An integrated tube structure and an integrated tube assembly method of an ICMOS

Abstract

The application discloses an integrated tube structure and an integrated tube assembling method of an ICMOS, which comprises an ICMOS single tube, a front mirror cover, a shell, a second circuit board, a third circuit board and a rear cover. The front mirror cover is composed of two parts, the front end of which is a cylindrical structure and is used for assembling the light cone type image intensifier part of the ICMOS single tube, and the rear end of which is a square structure with the shape of the first circuit board with a light sensitive chip and is used for assembling the first circuit board with a light sensitive chip of the ICMOS single tube. The thin part of the outer side of the square structure is nested with the thin part of the inner wall of the inner side of the shell and is assembled by glue joint. The second circuit board and the third circuit board are connected through a connector. The inner side of the rear cover has a top edge with the same shape as the gold wire of the third circuit board, and the third circuit board is pressed tightly through the top edge after assembly. The application realizes small size and light weight, has good sealing performance, and has good consistency after assembly.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of digital low-light devices; in particular to an ICMOS integrated tube structure and an integrated tube assembly method. BACKGROUND

[0002] ICMOS (intensified complementary metal-oxide-semiconductor) is an important imaging device in the field of digital low-light technology, and has significant use in the fields of military and scientific research. ICMOS is mainly composed of an ICMOS single tube, a back-end circuit board and a shell. According to the different models and sizes of the ICMOS single tube, the sizes of the front lens cover, the shell and the back cover to be assembled are also different.

[0003] The front lens cover, the shell and the back cover are important structures for connecting and fixing the ICMOS single tube and the back-end circuit board, and the integrated tube of the assembled ICMOS has size consistency and performance stability. In addition, the ICMOS single tube and the back-end circuit board are sealed and protected.

[0004] At present, there is no suitable shell and better assembly scheme for ICMOS. At present, the ICMOS single tube, the back-end circuit board and the shell are connected and fixed together by screws, and then directly inserted into the shell. The following problems exist in use:

[0005] (1) Because the ICMOS single tube, the back-end circuit board and the shell are connected by screws, and at least 4 screws are required, in order to tap the threads, the screw position is reserved, and the length is increased by at least 8 mm and the width is increased by at least 8 mm. This increases the length and width of the entire device by 8 mm, which does not meet the market demand for small size and light weight of ICMOS;

[0006] (2) There is a large gap between the front lens cover, the shell and the back cover after being connected by screws, and the sealing effect is not achieved. When ICMOS is used in a humid environment such as southwest China, water vapor can easily enter, causing damage to the device. SUMMARY

[0007] The purpose of the present application is to provide an ICMOS integrated tube structure and an integrated tube assembly method, and the technical problems to be solved include:

[0008] (1) A new front lens cover structure is adopted to ensure that the coupled ICMOS single tube can be smoothly assembled;

[0009] (2) A new shell structure is adopted to ensure the assembly of the circuit board;

[0010] (3) The shell and other parts are combined by nesting and glue connection to ensure the sealing and stability of the assembly;

[0011] To solve the above technical problems, the technical scheme adopted by the present application is:

[0012] An integrated tube structure of ICMOS comprises an ICMOS single tube, a front lens cover, a shell, a second circuit board (with connector), a third circuit board (with connector) and a back cover.

[0013] Further,

[0014] The ICMOS single tube is coupled with an image intensifier (light cone type) and a circuit board (with a photosensitive chip) before assembly, and the coaxiality of the outer circle center point of the image intensifier (light cone type) and the center point of the circuit board is ensured.

[0015] The front lens cover is used for assembling the ICMOS single tube and cooperates with the shell.

[0016] The inner wall of the shell has a convex rib cooperating with the second circuit board (with connector) and the third circuit board (with connector), and is slightly larger than the outer shape size of the second circuit board (with connector) and the third circuit board (with connector) to form a clearance fit.

[0017] The second circuit board (with connector) and the third circuit board (with connector) have the same outer shape size, are connected by the connectors between the circuit boards, and have the same R-shaped grooves on the four peripheral edges.

[0018] The back cover has a top edge on the inner side, which is consistent with the shape of the gold wire of the third circuit board (with connector), and the third circuit board (with connector) is pressed tightly through the top edge after assembly.

[0019] The application further provides an assembly method of the integrated tube structure of ICMOS, comprising the following steps:

[0020] In the first step, the front lens cover, the shell and the back cover are cleaned and dried before assembly, and epoxy resin glue is prepared.

[0021] In the second step, a thin layer of epoxy resin glue is coated on the inner wall of the cylinder at the front end of the front lens cover, then the ICMOS single tube 1 is taken and the image tube part is slowly rotated into the front end of the front lens cover as a cylinder, at the same time, the R-shaped grooves on the four edges of the circuit board at the rear end are cooperated with the inner wall convex ribs of the square structure at the rear end of the front lens cover, the ICMOS single tube is pressed to the bottom of the cylinder at the front end of the front lens cover, and the above components are placed in an oven for baking to accelerate curing.

[0022] In the third step, after the cured components are taken out of the oven, the second circuit board (with connector) is inserted into the connector of the circuit board of the ICMOS single tube through the connector, and the second circuit board (with connector) and the third circuit board (with connector) are assembled by the same method, and the geometric centers of the first circuit board, the second circuit board (with connector) and the third circuit board (with connector) of the ICMOS single tube are adjusted on the same straight line.

[0023] Fourth step, in the front mirror cover square structure car thin processing coated with a layer of thin epoxy resin glue, and then the inner wall of the shell protruding rib alignment third circuit board (with connector) four sides on the R-type groove, from the third circuit board (with connector) slowly embedded in the shell, until the shell inner wall car thin with the front mirror cover square structure car thin completely nested fit, and then the above components placed vertically (front mirror cover on the upper, the shell in the lower) into the oven baking, accelerate the curing.

[0024] Fifth step, the above assembly after the components from the oven, in the rear cover inside coated with a layer of thin epoxy resin glue, and then slowly into the corresponding protruding rib four edges of the shell, pay attention to the pressure, and add appropriate counterweight, and then put into the oven baking, accelerate the curing.

[0025] Sixth step, after the epoxy resin glue curing and bonding, it is taken from the oven, with the air gun for cleaning, namely the completion of ICMOS whole tube shell assembly.

[0026] The present application has the following beneficial effects compared with the prior art:

[0027] 1. Solve the ICMOS device small size, lightweight market demand problem. Because no use of threaded connection, the length and width of the device size each reduced by 8mm;

[0028] 2. Solve the ICMOS sealing problem, the front mirror cover, shell and rear cover and other components of the connection are all used glue joint, after the transfer can effectively prevent the entry of moisture;

[0029] 3. The assembled ICMOS appearance size consistency is good, is conducive to its standardization and mass production. BRIEF DESCRIPTION OF DRAWINGS

[0030] The present application will be further described in detail below in conjunction with the drawings:

[0031] Figure 1 For the coupling of the ICMOS whole tube structure schematic diagram;

[0032] Figure 2 For the assembled ICMOS whole tube perspective view;

[0033] Figure 3 For the coupling of the ICMOS single tube structure schematic diagram;

[0034] Figure 4 For the front mirror cover structure schematic diagram;

[0035] Figure 5 For the shell structure schematic diagram;

[0036] Figure 6 For the second / third circuit board structure schematic diagram;

[0037] Figure 7 Schematic diagram of the back cover structure;

[0038] In the figure: 1-ICMOS single tube, 2-front mirror cover, 3-housing, 4-second circuit board, 5-third circuit board, 6-back cover; 21-square structure thin-machined part, 31-inner wall ridge, 32-inner wall thin-machined part, 41-R-shaped groove, 42-connector, 61-top edge. DETAILED DESCRIPTION

[0039] An ICMOS whole tube structure includes an ICMOS single tube 1, a front mirror cover 2, a housing 3, a second circuit board 4 (with a connector), a third circuit board 5 (with a connector) and a back cover 6. The specific structure is as follows Figure 1 and 2 shown.

[0040] The ICMOS single tube 1 is coupled with the light cone type image intensifier and the first circuit board with the photosensitive chip before assembly, and the coaxiality of the center point of the outer circle of the light cone type image intensifier and the center point of the circuit board is guaranteed. Figure 3 shown.

[0041] The front mirror cover 2 is mainly composed of two parts, the front end is a cylindrical structure, which is used to install the image intensifier (light cone type) part of the ICMOS single tube 1, and the rear end is a square structure with a circuit board (with photosensitive chip) shape, which is used to install the circuit board (with photosensitive chip) part of the ICMOS single tube 1. The specific structure is as follows: Figure 4 The thin-machined portion 21 of the square structure outside the square structure and the thin-machined portion 32 of the inner wall inside the shell 3 form a nested and glued assembly.

[0042] The inner wall of the housing 3 has an inner wall ridge 31 that matches the second circuit board 4 (with connector) and the third circuit board 5 (with connector). The specific structure is as follows: Figure 5 It is slightly larger than the outer dimensions of the second circuit board 4 (with connector) and the third circuit board 5 (with connector), forming a clearance fit.

[0043] The second circuit board 4 (with connector) and the third circuit board 5 (with connector) have the same dimensions. The two circuit boards are connected to each other through connectors, and have R-shaped grooves of the same size on all four sides. The specific structure is as follows: Figure 6 As shown;

[0044] The inner side of the back cover 6 has a top edge that is consistent with the shape of the gold wire of the third circuit board 4 (with connector). After assembly, the third circuit board 4 (with connector) is pressed tightly by this top edge. The specific structure is as follows: Figure 7 shown.

[0045] The application also provides an assembling method of the whole tube structure of the ICMOS, comprising the following steps:

[0046] In the first step, the front lens cover 2, the shell 3 and the rear cover 6 are cleaned and dried before assembling, and the epoxy resin glue is prepared;

[0047] In the second step, a thin layer of epoxy resin glue is coated on the inner wall of the cylinder at the front end of the front lens cover 2, and then the image tube part of the ICMOS single tube 1 is slowly screwed into the front end of the front lens cover 2, while the R-shaped groove 41 on the four edges of the rear end circuit board is matched with the inner wall protruding rib 31 of the square structure at the rear end of the front lens cover 2, and the ICMOS single tube 1 is pressed to the bottom of the cylinder at the front end of the front lens cover 2, and then the above components are placed in the oven for baking and accelerating curing.

[0048] In the third step, after the cured components are taken out of the oven, the second circuit board 4 (with connector) is inserted into the connector of the first circuit board of the ICMOS single tube 1 through the connector, and the second circuit board 4 (with connector) and the third circuit board 5 (with connector) are assembled in the same way, and the geometric centers of the first circuit board, the second circuit board 4 (with connector) and the third circuit board 5 (with connector) of the ICMOS single tube 1 are adjusted on the same straight line.

[0049] In the fourth step, a thin layer of epoxy resin glue is coated on the thin part 21 of the square structure of the front lens cover 2, and then the inner wall protruding rib 31 of the shell 3 is aligned with the R-shaped groove on the four edges of the third circuit board 5 (with connector), and the third circuit board 5 (with connector) is slowly inserted into the shell 3 from the rear part, until the thin part 32 of the inner wall of the shell 3 is completely nested with the thin part 21 of the square structure of the front lens cover 2, and then the above components are placed vertically (the front lens cover 2 is on the top, and the shell 3 is on the bottom), and then placed in the oven for baking and accelerating curing.

[0050] In the fifth step, the above assembled components are taken out of the oven, a thin layer of epoxy resin glue is coated on the inner side of the rear cover 6, and then the protruding rib 31 on the four edges of the shell 3 is slowly buckled, and then the appropriate counterweight is pressed tightly, and then placed in the oven for baking and accelerating curing.

[0051] In the sixth step, after the epoxy resin glue is cured and bonded, it is taken out of the oven, and cleaned with an air gun, and the assembling of the whole tube structure of the ICMOS is completed.

Claims

1. An ICMOS whole tube structure, characterized in that: The invention comprises an ICMOS single tube (1), a front mirror cover (2), a shell (3), a second circuit board (4), a third circuit board (5) and a back cover (6); the ICMOS single tube (1) is coupled with a light cone-shaped image intensifier and a first circuit board with a photosensitive chip before assembly; the front mirror cover (2) is composed of a front and a rear part, the front end of which is a cylindrical structure for loading the light cone-shaped image intensifier part of the ICMOS single tube (1); the rear end of which is a square structure with a shape similar to the first circuit board with a photosensitive chip, for loading the first circuit board with a photosensitive chip of the ICMOS single tube (1); the outer thin-machined portion (21) of the square structure and the inner thin-machined portion (32) of the inner wall of the shell (3) are nested and glued together; the second circuit board (4) and the third circuit board (5) are connected by a connector; the inner side of the back cover (6) has a top edge with the same shape as the gold wire of the third circuit board (5), and the third circuit board (5) is pressed tightly by the top edge after assembly; The inner wall of the housing (3) has an inner wall ridge (31) that matches the second circuit board (4) and the third circuit board (5), and the four edges of the second circuit board (4) and the third circuit board (5) are each provided with an R-shaped groove (41) that matches the inner wall ridge (31).

2. The ICMOS structure according to claim 1, wherein: The housing (3) is assembled with the second circuit board (4) and the third circuit board (5) to form a clearance fit.

3. The ICMOS structure according to any one of claims 1 to 2, characterized in that: The ICMOS single tube (1) is coupled by a light cone-shaped image intensifier and a first circuit board with a photosensitive chip before assembly.

4. The ICMOS structure according to claim 3, wherein: The center point of the outer circle of the light cone-shaped image intensifier is coaxial with the center point of the first circuit board.

5. A method for assembling the entire tube structure of the ICMOS according to any one of claims 1 to 4, characterized in that: The following steps are involved: The first step is to clean and dry the front mirror cover (2), the housing (3) and the rear cover (6) before assembly; In the second step, a layer of epoxy resin glue is first applied to the inner wall of the cylinder at the front end of the front mirror cover (2), and then the image tube portion of the ICMOS single tube (1) is screwed into the front end cylinder of the front mirror cover (2), while keeping the R-shaped groove of the first circuit board and the inner wall ridge (31) of the square structure at the rear end of the front mirror cover (2) matched, and the ICMOS single tube (1) is pressed to the bottom of the cylinder at the front end of the front mirror cover (2), and then the assembled ICMOS single tube (1) and the front mirror cover (2) are placed in an oven for baking to accelerate curing; The third step is to take the cured component out of the oven, insert the second circuit board (4) into the connector of the first circuit board of the ICMOS single tube (1) through the connector and tighten it, assemble the second circuit board (4) and the third circuit board (5) in the same way, and adjust them so that the geometric centers of the first circuit board, the second circuit board (4) and the third circuit board (5) of the ICMOS single tube (1) are on the same straight line; The fourth step is to apply epoxy resin glue to the thin-machined portion (21) of the square structure of the front mirror cover (2), and then align the inner wall ridges (31) of the shell (3) with the R-shaped grooves (41) on the four sides of the third circuit board (5), and slowly embed the shell (3) from the rear of the third circuit board (5) until the thin-machined portion (32) of the inner wall of the shell (3) and the thin-machined portion (21) of the square structure of the front mirror cover (2) are completely nested and matched, and then put the assembled ICMOS single tube (1), the front mirror cover (2) and the shell (3) into the oven for baking and curing; Step 5: Take the assembled parts out of the oven, apply epoxy resin glue on the inside of the back cover (6), and then snap them into place and press them tightly onto the corresponding ridges (31) on the four sides of the outer shell (3), and bake them in the oven for curing. Step 6: After the epoxy resin glue is cured and bonded, take it out of the oven and clean it with an air gun, thus completing the assembly of the ICMOS tube structure.

6. The assembly method according to claim 5, characterized in that: In the fourth step, the front mirror cover (2) is placed vertically with the outer shell (3) at the bottom and placed in an oven for baking and curing.

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