Load-locked cavity, semiconductor processing equipment, transmission method and storage medium

Abstract

This invention provides a load-locking cavity, a semiconductor device processing apparatus, a semiconductor device transfer method, and a computer-readable storage medium. The load-locking cavity includes at least one chamber body, wherein the chamber body includes: a wafer tray for carrying a wafer to be processed; and a transfer port including a vertical sidewall and an inclined sidewall, wherein the vertical sidewall guides the wafer from the outside along a vertical direction to the wafer tray, and the inclined sidewall guides the wafer from the outside along an inclined direction to the wafer tray.

Description

Technical Field

[0001] This invention relates to the field of semiconductor processing technology, and in particular to a load-locking cavity, a semiconductor device processing apparatus, a semiconductor device transmission method, and a computer-readable storage medium. Background Technology

[0002] In the semiconductor processing field, load-locking cavities are crucial for semiconductor fabrication. Current load-locking cavity structures include a load chamber body and a wafer transfer port. The load chamber body includes at least one pair of chambers for supporting one or more wafer substrates. These at least one pair of chambers support independent wafer transfer and wafer pick-up operations. However, the wafer transfer ports of existing load chambers are generally configured as either vertical or tilted transfer ports based on a fixed transfer method, making them incompatible with both vertical and tilted transfer modes and resulting in poor product adaptability.

[0003] In order to overcome the above-mentioned defects in the existing technology, there is an urgent need in the field for a load-locking cavity to provide a transfer port structure that is compatible with both vertical and tilted transfer modes, so as to improve the product adaptability of the load-locking cavity to semiconductor processing equipment in different transfer modes, thereby improving the economy and reliability of the load-locking cavity. Summary of the Invention

[0004] The following provides a brief overview of one or more aspects to offer a basic understanding of them. This overview is not an exhaustive summary of all conceived aspects, nor is it intended to identify key or decisive elements of all aspects, nor to define the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form as a prelude to the more detailed descriptions that follow.

[0005] To overcome the aforementioned deficiencies in the prior art, this invention provides a load-locking cavity and a semiconductor device processing apparatus. It offers a transfer port structure compatible with both vertical and tilted transfer modes, improving the product adaptability of the load-locking cavity to semiconductor processing equipment in different transfer modes, thereby enhancing the economy and reliability of the load-locking cavity. Furthermore, this invention also provides a semiconductor device transfer method and a computer-readable storage medium that automatically balances the pressure between the load-locking cavity and the external environment to improve wafer particle behavior and provides pressure protection to prevent damage to semiconductor device processing equipment caused by abnormal high or low pressure, further improving the economy and reliability of the load-locking cavity.

[0006] Specifically, the load locking cavity provided according to the first aspect of the present invention includes at least one chamber body, wherein the chamber body includes: a wafer tray for carrying a wafer to be processed; and a wafer transfer port including a vertical sidewall and an inclined sidewall, wherein the vertical sidewall is used to guide the wafer from the outside along a vertical direction to the wafer tray, and the inclined sidewall is used to guide the wafer from the outside along an inclined direction to the wafer tray.

[0007] Furthermore, in some embodiments of the present invention, the chamber body further includes: a backfill port disposed on the vertical sidewall and / or the inclined sidewall, for providing lateral backfill gas to the load locking chamber.

[0008] Furthermore, in some embodiments of the present invention, the first diameter of the air inlet of the backfill port is smaller than the second diameter of its air outlet, so as to reduce the flow rate of the backfill gas in the load locking cavity.

[0009] Furthermore, in some embodiments of the present invention, the load locking cavity includes a plurality of the chamber bodies, wherein the vertical sidewalls of the laterally adjacent chamber bodies are integrated into one unit, and the backfill port is disposed on the inclined sidewall of each of the chamber bodies; or the inclined sidewalls of the laterally adjacent chamber bodies are integrated into one unit, and the backfill port is disposed on the vertical sidewall of each of the chamber bodies.

[0010] Furthermore, in some embodiments of the present invention, the cavity body includes multiple layers, wherein each layer of the cavity body is provided with at least one backfill port.

[0011] Furthermore, in some embodiments of the present invention, the load locking cavity includes at least one robotic arm, wherein the robotic arm grips the wafer from the outside and transfers the gripped wafer to the wafer transfer port along the vertical sidewall or the inclined sidewall.

[0012] Furthermore, the semiconductor device processing apparatus provided according to the second aspect of the present invention includes: a load-locking cavity as described in any of the first aspects of the present invention; a backfilling device for providing backfill gas to the load-locking cavity; a pressure balancing device that is activated when backfilling begins in the load-locking cavity to balance the pressure inside and outside the load-locking cavity; and a pressure control and protection device for controlling the pressure inside the load-locking cavity and providing pressure protection.

[0013] Furthermore, in some embodiments of the present invention, the processing equipment is configured to: supply backfill gas to the load-locking cavity via the backfilling device; monitor the pressure inside the load-locking cavity via the pressure control and protection device; in response to the pressure inside the load-locking cavity reaching or exceeding a preset first pressure threshold, open the pressure balancing device to discharge excess backfill gas to balance the pressure inside and outside the load-locking cavity; and in response to the pressure balance inside and outside the load-locking cavity, close the pressure balancing device and open the atmospheric valve of the load-locking cavity to perform wafer transfer between the load-locking cavity and the outside world, wherein the backfilling device continuously supplies the backfill gas to the load-locking cavity during the opening of the atmospheric valve to prevent external substances from entering the load-locking cavity.

[0014] Furthermore, in some embodiments of the present invention, the pressure control and protection device includes a pressure controller assembly, a pressure relief valve assembly, and an assembly mounting base. The pressure controller assembly and the pressure relief valve assembly are connected to the processing equipment via the assembly mounting base. The pressure control and protection device controls the pressure inside the load locking chamber via the pressure controller assembly. The pressure relief valve assembly opens when the pressure inside the load locking chamber is higher than a preset second pressure threshold to provide pressure protection for the load locking chamber.

[0015] Furthermore, in some embodiments of the present invention, the processing equipment further includes a vacuum pumping device and a pressure detection device. The processing equipment is configured to: evacuate the load locking chamber via the vacuum pumping device; in response to the pressure inside the load locking chamber reaching below a preset third pressure threshold, close the vacuum pumping device and verify the actual pressure inside the load locking chamber via the pressure detection device; in response to the actual pressure reaching below a preset fourth pressure threshold, open the vacuum valve of the load locking chamber to perform wafer transfer between the load locking chamber and the vacuum chamber, wherein the fourth pressure threshold is greater than or equal to the third pressure threshold.

[0016] Furthermore, the semiconductor transfer method provided by the third aspect of the present invention includes the following steps: providing backfill gas to a load-locking cavity; monitoring the pressure inside the load-locking cavity; in response to the pressure inside the load-locking cavity reaching or exceeding a preset first pressure threshold, opening a pressure balancing device to discharge excess backfill gas to balance the pressure inside and outside the load-locking cavity; and in response to the pressure balance inside and outside the load-locking cavity, closing the pressure balancing device, continuously providing the backfill gas to the load-locking cavity, and opening the atmospheric valve of the load-locking cavity to perform wafer transfer between the load-locking cavity and the outside world, and to prevent external substances from entering the load-locking cavity.

[0017] Furthermore, the computer-readable storage medium provided according to the fourth aspect of the present invention stores computer instructions thereon. When the computer instructions are executed by a processor, the semiconductor transmission method provided according to the third aspect of the present invention is implemented. Attached Figure Description

[0018] The above-described features and advantages of the present invention will be better understood after reading the following detailed description of embodiments of the present disclosure in conjunction with the accompanying drawings. In the drawings, components are not necessarily drawn to scale, and components having similar related characteristics or features may have the same or similar reference numerals.

[0019] Figure 1 A schematic diagram of a semiconductor device processing apparatus provided according to some embodiments of the present invention is shown.

[0020] Figure 2 A schematic diagram of a load-locking cavity provided according to some embodiments of the present invention is shown.

[0021] Figure 3 A schematic diagram of a multi-layer load-locking cavity provided according to some embodiments of the present invention is shown.

[0022] Figure 4 A schematic diagram of a load-locking cavity provided according to some embodiments of the present invention is shown.

[0023] Figure 5 A schematic flowchart of a transmission method for a semiconductor device according to some embodiments of the present invention is shown.

[0024] Figure 6 A schematic diagram of a semiconductor device processing apparatus according to some embodiments of the present invention is shown.

[0025] Figure 7 A schematic diagram of a pressure control and protection device according to some embodiments of the present invention is shown.

[0026] Figure 8 A schematic flowchart of a transmission method for a semiconductor device according to some embodiments of the present invention is shown. Detailed Implementation

[0027] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. Although the description of the present invention is presented in conjunction with preferred embodiments, this does not mean that the features of the invention are limited to these embodiments. On the contrary, the purpose of describing the invention in conjunction with embodiments is to cover other options or modifications that may be derived based on the claims of the present invention. To provide a thorough understanding of the invention, many specific details will be included in the following description. The invention may also be implemented without using these details. Furthermore, to avoid confusion or obscuring the focus of the invention, some specific details will be omitted in the description.

[0028] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0029] Furthermore, the terms "upper," "lower," "left," "right," "top," "bottom," "horizontal," and "vertical" used in the following description should be understood as the orientations shown in the relevant paragraphs and accompanying drawings. These relative terms are for illustrative purposes only and do not imply that the described apparatus must be manufactured or operated in a specific orientation, and therefore should not be construed as limiting the invention.

[0030] It is understood that although terms such as "first," "second," and "third" may be used herein to describe various components, regions, layers, and / or parts, these components, regions, layers, and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, regions, layers, and / or parts. Therefore, the first components, regions, layers, and / or parts discussed below may be referred to as second components, regions, layers, and / or parts without departing from some embodiments of the present invention.

[0031] As mentioned above, in the semiconductor processing field, load-locking cavities are crucial for semiconductor fabrication. Current load-locking cavity structures in the art include a load chamber body and a wafer transfer port. The load chamber body includes at least one pair of chambers for carrying one or more wafer substrates. These at least one pair of chambers support independent wafer transfer and wafer pick-up operations. However, the wafer transfer ports of existing load chambers are generally configured as vertical or angled transfer ports according to fixed transfer methods, failing to accommodate both vertical and angled transfer modes, resulting in poor product adaptability.

[0032] To overcome the aforementioned deficiencies in the prior art, this invention provides a load-locking cavity and a semiconductor device processing apparatus, capable of providing a transfer port structure compatible with both vertical and tilted transfer modes. This improves the product adaptability of the load-locking cavity to semiconductor processing equipment under different transfer modes, thereby enhancing the economy and reliability of the load-locking cavity. Furthermore, this invention also provides a semiconductor device transfer method and a computer-readable storage medium for automatically balancing the pressure between the load-locking cavity and the external environment to improve wafer particle behavior and provide pressure protection to prevent damage to semiconductor device processing equipment caused by abnormal high or low pressure, thereby further improving the economy and reliability of the load-locking cavity.

[0033] In some non-limiting embodiments, the method for transmitting the semiconductor device described in the third aspect of the present invention can be implemented via the semiconductor processing apparatus described in the second aspect of the present invention. The load-locking cavity described in the first aspect of the present invention can be configured in the semiconductor device processing apparatus described in the second aspect of the present invention. Further, the processing apparatus may be equipped with a memory and a processor. The memory includes, but is not limited to, the computer-readable storage medium described in the fourth aspect of the present invention, on which computer instructions are stored. The processor is connected to the memory and configured to execute the computer instructions stored in the memory to implement the method for transmitting the semiconductor device described in the third aspect of the present invention.

[0034] Please refer to the following first. Figure 1 , Figure 1 A schematic diagram of a semiconductor device processing apparatus provided according to some embodiments of the present invention is shown.

[0035] like Figure 1 As shown, in some embodiments of the present invention, the semiconductor device processing apparatus provided by the second aspect of the present invention includes a load-locking cavity 102, a backfilling device 106, a pressure balancing device 101, and a pressure control and protection device 103. The load-locking cavity 102 is used to receive and transfer the wafer to be processed. The backfilling device 106 is disposed on the left and right sides of the load-locking cavity 102 and is used to provide backfill gas to the load-locking cavity 102. The pressure balancing device 101 is disposed on the upper or lower side of the load-locking cavity 102 and is activated when backfilling begins in the load-locking cavity 102 to balance the pressure inside and outside the load-locking cavity 102. The pressure control and protection device 103 is also disposed on the upper or lower side of the load-locking cavity 102 and is used to control the pressure inside the load-locking cavity 102 and provide pressure protection.

[0036] Please refer to the details. Figure 2 , Figure 2 A schematic diagram of a load-locking cavity provided according to some embodiments of the present invention is shown. Figure 2In the illustrated embodiment, the load locking cavity 102 includes at least one chamber body. Here, the chamber body includes a wafer tray 25 and a transfer port. The wafer tray 25 is used to hold wafers to be processed. The transfer port includes vertical sidewalls 23 and 24 and inclined sidewalls 21 and 22. Here, the vertical sidewalls 23 and 24 guide the wafer from the outside along a vertical direction to the wafer tray 25. The inclined sidewalls 21 and 22 guide the wafer from the outside along an inclined direction to the wafer tray 25.

[0037] Furthermore, the aforementioned chamber body may preferably include backfill ports 26 and 27. These backfill ports 26 and 27 can be disposed on the aforementioned vertical sidewalls 23 and 24 and / or the aforementioned inclined sidewall 21, for providing lateral backfill gas to the load-locking cavity 102. Compared to conventional bottom-surface backfilling methods, this side-surface backfilling method effectively avoids the wafer's obstruction of the backfill gas, thereby effectively shortening the backfilling time and improving the processing capacity of semiconductor devices.

[0038] Furthermore, the first diameter of the air inlet of the backfill ports 26 and 27 can preferably be smaller than the second diameter of their outlet, thereby giving the backfill ports 26 and 27 a funnel shape. In this way, the present invention can further reduce the backfill gas flow rate to improve the particle performance of the wafer.

[0039] In addition, such as Figure 1 and Figure 2 As shown, the load locking cavity may include a plurality of such chamber bodies. These plurality of chamber bodies may be arranged adjacently in the same frame layer. In some embodiments, the vertical sidewalls 23 and 24 of laterally adjacent chamber bodies may be integrated into one unit. In this case, the backfill ports 26 and 27 may be correspondingly provided on the inclined sidewalls 21 and 22 of the chamber body.

[0040] Alternatively, in some embodiments, the inclined sidewalls of the laterally adjacent chamber bodies can be integrated into one unit. In this case, the backfill port can be correspondingly provided on the vertical sidewall of each chamber body to achieve the same effect.

[0041] Please refer to further information. Figure 3 , Figure 3 A schematic diagram of a multi-layer load-locking cavity provided according to some embodiments of the present invention is shown.

[0042] exist Figure 3In the illustrated embodiment, the load-locking cavity 102 may further include multiple chamber bodies. Each of the aforementioned chamber bodies is provided with at least one backfill port 31, 32, 33, or 34. Specifically, the load-locking cavity 102 may include four chamber bodies. These four chamber bodies may be respectively disposed in two frames, wherein each chamber body in each frame may be provided with one backfill port 31, 32, 33, or 34 to further improve the efficiency of backfill gas and shorten the backfill time, thereby increasing the processing capacity of semiconductor devices.

[0043] Please refer to further information. Figure 4 , Figure 4 A schematic diagram of a load-locking cavity provided according to some embodiments of the present invention is shown.

[0044] exist Figure 4 In the illustrated embodiment, the load locking cavity 102 may further include at least one robotic arm 42. The robotic arm 42 grips the wafer 43 to be processed from the outside and pushes the wafer into the wafer tray of the load locking cavity 41 along the vertical sidewalls 46, 47 or the inclined sidewalls 44, 45 for subsequent semiconductor processing.

[0045] For example, in a semiconductor processing apparatus with vertical wafer transfer, the robot 42 can grab the wafer 43 to be processed from the outside, and through mechanical rotation, push the grabbed wafer 43 against the vertical sidewalls 46 and 47 of the wafer transfer port, and then push the wafer 43 vertically into the wafer tray of the load locking cavity 41 along the vertical sidewalls 46 and 47 for subsequent semiconductor processing.

[0046] For example, in a semiconductor processing apparatus with tilted wafer transfer, the robotic arm 42 can grab the wafer 43 to be processed from the outside, and through mechanical rotation, push the grabbed wafer 43 against the tilted sidewalls 44 and 45 of the wafer transfer port, and then push the wafer into the wafer tray of the load locking cavity 41 along the tilted sidewalls 44 and 45 for subsequent semiconductor processing.

[0047] Thus, the load locking cavity 41 provided by the present invention can be compatible with both vertical wafer transfer and tilt wafer transfer modes, thereby improving the product adaptability of the load locking cavity to semiconductor processing equipment in different wafer transfer modes.

[0048] The working principle of the semiconductor device processing equipment described above will be described below with reference to some embodiments of semiconductor device transfer methods. Those skilled in the art will understand that these embodiments of semiconductor device transfer methods are merely non-limiting implementations provided by the present invention, intended to clearly demonstrate the main concepts of the invention and provide specific solutions convenient for public implementation, rather than limiting all functions or operating modes of the semiconductor device processing equipment. Similarly, the semiconductor device processing equipment is also only one non-limiting implementation provided by the present invention and does not constitute a limitation on the entities performing the steps in these semiconductor device transfer methods.

[0049] Please refer to the reference. Figure 1 , Figure 5 and Figure 6 . Figure 5 A schematic flowchart of a transmission method for a semiconductor device according to some embodiments of the present invention is shown. Figure 6 A schematic diagram of a semiconductor device processing apparatus according to some embodiments of the present invention is shown.

[0050] like Figure 1 , Figure 5 and Figure 6 As shown, during the operation of the semiconductor device processing apparatus, the processing apparatus can open the backfill valve 65 of the backfill device 106 to supply backfill gas to the load locking chamber 102 via the backfill device 106. Simultaneously with the backfill gas supply, the present invention can monitor the pressure inside the load locking chamber 102 via the pressure control and protection device 103. When the pressure inside the load locking chamber 102 reaches or exceeds a preset first pressure threshold, the processing apparatus can open the balancing valve 64 of the pressure balancing device 101 to discharge excess backfill gas, thereby balancing the pressure inside and outside the load locking chamber 102. Specifically, the first pressure threshold can be atmospheric pressure (760 Torr). After the excess backfill gas is discharged through the pressure balancing device 101, the pressure inside and outside the load locking chamber 102 is balanced. At this time, the processing apparatus can close the balancing valve 64 of the pressure balancing device 101 and continue to supply backfill gas to the load locking chamber 102, while simultaneously opening the atmospheric valve 63 of the load locking chamber 102 to perform wafer transfer between the load locking chamber 102 and the outside environment. When backfill gas is continuously supplied to the load-locking cavity 102, the gas inside the load-locking cavity 102 continuously flows outward, thereby preventing external atmosphere from entering the load-locking cavity 102 and thus preventing external substances from entering the load-locking cavity 102, thereby improving the particle performance of the wafer.

[0051] Please refer to further information. Figure 7 , Figure 7 A schematic diagram of a pressure control and protection device according to some embodiments of the present invention is shown.

[0052] exist Figure 7 In the illustrated embodiment, the pressure control and protection device 103 includes a pressure controller assembly 72, a pressure relief valve assembly 71, and an assembly mounting base 73. Here, the pressure controller assembly 72 and the pressure relief valve assembly 71 are connected to the semiconductor processing equipment via the assembly mounting base 73. The pressure control and protection device 103 controls the pressure inside the load locking chamber 102 via the pressure controller assembly 72. When the pressure control assembly 72 in the pressure control and protection device 103 fails for some reason, and the system continues to backfill, the pressure inside the load locking chamber 102 will exceed a preset second pressure threshold. At this time, the pressure relief valve assembly 71 will automatically open to provide pressure protection to the load locking chamber 102, thereby preventing damage to the processing equipment or personnel due to excessive backfill pressure.

[0053] In addition, Figure 1 In the illustrated embodiment, the semiconductor processing equipment may further include a vacuum pumping device 105 and a pressure detection device 104. The pressure detection device 104 is disposed on the upper or lower side of the load locking cavity 102 and is used to verify the actual pressure inside the load locking cavity 102. The vacuum pumping device 104 is disposed in the middle of the lower side of the load locking cavity 102 and is used to evacuate the load locking cavity 102.

[0054] Please refer to further information. Figure 8 , Figure 8 A schematic flowchart of a transmission method for a semiconductor device according to some embodiments of the present invention is shown.

[0055] like Figure 1 , Figure 6 and Figure 8 As shown, during the operation of the semiconductor device processing apparatus, the processing apparatus can also evacuate the load locking chamber 102 via the vacuum pumping device 104. When the pressure inside the load locking chamber 102 reaches below a preset third pressure threshold, the processing apparatus can shut down the vacuum pumping device 105 and, via the pressure detection device 61 (i.e., Figure 1 (104) The actual pressure inside the load locking chamber 102 is verified, and the vacuum valve 62 of the load locking chamber 102 is opened based on the actual pressure to allow wafer transfer between the load locking chamber 102 and the vacuum chamber. Specifically, if the actual pressure is below a preset fourth pressure threshold, the processing device can open the vacuum valve 62 of the load locking chamber 102 to allow wafer transfer between the load locking chamber 102 and the vacuum chamber. Conversely, if the actual pressure is greater than the preset fourth pressure threshold, the processing device can determine that the vacuum pumping function is faulty, thereby refusing to open the vacuum valve 62 of the load locking chamber 102 and promptly issuing a fault alarm.

[0056] In some embodiments, the fourth pressure threshold should be greater than or equal to the third pressure threshold. Specifically, the third pressure threshold can be determined based on the target vacuum conditions of the processing apparatus (e.g., 0.05 Torr), while the fourth pressure threshold can be determined based on the opening conditions of the vacuum valve 62 (e.g., 0.1 Torr). Thus, the pressure control and protection device 103 and the pressure detection device 104 can provide dual protection to prevent the vacuum chamber from being contaminated or damaged.

[0057] In summary, compared to current reaction chamber cleaning methods in the art, the load-locking cavity and semiconductor device processing equipment provided by this invention can offer a transfer port structure that is compatible with both vertical and tilted transfer modes, thereby improving the product adaptability of the load-locking cavity to semiconductor processing equipment in different transfer modes. Furthermore, by implementing the above-described semiconductor device transfer method or configuring the above-described computer-readable storage medium, this invention can also automatically balance the pressure between the load-locking cavity and the external environment to improve wafer particle behavior and provide pressure protection to prevent abnormal high and low pressures from damaging semiconductor device processing equipment, thereby improving the economy and reliability of the load-locking cavity.

[0058] Although the methods described above are illustrated and depicted as a series of actions for the sake of simplicity, it should be understood and appreciated that these methods are not limited by the order of the actions, as some actions may occur in a different order and / or concurrently with other actions from the illustrations and descriptions herein or not illustrated and described herein but which may be understood by those skilled in the art, according to one or more embodiments.

[0059] The prior description of this disclosure is provided to enable any person skilled in the art to make or use this disclosure. Various modifications to this disclosure will be apparent to those skilled in the art, and the general principles defined herein may be applied to other variations without departing from the spirit or scope of this disclosure. Therefore, this disclosure is not intended to be limited to the examples and designs described herein, but should be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A load-locking cavity, characterized in that, Includes at least one chamber body, wherein the chamber body comprises: Wafer trays are used to hold wafers to be processed. A wafer transfer port includes a vertical sidewall and an inclined sidewall, wherein the vertical sidewall guides the wafer from the outside along a vertical direction to the wafer tray, and the inclined sidewall guides the wafer from the outside along an inclined direction to the wafer tray; and A backfill port, disposed on the vertical sidewall and / or the inclined sidewall, is used to provide lateral backfill gas to the load locking cavity, wherein the first diameter of the inlet of the backfill port is smaller than the second diameter of its outlet, so as to reduce the flow rate of the backfill gas in the load locking cavity.

2. The load locking cavity as described in claim 1, characterized in that, Includes multiple chamber bodies, wherein, The vertical sidewalls of the laterally adjacent chamber bodies are integrated into one unit, and the backfill port is disposed on the inclined sidewall of each of the chamber bodies; or The inclined sidewalls of the laterally adjacent chamber bodies are integrated into one unit, and the backfill port is provided on the vertical sidewall of each of the chamber bodies.

3. The load locking cavity as described in claim 2, characterized in that, It includes multiple layers of the chamber body, wherein each layer of the chamber body is provided with at least one backfill port.

4. The load locking cavity as described in claim 1, characterized in that, Also includes: At least one robotic arm, wherein the robotic arm grasps the wafer from the outside and transfers the grasped wafer to the wafer transfer port along the vertical sidewall or the inclined sidewall.

5. A semiconductor device processing apparatus, characterized in that, include: Load locking cavity as described in any one of claims 1 to 4; A backfilling device is used to supply backfill gas to the load locking chamber; The pressure balancing device is activated when the load locking chamber begins to be backfilled, in order to balance the pressure inside and outside the load locking chamber; as well as A pressure control and protection device is used to control the pressure inside the load locking chamber and provide pressure protection.

6. The processing equipment as described in claim 5, characterized in that, The processing equipment is configured as follows: Backfill gas is supplied to the load locking chamber via the backfill device; The pressure inside the load locking chamber is monitored via the pressure control and protection device. In response to the pressure inside the load locking chamber reaching or exceeding a preset first pressure threshold, the pressure balancing device is activated to discharge excess backfill gas in order to balance the pressure inside and outside the load locking chamber. as well as In response to the pressure balance inside and outside the load locking chamber, the pressure balancing device is closed and the atmospheric valve of the load locking chamber is opened to transfer wafers between the load locking chamber and the outside. During the opening of the atmospheric valve, the backfilling device continuously supplies backfill gas to the load locking chamber to prevent external substances from entering the load locking chamber.

7. The processing equipment as described in claim 5, characterized in that, The pressure control and protection device includes a pressure controller assembly, a pressure relief valve assembly, and an assembly mounting base, wherein... The pressure controller assembly and the pressure relief valve assembly are connected to the processing equipment via the assembly mounting base. The pressure control and protection device controls the pressure inside the load locking chamber via the pressure controller assembly. The pressure relief valve assembly opens when the pressure inside the load locking chamber exceeds a preset second pressure threshold, thereby providing pressure protection for the load locking chamber.

8. The processing equipment as described in claim 5, characterized in that, It also includes a vacuuming device and a pressure detection device, and the processing equipment is configured as follows: The load locking chamber is evacuated using the vacuum pumping device. In response to the pressure inside the load locking chamber falling below a preset third pressure threshold, the vacuum pumping device is shut down, and the actual pressure inside the load locking chamber is verified via the pressure detection device. In response to the actual pressure reaching below a preset fourth pressure threshold, the vacuum valve of the load locking chamber is opened to perform wafer transfer between the load locking chamber and the vacuum chamber, wherein the fourth pressure threshold is greater than or equal to the third pressure threshold.

9. A transmission method for a semiconductor device, characterized in that, Includes the following steps: Backfill gas is supplied to the load-locking cavity as described in any one of claims 1 to 4; Monitor the pressure inside the load locking chamber; In response to the pressure inside the load locking chamber reaching or exceeding a preset first pressure threshold, the pressure balancing device is activated to discharge excess backfill gas in order to balance the pressure inside and outside the load locking chamber. as well as In response to the pressure balance inside and outside the load locking chamber, the pressure balancing device is closed, the backfill gas is continuously supplied to the load locking chamber, and the atmospheric valve of the load locking chamber is opened to facilitate wafer transfer between the load locking chamber and the outside world, and to prevent external substances from entering the load locking chamber.

10. A computer-readable storage medium storing computer instructions thereon, characterized in that, When the computer instructions are executed by the processor, the transmission method of the semiconductor device as described in claim 9 is implemented.

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