A transiently self-destructing integrated circuit device

Abstract

The application provides a transient self-destructing integrated circuit device, comprising a substrate, a package shell buckled on the substrate, a cavity formed in the package shell, a groove with a top opening arranged on a side of the package shell away from the substrate, a porous partition plate arranged in the cavity and butting against a bottom of the groove to close the bottom of the groove, a photosensitive polymer arranged in the groove for generating a corrosive solution under light, a sensor arranged between the substrate and the porous partition plate, and a light-transmitting cover plate arranged at the top opening of the groove for closing the top opening so that light can enter the groove through the light-transmitting cover plate. The application has the advantages of simple structure, low cost and controllable self-destruction according to external light.

Description

Technical Field

[0001] This invention relates to the field of semiconductor packaging, and more particularly to a transient self-destructible integrated circuit device. Background Technology

[0002] With the rapid development of the semiconductor industry and microelectronics technology, electronic devices have become an indispensable part of human life, playing an increasingly important role in information security, national defense, telecommunications, education, and healthcare. Protecting the information within chips is no longer limited to national defense and military security; it also involves protecting personal privacy and corporate intellectual property. The concept of transient electronics differs from the long-term, stable operation requirements of electronic products. Transient electronics, on the other hand, refers to devices that can reliably operate within their designed operating time. Upon completion of their intended task or termination, the device can partially or completely degrade under environmental factors or command triggers, achieving information security and preventing the theft of advanced hardware technologies. Currently, most self-destruct devices, both domestically and internationally, have complex structures and high manufacturing costs. How to package self-destruct devices with simple structures and low costs has become a major challenge. Summary of the Invention

[0003] In view of the problems existing in the prior art, this application proposes a transient self-destructible integrated circuit device, which mainly solves the problems that existing related devices have complex structures, high costs and difficulty in ensuring information security.

[0004] To achieve the above and other objectives, the technical solution adopted by the present invention is as follows.

[0005] This application provides a transient self-destructible integrated circuit device, comprising:

[0006] Substrate;

[0007] A packaged tube is fastened to the substrate, forming a cavity inside the packaged tube;

[0008] A groove, the top opening of which is located on the side of the packaging shell opposite to the substrate;

[0009] A porous partition is disposed within the cavity and abuts against the bottom of the groove to seal the bottom of the groove;

[0010] A photosensitive polymer is disposed within the groove to generate a corrosive solution under light irradiation;

[0011] The sensor is disposed between the substrate and the porous partition.

[0012] A light-transmitting cover plate is disposed at the top opening of the groove to close the top opening, allowing light to pass through the light-transmitting cover plate into the groove.

[0013] In one embodiment of this application, a sealing layer is provided on the side of the porous partition away from the groove, which is used to cooperate with the encapsulation shell and the substrate to form a sealed space for accommodating the sensor.

[0014] In one embodiment of this application, the porous partition is provided with a porous structure near the side wall of the groove, and the generated corrosive solution flows into the space where the sensor is located through the porous structure.

[0015] In one embodiment of this application, the sealing layer is made of materials including copper, aluminum, potassium, or magnesium.

[0016] In one embodiment of this application, the light-transmitting cover is made of materials including: silicate, acrylic, polycarbonate, polymethyl methacrylate, polystyrene, or polydiallyl diethylene glycol carbonate.

[0017] In one embodiment of this application, the photosensitive polymer includes: diazonium salt compounds, triazine compounds, onium salt compounds, or sulfonate compounds.

[0018] In one embodiment of this application, the sidewall of the groove is connected to the porous partition through a bonding layer.

[0019] In one embodiment of this application, the light-transmitting cover is sealed to the encapsulation shell by an adhesive.

[0020] In one embodiment of this application, the encapsulation shell is bonded to the substrate.

[0021] In one embodiment of this application, the material of the encapsulation shell includes ceramic.

[0022] As described above, the transient self-destructible integrated circuit device proposed in this application has the following beneficial effects.

[0023] By filling the groove with a photosensitive polymer, when external light passes through the light-transmitting cover into the groove, the photosensitive polymer will generate a corrosive solution under the light. The corrosive solution will flow into the space where the sensor is located along the pores of the porous partition, destroying the sensor structure and realizing the self-destruction of the device, thus ensuring information security. The overall structure is simple, the packaging cost is low, and it can meet the economic requirements. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the structure of a transient self-destructible integrated circuit device according to one embodiment of this application.

[0025] Figure 2 This is a top view of the encapsulated casing in one embodiment of this application.

[0026] Figure 3 This is a cross-sectional schematic diagram of the encapsulated casing in one embodiment of this application.

[0027] Figure 4 This is a schematic diagram of the encapsulation tube shell without a light-transmitting cover in one embodiment of this application. Detailed Implementation

[0028] The following specific examples illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that, unless otherwise specified, the following embodiments and features described therein can be combined with each other.

[0029] It should be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of the present invention. Therefore, the drawings only show the components related to the present invention and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0030] Currently, domestic and international methods for achieving device self-destruction mainly include chemical etching, energetic chips, and stress-induced chip breakage. Among these, chemical etching is one of the most economical and simplest methods, capable of completely destroying the device structure.

[0031] The significance of hermetic packaging lies in isolating the device inside the casing from the external environment, preventing harmful gases such as moisture and sulfur dioxide from entering the casing. This is primarily for device structures with strict environmental requirements. For these device structures, since they are not in contact with the external environment and are protected by the casing, how to achieve intelligent self-destruction is a very important but often overlooked issue.

[0032] Based on the problems of the existing technology, this application considers the degree of transferability between transient electronics technology and wafer-level sensor packaging, and designs a transient self-destructible multilayer sensor packaging structure based on current device manufacturing and packaging processes. On the basis of the packaged device, grooves are laser-cut inside the existing package shell and bonded to a perforated middle layer separator. A metal film is filled below the perforated middle layer separator to achieve multilayer hermetic protection for the sensor device. With this structure, this packaging method can greatly ensure the vacuum packaging conditions required by the sensor device, while the photosensitive polymer filled in the grooves enables controlled self-destruction of the device. The technical solution of this application will be described in detail below with reference to specific embodiments.

[0033] Please see Figure 1 This application provides a transient self-destructible integrated circuit device, comprising: a substrate, a package 1 4, a recess 7, a porous separator 9, a photosensitive polymer, a sensor 12, and a light-transmitting cover 6. The substrate 1 is typically made of silicon. The package 1 is fastened to the substrate 1, and the package 1 and the substrate 1 cooperate to form a closed cavity structure. The package 1 4 can be made of metal or ceramic materials; the specific material can be selected according to the actual application requirements and is not limited here.

[0034] In one embodiment, a groove 7 can be formed on the side of the package 4 facing away from the substrate 1 by laser cutting. The bottom of the groove 7 is connected to a porous partition 9, and the porous partition 9 and the sidewall of the groove 7 cooperate to form a bottom-closed groove structure so as to store the photosensitive polymer through the groove 7. The sidewall of the groove 7 and the porous partition 9 can be bonded with bonding adhesive. The porous partition 9 is provided with pores (3, 10) near the sidewall of the groove 7. After the photosensitive polymer decomposes under light to form a corrosive solution, the corrosive solution can flow into the space below through the pores (3, 10) to form single-point corrosion, avoiding insufficient corrosive solution to affect the self-destruction effect of the device.

[0035] In one embodiment, a porous partition 9 can be disposed near the center of the internal cavity of the packaging shell 4 to separate the internal cavity and form two chambers. The porous partition 9 can be made of a silicon substrate. The porous partition 9 can be disposed in the packaging shell 4 by welding or integrally formed with the packaging shell 4, depending on the actual application requirements, and is not limited here.

[0036] In one embodiment, a sealing layer may be provided on the side of the porous partition 9 opposite to the groove 7 to further enhance the airtightness of the separated chamber. The sealing layer may be a thin metal film, which is corroded by the corrosive solution, allowing the solution to smoothly enter the lower chamber. Exemplarily, the thin metal film may be made of copper, aluminum, potassium, or magnesium, etc.

[0037] In one embodiment, the sensor 12 is placed in the cavity between the porous partition 9 and the substrate 1. The type of sensor 12 can be set according to the actual application requirements, and there is no limitation here.

[0038] Please see Figure 2 , Figure 2This is a top view of the encapsulation housing 4 in one embodiment of this application. The location of the groove 7 on the top of the encapsulation housing 4 can be sealed by a light-transmitting cover plate 6. The light-transmitting cover plate 6 is bonded to the encapsulation housing 4 with adhesive, which can fill gaps during installation and enhance the overall sealing performance. The material of the light-transmitting cover plate 6 can be silicate, acrylic, polycarbonate, polymethyl methacrylate, polystyrene, or polydiallyl diethylene glycol carbonate, etc. The specific material selection can be determined according to the actual application requirements and is not limited here.

[0039] Please see Figure 3 , Figure 3 This is a cross-sectional schematic diagram of the encapsulation housing 4 in one embodiment of this application. A groove opening is formed at the top of the encapsulation housing 4 by laser cutting, creating an inwardly extending groove sidewall 7. The groove sidewall 7 can be used to bond with a porous structure to form a bonding layer (5, 8). The sidewall of the encapsulation housing 4 can also be bonded to the substrate 1 to form a bonding layer (2, 13).

[0040] Please see Figure 4 , Figure 4 This is a schematic diagram of the encapsulation housing 4 without the light-transmitting cover 6 installed in one embodiment of this application. A groove opening is formed at the top of the encapsulation housing 4, and a step is formed at the outer edge of the groove opening. This step serves as the mounting position for the light-transmitting cover 6. The light-transmitting cover 6 is placed on the step and bonded with adhesive to form a sealed structure.

[0041] The fabrication steps of the transient self-destructible integrated circuit device of this application are described below with reference to specific embodiments.

[0042] Taking a ceramic encapsulation shell as an example, the ceramic encapsulation shell is laser-cut to form a recessed groove; a porous silicon substrate (i.e., a porous partition) is inserted into the center of the ceramic encapsulation shell, and the bottom of the groove of the ceramic encapsulation shell is bonded to the porous silicon substrate, forming bonding layers (5, 8) on both sides of the groove wall; a hard metal thin layer (i.e., a sealing layer) is bonded below the porous silicon substrate and hermetically sealed; a photosensitive PAG polymer (i.e., a photosensitive polymer) is placed into the groove of the shell, and a light-transmitting material is re-placed on the top of the groove and the contact gap is hermetically sealed with adhesive to form a new top cover; the encapsulation shell obtained after the above steps is cleaned, and the silicon substrate is bonded to achieve sensor device encapsulation.

[0043] The porous silicon substrate has a porous structure near the bonding layer. When the PAG polymer is triggered, the acidic solution it generates flows out from the bonding layer and flows into the pores of the porous silicon substrate, achieving point-like aggregated corrosion of the metal thin film layer and ensuring that enough acidic solution flows to the sensor device.

[0044] In one embodiment, a 9mm x 9mm x 11mm ceramic encapsulation shell is laser-cut into [size not specified]. Figure 3The structure shown is machined to form a recessed groove, with the groove portion having dimensions of 5mm x 5mm x 3mm. Figure 4 The top view shows a porous silicon substrate (parallel seam weld) welded to the center of the ceramic package shell, with a thickness of 2mm. The bottom of the recessed area of ​​the ceramic package shell is bonded to the porous silicon substrate, forming a bonding layer on both sides of the recess wall, allowing acidic solutions to flow out through the bonding layer. A 1mm thick layer of hard aluminum is bonded below the porous silicon substrate and hermetically sealed (using adhesive to hermetically seal the contact gap, ensuring the air gap is less than 0.05mm). A photosensitive PAG / polymer (triazine compound) is placed into the recessed area of ​​the ceramic package shell, and an acrylic plate is reinserted on top, with the contact gap hermetically sealed using adhesive to form a new top cover, with an air gap of less than 0.05mm at the contact point. The package shell obtained after the above steps is cleaned, and substrate 1 is bonded to achieve sensor device packaging.

[0045] Based on the above technical solutions, this application adopts a multi-layer packaging method, which greatly ensures the hermeticity requirements of the device; the self-destruct mechanism is based on light triggering, and controllable self-destruction can be achieved by adjusting the light intensity of the light receiving area.

[0046] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in the present invention should still be covered by the claims of the present invention.

Claims

1. A transient self-destructible integrated circuit device, characterized in that, include: Substrate; A packaged tube is fastened to the substrate, forming a cavity inside the packaged tube; A groove, the top opening of which is located on the side of the packaging shell opposite to the substrate; A porous partition is disposed within the cavity and abuts against the bottom of the groove to seal the bottom of the groove; A photosensitive polymer is disposed within the groove to generate a corrosive solution under light irradiation; The sensor is disposed between the substrate and the porous partition. A light-transmitting cover plate is disposed at the top opening of the groove to close the top opening, allowing light to pass through the light-transmitting cover plate into the groove.

2. The transient self-destructible integrated circuit device according to claim 1, characterized in that, The porous partition has a sealing layer on the side opposite to the groove, which is used to cooperate with the encapsulation shell and the substrate to form a sealed space for accommodating the sensor.

3. The transient self-destructible integrated circuit device according to claim 1, characterized in that, The porous partition is provided with a porous structure near the side wall of the groove, and the generated corrosive solution flows into the space where the sensor is located through the porous structure.

4. The transient self-destructible integrated circuit device according to claim 2, characterized in that, The sealing layer is made of materials including copper, aluminum, potassium, or magnesium.

5. The transient self-destructible integrated circuit device according to claim 1, characterized in that, The materials used for the light-transmitting cover include: silicate, acrylic, polycarbonate, polymethyl methacrylate, polystyrene, or polydiallyl diethylene glycol carbonate.

6. The transient self-destructible integrated circuit device according to claim 1, characterized in that, The photosensitive polymer includes: diazonium salt compounds, triazine compounds, onium salt compounds, or sulfonate compounds.

7. The transient self-destructible integrated circuit device according to claim 1, characterized in that, The sidewall of the groove is connected to the porous partition through a bonding layer.

8. The transient self-destructible integrated circuit device according to claim 1, characterized in that, The light-transmitting cover is sealed to the encapsulation tube shell by an adhesive.

9. The transient self-destructible integrated circuit device according to claim 1, characterized in that, The encapsulation shell is bonded to the substrate.

10. The transient self-destructible integrated circuit device according to claim 1, characterized in that, The material of the encapsulation shell includes ceramic.

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