Parallel type double independent cavity heat transfer structure

Abstract

The application relates to a heat transfer structure with double independent cavities and parallel heat conduction paths, which comprises a temperature equalizing plate with a temperature equalizing cavity, a cavity partition plate is arranged in the temperature equalizing cavity of the temperature equalizing plate, and the cavity partition plate divides the temperature equalizing cavity into a first cavity and a second cavity; the cavity partition plate is provided with at least one recessed part, the recessed part is attached to the wall surface of the temperature equalizing cavity, and the heat conduction working medium in the first cavity and the second cavity can simultaneously act on the side wall surface. The heat transfer structure with double independent cavities in parallel has two independent cavities on the same temperature equalizing plate, the two independent cavities are alternately arranged, can contact two surfaces of the temperature equalizing plate, can perform heat distribution, the heat source on the bottom surface of the temperature equalizing plate can be simultaneously conducted by the working medium in the two independent cavities, two different heat conduction working media can be selected for temperature equalization, work under different environmental temperatures can be adapted, and high-efficiency heat transfer under different environmental temperatures can be met.

Description

Technical Field

[0001] This invention relates to the field of temperature equalization in power batteries, and in particular to a heat transfer structure with parallel dual independent cavities. Background Technology

[0002] Temperature has the greatest impact on battery charge and discharge performance. The electrochemical reactions at the electrode / electrolyte interface are related to ambient temperature. If the temperature decreases, the electrode reaction rate also decreases. Assuming the battery voltage remains constant, the discharge current decreases, and the battery's power output also decreases. Conversely, if the temperature rises, the battery output power increases. Temperature also affects the electrolyte transport rate; higher temperatures accelerate transport, while lower temperatures slow it down, thus affecting the charge and discharge performance of lithium batteries. However, excessively high temperatures can disrupt the chemical balance within the battery, leading to side reactions. The discharge efficiency of nickel-cadmium, nickel-metal hydride, and lithium batteries decreases significantly at low temperatures (e.g., below -15°C), and at -20°C, the alkaline solution reaches its freezing point, greatly reducing the battery charging speed.

[0003] Power batteries, such as blade batteries, rely on a liquid cooling plate on the base plate to dissipate heat. However, during fast charging, the temperature difference between the outer tabs and the center of the blade battery can be excessive, reaching over 20 degrees Celsius or even higher. This can cause uneven temperature distribution across different parts of the battery, leading to localized failure and impacting its lifespan. Maintaining uniform temperature across all parts of the battery is a key issue determining the success of fast charging technology. Therefore, the performance of the vapor chamber plays a crucial role in fast charging technology.

[0004] Power batteries must maintain a consistent temperature uniformity across different regions and seasons. Since ambient temperatures vary greatly, reaching above 50°C in summer and below -34°C in winter, the working fluids commonly used in vapor chambers are either ambient temperature or cryogenic. These working fluids in low-pressure, sealed containers absorb heat at the heat source end, evaporating from liquid to vapor and rapidly transferring heat to the condensation section. Ambient temperature working fluids use deionized water, which freezes at low temperatures, rendering it inoperable and unable to transfer heat. Cryogenic working fluids can use refrigerants, methanol, and acetone, which can operate even at temperatures below -30°C. The former has better performance at ambient temperature, while the latter can start operating at low temperatures but has lower heat transfer power. Currently, vapor chambers only offer a single working fluid, either capable of operating at ambient temperature with high heat transfer power and good performance, or capable of starting operating at low temperatures but with lower heat transfer power and poorer performance. To maintain high-power heat transfer and good temperature uniformity at both high and low temperatures, the common practice is to fabricate two different working fluids into different heat pipes and arrange them in a regular, spaced manner. This satisfies the temperature uniformity at low and normal temperatures. For the same battery cell, it must either contact the low-temperature heat pipe or the normal-temperature heat pipe, and cannot contact both simultaneously. Therefore, only individual batteries can be temperature-uniformed, and adjacent batteries cannot be temperature-uniformed at the same time. This will result in poor temperature uniformity for some batteries at low temperatures, leading to battery failure and affecting battery life.

[0005] Furthermore, in the field of electronic chips, most existing data center servers use air cooling to transfer heat from the chips to the data center rooms, and then air conditioning to dissipate the heat outdoors. This method consumes a large amount of electricity. As the power consumption and heat flux density of chips increase dramatically in the future, chips with a power consumption of 500W or more will become the mainstream, doubling or even tripling the power consumption. If the old method of chip air cooling combined with air conditioning is still used for heat dissipation, the power consumption will be astronomical. This is completely inconsistent with the national requirements for energy conservation and emission reduction in data centers. Therefore, relevant manufacturers in the data center server field have begun to design liquid cooling methods for heat conduction and dissipation to meet the country's high requirements for energy conservation and emission reduction. This is also why many data centers are located underwater or in countries or regions with low ambient temperatures.

[0006] Currently, the most common liquid cooling method for chips is to use the base plate of the water cooling head to conduct the heat from the chip to the convection-enhanced heat transfer fins. Under the pressure of the water pump, the liquid mixture exchanges heat with the convection-enhanced heat transfer fins of the water cooling head through convection. The heat transfer path is a unidirectional series connection, where heat can only be exchanged along the path of chip, base plate of water cooling head, convection-enhanced heat transfer fins on the base plate, and liquid mixture. The thermal resistance of the entire heat transfer path is composed of the thermal resistance of each component itself and the contact thermal resistance between the two components. Among these factors, the thermal resistance of the enhanced heat transfer fins and the temperature uniformity of its various parts have a significant impact on the thermal resistance. Especially when the chip size is small, due to the series connection, under such high power consumption conditions, the thermal resistance of the enhanced heat transfer fins and the temperature difference are too large, which in turn affects the thermal resistance of the entire heat transfer path. Summary of the Invention

[0007] To overcome at least some of the problems mentioned above, this invention provides a parallel dual-independent-cavity heat transfer structure. The same heat exchanger plate has two independent cavities arranged alternately, each capable of contacting both sides of the heat exchanger plate. This allows for heat diversion and temperature equalization, enabling the heat source on the bottom surface of the heat exchanger plate to be simultaneously conducted by the working fluids within the two independent cavities. It allows for the selection of two different heat-conducting working fluids for heat transfer and temperature equalization, adapting to different ambient temperatures and achieving efficient heat transfer under varying conditions. This maintains temperature consistency across all cells of the power battery and improves the fast-charging efficiency of the power battery.

[0008] The technical solution adopted by the present invention to solve its technical problem is: a heat transfer structure with dual independent cavities and parallel heat conduction paths, including a heat spreader plate with a heat spreader cavity inside, and a cavity partition plate is provided in the heat spreader cavity of the heat spreader plate to divide the heat spreader cavity into a first cavity and a second cavity; the cavity partition plate is provided with at least one recessed portion, which is attached to the wall surface of the heat spreader cavity, so that the heat conduction working fluid in the first cavity and the second cavity can act on the side wall surface simultaneously.

[0009] Preferably, the recessed portion includes a plurality of first recessed portions and second recessed portions, which are disposed on the cavity partition plate. The recessed directions of the first recessed portions and the second recessed portions are opposite, and at least one first recessed portion or second recessed portion is in contact with the wall surface of the uniform temperature cavity, so that the first cavity or the second cavity can contact the wall surface of the uniform temperature cavity.

[0010] Preferably, the first recess and the second recess are respectively attached to the two end walls of the uniform temperature cavity, so that the first cavity and the second cavity can contact the upper and lower end surfaces of the uniform temperature cavity.

[0011] Preferably, different heat-conducting working fluids are provided in the first cavity and the second cavity respectively.

[0012] Preferably, the first and second recesses are arranged alternately in a longitudinal and transverse manner on the cavity partition plate, and there is a transition interval between the first and second recesses, which makes the first cavity and the second cavity form independent and connected cavities respectively.

[0013] Preferably, at least one of the upper and lower walls of the temperature equalization cavity of the temperature equalization plate is provided with a porous medium capillary structure.

[0014] Preferably, at least one side of the cavity partition plate is provided with a porous medium capillary structure.

[0015] Preferably, at least one support column is provided in the temperature equalization cavity of the temperature equalization plate, with one end of the support column connected to the wall of the temperature equalization cavity and the other end connected to the first recess or the second recess.

[0016] Preferably, at least one support column is provided in the first cavity and the second cavity.

[0017] Preferably, one of the first cavity and the second cavity is a liquid-cooled cavity, and two connection ports for communicating with the liquid-cooled cavity are provided on the outside of the heat spreader.

[0018] Preferably, the liquid cooling cavity is provided with a convection-enhanced heat transfer fin assembly, which directs the liquid flow from one connection port to the other.

[0019] The beneficial effects of this invention are: a parallel dual-independent-cavity heat transfer structure, with two independent cavities on the same heat spreader plate, the two independent cavities are arranged alternately, and both can contact both sides of the heat spreader plate, so that the same battery can be heated by the working fluid in the two independent cavities at the same time. It can select two different heat-conducting working fluids for heat spreader plate, such as low-temperature working fluid and room-temperature working fluid, taking advantage of the advantages of each working fluid, so as to achieve the best heat spreader plate level in various environments, control the temperature difference within the requirements, meet the requirements of efficient heat transfer under different ambient temperatures, maintain the temperature uniformity of each battery cell of the power battery, and improve the fast charging efficiency of the power battery.

[0020] Alternatively, in two independent cavities, one cavity uses a phase change working fluid and the other uses a liquid-cooled working fluid. Part of the heat from the chip is directly conducted to the bottom panel and convection-enhanced heat transfer fins on the liquid-cooled side, and then to the liquid-cooled mixture. Another part of the heat is transferred from the liquid to vapor through the phase change process of the working fluid, and then to the cavity partition plate. The cavity partition plate then conducts the heat to the enhanced convection heat transfer fins, and finally to the liquid-cooled mixture. In this way, the convection heat transfer area is greatly increased and the thermal resistance of the other heat conduction path is reduced. Overall, this heat transfer structure has excellent heat transfer performance.

[0021] Alternatively, when the heat source is attached to the bottom panel of the heat transfer structure in this embodiment, all the heat is diverted through a portion of the bottom panel to the enhanced convection heat transfer fin assembly. A portion still passes through the bottom panel to the enhanced convection heat transfer fin assembly, while the other portion passes through a vapor chamber with higher thermal conductivity to the enhanced convection heat transfer fin assembly. The heat distribution between these two processes is dynamically determined by the performance of the vapor chamber. The enhanced convection heat transfer fin assembly is typically made of copper, with a thermal conductivity of approximately 380 W / mK, but the vapor chamber's thermal conductivity can be 10 times, or even over 100 times, that of copper. Under such high power consumption conditions, the parallel connection significantly reduces the thermal resistance of the entire heat transfer path. Attached Figure Description

[0022] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0023] Figure 1 This is a schematic diagram of the overall structure of the heat transfer structure with dual independent cavities and parallel heat conduction paths in Embodiment 1 of the present invention.

[0024] Figure 2 This is a cross-sectional schematic diagram of the heat transfer structure with dual independent cavities and parallel heat conduction paths according to Embodiment 1 of the present invention.

[0025] Figure 3 This is an exploded view of the heat transfer structure with dual independent cavities and parallel heat conduction paths according to Embodiment 1 of the present invention;

[0026] Figure 4 This is a schematic diagram of the overall structure of the heat transfer structure with dual independent cavities and parallel heat conduction paths in Embodiment 2 of the present invention.

[0027] Figure 5 This is a cross-sectional schematic diagram of the heat transfer structure with dual independent cavities and parallel heat conduction paths according to Embodiment 2 of the present invention.

[0028] Figure 6 This is an exploded view of the heat transfer structure with dual independent cavities and parallel heat conduction paths in Embodiment 2 of the present invention.

[0029] Figure 7 This is an exploded view of the overall structure of the heat transfer structure with dual independent cavities and parallel heat conduction paths in Embodiment 2 of the present invention.

[0030] Figure 8 This is an exploded view of the overall structure of the heat transfer structure with dual independent cavities and parallel heat conduction paths in Embodiment 3 of the present invention. Detailed Implementation

[0031] The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic diagrams, illustrating only the basic structure of the invention, and therefore only show the components relevant to the invention.

[0032] Example 1

[0033] like Figure 1 , 2 As shown in Figure 3, the heat transfer structure with dual independent cavities and parallel heat conduction paths has a main body of a heat spreader plate structure. A cavity partition plate 2 is provided in the heat spreader plate 1 cavity, which divides the heat spreader plate 1 to form a first cavity 3 and a second cavity 4. The cavity partition plate 2 is provided with at least one recessed part, which is attached to the wall of the heat spreader plate 1, so that the heat conduction medium in the first cavity 3 and the second cavity 4 can act on the side wall simultaneously.

[0034] Among them, see Figure 3 The heat exchange plate 1 is composed of an upper heat exchange plate shell 11 and a lower heat exchange plate 12.

[0035] In this embodiment, a recessed portion is provided in the middle of the cavity partition plate 2. The recessed portion is attached to the bottom side wall of the uniform temperature cavity. In this embodiment, when the heat transfer structure is applied, the area of ​​the recessed portion is smaller than the area of ​​the heat source 10. When the heat source is attached to the bottom panel of this heat transfer structure, that is, when the heat source is attached to the first cavity 3 and the second cavity 4 of the uniform temperature plate 1, the heat is uniformly heated and conducted by the heat-conducting working fluid in the first cavity 3 and the second cavity 4 respectively.

[0036] Different heat-conducting working fluids are respectively installed in the first cavity 3 and the second cavity 4.

[0037] The first cavity 3 is a uniform temperature cavity located at the top. The sidewalls of the first cavity 3 are sintered with porous capillary structures 8, and the heat-conducting medium inside the first cavity 3 is deionized water. The second cavity 4 is a liquid-cooled cavity. The upper part of the uniform temperature plate 1 has two connection ports 6 connecting to the liquid-cooled cavity. The connection ports 6 penetrate the upper panel of the uniform temperature plate 1 and then penetrate the cavity partition plate 2. The connection ports 6 are respectively connected to an external water-cooling drive device, forming a liquid-cooled convection enhanced heat transfer channel.

[0038] A support column 5 is provided in the middle of the recessed part, and the upper and lower ends of the support column 5 contact the middle of the recessed part of the heat exchange plate shell 11 and the cavity partition plate 2.

[0039] The liquid-cooled cavity is equipped with a convection-enhanced heat transfer fin assembly 7, which directs the liquid flow from one connection port 6 to the other. The fin assembly 7 consists of multiple fins welded to the cavity partition plate 2 and the liquid-cooled cavity. Alternatively, the convection-enhanced heat transfer fin assembly can be formed by serrations on the bottom plate and then welded between the cavity partition plate 2 and the liquid-cooled cavity.

[0040] The heat spreader in this embodiment combines heat dissipation and liquid cooling functions, making it suitable for heat conduction of large-size, high-power chips.

[0041] When the heat source is attached to the bottom panel of the heat transfer structure in this embodiment, all the heat passes through the part in contact with it, and then all the heat is split along a parallel heat conduction path. Part of the heat still passes through the end face of the convection-enhanced heat transfer fin assembly in contact with the bottom panel, while another part passes through a vapor chamber with a higher thermal conductivity to the other end face of the convection-enhanced heat transfer fin assembly. The heat from these two parts is dynamically distributed by the thermal conductivity of the vapor chamber. The material of the convection-enhanced heat transfer fin assembly is generally copper, with a thermal conductivity of approximately 380 W / mK. However, the thermal conductivity of the vapor chamber can be 10 times, or even more than 100 times, that of copper. Therefore, under such high power consumption conditions, the parallel heat conduction path method greatly reduces the thermal resistance of the entire heat transfer path.

[0042] Example 2

[0043] like Figure 4-7 As shown, the heat transfer structure with two independent cavities and parallel heat conduction paths has a main body of a heat spreader plate structure. A cavity partition plate 2 is provided in the heat spreader plate 1 cavity, which divides the heat spreader plate 1 to form a first cavity 3 and a second cavity 4. The cavity partition plate 2 is provided with at least one recessed part, which is attached to the wall of the heat spreader plate 1, so that the heat conduction medium in the first cavity 3 and the second cavity 4 can act on the side wall at the same time.

[0044] In this embodiment, the recessed portion includes a plurality of first recessed portions 21 and second recessed portions 22. The first recessed portions 21 and second recessed portions 22 are alternately arranged on the cavity partition plate 2. The recessed directions of the first recessed portions 21 and the second recessed portions 22 are opposite. The first recessed portions 21 and the second recessed portions 22 are respectively attached to the two end walls of the uniform temperature cavity, so that the first cavity 3 and the second cavity 4 can respectively contact the upper and lower end surfaces of the uniform temperature cavity.

[0045] In other embodiments, only a portion of the first recess 21 and the second recess 22 are in contact with the wall of the uniform temperature cavity.

[0046] Among them, see Figure 4 , 5 6. The heat exchange plate 1 is composed of an upper heat exchange plate shell 11 and a lower heat exchange plate 12. Figure 4 , 5 6 is for simplified structure.

[0047] In this embodiment, different heat-conducting working fluids are respectively provided inside the first cavity 3 and the second cavity 4. A room-temperature working fluid and a low-temperature working fluid are respectively provided inside the first cavity 3 and the second cavity 4. The room-temperature working fluid is deionized water, which freezes and cannot function at low temperatures. The low-temperature working fluid can be refrigerant, methanol, or acetone, and can function even at ambient temperatures below -30°C. The former has high heat transfer power and low thermal resistance at room temperature, while the latter has better start-up performance at low temperatures. This solves the problem that when the heat spreader has only a single working fluid, it either performs better at room temperature or at low temperatures.

[0048] Its first cavity 3 and second cavity 4 form a normal temperature cavity and a low temperature cavity.

[0049] In this embodiment, the same side of the heat spreader contains both low-temperature and normal-temperature working fluids for heat conduction, which can meet all temperature difference requirements at low and normal temperatures. Both cavities are sealed containers with different working fluids, which can solve the problem of battery heat dissipation under low and normal temperature environments.

[0050] The difference between cryogenic working fluid and room temperature water working fluid: Cryogenic working fluid can operate at low temperatures, such as -30°C, but its heat transfer power is relatively low and its thermal resistance is relatively high when it is in a horizontal position. Therefore, its heat transfer in high-temperature environments is limited and it cannot meet the temperature uniformity requirements under high power. Room temperature water working fluid freezes at low temperatures and cannot transfer heat, but its heat transfer power is relatively high and its thermal resistance is relatively low in room temperature environments, such as 40°C. Therefore, the heat spreader in this embodiment is combined with these two working fluids, taking advantage of their respective strengths, in order to achieve the best performance and control the temperature difference within the requirements.

[0051] In this embodiment, the first recess 21 and the second recess 22 are arranged on the cavity partition plate 2, and the first cavity 3 and the second cavity 4 can be arranged according to their respective heat transfer power capabilities, and have the same temperature uniformity performance.

[0052] In this embodiment, there is a transition gap between the first recess 21 and the second recess 22, which allows the first cavity 3 and the second cavity 4 to form independent but connected cavities. The transition gap connects adjacent first recesses 21 and adjacent second recesses 22.

[0053] See Figure 7 , Figure 7 This is an exploded view of the complete structure in this embodiment.

[0054] In this embodiment, a porous medium capillary structure 8 is sintered on the upper and lower walls of the temperature uniform cavity of the temperature uniform plate 1. The porous medium capillary structure is sintered from copper powder or copper mesh.

[0055] Furthermore, in this embodiment, a porous medium capillary structure 8 is also sintered on both sides of the cavity partition plate 2.

[0056] Multiple support columns 5 are provided inside the temperature equalization cavity of the temperature equalization plate 1. One end of each support column 5 is connected to the wall of the temperature equalization cavity, and the other end is connected to either the first recess 21 or the second recess 22. These support columns provide support to the upper and lower walls of the two cavities. In this embodiment, support columns 5 are respectively provided inside the first cavity 3 and the second cavity 4. The support columns 5 are evenly distributed according to the actual size of the temperature equalization plate 1; or they can be provided within each of the first cavity 3 and the second cavity 4.

[0057] The outer layer of the support column 5 is sintered with a porous medium capillary structure 8, which connects the upper and lower walls of the heat spreader 1 with the porous medium capillary structure on the upper and lower end faces of the partition plate 2.

[0058] The heat spreader in this embodiment has two independent cavities. The low-temperature cavity and the normal-temperature cavity are arranged alternately as needed. The same battery can be in contact with both low-temperature working fluid for heat transfer and normal-temperature working fluid for heat transfer, which can meet the requirements of efficient heat transfer and temperature equalization under different ambient temperatures.

[0059] Among them, the working fluid at room temperature is deionized water, which freezes and cannot work at low temperatures. The working fluid at low temperatures can be refrigerant, methanol and acetone, which can work even at ambient temperatures below -30°C. However, water has a higher heat transfer power at room temperature. Therefore, the parallel dual independent cavity heat transfer structure in this invention, which is equipped with both high and low temperature working fluids, can work simultaneously to meet the requirements of efficient heat conduction and temperature uniformity in both low and normal temperature environments.

[0060] Each individual cell has both low-temperature and normal-temperature working fluids for heat transfer, which can fully control the temperature difference within the required range regardless of whether the environment is low-temperature or high-temperature.

[0061] In application, the dual-chamber heat spreader is placed on top of the blade battery. Another application scenario is to place this heat spreader between two blade batteries to better equalize the temperature of the two adjacent blade batteries.

[0062] During fast charging, the shorter the charging time, the greater the heat generation and power consumption. If the battery is not rapidly homogenized, certain areas may overheat due to fast charging, posing a risk of explosion and shortening battery life. In this embodiment, the temperature distribution plate has fully interconnected low-temperature and normal-temperature chambers. This means that the high-temperature battery in the middle can conduct heat to the lower-temperature battery on the outside, thereby achieving temperature homogenization among different individual batteries.

[0063] Example 3

[0064] like Figure 8As shown, the heat transfer structure with two independent cavities and parallel heat conduction paths has a main body of a heat spreader plate structure. A cavity partition plate 2 is provided in the heat spreader plate 1 cavity, which divides the heat spreader plate 1 to form a first cavity 3 and a second cavity 4. The cavity partition plate 2 is provided with at least one recessed part, which is attached to the wall of the heat spreader plate 1, so that the heat conduction medium in the first cavity 3 and the second cavity 4 can act on the side wall at the same time.

[0065] The heat exchange plate 1 is composed of an upper heat exchange plate shell 11 and a lower heat exchange plate 12.

[0066] In this embodiment, the recessed portion includes a first recessed portion 21 and a second recessed portion 22. The first recessed portion 21 and the second recessed portion 22 are alternately arranged on the cavity partition plate 2. The recessed directions of the first recessed portion 21 and the second recessed portion 22 are opposite. The first recessed portion 21 and the second recessed portion 22 are respectively attached to the two end walls of the uniform temperature cavity, so that the first cavity 3 and the second cavity 4 can respectively contact the upper and lower end surfaces of the uniform temperature cavity.

[0067] The difference between this embodiment and Embodiment 1 is that the recessed portion is composed of a first recessed portion 21 and a second recessed portion 22, arranged in a longitudinal and transverse alternating layout.

[0068] In this embodiment, there is a transition gap between the first recess 21 and the second recess 22, which makes the first cavity 3 and the second cavity 4 form independent and connected cavities respectively.

[0069] In this embodiment, multiple support columns 5 are provided inside the temperature equalization cavity of the temperature equalization plate 1. One end of each support column 5 is connected to the wall of the temperature equalization cavity, and the other end is connected to the first recess 21 or the second recess 22. This provides support to the upper and lower walls of the two cavities. In this embodiment, support columns 5 are respectively provided inside the first cavity 3 and the second cavity 4. The support columns 5 are evenly distributed according to the actual size of the temperature equalization plate 1; or they can be provided inside each of the first cavity 3 and the second cavity 4.

[0070] In this embodiment, different heat-conducting working fluids are respectively installed inside the first cavity 3 and the second cavity 4. One cavity is a closed phase-change heat-conducting isothermal structure, and the other cavity is a liquid-cooled cavity. Two connection ports 6 are provided on the outside of the isothermal plate 1 to connect to the liquid-cooled cavity. The connection ports 6 are respectively connected to an external water-cooling drive device to form a liquid-cooled convection enhanced heat transfer channel.

[0071] The liquid-cooled cavity is equipped with a convection-enhanced heat transfer fin assembly 7, which directs the liquid flow from one connection port 6 to the other. The fin assembly 7 consists of multiple fins welded to the cavity partition plate 2 and the liquid-cooled cavity. Alternatively, the convection-enhanced heat transfer fin assembly can be formed by serrations on the bottom plate and then welded between the cavity partition plate 2 and the liquid-cooled cavity.

[0072] In this embodiment, the vapor chamber has two chambers. One chamber is a sealed container where the working fluid undergoes a phase change for heat transfer. The other chamber is filled with a liquid mixture, which removes heat through liquid cooling. This example is suitable for applications involving large-size, high-power chips or chips with multiple heat sources. On one hand, the sealed phase-change heat transfer chamber can quickly reduce the heat flux density of the chip. Compared to liquid cooling of large-size, high-power chips, in this embodiment, the heat conduction of the heat-conducting fins is not entirely from the bottom plate of the vapor chamber to the bottom of the fins and then to the top for enhanced convection heat transfer with the liquid mixture. Instead, a portion of the heat is transferred from the bottom plate to the bottom of the heat-conducting fins, and another portion is transferred from the other phase-change chamber of the vapor chamber to the top of the finned heat-conducting fins. This means that heat is transferred bidirectionally from both the bottom and top of the finned heat-conducting fins, maintaining low thermal resistance and temperature uniformity, thus fully utilizing the advantages of liquid cooling.

[0073] When the heat source is attached to the bottom panel of the heat transfer structure in this embodiment, all the heat passes through the part in contact with it, and then all the heat is split along a parallel heat conduction path. Part of the heat still passes through the end face of the convection-enhanced heat transfer fin assembly in contact with the bottom panel, while another part passes through a vapor chamber with a higher thermal conductivity to the other end face of the convection-enhanced heat transfer fin assembly. The heat from these two parts is dynamically distributed by the thermal conductivity of the vapor chamber. The material of the convection-enhanced heat transfer fin assembly is generally copper, with a thermal conductivity of approximately 380 W / mK. However, the thermal conductivity of the vapor chamber can be 10 times, or even more than 100 times, that of copper. Therefore, under such high power consumption conditions, the parallel heat conduction path method greatly reduces the thermal resistance of the entire heat transfer path.

[0074] Based on the above-described preferred embodiments of the present invention, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the inventive concept. The technical scope of this invention is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A heat transfer structure with dual independent cavities and parallel heat conduction paths, comprising a heat spreader with an internal heat spreader cavity, characterized in that: A cavity partition plate is provided inside the temperature-equalizing cavity of the heat-equalizing plate, dividing the temperature-equalizing cavity into a first cavity and a second cavity. The cavity partition plate has at least one recessed portion that adheres to the wall surface of the temperature-equalizing cavity, allowing the heat-conducting working fluid in both the first and second cavities to simultaneously act on the wall surface. The recessed portion includes multiple first and second recessed portions, which are disposed on the cavity partition plate. The first and second recessed portions have opposite recessing directions, and at least one first or second recessed portion adheres to the wall surface of the temperature-equalizing cavity, allowing the first or second cavity to contact the wall surface of the temperature-equalizing cavity. The first and second recessed portions respectively contact the end walls of the temperature-equalizing cavity. The first and second cavities are attached to each other so that they can contact the upper and lower end faces of the uniform temperature cavity, respectively. Different heat-conducting working fluids are respectively provided in the first and second cavities. The first and second recesses are arranged on the cavity partition plate, and there is a transition gap between the first and second recesses, which makes the first and second cavities independent and connected cavities, respectively. At least one side of the upper and lower wall surfaces of the uniform temperature cavity of the uniform temperature plate is provided with a porous medium capillary structure. At least one side of the cavity partition plate is provided with a porous medium capillary structure. At least one support column is provided in the uniform temperature cavity of the uniform temperature plate, with one end of the support column connected to the wall surface of the uniform temperature cavity and the other end connected to the first or second recess.

2. The heat transfer structure with dual independent cavities and parallel heat conduction paths according to claim 1, characterized in that: At least one support column is provided in the first cavity and the second cavity.

3. The heat transfer structure with dual independent cavities and parallel heat conduction paths according to claim 2, characterized in that: One of the first and second cavities is a liquid-cooled cavity, and two connection ports connecting to the liquid-cooled cavity are provided on the outside of the heat spreader.

4. The heat transfer structure with dual independent cavities and parallel heat conduction paths according to claim 3, characterized in that: The liquid cooling cavity is equipped with a convection-enhanced heat transfer fin assembly, which directs the liquid flow from one connection port to the other.

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