A buffer cavity is provided on one side of the runner block close to the glue injection cover plate, and the entrance of the second channel is accommodated in the buffer cavity; a glue injection channel is formed inside the runner block, and the glue injection channel connects the glue injection port with the buffer cavity; the plane where the second channel is located is a preset plane, and the glue injection channel and the preset plane have a preset inclination angle; A plurality of glue inlet grooves are arranged on the peripheral wall of the entrance of the second channel, and the plurality of glue inlet grooves connect the buffer cavity with the colloid homogenizing flow channel; the plurality of glue inlet grooves are arranged to be inclined in the clockwise direction, or the plurality of glue inlet grooves are arranged to be inclined in the counterclockwise direction; The inclination direction of the glue inlet channel is the same as the inclination direction of the glue inlet groove opposite thereto.

6. An automatic glue coating device according to claim 4, characterized in that, The gluing unit comprises: A glue coating block is connected to the flow channel block; the glue coating flow channel is arranged in the glue coating block and passes through the glue coating block; the inlet of the glue coating flow channel is connected to the outlet of the second channel.

7. An automatic glue coating device according to claim 6, characterized in that, The size of the second channel is larger than that of the glue coating channel, and a conical transition is formed between the outlet of the second channel and the inlet of the glue coating channel.

8. An automatic glue coating device according to claim 6, characterized in that, The gluing device further comprises a cooling part, and the cooling part is used for cooling the profile after gluing.

9. An automatic glue coating device according to claim 8, characterized in that, The cooling part comprises a cooling channel, and the cooling channel is arranged in the glue coating block; The cooling flow channel is arranged close to the outlet of the glue application flow channel, and the cooling flow channel is arranged in a ring around the outer wall surface of the glue application flow channel; A cooling medium outlet and a cooling medium inlet are arranged on the glue application block, and both the cooling medium outlet and the cooling medium inlet are communicated with the cooling flow channel.

10. An automatic gluing device according to any one of claims 1-9, characterized in that, The automatic glue application device further includes a traction mechanism, and the traction mechanism is used to drive the profile to move successively within the positioning portion, the colloid homogenizing portion, and the glue application portion.

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