LED semiconductor chip packaging magnetic aluminum plate and positioning method thereof

Abstract

The present invention relates to a magnetic aluminum plate for LED semiconductor chip packaging and a positioning method thereof, wherein the magnetic aluminum plate for LED semiconductor chip packaging includes a first suction cup mechanism, wherein the position of a magnet in a first magnet mounting groove can be moved along the extension direction of the first magnet mounting groove; a second suction cup mechanism, which is used to carry a wafer to be cut, and a second magnet mounting groove is provided on a side of the second suction cup mechanism opposite to the first suction cup mechanism, wherein the second magnet mounting groove is used to accommodate a portion of the magnet extending out of the first magnet mounting groove; a position sensing piece, which is used to monitor the installation position of the magnet in real time and determine the relative positional relationship between the extending portion of the magnet and the second magnet mounting groove; and an adjustment unit, which is used to adjust the position of the magnet in the first magnet mounting groove according to the relative positional relationship. The real-time adjustment of the position of the magnet in the first magnet mounting groove is achieved so that the magnets in the first magnet array and the second magnet array are better matched with the mounting grooves, thereby improving the accuracy of the engagement.

Description

Technical Field

[0001] The present invention relates to the technical field of chip production and processing, and in particular to a magnetic aluminum plate for LED semiconductor chip packaging and a positioning method thereof. Background Art

[0002] During the production and processing of LED semiconductor chips, wafers need to be packaged to form the smallest chip unit, and then multiple minimum units are used to form LED semiconductor chips. Due to their thinness and brittleness, wafers are typically mounted on wafer carriers and further loaded into carrier cassettes. With advancements in production technology, wafers are becoming thinner and larger. For larger wafers, due to their increased mass and reduced thickness, to ensure that the robot can smoothly grip the wafers in and out of the carrier cassette, mating locking parts are installed on the clamping part and carrier to increase the vertical force resistance.

[0003] Patent document CN111128822A discloses a carrier for wafer loading, which includes a wafer carrier for loading wafers, a first clamping plate and a second clamping plate that are movable relative to each other. The first clamping plate and the second clamping plate are mounted on a driving structure of a manipulator. A positioning block is fixedly mounted on the side of the second clamping plate near the first clamping plate. The wafer carrier is provided with a control capsule corresponding to the positioning block. The control capsule is contractible under the pressure of the positioning block. The control capsule is connected to a clamping capsule through a connecting channel. The top of the clamping capsule is inflatable. The control capsule, the clamping capsule, and the connecting channel are filled with gas or liquid medium. The first clamping plate and the second clamping plate are used to clamp the wafers. The first clamping plate and the second clamping plate are assembled together by manually screwing and riveting, which consumes a lot of time, manpower, and material resources, and has low production efficiency. Summary of the Invention

[0004] To this end, the present invention provides a magnetic aluminum plate for LED semiconductor chip packaging and a positioning method thereof, which can solve the problem of low production efficiency in the prior art.

[0005] To achieve the above objectives, the present invention provides a magnetic aluminum plate for LED semiconductor chip packaging, comprising:

[0006] a first suction cup mechanism, wherein a plurality of first magnet mounting grooves are provided on a side of the first suction cup mechanism opposite to the second suction cup mechanism, magnets are installed in the magnet mounting grooves, the magnets extend out of the first magnet mounting grooves, and positioning screws are provided at the ends of the magnets for fixing the positions of the magnets in the first magnet mounting grooves after the magnets are placed in the first magnet mounting grooves, and when the positioning screws are in a non-fixed state, the position of the magnets in the first magnet mounting grooves can move along the extension direction of the first magnet mounting grooves;

[0007] a second suction cup mechanism, wherein the first suction cup mechanism and the second suction cup mechanism are engaged with each other to support the wafer to be cut, and a second magnet mounting groove is provided on a side of the second suction cup mechanism opposite to the first suction cup mechanism, and when the first suction cup mechanism and the second suction cup mechanism are engaged with each other, the second magnet mounting groove is used to accommodate a portion of the magnet extending out of the first magnet mounting groove;

[0008] a position sensing piece, disposed in the second magnet mounting groove, for monitoring the mounting position of the magnet in real time during the engagement process between the first suction cup mechanism and the second suction cup mechanism, and determining the relative positional relationship between the protruding portion of the magnet and the second magnet mounting groove;

[0009] The adjustment unit is used to adjust the position of the magnet in the first magnet mounting slot according to the relative position relationship according to the adjustment time determined by the area of ​​the protruding portion of the magnet that does not fall into the second magnet mounting slot and the preset standard area.

[0010] Furthermore, the first suction cup mechanism includes two circular magnet arrays, and the radius of the circle formed by the first magnet array is larger than the radius of the circle formed by the second magnet array. Eight wafer accommodating areas are arranged inside the first magnet array and outside the second magnet array, and one wafer accommodating area is arranged inside the second magnet array. The first magnet array includes 8 magnets, and the second magnet array is provided with 6 magnets.

[0011] Furthermore, a first magnet is provided in the first magnet installation groove, and a second magnet is provided in the second magnet installation groove. The first magnet and the second magnet attract each other, thereby realizing the engagement of the first suction cup mechanism and the second suction cup mechanism.

[0012] Furthermore, the adjusting unit adjusts the position of the magnet in the first magnet mounting slot according to the relative position relationship, including:

[0013] A standard area S0 is preset. If the area of ​​the protruding portion of the magnet that does not fall into the second magnet mounting slot is ≤ S0, it means that the relative position error between the magnet and the second magnet mounting slot is small and no adjustment is required.

[0014] If the area of ​​the protruding portion of the magnet that does not fall into the second magnet mounting slot is greater than S0, it indicates that the relative position error between the magnet and the second magnet mounting slot is large and needs to be adjusted.

[0015] Further, when the position of the magnet needs to be adjusted, a first standard area S1, a second standard area S2, and a third standard area S3 are set in the adjustment unit, and S1 < S2 < S3. If S0 < the area where the extended part of the magnet does not fall into the second magnet mounting groove ≤ the first standard area S1, then the first time T1 is selected to adjust the position of the magnet. After the position of the magnet is adjusted, the clamping of the first suction cup mechanism and the second suction cup mechanism is completed;

[0016] If the first standard area S1 < the area where the extended part of the magnet does not fall into the second magnet mounting groove ≤ the second standard area S2, then the second time T2 is selected to adjust the position of the magnet. After the position of the magnet is adjusted, the clamping of the first suction cup mechanism and the second suction cup mechanism is completed;

[0017] If the second standard area S2 < the area where the extended part of the magnet does not fall into the second magnet mounting groove ≤ the third standard area S3, then the third time T3 is selected to adjust the position of the magnet. After the position of the magnet is adjusted, the clamping of the first suction cup mechanism and the second suction cup mechanism is completed;

[0018] If the area where the extended part of the magnet does not fall into the second magnet mounting groove > the third standard area S3, then the fourth time T4 is selected to adjust the position of the magnet. After the position of the magnet is adjusted, the clamping of the first suction cup mechanism and the second suction cup mechanism is completed, and the first time T1 < the second time T2 < the third time T3 < the fourth time T4.

[0019] Further, a standard magnetic force uniformity M0 is also set in the adjustment unit to compare with the actual magnetic force uniformity M after adjustment, and the adjustment use frequency is determined according to the comparison result.

[0020] Further, when the adjustment unit determines the adjustment use frequency according to the comparison result, a first adjustment parameter n1, a second adjustment parameter n2, and a magnetic force standard difference ΔM0 are preset;

[0021] Set the actual use frequency as n0. If the actual magnetic force uniformity ≤ the standard magnetic force uniformity M0, the use frequency is reduced;

[0022] If the actual magnetic force uniformity > the standard magnetic force uniformity M0, the current use frequency is maintained unchanged, and the first adjustment parameter n1 is less than the second adjustment parameter n2.

[0023] Further, when the use frequency is reduced, if the standard magnetic force uniformity M0 - the actual magnetic force uniformity ≤ the magnetic force standard difference ΔM0, the adjustment unit reduces the use frequency by using the first adjustment parameter;

[0024] If the standard magnetic force uniformity M0 - the actual magnetic force uniformity > the magnetic force standard difference ΔM0, the use frequency is reduced by using the second adjustment parameter;

[0025] Reduce the usage frequency using the first adjustment parameter, and set the reduced usage frequency to n0' = n0 - n1;

[0026] Reduce the usage frequency using the second adjustment parameter, and set the reduced usage frequency to n0'' = n0 - n2.

[0027] On the other hand, the present invention also provides a positioning method for an LED semiconductor chip package magnetic adsorption aluminum disc using the LED semiconductor chip package magnetic adsorption aluminum disc as described above, including:

[0028] During the engagement process, the installation position of the magnet is monitored in real time to determine the relative position relationship between the protruding part of the magnet and the second magnet installation groove;

[0029] Adjust the position of the magnet in the first magnet installation groove according to the relative position relationship;

[0030] A standard area S0 is preset. If the area where the protruding part of the magnet does not fall into the second magnet installation groove ≤ S0, it means that the relative position error between the position of the magnet and the second magnet installation groove is small and no adjustment is required;

[0031] If the area where the protruding part of the magnet does not fall into the second magnet installation groove > S0, it means that the relative position error between the position of the magnet and the second magnet installation groove is large and adjustment is required;

[0032] When the position of the magnet needs to be adjusted, a first standard area S1, a second standard area S2, and a third standard area S3 are set in the adjustment unit, and S1 < S2 < S3. If S0 < the area where the protruding part of the magnet does not fall into the second magnet installation groove ≤ the first standard area S1, select the first time T1 to adjust the position of the magnet, and complete the engagement of the first suction cup mechanism and the second suction cup mechanism after the position of the magnet is adjusted;

[0033] If the first standard area S1 < the area where the protruding part of the magnet does not fall into the second magnet installation groove ≤ the second standard area S2, select the second time T2 to adjust the position of the magnet, and complete the engagement of the first suction cup mechanism and the second suction cup mechanism after the position of the magnet is adjusted;

[0034] If the second standard area S2 < the area where the protruding part of the magnet does not fall into the second magnet installation groove ≤ the third standard area S3, select the third time T3 to adjust the position of the magnet, and complete the engagement of the first suction cup mechanism and the second suction cup mechanism after the position of the magnet is adjusted;

[0035] If the area of ​​the extended part of the magnet that does not fall into the second magnet mounting groove is greater than the third standard area S3, the fourth time T4 is selected to adjust the position of the magnet. After the position of the magnet is adjusted, the engagement of the first suction cup mechanism and the second suction cup mechanism is completed, and the first time T1 is less than the second time T2, less than the third time T3, and less than the fourth time T4.

[0036] Furthermore, a standard magnetic uniformity M0 is provided for comparison with the adjusted actual magnetic uniformity M, and the adjustment frequency is determined based on the comparison result;

[0037] A first adjustment parameter n1, a second adjustment parameter n2 and a magnetic force standard deviation value ΔM0 are preset;

[0038] Set the actual operating frequency to n0. If the actual magnetic uniformity is less than or equal to the standard magnetic uniformity M0, reduce the operating frequency.

[0039] If the actual magnetic uniformity is greater than the standard magnetic uniformity M0, the current operating frequency is maintained unchanged, and the first adjustment parameter n1 is less than the second adjustment parameter n2;

[0040] When reducing the frequency of use, if the standard magnetic uniformity M0-the actual magnetic uniformity ≤ the magnetic standard deviation ΔM0, the first adjustment parameter is used to reduce the frequency of use;

[0041] If the standard magnetic uniformity M0 - the actual magnetic uniformity > the magnetic standard deviation ΔM0, the second adjustment parameter is used to reduce the frequency of use;

[0042] The first adjustment parameter is used to reduce the usage frequency, and the reduced usage frequency is set to n0′= n0-n1;

[0043] The second adjustment parameter is used to reduce the usage frequency, and the reduced usage frequency is set to n0" = n0-n2.

[0044] Compared with the prior art, the beneficial effect of the present invention lies in that, by detecting the real-time position of the magnet in the first magnet safety groove during the engagement process, and based on the relative position relationship between the real-time position of the first magnet and the second magnet mounting groove, the position of the magnet in the first magnet mounting groove is adjusted in real time, so that the magnets in the first magnet array and the second magnet array are better matched with the mounting groove, thereby improving the accuracy of the engagement.

[0045] In particular, by arranging corresponding magnets in the first suction cup mechanism and the second suction cup mechanism, the two parts are engaged through the cooperation of the two magnets, and by adjusting the position, the larger the overlapping area of ​​the engaging parts, the greater the engaging force, thereby achieving the magnetic suction effect of the first suction cup mechanism and the second suction cup mechanism, and ensuring the processing of the subsequent chip production process.

[0046] In particular, by setting a standard area S0 and determining the engagement error based on the relationship between the area of ​​the extended portion of the magnet that does not fall into the second magnet mounting slot and the standard area S0, if the relative position error is large, adjustment is required; if the relative position error is small, it indicates that the first suction cup mechanism and the second suction cup mechanism can achieve better engagement, thereby ensuring that the wafer processing process can be guaranteed after engagement.

[0047] In particular, by comparing the actual magnetic uniformity with the standard magnetic uniformity to determine the clamping force of the two parts, effective optimization of the wafer processing program can be achieved, and the wafer processing yield can be improved. If the clamping force meets the requirements, it means that the magnetic uniformity meets the standard magnetic uniformity, and subsequent cutting processing can be carried out. If it does not meet the standard magnetic uniformity, it means that the clamping uniformity is poor. At this time, the frequency of use needs to be reduced to improve the wafer processing yield.

[0048] In particular, by adjusting the operating frequency according to the magnetic uniformity, effective control of the processing yield is achieved, which greatly improves the processing efficiency and processing accuracy.

[0049] In particular, by adjusting the reduction range of the frequency of use in a step-by-step manner, it is ensured that the processing equipment is effectively scheduled during the actual processing process, ensuring the smooth processing process, thereby greatly improving the processing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0050] Figure 1 A schematic structural diagram of a magnetic aluminum plate for LED semiconductor chip packaging provided by an embodiment of the present invention;

[0051] Figure 2 A flow chart of a method for positioning a magnetic aluminum plate for LED semiconductor chip packaging provided by an embodiment of the present invention;

[0052] Figure 3 A schematic structural diagram of a first suction cup mechanism provided in an embodiment of the present invention;

[0053] Figure 4 is a structural schematic diagram of a second suction cup mechanism provided in an embodiment of the present invention;

[0054] Figure 5 1 is a schematic structural diagram of a magnet provided by an embodiment of the present invention;

[0055] Figure 6 A schematic structural diagram of a positioning screw provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0056] In order to make the objects and advantages of the present invention more clearly understood, the present invention is further described below in conjunction with embodiments; it should be understood that the specific embodiments described herein are merely used to explain the present invention and are not intended to limit the present invention.

[0057] The preferred embodiments of the present invention are described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these embodiments are only used to explain the technical principles of the present invention and are not intended to limit the scope of protection of the present invention.

[0058] It should be noted that, in the description of the present invention, terms such as "up", "down", "left", "right", "inside", and "outside" indicating directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings. This is only for the convenience of description and does not indicate or imply that the device or element must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it cannot be understood as a limitation on the present invention.

[0059] Furthermore, it should be noted that, in the description of the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0060] See also Figure 1 、 Figure 3-Figure 6 As shown, the LED semiconductor chip packaging magnetic aluminum plate provided by the embodiment of the present invention includes:

[0061] A first suction cup mechanism 10 is provided with a plurality of first magnet mounting grooves on a side opposite to the second suction cup mechanism. Magnets are mounted in the magnet mounting grooves, and the magnets extend out of the first magnet mounting grooves. Positioning screws 102 are provided at the ends of the magnets for fixing the positions of the magnets in the first magnet mounting grooves after the magnets are placed in the first magnet mounting grooves. When the positioning screws are in a non-fixed state, the position of the magnets in the first magnet mounting grooves can move along the extension direction of the first magnet mounting grooves.

[0062] A second suction cup mechanism 20, which is used to hold the wafer to be cut after the first suction cup mechanism and the second suction cup mechanism are engaged. A second magnet mounting groove is provided on the side of the second suction cup mechanism opposite to the first suction cup mechanism. When the first suction cup mechanism and the second suction cup mechanism are engaged, the second magnet mounting groove is used to accommodate the portion of the positive magnet extending out of the first magnet mounting groove;

[0063] A position sensing piece 30 is disposed in the second magnet mounting groove and is used to monitor the mounting position of the magnet in real time during the engagement process between the first suction cup mechanism and the second suction cup mechanism, thereby determining the relative positional relationship between the protruding portion of the magnet and the second magnet mounting groove;

[0064] The adjustment unit 40 is used to determine the adjustment time by comparing the area of ​​the protruding portion of the magnet that does not fall into the second magnet installation slot with a preset standard area, and adjust the position of the magnet in the first magnet installation slot according to the relative position relationship and the adjustment time.

[0065] Specifically, the adjustment unit in the embodiment of the present invention can be set on the first suction cup mechanism or on the second suction cup mechanism, and can also be set at other positions. No specific limitation is made here, and the actual implementation shall prevail. The adjustment unit in the embodiment of the present invention is connected to the position sensing piece, and is used to adjust the position of the magnet in the first magnet mounting groove according to the relative position relationship determined according to the position sensing piece. The adjustment time during the adjustment process is determined based on the area of ​​the protruding part of the magnet that does not fall into the second magnet mounting groove and the preset standard area. After determining the adjustment time, during the adjustment action, the position of the magnet should be adjusted within the adjustment time to achieve effective engagement of the first suction cup mechanism and the second suction cup mechanism.

[0066] Specifically, the first chuck mechanism 10 in the embodiment of the present invention includes two circular magnet arrays, with the radius of the circle formed by the first magnet array being larger than the radius of the circle formed by the second magnet array. Eight wafer accommodation areas are provided within the first magnet array 104 and outside the second magnet array, and one wafer accommodation area is provided within the second magnet array 103. The first magnet array includes eight magnets 101, and the second magnet array includes six magnets.

[0067] Specifically, the embodiment of the present invention detects the real-time position of the magnet in the first magnet safety slot during the engagement process, and adjusts the position of the magnet in the first magnet installation slot in real time based on the relative positional relationship between the real-time position of the first magnet and the second magnet installation slot, so that the magnets in the first magnet array and the second magnet array are well matched with the installation slot, thereby improving the engagement accuracy. In actual applications, if there is a small mismatch between the magnet and the second magnet installation slot, the magnetic force of the magnet can achieve self-consistency in position. If the magnet and the second magnet installation slot cannot be effectively engaged, the engagement effect will be affected, greatly reducing the efficiency of the aluminum plate.

[0068] In practical applications, a first magnet is provided in the first magnet installation slot, and a second magnet 201 is provided in the second magnet installation slot. The first magnet and the second magnet attract each other, thereby realizing the engagement of the first suction cup mechanism and the second suction cup mechanism.

[0069] Specifically, in the embodiment of the present invention, corresponding magnets are arranged in the first suction cup mechanism and the second suction cup mechanism, and the engagement between the two parts is achieved through the cooperation of the two magnets. Moreover, through the adjustment of the position, the larger the overlapping area of the engaging part, the greater the engaging force, so as to achieve the magnetic adsorption effect between the first suction cup mechanism and the second suction cup mechanism and ensure the processing in the subsequent chip manufacturing process.

[0070] Specifically, the adjustment of the position of the magnet in the first magnet mounting groove by the adjustment unit according to the relative position relationship includes:

[0071] A standard area S0 is preset. If the area where the extended part of the magnet does not fall into the second magnet mounting groove ≤ S0, it means that the relative position error between the position of the magnet and the second magnet mounting groove is small and no adjustment is required;

[0072] If the area where the extended part of the magnet does not fall into the second magnet mounting groove > S0, it means that the relative position error between the position of the magnet and the second magnet mounting groove is large and adjustment is required.

[0073] Specifically, in the embodiment of the present invention, by setting the standard area S0 and according to the relationship between the area where the extended part of the magnet does not fall into the second magnet mounting groove and the standard area S0, the error of the engagement is determined. If the relative position error is large, adjustment is required. If the relative position error is small, it means that the first suction cup mechanism and the second suction cup mechanism can achieve a good engagement, so that the processing procedure for the wafer after the engagement can be guaranteed. However, if the engagement is not tight, it will affect the subsequent processing procedure, thereby reducing the production yield. The embodiment of the present invention realizes the dynamic adjustment of the engagement adsorption through the adjustment of the relative position, so as to optimize the processing of the wafer arranged in the aluminum disc and greatly improve the processing yield.

[0074] For any magnet, when the position of the magnet needs to be adjusted, a first standard area S1, a second standard area S2 and a third standard area S3 are set in the adjustment unit, and S1 < S2 < S3. If S0 < the area where the extended part of the magnet does not fall into the second magnet mounting groove ≤ the first standard area S1, the first time T1 is selected to adjust the position of the magnet, and after the position of the magnet is adjusted, the engagement between the first suction cup mechanism and the second suction cup mechanism is completed;

[0075] If the first standard area S1 < the area where the extended part of the magnet does not fall into the second magnet mounting groove ≤ the second standard area S2, the second time T2 is selected to adjust the position of the magnet, and after the position of the magnet is adjusted, the engagement between the first suction cup mechanism and the second suction cup mechanism is completed;

[0076] If the second standard area S2 is less than the area of ​​the protruding portion of the magnet that does not fall into the second magnet mounting groove and is less than or equal to the third standard area S3, the position of the magnet is adjusted at a third time T3, and the first suction cup mechanism and the second suction cup mechanism are engaged after the position of the magnet is adjusted.

[0077] If the area of ​​the extended part of the magnet that does not fall into the second magnet mounting groove is greater than the third standard area S3, the fourth time T4 is selected to adjust the position of the magnet. After the position of the magnet is adjusted, the engagement of the first suction cup mechanism and the second suction cup mechanism is completed, and the first time T1 is less than the second time T2, less than the third time T3, and less than the fourth time T4.

[0078] Specifically, the embodiment of the present invention effectively adjusts the adjustment area and selects different times to adjust the position of the magnet, so that the first suction cup mechanism and the second suction cup mechanism are effectively engaged. In the actual processing process, if the area of ​​the extended part of the magnet that does not fall into the second magnet mounting groove is adjusted respectively with the preset first standard area S1, second standard area S2 and third standard area S3, different times are selected to adjust the position of the magnet. In actual application, if the relative position needs to be adjusted more, it will take more time, otherwise it will take less time. However, in actual application, there is a difference in adjustment efficiency in the effect of relative position adjustment within the preset time. In actual application, taking the first time as an example, within the first time, the area of ​​the extended part of the magnet that does not fall into the second magnet mounting groove can be effectively adjusted, and the position of the magnet can be effectively optimized, thereby effectively improving the magnetic force between the two. However, as the years of use increase, the functionality of the adjustment robot degrades, and the adjustment time may need to be extended. If the adjustment is still performed according to the first time, the position of the magnet may not be accurately adjusted, thereby affecting the magnetic force after engagement, and further affecting subsequent processing steps, so that the yield of wafer processing is affected. Therefore, the embodiment of the present invention can also effectively monitor the uniformity of the adjusted magnetic force to determine the adjustment effect.

[0079] Specifically, the adjustment unit is further provided with a standard magnetic uniformity M0 for comparison with the actual magnetic uniformity M after adjustment, and the adjustment frequency is determined according to the comparison result.

[0080] Specifically, the embodiment of the present invention compares the actual magnetic uniformity with the standard magnetic uniformity to determine the clamping force of the two parts, so as to achieve effective optimization of the wafer processing program and improve the processing yield of the wafer. If the clamping force meets the requirements, it means that the magnetic uniformity meets the standard magnetic uniformity, and subsequent cutting processing can be carried out. If it does not meet the standard magnetic uniformity, it means that the clamping uniformity is poor. At this time, the frequency of use needs to be reduced to improve the yield of wafer processing. When monitoring the clamping force, strain gauges can be set on the bonding surface. The implementation methods are not listed one by one here.

[0081] Specifically, when the adjustment unit determines to adjust the usage frequency according to the comparison result, a first adjustment parameter n1, a second adjustment parameter n2 and a magnetic force standard deviation value ΔM0 are preset;

[0082] Set the actual operating frequency to n0. If the actual magnetic uniformity is less than or equal to the standard magnetic uniformity M0, reduce the operating frequency.

[0083] If the actual magnetic uniformity is greater than the standard magnetic uniformity M0, the current operating frequency is maintained unchanged, and the first adjustment parameter n1 is less than the second adjustment parameter n2.

[0084] Specifically, the embodiment of the present invention achieves effective control of the processing yield by adjusting the operating frequency according to the magnetic uniformity, thereby greatly improving the processing efficiency and processing accuracy.

[0085] Specifically, when reducing the frequency of use, if the standard magnetic uniformity M0-actual magnetic uniformity ≤ magnetic standard deviation ΔM0, the first adjustment parameter is used to reduce the frequency of use;

[0086] If the standard magnetic uniformity M0 - the actual magnetic uniformity > the magnetic standard deviation ΔM0, the second adjustment parameter is used to reduce the frequency of use;

[0087] The first adjustment parameter is used to reduce the usage frequency, and the reduced usage frequency is set to n0′= n0-n1;

[0088] The second adjustment parameter is used to reduce the usage frequency, and the reduced usage frequency is set to n0" = n0-n2.

[0089] Specifically, the embodiment of the present invention ensures effective scheduling of processing equipment during the actual processing process by adjusting the reduction range of the usage frequency in a step-by-step manner, ensuring the smooth processing process and thus greatly improving the processing efficiency.

[0090] Specifically, the magnet in the embodiment of the present invention directly absorbs and assembles the upper plate in the first suction cup mechanism and the lower plate in the second suction cup mechanism together, without the need to drill screw countersunk holes, thereby optimizing the product and making the appearance more simple and beautiful.

[0091] Specifically, the present invention implements a method that continuously tests and adjusts the magnetic field of the PSS magnetic aluminum disk and the magnetic field of the etcher by evenly arranging the positions, thereby avoiding the magnetic field reaction of the PSS etcher. The magnetic fields cancel each other out. The PSS etcher uses a plasma inductively coupled reaction particle technology, which combines physical methods with chemical reactions. Physical etching reaction refers to the acceleration of charged positive ions in a biased electric field to impact the substrate surface. This downward bombardment force is offset by the magnetic field of the magnet. Chemical reaction etching uses the principle that the reactive gases in the plasma react with the substrate material to produce volatile products to achieve the etching purpose. Chemical reaction is isotropic diffusion and is not affected by the magnetic field of the magnetic aluminum disk. Furthermore, it does not produce any adverse effects in the chip processing process.

[0092] Specifically, the embodiment of the present invention reduces helium leakage and improves yield by changing the outer diameter of the upper plate in the first suction cup mechanism to the same size as the outer diameter of the lower plate in the second suction cup mechanism and also increasing the size of the pressure ring in the lithography machine.

[0093] Specifically, in the embodiment of the present invention, the upper plate in the first suction cup mechanism and the lower plate in the second suction cup mechanism are directly adsorbed and assembled by magnets to package the wafer, which changes the long-standing manual screw-removing and riveting assembly method of LED semiconductor chips, saving time, reducing costs and improving efficiency.

[0094] Specifically, the embodiment of the present invention eliminates the upper plate toothed sleeve screw hole in the first suction cup mechanism and the lower plate screw countersunk hole in the second suction cup mechanism, thereby solving the previous problem of high helium flow rate due to the matching accuracy between the screw countersunk hole and the cup head screw.

[0095] Specifically, in an embodiment of the present invention, a step is designed on the surface where the upper plate in the first suction cup mechanism and the lower plate in the second suction cup mechanism fit together, so as to facilitate the separation of the upper plate in the first suction cup mechanism and the lower plate in the second suction cup mechanism after the wafer etching is completed.

[0096] Specifically, in order to solve the problems of a large amount of manpower, material resources and resources consumed in assembling the upper plate in the first suction cup mechanism and the lower plate in the second suction cup mechanism, as well as the high helium flow rate caused by the matching accuracy between the screw countersunk hole and the cup head screw, an embodiment of the present invention provides a magnetic aluminum plate for LED semiconductor chip packaging.

[0097] Specifically, in the embodiments of the present invention, the upper disk in the first suction cup mechanism and the lower disk in the second suction cup mechanism are adsorbed and assembled with each other by using a magnet, so as to achieve the purpose of connecting the lower disk in the second suction cup mechanism, and change the assembly methods such as screwing and riveting the LED chip by manual labor for a long time.

[0098] Adopting the design scheme described in the present invention can achieve the following technical effects:

[0099] 1. Reduce the increase in the defective rate of the wafer caused by excessive manual operations;

[0100] 2. Reduce the opening of the bottom of the lower disk in the second suction cup mechanism, reduce the helium flow rate, and improve the yield of the wafer;

[0101] 3. Optimize the product and save cost resources;

[0102] 4. The overall appearance is more concise and beautiful;

[0103] 5. Easy to use and simple to operate.

[0104] Specifically, the embodiments of the present invention also provide a behavior method for magnetically attracting an aluminum disk for an LED semiconductor chip package, and the method includes:

[0105] Step S100: During the engagement process, the installation position of the magnet is monitored in real time to determine the relative position relationship between the protruding part of the magnet and the second magnet installation groove;

[0106] Step S200: Adjust the position of the magnet in the first magnet installation groove according to the relative position relationship;

[0107] A standard area S0 is preset. If the area where the protruding part of the magnet does not fall into the second magnet installation groove ≤ S0, it means that the relative position error between the position of the magnet and the second magnet installation groove is small and no adjustment is required;

[0108] If the area where the protruding part of the magnet does not fall into the second magnet installation groove > S0, it means that the relative position error between the position of the magnet and the second magnet installation groove is large and adjustment is required;

[0109] When the position of the magnet needs to be adjusted, a first standard area S1, a second standard area S2, and a third standard area S3 are set in the adjustment unit, and S1 < S2 < S3. If S0 < the area where the protruding part of the magnet does not fall into the second magnet installation groove ≤ the first standard area S1, select the first time T1 to adjust the position of the magnet, and when the position of the magnet is adjusted, the engagement of the first suction cup mechanism and the second suction cup mechanism is completed;

[0110] If the first standard area S1 is less than the area of ​​the protruding portion of the magnet that does not fall into the second magnet mounting groove and is less than or equal to the second standard area S2, the position of the magnet is adjusted at a second time T2, and the first suction cup mechanism and the second suction cup mechanism are engaged after the position of the magnet is adjusted.

[0111] If the second standard area S2 is less than the area of ​​the protruding portion of the magnet that does not fall into the second magnet mounting groove and is less than or equal to the third standard area S3, the position of the magnet is adjusted at a third time T3, and the first suction cup mechanism and the second suction cup mechanism are engaged after the position of the magnet is adjusted.

[0112] If the area of ​​the extended part of the magnet that does not fall into the second magnet mounting groove is greater than the third standard area S3, the fourth time T4 is selected to adjust the position of the magnet. After the position of the magnet is adjusted, the engagement of the first suction cup mechanism and the second suction cup mechanism is completed, and the first time T1 is less than the second time T2, less than the third time T3, and less than the fourth time T4.

[0113] Specifically, a standard magnetic uniformity M0 is provided for comparison with the actual magnetic uniformity M after adjustment, and the adjustment frequency is determined based on the comparison result;

[0114] A first adjustment parameter n1, a second adjustment parameter n2 and a magnetic force standard deviation value ΔM0 are preset;

[0115] Set the actual operating frequency to n0. If the actual magnetic uniformity is less than or equal to the standard magnetic uniformity M0, reduce the operating frequency.

[0116] If the actual magnetic uniformity is greater than the standard magnetic uniformity M0, the current operating frequency is maintained unchanged, and the first adjustment parameter n1 is less than the second adjustment parameter n2;

[0117] When reducing the frequency of use, if the standard magnetic uniformity M0-the actual magnetic uniformity ≤ the magnetic standard deviation ΔM0, the first adjustment parameter is used to reduce the frequency of use;

[0118] If the standard magnetic uniformity M0 - the actual magnetic uniformity > the magnetic standard deviation ΔM0, the second adjustment parameter is used to reduce the frequency of use;

[0119] The first adjustment parameter is used to reduce the usage frequency, and the reduced usage frequency is set to n0′= n0-n1;

[0120] The second adjustment parameter is used to reduce the usage frequency, and the reduced usage frequency is set to n0" = n0-n2.

[0121] The positioning method in the embodiment of the present invention applies the above-mentioned LED semiconductor chip packaging magnetic aluminum plate, has the same technical features, and can achieve the same technical effects, which will not be described in detail here.

[0122] Thus far, the technical solutions of the present invention have been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it will be readily understood by those skilled in the art that the scope of protection of the present invention is obviously not limited to these specific embodiments. Without departing from the principles of the present invention, those skilled in the art may make equivalent changes or substitutions to the relevant technical features, and the technical solutions after such changes or substitutions will fall within the scope of protection of the present invention.

[0123] The foregoing description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that the present invention is susceptible to various modifications and variations. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention are intended to be within the scope of protection of the present invention.

Claims

1. A magnetic aluminum plate for LED semiconductor chip packaging, characterized in that: include: The first suction cup mechanism and the second suction cup mechanism are engaged with each other to carry the wafer to be cut, wherein: A plurality of first magnet mounting slots are provided on a side of the first suction cup mechanism opposite to the second suction cup mechanism, wherein magnets extending out of the first magnet mounting slots are installed in the magnet mounting slots, and positioning screws are provided at the ends of the magnets for fixing the positions of the magnets in the first magnet mounting slots after the magnets are placed in the first magnet mounting slots, and when the positioning screws are in a non-fixed state, the position of the magnets in the first magnet mounting slots can move along the extension direction of the first magnet mounting slots; A second magnet mounting groove is provided on a side of the second suction cup mechanism opposite to the first suction cup mechanism. When the first suction cup mechanism and the second suction cup mechanism are engaged, the second magnet mounting groove is used to accommodate the portion of the magnet extending out of the first magnet mounting groove. a position sensing piece, disposed in the second magnet mounting groove, for monitoring the mounting position of the magnet in real time during the engagement process between the first suction cup mechanism and the second suction cup mechanism, and determining the relative positional relationship between the protruding portion of the magnet and the second magnet mounting groove; An adjustment unit is connected to the position sensing piece, and is used to determine the adjustment time by the area of ​​the protruding part of the magnet that does not fall into the second magnet mounting slot and the preset standard area, and adjust the position of the magnet in the first magnet mounting slot according to the relative position relationship and the adjustment time.

2. The LED semiconductor chip packaging magnetic aluminum plate according to claim 1, characterized in that: The first suction cup mechanism includes two circular magnet arrays, and the radius of the circle formed by the first magnet array is larger than the radius of the circle formed by the second magnet array. Eight wafer accommodating areas are arranged inside the first magnet array and outside the second magnet array, and one wafer accommodating area is arranged inside the second magnet array. The first magnet array includes 8 magnets, and the second magnet array is provided with 6 magnets.

3. The LED semiconductor chip packaging magnetic aluminum plate according to claim 1, characterized in that: A first magnet is provided in the first magnet installation groove, and a second magnet is provided in the second magnet installation groove. The first magnet and the second magnet attract each other, thereby realizing the engagement of the first suction cup mechanism and the second suction cup mechanism.

4. The LED semiconductor chip packaging magnetic aluminum plate according to claim 2, characterized in that: The adjusting unit adjusting the position of the magnet in the first magnet installation slot according to the relative position relationship includes: A standard area S0 is preset. If the area of ​​the protruding portion of the magnet that does not fall into the second magnet mounting slot is ≤ S0, it means that the relative position error between the magnet and the second magnet mounting slot is small and no adjustment is required. If the area of ​​the protruding portion of the magnet that does not fall into the second magnet mounting slot is greater than S0, it means that the relative position error between the magnet and the second magnet mounting slot is large and needs to be adjusted.

5. The LED semiconductor chip packaging magnetic aluminum plate according to claim 4, characterized in that: The adjustment unit is provided with a first standard area S1, a second standard area S2, and a third standard area S3, and S1<S2<S3. If S0<the area of ​​the extended portion of the magnet that does not fall into the second magnet mounting groove ≤ the first standard area S1, the position of the magnet is adjusted at a first time T1. After the position of the magnet is adjusted, the first suction cup mechanism and the second suction cup mechanism are engaged. If the first standard area S1 is less than the area of ​​the protruding portion of the magnet that does not fall into the second magnet mounting groove and is less than or equal to the second standard area S2, the position of the magnet is adjusted at a second time T2, and the first suction cup mechanism and the second suction cup mechanism are engaged after the position of the magnet is adjusted. If the second standard area S2 is less than the area of ​​the protruding portion of the magnet that does not fall into the second magnet mounting groove and is less than or equal to the third standard area S3, the position of the magnet is adjusted at a third time T3, and the first suction cup mechanism and the second suction cup mechanism are engaged after the position of the magnet is adjusted. If the area of ​​the extended part of the magnet that does not fall into the second magnet mounting groove is greater than the third standard area S3, the fourth time T4 is selected to adjust the position of the magnet. After the position of the magnet is adjusted, the engagement of the first suction cup mechanism and the second suction cup mechanism is completed, and the first time T1 is less than the second time T2, less than the third time T3, and less than the fourth time T4.

6. The LED semiconductor chip packaging magnetic aluminum plate according to claim 5, characterized in that: The adjustment unit is also provided with a standard magnetic uniformity M0 for comparison with the actual magnetic uniformity M after adjustment, and the adjustment frequency is determined according to the comparison result.

7. The LED semiconductor chip packaging magnetic aluminum plate according to claim 6, characterized in that: When the adjustment unit determines to adjust the usage frequency according to the comparison result, the first adjustment parameter n1, the second adjustment parameter n2 and the magnetic force standard deviation value ΔM0 are preset; Set the actual operating frequency to n0. If the actual magnetic uniformity is less than or equal to the standard magnetic uniformity M0, reduce the operating frequency. If the actual magnetic uniformity is greater than the standard magnetic uniformity M0, the current operating frequency is maintained unchanged, and the first adjustment parameter n1 is less than the second adjustment parameter n2.

8. The LED semiconductor chip packaging magnetic aluminum plate according to claim 7, characterized in that: When the adjustment unit reduces the frequency of use, if the standard magnetic uniformity M0 minus the actual magnetic uniformity ≤ the magnetic standard deviation ΔM0, the adjustment unit reduces the frequency of use using the first adjustment parameter; If the standard magnetic uniformity M0 - the actual magnetic uniformity > the magnetic standard deviation ΔM0, the second adjustment parameter is used to reduce the frequency of use; The first adjustment parameter is used to reduce the usage frequency, and the reduced usage frequency is set to n0′= n0-n1; The second adjustment parameter is used to reduce the usage frequency, and the reduced usage frequency is set to n0" = n0-n2.

9. A method for positioning a magnetic aluminum disk for LED semiconductor chip packaging using the magnetic aluminum disk for LED semiconductor chip packaging according to any one of claims 1 to 8, characterized in that: include: During the engagement process, the installation position of the magnet is monitored in real time to determine the relative position relationship between the protruding portion of the magnet and the second magnet installation slot; adjusting the position of the magnet in the first magnet mounting slot according to the relative position relationship; A standard area S0 is preset. If the area of ​​the protruding portion of the magnet that does not fall into the second magnet mounting slot is ≤ S0, it means that the relative position error between the magnet and the second magnet mounting slot is small and no adjustment is required. If the area of ​​the protruding portion of the magnet that does not fall into the second magnet mounting slot is greater than S0, it means that the relative position error between the magnet and the second magnet mounting slot is large and needs to be adjusted; When the position of the magnet needs to be adjusted, a first standard area S1, a second standard area S2, and a third standard area S3 are set in the adjustment unit, and S1<S2<S3. If S0<the area of ​​the protruding portion of the magnet that does not fall into the second magnet mounting groove ≤ the first standard area S1, the position of the magnet is adjusted at a first time T1. After the position of the magnet is adjusted, the first suction cup mechanism and the second suction cup mechanism are engaged. If the first standard area S1 is less than the area of ​​the protruding portion of the magnet that does not fall into the second magnet mounting groove and is less than or equal to the second standard area S2, the position of the magnet is adjusted at a second time T2, and the first suction cup mechanism and the second suction cup mechanism are engaged after the position of the magnet is adjusted. If the second standard area S2 is less than the area of ​​the protruding portion of the magnet that does not fall into the second magnet mounting groove and is less than or equal to the third standard area S3, the position of the magnet is adjusted at a third time T3, and the first suction cup mechanism and the second suction cup mechanism are engaged after the position of the magnet is adjusted. If the area of ​​the extended part of the magnet that does not fall into the second magnet mounting groove is greater than the third standard area S3, the fourth time T4 is selected to adjust the position of the magnet. After the position of the magnet is adjusted, the engagement of the first suction cup mechanism and the second suction cup mechanism is completed, and the first time T1 is less than the second time T2, less than the third time T3, and less than the fourth time T4.

10. The method for positioning a magnetic aluminum plate for LED semiconductor chip packaging according to claim 9, characterized in that: A standard magnetic uniformity M0 is also provided for comparison with the actual magnetic uniformity M after adjustment, and the adjustment frequency is determined based on the comparison result; A first adjustment parameter n1, a second adjustment parameter n2 and a magnetic force standard deviation value ΔM0 are preset; Set the actual operating frequency to n0. If the actual magnetic uniformity is less than or equal to the standard magnetic uniformity M0, reduce the operating frequency. If the actual magnetic uniformity is greater than the standard magnetic uniformity M0, the current operating frequency is maintained unchanged, and the first adjustment parameter n1 is less than the second adjustment parameter n2; When reducing the frequency of use, if the standard magnetic uniformity M0-the actual magnetic uniformity ≤ the magnetic standard deviation ΔM0, the first adjustment parameter is used to reduce the frequency of use; If the standard magnetic uniformity M0 - the actual magnetic uniformity > the magnetic standard deviation ΔM0, the second adjustment parameter is used to reduce the frequency of use; The first adjustment parameter is used to reduce the usage frequency, and the reduced usage frequency is set to n0′= n0-n1; The second adjustment parameter is used to reduce the usage frequency, and the reduced usage frequency is set to n0" = n0-n2.

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