A method for gluing and preparing samples of ultra-thin metal plates

Abstract

The invention provides a method for preparing samples by gluing ultra-thin metal plates, comprising the following steps: step S1, processing two ultra-thin metal plates into the size of a gluing sample and wiping the surface with an organic solvent; step S2, selecting a bottom plate and processing it, fixing the two ultra-thin metal plates on the two bottom plates to obtain two plates as an upper plate and a lower plate; step S3, wiping the surface of the ultra-thin metal plates with an organic solvent; step S4, marking the surface of the ultra-thin metal plates of the lower plate to determine a gluing area and a gluing area; step S5, using a non-stick adhesive film to cover the gluing area outside the gluing area, and extending it to cover the two side surfaces of the bottom plate; step S6, injecting adhesive into the gluing area with the assistance of an upper non-stick adhesive film; step S7, applying an even amount of adhesive and removing the upper non-stick adhesive film; step S8, butting and assembling the ultra-thin metal plates of the upper plate and the lower plate in the gluing area to form a gluing joint and fixing it with a chuck; step S9, cleaning the overflowed adhesive and curing it to complete the sample preparation.

Description

Technical Field

[0001] The invention relates to the field of scientific research test methods, and in particular to a method for preparing samples by gluing ultra-thin metal plates. Background Art

[0002] Hydrogen fuel cells are a new type of energy conversion device that is clean and pollution-free, meets the "dual carbon" requirements, and has broad application prospects. As the core component of the hydrogen fuel cell stack, the sealing of ultra-thin bipolar plates is crucial to the energy conversion and service life of the battery. The existing plate sealing mainly adopts the adhesive process. The metal bipolar plate materials in existing products and R&D involve stainless steel, titanium, aluminum, nickel and other metal alloys. The mechanical strength and sealing performance of different adhesives are also different. In order to study the adhesive sealing performance of fuel cell bipolar plates, it is necessary to conduct extensive adhesive performance tests on ultra-thin metal plates.

[0003] Thin plates are extremely thin and have low mechanical properties, which results in poor sample preparation and testing operability. When performing shear, tensile, compression and other performance tests, there are problems such as easy damage to the plate, difficulty in clamping the plate, and easy buckling of the plate. Therefore, thin plate testing requires special methods, and many existing patents involve thin plate testing methods.

[0004] In patent CN110039461A, Xu Xusong and others designed a portable metal sheet clamping device to solve the problem of fixing metal sheets during processing; in patent CN103163019A, Chen Wei and others designed a special fixture for tensile testing of metal sheets or metal foils, which solves the problem of incompatibility of existing fixtures for tensile testing of ultra-thin metal sheets for sheets with a thickness of less than 1 mm; patent CN216433724 U designed a fixture for shear testing of small-sized composite sheets. It solves the problem that existing small-sized composite sheets cannot be clamped during shear tests; patent CN114323949A designed a normal-loaded thin plate micro-tensile test device and method, which solves the technical problem of the blank of micro-tensile mechanical properties of normal-loaded thin plates; patent CN113959847A designed a metal sheet compression test method and a method for judging the effectiveness of sample installation, which solves the problems of judging the effectiveness of thin plate compression tests and methods.

[0005] The above patents mainly focus on the clamping problem of metal sheets during material processing and mechanical property testing, and the thickness limits of metal sheets in various patents are different and not unified.

[0006] However, the existing metal sheet gluing sample preparation method has poor applicability to metal thin plates, especially ultra-thin metal plates with a thickness of less than 0.2 mm. In the existing method for gluing and preparing samples of metal sheets, the gluing area of ​​the gluing joint is at the end of the sheet, which is not suitable for gluing tests of ultra-thin metal sheets: the strength of ultra-thin metal sheets is low, and the corresponding gluing area is small. If the end is still coated with glue, the joint will be difficult to fix and the gluing operation will be difficult, which will easily cause large errors in the gluing area. On the other hand, when the metal sheet is thin (especially metal foil with a thickness of less than 0.2 mm), it is very easy to cause irreversible damage to the metal sheet when making the gluing sample joint. For example, the fixing chuck will produce indentations on the sheet or even directly damage the ultra-thin metal sheet. In addition, the thickness control of the glue layer and the restriction of the flow of glue in the ultra-thin metal sheet joint have their own particularities. There is also the problem of curling and deformation of the ultra-thin metal sheet during the curing operation of the gluing joint. When the joint is subjected to a tensile test, the clamping problem of the ultra-thin metal sheet causes the stress state of the joint glue layer to change to a shear and peeling coupling situation, which makes it impossible to obtain accurate gluing performance. These problems limit the extensive testing of the adhesive properties of ultra-thin metal plates, and the existing experimental methods and patents do not propose effective adhesive testing methods to solve the adhesive problems of ultra-thin metal plates. Summary of the invention

[0007] The present invention is made to solve the above-mentioned problem, and its purpose is to provide a method for preparing samples by gluing ultra-thin metal plates.

[0008] The present invention provides a method for preparing a sample by gluing ultra-thin metal plates, which is characterized by comprising the following steps: step S1, processing two ultra-thin metal plates into the size of a gluing sample and wiping the surfaces of the ultra-thin metal plates with an organic solvent;

[0009] Step S2, selecting a bottom plate that meets the thickness requirements, processing the bottom plate into the same size as the metal ultra-thin plate, fixing two metal ultra-thin plates on the two bottom plates respectively, and obtaining two plates after fixing and serving as the upper plate and the lower plate respectively;

[0010] Step S3, wiping the surface of the metal ultra-thin plate with an organic solvent;

[0011] Step S4, marking the surface of the metal ultra-thin plate of the lower plate to determine the gluing area and the gluing area, wherein the gluing area is located within the gluing area;

[0012] Step S5, using two non-adhesive films to closely cover the adhesive area outside the adhesive coating area, and extending to cover the two side surfaces of the bottom plate;

[0013] Step S6, covering the two non-adhesive films with an upper non-adhesive film, and injecting adhesive into the glue coating area with the help of the upper non-adhesive film;

[0014] Step S7, after the adhesive is evenly applied, the upper non-adhesive film is removed;

[0015] Step S8, the metal ultra-thin plate of the upper plate and the metal ultra-thin plate of the lower plate are butt-jointed and assembled in the adhesive area to form an adhesive joint and fixed with a chuck;

[0016] Step S9, after cleaning the overflowed adhesive, the adhesive is cured to complete the sample preparation.

[0017] The method for preparing a sample by gluing an ultra-thin metal plate provided by the present invention may also have the following characteristics: wherein the thickness of the ultra-thin metal plate is less than 0.2 mm.

[0018] The method for preparing samples by gluing ultra-thin metal plates provided by the present invention may also have the following feature: wherein the size of the gluing sample is 100 mm×25 mm.

[0019] The method for preparing metal ultra-thin plates by gluing provided by the present invention may also have the following characteristics: wherein the materials of the base plate and the non-adhesive film are both acid-resistant, alkali-resistant and high-temperature-resistant materials.

[0020] The method for preparing a sample by gluing an ultra-thin metal plate provided by the present invention may also have the following characteristics: wherein the thickness requirement of the bottom plate in step S2 is obtained by limiting the bending rigidity of the bottom plate, and comprises the following sub-steps:

[0021] Step S2-1, taking the bending stiffness of the test sheet with a thickness of δ0=1 mm as the control bending stiffness K0, K0=E0I0, E0 is the Young's modulus of the test sheet, I0 is the moment of inertia of the test sheet,

[0022] Step S2-2, bending stiffness K of the bottom plate x Need to be greater than the reference bending stiffness K0, according to K x ≥K0, get the bottom plate thickness δ x The calculation formula is as follows:

[0023]

[0024] In formula (1), E0 is the Young's modulus of the test sheet, in MPa, and E x is the Young's modulus of the base plate, in MPa.

[0025] The method for preparing ultra-thin metal plates by gluing provided by the present invention may also have the following characteristics: wherein, in step S3, after wiping the surface of the ultra-thin metal plate with an organic solvent, the ultra-thin metal plate is surface treated or not surface treated according to the use requirements.

[0026] In the method for preparing a sample by gluing an ultra-thin metal plate provided by the present invention, the following features may also be present: wherein step S4 includes the following sub-steps:

[0027] Step S4-1, when marking the surface of the metal ultra-thin plate of the lower plate, the adhesive area is located at one side end of the surface of the metal ultra-thin plate, and the starting line of the adhesive area is 10 mm away from the end of the metal ultra-thin plate;

[0028] Step S4-2, the size of the adhesive area is 25 mm × 25 mm, the length of the glue coating area is 25 mm, and the width of the glue coating area is determined by a single pull test of the metal ultra-thin plate, and the tensile strength σ of the metal ultra-thin plate is obtained by a tensile test. x , and then according to the room temperature shear strength σ of the adhesive 胶 , according to F x ≥F 胶 , get the theoretical maximum adhesive width d max The calculation formula is as follows:

[0029]

[0030] In formula (2), δ 测 is the actual thickness of the metal ultra-thin plate, in mm, and the actual adhesive width d0 <d max , and finally determine the width d0 of the glue coating area.

[0031] The method for preparing metal ultra-thin plates by gluing provided by the present invention may also have the following feature: the thickness of the non-adhesive film is the same as the thickness of the adhesive layer in the adhesive coating area.

[0032] The method for preparing ultra-thin metal plates by gluing provided by the present invention may also have the following features: in step S6, a long strip-shaped opening corresponding to the glue coating area is opened on the upper non-adhesive film, and when applying glue, the long strip-shaped opening is placed above the glue coating area, and adhesive is injected into the glue coating area through the long strip-shaped opening.

[0033] Functions and Effects of the Invention

[0034] The present invention relates to a method for preparing samples by gluing ultra-thin plates. By fixing an ultra-thin metal plate having a thickness of less than 0.2 mm on a base plate of a certain thickness, a certain rigidity and strength are provided to the sample, thereby ensuring the operability of the gluing sample preparation, avoiding damage to the metal material during operation, and ensuring the correct force on the sample during the subsequent shear test. Moreover, the material used for the base plate and the material used for the film of the present invention are selected with better material properties in consideration of the possible surface treatment before gluing the ultra-thin metal plate and the curing environment of the adhesive. In addition, the gluing area of ​​the present invention is changed to be determined by a line at a distance of 10 mm from the end, which is more suitable for gluing ultra-thin metal plates with a narrow gluing area. Meanwhile, the present invention uses a non-adhesive film to limit the gluing area and replaces the commonly used glass beads to control the thickness of the adhesive layer, which is also more suitable for gluing ultra-thin metal plates. Therefore, the method for preparing metal ultra-thin plate adhesive samples of the present invention solves the problems of metal ultra-thin plate adhesive testing, such as difficult metal ultra-thin plate adhesive operation, difficult adhesive layer thickness control, easy damage to metal substrate, and easy curling during the curing process, thereby ensuring the smooth progress of metal ultra-thin plate adhesive sample preparation and subsequent testing, and providing a sample preparation method with strong applicability and good operability for testing the adhesive properties of metal ultra-thin plates. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 It is a schematic flow chart of a method for preparing a sample by gluing an ultra-thin metal plate in an embodiment of the present invention;

[0036] Figure 2 is a schematic structural diagram of a lower plate in an embodiment of the present invention;

[0037] Figure 3 Schematic diagram of the thickness of the adhesive layer before pressing when the upper plate and the lower plate are glued together in an embodiment of the present invention;

[0038] Figure 4 Schematic diagram of the thickness of the adhesive layer after being pressed when the upper plate and the lower plate are glued together in an embodiment of the present invention;

[0039] Figure 5 is a schematic diagram of using an upper non-adhesive film to assist in gluing in an embodiment of the present invention;

[0040] Figure 6 It is a schematic diagram of the structure after the upper plate and the lower plate are glued and cured in an embodiment of the present invention. DETAILED DESCRIPTION

[0041] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is specifically described in the following embodiments in conjunction with the accompanying drawings.

[0042] <Example>

[0043] In this embodiment, the thickness δ金属 =0.1mm metal Ti ultra-thin plate was glued and sampled, and the adhesive used was high temperature curing adhesive DB392.

[0044] Figure 1 The present invention is a schematic flow chart of a method for gluing and preparing a sample of an ultra-thin metal plate in an embodiment of the present invention.

[0045] like Figure 1 As shown, a method for preparing a sample by gluing an ultra-thin metal plate in this embodiment comprises the following steps:

[0046] Step S1, processing two metal Ti ultra-thin plates into the size of adhesive samples and wiping the surfaces of the metal ultra-thin plates with alcohol.

[0047] In this embodiment, alcohol or other organic solvents are used to clean the surface of the metal Ti ultra-thin plate in order to ensure the fixing strength between the metal ultra-thin plate and the base plate, so as to avoid debonding of the metal ultra-thin plate and the base plate in subsequent operations.

[0048] The size of the adhesive specimen is 100 mm × 25 mm.

[0049] Step S2, select a bottom plate that meets the thickness requirements, process the bottom plate into the same size as the metal ultra-thin plate, fix two metal ultra-thin plates on the two bottom plates respectively, and obtain two plates after fixing and use them as the upper plate and the lower plate respectively.

[0050] The selection of the material of the bottom plate needs to consider the curing conditions of the adhesive and the subsequent operating environment involved in the test, and select heat-resistant, acid-resistant and alkali-resistant materials; in addition, select non-metallic materials to reduce the impact of electrochemical corrosion. In this embodiment, polytetrafluoroethylene is selected as the bottom plate material.

[0051] In step S2, the thickness requirement of the bottom plate is obtained by limiting the bending stiffness of the bottom plate, which includes the following sub-steps:

[0052] Step S2-1, taking the bending stiffness of the test sheet with a thickness of δ0=1 mm as the control bending stiffness K0, K0=E0I0, E0 is the Young's modulus of the test sheet, I0 is the moment of inertia of the test sheet,

[0053] Step S2-2, bending stiffness K of the bottom plate x Need to be greater than the reference bending stiffness K0, according to K x ≥K0, get the bottom plate thickness δ x The calculation formula is as follows:

[0054]

[0055] In formula (1), E0 is the Young's modulus of the test sheet, in MPa, and E xis the Young's modulus of the base plate, in MPa.

[0056] In this embodiment, the Young's modulus of the metal Ti ultra-thin plate and the base plate made of polytetrafluoroethylene are E Ti =1.08×10 5 MPa, E PTFE =0.5×10 3 MPa;

[0057] Calculate according to the calculation formula of the bottom plate thickness:

[0058]

[0059] Get δ PTFE ≥5.99mm, so the bottom plate thickness δ is selected in this embodiment PTFE =8mm polytetrafluoroethylene plate is used as the bottom plate to provide a certain rigidity and strength, and ensure good corrosion resistance and high temperature resistance.

[0060] The metal ultra-thin plate and the base plate are fixedly connected by gluing or mechanical connection.

[0061] In this embodiment, double-sided tape is used for fixing. When using double-sided tape, it is also necessary to consider that the working temperature of the double-sided tape must be higher than the curing temperature of the adhesive used and the heat-affected temperature caused by the surface treatment of the metal ultra-thin plate, so as to avoid the subsequent steps (surface treatment, curing of the adhesive) causing the metal ultra-thin plate to debond from the bottom plate. Therefore, this embodiment uses polyimide high-temperature double-sided tape, whose working temperature is higher than the curing temperature of the adhesive high-temperature curing adhesive DB392.

[0062] Step S3, wiping the surface of the metal ultra-thin plate with alcohol.

[0063] In step S3, after the surface of the metal ultra-thin plate is wiped with an organic solvent, the metal ultra-thin plate is subjected to surface treatment or not subjected to surface treatment according to the use requirements. Surface treatment includes laser, plasma and other treatment methods. In this embodiment, surface treatment is not performed.

[0064] In step S1 and step S3, one or more organic solvents such as alcohol can be selected to wipe the metal ultra-thin plate.

[0065] Step S4, drawing lines on the surface of the metal ultra-thin plate of the lower plate to determine the gluing area and the gluing area, wherein the gluing area is located within the gluing area.

[0066] Step S4 includes the following sub-steps:

[0067] Step S4-1, such as Figure 2As shown, when marking the surface of the metal ultra-thin plate of the lower plate, the adhesive area is located at one side of the surface of the metal ultra-thin plate, and the starting line of the adhesive area is 10 mm away from the end of the metal ultra-thin plate;

[0068] Step S4-2, the size of the adhesive area is 25 mm×25 mm, the length of the glue coating area is 25 mm, and the width of the glue coating area is determined by a single pull test of the metal ultra-thin plate.

[0069] In this embodiment, the tensile strength σ of the ultra-thin metal plate is obtained by performing a tensile test. x =365MPa, then according to the shear strength σ of DB392 胶 =10MPa~12MPa, according to the theoretical maximum adhesive width d max The calculation formula is:

[0070]

[0071] Get max ≤3.04mm, take the actual adhesive width d0 <d max , and finally determine the width of the glue coating area d0 = 3mm, and determine the size of the glue coating area to be 3mm×25mm.

[0072] Figure 2 Schematic diagram of the structure of the lower plate in an embodiment of the present invention.

[0073] like Figure 2 As shown, in this embodiment, the dimensions of the base plate 1 and the metal ultra-thin plate 2 are both 100 mm × 25 mm, and the base plate 1 and the metal ultra-thin plate 2 are fixedly connected by a connecting layer 3 formed by a double-sided adhesive tape, and the upper surface of the metal ultra-thin plate 2 is divided into an adhesive area 21 (25 mm) in the length direction, and the adhesive area 21 includes a glue coating area 22, a middle section 23 (50 mm) and a stretching reinforcement section 24 (25 mm), and the starting line of the adhesive area is 10 mm away from the end of the metal ultra-thin plate.

[0074] Step S5, using two non-adhesive films to closely cover the adhesive area outside the adhesive coating area, and extending to cover the two side surfaces of the bottom plate.

[0075] The material of the non-adhesive film is selected to be a heat-resistant, acid-resistant and alkali-resistant non-adhesive material. In this embodiment, the material of the non-adhesive film is polytetrafluoroethylene, which is heat-resistant, acid-resistant and alkali-resistant, and can effectively prevent the adhesive from contacting the non-adhesive coating area. At the same time, the thickness of the non-adhesive film is selected to be 0.05 mm, which is consistent with the required adhesive layer thickness in the adhesive coating area.

[0076] The thickness of the non-stick film is the same as the thickness of the glue layer in the glue-coated area. The thickness of the glue layer in the glue-coated area can be controlled according to the thickness of the non-stick film used. The principle is as follows:

[0077] Figure 3 Schematic diagram of the thickness of the adhesive layer before pressing when the upper plate and the lower plate are glued together in an embodiment of the present invention. Figure 4 It is a schematic diagram of the thickness of the adhesive layer after being pressed when the upper plate and the lower plate are glued together in an embodiment of the present invention.

[0078] like Figure 3 and Figure 4 As shown, when the upper and lower plates are glued together, the clamping force F 夹紧 Ensure the stability of the joint structure before the glue layer solidifies; non-stick film 4 and clamping force F 夹紧 Similar to seals and sealing forces: Under clamping force F 夹紧 Under the action, after the joint structure is pressed, the compression amount of the non-stick film 4 is Δl, and a sealing interface is formed between the metal ultra-thin plate 2 and the non-stick film 4, ensuring that the glue cannot overflow outside the scribed area, but can only overflow from both sides of the joint and be cleaned up; in addition, after the joint is pressed, the thickness of the glue layer δ 胶 It is consistent with the thickness of the non-stick film after being pressed (l-Δl), so the thickness of the adhesive layer can be controlled.

[0079] The selection process of non-stick film thickness is as follows: Determine the adhesive layer thickness requirement δ 胶 , and the clamping force F of the joint 夹紧 , according to the requirement that the thickness of the film after deformation is equal to the thickness of the adhesive layer and the mechanical equation of the compression deformation of the film:

[0080] δ 胶 =l-Δl (3)

[0081] E 膜 ε 膜 =σ (4)

[0082]

[0083] In formulas (3)-(5), A=a×(b 胶接 -d0) is the force bearing area of ​​the non-stick film, E 膜 is the Young's modulus of the non-stick film, in MPa;

[0084] The relationship between the initial thickness of the non-stick film and the thickness of the adhesive layer is as follows:

[0085]

[0086] Analysis is performed, due to the clamping force F 夹紧 <<E 膜 A, the formula is as follows:

[0087] l≈δ 胶 (7)

[0088] In summary, select non-stick films with the same adhesive layer thickness requirements, that is, l≈δ 胶 , to control the thickness of the glue layer and limit overflow.

[0089] Step S6, covering the two non-adhesive films with an upper non-adhesive film, and injecting adhesive into the glue coating area with the help of the upper non-adhesive film.

[0090] Figure 5 It is a schematic diagram of using an upper non-adhesive film to assist in gluing in an embodiment of the present invention.

[0091] like Figure 5 As shown, when applying glue in step S6, an upper non-adhesive film 5 is placed above the two non-adhesive films 4 to assist in the application of glue. The upper non-adhesive film 5 is provided with a long strip opening corresponding to the application area. When applying glue, the long strip opening is placed above the application area, and adhesive is injected into the application area through the long strip opening to control the overflow of glue. The upper non-adhesive film 5 is only used during the application of glue and can be reused to prevent glue from being applied to the upper surface of the non-adhesive film 4 during manual application of glue, causing the glue to overflow between the non-adhesive film 4 and the lower plate, affecting the thickness control of the glue layer.

[0092] In this embodiment, the amount of adhesive used needs to be controlled to ensure that a small amount of adhesive overflows after the joint is clamped.

[0093] Step S7, after the adhesive is evenly applied, the upper non-adhesive film is removed.

[0094] Step S8, the metal ultra-thin plate of the upper plate and the metal ultra-thin plate of the lower plate are butt-jointed and assembled in the adhesive area to form an adhesive joint and fixed with a chuck or a special fixture.

[0095] Step S9, after cleaning the overflowed adhesive, the adhesive is cured to complete the sample preparation.

[0096] Through a metal ultra-thin plate gluing sampling method in this embodiment, the metal Ti ultra-thin plate is successfully glued and sampled, which solves the problem of difficult sample preparation operation in the adhesive performance test of the metal Ti ultra-thin plate with a thickness of 0.1 mm. The sample preparation method is also suitable for samples that need to be laser treated or plasma surface treated before gluing.

[0097] Figure 6 It is a schematic diagram of the structure after the upper plate and the lower plate are glued and cured in an embodiment of the present invention.

[0098] like Figure 6As shown, the upper plate and the lower plate complete the adhesive joint in the adhesive area, and the non-adhesive film 4 can control the thickness of the adhesive layer in the adhesive area 22, and the non-adhesive film 4 is tightly attached to the sides of the metal ultra-thin plate 2 and the bottom plate 1 to cover. After the joint is clamped, a sealed interface is formed between the metal ultra-thin plate 2 and the non-adhesive film 4, which can ensure that the adhesive does not overflow outside the scribed area, but can only overflow from both sides of the joint and be cleaned. At the same time, the bottom plate 1 provides a certain rigidity and strength, avoiding damage to the metal ultra-thin plate 2 during operation, and ensuring the smooth progress of the metal ultra-thin plate adhesive sample preparation.

[0099] Functions and Effects of the Embodiments

[0100] The present embodiment involves a method for preparing samples by gluing ultra-thin metal plates. By fixing an ultra-thin metal plate with a thickness of less than 0.2 mm on a base plate of a certain thickness, a certain rigidity and strength are provided to the sample, thereby ensuring the operability of the gluing sample preparation, avoiding damage to the metal material during operation, and ensuring the correct force on the sample during the subsequent shear test. Moreover, the material used for the base plate and the material used for the film in the present embodiment are selected with better material properties in consideration of the possible surface treatment before gluing the ultra-thin metal plate and the curing environment of the adhesive. In addition, the gluing area of ​​the present embodiment is changed to be determined by a line at a distance of 10 mm from the end, which is more suitable for gluing ultra-thin metal plates with a narrow gluing area. At the same time, the present embodiment uses a non-adhesive film to limit the gluing area, instead of the commonly used glass beads to control the thickness of the adhesive layer, which is more suitable for gluing ultra-thin metal plates. Therefore, a metal ultra-thin plate adhesive sampling method in the present embodiment solves the problems of metal ultra-thin plate adhesive testing, such as difficult metal ultra-thin plate adhesive operation, difficult adhesive layer thickness control, easy damage to metal substrate, and easy curling during the curing process. It ensures the smooth progress of metal ultra-thin plate adhesive sampling and subsequent testing, and provides a sampling method with strong applicability and good operability for testing the adhesive properties of metal ultra-thin plates.

[0101] The above-mentioned embodiments are preferred examples of the present invention and are not intended to limit the protection scope of the present invention.

Claims

1. A method for preparing a sample by gluing an ultra-thin metal plate, characterized in that: The following steps are involved: Step S1, processing two ultra-thin metal plates into a gluing sample size and wiping the surfaces of the ultra-thin metal plates with an organic solvent; Step S2, selecting a bottom plate that meets the thickness requirements, processing the bottom plate to the same size as the metal ultra-thin plate, gluing and fixing two metal ultra-thin plates on the two bottom plates respectively, obtaining two sheet materials after fixing and serving as an upper plate and a lower plate respectively, the thickness of the metal ultra-thin plate being less than 0.2 mm, and the metal ultra-thin plate and the bottom plate being fixed with double-sided tape, the working temperature of the double-sided tape being higher than the curing temperature of the adhesive used, so as to avoid debonding of the metal ultra-thin plate and the bottom plate; Step S3, wiping the surface of the metal ultra-thin plate with an organic solvent; Step S4, drawing lines on the surface of the metal ultra-thin plate of the lower plate to determine the adhesive area and the glue-coated area, the glue-coated area is located in the adhesive area, when drawing lines on the surface of the metal ultra-thin plate of the lower plate, the adhesive area is located at one side end of the surface of the metal ultra-thin plate, the starting line of the adhesive area is 10 mm away from the end of the metal ultra-thin plate, the size of the adhesive area is 25 mm×25 mm, the length of the glue-coated area is 25 mm, and the width of the glue-coated area is determined by a single pull test of the metal ultra-thin plate; Step S5, using two non-adhesive films to closely cover the adhesive area outside the adhesive coating area and extend to cover the two side surfaces of the bottom plate, the thickness of the non-adhesive films being the same as the thickness of the adhesive layer in the adhesive coating area; Step S6, covering the two non-adhesive films with an upper non-adhesive film, and injecting adhesive into the adhesive coating area with the help of the upper non-adhesive film; Step S7, after the adhesive is evenly applied, the upper non-adhesive film is removed; Step S8, the ultra-thin metal plate of the upper plate and the ultra-thin metal plate of the lower plate are butt-jointed and assembled in the adhesive area to form an adhesive joint and fixed with a chuck; Step S9, after cleaning the overflowed adhesive, the adhesive is cured to complete sample preparation.

2. The method for preparing ultra-thin metal plates by gluing according to claim 1, characterized in that: in, The adhesive sample has a size of 100 mm×25 mm.

3. The method for preparing a sample by gluing an ultra-thin metal plate according to claim 1, characterized in that: in, The materials of the bottom plate and the non-stick film are both acid-resistant, alkali-resistant and high-temperature-resistant materials.

4. The method for preparing a sample by gluing an ultra-thin metal plate according to claim 1, characterized in that: in, The thickness requirement of the bottom plate in step S2 is obtained by limiting the bending stiffness of the bottom plate, which includes the following sub-steps: Step S2-1, taking the bending stiffness of the test sheet with a thickness of δ0=1 mm as the control bending stiffness K0, K0=E0I0, E0 is the Young's modulus of the test sheet, I0 is the moment of inertia of the test sheet, Step S2-2, the bending stiffness K of the base plate x Need to be greater than the control bending stiffness K0, according to K x ≥K0, get the bottom plate thickness δ x The calculation formula is as follows: In formula (1), E0 is the Young's modulus of the test sheet, in MPa, and E x is the Young's modulus of the base plate, in MPa.

5. The method for preparing a sample by gluing an ultra-thin metal plate according to claim 1, characterized in that: in, In step S3, after wiping the surface of the metal ultra-thin plate with an organic solvent, the metal ultra-thin plate is subjected to surface treatment or not subjected to surface treatment according to usage requirements.

6. The method for preparing a sample by gluing an ultra-thin metal plate according to claim 1, characterized in that: in, Step S4 includes the following sub-steps: Step S4-1, obtaining the tensile strength σ of the ultra-thin metal sheet by performing a tensile test x , and then according to the room temperature shear strength σ of the adhesive 胶 , according to F x ≥F 胶 , get the theoretical maximum adhesive width d max The calculation formula is as follows: In formula (2), δ 测 is the actual thickness of the metal ultra-thin plate, in mm, and the actual adhesive width d0 is taken <d max , and finally determine the width d0 of the glue-coated area.

7. The method for preparing samples by gluing ultra-thin metal plates according to claim 1, characterized in that: in, In step S6, a long strip opening corresponding to the glue coating area is opened on the upper non-stick film. When applying glue, the long strip opening is placed above the glue coating area, and the adhesive is injected into the glue coating area through the long strip opening.

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