An integrated circuit plastic packaging material grasping device and grasping method

Abstract

The present invention provides a grasping device for integrated circuit plastic packaging materials, which includes a driving member, a mounting plate, a substrate, a wafer dialing and grasping member, and an induction component. The driving member is installed on the mounting plate, the substrate is connected to the driving member, and the driving member drives the substrate to move away from or close to the mounting plate. The wafer dialing and grasping member is installed on the substrate. The wafer dialing and grasping member includes an outer dialing claw and an inner dialing claw. The outer dialing claw and the inner dialing claw are arranged facing each other and are both connected to the driving member. The induction component includes a presence sensor and a positive and negative sensor. The presence sensor is installed on the substrate and is located between the outer dialing claw and the inner dialing claw. The positive and negative sensor is installed on the substrate and can detect whether it corresponds to the through hole of the integrated circuit lead frame wafer. The present invention also provides a method for grasping integrated circuit plastic packaging materials. The present invention can quickly and sensitively sense whether the integrated circuit lead frame wafer is placed reversely, thereby preventing the reversely placed integrated circuit lead frame wafer from being conveyed to the plastic packaging machine.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor electronic product production, and particularly relates to an integrated circuit plastic packaging material grasping device and a grasping method. Background Art

[0002] The lead frame is a chip carrier of an integrated circuit, and according to production requirements, through holes are often provided on the finished product. As shown in Figure 1 an integrated circuit lead frame sheet is shown, which includes a first side and a second side that are opposite to each other, and a plurality of through holes are provided at intervals along the length direction of the edge. After the integrated circuit lead frame sheet is loaded with chips, it needs to be plastic-packaged. The specific operation is to place the integrated circuit lead frame sheet on a plastic-packaging machine for plastic-packaging. In the prior art, there are many grasping mechanisms for grasping the integrated circuit lead frame sheet onto the plastic-packaging machine, but when they are used, the following problems often exist:

[0003] 1. After the integrated circuit lead frame sheet is loaded with chips, there is a distinction between the front side and the back side. Upstream of the grasping mechanism, the integrated circuit lead frame sheet is manually placed for the grasping mechanism to grasp. During manual operation, the integrated circuit lead frame sheet is often placed in the reverse direction. However, the grasping mechanisms in the prior art directly grasp it onto the plastic-packaging machine without being able to distinguish between the front side and the back side of the integrated circuit lead frame sheet, resulting in the plastic-packaging machine being unable to complete the plastic-packaging operation. Therefore, how to enable the grasping mechanism to identify the front side and the back side of the integrated circuit lead frame sheet is the main problem to be solved;

[0004] 2. As shown in Figure 1 epoxy resin is also shown. When plastic-packaging the integrated circuit lead frame sheet, it is often necessary to plastic-package it together with the epoxy resin. The main plastic-packaging form is to plastic-package a row of epoxy resin between two integrated circuit lead frame sheets. The grasping mechanisms in the prior art cannot simultaneously grasp the integrated circuit lead frame sheet and the epoxy resin onto the plastic-packaging machine. At this time, the epoxy resin can only be placed on the plastic-packaging machine manually and then plastic-packaged, resulting in a reduction in plastic-packaging efficiency. Therefore, how to simultaneously grasp the integrated circuit lead frame sheet and the epoxy resin onto the plastic-packaging machine is another problem to be solved. Summary of the Invention

[0005] The present invention aims to solve at least one of the above-mentioned technical problems, and provides an integrated circuit plastic packaging material grasping device and a grasping method, which can quickly and sensitively sense whether the integrated circuit lead frame sheet is placed in the reverse direction, thereby preventing the integrated circuit lead frame sheet placed in the reverse direction from being conveyed to the plastic-packaging machine.

[0006] To achieve the above object, the technical solution adopted by the present invention is:

[0007] An integrated circuit plastic packaging material grabbing device includes a driving member, a mounting plate, a substrate, a wafer picking and grasping member, and an induction component. The driving member is installed on the mounting plate, the substrate is connected to the driving member, and the driving member drives the substrate to move away from or close to the mounting plate. The wafer picking and grasping member is installed on the substrate. The wafer picking and grasping member includes an outer claw and an inner claw. The outer claw and the inner claw are arranged facing each other and are both connected to the driving member. The driving member drives the outer claw and the inner claw to move towards or away from each other. The induction component includes a presence sensor and a positive and negative sensor. The presence sensor is installed on the substrate and is located between the outer claw and the inner claw. The positive and negative sensor is installed on the substrate and can detect whether it corresponds to the through hole of the integrated circuit lead frame piece.

[0008] Further, the wafer picking and grasping member further includes an outer moving rod and an inner moving rod. The outer moving rod and the inner moving rod are arranged adjacent to each other on the substrate. The outer claw is arranged on the outer moving rod and is provided with a grasping opening facing the inner moving rod and cooperating with one side edge of the integrated circuit lead frame piece. The inner claw is arranged on the inner moving rod and extends along the width direction of the substrate. The inner claw is provided with a grasping opening cooperating with the other side edge of the integrated circuit lead frame piece. The outer claw is connected to the driving member through the outer moving rod, and the inner claw is connected to the driving member through the inner moving rod.

[0009] Further, the wafer picking and grasping member further includes a pressure plate. The pressure plate is located on the side away from the substrate and the pressure plate can move away from or close to the substrate. The pressure plate is provided with avoidance openings corresponding to the outer claw and the inner claw. The pressure plate is provided with passing openings corresponding to the presence sensor and the positive and negative sensor.

[0010] Further, the number of the wafer picking and grasping members is two. The two wafer picking and grasping members are arranged at intervals along the width direction of the substrate and are installed on the substrate. The number of the induction components is two groups. One group of the induction components is arranged corresponding to one wafer picking and grasping member. The driving member includes a grasping cylinder and two linkage rods. One end of one linkage rod is connected to one end of the outer moving rod of one wafer picking and grasping member and one end of the inner moving rod of the other wafer picking and grasping member. The grasping cylinder is connected to the outer moving rod and the inner moving rod in one of the wafer picking and grasping members.

[0011] Further, the integrated circuit plastic encapsulation material grasping mechanism further includes a resin clamping member, which is adjacent to the sheet dialing and grasping member; the resin clamping member includes two clamping portions, and the two clamping portions are spaced on the substrate; each clamping portion includes a moving rod and a claw, the moving rod is installed on the substrate and connected to the driving member, the driving member can drive the two moving rods to move towards or away from each other, and the claw is arranged on the moving rod and has a grasping opening facing the other claw.

[0012] Further, the resin clamping member includes a pressing bar, which is located between the two clamping portions and can move towards or away from the substrate, and a photoelectric sensor is arranged on the pressing bar.

[0013] Further, it further includes a control system, and the control system includes a first occlusion induction module, a penetration induction module, a second occlusion induction module, a host computer and a control module.

[0014] The first occlusion induction module is connected to the presence sensor and is used to collect the induction data of the presence sensor.

[0015] The penetration induction module is connected to the front and back sensor and is used to collect the induction data of the front and back sensor.

[0016] The second occlusion induction module is connected to the photoelectric sensor and is used to collect the induction data of the photoelectric sensor.

[0017] The host computer is connected to the first occlusion induction module, the penetration induction module and the second occlusion induction module, and the host computer is used to synthesize the induction data of the first occlusion induction module, the penetration induction module and the second occlusion induction module and generate a control instruction.

[0018] The control module is connected to the host computer and the driving member, and the control module is used to receive the control instruction from the host computer and control the driving member to complete the operation.

[0019] Further, the control system further includes a second occlusion induction module.

[0020] The second occlusion induction module is connected to the photoelectric sensor and is used to collect the induction data of the photoelectric sensor.

[0021] The second occlusion induction module is connected to the host computer, and the host computer combines the induction data of the first occlusion induction module, the penetration induction module and the second occlusion induction module and generates a control instruction.

[0022] Further, the driving member includes a substrate cylinder, a material grasping cylinder, a resin cylinder and a resin pressing cylinder.

[0023] The substrate cylinder is connected to both the substrate and the control module, and the control module controls the substrate cylinder to drive the substrate to move away from or closer to the mounting plate;

[0024] The material grasping cylinder is connected to the control module. The outer claw is connected to the material grasping cylinder through the outer moving rod, and the inner claw is connected to the material grasping cylinder through the inner moving rod. The control module controls the material grasping cylinder to drive the outer moving rod and the inner moving rod to move towards or away from each other;

[0025] The resin cylinder is connected to the moving rods of both clamping parts, and the control module controls the resin cylinder to drive the two moving rods to move towards or away from each other;

[0026] The resin pressing cylinder is connected to both the pressing strip and the control module, and the control module controls the resin pressing cylinder to drive the pressing strip to move towards or away from the substrate.

[0027] A method for grasping an integrated circuit plastic packaging material, comprising the following steps:

[0028] Providing a device: providing the above-mentioned integrated circuit plastic packaging material grasping device;

[0029] Substrate in place: The control module controls the substrate cylinder to drive the substrate to move away from the mounting plate;

[0030] Induction of presence or absence of the material sheet: The presence or absence sensor is blocked by the integrated circuit lead frame sheet and generates a signal indicating the presence of the material. The presence or absence sensor feeds back the signal indicating the presence of the material to the first occlusion sensing module. At this time, the control module controls the substrate cylinder to stop moving;

[0031] Induction of correct or incorrect placement: If the through sensor penetrates the through hole, based on the signal indicating the presence of the material, the through sensing module generates a signal indicating correct placement; if the through sensor does not penetrate the through hole, the through sensing module cannot generate a signal indicating correct placement and generates an alarm signal;

[0032] Grasping the material sheet: Based on the signal indicating correct placement, the control module controls the material grasping cylinder to drive the outer moving rod and the inner moving rod to move towards each other. At this time, the outer claw and the inner claw grasp the integrated circuit lead frame sheet;

[0033] Induction of presence or absence of resin: The control module controls the resin pressing cylinder to drive the pressing strip to move away from the substrate. When the photoelectric sensor contacts the epoxy resin, a signal indicating the presence of resin is generated. The photoelectric sensor feeds back the signal indicating the presence of resin to the second occlusion sensing module;

[0034] Resin grasping: Based on the fat signal, the control module controls the resin cylinder to drive the two moving rods to move towards each other, and thus the epoxy resin can be grasped.

[0035] Encapsulant movement: Based on the correct-placement signal and the fat signal, the control module controls the substrate cylinder to drive the substrate to move towards the mounting plate.

[0036] Due to the adoption of the above technical solutions, the present invention has the following beneficial effects:

[0037] By combining the presence sensor and the positive / negative sensor arranged at the through-hole position of the integrated circuit lead frame sheet, it is possible to quickly and sensitively sense whether the integrated circuit lead frame sheet is placed in the wrong direction, thereby preventing the integrated circuit lead frame sheet placed in the wrong direction from being conveyed to the plastic encapsulation machine.

[0038] It is possible to grasp the integrated circuit lead frame sheet and the epoxy resin simultaneously, and the substrate moves towards the mounting plate only after the correct-placement signal and the fat signal, which can ensure that the plastic encapsulation finished product contains both the integrated circuit lead frame sheet and the epoxy resin. Description of the Drawings

[0039] Figure 1 Schematic structural diagram of an integrated circuit lead frame sheet and an epoxy resin.

[0040] Figure 2 Schematic structural diagram of the material being clamped by the integrated circuit plastic encapsulation material grasping device.

[0041] Figure 3 For Figure 2 Schematic structural diagram of the integrated circuit plastic encapsulation material grasping device in

[0042] Figure 4 For Figure 3 Partial exploded view of

[0043] Figure 5 For Figure 4 Enlarged view at A in

[0044] Figure 6 For Figure 3 Schematic back structure diagram of

[0045] Figure 7 For Figure 6 Schematic structure diagram after hiding the substrate in

[0046] Figure 8 For Figure 6 Partial exploded view of

[0047] Figure 9 Schematic control diagram of the control system.

[0048] Figure 10 It is a schematic flow diagram of a method for grasping integrated circuit plastic packaging materials.

[0049] In the attached drawings, 100 - integrated circuit lead frame sheet, 101 - first side, 102 - second side, 103 - through hole, 104 - epoxy resin, 1 - driving member, 11 - frame, 12 - linkage rod, 13 - substrate cylinder, 14 - material grasping cylinder, 15 - resin cylinder, 16 - resin pressing cylinder, 2 - mounting plate, 3 - substrate, 31 - mounting sleeve, 32 - guiding shaft, 4 - material sheet dialing and grasping member, 41 - outer dialing claw, 411 - outer vertical rod, 412 - outer horizontal rod, 42 - inner dialing claw, 421 - inner long rod, 422 - inner vertical rod, 423 - inner horizontal rod, 43 - outer moving rod, 44 - inner moving rod, 45 - material pressing plate, 451 - avoiding opening, 452 - supplying opening, 46 - connecting cylinder rod, 5 - presence / absence sensor, 6 - forward / backward sensor, 7 - clamping portion, 71 - moving rod, 711 - moving groove, 72 - grasping claw, 721 - vertical connecting block, 722 - triangular block, 73 - driving rod, 8 - pushing bar, 9 - photoelectric sensor, 200 - control system, 201 - first occlusion induction module, 202 - penetration induction module, 203 - second occlusion induction module, 204 - host computer, 205 - control module. Specific embodiments

[0050] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0051] It should be noted that when a component is referred to as being "fixed to" another component, it can be directly on the other component or there can also be an intermediate component. When a component is considered to be "disposed on" another component, it can be directly disposed on the other component or there may be an intermediate component at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are only for the purpose of illustration.

[0052] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which this invention belongs. The terms used herein in the description of the present invention are only for the purpose of describing specific embodiments and do not limit the present invention only. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0053] Such as Figures 2 to 7As shown in the figure, a preferred embodiment of the present invention provides an integrated circuit plastic packaging material grasping device, which is used to grasp an integrated circuit lead frame sheet 100 and an epoxy resin 104 simultaneously. It includes an integrated circuit plastic packaging material grasping mechanism and a mounting plate 2, and the integrated circuit plastic packaging material grasping mechanism is installed on the mounting plate 2.

[0054] The integrated circuit plastic packaging material grasping mechanism includes a driving member 1, a substrate 3, a sheet material dialing and grasping member 4, and an induction component. The driving member 1 is installed on the mounting plate 2, and the substrate 3 is connected to the driving member 1. Specifically, the driving member 1 includes a substrate cylinder 13. The substrate cylinder 13 uses a cylinder with the brand of SMC and the model of CQS25-40. The substrate cylinder 13 is installed on the mounting plate 2 and connected to the substrate 3. In detail, a frame 11 is installed on one side of the substrate 3 facing the mounting plate 2, and the frame 11 is connected to the mounting plate 2. The substrate cylinder 13 drives the substrate 3 to move away from or close to the mounting plate 2. The sheet material dialing and grasping member 4 is installed on the substrate 3. The sheet material dialing and grasping member 4 includes an outer dialing claw 41 and an inner dialing claw 42. The outer dialing claw 41 and the inner dialing claw 42 are arranged facing each other and are both connected to the driving member 1. The driving member 1 drives the outer dialing claw 41 and the inner dialing claw 42 to move towards or away from each other. The induction component includes a presence sensor 5 and a positive and negative sensor 6. The presence sensor 5 is installed on the substrate 3 and is located between the outer dialing claw 41 and the inner dialing claw 42. The positive and negative sensor 6 is installed on the substrate 3 and can detect whether it corresponds to the through hole 103 of the integrated circuit lead frame sheet 100. Specifically, the number of the presence sensors 5 is one, and its installation position corresponds to the partition between any two through holes 103 of the integrated circuit lead frame sheet 100, so that the partition can completely block the presence sensor 5; the number of the positive and negative sensors 6 is two, and the two positive and negative sensors 6 correspond to any two through holes 103 of the integrated circuit lead frame sheet 100, and the positive and negative sensor 6 can pass through the through hole 103; one of the positive and negative sensors 6 is adjacent to the presence sensor 5; both the presence sensor 5 and the positive and negative sensor 6 use a miniature photoelectric sensor with the brand of 0MRON and the model of EE-SX670. Among them, the sensing needle of the positive and negative sensor 6 is higher than the sensing needle of the presence sensor 5, so that the positive and negative sensor 6 can penetrate the through hole 103 when the partition between the two through holes 103 on the integrated circuit lead frame sheet 100 completely blocks the presence sensor 5.

[0055] In this embodiment, the sheet gripper 4 further includes an outer moving rod 43 and an inner moving rod 44. The outer moving rod 43 and the inner moving rod 44 are arranged adjacent to each other on the substrate 3. Specifically, the outer moving rod 43 and the inner moving rod 44 are arranged at intervals along the width direction of the substrate 3, and both the outer moving rod 43 and the inner moving rod 44 extend along the length direction of the substrate 3. The outer gripper 41 is arranged on the outer moving rod 43 and has a gripping opening facing the inner moving rod 44. Specifically, the outer gripper 41 includes an outer vertical rod 411 and two outer cross rods 412. The outer vertical rod 411 is connected to the outer moving rod 43, and the two outer cross rods 412 are arranged at intervals along the length direction of the outer vertical rod 411, and one end of each of the two outer cross rods 412 is connected to the outer vertical rod 411 to form a gripping opening capable of cooperating with one side edge of the integrated circuit lead frame sheet 100.

[0056] The inner gripper 42 is arranged on the inner moving rod 44 and extends along the width direction of the substrate 3. The inner gripper 42 is provided with a gripping opening for cooperating with the other side edge of the integrated circuit lead frame sheet 100. Specifically, the inner gripper 42 includes an inner long rod 421, an inner vertical rod 422, and two inner cross rods 423. One end of the inner long rod 421 is connected to the inner moving rod 44 and extends in a direction away from the outer moving rod 43. One end of the inner vertical rod 422 is connected to the end of the inner long rod 421 that faces away from the inner moving rod 44. The two inner cross rods 423 are arranged at intervals along the length direction of the inner vertical rod 422, and one end of each of the two inner cross rods 423 is connected to the inner vertical rod 422 to form the gripping opening of the inner gripper 42.

[0057] The outer gripper 41 is connected to the driving member 1 through the outer moving rod 43, and the inner gripper 42 is connected to the driving member 1 through the inner moving rod 44. Specifically, the driving member 1 includes a gripping cylinder 14. The outer moving rod 43 and the inner moving rod 44 are connected to the same gripping cylinder 14. The gripping cylinder 14 drives the outer moving rod 43 and the inner moving rod 44 to move towards or away from each other. When the outer moving rod 43 and the inner moving rod 44 move towards each other, the outer gripper 41 and the inner gripper 42 move towards each other and can grip the integrated circuit lead frame sheet 100. When the outer moving rod 43 and the inner moving rod 44 move away from each other, the outer gripper 41 and the inner gripper 42 move away from each other and can release the integrated circuit lead frame sheet 100.

[0058] The outer moving rod 43 and the inner moving rod 44 are arranged adjacent to each other. Therefore, a single cylinder can drive the outer moving rod 43 and the inner moving rod 44 to move, making the layout of the entire mechanism more compact and saving the installation space for the entire mechanism.

[0059] In this embodiment, a groove is provided on the side of the substrate 3 facing away from the mounting plate 2, and the sheet material grabbing member 4 is installed in the groove. The number of the sheet material grabbing members 4 is two, and the two sheet material grabbing members 4 are arranged at intervals along the width direction of the substrate 3 and installed on opposite sides of the substrate 3. The outer moving rod 43 is located on the side of the inner moving rod 44 facing away from the other sheet material grabbing member 4, and the grasping opening of the inner claw 42 is provided at one end of the inner claw 42 facing away from the corresponding outer moving rod 43. The number of the induction components is two groups, and one group of induction components is provided in each sheet material grabbing member 4. The induction components in the two sheet material grabbing members 4 are arranged diagonally in the groove for sensing an integrated circuit lead frame sheet 100 placed face up and an integrated circuit lead frame sheet 100 placed face down. The driving member 1 includes two linkage rods 12. One end of the outer moving rod 43 of one sheet material grabbing member 4 and one end of the inner moving rod 44 of the other sheet material grabbing member 4 are connected to opposite ends of one of the linkage rods 12, and one end of the inner moving rod 44 of one sheet material grabbing member 4 and one end of the outer moving rod 43 of the other sheet material grabbing member 4 are connected to opposite ends of the other linkage rod 12. A material grabbing cylinder 14 is connected to the outer moving rod 43 and the inner moving rod 44 in one of the sheet material grabbing members 4. Specifically, connecting rods 46 are respectively provided on the outer moving rod 43 and the inner moving rod 44 in one of the sheet material grabbing members 4, and the two connecting rods 46 are connected to the same material grabbing cylinder 14.

[0060] When the material grabbing cylinder 14 drives the outer moving rod 43 and the inner moving rod 44 in one of the sheet material grabbing members 4 to move towards each other through the two connecting rods 46, the outer moving rod 43 and the inner moving rod 44 in the other sheet material grabbing member 4 will also move towards each other. During this process, the two sheet material grabbing members 4 can respectively grab the integrated circuit lead frame sheet 100 placed face up and the integrated circuit lead frame sheet 100 placed face down. It can be seen that by connecting the outer moving rod 43 and the inner moving rod 44 in the two sheet material grabbing members 4 through the linkage rod 12 and combining the structure of the inner claw 42, when the material grabbing cylinder 14 drives the outer moving rod 43 and the inner moving rod 44 of one sheet material grabbing member 4 to move, the outer moving rod 43 and the inner moving rod 44 of the other sheet material grabbing member 4 can move simultaneously, so that the two sheet material grabbing members 4 can simultaneously grab the two integrated circuit lead frame sheets 100 placed face up and face down, which not only improves the efficiency but also saves the installation space of the whole structure.

[0061] In this embodiment, the material sheet grasping member 4 further includes a material pressing plate 45, which is located at a side away from the substrate 3 and can move in a direction away from or close to the substrate 3. Specifically, the material sheet grasping member 4 further includes a compression spring, which is not shown in the figure. One end of the compression spring is connected to the substrate 3, and the other end of the compression spring is connected to the material pressing plate 45. When the material pressing plate 45 touches the integrated circuit lead frame sheet 100, the compression spring is compressed, and the material pressing plate 45 moves in a direction close to the substrate 3, which can play a buffering role in the process of the substrate 3 moving toward the integrated circuit lead frame sheet 100. When the integrated circuit lead frame sheet 100 is separated from the material sheet grasping member 4, the compression spring is retracted, and the material pressing plate 45 moves in a direction away from the substrate 3. The material pressing plate 45 is provided with an avoidance opening 451 corresponding to the outer claw 41 and the inner claw 42; the material pressing plate 45 is provided with a supply opening 452 corresponding to the presence sensor 5 and the positive and negative sensors 6. When the pressing plate 45 presses the integrated circuit lead frame sheet 100 , the integrated circuit lead frame sheet 100 in a thin sheet shape is pressed as a whole and becomes flat, which is more convenient for the outer claws 41 and the inner claws 42 to grasp it.

[0062] In this embodiment, the integrated circuit plastic packaging material grabbing mechanism further includes a resin clamping member, which is adjacent to the sheet grabbing member 4, and specifically, the resin clamping member is located between two sheet grabbing members 4. The resin clamping member includes two clamping parts 7, and the two clamping parts 7 are arranged on the substrate 3 at intervals, and specifically, the two clamping parts 7 are arranged at intervals along the width direction of the substrate 3. The clamping part 7 includes a moving rod 71 and a gripper 72. The moving rod 71 extends along the length direction of the substrate 3. The moving rod 71 is installed on the substrate 3 and connected to the driving member 1. The driving member 1 can drive the two moving rods 71 ​​to move toward or away from each other. Specifically, the moving rods 71 ​​of the two clamping parts 7 penetrate the substrate 3 and extend a driving rod 73 respectively. The driving rod 73 penetrates to the side of the substrate 3 away from the sheet grabber 4 and extends to the edge of the substrate 3 along the width direction of the substrate 3. The driving member 1 includes a resin cylinder 15. The resin cylinder 15 adopts a cylinder with a brand of SMC and a model of CQS25-40. The resin cylinder 15 connects the two moving rods 71 ​​and drives the two moving rods 71 ​​to move toward or away from each other. The moving rod 71 is provided with a moving groove 711 for the inner long rod 421 to move. When the resin cylinder 15 drives the two moving rods 71 ​​to move toward each other, the two grippers 72 can grab the epoxy resin 104 ; when the resin cylinder 15 drives the two moving rods 71 ​​to move away from each other, the two grippers 72 can release the epoxy resin 104 .

[0063] The gripper 72 is provided on the moving rod 71 and has a gripping opening facing the other gripper 72. Specifically, the gripper 72 includes a vertical connecting block 721 and two triangular blocks 722. The triangular cross-sections of the two triangular blocks 722 are isosceles triangles. One end of the vertical connecting block 721 is connected to the moving rod 71, and the two triangular blocks 722 are spaced apart and arranged facing each other at the end of the vertical connecting block 721 facing away from the moving rod 71. Specifically, the bases of the isosceles triangles are arranged facing each other to form the gripping opening of the gripper 72. The gripping opening of the gripper 72 is composed of two triangular blocks 722, and the epoxy resin 104 is in a cylindrical shape. When gripping epoxy resins 104 of different sizes, the surfaces corresponding to the bases of the two triangular blocks 722 can contact and fit with the outer wall of the epoxy resin 104, so that the adaptable gripper 72 can grip epoxy resins 104 of different sizes.

[0064] In this embodiment, the resin clamping member includes a pressing strip 8. The pressing strip 8 is located between the two clamping portions 7 and the pressing strip 8 can move towards or away from the substrate 3. Specifically, the driving member 1 includes a resin pressing cylinder 16. The resin pressing cylinder 16 is connected to the pressing strip 8, and the resin pressing cylinder 16 drives the pressing strip 8 to move towards or away from the substrate 3. A photoelectric sensor 9 is provided on the pressing strip 8. The photoelectric sensor 9 is a miniature photoelectric sensor with the brand 0MRON and the model EE-SX470. When the resin pressing cylinder 16 drives the pressing strip 8 to move away from the substrate 3, the pressing strip 8 presses against the epoxy resin 104, and the photoelectric sensor 9 can sense the epoxy resin 104 to provide the whole device to judge the timing of gripping the epoxy resin 104.

[0065] In this embodiment, the integrated circuit plastic encapsulation material gripping mechanism further includes two sets of mounting kits. The two sets of mounting kits are provided at opposite ends of the substrate 3. The mounting kit includes a mounting sleeve 31 and a guide shaft 32. The mounting sleeve 31 is mounted on the substrate 3, and the guide shaft 32 is arranged through the mounting sleeve 31. Opposite ends of the guide shaft 32 are connected to opposite sides of the substrate 3. The outer moving rod 43, the inner moving rod 44 and the moving rod 71 of the two clamping portions 7 are mounted on the substrate 3 through the guide shaft 32. Specifically, one ends of the outer moving rod 43, the inner moving rod 44 and the moving rod 71 of the two clamping portions 7 are all slidably sleeved on a guide shaft 32. Among them, the mounting sleeve 31 is located between the moving rods 71 of the two clamping portions 7. The arrangement of the guide shaft 32 can guide the movement of the outer moving rod 43, the inner moving rod 44 and the moving rod 71 of the two clamping portions 7.

[0066] In this embodiment, referring to Figure 8 , the integrated circuit plastic encapsulation material gripping mechanism includes a control system 200. The control system 200 includes a first occlusion sensing module 201, a penetration sensing module 202, a second occlusion sensing module 203, a host computer 204 and a control module 205.

[0067] The first occlusion sensing module 201 is connected to the presence sensor 5 and is used to collect the sensing data of the presence sensor 5;

[0068] The penetration sensing module 202 is connected to the front and back sensor 6 and is used to collect the sensing data of the front and back sensor 6;

[0069] The second occlusion sensing module 203 is connected to the photoelectric sensor 9 and is used to collect the sensing data of the photoelectric sensor 9;

[0070] The host computer 204 is connected to the first occlusion sensing module 201, the penetration sensing module 202, and the second occlusion sensing module 203. The host computer 204 is used to synthesize the sensing data of the first occlusion sensing module 201, the penetration sensing module 202, and the second occlusion sensing module 203 and generate a control instruction;

[0071] The control module 205 is connected to the host computer 204 and the driving member 1. Specifically, the substrate cylinder 13, the material grasping cylinder 14, the resin cylinder 15, and the resin pressing cylinder 16 are all connected to the control module 205. The control module 205 is used to receive the control instruction from the host computer 204 and control the driving member 1 to complete the operations of the corresponding components. Specifically, the control module 205 is used to control the operations of the substrate cylinder 13, the material grasping cylinder 14, the resin cylinder 15, and the resin pressing cylinder 16.

[0072] This embodiment further provides a method for grasping integrated circuit plastic packaging materials, which is used to grasp the integrated circuit lead frame sheet 100 and the epoxy resin 104 that have been placed upstream in production. In the upstream production, the placed integrated circuit lead frame sheet 100 and the epoxy resin 104 are shown in Figure 1 , specifically, two front and back integrated circuit lead frame sheets 100 and a row of epoxy resins 104 located between the two integrated circuit lead frame sheets 100, as shown in Figure 9 , including the following steps:

[0073] Provide the device: Provide the above-mentioned integrated circuit plastic packaging material grasping device;

[0074] Substrate in place: The control module 205 controls the substrate cylinder 13 to drive the substrate 3 to move away from the mounting plate 2, the compression spring is compressed, and the pressure plate 45 presses against the integrated circuit lead frame sheet 100;

[0075] Induction of the material sheet: Whether the presence / absence sensor 5 is completely blocked by the integrated circuit lead frame sheet 100 to generate a signal indicating the presence of the material. The presence / absence sensor 5 feeds back the signal indicating the presence of the material to the first occlusion induction module 201. At this time, the control module 205 controls the substrate cylinder 13 to stop moving. Since it has been confirmed upstream in production that the integrated circuit lead frame sheet 100 is placed properly, when the presence / absence sensor 5 does not sense the integrated circuit lead frame sheet 100, the control module 205 will control the substrate cylinder 13 to continue driving the substrate 3 to move away from the mounting plate 2 until the absence sensor 5 senses the integrated circuit lead frame sheet 100;

[0076] Induction of whether it is placed in the wrong direction: If the front / back sensor 6 penetrates the through-hole 103, based on the signal indicating the presence of the material, the penetration induction module 202 generates a signal indicating it is placed correctly. If the front / back sensor 6 does not penetrate the through-hole 103, the penetration induction module 202 cannot generate a signal indicating it is placed correctly and generates an alarm signal. At this time, the operator adjusts the front / back direction of the integrated circuit lead frame sheet 100 according to the alarm signal;

[0077] Grasping of the material sheet: The host computer 204 issues a control command to the control module 205 based on the signal indicating it is placed correctly. The control module 205 controls the gripper cylinder 14 to drive the outer moving rod 43 and the inner moving rod 44 to move towards each other. Specifically, when the gripper cylinder 14 drives the outer moving rod 43 and the inner moving rod 44 in a material sheet gripper 4 to move towards each other through two connecting cylinder rods 46, the outer moving rod 43 and the inner moving rod 44 in the other material sheet gripper 4 will also move towards each other. During this process, the outer gripper 41 and the inner gripper 42 in the same material sheet gripper 4 move towards each other. Then, the outer claws 41 and the inner claws 42 of one material sheet gripper 4 grasp the integrated circuit lead frame sheet 100 placed face-up, and the outer claws 41 and the inner claws 42 of the other material sheet gripper 4 grasp the integrated circuit lead frame sheet 100 placed face-down;

[0078] Induction of the presence / absence of resin: The control module 205 controls the resin pressing cylinder 16 to drive the pressing strip 8 to move away from the substrate 3. When the photoelectric sensor 9 senses the epoxy resin 104, it generates a signal indicating the presence of resin. The photoelectric sensor 9 feeds back the signal indicating the presence of resin to the second occlusion induction module 203. Since it has been confirmed upstream in production that the epoxy resin 104 is placed properly, when the photoelectric sensor 9 does not sense the epoxy resin 104, the control module 205 will control the resin pressing cylinder 16 to continue driving the pressing strip 8 to move away from the substrate 3 until the photoelectric sensor 9 senses the epoxy resin 104;

[0079] Grasping of the resin: The host computer 204 issues a control command to the control module 205 based on the signal indicating the presence of resin. The control module 205 controls the resin cylinder 15 to drive two moving rods 71 to move towards each other, then the claws 72 of the two clamping parts 7 move towards each other, and thus the epoxy resin 104 is grasped;

[0080] Encapsulant movement: The host computer 204 issues a control instruction to the control module 205 based on the signal of correct placement and the signal of having resin, and the control module 205 controls the substrate cylinder 13 to drive the substrate 3 to move towards the direction close to the mounting plate 2.

[0081] When using the integrated circuit plastic encapsulation material grasping device to grasp the integrated circuit lead frame sheet 100 and the epoxy resin 104, the beneficial effects are as follows:

[0082] First, by combining the presence of the inductor 5 and the positive and negative inductor 6 at the position of the through hole 103 of the integrated circuit lead frame sheet 100, it is possible to quickly and sensitively sense whether the integrated circuit lead frame sheet 100 is placed in the reverse direction, thereby preventing the reversely placed integrated circuit lead frame sheet 100 from being conveyed to the plastic encapsulation machine.

[0083] Second, it is possible to grasp the integrated circuit lead frame sheet 100 and the epoxy resin 104 simultaneously, and the substrate 3 moves towards the mounting plate 2 only after receiving the signal of correct placement and the signal of having resin, which can ensure that the plastic encapsulated product contains both the integrated circuit lead frame sheet 100 and the epoxy resin 104.

[0084] It can be understood that the sensing components in the two material sheet grabbing members 4 are not limited to the diagonal arrangement in the groove in this embodiment. In other embodiments, the sensing components in the two material sheet grabbing members 4 can be arranged along the width direction of the substrate 3 to sense two integrated circuit lead frame sheets 100 placed face up or face down.

[0085] The above description is a detailed description of the preferred and feasible embodiments of the present invention, but the embodiments are not intended to limit the scope of the patent application of the present invention. Any equivalent changes or modifications made under the technical spirit disclosed by the present invention shall fall within the scope of the patent covered by the present invention.

Claims

1. An integrated circuit plastic encapsulation material grasping device, characterized in that: It includes a driving member (1), a mounting plate (2), a substrate (3), a sheet material picking and grasping member (4), an induction component, a resin clamping member, and a control system (200). The driving member (1) is installed on the mounting plate (2). The substrate (3) is connected to the driving member (1), and the driving member (1) drives the substrate (3) to move in a direction away from or close to the mounting plate (2). The sheet material picking and grasping member (4) is installed on the substrate (3). The sheet material picking and grasping member (4) includes an outer claw (41) and an inner claw (42). The outer claw (41) and the inner claw (42) are arranged facing each other and are both connected to the driving member (1). The driving member (1) drives the outer claw (41) and the inner claw (42) to move towards or away from each other. The induction component includes a presence sensor (5) and a forward and reverse sensor (6). The presence sensor (5) is installed on the substrate (3) and is located between the outer claw (41) and the inner claw (42). The forward and reverse sensor (6) is installed on the substrate (3) and can detect whether it corresponds to the through hole (103) of the integrated circuit lead frame sheet (100). The resin clamping member is adjacent to the sheet material picking and grasping member (4). The resin clamping member includes two clamping parts (7) and a pressing bar (8). The two clamping parts (7) are spaced apart and arranged on the substrate (3). The clamping part (7) includes a moving rod (71) and a claw (72). The moving rod (71) is installed on the substrate (3) and is connected to the driving member (1). The pressing bar (8) is located between the two clamping parts (7), and the pressing bar (8) can move towards or away from the substrate (3). A photoelectric sensor (9) is provided on the pressing bar (8). The control system (200) includes a first occlusion induction module (201), a penetration induction module (202), a second occlusion induction module (203), a host computer (204), and a control module (205). The first occlusion induction module (201) is connected to the presence sensor (5). The penetration induction module (202) is connected to the forward and reverse sensor (6). The second occlusion induction module (203) is connected to the photoelectric sensor (9). The control module (205) controls the grease pressing cylinder (16) to drive the pressing bar (8) to move away from the substrate (3). When the photoelectric sensor (9) contacts the epoxy resin, a grease signal is generated, and the photoelectric sensor (9) feeds back the grease signal to the second occlusion induction module (203).

2. The integrated circuit plastic encapsulation material grasping device according to claim 1, wherein: The sheet material gripping member (4) further includes an outer moving rod (43) and an inner moving rod (44). The outer moving rod (43) and the inner moving rod (44) are adjacently arranged on the substrate (3). The outer claw (41) is arranged on the outer moving rod (43) and is provided with a gripping opening facing the inner moving rod (44) and adapted to cooperate with one side edge of the integrated circuit lead frame sheet (100). The inner claw (42) is arranged on the inner moving rod (44) and extends along the width direction of the substrate (3). The inner claw (42) is provided with a gripping opening adapted to cooperate with the other side edge of the integrated circuit lead frame sheet (100). The outer claw (41) is connected to the driving member (1) through the outer moving rod (43), and the inner claw (42) is connected to the driving member (1) through the inner moving rod (44).

3. The integrated circuit plastic encapsulation material grasping device according to claim 2, wherein: The sheet material gripping member (4) further includes a pressure plate (45). The pressure plate (45) is located on the side away from the substrate (3) and can move in a direction away from or close to the substrate (3). The pressure plate (45) is provided with avoidance openings (451) corresponding to the outer claw (41) and the inner claw (42). The pressure plate (45) is provided with passing openings (452) corresponding to the presence / absence sensor (5) and the positive / negative sensor (6).

4. An integrated circuit plastic encapsulation material grasping device as described in claim 2 or claim 3, characterized in that: The number of the sheet material gripping members (4) is two. The two sheet material gripping members (4) are arranged at intervals along the width direction of the substrate (3) and are installed on the substrate (3). The number of the induction components is two groups. One group of the induction components is arranged corresponding to one sheet material gripping member (4). The driving member (1) includes a material gripping cylinder (14) and two linkage rods (12). Opposite ends of one linkage rod (12) are connected to one end of the outer moving rod (43) of one sheet material gripping member (4) and one end of the inner moving rod (44) of the other sheet material gripping member (4). The material gripping cylinder (14) is connected to the outer moving rod (43) and the inner moving rod (44) in one of the sheet material gripping members (4).

5. The integrated circuit plastic encapsulation material grasping device according to claim 3, wherein: The driving member (1) can drive the two moving rods (71) to move towards or away from each other. The claw (72) is arranged on the moving rod (71) and is provided with a gripping opening facing the other claw (72).

6. The integrated circuit plastic encapsulation material gripping device according to claim 5, characterized in that: The first occlusion induction module (201) is used to collect the induction data of the presence / absence sensor (5). The penetration induction module (202) is used to collect the induction data of the positive / negative sensor (6). The second occlusion induction module (203) is used to collect the induction data of the photoelectric sensor (9). The upper computer (204) is connected to the first occlusion induction module (201), the penetration induction module (202), and the second occlusion induction module (203). The upper computer (204) is used to synthesize the induction data of the first occlusion induction module (201), the penetration induction module (202), and the second occlusion induction module (203) and generate a control instruction. The control module (205) is connected to both the host computer (204) and the driving member (1). The control module (205) is configured to receive control instructions from the host computer (204) and control the driving member (1) to complete operations.

7. The integrated circuit plastic encapsulation material gripping device according to claim 6, wherein: The control system (200) further includes a second occlusion sensing module (203). The second occlusion sensing module (203) is connected to the photoelectric sensor (9) and is configured to collect the sensing data of the photoelectric sensor (9). The second occlusion sensing module (203) is connected to the host computer (204). The host computer (204) combines the sensing data of the first occlusion sensing module (201), the penetration sensing module (202), and the second occlusion sensing module (203) and generates control instructions.

8. The integrated circuit plastic encapsulation material gripping device according to claim 7, characterized in that: The driving member (1) includes a substrate cylinder (13), a material grasping cylinder (14), a resin cylinder (15), and a resin pressing cylinder (16). The substrate cylinder (13) is connected to both the substrate (3) and the control module (205). The control module (205) controls the substrate cylinder (13) to drive the substrate (3) to move away from or towards the mounting plate (2). The material grasping cylinder (14) is connected to the control module (205). The outer claw (41) is connected to the material grasping cylinder (14) through the outer moving rod (43), and the inner claw (42) is connected to the material grasping cylinder (14) through the inner moving rod (44). The control module (205) controls the material grasping cylinder (14) to drive the outer moving rod (43) and the inner moving rod (44) to move towards or away from each other. The resin cylinder (15) is connected to the moving rods (71) of the two clamping portions (7). The control module (205) controls the resin cylinder (15) to drive the two moving rods (71) to move towards or away from each other. The resin pressing cylinder (16) is connected to both the pressing strip (8) and the control module (205). The control module (205) controls the resin pressing cylinder (16) to drive the pressing strip (8) to move towards or away from the substrate (3).

9. A method for grasping an integrated circuit plastic encapsulation material, characterized in that, Comprising the following steps: Providing a device: providing the integrated circuit plastic encapsulation material grasping device according to claim 8. Substrate positioning: The control module (205) controls the substrate cylinder (13) to drive the substrate (3) to move away from the mounting plate (2). Sensing the presence or absence of the wafer: The presence or absence sensor (5) is blocked by the integrated circuit lead frame wafer (100) and generates a signal indicating the presence of the wafer. The presence or absence sensor (5) feeds back the signal indicating the presence of the wafer to the first occlusion sensing module (201). At this time, the control module (205) controls the substrate cylinder (13) to stop moving. Whether it is placed in the reverse direction and sensed: If the front-back sensor (6) penetrates the through-hole (103), based on the signal indicating the presence of the material, the penetration sensing module (202) generates a signal indicating that it is placed correctly; if the front-back sensor (6) does not penetrate the through-hole (103), the penetration sensing module (202) cannot generate a signal indicating that it is placed correctly and generates an alarm signal; Gripping of the chip: Based on the signal indicating that it is placed correctly, the control module (205) controls the gripper cylinder (14) to drive the outer moving rod (43) and the inner moving rod (44) to move towards each other. At this time, the outer pawl (41) and the inner pawl (42) grip the integrated circuit lead frame chip (100); Sensing the presence or absence of resin: The control module (205) controls the resin pressing cylinder (16) to drive the pressing bar (8) to move away from the substrate (3). When the photoelectric sensor (9) contacts the epoxy resin, a signal indicating the presence of resin is generated, and the photoelectric sensor (9) feeds back the signal indicating the presence of resin to the second occlusion sensing module (203); Gripping of the resin: Based on the signal indicating the presence of resin, the control module (205) controls the resin cylinder (15) to drive the two moving rods (71) to move towards each other, and then the epoxy resin is gripped; Movement of the encapsulation material: Based on the signal indicating that it is placed correctly and the signal indicating the presence of resin, the control module (205) controls the substrate cylinder (13) to drive the substrate (3) to move towards the mounting plate (2).

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