A conforming device

Abstract

The application discloses a laminating device and belongs to the technical field of display device production. The laminating device is mainly characterized by a moving mechanism. The film material is moved to the opposite side of the to-be-laminated area of the substrate, and then the film material is moved to the side of the film loading table by the film loading part, so that the lamination between the film material and the to-be-laminated area is completed. Compared with the manual lamination method, the laminating device has higher implementation efficiency. Meanwhile, the lamination process of the laminating device does not need the participation of the roller, and the lower limit of the size of the applicable film material is expanded, and the laminating process between the substrate and multiple smaller film materials is especially suitable.

Description

Technical Field

[0001] This invention relates to the field of display device manufacturing technology, and more specifically, to a bonding device. Background Technology

[0002] In the current field of optoelectronic technology, lamination equipment has been widely used. The main technical solution involves using rollers to apply film materials to the areas of a substrate to be laminated. However, this technique is only suitable for laminating single, large-sized films onto the substrate. When there are multiple areas on the substrate to be laminated, requiring the lamination of smaller films one by one, rollers become unsuitable. Therefore, manual lamination is still used in these situations. Manual lamination is inefficient and affects normal product production. Summary of the Invention

[0003] The present invention aims to provide a bonding device with high bonding efficiency.

[0004] The solution adopted by the present invention to solve the above-mentioned technical problems is as follows:

[0005] A bonding apparatus for bonding a film material to a substrate, comprising:

[0006] A film carrier section, which is used to carry the film material and move it to the bonding station;

[0007] A substrate carrier stage, which is used to support the substrate;

[0008] A moving mechanism is used to drive the carrier stage and the film portion located at the bonding station to move relative to each other so that the areas to be bonded of the film and the substrate are aligned.

[0009] When the areas to be bonded to the film and the substrate are opposite each other, the film carrier is moved toward the carrier stage so that the film is bonded to the areas to be bonded to the substrate.

[0010] In some embodiments of this application, the carrier film portion has a carrier film surface for supporting the film material, and the carrier plate stage has a carrier plate surface for supporting the substrate. When the carrier film portion is in the bonding position, the carrier film surface is parallel to the carrier plate surface. The moving mechanism is used to drive the carrier film portion to move relative to the carrier plate stage in a first direction or a second direction so that the bonding areas of the film material and the substrate are facing each other.

[0011] Wherein, the first direction and the second direction are two different directions parallel to the surface of the carrier plate.

[0012] In some embodiments of this application, the moving mechanism includes:

[0013] A first track extends along the first direction, and the carrier film portion located at the bonding station is on the first track and can reciprocate along the extension direction of the first track.

[0014] The second track extends along the second direction, and the carrier platform is mounted on the second track and is capable of reciprocating along the extension direction of the second track.

[0015] In some embodiments of this application, the carrier film portion includes a fixed end and a movable end connected together. The movable end is used to move away from or towards the fixed end and to carry the film material.

[0016] When the carrier film portion is in the bonding position, the relative movement direction of the fixed end and the movable end is perpendicular to the carrier plate surface.

[0017] In some embodiments of this application, the bonding device further includes:

[0018] A membrane alignment mechanism is used to align the membrane material to be picked up to a preset position, and the membrane carrier is used to move to the picking station to pick up the membrane material to be picked up at the preset position.

[0019] In some embodiments of this application, the membrane alignment mechanism includes:

[0020] A film loading platform, wherein the film loading platform has a loading surface for supporting the film material to be picked up;

[0021] Two sets of alignment components, each of the alignment components includes a first alignment part and a second alignment part. The first alignment part and the second alignment part are disposed opposite to each other on the feeding plane and are used to move relative to each other along the feeding plane so as to abut against the opposite sides of the film material to be picked up. The first alignment part in each alignment component is used to abut against the two adjacent sides of the film material to be picked up.

[0022] In some embodiments of this application, the first alignment part of each alignment component is fixed on the feeding platform, the feeding plane is provided with a groove that penetrates the feeding plane, and the second alignment part of each alignment component passes through the groove and is slidably installed in the groove along the extension direction of the groove.

[0023] Each of the alignment components has an alignment drive member connected to the end of its second alignment part away from the feeding plane, and moves along the extension direction of the slide groove under the drive of the alignment drive member.

[0024] In some embodiments of this application, the bonding device further includes:

[0025] The film-tearing mechanism further includes a film carrier section that moves to a film-tearing station. When the film carrier section moves to the film-tearing station, the film-tearing mechanism acts on the film material on the film carrier section to remove the release layer of the film material.

[0026] In some embodiments of this application, the film-tearing mechanism includes:

[0027] The film-tearing section is used to contact and tear off the release layer of the film material. When the film carrier section moves to the film-tearing station, the film carrier section is above the film-tearing section.

[0028] In some embodiments of this application, the film-tearing mechanism includes a film-tearing drive, and the film-tearing part is a film-tearing rubber roller, which is rotatably mounted on the film-tearing drive.

[0029] When the film carrier moves to the film-tearing station, the film-tearing roller is used to contact a corner of the release layer of the film material, and the film-tearing drive is used to drive the film-tearing roller to roll along the release layer of the film material in a preset direction, wherein the preset direction forms an acute angle with any side of the corner of the release layer of the film material.

[0030] In summary, the bonding equipment provided by this invention mainly uses a moving mechanism to move the film material to face the bonding area of ​​the substrate, and then uses a film carrier to move the film material closer to the film carrier stage, thereby completing the bonding between the film material and the bonding area. Compared with manual bonding, the bonding equipment provided by this invention has higher efficiency. Furthermore, the entire bonding process does not require the use of rollers, expanding the lower limit of applicable film material sizes, making it particularly suitable for bonding processes between a substrate and multiple smaller-sized films. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0032] Figure 1 This is a schematic diagram of the bonding device provided in the embodiments of the present invention;

[0033] Figure 2 This is a schematic diagram of the planar position of the bonding device in the embodiments provided by the present invention;

[0034] Figure 3 This is a schematic diagram of the assembly between the first track and the carrier film in the embodiment provided by the present invention;

[0035] Figure 4 and Figure 5 This is a schematic diagram of the structure of the carrier film portion in the embodiments provided by the present invention;

[0036] Figure 6 This is a schematic diagram of the membrane alignment mechanism in the embodiments provided by the present invention;

[0037] Figure 7 This is a schematic diagram of the structure of the film-tearing roller in the embodiments provided by the present invention;

[0038] Figure 8 This is a schematic diagram of the film-peeling roller rolling along the release layer in a preset direction in an embodiment of the present invention.

[0039] Explanation of reference numerals in the attached figures:

[0040] 10-Carrier film section, 11-Carrier film surface, 12-Fixed end, 13-Modible end, 13a-Suction plate;

[0041] 20 - Carrier stage, 21 - Carrier surface;

[0042] 31 - First orbital, 32 - Second orbital;

[0043] 40-Membrane alignment mechanism, 41-Filling film stage, 41a-Filling plane, 42-First alignment part, 43-Second alignment part, 44-Slide groove, 45-Alignment drive component;

[0044] 50 - Film tearing mechanism, 51 - Film tearing roller;

[0045] 60 - Membrane material, 61 - Release layer, 62 - Functional layer;

[0046] 70 - Substrate, 71 - Area to be bonded, 72 - Alignment mark. Detailed Implementation

[0047] The technical solutions of the embodiments of this application will be clearly and comprehensively described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all examples. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0048] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a unique orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of the stated features. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0049] In this application, the term "exemplary" is used to mean "serving as an example, illustration, or description." Any embodiment described as "exemplary" in this application is not necessarily to be construed as being more preferred or advantageous than other embodiments. The following description is provided to enable any person skilled in the art to make and use the invention. Details are set forth in the following description for purposes of explanation. It should be understood that those skilled in the art will recognize that the invention can be made without using these specific details. In other instances, known structures and processes are not described in detail to avoid obscuring the description of the invention with unnecessary detail. Therefore, the invention is not intended to be limited to the embodiments shown, but is consistent with the broadest scope of the principles and features disclosed in this application.

[0050] According to an embodiment of the present invention, please refer to Figure 1 , Figure 2 and Figure 3 The bonding equipment provided in this embodiment includes: a film carrier 10, a substrate carrier 20, and a moving mechanism. The film carrier 10 is used to carry the film material 60 and move it to the bonding station; the substrate carrier 20 is used to carry the substrate 70; the moving mechanism is used to drive the substrate carrier 20 and the film carrier 10 located at the bonding station to move relative to each other, so that the bonding areas 71 of the film material 60 and the substrate 70 are facing each other; when the bonding areas 71 of the film material 60 and the substrate 70 are facing each other, the film carrier 10 is used to move toward the substrate carrier 20 so that the film material 60 is bonded to the bonding area 71 of the substrate 70.

[0051] In this embodiment, the bonding equipment can be used to bond multiple specific films 60 onto a 16.9-inch substrate 70. For example, the film 60 has dimensions of 50 × 50 mm and is specifically a water-blocking film. Please refer to [link to documentation]. Figure 1 The substrate 70 has multiple bonding areas 71 corresponding to the film material 60. The bonding areas 71 are divided into two groups, each group having 8 areas.

[0052] The aforementioned film carrier 10 is mainly used to support and attach the film material 60 to be bonded, so that the film material 60 can move together with the film carrier 10, while the substrate 20 is mainly used to support and attach the substrate 70, so that the substrate 70 can move together with the substrate 20.

[0053] In this embodiment, the film carrier 10 is first in the picking station to pick up the film material 60 to be picked up. The film material 60 to be picked up has a release film attached to it. The film carrier 10 moves from the picking station to the film tearing station, tears off the release film on the film material 60, and then enters the bonding station to complete the bonding.

[0054] In this embodiment, when the film carrier 10 completes other processes and enters the bonding station, the moving mechanism acts on the film carrier 10 and the substrate stage 20, so that the film material 60 carried by the film carrier 10 and the bonding area 71 on the substrate 70 are facing each other. Then, the film carrier 10 and the substrate stage 20 move towards each other, thereby bonding the facing film material 60 and the bonding area 71.

[0055] The bonding device provided in this embodiment mainly uses a moving mechanism to move the film 60 to face the bonding area 71 of the substrate 70, and then uses the film carrier 10 to move the film 60 toward the side closer to the film carrier stage, thereby completing the bonding between the film 60 and the bonding area 71.

[0056] After one film material 60 is bonded to the corresponding bonding area 71, the film carrier 10 returns to the pick-up station and picks up the next film material 60. It then moves back to the bonding station, and the moving mechanism is readjusted so that the film material 60 and the bonding area 71 are aligned before bonding. This process is repeated, bonding the film materials 60 to the corresponding bonding areas 71 one after another until all bonding areas 71 are bonded. Compared to manual bonding, the bonding equipment provided in this embodiment is more efficient. Furthermore, the entire bonding process does not require rollers, expanding the lower limit of the applicable film material size 60, making it particularly suitable for bonding processes between a substrate 70 and multiple smaller-sized film materials 60.

[0057] Regarding the bonding of the membrane material 60 and the area to be bonded 71, in this embodiment, the film carrier 10 can move the membrane material 60 towards the carrier stage 20, so that the membrane material 60 and the area to be bonded 71 facing each other are bonded. That is, the membrane material 60 and the area to be bonded 71 are bonded face-to-face, which effectively avoids problems such as bubble lines and drag scratches at the bonding edges. Please refer to... Figure 1and Figure 4 In this embodiment, the film carrier 10 includes a fixed end 12 and a movable end 13 connected together. The movable end 13 is used to move away from or towards the fixed end 12 and to carry the film material 60. When the film material 60 is in the bonding position, the movable end 13 can drive the film material 60 to move relative to the fixed end 12, so that the film material 60 moves towards the side closer to the bonding area 71 to complete the bonding.

[0058] For more specific details, please refer to... Figure 4 and Figure 5 In this embodiment, the movable end 13 is composed of a suction plate 13a. One side of the suction plate 13a forms a film carrier surface 11, and a suction nozzle orifice is formed on the film carrier surface 11. The suction nozzle orifice is used to connect with a vacuum pump to form a negative pressure, so that the film carrier surface 11 can support the film material 60. The diameter of the suction nozzle orifice is 0.5-1mm, and the spacing between each suction nozzle orifice is 0.5-1cm. The implementer can select the specific structure of the suction plate 13a according to their own needs. Similarly, in this embodiment, a suction nozzle orifice is also provided on the carrier plate surface 21 so that the substrate 70 can be firmly vacuum-adhered to the carrier plate surface 21.

[0059] It is understandable that, in addition to vacuum adsorption, clamping mechanisms can also be used to fix the carrier film surface 11 to the film material 60, and the carrier plate surface 21 to the substrate 70. Implementers can choose according to their specific needs.

[0060] The aforementioned moving mechanism can employ a curved moving mechanism such as a flipping mechanism, as long as the membrane material 60 is aligned with the area to be bonded 71 before bonding. However, the flipping mechanism's movement process can easily generate static electricity, leading to dust accumulation on the membrane material 60. For this, please refer to [link / reference needed]. Figure 1 , Figure 2 and Figure 3 In this embodiment, the carrier film portion 10 has a carrier film surface 11 for supporting the film material 60, and the carrier plate stage 20 has a carrier plate surface 21 for supporting the substrate 70. When the carrier film portion 10 is in the bonding position, the carrier film surface 11 is parallel to the carrier plate surface 21. The moving mechanism is used to drive the carrier film portion 10 to move relative to the carrier plate stage 20 in a first direction or a second direction, so that the bonding areas 71 of the film material 60 and the substrate 70 are parallel and facing each other. The first direction and the second direction are two different directions parallel to the carrier plate surface 21.

[0061] When the film material 60 is supported by the film carrier surface 11, it extends along the plane of the film carrier surface 11. Correspondingly, when the substrate 70 is supported by the substrate plate surface 21, it extends along the plane of the substrate plate surface 21. This embodiment improves the positional relationship between the film carrier surface 11 and the substrate plate surface 21 at the bonding station, so that the alignment between the film carrier part 10 and the substrate plate stage 20 can be completed only through linear movement, reducing the structural complexity and implementation cost.

[0062] For more specific details, please refer to... Figure 1 , Figure 2 and Figure 3 In this embodiment, the moving mechanism includes a first track 31 and a second track 32. The first track 31 extends along the first direction, and the film carrier 10 located at the bonding station is on the first track 31 and can reciprocate along the extension direction of the first track 31. The second track 32 extends along the second direction, and the carrier plate 20 is mounted on the second track 32 and can reciprocate along the extension direction of the second track 32.

[0063] The moving mechanism used in this embodiment mainly includes two parts: a first track 31 and a second track 32. The film carrier 10 and the carrier platform 20 are respectively installed on different tracks. By moving in coordination, their relative positional relationship is changed until the film 60 and the area to be bonded 71 are directly opposite each other. With this configuration, after the film 60 is bonded, the carrier platform 20 can move to the next station by relying on the second track 32 to complete the next process, thereby avoiding the need for additional tracks to install the carrier platform 20 and reducing structural complexity.

[0064] More specifically, in this embodiment, two sets of bonding areas 71 on the substrate 70 are arranged along the length direction of the substrate 70, and each bonding area 71 in one set is arranged sequentially along the width direction of the substrate 70. When the carrier surface 21 supports the substrate 70, the width direction of the substrate 70 extends along the first direction, and its length direction extends along the second direction. With this configuration, bonding of that set of bonding areas 71 can be completed simply by moving the substrate 70 until one set of bonding areas 71 is above the extension direction of the first track 31, thereby reducing the number of times the carrier stage 20 feeds the substrate.

[0065] The aforementioned moving mechanism can also be a track structure with a composite motion trajectory. For example, in another embodiment, the moving mechanism includes a first track 31 extending along a first direction and a second track 32 extending along a second direction. The second track 32 is mounted on the first track 31 so that the second track 32 can move along the extension direction of the first track 31, i.e., the first direction. The film carrier 10 is correspondingly mounted on the second track 32 and can move along the extension direction of the second track 32. With this configuration, the film material 60 on the film carrier 10 and the area 71 to be bonded can be aligned. However, compared with the technical means described above, this method requires an additional track for mounting the substrate stage 20 to feed the substrate 70, resulting in higher implementation costs.

[0066] It should be noted that in this embodiment, the first track 31, the second track 32, and the film carrier 10 are each equipped with a corresponding driving mechanism. For example, in this embodiment, the first track 31 is equipped with a first servo motor and a transmission mechanism. The first servo motor drives the transmission mechanism, thereby moving the film carrier 10 mounted on the first track 31. The second track 32 is equipped with a second servo motor and a transmission mechanism to drive the film carrier stage to move along the second track 32. The film carrier 10 is equipped with a third servo motor and a transmission mechanism to drive the movable end 13 to move relative to the fixed end 12. The transmission mechanism on the film carrier 10 can be a ball screw.

[0067] Please combine Figure 1 and Figure 3 In this embodiment, four alignment marks 72 are also provided on the substrate 70, and four corresponding CCD devices are provided on the film carrier 10. When the stage 20 moves to a suitable position, the CCD devices can identify the alignment marks 72 under the drive of the moving mechanism, obtain the relative positional relationship between the film carrier 10 (film material 60) and the substrate 70, and thus achieve precise visual alignment between the film material 60 and the bonding area 71.

[0068] Please see Figure 2 As described above, in this embodiment, the film carrier 10 can move on the first track 31 to reciprocate between the pick-up station, the tear-off station and the bonding station, so that after the film material 60 is picked up by the film material 60 alignment mechanism 40, the release layer 61 can be torn off at the film tearing mechanism 50 to expose the functional layer 62 for bonding, and thus the bonding is finally completed.

[0069] Specifically, in this embodiment, the bonding device further includes: a film material 60 alignment mechanism 40, which is used to align the film material 60 to be picked up to a preset position, and the film carrier 10 is used to move to the picking station to pick up the film material 60 to be picked up at the preset position.

[0070] Please combine Figure 6 The membrane material 60 alignment mechanism 40 is mainly used to achieve the initial mechanical alignment of the membrane material 60 and the film carrier 10, ensuring that the membrane material 60 picked up by the film carrier 10 is in a precise position. In this embodiment, the membrane material 60 alignment mechanism 40 includes: a feeding platform 41 and two sets of alignment components. The feeding platform 41 has a feeding plane 41a for carrying the membrane material 60 to be picked up. Each alignment component includes a first alignment part 42 and a second alignment part 43. The first alignment part 42 and the second alignment part 43 are arranged opposite to each other on the feeding plane 41a and are used to move relative to each other along the feeding plane 41a to abut against the opposite sides of the membrane material 60 to be picked up. The first alignment part 42 in each alignment component is used to abut against the adjacent sides of the membrane material 60 to be picked up.

[0071] In this process, the first alignment part 42 of the two alignment components abuts against the adjacent two sides of the membrane material 60 to be picked up during the alignment process. As the first alignment part 42 and the second alignment part 43 move relative to each other, they abut against the opposite sides of the membrane material 60. During this process, since each side of the membrane material 60 is contacted by the alignment parts, as the first alignment part 42 and the second alignment part 43 move toward each other, the membrane material 60 to be picked up gradually and accurately moves to the preset position, completing the alignment. Afterward, the suction plate 13a of the film carrier 10 descends and picks up the membrane material 60.

[0072] It should be noted that the aforementioned alignment portion and the side of the membrane material 60 can be in the form of point contact or surface contact. For example, in another embodiment, the aforementioned alignment portion is cylindrical, and its outer peripheral surface is used to form point-to-surface contact with the side of the membrane material 60. However, with such an arrangement, the local pressure on the membrane material 60 is relatively large, which can easily cause damage to the membrane material 60. Correspondingly, in this embodiment, the first alignment portion 42 has a first alignment surface for contacting the side of the membrane material 60, and the second alignment portion 43 has a second alignment surface for contacting the side of the membrane material 60.

[0073] Furthermore, the first alignment portion 42 and the second alignment portion 43 can be configured such that both move relative to the loading film stage 41, or one moves relative to the loading film stage 41 while the other remains fixed to the loading film stage 41. In this embodiment, the first alignment portion 42 remains relatively fixed to the loading film stage 41, while the second alignment portion 43 is configured to move relative to the loading film stage 41, moving towards the first alignment portion 42.

[0074] More specifically, in this embodiment, the first alignment part 42 of each alignment component is fixed on the feeding platform, the feeding plane 41a is provided with a groove 44 penetrating the feeding plane 41a, the second alignment part 43 of each alignment component passes through the groove 44 and is slidably installed in the groove 44 along the extension direction of the groove 44; the end of the second alignment part 43 of each alignment component away from the feeding plane 41a is respectively connected to an alignment drive member 45, and moves along the extension direction of the groove 44 under the drive of the alignment drive member 45.

[0075] By connecting the alignment drive 45 to the end of the second alignment part 43 away from the feeding plane 41a, the airflow or static electricity generated by the movement of the alignment drive 45 itself can be effectively prevented from affecting the film material 60 to be picked up on the feeding plane 41a, thus avoiding the problems of particle foreign objects being stirred up and static electricity. In this embodiment, the alignment drive 45 is specifically a cylinder.

[0076] In addition, regarding the film-tearing station, in this embodiment, the bonding equipment further includes a film-tearing mechanism 50. The film carrier 10 is also used to move to the film-tearing station. When the film carrier 10 moves to the film-tearing station, the film-tearing mechanism 50 acts on the film material 60 on the film carrier 10 to tear off the release layer 61 of the film material 60.

[0077] Specifically, in this embodiment, a third track (not shown) is also included. The film-tearing mechanism 50 is mounted on the third track and can move along the extension direction of the third track. The third track is located below the first track 31 and is used to move the film-tearing mechanism 50 to a designated position when the film-tearing process is started.

[0078] Please combine Figure 1 and Figure 7 The film-tearing mechanism 50 includes a film-tearing section, which is used to contact and tear off the release layer 61 of the film material 60. When the film-carrying section 10 moves to the film-tearing station, the film-carrying section 10 is above the film-tearing section.

[0079] Understandably, since the film carrier 10 is located above the film peeling part, the film peeling part removes the release layer 61 of the film material 60 from below. This can effectively overcome the problem of foreign particles falling onto the film surface, thereby ensuring the bonding effect.

[0080] Please combine again Figure 1 , Figure 2 and Figure 7 In this embodiment, when the carrier film portion 10 is in the bonding station, the carrier film surface 11 is above the carrier plate surface 21. That is, the carrier film portion 10 can be directly transported to the bonding station after the tear-off station and bonded in the same posture. This arrangement avoids flipping the carrier film portion 10, reducing the risk of dust or static electricity caused by flipping the carrier film portion 10.

[0081] For more specific details, please refer to... Figure 7 In this embodiment, the film-tearing mechanism 50 includes a film-tearing drive (not shown) mounted on a third track. The film-tearing part is a film-tearing roller 51, which is rotatably mounted on the film-tearing drive. The film-tearing drive is used to drive the film-tearing roller 51 to roll along the release layer 61 of the film material 60 in a preset direction after the film-tearing roller 51 contacts the release layer 61 of the film material 60 at a corner. The preset direction forms an acute angle with any side of the corner of the release layer 61 of the film material 60. Please refer to... Figure 1 , Figure 4 and Figure 8 When the film-peeling roller 51 contacts the release layer 61, the adhesive applied to the outer circumferential surface of the film-peeling roller 51 adheres to the release layer 61. The film-peeling roller 51 moves, and because the film-peeling roller 51 acts on the corner where the adhesion force to the release layer 61 is relatively small, and the preset direction forms an acute angle with any side of the corner of the release layer 61 of the film material 60, the film-peeling roller 51 can easily peel off the release layer 61. In addition, in this embodiment, when the film carrier 10 moves along the first track 31 to the peeling station, the movable end 13 of the film carrier 10 moves downward so that the release layer 61 of the film material 60 contacts the film-peeling roller 51.

[0082] The above provides a detailed description of a bonding device provided in the embodiments of this application. Specific examples have been used to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of the present invention. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of the present invention. Therefore, the content of this specification should not be construed as a limitation of the present invention.

Claims

1. A bonding apparatus for bonding a film material to a substrate, characterized in that, include: A film carrier section, which is used to carry the film material and move it to the bonding station; A substrate carrier stage, which is used to support the substrate; A moving mechanism is provided to drive the carrier plate stage and the film-carrying portion located at the bonding station to move relative to each other, so that the areas to be bonded of the film and the substrate are aligned. The moving mechanism includes a first track and a second track. The first track extends along a first direction, and the film-carrying portion located at the bonding station is on the first track and can reciprocate along the extension direction of the first track. The second track extends along a second direction, and the carrier plate stage is mounted on the second track and can reciprocate along the extension direction of the second track. When the areas to be bonded of the film material and the substrate are aligned, the film carrier is moved toward the carrier stage to bond the film material to the areas to be bonded of the substrate; the areas to be bonded in the same group are arranged sequentially along the width direction of the substrate. The carrier film portion has a carrier film surface for supporting the film material, and the carrier plate stage has a carrier plate surface for supporting the substrate. When the carrier film portion is in the bonding position, the carrier film surface is parallel to the carrier plate surface. The moving mechanism is used to drive the carrier film portion to move along a first direction and to drive the carrier plate stage to move along a second direction, so that the areas to be bonded of the film material and the substrate are parallel and facing each other. The first direction and the second direction are two different directions parallel to the carrier plate surface. When the carrier plate surface supports the substrate, the width direction of the substrate extends along the first direction. The carrier film portion includes a fixed end and a movable end connected together. The movable end is used to move away from or towards the fixed end and to carry the film material. When the carrier film portion is in the bonding position, the relative movement direction of the fixed end and the movable end is perpendicular to the carrier plate surface. The movable end is composed of a suction plate, one side of which forms a film carrier surface. A suction nozzle hole is formed on the film carrier surface. The suction nozzle hole is used to connect with a vacuum pump to form a negative pressure so that the film carrier surface can support the film material.

2. The apparatus of claim 1, wherein The bonding equipment also includes: A membrane alignment mechanism is used to align the membrane material to be picked up to a preset position, and the membrane carrier is used to move to the picking station to pick up the membrane material to be picked up at the preset position.

3. The apparatus of claim 2, wherein The membrane alignment mechanism includes: A film loading platform, wherein the film loading platform has a loading surface for supporting the film material to be picked up; Two sets of alignment components, each of the alignment components includes a first alignment part and a second alignment part. The first alignment part and the second alignment part are disposed opposite to each other on the feeding plane and are used to move relative to each other along the feeding plane so as to abut against the opposite sides of the film material to be picked up. The first alignment part in each alignment component is used to abut against the two sides adjacent to the film material to be picked up.

4. The apparatus of claim 3, wherein The first alignment part of each alignment component is fixed on the feeding film stage. The feeding plane is provided with a sliding groove that penetrates the feeding plane. The second alignment part of each alignment component passes through the sliding groove and is slidably installed in the sliding groove along the extension direction of the sliding groove. Each of the alignment components has an alignment drive member connected to the end of its second alignment part away from the feeding plane, and moves along the extension direction of the slide groove under the drive of the alignment drive member.

5. The apparatus of claim 1, wherein The bonding equipment also includes: The film-tearing mechanism further includes a film carrier section that moves to a film-tearing station. When the film carrier section moves to the film-tearing station, the film-tearing mechanism acts on the film material on the film carrier section to remove the release layer of the film material.

6. The apparatus of claim 5, wherein the adhesive is applied to the substrate in a pattern. The film-tearing mechanism includes: The film-tearing section is used to contact and tear off the release layer of the film material. When the film carrier section moves to the film-tearing station, the film carrier section is above the film-tearing section.

7. The apparatus of claim 6, wherein the adhesive is applied to the substrate in a pattern. The film-tearing mechanism includes a film-tearing drive component, and the film-tearing part is a film-tearing rubber roller, which is rotatably mounted on the film-tearing drive component. When the film carrier moves to the film-tearing station, the film-tearing roller is used to contact a corner of the release layer of the film material, and the film-tearing drive is used to drive the film-tearing roller to roll along the release layer of the film material in a preset direction, wherein the preset direction forms an acute angle with any side of the corner of the release layer of the film material.

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