A kind of surface mount bottom terminal component device tin filling device and process method

Abstract

This invention provides a soldering device for surface-mount bottom terminal components, comprising: a soldering worktable with a solder pot for providing molten solder, and a solder scraper on one side of the solder pot; a soldering fixture with component slots arranged in an array for holding components; a rotating arm disposed on the soldering worktable for gripping and moving the soldering fixture; and a vacuum suction tube, the first end of which is connected to a vacuum controller disposed on the soldering worktable, and the second end of which is connected to the soldering fixture, for evacuating the soldering fixture to fix the components in the slots; the rotating arm grips the soldering fixture with the components fixed on it, moves the soldering fixture to the solder pot, and dips the component solder tip into the molten solder before scraping it with the solder scraper to smooth the component solder tip, thus completing the soldering and scraping process of the component solder tip. This invention improves soldering efficiency and reliability, results in a high degree of surface smoothness of the component solder tip after soldering, and has the advantages of simple operation and strong versatility.

Description

Technical Field

[0001] This invention belongs to the field of electronic assembly, and specifically relates to a soldering device and process method for surface-mount bottom terminal components. Background Technology

[0002] Bottom-mount (BTC) surface mount devices refer to devices whose external connections consist of metal terminals that form part of the overall component. These devices are generally referred to in the industry as QFN, DFN, SON, LGA, MLP, and MLF. Due to their advantages such as small size, light weight, good heat dissipation, and good electrical performance, bottom-mount devices are widely used in the electronics industry, especially in aerospace and weaponry. In the field of electronic assembly with high reliability requirements, there are clear regulations regarding the removal of gold from gold-plated leads and the removal of oxides from oxidized leads. Tinning is an effective method for removing gold and oxides from electronic components and is currently the mainstream practice in the industry. Tinning is divided into automatic tinning and manual tinning. Automatic tinning relies on automatic tinning equipment, which has higher cost and space requirements. Manual tinning relies on manual labor using tools and fixtures, which is low-cost and highly compatible, but requires skilled personnel. In today's high-density assembly industry, BTC devices are mostly fine-pitch lead devices (lead pitch < 0.5), with small solder terminals and relatively small pads on the printed circuit board. Therefore, strict control of the solder at the solder terminals is crucial during assembly, and the flatness of the soldering surface is also highly demanding. Manual soldering is prone to quality problems such as solder bridging at the solder terminals, excessive solder buildup, substandard flatness of the solder terminals after soldering, and solder terminal damage, resulting in low soldering efficiency and poor soldering reliability for BTC devices.

[0003] Currently, there are three main methods in the industry for manually soldering BTC-type devices: 1. Direct tinning in a solder pot: the device is held in place by tools and fixtures and then directly immersed in a solder pot; 2. Manual soldering iron and desoldering with a desoldering wick: the device is held in place by a fixture, solder is applied to the solder joints with a soldering iron, and then the desoldering wick is heated by the soldering iron to remove the solder; 3. Rework station tinning: the device is mounted onto pads printed with solder paste using a rework station, and then soldered on a rework station. After the solder melts at one end, the device is removed. Of these methods, neither solder pot tinning nor rework station tinning can solve the problem of solder flatness at the device's solder joints. Furthermore, solder pot tinning makes it difficult to control the amount of solder, and solder buildup between the device's solder joints can easily cause bridging. While manual soldering with a desoldering wick can ensure flatness of the solder joints and remove excess solder, this method has two major drawbacks: 1. Low soldering efficiency: the device needs to be fixed before soldering, and after soldering, the solder joints need to be removed one by one using a desoldering wick. 2. For hot-melt solder joints, the soldering iron temperature needs to be increased and the device preheated to ensure proper solder melting, which poses a risk to the reliability of the solder joints and may even result in the pads being pulled off. Therefore, this method requires a high level of skill from the operator and produces poor product consistency. Currently, automated soldering equipment in the industry commonly uses hot air (nitrogen) to flatten the solder joints of BTC devices after soldering to ensure flatness. However, hot air and nitrogen equipment is complex and costly. Currently, there is no reliable and effective method for flattening the solder joints after manual soldering. Summary of the Invention

[0004] The purpose of this invention is to provide a soldering device and process for surface-mount bottom terminal components, which solves the problems existing in manual soldering of BTC devices. It can effectively improve the soldering efficiency, reliability and consistency of BTC devices, and reduce the skill level requirements of operators for manual soldering.

[0005] To achieve the above objectives, the present invention provides a soldering device for surface-mount bottom terminal components, comprising: a soldering worktable on which a solder pot for providing molten solder is disposed, and a solder scraper is disposed on one side of the solder pot; a soldering fixture on which component slots are arranged in an array for holding components; a rotating arm disposed on the soldering worktable for gripping and moving the soldering fixture; a vacuum suction tube, the first end of which is connected to a vacuum controller disposed on the soldering worktable, and the second end of which is connected to the soldering fixture, for evacuating the soldering fixture to fix the components in the slots; the rotating arm grips the soldering fixture with the components fixed on it, moves the soldering fixture to the solder pot, so that the solder end of the component is dipped in molten solder and then scraped by the solder scraper to smooth the solder end of the component, thereby completing the process of dipping and scraping the solder end of the component.

[0006] Preferably, one side of the tin pot extends outward to form a tin scraping platform, and the tin scraping platform is at the same horizontal level as the molten tin in the tin pot. The heat generated by heating the tin pot is conducted from the side of the tin scraping platform connected to the tin pot to the tin scraping platform, so that the temperature of the tin scraping platform is consistent with the temperature of the tin pot.

[0007] Preferably, the solder scraping platform is provided with a solder scraper plate, which is fixed to the solder scraping platform extending from the solder pot by solder scraper plate fasteners.

[0008] Preferably, the tin scraper is made of an aluminum alloy plate with a high thermal conductivity and a tin-plated surface, and its thickness is 2-5 mm; or the tin scraper is composed of an FR4 copper-clad tin-plated plate, an FR4 copper-clad silver-plated plate, or an aluminum alloy silver-plated plate.

[0009] Preferably, the rotating arm includes a vertical support arm and at least one horizontal support arm. The vertical support arm is vertically mounted on the tinning worktable. The first end of the horizontal support arm is connected to the vertical support arm, and the second end is provided with a height adjustment device. The horizontal support arm can rotate 180° around the vertical support arm in the horizontal plane.

[0010] Preferably, the bottom of the height adjustment device is connected to a tooling gripping device; the height adjustment device includes: a guide rod with a handle at one end and a first fixing hole at the handleless end for fastening to the tooling gripping device; a hollow sleeve with a rack and scale on its side wall, and elastic elements connected to its top and bottom respectively; the guide rod passes through the top elastic element, the inner tube of the hollow sleeve, and the bottom spring sequentially from the top of the hollow sleeve and is disposed inside the hollow sleeve; the rack disposed on the side wall of the hollow sleeve is connected to a knob, and by adjusting the knob, the hollow sleeve with the rack is moved up or down, adjusting the height of the guide rod disposed inside the hollow sleeve, thereby driving the tooling gripping device to move up or down.

[0011] Preferably, the tinning fixture includes a tinning fixture back plate and a tinning fixture front plate, which are connected by an interference fit, so that the front of the tinning fixture back plate fits against the back of the tinning fixture front plate, and the connection is airtight. The back of the tinning fixture back plate is provided with a vacuum interface for connecting to a vacuum suction tube, which is connected to a vacuum controller set on the tinning worktable. The back of the tinning fixture back plate also includes two second fixing holes for connecting to a fixture gripping device.

[0012] Preferably, the array of component slots is disposed on the front side of the tinning tooling front plate, and a vacuum suction hole is provided in the center of the component slot, with each vacuum suction hole communicating with a vacuum interface.

[0013] Preferably, the soldering workbench is further provided with a flux application module and a feeding platform; the flux application module includes an array of brushes and a baffle that constrains the brushes; the baffle is made of metal and divides the brushes into a brush array that corresponds to the array of component slots; the horizontal height of the brush tip is the same as the horizontal height of the solder scraper; the size of the feeding platform is larger than the soldering fixture, and the horizontal height of the feeding platform is the same as the horizontal height of the solder pot and the solder scraper.

[0014] The present invention also provides a method for soldering surface-mount bottom terminal components, using the above-mentioned soldering apparatus for surface-mount bottom terminal components, comprising:

[0015] Step S1: Heat the tin pot until it reaches the set temperature to form molten tin.

[0016] Step S2, Loading: Place the tinning fixture face up on the unloading platform, place the solder ends of the components to be tinned face up, and arrange them in an array above the vacuum suction hole in the slot of the tinning fixture. Connect the vacuum suction tube so that the components are vacuum-adsorbed in the slot; connect the tinning fixture to the fixture gripping device.

[0017] Step S3, Applying flux: Move the tinning fixture above the flux application module, adjust the height of the fixture gripping device so that the solder end of the component is in contact with the top of the brush, and move the handle to complete the application of flux to the solder end of the component.

[0018] Step S4, Soldering: Drag the handle to move the soldering fixture above the solder pot, adjust the height of the fixture gripping device, immerse the component solder ends into the molten solder in the solder pot, and complete the soldering of the component solder ends.

[0019] Step S5, Soldering: After the components are dipped in solder, move the soldering fixture above the solder scraper, adjust the height of the soldering fixture so that the solder end of the component is flush with the top surface of the solder scraper, drag the handle to transfer the solder from the bottom of the component to the solder scraper by scraping, so as to achieve a smooth surface of the bottom solder end of the component.

[0020] Step S6, Unloading: Transfer the soldering fixture to the unloading platform, so that the solder ends of the components are flush with the unloading platform. Set the vacuum control device to the vacuum breaking state, so that the components fall from the soldering fixture, and the component unloading is completed.

[0021] In summary, compared with the prior art, the tinning apparatus and process method for surface-mount bottom terminal components provided by the present invention have the following beneficial effects:

[0022] 1. High tinning efficiency: During the tinning process, all solder ends of BTC devices are tinned simultaneously. Compared with the current method of tinning solder ends one by one using a manual soldering iron or desoldering rope, all solder ends of the device can be tinned simultaneously in batches, increasing efficiency by more than 50 times.

[0023] 2. High tinning reliability: Compared with the current manual tinning of BTC devices, which suffers from uneven force on the solder ends due to the soldering iron and desoldering rope, this invention ensures uniform force on the device during the scraping process by dragging a flat plate, resulting in high tinning reliability.

[0024] 3. High success rate of tinning on the first try. Compared with manual tinning, this invention avoids solder buildup and bridging between solder ends by scraping the solder ends on a flat plate after tinning. At the same time, the small stress present during the scraping process provides energy for the solder to wet the solder ends, and the success rate of tinning on the first try can reach 100%.

[0025] 4. High flatness of solder joints: Compared with the current manual soldering and automated hot air leveling, the solder joints are transferred to the soldering board by scraping, resulting in high flatness of the solder joints and not affecting subsequent SMT (Surface Mount Technology) production.

[0026] 5. Low cost: Currently, the industry mostly uses manual tinning or equipment tinning, which is expensive, ranging from 500,000 to 2 million yuan. The device of this invention is simple and costs less than 20,000 yuan. It uses a manual control device for tinning, and the cost of tinning tooling is low. Tinning operation requires low skill level from operators, and labor costs are low. Attached Figure Description

[0027] Figure 1 This is a layout diagram of the soldering workbench in the soldering apparatus for surface-mount bottom terminal components of the present invention;

[0028] Figure 2 This is a schematic diagram of the solder pot structure in the soldering device for surface-mount bottom terminal components of the present invention;

[0029] Figure 3 This is a schematic diagram of the rotating arm structure in the surface mount bottom terminal component tinning device of the present invention;

[0030] Figure 4 This is a schematic diagram of the height adjustment fixture and gripping fixture in the surface mount bottom terminal component tinning device of the present invention;

[0031] Figure 5 This is a schematic diagram of the soldering fixture in the soldering device for surface-mount bottom terminal components of the present invention;

[0032] Figure 6 This is a schematic diagram of the flux-dipping fixture in the surface mount bottom terminal component tinning device of the present invention. Detailed Implementation

[0033] The following will be combined with the appendix in the embodiments of the present invention. Figure 1 ~Attached Figure 6 The technical solutions, structural features, objectives and effects achieved in the embodiments of the present invention will be described in detail.

[0034] It should be noted that the accompanying drawings are in a very simplified form and use non-precise proportions. They are only used to facilitate and clarify the purpose of illustrating the embodiments of the present invention, and are not intended to limit the implementation conditions of the present invention. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportional relationship, or adjustments to the size should still fall within the scope of the technical content disclosed in the present invention, provided that they do not affect the effects and objectives that the present invention can produce.

[0035] It should be noted that, in this invention, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only the expressly listed elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus.

[0036] This invention provides a soldering device for surface-mount bottom terminal components, such as... Figure 1 As shown, the surface mount bottom terminal component soldering device includes: a soldering worktable 1, on which a solder pot 11 for providing molten solder is provided, and a solder scraper 111 is provided on one side of the solder pot 11; a soldering fixture 3, on which component slots 321 are arranged in an array for supporting components; a rotating arm 2, which is set on the soldering worktable 1 for gripping and moving the soldering fixture 3; a vacuum suction tube 4, the first end of which is connected to a vacuum controller set on the soldering worktable 1, and the second end is connected to the soldering fixture 3, to evacuate the soldering fixture 3 to fix the components in the slots 321; the rotating arm 2 grips the soldering fixture 3 with the components fixed, moves the soldering fixture 3 to the solder pot 11, so that the solder end of the component is dipped in molten solder and then scraped by the solder scraper 111 to smooth the solder end of the component, thus completing the process of dipping and scraping the solder end of the component.

[0037] Among them, such as Figure 1As shown, the tinning workbench 1 is equipped with a control button assembly 12, which includes a first button, a second button, and a third button. The first button is electrically connected to the tin pot 11 and controls the heating of the tin pot 11 to be turned on or off. The second button is also electrically connected to the tin pot 11 and is used to set the heating temperature of the tin pot 11. The third button is connected to a vacuum controller (not shown in the figure) and controls the vacuum controller to be in a vacuum-evacuating or vacuum-breaking state. Specifically, when the vacuum controller is in a vacuum-evacuating state, the vacuum controller evacuates the tinning fixture 3 to fix the components inside the tinning fixture 3. When the vacuum controller is in a vacuum-breaking state, it breaks the vacuum state of the tinning fixture 3 so that the components can be taken out from the tinning fixture 3.

[0038] Among them, such as Figure 1 and Figure 2 As shown, the solder pot 11 extends outward on one side to form a solder scraping platform, and the solder scraping platform is at the same level as the liquid level of the solder in the solder pot 11. The heat generated by heating the solder pot 11 is conducted from the side of the solder scraping platform connected to the solder pot 11 to the solder scraping platform, so that the temperature of the solder scraping platform is consistent with the temperature of the solder pot 11.

[0039] Furthermore, such as Figure 1 and Figure 2 As shown, a squeegee 111 is provided on the squeegee platform, which is fixed to the squeegee platform extending from the solder pot 11 by squeegee fasteners 112 (four sets of bolts are used in this embodiment). The squeegee 111 is made of a tin-plated aluminum alloy plate with high thermal conductivity and a thickness of 2-5 mm. It should be noted that other materials, such as FR4 copper-clad tin-plated board, FR4 copper-clad silver-plated board, and aluminum alloy silver-plated board, can also be used as squeegee 111 if they meet the requirements of flatness, thermal conductivity, and good wetting with solder. By integrating the tin pot 11 with the tin scraping platform, the tin pot 11 combines the functions of tin dipping and tin scraping. Heating the tin pot 11 simultaneously heats the tin scraping platform through heat conduction, thereby improving the efficiency of tin dipping and tin scraping during the tinning process.

[0040] Among them, such as Figure 3As shown, the rotating arm 2 includes a vertical support arm 21 and at least one horizontal support arm. The vertical support arm 21 is vertically mounted on the tinning worktable 1. The first end of the horizontal support arm is connected to the vertical support arm 21, and the second end is equipped with a height adjustment device 24. The horizontal support arm can rotate 180° around the vertical support arm 21 in the horizontal plane. In this embodiment, the rotating arm 2 includes one vertical support arm 21 and two horizontal support arms, namely a first horizontal support arm 22 and a second horizontal support arm 23. The first end of the first horizontal support arm 22 is connected to the vertical support arm 21, and the second end is connected to the second horizontal support arm 23. The second horizontal support arm 23 can rotate 180° around the connection point with the first horizontal support arm 22 in the horizontal plane. The end 231 of the second horizontal support arm 23 that is not connected to the first horizontal support arm 22 is equipped with a height adjustment device 24. By setting multiple horizontal support arms, the working range of the rotating arm 2 is expanded, and the applicability of the rotating arm 2 is improved.

[0041] Furthermore, such as Figure 3 and Figure 4 As shown, the bottom of the height adjustment device 24 is connected to the tooling gripping device 25; the height adjustment device 24 includes: a guide rod with a handle 241 at one end and a first fixing hole at the handleless end for fastening to the tooling gripping device 25 (in this embodiment, the tooling gripping device 25 is fixed in the first fixing hole by screws); a hollow sleeve 244 with a rack and scale on its side wall, and elastic elements connected to the top and bottom respectively (in this embodiment, a spring is used as the elastic element); the guide rod passes through the top spring, the inner tube of the hollow sleeve 244 and the bottom spring in sequence from the top of the hollow sleeve 244 and is thus set inside the hollow sleeve 244; the rack set on the side wall of the hollow sleeve 244 is connected to a knob 243. By adjusting the knob 243, the hollow sleeve 244 with the rack is moved up or down, thereby adjusting the height of the guide rod sleeved inside the hollow sleeve 244, and driving the tooling gripping device 25 to move up or down. Simultaneously, when the hollow sleeve 244 is fixed, applying pressure to the handle 241 at the top of the guide rod allows for temporary adjustment of the height of the tooling gripping device 25. Specifically, when the handle 241 is pressurized, the top spring of the hollow sleeve 244 is compressed, the bottom spring of the hollow sleeve 244 is stretched, the guide rod moves downward, and the tooling gripping device 25 at the bottom of the guide rod moves downward. When the handle 241 is released, i.e., the pressure on the handle 241 is released, the top and bottom springs of the hollow sleeve 244 return to their original shapes, the guide rod moves upward, and the tooling gripping device 25 at the bottom of the guide rod moves upward. Rotating the handle 241 causes the guide rod to rotate, which in turn causes the tooling gripping device 25 to rotate, achieving a 360° rotation of the tooling gripping device.

[0042] Among them, such as Figure 5 As shown, the tinning fixture 3 includes a tinning fixture back plate 31 and a tinning fixture front plate 32. The tinning fixture back plate 31 and the tinning fixture front plate 32 are connected by an interference fit, and the connection is airtight. The front of the tinning fixture back plate 31 is attached to the back of the tinning fixture front plate 32. The back of the tinning fixture back plate 31 is provided with a vacuum interface 311 for connecting to a vacuum suction tube 4, and through the vacuum suction tube 4, it is connected to a vacuum controller set on the tinning worktable 1. The back of the tinning fixture back plate 31 also includes two second fixing holes 313 for connecting to the fixture gripping device 25 (in this embodiment, the tinning fixture 3 and the fixture gripping device 25 are fastened together by screws). Furthermore, the back of the tinning tooling back plate 31 is also provided with four support members 312 (in this embodiment, these are support legs located at the four corners of the back of the tinning tooling back plate 31) to support the entire tinning tooling 3 when the front of the tinning tooling front plate 32 is facing upwards.

[0043] Furthermore, such as Figure 5 As shown, the component slots 321 distributed in the array are set on the front side of the tinning tool front plate 32. The center of the component slot 321 is provided with a vacuum suction hole with a diameter of 3mm. Each vacuum suction hole is connected to the vacuum interface 311. Each component slot is 20×20mm in size, so that it can accommodate components with a size of 4mm to 20mm.

[0044] Among them, such as Figure 1 As shown, the soldering workbench 1 is also equipped with a flux application module 13 and a material feeding platform 14. Specifically, as... Figure 6 As shown, the flux application module 13 includes an array of brushes 131 and a baffle 132 that constrains the brushes 131. In this embodiment, the array of brushes 131 is composed of densely packed pig bristles with a length of 20mm. The baffle 132 is made of metal and divides the brushes 131 into a brush array consistent with the component slots 321 arrayed on the front plate 32 of the soldering fixture. The horizontal height of the top of the brushes 131 is consistent with the horizontal height of the squeegee 111. After flux is added to the flux application module 13, the flux wets the brushes 131 due to the surface tension of the liquid. When the soldering end of the component contacts the flux application module 13 and picks up the flux, the flux is transferred from the brushes 131 to the soldering end of the component. Further, as... Figure 1 As shown, the size of the unloading platform 14 is slightly larger than that of the tinning fixture 3, and the horizontal height of the unloading platform 14 is consistent with the horizontal height of the tin pot 11 and the tin scraper 111.

[0045] It should be noted that when using the surface mount bottom terminal component tinning apparatus provided by this invention to perform the tinning process on components, the following steps are included:

[0046] Step S1: Heat the solder pot 11 to reach the set temperature. Specifically, turn on the power switch of the solder pot 11 using the first button on the soldering workbench 1, and set the temperature of the solder pot 11 to 260℃ using the second button. After the temperature of the solder pot 11 stabilizes (i.e., the temperature of the solder pot 11 reaches and is maintained at 260℃, and at the same time, the solder scraping platform connected to the solder pot 11 also reaches and is maintained at 260℃ through the heat transfer from the solder pot 11), proceed to step S2.

[0047] Step S2, Loading: Place the tinning fixture 3 face up on the unloading platform 14, with the solder ends of the components to be tinned facing upwards (in this embodiment, it is a 10×10mm QFN component, which includes 28 solder ends). Arrange the components in the slot 321 of the tinning fixture 3 directly above the vacuum suction hole. After placement, connect the vacuum suction tube 4 and turn on the vacuum mode through the third button on the tinning worktable 1, so that the components are vacuum-adsorbed in the slot 321. After checking that the components are fixed in the slot and will not fall off, place the tinning fixture 3 face down on the unloading platform 14, drag the handle 241 on the rotating arm 2 to move the fixture gripping device 25 located at the bottom of the guide rod to directly above the tinning fixture 3, and connect the tinning fixture 3 to the fixture gripping device 25 with screws, that is, fix the tinning fixture 3 on the rotating arm 2.

[0048] Step S3, Applying flux: Drag the handle 241 to move the tinning fixture 3 directly above the flux application module 13. Adjust the knob 243 or press down the handle 241 to adjust the height of the fixture gripping device 25 so that the bottom surface of the component (i.e. the component solder end) is in contact with the top of the brush 131. Move the handle 241 back and forth and left and right to move the tinning fixture 3 back and forth and left and right, so that the component solder end on the tinning fixture 3 is evenly coated with flux, thus completing the application of flux to the component solder end.

[0049] Step S4, Soldering: Drag handle 241 to move soldering fixture 3 directly above solder pot 11. Adjust knob 243 or press down handle 241 to lower fixture gripping device 25, immersing the component solder end into the molten solder in solder pot 11 to a depth of 0.3mm, thus soldering the component solder end. Then rotate adjustment knob 243 or release handle 241 to move central control sleeve 244 upward or guide rod upward, thereby driving fixture gripping device 25 upward, so that component solder end is removed from molten solder in solder pot 11.

[0050] Step S5, Soldering: After the components are dipped in solder, drag the handle 241 to move the soldering fixture 3 directly above the solder scraper 111. Adjust the knob 243 to make the solder end of the component flush with the top surface of the solder scraper 111. Drag the handle 241 back and forth and left and right to transfer the solder from the bottom of the component to the solder scraper 111 by scraping. This will make all surfaces of the bottom solder end of the component smooth, so as to achieve a smooth surface of the bottom solder end of the component.

[0051] Step S6, Unloading: Drag handle 241 to transfer the soldering fixture 3 to the unloading platform 14. Adjust knob 243 to make the solder end of the component flush with the unloading platform 14. Then, press the third button on the soldering worktable 1 to put the vacuum control device into a vacuum breaking state, so that the component falls from the soldering fixture 3, completing the component unloading.

[0052] In summary, compared with the existing manual tinning process, the tinning device and process method for surface-mount bottom terminal components provided by the present invention have advantages such as high tinning efficiency, high tinning reliability, and high flatness of the tinned solder ends.

[0053] Although the present invention has been described in detail through the preferred embodiments above, it should be understood that the above description should not be considered as a limitation of the present invention. Various modifications and substitutions to the present invention will be apparent to those skilled in the art after reading the above description. Therefore, the scope of protection of the present invention should be defined by the appended claims.

Claims

1. A device for soldering surface-mount bottom terminal components, characterized in that, include: A tinning workbench (1) is provided with a tin pot (11) for providing molten tin. One side of the tin pot (11) extends outward to form a tin scraping platform, and the tin scraping platform is at the same level as the molten tin in the tin pot (11). The heat generated by heating the tin pot (11) is conducted from the side of the tin scraping platform connected to the tin pot (11) to the tin scraping platform, so that the temperature of the tin scraping platform is consistent with the temperature of the tin pot (11). A tin scraper (111) is provided on the tin scraping platform, and the tin scraper (111) is fixed to the tin scraping platform extending from the tin pot (11) by tin scraper fasteners (112). A tinning fixture (3) has component slots (321) arranged in an array on it for carrying components; the tinning fixture (3) includes a tinning fixture back plate (31) and a tinning fixture front plate (32), the tinning fixture back plate (31) and the tinning fixture front plate (32) are connected by an interference fit, so that the front of the tinning fixture back plate (31) is in contact with the back of the tinning fixture front plate (32), and the connection is airtight; the back of the tinning fixture back plate (31) is provided with a vacuum interface (311). A rotating arm (2) is mounted on the tinning worktable (1) for gripping and moving the tinning fixture (3). The vacuum suction tube (4) has its first end connected to the vacuum controller set on the tinning workbench (1) and its second end connected to the vacuum interface (311) of the tinning fixture back plate (31) to evacuate the tinning fixture (3) so that the components are fixed in the slot (321). The rotating arm (2) grabs the tinning fixture (3) with the components fixed on it, moves the tinning fixture (3) to the tin pot (11), and makes the solder end of the component dip into the tin liquid and then scrape it with the tin scraper (111) to flatten the solder end of the component, thus completing the process of dipping and scraping the solder end of the component.

2. The surface mount bottom terminal component soldering device as described in claim 1, characterized in that, The tin scraper (111) is made of an aluminum alloy plate with high thermal conductivity and tin plating on the surface, and its thickness is 2~5mm; Alternatively, the tin scraper (111) may be composed of FR4 copper-clad tin-plated board, FR4 copper-clad silver-plated board, or aluminum alloy silver-plated board.

3. The surface mount bottom terminal component soldering device as described in claim 1, characterized in that, The rotating arm (2) includes a vertical support arm (21) and at least one horizontal support arm. The vertical support arm (21) is vertically mounted on the tinning workbench (1). The first end of the horizontal support arm is connected to the vertical support arm (21), and the second end is provided with a height adjustment device (24). The horizontal support arm can rotate 180° around the vertical support arm in the horizontal plane.

4. The surface mount bottom terminal component soldering device as described in claim 3, characterized in that, The bottom of the height adjustment device (24) is connected to a tooling gripping device (25); the height adjustment device (24) includes: The guide rod has a handle (241) at one end and a first fixing hole at the handleless end for fastening to the tooling gripping device (25). The hollow sleeve (244) has a rack and scale on its side wall, and elastic elements are connected to the top and bottom respectively; the guide rod passes through the top elastic element, the inner tube of the hollow sleeve (244) and the bottom spring in sequence from the top of the hollow sleeve (244) and is set inside the hollow sleeve (244); The rack set on the side wall of the hollow sleeve (244) is connected to a knob (243). By adjusting the knob (243), the hollow sleeve (244) with the rack is moved up or down, adjusting the height of the guide rod sleeved in the hollow sleeve (244), and driving the tooling gripping device (25) to move up or down.

5. The surface mount bottom terminal component soldering device as described in claim 3, characterized in that, The vacuum interface (311) is used to connect to the vacuum suction tube (4), and the vacuum suction tube (4) is connected to the vacuum controller set on the tinning workbench (1); the back of the tinning fixture back plate (31) also includes two second fixing holes (313) for connecting to the fixture gripping device (25).

6. The surface mount bottom terminal component soldering device as described in claim 5, characterized in that, The component slots (321) distributed in the array are located on the front side of the tinning tool front plate (32). The center of the component slots (321) is provided with vacuum suction holes, and each vacuum suction hole is connected to a vacuum interface (311).

7. The surface mount bottom terminal component soldering device as described in claim 1, characterized in that, The tinning workbench (1) is also equipped with a flux dipping module (13) and a material unloading platform (14). The flux dispensing module (13) includes an array of distributed brushes (131) and baffles (132) that constrain the brushes (131). The baffle (132) is made of metal and divides the brush (131) into a brush array that is consistent with the array of component slots (321). The horizontal height of the tip of the brush (131) is the same as the horizontal height of the tin scraper (111); The size of the unloading platform (14) is larger than that of the tinning fixture (3), and the horizontal height of the unloading platform (14) is consistent with the horizontal height of the tin pot (11) and the tin scraper (111).

8. A method for tinning surface-mount bottom terminal components, characterized in that, The surface-mount bottom terminal component soldering apparatus as described in any one of claims 1 to 7 comprises: Step S1: Heat the tin pot (11) to reach the set temperature to form molten tin. Step S2, Loading: Place the tinning fixture (3) face up on the unloading platform (14), with the solder ends of the components to be tinned facing up, and arrange them in an array above the vacuum suction hole in the slot (321) of the tinning fixture (3). Connect the vacuum suction tube (4) so ​​that the components are vacuum-adsorbed in the slot (321); connect the tinning fixture (3) to the fixture gripping device (25); Step S3, Dipping flux: Move the tinning fixture (3) above the flux dipping module (13), adjust the height of the fixture gripping device (25) so that the solder end of the component is in contact with the top of the brush (131), and move the handle (241) to complete the dipping of flux on the solder end of the component. Step S4, Soldering: Drag the handle (241) to move the soldering fixture (3) above the solder pot (11), adjust the height of the fixture gripping device (25), immerse the soldering end of the component into the molten solder in the solder pot (11) to complete the soldering of the component. Step S5, Soldering: After the components are dipped in solder, move the soldering fixture (3) above the solder scraper (111), adjust the height of the soldering fixture (3) so that the solder end of the component is flush with the top surface of the solder scraper (111), drag the handle (241) so that the solder at the bottom of the component is transferred to the solder scraper (111) by scraping, so as to achieve a flat surface at the bottom of the component. Step S6, Unloading: Transfer the tinning fixture (3) above the unloading platform (14) so ​​that the solder end of the component is flush with the unloading platform (14). Set the vacuum control device to the vacuum breaking state so that the component falls from the tinning fixture (3) and the component unloading is completed.

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