Drawing device and drawing method

By using a first ranging sensor to acquire substrate distance information in the drawing device and combining it with the focusing control unit to adjust the focusing position of the drawing head, the problem of excessively long substrate replacement and alignment processing time in the prior art is solved, achieving efficient substrate pattern drawing and improving throughput.

CN115729051BActive Publication Date: 2026-04-21SCREEN HOLDINGS CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SCREEN HOLDINGS CO LTD
Filing Date
2022-07-29
Publication Date
2026-04-21

AI Technical Summary

Technical Problem

Existing drawing devices, even with two substrate holding sections, cannot adequately increase throughput, mainly because the range sensor required for autofocus is located below the drawing head, resulting in increased substrate replacement and alignment processing time.

Method used

The first ranging sensor acquires distance information during substrate holding, and the focusing position of the drawing head is controlled by the focusing control unit. Combined with the second ranging sensor, the focus is adjusted in real time during the drawing process to achieve efficient pattern drawing between substrates.

Benefits of technology

The throughput of the drawing device is improved by reducing unnecessary waiting time and increasing processing efficiency through ranging and focus control during substrate holding.

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Abstract

The present application provides a kind of drawing device and drawing method.Drawn device (1) has drawing head (41), the first stage (21a) and the second stage (21b), and the first ranging sensor (5).Sensor element (51) of the first ranging sensor (5) obtains the distance between the measuring position on the substrate (9) held by the other stage during the period of drawing pattern on the substrate (9) held by one stage.Drawn head (41) includes the second ranging sensor for obtaining the distance between the measuring position on the substrate (9) on which the drawing of pattern is being carried out.Control unit (10) uses the information obtained from the substrate (9) by the first ranging sensor (5) before drawing pattern, and the information obtained from the second ranging sensor during the process of drawing pattern on the substrate (9), to control the focusing position of the light emitted from the drawn head (41).
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Description

[0001] Refer to related applications

[0002] This application claims the benefit of priority to Japanese Patent Application JP2021-137767, filed on August 26, 2021, all disclosures of which are incorporated herein by reference. Technical Field

[0003] This invention relates to a technique for drawing patterns on a substrate by irradiating it with light. Background Technology

[0004] Conventionally, patterns are drawn by irradiating light onto a semiconductor substrate, a printed substrate, or a glass substrate for an organic EL display device or a liquid crystal display device (hereinafter, the photosensitive material layer is included in the term "substrate"). Such a drawing apparatus sequentially performs substrate loading, substrate alignment, drawing on the substrate, and substrate unloading.

[0005] In recent years, in order to increase the throughput of drawing devices (the number of substrates processed per unit time), the following technical solution has been proposed: two substrate holding parts and one drawing head are set in one drawing device, and during the drawing process on one substrate holding part relative to the substrate, the substrate is replaced and aligned on the other substrate holding part.

[0006] For example, in the step-scan type projection exposure apparatus disclosed in International Publication No. 2003 / 010802, during the exposure of a wafer relative to a substrate holding section, i.e., a stage, wafer replacement, alignment measurement, and standby on the other stage until the end of exposure are performed on another stage (see Figure 4).

[0007] Furthermore, in Japanese Patent Application Publication No. 2014-197125, an automatic focusing mechanism is disclosed in a drawing apparatus for drawing patterns by irradiating light onto a substrate. This mechanism involves placing a detector on the optical head to detect the separation distance between the optical head and the substrate, and adjusting the focusing position of the drawing light according to the separation distance. Additionally, the following technique is disclosed: depending on the drawing area, the detector of the optical head is used to obtain the variation in the separation distance in the drawing area before drawing, and automatic focusing control is performed during drawing based on this variation in separation distance.

[0008] Furthermore, in most drawing devices, an autofocus function is provided in the drawing head to perform high-precision drawing on the surface of the substrate. The autofocus function ensures that the image formed by the light emitted from the drawing head is accurately aligned with the position of the substrate surface in the height direction. However, since the ranging sensor required for autofocus is located in the drawing head, the necessary measurements associated with autofocus are performed only after the substrate is positioned below the drawing head. Therefore, there is a period of time during which drawing is not performed regardless of whether the substrate is positioned below the drawing head. As a result, throughput cannot be sufficiently improved regardless of whether two substrate holding sections are provided. Summary of the Invention

[0009] The object of the present invention is to improve throughput in a drawing apparatus having a first substrate holding section and a second substrate holding section.

[0010] This invention relates to a drawing apparatus for drawing patterns onto a substrate by irradiating it with light. The drawing apparatus includes: a drawing head that emits modulated light; a first substrate holding portion that holds a first substrate; a second substrate holding portion that holds a second substrate; a moving mechanism that moves the drawing head relative to the first substrate holding portion during the period of drawing a pattern onto the first substrate held by the first substrate holding portion using light emitted from the drawing head, and moves the drawing head relative to the second substrate holding portion during the period of drawing a pattern onto the second substrate held by the second substrate holding portion using light emitted from the drawing head; and a first ranging sensor that, when irradiating the first substrate held by the second substrate holding portion with light emitted from the drawing head, moves the drawing head relative to the second substrate holding portion. During the period when a pattern is drawn on the second substrate held by the board holding part, the distance between the drawing head and a measured position on the first substrate is obtained by facing the first substrate held by the first substrate holding part; during the period when a pattern is drawn on the first substrate held by the first substrate holding part, the distance between the drawing head and a measured position on the second substrate is obtained by facing the second substrate held by the second substrate holding part; and a focus control part controls the focus position of the light emitted from the drawing head to be aligned with the position in the height direction of the surface of the substrate on which the pattern is to be drawn during the pattern drawing process. The drawing head includes: a second distance sensor that obtains the distance between the light emitted from the drawing head and a measured position on the substrate on which the pattern is being drawn; and a focus changing part that changes the focus position of the light emitted from the drawing head. The focus control part controls the focus changing part using information obtained from the substrate by the first distance sensor before the pattern is drawn and information obtained from the second distance sensor during the process of drawing the pattern on the substrate.

[0011] According to the present invention, throughput can be increased in a drawing apparatus having a first substrate holding portion and a second substrate holding portion.

[0012] Preferably, the measurement accuracy of the first ranging sensor is lower than that of the second ranging sensor.

[0013] In a preferred aspect of the invention, before the drawing head begins to draw a pattern onto the substrate held by the first substrate holding portion or the second substrate holding portion, the focusing control portion uses information obtained by the first ranging sensor to make the focusing position of the light emitted from the drawing head close to the position in the height direction of the surface of the substrate at the start of drawing.

[0014] Preferably, the first ranging sensor measures multiple positions near the drawing start position on the substrate held by the first substrate holding part or the second substrate holding part, and acquires multiple distances up to the multiple positions. The focusing control unit uses the distance with the highest frequency among the multiple distances as the distance between the first ranging sensor and the substrate.

[0015] In another preferred aspect of the invention, the first ranging sensor includes a sensor element with an absolute position fixed above the first substrate holding portion and a sensor element with an absolute position fixed above the second substrate holding portion.

[0016] In another preferred aspect of the invention, the drawing apparatus further comprises: an alignment camera that, while drawing a pattern on a second substrate held by the second substrate holding portion, photographs alignment marks on the first substrate held by the first substrate holding portion relative to the first substrate, and photographs alignment marks on the second substrate held by the second substrate holding portion relative to the second substrate holding portion during the same period; and a camera position switching unit that switches the relative position of the alignment camera with respect to the first substrate holding portion and the second substrate holding portion between a position opposite to the first substrate held by the first substrate holding portion and a position opposite to the second substrate held by the second substrate holding portion, and uses the camera position switching unit to switch the relative position of the first ranging sensor with respect to the first substrate holding portion and the second substrate holding portion, together with the alignment camera, between a position opposite to the first substrate and a position opposite to the second substrate.

[0017] In another preferred aspect of the invention, the first ranging sensor is a diffuse reflection type, and the focusing control unit includes a correction unit that corrects the distance obtained by the first ranging sensor from the first ranging sensor to the measurement position on the substrate, the correction unit correcting the distance based on the surface of the substrate and the material theren.

[0018] The present invention also relates to a drawing method for drawing a pattern onto a substrate by irradiating it with light. The drawing method includes: a) a step of holding a first substrate using a first substrate holding portion; b) a step of acquiring the distance between a first ranging sensor opposite to the first substrate and a measurement position on the first substrate using a first ranging sensor; c) a step of drawing a pattern onto the first substrate by emitting modulated light from a drawing head toward the first substrate and moving the drawing head relative to the first substrate holding portion; d) a step of holding a second substrate using a second substrate holding portion during the execution of step c); e) during the execution of step c) a step of acquiring the distance between a first ranging sensor opposite to the second substrate and a measurement position on the first substrate using the first ranging sensor. The process includes: f) a step of measuring the distance between a first ranging sensor and a measurement position on the second substrate; f) a step of drawing a pattern onto the second substrate by emitting modulated light from the drawing head toward the second substrate and moving the drawing head relative to the holding portion of the second substrate after steps c) and e); g) a step of repeatedly performing steps a) to f), wherein steps a) and b) are performed relative to the next first substrate during the period of performing step f), and step c) is performed relative to the next first substrate after step f) and step b) performed relative to the next first substrate. The drawing head includes a second ranging sensor that acquires the distance between itself and a measurement position on the substrate on which the pattern is being drawn. In step c), using the information obtained from the first substrate using the first ranging sensor in step b) and the information obtained from the second ranging sensor during the process of drawing a pattern on the first substrate, focus control is performed to align the focus position of the light emitted from the drawing head with the position in the height direction of the surface of the first substrate. In step f), using the information obtained from the second substrate using the first ranging sensor in step e) and the information obtained from the second ranging sensor during the process of drawing a pattern on the second substrate, focus control is performed to align the focus position of the light emitted from the drawing head with the position in the height direction of the surface of the second substrate.

[0019] The above-described objectives, as well as other objectives, features, forms, and advantages, will become apparent from the following detailed description of the invention with reference to the accompanying drawings. Attached Figure Description

[0020] Figure 1 This is a perspective view showing a drawing apparatus according to one embodiment.

[0021] Figure 2 This is a diagram showing the structure of a computer.

[0022] Figure 3It is a block diagram showing the functional configuration of the control unit and its surroundings.

[0023] Figure 4A It is a diagram showing the flow of the drawing device's operation.

[0024] Figure 4B It is a diagram showing the flow of the drawing device's operation.

[0025] Figure 5 This is a diagram showing the positions of the first and second platforms.

[0026] Figure 6 This is a diagram showing the positions of the first and second platforms.

[0027] Figure 7 This is a diagram showing the positions of the first and second platforms.

[0028] Figure 8 This is a diagram showing the positions of the first and second platforms.

[0029] Figure 9 This is a diagram showing the positions of the first and second platforms.

[0030] Figure 10 This is a diagram showing the positions of the first and second platforms.

[0031] Figure 11 This is a diagram used to illustrate the situation where the drawing is performed relative to the substrate.

[0032] Figure 12 This is a plan view showing another example of the structure associated with the camera unit and the first ranging sensor.

[0033] Figure 13 This is a block diagram showing the functional configuration of the correction section and its surroundings.

[0034] The reference numerals in the attached figures are explained as follows:

[0035] 1 Drawing device

[0036] 2. Moving mechanism

[0037] 5. First ranging sensor

[0038] 9 substrates (1st substrate, 2nd substrate)

[0039] 12th Revision Section

[0040] 21a First stage (first substrate holding section)

[0041] 21b Second stage (second substrate holding section)

[0042] 31. Point the camera.

[0043] 32-camera position switching unit

[0044] 41 Drawing Head

[0045] 51 Sensor Elements

[0046] 113 Focus Control Department

[0047] 412 Second Distance Sensor

[0048] 413 Focus on Change Department

[0049] Steps S11~S16, S21~S26 Detailed Implementation

[0050] Figure 1 This is a perspective view showing a drawing apparatus 1 according to an embodiment of the present invention. The drawing apparatus 1 is an apparatus for drawing a pattern on a substrate 9 by irradiating it with light. The drawing apparatus 1 is a two-stage direct drawing apparatus that draws a pattern by irradiating a substrate 9 having a photosensitive material layer on its surface with spatially modulated, generally beam-shaped light and scanning the irradiated area of ​​the light on the substrate 9. Figure 1 In the diagram, the X, Y, and Z directions are represented by arrows indicating three mutually orthogonal directions. Figure 1 In the example shown, the X and Y directions are horizontal directions perpendicular to each other, and the Z direction is vertical. The same applies to the other figures.

[0051] The substrate 9 is, for example, a plate-shaped member that is generally rectangular when viewed from above. The substrate 9 is, for example, a printed circuit board used in the manufacturing process. A resist film formed of photosensitive material is provided on a copper layer on the (+Z) side surface of the substrate 9 (hereinafter also referred to as "upper surface 91"). In the drawing apparatus 1, a circuit pattern is drawn (i.e., formed) on this resist film of the substrate 9. Furthermore, the type and shape of the substrate 9 can be varied in many ways.

[0052] The drawing device 1 includes a first transport mechanism 2a, a second transport mechanism 2b, a camera unit 3, a pattern drawing unit 4, a frame 7, and a control unit 10. The control unit 10 controls the first transport mechanism 2a, the second transport mechanism 2b, the camera unit 3, and the pattern drawing unit 4.

[0053] Frame 7 serves as the main base for mounting the various components of the drawing device 1. Frame 7 includes a generally rectangular base 71, and a portal-shaped first gantry portion 72 and a second gantry portion 73 spanning the base 71. The second gantry portion 73 is positioned near the (+Y) side of the first gantry portion 72. In the following description, the first gantry portion 72 and the second gantry portion 73 will be collectively referred to as "gantry portion 74". A first transport mechanism 2a and a second transport mechanism 2b are mounted on the base 71. The first gantry portion 72 supports the camera unit 3. The second gantry portion 73 supports the pattern drawing unit 4. Frame 7 is placed on a pedestal (not shown in the illustration).

[0054] The first transport mechanism 2a and the second transport mechanism 2b are respectively mechanisms for holding and moving the substrate 9 below the imaging unit 3 and the pattern drawing unit 4 (i.e., on the (-Z) side). The second transport mechanism 2b is arranged adjacent to the first transport mechanism 2a on the (+X) side. The first transport mechanism 2a and the second transport mechanism 2b have substantially the same structure.

[0055] The first transport mechanism 2a includes a first stage 21a and a first moving mechanism 22a. The first stage 21a is a generally flat first substrate holding portion that holds the substrate 9 in a generally horizontal state from below. The first stage 21a is, for example, a vacuum chuck that adsorbs and holds the lower surface of the substrate 9. The first stage 21a may also have a structure other than a vacuum chuck. The upper surface 91 of the substrate 9 placed on the first stage 21a is generally perpendicular to the Z direction (i.e., the vertical direction) and generally parallel to the X and Y directions.

[0056] The first moving mechanism 22a is a first stage moving mechanism that moves the first stage 21a relative to the imaging unit 3 and the pattern drawing unit 4 in a generally horizontal direction (i.e., a direction generally parallel to the upper surface 91 of the substrate 9). The first moving mechanism 22a moves the first stage 21a, supported on the guide rail 221a, linearly in the Y direction along the guide rail 221a below the imaging unit 3 and the pattern drawing unit 4. As a result, the substrate 9 held by the first stage 21a moves in the Y direction. In the following description, the Y direction will also be referred to as the "substrate moving direction" or the "main scanning direction". The drive source of the first moving mechanism 22a can be, for example, a linear servo motor or a mechanism with a motor mounted on a ball screw. The construction of the first moving mechanism 22a can also be varied.

[0057] The second transport mechanism 2b includes a second stage 21b and a second moving mechanism 22b. The second stage 21b is a generally flat second substrate holding portion that holds the substrate 9 in a generally horizontal state from below. The second stage 21b is arranged adjacent to the side (i.e., the (+X) side) of the first stage 21a. The upper surface of the second stage 21b and the upper surface of the first stage 21a are substantially at the same height in the vertical direction (i.e., the Z direction). The second stage 21b is, for example, a vacuum chuck that adsorbs and holds the lower surface of the substrate 9. The second stage 21b may also have a structure other than a vacuum chuck. The upper surface 91 of the substrate 9 placed on the second stage 21b is substantially perpendicular to the Z direction and substantially parallel in the X and Y directions. The upper surface 91 of the substrate 9 held by the second stage 21b and the upper surface 91 of the substrate 9 held by the first stage 21a are at approximately the same height in the vertical direction (i.e., at approximately the same position in the Z direction).

[0058] The second moving mechanism 22b is a second stage moving mechanism that moves the second stage 21b relative to the camera unit 3 and the pattern drawing unit 4 in a generally horizontal direction (i.e., a direction generally parallel to the upper surface 91 of the substrate 9). The second moving mechanism 22b moves the second stage 21b supported on the guide rail 221b linearly along the guide rail 221b in the Y direction (i.e., the substrate moving direction) below the camera unit 3 and the pattern drawing unit 4. As a result, the substrate 9 held by the second stage 21b moves in the Y direction. The direction in which the second moving mechanism 22b moves the second stage 21b is generally parallel to the direction in which the first moving mechanism 22a moves the first stage 21a. The drive source of the second moving mechanism 22b is, for example, a linear servo motor, or a mechanism with a motor mounted on a ball screw. The construction of the second moving mechanism 22b can also be varied.

[0059] The first moving mechanism 22a and the second moving mechanism 22b are arranged in a direction intersecting the substrate moving direction (i.e., the Y direction). Figure 1 In the example shown, the first moving mechanism 22a and the second moving mechanism 22b are arranged in the X direction. The second moving mechanism 22b is adjacent to the first moving mechanism 22a on the (+X) side. The first moving mechanism 22a and the second moving mechanism 22b are at approximately the same height in the vertical direction.

[0060] The first moving mechanism 22a and the second moving mechanism 22b are supported from below by the base 71 of the frame 7. Compared to the second gantry portion 73, the first moving mechanism 22a and the second moving mechanism 22b extend from the (+Y) side to the (-Y) direction, passing below the pattern drawing portion 4 supported by the second gantry portion 73 and below the camera portion 3 supported by the first gantry portion 72, and protruding from the first gantry portion 72 towards the (-Y) side. The central portions of the first gantry portion 72 and the first moving mechanism 22a and the second moving mechanism 22b in the Y direction are located at approximately the same position in the Y direction.

[0061] In the drawing apparatus 1, the substrate 9 is loaded and unloaded relative to the first stage 21a when the first stage 21a is located on the (-Y) side compared to the first gantry 72. Additionally, the substrate 9 is loaded and unloaded relative to the second stage 21b when the second stage 21b is located on the (-Y) side compared to the first gantry 72.

[0062] As shown, the first gantry section 72 and the second gantry section 73 are provided across the first transport mechanism 2a and the second transport mechanism 2b. The first gantry section 72 has two support columns extending in the Z direction on both sides of the first transport mechanism 2a and the second transport mechanism 2b in the X direction, and a beam connecting the upper ends of the two support columns. This beam extends in the X direction above the first transport mechanism 2a and the second transport mechanism 2b. The ends of the two support columns of the first gantry section 72 on the (-Z) side are connected to the base 71. The second gantry section 73 has two support columns extending in the Z direction on both sides of the first transport mechanism 2a and the second transport mechanism 2b in the X direction, and a beam connecting the upper ends of the two support columns. This beam extends in the X direction above the first transport mechanism 2a and the second transport mechanism 2b. The ends of the two support columns of the second gantry section 73 on the (-Z) side are connected to the base 71.

[0063] Camera unit 3 has multiple (in) Figure 1 The example shown includes two alignment cameras 31 and a camera position switching unit 32. Multiple alignment cameras 31 are arranged in the X direction and movably mounted on the beam of the first gantry 72. The camera position switching unit 32 is mounted on the beam and moves the multiple alignment cameras 31 along the beam in the X direction. The drive source for the camera position switching unit 32 is, for example, a linear servo motor or a mechanism with a motor mounted on a ball screw. Figure 1 In the example shown, the distance between the two cameras 31 in the X direction can be changed. Furthermore, the number of cameras 31 in the camera unit 3 can be one or more.

[0064] Each aligned camera 31 is a camera equipped with an image sensor and an optical system (not shown in the illustration). Each aligned camera 31 is, for example, a region camera for acquiring two-dimensional images. The image sensor has, for example, multiple CCD (Charge Coupled Device) elements arranged in a matrix. In each aligned camera 31, reflected light from illumination light (not shown) directed to the upper surface 91 of the substrate 9 is directed to the image sensor via the optical system. The image sensor receives the reflected light from the upper surface 91 of the substrate 9 and acquires an image of a generally rectangular imaging area. As the light source, various light sources such as LEDs (Light Emitting Diodes) can be used. Furthermore, each aligned camera 31 can be other types of cameras such as linear cameras.

[0065] In the drawing apparatus 1, a camera position switching unit 32 moves a plurality of alignment cameras 31 between a first imaging position above the first transport mechanism 2a and a second imaging position above the second transport mechanism 2b. The first imaging position is the position where the alignment camera 31 is positioned opposite the first stage 21a and the first substrate 9 during imaging. The second imaging position is the position where the alignment camera 31 is positioned opposite the second stage 21b and the second substrate 9 during imaging. Figure 1 In this setup, multiple alignment cameras 31 are located at a first camera position. The multiple alignment cameras 31 at the first camera position capture images of the upper surface 91 of the substrate 9 on the first stage 21a. Additionally, the multiple alignment cameras 31 at a second camera position capture images of the upper surface 91 of the substrate 9 on the second stage 21b.

[0066] Pattern drawing unit 4 has multiple (in Figure 1 The example shown has six drawing heads 41 and a drawing head moving mechanism 42. The multiple drawing heads 41 are arranged in the X direction and movably mounted on the beam of the second gantry 73. The drawing head moving mechanism 42 is mounted on the beam and moves the multiple drawing heads 41 integrally along the beam in the X direction. The drive source for the drawing head moving mechanism 42 is, for example, a linear servo motor or a mechanism with a motor mounted on a ball screw. Furthermore, the number of drawing heads 41 in the pattern drawing unit 4 can be one or multiple.

[0067] Each drawing head 41 includes a light source, an optical system, and a spatial light modulation element (not shown in the illustration). Various components such as a DMD (Digital Micro Mirror Device) or a GLV (Grating Light Valve) (a registered trademark of Silicon Photonics (Sunnyvale, California)) can be used as the spatial light modulation element. Various light sources such as an LD (Laser Diode) can be used as the light source. Multiple drawing heads 41 have substantially the same structure.

[0068] In the drawing apparatus 1, a plurality of drawing heads 41 are moved between a first drawing position above the first transport mechanism 2a and a second drawing position above the second transport mechanism 2b using a drawing head moving mechanism 42. The first drawing position is the position where the drawing head 41 is opposite to the first stage 21a and the first substrate 9 during drawing. The second drawing position is the position where the drawing head 41 is opposite to the second stage 21b and the second substrate 9 during drawing. Figure 1 In this process, multiple drawing heads 41 are located at a second drawing position. The multiple drawing heads 41 draw patterns on the upper surface 91 of the substrate 9 on the first stage 21a at the first drawing position. Additionally, the multiple drawing heads 41 draw patterns on the upper surface 91 of the substrate 9 on the second stage 21b at the second drawing position. Furthermore, when drawing patterns on the upper surface 91 of the substrate 9 on the first stage 21a, the drawing heads 41 are also moved in a stepping direction in the X direction using a drawing head moving mechanism 42. Similarly, when drawing patterns on the upper surface 91 of the substrate 9 on the second stage 21b, the drawing heads 41 are also moved in a stepping direction in the X direction using the drawing head moving mechanism 42.

[0069] The first and second drawing positions are located approximately at the same position in the Y direction as the central portions of the first and second moving mechanisms 22a and 22b. Similarly, the first and second camera positions are also located approximately at the same position in the Y direction as the central portions of the first and second moving mechanisms 22a and 22b. In other words, the plurality of drawing heads 41 of the pattern drawing unit 4 and the plurality of aiming cameras 31 of the camera unit 3 are located approximately at the same position in the Y direction as the central portions of the first and second moving mechanisms 22a and 22b.

[0070] When drawing a pattern at the first drawing position, modulated (i.e., spatially modulated) light is irradiated from the plurality of drawing heads 41 of the pattern drawing unit 4 toward the substrate 9 on the first stage 21a below. Then, in parallel with the irradiation of this light, the substrate 9 is moved horizontally from the (+Y) side of the pattern drawing unit 4 in the (-Y) direction (i.e., the substrate moving direction) using the first moving mechanism 22a. As a result, the irradiated area of ​​the light from the plurality of drawing heads 41 is mainly scanned relative to the substrate 9 in the (+Y) direction, and a pattern (e.g., a circuit pattern) is drawn relative to the substrate 9. The first moving mechanism 22a is a scanning mechanism that moves the irradiated area of ​​the light from each drawing head 41 along the Y direction on the substrate 9.

[0071] When a main scan ends, the drawing head 41 is moved only a predetermined distance in the (+X) direction by the drawing head moving mechanism 42 (i.e., sub-scanning), and the substrate 9 moves in the (+Y) direction. That is, in parallel with the illumination of light from the drawing head 41, the substrate 9 moves horizontally in the (+Y) direction by the first moving mechanism 22a. As a result, the illumination areas of the light from the multiple drawing heads 41 are subjected to a main scan relative to each other in the (-Y) direction on the substrate 9, and a pattern is drawn relative to the substrate 9. Thereafter, in this embodiment, the drawing head 41 is moved only a predetermined distance in the (+X) direction, and the pattern is also drawn based on the main scan of the illumination area in the (+Y) direction. In this way, in the drawing apparatus 1, drawing relative to the substrate 9 is performed by repeatedly moving the first stage 21a in the Y direction and stepping in the X direction in a multi-path manner. The drawing of the pattern in the second drawing position is the same as that in the first drawing position, except that the first platform 21a and the first moving mechanism 22a are changed to the second platform 21b and the second moving mechanism 22b.

[0072] The drawing relative to the substrate 9 can also be performed in a so-called one-pass manner. Specifically, in the case of the first stage 21a, the first moving mechanism 22a moves the first stage 21a relative to the plurality of drawing heads 41 in the Y direction, and the illumination area of ​​the light from the plurality of drawing heads 41 is scanned only once in the Y direction on the upper surface 91 of the substrate 9. Thus, the drawing relative to the substrate 9 is completed. The same applies to the second stage 21b.

[0073] The number of main scans when drawing patterns on the substrate 9 can be 1, 2, or 3 times, or even more than 4 times. In the case of multiple main scans, preferably, the movement of the substrate 9 alternates between the (+Y) and (-Y) directions, and when switching movement directions, the drawing head 41 moves in a stepping motion relative to the substrate 9 in the (+X) direction. Of course, the stepping motion of the drawing head 41 can also be in the (-X) direction.

[0074] As described above, in the drawing apparatus 1, a mechanism is configured to move the drawing head 41 relative to the substrate 9 held by the first stage 21a during drawing, utilizing a first moving mechanism 22a and a drawing head moving mechanism 42. However, in the case of a single-pass operation, the first moving mechanism 22a becomes a mechanism that moves the drawing head 41 relative to the substrate 9 held by the first stage 21a during drawing. Similarly, in the drawing apparatus 1, a mechanism is configured to move the drawing head 41 relative to the substrate 9 held by the second stage 21b during drawing, utilizing a second moving mechanism 22b and a drawing head moving mechanism 42. In the case of a single-pass operation, the second moving mechanism 22b becomes a mechanism that moves the drawing head 41 relative to the substrate 9 held by the second stage 21b during drawing.

[0075] Furthermore, the drawing head moving mechanism 42 also functions as a head position switching unit that switches the position of the drawing head 41 between a position opposite to the substrate 9 held by the first stage 21a and a position opposite to the substrate 9 held by the second stage 21b. The head position switching unit does not necessarily need to function as the drawing head moving mechanism 42. For example, a moving mechanism that switches the position of the drawing head 41 between a position opposite to the first stage 21a and a position opposite to the second stage 21b can be provided, and a mechanism that causes the drawing head 41 to move in steps in the X direction can also be provided on this moving mechanism. That is, the mechanism for moving the drawing head 41 relative to the substrate 9 held by the first stage 21a during drawing, the mechanism for moving the drawing head 41 relative to the substrate 9 held by the second stage 21b during drawing, and the mechanism for moving the drawing head 41 relative to the first stage 21a and the second stage 21b between the position opposite to the substrate 9 held by the first stage 21a and the position opposite to the substrate 9 held by the second stage 21b (head position switching unit) can be provided on the drawing apparatus 1 in various forms.

[0076] In the following description, all these mechanisms will be collectively referred to as "Mobile Mechanism 2". Figure 1 In the case of the drawing apparatus 1, the moving mechanism 2 includes a first moving mechanism 22a, a second moving mechanism 22b, and a drawing head moving mechanism 42. During the period when drawing a pattern on the substrate 9 held by the first stage 21a (first substrate holding portion) using light emitted from the drawing head 41, the moving mechanism 2 moves the drawing head 41 relative to the first stage 21a. During the period when drawing a pattern on the substrate 9 held by the second stage 21b (second substrate holding portion) using light emitted from the drawing head 41, the moving mechanism 2 moves the drawing head 41 relative to the second stage 21b.

[0077] The drawing device 1 also includes a first ranging sensor 5. The first ranging sensor 5 is disposed on the (-Y) side of the beam portion of the first gantry 72. The first ranging sensor 5 includes a plurality of sensor elements 51. The plurality of sensor elements 51 are arranged in the X direction. The number of sensor elements 51 is, in principle, twice the number of drawing heads 41. A plurality of sensor elements 51, in principle the same number as the number of drawing heads 41, are disposed above the first stage 21a, and a plurality of sensor elements 51, in principle the same number as the number of drawing heads 41, are disposed above the second stage 21b. Figure 1 In this example, the number of drawing heads 41 is 6, and the number of sensor elements 51 is 12. Above the first stage 21a, the spacing between the centers of the sensor elements 51 (i.e., the center-to-center spacing in the X direction) is the same as the spacing between the drawing heads 41 (i.e., the center-to-center spacing in the X direction). Above the second stage 21b, the spacing between the sensor elements 51 is also the same as the spacing between the drawing heads 41.

[0078] Each sensor element 51 acquires the distance between the substrates 9 held by the first stage 21a or the second stage 21b located below. More precisely, this measurement acquires the distance between a measurement position on the upper surface 91 of the substrate 9 and a specific portion of the sensor element 51 above it. The position of the sensor element 51 in the height direction is acquired beforehand by measurement, and the position of the measurement position in the height direction can be determined from the position of the sensor element 51 in the height direction and the acquired distance. Therefore, the measurement of the distance between the sensor element 51 and the measurement position essentially acquires the position of the measurement position in the height direction. More precisely, the output value from the sensor element 51 is converted into the position of the measurement position in the height direction using the focus control unit 113 of the control unit 10 (described later). The conversion uses, for example, a linear function. Furthermore, the measurement position is, in principle, directly below the sensor element 51, but it is acceptable as long as it is approximately below, and is not limited to directly below.

[0079] Each sensor element 51 employs diffuse reflection. Specifically, laser light is irradiated from the sensor element 51 onto the substrate 9 via a projection lens. The diffusely reflected light from the substrate 9 is received by a light-receiving position detection sensor (e.g., a PSD (Position Sensitive Detector) or CMOS (Complementary Metal-Oxide Semiconductor)) via a light-receiving lens, detecting the light-receiving position. Then, the distance between the sensor element 51 and the measurement position on the substrate 9 is determined from the light-receiving position. Diffuse reflection sensors are readily available and inexpensive, but their measurement accuracy is relatively low. The wavelength of the light emitted from the first ranging sensor 5 can be any wavelength as long as it does not affect the photosensitive material forming the surface of the substrate 9 (i.e., the upper surface 91). The light source of the first ranging sensor 5 is preferably a semiconductor laser of visible light or infrared light, more preferably a semiconductor laser of visible light.

[0080] Figure 2 This diagram illustrates the configuration of the computer 100 included in the control unit 10. The computer 100 is a typical computer including a processor 101, a memory 102, an input / output unit 103, and a bus 104. The bus 104 is a signal circuit connecting the processor 101, the memory 102, and the input / output unit 103. The memory 102 stores programs and various information. The memory 102 is, for example, RAM (Random Access Memory) or a fixed disk drive. The processor 101, according to the programs stored in the memory 102, utilizes the memory 102 and performs various processes (e.g., numerical calculations or image processing). The input / output unit 103 includes a keyboard 105 and a mouse 106 for accepting input from the operator, and a display 107 for displaying output from the processor 101. Furthermore, the control unit 10 can be a programmable logic controller (PLC) or a circuit board, or a combination of these and one or more computers.

[0081] Figure 3 This is a block diagram showing the functional configuration of the control unit 10 implemented by the computer 100 and its surrounding functional configuration. The control unit 10 includes a camera control unit 111, a position detection unit 112, a focus control unit 113, a drawing control unit 114, and a storage unit 115. The storage unit 115 is mainly implemented by the memory 102. The storage unit 115 stores data (i.e., drawing data) or other information of a predetermined pattern drawn on the substrate 9.

[0082] The camera control unit 111, position detection unit 112, focus control unit 113, and drawing control unit 114 are mainly implemented by the processor 101. The camera control unit 111 controls the camera unit 3, the first moving mechanism 22a, and the second moving mechanism 22b to acquire a mark (which may be part of a pattern) on the upper surface 91 of the substrate 9 provided on the first stage 21a and the second stage 21b using the alignment camera 31. The image is then sent to and saved to the storage unit 115.

[0083] The position detection unit 112 uses the image to detect the position of the substrate 9 (including distortion of the substrate 9). The drawing control unit 114 controls the moving mechanism 2 and the pattern drawing unit 4 to irradiate light onto the substrate 9 held by the first stage 21a or the second stage 21b to draw a pattern. At this time, the drawn pattern is corrected while drawing using the position of the substrate 9 detected by the position detection unit 112.

[0084] Each drawing head 41 of the pattern drawing unit 4 includes a light source, an optical system, and a light modulation element 411, as described above. Furthermore, the light source may be integrated with the drawing head 41 or may be separate from it. When the light source is separate from the drawing head 41, light from the light source is introduced into the drawing head 41 via an optical system including an optical fiber or the like.

[0085] like Figure 3 As shown, the drawing head 41 also includes a second ranging sensor 412 and a focus adjustment unit 413. The second ranging sensor 412 acquires the distance between measurement positions on the substrate 9 where the pattern is being drawn. The measurement position can be a drawing position or a position at the same height as the drawing position. Essentially, the second ranging sensor 412 measures the distance between the drawing head 41 and the upper surface 91 of the substrate 9. More precisely, the second ranging sensor 412 acquires the distance between the drawing position on the upper surface 91 of the substrate 9 and a position directly above the drawing position relative to a fixed position of the drawing head 41. However, the distance acquired by the second ranging sensor 412 does not need to be the distance between the drawing head 41 and a position directly below it, or the distance between the drawing position and a position directly above it; it only needs to be the distance in the height direction between positions that can be considered as these distances. That is, the second ranging sensor 412 can acquire the distance in the height direction between a position offset from the drawing position on the upper surface 91 of the substrate 9 and the drawing head 41.

[0086] The position of the second ranging sensor 412 (or the drawing head 41) in the height direction is obtained in advance by measurement, and the position of the measuring location in the height direction can be calculated from the position of the second ranging sensor 412 in the height direction and the obtained distance. Therefore, measuring the distance between the second ranging sensor 412 and the measuring location essentially obtains the position of the measuring location in the height direction.

[0087] The second ranging sensor 412 performs a higher precision measurement compared to the first ranging sensor 5. As the second ranging sensor 412, for example, oblique light (e.g., a laser) is irradiated onto the surface of the substrate 9, and the position of the reflected light is detected using a high-precision light-receiving element. The second ranging sensor 412 obtains the distance between the drawing head 41 and the substrate 9 based on the light-receiving position. As the second ranging sensor 412, for example, the sensor described in Japanese Patent Application Publication No. 2014-197125 can be used.

[0088] The focus changing unit 413 changes the position of the image formed using the light emitted from the drawing head 41 in the Z direction (i.e., the position in the height direction, hereinafter also referred to as the "focus position"). The focus changing unit 413 includes, for example, a focusing lens included in the optical system of the drawing head 41, and a drive unit that moves the focusing lens along the optical axis. There may be one or more focusing lenses. By moving the position of the focusing lens along the optical axis, the position of the image formed using the light emitted from the drawing head 41 in the height direction is changed.

[0089] The focus control unit 113 uses information from each sensor element 51 of the first range sensor 5 and information from the second range sensor 412 to control the focus position of the image formed by the light emitted from the drawing head 41 to be aligned with the position of the substrate 9 surface at the drawing position in the Z direction during the drawing process. That is, the position of the drawing position on the substrate 9 in the Z direction changes slightly in the vertical direction as the drawing position moves in the main scanning direction, but the focus control unit 113 changes the position of the image formed by the light emitted from the drawing head 41 in the Z direction accordingly. Furthermore, the use of information from the first range sensor 5 by the focus control unit 113 will be explained later.

[0090] The sensor elements 51 of the first ranging sensor 5, as described above, have lower accuracy and lower cost than those of the second ranging sensor 412. Therefore, it is possible to suppress the increase in manufacturing cost of the drawing device 1. When the first ranging sensor 5 is composed of multiple sensor elements 51, it is also possible to suppress the increase in manufacturing cost of the drawing device 1. In particular, like... Figure 1 As with the drawing device 1, when the number of sensor elements 51 is twice the number of drawing heads 41, the effect of suppressing the increase in manufacturing cost of the drawing device 1 is obvious.

[0091] Next, an explanation Figure 1The illustrated flow diagram shows the process of drawing a pattern onto a substrate 9 using the drawing apparatus 1. In the drawing apparatus 1, while drawing is being performed on a substrate 9 held on one of the first stage 21a and the second stage 21b, the substrate 9 is moved onto the other stage and aligned (i.e., repositioned). Then, when the drawing on the substrate 9 held on the first stage is finished, drawing begins on the substrate 9 held on the other stage. Furthermore, while drawing is being performed on the substrate 9 on the other stage, a completed substrate 9 is removed from one stage, and a new substrate 9 is moved onto the first stage for alignment and other similar processes.

[0092] Figure 4A as well as Figure 4B This is a diagram illustrating an example of the drawing process in drawing device 1. Figure 4A as well as Figure 4B Steps S11 to S16 on the left side of the diagram illustrate the drawing process for drawing onto the substrate 9 on the first stage 21a. Figure 4A as well as Figure 4B Steps S21 to S26 on the right side of the diagram illustrate the drawing process for drawing onto the substrate 9 on the second stage 21b. Additionally, located in... Figure 4A as well as Figure 4B The steps at the same position in the vertical direction are performed in parallel. Specifically, steps S11-S15 and step S26 are performed in parallel. Additionally, steps S16 and steps S21-S25 are performed in parallel. Figure 4A as well as Figure 4B The description of the actions of the substrate 9 being initially moved into the drawing device 1 and the substrate 9 being finally moved out is omitted.

[0093] exist Figure 4A as well as Figure 4B The description begins with the state in which a pattern is drawn on the substrate 9 on the second stage 21b relative to the second transport mechanism 2b. Furthermore, Figures 5-10 This is a conceptual diagram showing the approximate positions of the first stage 21a and the second stage 21b in the Y direction of the drawing apparatus 1 during the drawing process. Figures 5-10 In the diagram, the first platform 21a, the first moving mechanism 22a, the second platform 21b, and the second moving mechanism 22b are depicted with solid lines, while the arrangement of the camera 31, the drawing head 41, and the sensor elements 51 of the first ranging sensor 5 are depicted with dashed lines.

[0094] In the following description, regarding the position of the first stage 21a in the Y direction, the position where the first stage 21a overlaps with the alignment camera 31 and / or the drawing head 41 in the vertical direction is called the "processing position," the position where the first stage 21a overlaps with the (-Y) side of the first moving mechanism 22a in the vertical direction is called the "moving-out / moving-in position," and the position where the first stage 21a overlaps with the (+Y) side of the first moving mechanism 22a in the vertical direction is called the "standby position." Similarly, regarding the position of the second stage 21b in the Y direction, the position where the second stage 21b overlaps with the alignment camera 31 and / or the drawing head 41 in the vertical direction is also called the "processing position," the position where the second stage 21b overlaps with the (-Y) side of the second moving mechanism 22b in the vertical direction is called the "moving-out / moving-in position," and the position where the second stage 21b overlaps with the (+Y) side of the second moving mechanism 22b in the vertical direction is called the "standby position." Furthermore, the aforementioned processing position is not a concept indicating a point in the Y direction, but may also indicate a defined range in the Y direction (i.e., the area where processing is performed) where the substrate 9 is photographed by the aligning camera 31 and the pattern is drawn by the drawing head 41.

[0095] In drawing device 1, such as Figure 5 As shown, with the second stage 21b in the processing position and the drawing head 41 in the second drawing position, a pattern based on the drawing head 41 is drawn relative to the substrate 9 on the second stage 21b (step S26). Hereinafter, the substrate 9 held by the second stage 21b or the predetermined substrate 9 to be held will be referred to as the "second substrate 9". "Second substrate" does not refer to a second substrate, but only to the substrate associated with the second stage 21b. In step S26, the drawing control unit 114 (see reference...) Figure 3 The pattern drawing unit 4, the second moving mechanism 22b, and the drawing head moving mechanism 42 are controlled so that a pattern is drawn relative to the substrate 9, which moves in the (+Y) direction or (-Y) direction, at the processing position.

[0096] Additionally, in parallel with step S26, the completed substrate 9 is removed from the first stage 21a located at the transfer-in / transfer-out position, and a new substrate 9 is transferred in and held on the first stage 21a (steps S11, S12). Hereinafter, the substrate 9 held by the first stage 21a, or the predetermined substrate 9 held therein, will be referred to as "first substrate 9". "First substrate" does not refer to the first substrate, but only to the substrate associated with the first stage 21a. Without distinguishing between the first substrate and the second substrate described later, it will simply be referred to as "substrate".

[0097] Next, the first moving mechanism 22a is used to move the first platform 21a in the (+Y) direction, as follows: Figure 6 The location shown is the processing position. Figure 6 In the shown state, the second stage 21b remains in the processing position, and drawing is performed relative to the substrate 9 on the second stage 21b. Additionally, the alignment camera 31 is positioned at a first imaging position opposite to the first substrate 9 held by the first stage 21a (first substrate holding unit) using the camera position switching unit 32. Furthermore, the spacing of the alignment cameras 31 is pre-adjusted to correspond to the size of the first substrate 9.

[0098] When the first stage 21a is in the processing position, the camera control unit 111 (see reference) Figure 3 The first moving mechanism 22a is controlled, thereby moving the first stage 21a in the (+Y) direction at a predetermined speed. Using the camera control unit 111 to control the alignment camera 31, an image is captured the instant the alignment mark (not shown) on the first substrate 9 is located below the alignment camera 31, and the acquired image is sent to the position detection unit 112. Furthermore, the movement of the first stage 21a can be stopped during image capture. Images are captured relative to each alignment mark on the first substrate 9. The position detection unit 112 performs pattern matching based on a reference image relative to the image. This pattern matching is performed, for example, using a known pattern matching method (e.g., geometric shape pattern matching or normalized cross-correlation retrieval). The position of the alignment mark in the image is thus determined, and the position of the first substrate 9 relative to the first stage 21a is detected (step S13). Hereinafter, information related to the position of the substrate 9 acquired by the position detection unit 112 will be referred to as "alignment information".

[0099] The position of the first substrate 9 detected by the position detection unit 112 includes information indicating the coordinates of the first substrate 9 in the X and Y directions relative to the first stage 21a, which serves as the substrate holding unit, the orientation (i.e., rotational position) of the first substrate 9, and the deformation caused by distortion of the first substrate 9. Furthermore, the information indicating the deformation of the first substrate 9 refers to information such as the shape of the deforming first substrate 9 and the position of the drawing area on the first substrate 9. Based on the detected alignment information, the position detection unit 112 performs correction (i.e., alignment processing) of the drawing data for the first substrate 9 on the first stage 21a. Furthermore, if the first moving mechanism 22a has the function of rotating the first stage 21a about an axis pointing towards the Z direction, the rotation of the first substrate 9 can also be performed based on the alignment information. The above explanation of alignment related to the first substrate 9 is also applied to the processing of the second substrate 9, which will be described later.

[0100] When the portion of the first substrate 9 on the (-Y) side passes under the first ranging sensor 5, the outputs of the six sensor elements 51 from the first stage 21a side are recorded in the storage unit 115 of the control unit 10. That is, the distance between each sensor element 51 and the upper surface 91 of the first substrate 9 is repeatedly output from each sensor element 51 and recorded in the storage unit 115 of the control unit 10. The distance between the sensor element 51 and the upper surface 91 of the first substrate 9 corresponds to the position of the upper surface 91 of the substrate 9 in the height direction based on the measurement position of the sensor element 51. Therefore, based on the above measurement, the change in the position of the upper surface 91 of the first substrate 9 in the height direction within the movement range of the measurement position is obtained. Hereinafter, the position of the upper surface 91 of the substrate 9 in the height direction in the measurement position or the drawing position will also be referred to as the "surface height position". The focus control unit 113 calculates the highest frequency value based on the surface height position of the first substrate 9 in multiple measurement positions obtained from the information obtained using each sensor element 51 (step S14). Hereinafter, the highest frequency value will be referred to as "prefocus information". The same number of prefocus information points as the number of sensor elements 51 of the first ranging sensor 5 will be acquired.

[0101] The location where the substrate 9 has through holes or layer differences should not be used as the measurement position for the height of the upper surface 91 of the substrate 9. By using the highest frequency value of multiple surface height positions of the first substrate 9 obtained by each sensor element 51 as the position in the height direction of the upper surface 91 of the first substrate 9, an accurate surface height position represented by multiple surface height positions can be obtained. Furthermore, "highest frequency value" means that by dividing the position in the height direction into multiple small ranges, classifying the multiple surface height positions obtained by each sensor element 51 into each small range, and using the center value of the small range to which the most surface height positions belong as the accurate surface height position represented by multiple measurement positions.

[0102] The range of movement of the measurement position of each sensor element 51 on the substrate 9 coincides with the trajectory of the movement of the drawing position when a certain drawing head 41 starts drawing in a subsequent process. That is, the position of each sensor element 51 in the X direction is consistent with the position in the X direction when a certain drawing head 41 starts drawing in a subsequent process. Therefore, each sensor element 51 of the first ranging sensor 5 (more precisely, each sensor element 51 on the first substrate 9 side) places the measurement position at multiple positions (arranged in the main scanning direction) near the drawing start position on the first substrate 9 held by the first stage 21a, which is the first substrate holding unit, and acquires multiple distances up to these multiple positions. Then, the focus control unit 113 uses the most frequent distance among the acquired multiple distances as the distance between each sensor element 51 of the first ranging sensor 5 and the first substrate 9. As described above, the distance between each sensor element 51 and the first substrate 9 is essentially pre-focusing information representing the surface height position of the substrate 9 at the drawing position at the start of drawing.

[0103] During the patterning process on the second substrate 9 held by the second stage 21b (second substrate holding section), when the acquisition of alignment information and pre-focusing information from the first substrate 9 is completed, the first stage 21a is further moved in the (+Y) direction using the first moving mechanism 22a, as follows. Figure 7 The device is shown in the standby position (step S15). Figure 7 In the shown state, the second stage 21b is still in the processing position (more precisely, a position with a certain range for drawing) and is drawing relative to the second substrate 9. The first stage 21a is in standby position until the drawing relative to the second substrate 9 is completed.

[0104] When the drawing relative to the second substrate 9 is completed (step S26), the second stage 21b is moved in the (-Y) direction using the second moving mechanism 22b, as follows: Figure 8 The device is positioned at the loading / unloading position. Simultaneously, the first moving mechanism 22a moves the first stage 21a in the (-Y) direction to the processing position. The alignment camera 31 moves from the first imaging position to a second imaging position opposite (more precisely, opposite during imaging) to the second substrate 9 held by the second stage 21b (the second substrate holding part), and the drawing head 41 moves from the second drawing position to the first drawing position. Then, based on the drawing data after the alignment process, the drawing control unit 114 controls the pattern drawing unit 4 and the first moving mechanism 22a, thereby drawing a pattern on the first substrate 9 on the first stage 21a, which is moving in the Y direction, at the processing position (step S16).

[0105] Figure 11This diagram is used to illustrate the drawing relative to the first substrate 9. The drawing relative to the second substrate 9 is also done in the same way. Therefore, in the following section regarding... Figure 11 In the description, both the first substrate 9 and the second substrate 9 are collectively referred to as "substrate 9" without distinction. Figure 11 Six drawing heads 41 are shown in dashed lines. The 18 regions 8 extending in the Y direction depicted on the substrate 9 represent the regions drawn by one drawing head 41 when the substrate 9 moves in the Y direction. A DMD is used as the light modulation element 411 of the drawing head 41. When the rectangular image of the DMD is obliquely projected onto the substrate 9, more precisely, the multiple regions 8 slightly overlap in the X direction.

[0106] Arrow 81, shown as a thick solid line, indicates the initial movement of the drawing position of the plurality of drawing heads 41. Specifically, it shows that by moving the substrate 9 in the (-Y) direction, the drawing position moves relatively in the (+Y) direction on the substrate 9. When the drawing position moves to the end of the (+Y) side of region 8, the drawing head 41 is moved stepwise in the (+X) direction by the drawing head moving mechanism 42, thereby moving the drawing position stepwise in the (+X) direction on the substrate 9. Then, by moving the substrate 9 in the (+Y) direction, as shown by the dashed arrow 82, the drawing position moves in the (-Y) direction to draw in the second region 8. When the drawing position moves to the end of the (-Y) side of the second region 8, the drawing head 41 is moved stepwise in the (+X) direction by the drawing head moving mechanism 42, thereby moving the drawing position stepwise in the (+X) direction on the substrate 9. Then, by moving the substrate 9 in the (-Y) direction, as indicated by the dashed arrow 83, the drawing position is moved in the (+Y) direction, and the drawing is performed in region 8 for the third time.

[0107] exist Figure 11 In the example, the drawing head 41 moves back and forth once and a half times in the Y direction relative to the substrate 9, thereby ending the drawing. Furthermore, as described above, the number of drawing heads 41 or the width of the region 8 can be varied in various ways. Preferably, the number of drawing heads 41 is two or more. Alternatively, the drawing can be ended by moving the drawing head 41 only once in the Y direction relative to the substrate 9, i.e., in the main scanning direction, or by moving it more than twice in the main scanning direction. If the first substrate 9 is described in the usual way, modulated light is emitted from the drawing head 41 toward the first substrate 9, and the drawing head 41 is moved relative to the first stage 21a (first substrate holding portion), thereby drawing a pattern onto the first substrate 9. In the case of the second substrate 9, the same applies except that the first stage 21a is replaced by the second stage 21b (second substrate holding portion).

[0108] Furthermore, if the number of movements in the main scanning direction until the end of drawing is odd, in order to make the position of the substrate 9 at the end of drawing close to the move-out / move-in position, the standby position is preferably on the opposite side of the move-out / move-in position relative to the drawing head 41. Conversely, if the number of movements in the main scanning direction until the end of drawing is even, in order to make the position of the substrate 9 at the end of drawing close to the move-out / move-in position, the standby position and the move-out / move-in position are preferably on the same side relative to the drawing head 41.

[0109] When initial drawing begins in region 8, the pre-focusing information obtained in step S14 is utilized. Very precise drawing is performed in the drawing apparatus 1. Therefore, even a tiny deviation in the height direction of the drawing position on the surface of the substrate 9, i.e., the position of the surface height position relative to the position in the height direction of the image formed from the drawing head 41 (hereinafter referred to as the "image height position"), is not permitted. During continuous drawing, the second ranging sensor 412 of the drawing head 41 measures the surface height position, and the focusing control unit 113 of the control unit 10 controls the focusing change unit 413 of the drawing head 41 based on the measurement result. That is, the focusing lens within the drawing head 41 is moved slightly along the optical axis. Thus, even if the drawing position moves parallel to the substrate 9, the surface height position and the image height position in the drawing position are accurately aligned. However, at the start of drawing, there is no reliable information from the second ranging sensor 412, so the actual surface height position may deviate significantly from the image height position before control. In particular, in the case of warping of the substrate 9, sometimes the surface height position and the image height position deviate significantly at the end of the substrate 9. Because the speed at which the image height position changes is limited, when there is a large offset between the surface height position and the image height position, it takes time to align the surface height position and the image height position. This can cause problems with the inability to align the surface height position and the image height position for a period of time after the start of drawing.

[0110] Therefore, in the drawing apparatus 1, by setting a first ranging sensor 5, the position of the substrate 9 surface in the height direction at the drawing start position is obtained in advance as pre-focusing information before drawing begins; that is, the surface height position at the start of drawing. By making the surface height position close to the image height position in advance before drawing begins, automatic focusing control is achieved immediately and quickly after drawing begins. More precisely, the pre-focusing information obtained by each sensor element 51 of the first ranging sensor 5 (i.e., the distance between each sensor element 51 and the substrate 9) is converted into the corresponding distance between the drawing head 41 and the substrate 9 for automatic focusing control at the start of drawing. The distance between the drawing head 41 and the substrate 9 obtained by conversion is essentially the same as the surface height position obtained at the drawing start position. In addition, the surface height position from the end of drawing one region 8 to the start of drawing the next region 8 can use the surface height position obtained from the second ranging sensor 412 at the end of drawing the previous region 8.

[0111] By setting the first ranging sensor 5, it is impossible to determine the surface height position at the start of drawing using the second ranging sensor 412 of the drawing head 41 before drawing begins. Assuming that the first ranging sensor 5 is not set, it is necessary to scan a certain distance relative to the substrate 9 in the main scanning direction before drawing begins, and use the output from the second ranging sensor 412 to obtain the surface height position at the start of drawing. In contrast, in the drawing apparatus 1, using the information from the first ranging sensor 5, drawing can begin immediately after the drawing head 41 is positioned at the start of drawing, thus improving the throughput of the drawing apparatus 1.

[0112] In drawing device 1, such as Figure 4B As shown, in parallel with the drawing of the first substrate 9 on the first stage 21a (step S16), the drawn second substrate 9 is removed from the second stage 21b located at the move-out / move-in position, and a new second substrate 9 is moved in and held on the second stage 21b (steps S21, S22). Next, the second stage 21b is moved in the (+Y) direction using the second moving mechanism 22b, and similarly to steps S13 and S14, the alignment information of the second substrate 9 is acquired by the control of the camera control unit 111, and pre-focus information is acquired almost in parallel with this (steps S23, S24). In terms of these operations, in the above description relative to the first substrate 9, the operations are the same as those after replacing the first substrate 9 with the second substrate 9, replacing the first stage 21a with the second stage 21b, replacing the first moving mechanism 22a with the second moving mechanism 22b, and replacing the first camera position with the second camera position.

[0113] That is, under the control of the camera control unit 111, such as Figure 9The second substrate 9 is moved to the processing position, and moves in the (+Y) direction. At the instant when the alignment mark is below the alignment camera 31, an image is captured, and the alignment information of the second substrate 9 is acquired by the position detection unit 112 (step S23). Then, the drawing data used for the second substrate 9 is corrected (i.e., alignment processing).

[0114] When the portion of the second substrate 9 on the (-Y) side passes below the first ranging sensor 5, the outputs from the six sensor elements 51 on the second stage 21b side are recorded in the storage unit 115. The focus control unit 113 calculates the highest frequency value based on multiple values ​​(surface height position) of the position of the upper surface 91 of the second substrate 9 in the height direction obtained from the information acquired by each sensor element 51, and uses this as pre-focus information (step S24). The pre-focus information indicates the position (surface height position) of the upper surface 91 of the second substrate 9 in the height direction at the corresponding drawing position at the start of drawing.

[0115] During the patterning process on the first substrate 9 held by the first stage 21a (first substrate holding part), when the acquisition of alignment information and pre-focusing information from the second substrate 9 ends, the second stage 21b is further moved in the (+Y) direction by the second moving mechanism 22b, as follows. Figure 10 The device is shown in the standby position (step S25). Figure 10 In the shown state, drawing is performed relative to the first substrate 9. The second stage 21b remains in standby position until the drawing relative to the first substrate 9 is completed.

[0116] When the drawing relative to the first substrate 9 is completed, the drawing head 41 moves to the second drawing position, and the camera 31 moves to the first camera position. Then, as referred to Figure 4A As explained, drawing on the second substrate 9 begins (step S26). During the drawing process on the second substrate 9, the first substrate 9 is moved out and the next first substrate 9 is moved in (steps S11, S12), and alignment information and pre-focusing information related to the first substrate 9 are acquired (steps S13, S14). The first substrate 9 is in the standby position (step S15).

[0117] When drawing on the second substrate 9 begins, the pre-focusing information obtained by the first ranging sensor 5 in step S24 is used to quickly initiate automatic focusing control. This operation is the same as that for the first substrate 9. By setting the first ranging sensor 5, it is not necessary to use the second ranging sensor 412 of the drawing head 41 to determine the surface height position at the drawing start position before drawing begins. As a result, drawing can begin immediately after the drawing head 41 is positioned at the second drawing position, thereby improving the throughput of the drawing apparatus 1.

[0118] Figure 12 This is a plan view showing another example of the structure associated with the camera unit 3 and the first ranging sensor 5 of the drawing device 1. Figure 12 The structure of the first gantry section 72 is shown, and other structures of the drawing device 1 are also shown. Figure 1 same.

[0119] exist Figure 12 The first gantry section 72 has a beam portion equipped with a camera position switching section 32 extending in the X direction. The camera position switching section 32 moves the camera base 33 in the X direction, as indicated by arrow 34. Two alignment cameras 31 are provided on the camera base 33. One alignment camera 31 is mounted on the camera base 33 via a camera position adjustment section 35. The camera position adjustment section 35 moves relative to the camera base 33 in the X direction to align the camera 31. The camera position adjustment section 35 can employ various mechanisms, such as a linear servo motor or a mechanism with a motor mounted on a ball screw.

[0120] The camera position adjustment unit 35 changes the spacing between the two aligned cameras 31. Furthermore, the camera position switching unit 32 switches the positions of the two aligned cameras 31 between a first camera position opposite to the first stage 21a and the first substrate 9 (more precisely, opposite to the first moving mechanism 22a) and a second camera position opposite to the second stage 21b and the second substrate 9 (more precisely, opposite to the second moving mechanism 22b). Additionally, although... Figure 1 The description is simplified, but the camera base 33 and the camera position adjustment part 35 are also provided. Figure 1 The drawing device 1. The camera base 33 can also be considered as part of the camera position switching unit 32. When there is only one aligned camera 31, no camera position adjustment unit 35 is provided. When there are three or more aligned cameras 31, camera position adjustment units 35 can be provided for each of the other aligned cameras 31 except for one. Furthermore, even if there are two or more aligned cameras 31, the position of all aligned cameras 31 can be fixed relative to the camera base 33.

[0121] exist Figure 12 In, with Figure 1 Unlike other cases, the first ranging sensor 5 is fixed to the camera base 33. Figure 12In this example, the six sensor elements 51 of the first ranging sensor 5 are fixed to the camera base 33. Preferably, the spacing of the sensor elements 51 in the X direction, i.e., the distance between them in the X direction, is the same as the distance between the drawing head 41 in the X direction. Of course, the spacing of the sensor elements 51 in the X direction can also be different from the distance between the drawing head 41 in the X direction. The number of sensor elements 51 is preferably the same as the number of drawing heads 41, but it can also be different. The number of sensor elements 51 is preferably two or more, but it can also be one.

[0122] have Figure 12 The operation of the drawing device 1 shown, apart from the fact that the first ranging sensor 5 and the aligning camera 31 move together in the X direction, is similar to that of the reference device. Figure 4A as well as Figure 4B The actions described are the same. That is, during the period when the second substrate 9 is being patterned (step S26), the first substrate 9 is moved out and in (steps S11, S12), and alignment information and pre-focus information are acquired (steps S13, S14). Until the patterning of the second substrate 9 is completed, the first substrate 9 is in standby position (step S15). Then, when the patterning of the second substrate 9 is completed, the drawing head 41 moves from the second drawing position to the first drawing position, and at the same time, the alignment camera 31 moves from the first camera position to the second camera position. As a result, the first ranging sensor 5 also moves from the position opposite to the first moving mechanism 22a (the position opposite to the first stage 21a and the first substrate 9 during measurement) to the position opposite to the second moving mechanism 22b (the position opposite to the second stage 21b and the second substrate 9 during measurement).

[0123] Subsequently, during the process of patterning the first substrate 9 (step S16), the second substrate 9 is moved out and in (steps S21, S22), and alignment information and pre-focusing information are acquired (steps S23, S24). The second substrate 9 remains in a standby position until the patterning of the first substrate 9 is completed (step S25). When the patterning of the first substrate 9 is completed, the drawing head 41 moves from the first drawing position to the second drawing position, and simultaneously, the alignment camera 31 moves from the second imaging position to the first imaging position. Consequently, the first ranging sensor 5 also moves from a position opposite to the second moving mechanism 22b to a position opposite to the first moving mechanism 22a. When starting to draw on the first substrate 9 and the second substrate 9, the pre-acquired pre-focusing information is used as described above. This improves the throughput of the drawing apparatus 1.

[0124] exist Figure 1 or Figure 12The first ranging sensor 5 shown (where the first ranging sensor 5 includes multiple sensor elements 51, each sensor element 51 (hereinafter the same)) is not limited to a diffuse reflection sensor. For example, orthogonal reflection or other methods may also be used within the permissible range. Diffuse reflection sensors are inexpensive to acquire; however, when the transmittance of the light used for measurement relative to the object being measured is high, there is a disadvantage that the measurement cannot be performed as effectively as when the transmittance is low. Therefore, when the transmittance of the light used for measurement relative to the object being measured is high, such as... Figure 13 As shown, the focus control unit 113 of the drawing apparatus 1 includes a correction unit 12 that corrects the distance from the first ranging sensor 5 (each sensor element 51) acquired by the first ranging sensor 5 to the measured position on the substrate 9. That is, it corrects the measured surface height position. In the above embodiment, the correction unit 12 corrects the pre-focus information. Furthermore, in Figure 13 Only the focusing control unit 113 and the first ranging sensor 5 are shown in the diagram; other components are omitted.

[0125] The correction is preferably performed when the transmittance of the material on and near the surface of the substrate 9 relative to the wavelength of light emitted from the first ranging sensor 5 is 50% or more, preferably 60% or more, and more preferably 70% or more. This material on and near the surface of the substrate 9 is a blue glass plate with a resist film or a dry film with a resist film (e.g., polyethylene terephthalate). A protective film may be further present on top of the resist film. Of course, the material to be corrected is not limited to these materials. The wavelength of the light emitted from the first ranging sensor 5 is only required to be a wavelength that does not affect the photosensitive material on the upper surface 91 of the substrate 9. Preferably, it is visible light or infrared light with a wavelength of 600 nm or more. For example, a wavelength of 660 nm.

[0126] When correction using the correction unit 12 is required, for example, a function relating the output from the first ranging sensor to the distance (or a function relating the output to the surface height position) can be obtained beforehand using a calibration operation. The correction unit 12 calculates the distance between the first ranging sensor 5 and the substrate 9 by substituting the output from the first ranging sensor 5 into this function. The function is preferably a first-order function. By providing the correction unit 12, even when the material forming the surface of the substrate 9 is transmissive to the light used for measurement, a diffuse sensor can be used as the first ranging sensor 5.

[0127] Various modifications can be made to the drawing device 1 described above.

[0128] The drawing head 41 is not limited to emitting spatially modulated light in two dimensions; it can also emit linear light that is spatially modulated into one dimension and extends in a direction intersecting the main scanning direction. The drawing head 41 can also emit spot-shaped light, which is modulated while scanning in a direction intersecting the main scanning direction. Various forms of modulated light can be emitted by the drawing head 41.

[0129] The substrate holding portion holding the substrate 9 is not limited to a platform-shaped structure such as the first platform 21a or the second platform 21b. Various forms can be adopted as the first substrate holding portion holding the first substrate 9 and the second substrate holding portion holding the second substrate 9. For example, the first substrate holding portion and the second substrate holding portion can use a claw-like structure to hold the outer edge of the substrate 9, or they can adhere to and hold the center of the lower surface of the substrate 9.

[0130] The moving mechanism 2 is not limited to the mechanism shown in the above embodiments. During the period when a pattern is drawn on the first substrate 9 held by the first substrate holding portion using light emitted from the drawing head 41, the moving mechanism 2 moves relative to the first substrate holding portion. During the period when a pattern is drawn on the second substrate 9 held by the second substrate holding portion using light emitted from the drawing head 41, the moving mechanism 2 moves relative to the second substrate holding portion. Therefore, it is preferable to independently perform the movement of the first substrate 9 during drawing on the first substrate 9 and the movement of the second substrate 9 during measurement relative to the second substrate 9. Thus, the moving mechanism 2 preferably includes a first substrate moving mechanism that horizontally moves the first substrate 9 relative to the drawing head 41 and the first ranging sensor 5 (different from the first moving mechanism 22a described above, this is a broad concept), and a second substrate moving mechanism that horizontally moves the second substrate 9 relative to the drawing head 41 and the first ranging sensor 5 independently of the first substrate moving mechanism (different from the second moving mechanism 22b described above, this is a broad concept).

[0131] Furthermore, during the drawing process, it is preferable to keep the position of the drawing head 41 as fixed as possible to minimize misalignment between the drawing head 41 and the first substrate 9 and the second substrate 9. Therefore, the first substrate moving mechanism, such as Figure 1 The preferred embodiment includes a first moving mechanism 22a that moves the first substrate 9 in a straight line in the main scanning direction, and the second substrate moving mechanism preferably includes a second moving mechanism 22b that moves the second substrate 9 in a straight line in the main scanning direction.

[0132] exist Figure 1In the example, the position of substrate 9 is set to one of the following: "transfer-out / transfer-in position", "processing position", and "standby position". However, for example, the "transfer-out / transfer-in position" and the "standby position" can also be the same position. Moreover, with the structure of the robot that performs the transfer of substrate 9, the "transfer-out / transfer-in position" and the "processing position" can overlap. In this case, substrate 9 can also move only within the range of movement during drawing.

[0133] exist Figure 1 In the example, a drawing head moving mechanism 42 that moves the drawing head 41 in the X direction is used to switch the drawing head 41 between a position opposite to the first substrate holding portion and a position opposite to the second substrate holding portion. Therefore, the moving mechanism 2 conceptually includes a head position switching unit that switches the drawing head 41 between the position opposite to the first substrate holding portion and the position opposite to the second substrate holding portion. The head position switching unit may also be provided separately from the mechanism that moves the drawing head in the X direction during drawing. Therefore, the moving mechanism 2 includes a first substrate moving mechanism, a second substrate moving mechanism, and a head position switching unit.

[0134] During the period when the first ranging sensor 5 is drawing a pattern onto the second substrate 9 held by the second substrate holding member, it is positioned opposite the first substrate 9 held by the first substrate holding member to obtain the distance between itself and a measurement position on the first substrate 9. Furthermore, during the period when the pattern is drawn onto the first substrate 9 held by the first substrate holding member, it is positioned opposite the second substrate 9 held by the second substrate holding member to obtain the distance between itself and a measurement position on the second substrate 9. To achieve this operation, in... Figure 1 In this design, the first ranging sensor 5 includes a sensor element 51 with an absolute position fixed above the first substrate holding portion and another sensor element 51 with an absolute position fixed above the second substrate holding portion. Here, "absolute position" refers to the position relative to the space (i.e., indoor space) where the frame 7 is provided on the drawing device 1. Furthermore, the absolute position of the sensor element 51 can also be achieved by fixing the sensor element 51 to a location other than the gantry portion 74.

[0135] By fixing the absolute position of sensor element 51, the error in the distance acquired by sensor element 51 can be suppressed to a very small extent, making it easy to utilize autofocus control. With the absolute position of sensor element 51 fixed, compared to... Figure 12 Compared to the previous case, the number of sensor elements 51 has increased, but the sensor elements 51 are low-cost sensors, so the device manufacturing cost will not increase significantly.

[0136] In the first substrate holding part (in Figure 1In the case where the absolute position sensor element 51 is fixed above the first stage 21a, the number can be one or more. In the second substrate holding section (in... Figure 1 In the case where the absolute position sensor element 51 is fixed above the second stage 21b), the number can be one or more. Figure 1 In the case of the example, the minimum number of sensor elements 51 is 2.

[0137] When there are two or more sensor elements 51 simultaneously opposite to a substrate 9, the distance between the first ranging sensor 5 and the measurement position on the substrate 9 is obtained by the first ranging sensor 5, which means obtaining the distance between each sensor element 51 and its corresponding measurement position on the substrate 9. When there is only one sensor element 51 opposite to a substrate 9, the distance between the first ranging sensor 5 and the measurement position on the substrate 9 is obtained by the first ranging sensor 51, which means obtaining the distance between the corresponding measurement position on the substrate 9.

[0138] exist Figure 12 In the example, the relative position of the first ranging sensor 5 with respect to the first substrate holding part (which is the first stage 21a) and the second substrate holding part (which is the second stage 21b) is switched by the camera position switching unit 32 along with the alignment camera 31 between a position opposite to the first substrate 9 held by the first substrate holding part and a position opposite to the second substrate 9 held by the second substrate holding part. In this case, the minimum number of sensor elements 51 of the first ranging sensor 5 is 1. Furthermore, the first ranging sensor 5 can be fixed to a location other than the camera base 33, as long as it moves together with the alignment camera 31. The camera position switching unit 32 can adopt various configurations as long as it switches the relative position of the alignment camera 31 with respect to the first substrate holding part and the second substrate holding part between a position opposite to the first substrate 9 held by the first substrate holding part and a position opposite to the second substrate 9 held by the second substrate holding part.

[0139] In the above-described drawing apparatus 1, the focus control unit 113 utilizes pre-focus information acquired by the first ranging sensor 5 to pre-position the drawing head 41 at a position close to the surface of the substrate 9 (surface height position), thereby enabling automatic focus control and pattern drawing to begin immediately when the drawing head 41 is positioned at the first or second drawing position. However, the information acquired by the first ranging sensor 5 is not limited to the pre-focus information acquired in the manner described above.

[0140] For example, in the above embodiment, the surface height position at the starting position of the initial main scan is obtained, but the surface height position at all main scan positions in the starting (+Y) direction and (-Y) direction can also be obtained. Furthermore, the variation in surface height position over the entire length of all main scans can be obtained in advance using the first ranging sensor 5, and this information can be used when drawing the pattern using the second ranging sensor 412. For example, the first ranging sensor 5 can be used in advance to detect positions where the autofocus control using the second ranging sensor 412 might malfunction during each main scan, to prevent control errors during drawing. In either case, the measurement based on the first ranging sensor 5 is performed in steps S14 and S24 described above. As described above, the focusing control unit 113 can control the focusing change unit 413 in various forms using information obtained from the substrate 9 by the first ranging sensor 5 before drawing the pattern, and information obtained from the second ranging sensor 412 during the process of drawing the pattern onto the substrate 9.

[0141] The focus control unit 113 utilizes information from the first ranging sensor 5 and information from the second ranging sensor 412. As a result, during the process of drawing a pattern on a substrate 9 held by one substrate holding unit, information based on the first ranging sensor 5 is obtained in advance from the substrate 9 held by the other substrate holding unit. When drawing a pattern on the substrate held by the other substrate holding unit, the information obtained from the first ranging sensor is used, thereby enabling efficient focus control during pattern drawing and improving throughput.

[0142] In the above embodiment, the highest frequency value of the distance between the sensor element 51 and the substrate 9 is obtained by measuring near the drawing start position using the first ranging sensor 5, and used as pre-focusing information. However, the pre-focusing information can also be the average value or the center value of the distance. Even with this information, before the drawing head 41 begins to draw a pattern on the substrate 9 held by the first substrate holding part or the second substrate holding part, the focusing control unit 113 can use the information obtained by the first ranging sensor 5 to make the focusing position (image height position) of the light emitted from the drawing head 41 close to the surface height position of the substrate 9 at the start of drawing.

[0143] exist Figure 1 In the example, preferably, the number of sensor elements 51 of the first ranging sensor 5 is twice the number of drawing heads 41. This allows the distance between the drawing head 41 and the substrate 9 at the starting position of each drawing head 41 to be obtained. Figure 12In the case of the example, preferably, the number of sensor elements 51 of the first ranging sensor 5 is the same as the number of drawing heads 41. However, the number of sensor elements 51 of the first ranging sensor 5 is not limited to the example described above. When the measurement position of the sensor element 51 is inconsistent with the drawing start position of the drawing head 41, the distance (or surface height position) between the drawing head 41 and the substrate 9 at the drawing start position of each drawing head 41 can be obtained by, for example, performing linear interpolation on the measurement values ​​of multiple sensor elements 51.

[0144] In the drawing apparatus 1, the first transport mechanism 2a may further include one or more of the following: a moving mechanism that moves the first substrate holding portion (first stage 21a) in the X direction; a rotating mechanism that rotates the first substrate holding portion around a rotating axis extending in the Z direction; and a lifting mechanism that moves the first substrate holding portion in the Z direction. For example, a linear servo motor can be used as the moving mechanism and the lifting mechanism. Additionally, for example, a servo motor can be used as the rotating mechanism. The construction of the moving mechanism, the rotating mechanism, and the lifting mechanism can also be modified in various ways. The second transport mechanism 2b is also the same as the first transport mechanism 2a.

[0145] In the drawing apparatus 1, the number of substrate holding units can be three or more. In this case, it is preferable that the number of one or more drawing heads 41 (hereinafter referred to as "drawing head group") used simultaneously when drawing on the same substrate 9 is less than the number of substrate holding units (and is more than one), the number of one or more alignment cameras 31 (hereinafter referred to as "camera group") used simultaneously when taking pictures of the same substrate 9 is also less than the number of substrate holding units (and is more than one), and the number of first ranging sensors 5 (i.e., one or more sensor elements 51 used simultaneously when measuring the same substrate 9) is also less than the number of substrate holding units (and is more than one). The processing performed by each substrate holding unit is the same as the processing performed with respect to the first substrate holding unit and the second substrate holding unit.

[0146] Based on the above configuration, during the process of drawing on a substrate 9 using a drawing head group (fewer than the number of substrate holding units), a camera group (fewer than the number of substrate holding units), and a first ranging sensor 5 (fewer than the number of substrate holding units), alignment information of other substrates 9 and information from the first ranging sensor 5 can be acquired, thereby improving throughput. Generally, since the pattern drawing operation takes time, the number of drawing head groups is preferably only one less than the number of substrate holding units.

[0147] The substrate 9 described above is not necessarily limited to a printed circuit board. In the drawing apparatus 1, for example, it can also be drawn on a glass substrate for a flat panel display device such as a semiconductor substrate, a glass substrate for a photomask, or a substrate for a solar cell panel.

[0148] The above-described embodiments and their variations can be appropriately combined as long as they do not contradict each other.

[0149] The present invention has been described and illustrated in detail above, but the description is illustrative and not limiting. Therefore, various modifications or forms can be realized without departing from the scope of the present invention.

Claims

1. A drawing apparatus that draws a pattern on a substrate by irradiating light to the substrate, the drawing apparatus characterized by comprising: a drawing head that emits modulated light; a first substrate holding unit that holds a first substrate; a second substrate holding unit that holds a second substrate; a moving mechanism that relatively moves the drawing head with respect to the first substrate holding unit during a period in which a pattern is drawn on the first substrate held by the first substrate holding unit using the light emitted from the drawing head, and relatively moves the drawing head with respect to the second substrate holding unit during a period in which a pattern is drawn on the second substrate held by the second substrate holding unit using the light emitted from the drawing head; and a focus control unit that controls a focus position of the light emitted from the drawing head to align with a position in a height direction of a surface of the substrate on which the pattern is to be drawn during drawing of the pattern, wherein the drawing head includes: a first distance measuring sensor that acquires a distance between a measurement position on the substrate on which drawing of the pattern is being performed; and a focus changing unit that changes the focus position of the light emitted from the drawing head using information from the second distance measuring sensor during a period in which drawing is being continuously performed, wherein the focus control unit uses information acquired by the first distance measuring sensor to bring the focus position of the light emitted from the drawing head close to the position in the height direction of the surface of the substrate at the time of start of drawing after the drawing head has drawn a pattern on the substrate held by one of the first substrate holding unit or the second substrate holding unit, and before starting to draw a pattern on the substrate held by the other.

2. The drawing apparatus according to claim 1, wherein a measurement accuracy of the first distance measuring sensor is lower than a measurement accuracy of the second distance measuring sensor.

3. The drawing apparatus according to claim 1, wherein the first distance measuring sensor acquires a plurality of distances from a plurality of positions in the vicinity of a drawing start position on the substrate held by the first substrate holding unit or the second substrate holding unit until the measurement position is located at the plurality of positions, and the focus control unit uses a distance having the highest frequency among the plurality of distances as a distance between the first distance measuring sensor and the substrate.

4. The drawing apparatus according to any one of claims 1 to 3, wherein the first distance measuring sensor includes a sensor element having an absolute position fixed above the first substrate holding unit, and a sensor element having an absolute position fixed above the second substrate holding unit.

5. The drawing apparatus according to any one of claims 1 to 3, further comprising: an alignment camera that photographs an alignment mark on the first substrate held by the first substrate holding unit opposite the second substrate held by the second substrate holding unit during drawing of a pattern on the second substrate, and photographs an alignment mark on the second substrate held by the second substrate holding unit opposite the first substrate held by the first substrate holding unit during drawing of a pattern on the first substrate. a first distance measuring sensor that acquires a distance to a measurement position on a first substrate held by the first substrate holding section while drawing a pattern on the first substrate held by the first substrate holding section, and acquires a distance to a measurement position on a second substrate held by the second substrate holding section while drawing a pattern on the second substrate held by the second substrate holding section; ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ a camera position switching section that switches a relative position of the alignment camera with respect to the first substrate holding section and the second substrate holding section between a position opposite the first substrate held by the first substrate holding section and a position opposite the second substrate held by the second substrate holding section, the first distance measuring sensor is switched by the camera position switching section together with the alignment camera between the position opposite the first substrate and the position opposite the second substrate.

6. The drawing apparatus according to claim 1, wherein the first distance measuring sensor is of a diffuse reflection type, the focus control section includes a correction section that corrects a distance from the first distance measuring sensor to a measurement position on a substrate acquired by the first distance measuring sensor, the correction section corrects the distance according to a material of a surface of a substrate and its vicinity.

7. A drawing method of drawing a pattern on a substrate by irradiating light to the substrate, the drawing method characterized by comprising: a) a step of holding a first substrate by a first substrate holding section; b) a step of acquiring a distance between the first distance measuring sensor and a measurement position on the first substrate by a first distance measuring sensor opposite the first substrate; c) a step of drawing a pattern on the first substrate by emitting modulated light from a drawing head toward the first substrate and relatively moving the drawing head with respect to the first substrate holding section; d) a step of holding a second substrate by a second substrate holding section during the c) step; e) a step of acquiring a distance between the first distance measuring sensor and a measurement position on the second substrate by the first distance measuring sensor opposite the second substrate during the c) step; f) a step of drawing a pattern on the second substrate by emitting modulated light from the drawing head toward the second substrate and relatively moving the drawing head with respect to the second substrate holding section after the c) step and the e) step; and g) a step of repeating the a) to f) steps, the a) and b) steps are performed with respect to a next first substrate during the f) step, and the c) step is performed with respect to the next first substrate after the f) step and the b) step performed with respect to the next first substrate, the drawing head includes a second distance measuring sensor that acquires a distance from a measurement position on a substrate on which a pattern is being drawn, In the c) process, focus control is performed, before the drawing head starts to draw a pattern on the first substrate, using information obtained from the first substrate by the first distance measuring sensor in the b) process, the focus position of light emitted from the drawing head is brought close to the position in the height direction of the surface of the first substrate, during the period in which the drawing head draws a pattern on the first substrate, using information from the second distance measuring sensor, the focus position of light emitted from the drawing head is aligned with the position in the height direction of the surface of the first substrate, In the f) process, focus control is performed, before the drawing head starts to draw a pattern on the second substrate, using information obtained from the second substrate by the first distance measuring sensor in the e) process, the focus position of light emitted from the drawing head is brought close to the position in the height direction of the surface of the second substrate, during the period in which the drawing head draws a pattern on the second substrate, using information from the second distance measuring sensor, the focus position of light emitted from the drawing head is aligned with the position in the height direction of the surface of the second substrate.

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