A chip mounter applicable to optical devices and optical modules

Abstract

The present application relates to a kind of patch machine applicable to optical device and optical module, including operation platform, negative pressure suction component, transverse pivot, the operating handle of driving transverse pivot rotation, transverse pivot is equipped with transverse moving part, and transverse moving part is connected with operating handle by connecting rod mechanism;The front of transverse moving part is equipped with vertical moving part, and the lower end of vertical moving part is longitudinally slidingly matched with transverse moving part, and transverse pivot rotation drives the movement of vertical moving part;Vertical moving part is equipped with vertical slide, and negative pressure suction component includes the negative pressure suction nozzle of slidingly matched with vertical slide, and the upper side of negative pressure suction nozzle is equipped with the detection component connected with alarm module, when detection component detects the upper end of negative pressure suction nozzle, alarm module sends alarm indication.The present application is convenient for manually controlling the position of chip, and the operation is convenient, improves the efficiency of patching;And after patching in place, alarm indication is sent using alarm module, so that operator can quickly stop patching, to avoid damaging chip.

Description

Technical Field

[0001] This invention relates to a chip mounter applicable to optical devices and optical modules. Background Technology

[0002] Optical modules are a core component of optical communication, used to convert optical signals into electrical signals. Internally, an optical module mainly consists of optical components and a circuit board. Depending on the packaging, the optical chip inside the optical component can be placed on the circuit board or inside the component itself. This process typically requires automated placement equipment, which is expensive and significantly increases product development costs. Current manual placement equipment often controls chip position via a slide adjustment mechanism, which is inconvenient and inefficient. Furthermore, manual placement can easily result in insufficient or excessive placement pressure, affecting placement quality. Summary of the Invention

[0003] The present invention addresses the problems existing in the prior art. Specifically, the technical problem to be solved by the present invention is to provide a chip mounter that can be applied to optical devices and optical modules. It is not only reasonably designed and easy to operate, but also improves the mounting quality.

[0004] To achieve the above objectives, the technical solution adopted by the present invention is as follows: a chip mounter applicable to optical devices and optical modules, comprising an operating table, a negative pressure adsorption assembly disposed above the operating table for adsorbing chips, a horizontal rotating shaft, and an operating handle for driving the horizontal rotating shaft to rotate. The horizontal rotating shaft is equipped with a horizontal moving component, which is connected to the operating handle via a linkage mechanism. The operating handle drives the horizontal moving component to move horizontally. A vertical moving component is provided in front of the horizontal moving component, and the lower end of the vertical moving component slides longitudinally with the horizontal moving component. When the horizontal rotating shaft rotates, the horizontal moving component drives the vertical moving component to move vertically. The vertical moving component has a vertically penetrating vertical slide rail. The negative pressure adsorption assembly includes a negative pressure suction nozzle that slides with the vertical slide rail. A detection component connected to an alarm module is provided on the upper side of the negative pressure suction nozzle. When the detection component detects the upper end of the negative pressure suction nozzle, the alarm module issues an alarm indication.

[0005] Furthermore, the lateral moving member slides in conjunction with the lateral slide rail installed at the bottom left end of the lateral rotating shaft; the linkage mechanism includes a first link and a second link, the rear end of the first link is hinged to the right end of the lateral rotating shaft in the horizontal direction, the front end of the first link is hinged to the right end of the second link in the horizontal direction, and the left end of the second link is hinged to the lateral moving member in the horizontal direction; the operating handle is fixedly connected to the front end of the first link.

[0006] Furthermore, the upper front end of the lateral moving member is provided with a pair of longitudinal sliding grooves distributed on the left and right; the vertical moving member is located between the pair of longitudinal sliding grooves, and the vertical moving member slides in cooperation with the vertical slide rail located behind it. The lower left and right sides of the vertical moving member are provided with sliding rollers, and the sliding rollers are housed in the longitudinal sliding grooves and slide in cooperation with the longitudinal sliding grooves.

[0007] Furthermore, the lower end of the vertical moving part is fixedly connected to a mounting block, and the mounting block is provided with a vertical slide rail; the upper end of the negative pressure suction nozzle is connected to a suction nozzle clamping block movably disposed on the top of the mounting block, and a connector connected to the negative pressure suction nozzle is provided above the suction nozzle clamping block. A rotating disk driven by a rotating mechanism to rotate in the horizontal direction is provided above the connector, and a vertical slot for the connector to extend into is provided at the lower end of the rotating disk; the detection component is disposed on the upper side of the vertical slot and is used to detect the connector.

[0008] Furthermore, an elastic element that can deform vertically is connected between the suction nozzle clamping block and the vertical moving part. The elastic element includes a pair of tension springs located on the left and right sides of the suction nozzle clamping block. The tension springs are vertically arranged, and their upper and lower ends are connected to the suction nozzle clamping block and the vertical moving part respectively by connecting bolts.

[0009] Furthermore, the connector includes a connecting pipe with a negative pressure air tube connected to its side wall. The lower end of the connecting pipe is connected to a negative pressure suction nozzle. The upper outer wall of the connecting pipe is provided with a rotating block for extending into a vertical slot. On the opposite side of the rotating block, there is a sensing block to facilitate sensing by the detection component. The sensing block is fixed to the upper outer wall of the connecting pipe. The detection component includes a miniature light sensor. The miniature light sensor is fixedly installed at the bottom of the rotating disk. The sensing slot of the miniature light sensor is distributed opposite to the vertical slot to facilitate the vertical extension of the sensing block.

[0010] Furthermore, the rotating mechanism includes a pulley mechanism horizontally mounted on the vertical moving part, and the drive motor of the pulley mechanism is controlled by a foot switch; the middle part of the rotating disk is connected to the left end of the pulley mechanism, the pulley mechanism drives the rotating disk to rotate in the horizontal direction, a positioning block is provided in the middle of the bottom surface of the rotating disk, a vertical slot is opened in the middle of the positioning block, and the vertical slot passes through the radial direction of the rotating disk.

[0011] Furthermore, the vertical slide is provided with a number of circumferentially distributed vertical guide members, each including a pair of guide wheels distributed vertically and horizontally for contacting the outer wall of the negative pressure suction nozzle.

[0012] Furthermore, it also includes a manually operated lifting slide on the operating table, which is located directly below the negative pressure adsorption component. The manually operated lifting slide is used to place the items to be patched and the material box containing the chip.

[0013] Furthermore, a microscope is provided on the front side of the negative pressure suction nozzle, and a vertical bracket fixed to the operating table is provided on the left side of the microscope. A longitudinal moving slide rail is installed on the upper end of the vertical bracket, a vertical moving slide rail is installed on the sliding part of the longitudinal moving slide rail, a horizontal moving slide rail is installed on the sliding part of the vertical moving slide rail, and a microscope mounting bracket is installed on the sliding part of the horizontal moving slide rail for mounting the microscope. Locking screws for locking the sliding parts are provided on the longitudinal moving slide rail, the vertical moving slide rail, and the horizontal moving slide rail.

[0014] Compared with the prior art, the present invention has the following advantages: the present invention has a reasonable structural design, which facilitates manual control of the chip position, makes operation convenient, and improves chip placement efficiency; and after the chip is placed in place, the alarm module issues an alarm indication so that the operator can quickly stop the chip placement and avoid damage to the chip. Attached Figure Description

[0015] Figure 1 This is a three-dimensional structural diagram of an embodiment of the present invention. Figure 1 ;

[0016] Figure 2 This is a three-dimensional structural diagram of an embodiment of the present invention. Figure 2 ;

[0017] Figure 3 This is a three-dimensional structural schematic diagram of the linkage mechanism in an embodiment of the present invention;

[0018] Figure 4 This is a top view schematic diagram of the linkage mechanism in an embodiment of the present invention;

[0019] Figure 5 This is a partial structural schematic diagram of the linkage mechanism in an embodiment of the present invention;

[0020] Figure 6 This is a schematic diagram of the structure of the vertical moving part and the horizontal moving part cooperating in an embodiment of the present invention. Figure 1 ;

[0021] Figure 7 This is a schematic diagram of the structure of the vertical moving part and the horizontal moving part cooperating in an embodiment of the present invention. Figure 2 ;

[0022] Figure 8 yes Figure 7 Enlarged diagram of point A in the diagram;

[0023] Figure 9 This is a three-dimensional structural diagram of the connecting plate in an embodiment of the present invention;

[0024] Figure 10 This is a three-dimensional structural schematic diagram of the negative pressure adsorption component in an embodiment of the present invention;

[0025] Figure 11 This is a partial structural diagram of the negative pressure adsorption component in an embodiment of the present invention. Figure 1 ;

[0026] Figure 12 This is a partial structural diagram of the negative pressure adsorption component in an embodiment of the present invention. Figure 2 ;

[0027] Figure 13 This is a partial structural diagram of an embodiment of the present invention. Figure 1 ;

[0028] Figure 14 This is a partial structural diagram of an embodiment of the present invention. Figure 2 . Detailed Implementation

[0029] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0030] In the description of this invention, it should be understood that the terms "longitudinal", "lateral", "up", "down", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this invention, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention.

[0031] like Figures 1-14As shown, this invention discloses a chip mounter applicable to optical devices and modules, comprising an operating table, a negative pressure adsorption assembly disposed above the operating table for adsorbing chips, a horizontal rotating shaft, and an operating handle for driving the horizontal rotating shaft to rotate. The horizontal rotating shaft is equipped with a horizontal moving component 5, which is slidably connected to the horizontal rotating shaft 3 laterally. The horizontal moving component is connected to the operating handle via a linkage mechanism. When the operating handle is swung left or right, the operating handle drives the horizontal moving component to move laterally via the linkage mechanism. A vertical moving component is provided in front of the horizontal moving component, and the lower end of the vertical moving component slides longitudinally with the horizontal moving component. The components are hinged together. When the operating handle 4 swings up and down, the operating handle drives the horizontal rotating shaft to rotate. The horizontal moving component drives the vertical moving component to move vertically, thereby driving the negative pressure adsorption component 2 to move vertically. The vertical moving component is provided with a vertically penetrating vertical slide. The negative pressure adsorption component includes a negative pressure suction nozzle that slides with the vertical slide. The upper side of the negative pressure suction nozzle is provided with a detection component connected to the alarm module. When the patch is applied, the negative pressure suction nozzle will move upward along the vertical slide. When the detection component detects the upper end of the negative pressure suction nozzle, the alarm module issues an alarm indication. At this time, the patch application operation is just completed, and the vertical moving component stops moving downward.

[0032] In this embodiment, a first transverse slide rail 8 is installed at the bottom left end of the transverse rotating shaft 3, and the lower rear end of the transverse moving member 5 is fixedly connected to the slider on the first transverse slide rail 8. The transverse moving member 5 moves along the first transverse slide rail 8.

[0033] In this embodiment, the linkage mechanism 6 includes a first link 9 and a second link 10. The rear end of the first link 9 is hinged horizontally to the right end of the transverse rotating shaft 3 via a vertically arranged hinge shaft. The front end of the first link 9 is hinged horizontally to the right end of the second link 10. The left end of the second link 10 is hinged horizontally to the transverse moving member 5. The operating handle 4 is fixedly connected to the front end of the first link 9. In use, when the operating handle 4 is swung left and right, the operating handle 4 drives the first link 9 to rotate horizontally. The first link 9 drives the transverse moving member 5 to slide along the first transverse slide rail via the second link 10. At this time, the transverse moving member 5 drives the vertical moving member 22 and the negative pressure adsorption component 2 to move synchronously, so as to realize the movement between the material picking station and the patch mounting station.

[0034] In this embodiment, the upper front end of the lateral moving member 5 is provided with a U-shaped mounting port 11. Connecting plates 12 are fixedly connected to the outer sides of the left and right ends of the U-shaped mounting port 11. The inner side of the front end of the connecting plate 12 is provided with a longitudinal sliding groove 13, i.e., the two connecting plates form a pair of left-right distributed longitudinal sliding grooves. The lower end of the vertical moving member 22 is provided with a rearwardly extending U-shaped connecting portion 14. The U-shaped connecting portion 14 is directly opposite the U-shaped mounting port 11 and located between the two connecting plates 12. Sliding rollers 15 are provided on both the left and right sides of the U-shaped connecting portion 14. The sliding rollers 15 are accommodated within the longitudinal sliding grooves 13 and slide in cooperation with the longitudinal sliding grooves. A vertical slide rail 17 is provided on the rear side of the vertical moving member 22, and the rear side of the vertical moving member 22 is fixedly connected to a slider on the vertical slide rail 17. In use, when the operating handle 4 is pressed down or lifted up, the operating handle 4 drives the horizontal rotating shaft 3 to rotate around its axis. The horizontal rotating shaft 3 drives the horizontal moving part 5 to rotate synchronously. When the horizontal moving part 5 rotates, the sliding roller 15 and the longitudinal slide groove 13 form relative sliding, and drive the vertical moving part 22 to move along the vertical slide rail 17. At this time, the vertical moving part 22 drives the negative pressure adsorption component 2 to move synchronously, so as to realize the lowering of the chip.

[0035] In this embodiment, a material platform 19 is also provided on the operating table 1. The material platform 19 is located directly below the negative pressure adsorption component 2. The material platform 19 is used to place the item 20 to be patched and the material box 21 containing the chip. The operating handle 4 drives the negative pressure adsorption component 2 to move between the item 20 and the material box 21 through the horizontal rotating shaft 3 and the linkage mechanism 6 to realize material picking. The negative pressure adsorption component can also move vertically to realize the patching operation.

[0036] In this embodiment, to improve the stability of the vertical moving member 22 moving with the horizontal moving member 5, a second horizontal slide rail 23 is provided on the rear side of the upper end of the vertical moving member 22. The second horizontal slide rail does not rotate with the horizontal axis. The rear part of the upper end of the vertical moving member 22 is connected to the slider of the second horizontal slide rail 23, which plays a further guiding role. To improve the protective effect, a protective cover 46 is provided on the outside of the linkage mechanism. The left end of the front side wall of the protective cover 46 has a clearance window 47 to facilitate the forward extension of the vertical moving member 22, and the lower part of the right side wall of the protective cover 46 has a clearance slot 48 to facilitate the forward extension of the operating handle 4. The second horizontal slide rail is fixedly installed inside the protective cover, and the lower end of the protective cover is fixedly connected to the operating table.

[0037] In this embodiment, the lower front end of the vertical moving part 22 is fixedly connected to the mounting block 24, and the mounting block 24 is provided with a vertically penetrating vertical slide 25; the negative pressure suction nozzle 26 is slidably engaged with the vertical slide 25, and the upper end of the negative pressure suction nozzle 26 is connected to the rotating mechanism via a connector. The negative pressure suction nozzle is used to adsorb the chip, and the rotating mechanism drives the negative pressure suction nozzle to rotate in order to adjust the chip mounting angle.

[0038] In this embodiment, the upper end of the negative pressure suction nozzle 26 is connected to a suction nozzle clamping block 27 movably disposed on the top of the mounting block 24. Above the suction nozzle clamping block 27 is a connector connected to the negative pressure suction nozzle 26. Above the connector is a rotating disk 28 driven by a rotating mechanism to rotate horizontally. The lower end of the rotating disk 28 is provided with a vertical slot 29 for the connector to extend into. The detection component is disposed on one upper side of the vertical slot and is used to detect the connector. When the detection component detects the connector, the alarm module issues an alarm indication. In use, the vertical moving part 22 is controlled to move downward by operating the handle 4. The vertical moving part 22 drives the negative pressure nozzle 26, the rotating disk 28 and the connecting parts to move downward synchronously. The chip at the suction port at the lower end of the negative pressure nozzle 26 comes into contact with the item 20 (such as the inside of a circuit board or optical device) on the material table. As the vertical moving part 22 continues to move downward, the negative pressure nozzle 26 will move upward along the vertical slide 25 to avoid reaching or even exceeding the pressure value required for chip placement at once, which could damage the chip. When the negative pressure nozzle moves upward to the point where the detected component is sensed, the alarm module issues an alarm indication, and the operator stops the vertical moving part from moving downward, completing the chip placement operation. Afterward, the vertical moving part is controlled to move upward.

[0039] In this embodiment, an elastic element capable of vertical deformation is connected between the nozzle clamping block 27 and the vertical moving member 22. During the placement process, the negative pressure nozzle moves vertically upward. By providing an elastic element between the nozzle clamping block and the vertical moving member, the negative pressure nozzle is driven downward to its initial position after the placement operation is completed. Preferably, the elastic element includes a pair of tension springs 30 disposed on the left and right sides of the nozzle clamping block 27. The tension springs 30 are vertically arranged, and their upper and lower ends are connected to the nozzle clamping block 27 and the vertical moving member 22 respectively by connecting bolts 50. It should be noted that, based on the required pressure for placement and the weight of the part, the tension of the tension spring at the moment the detection component senses it can be calculated, thereby completing the selection of spring parameters.

[0040] In this embodiment, the connector includes a connecting pipe 32 with a negative pressure air pipe 31 connected to its side wall. The negative pressure air pipe 31 is connected to a negative pressure generating device through a pipeline, so that the suction port of the negative pressure nozzle forms a negative pressure and adsorbs the chip. The lower end of the connecting pipe 32 is connected and fixed to the negative pressure nozzle 26. The top surface of the nozzle clamping block 27 contacts the bottom surface of the connecting pipe 32. The nozzle clamping block 27 is movably disposed on the top of the vertical moving part 22, providing support for the connecting pipe 32. The nozzle clamping block uses its clamping port to hold the upper end of the negative pressure nozzle. When the negative pressure nozzle moves upward along the vertical slide rail, the negative pressure nozzle drives the connecting pipe and the nozzle clamping block to move upward synchronously.

[0041] In this embodiment, the upper outer wall of the connecting tube 32 is provided with a rotating block 33 for extending into the vertical slot 29. When the rotating disk 28 rotates in the horizontal direction, the side of the rotating block 33 contacts the side wall of the vertical slot 29. The rotating disk 28 pushes the rotating block 33 to rotate. The rotating block 33 drives the negative pressure suction nozzle 26 to rotate in the vertical slide 25 through the connecting tube 32. This can adjust the angle of the chip so that the chip is rotated to a suitable mounting angle.

[0042] In this embodiment, a sensing block 34 is provided on one side opposite to the rotating paddle 33 to facilitate sensing by the detection component. The sensing block 34 is fixed to the upper outer wall of the connecting tube 32, and the rotating paddle 33 and the sensing block 34 are vertically offset. During the patch application process, the negative pressure suction nozzle 26 moves upward, and the negative pressure suction nozzle 26 drives the sensing block 34 to move upward synchronously. When the detection component senses the sensing block 34, the alarm module issues an alarm indication, and the operator stops the vertical moving part from moving downward (i.e., stops patch application). The detection component includes a miniature light sensor, which is fixedly installed at the bottom of the rotating disk 15 and rotates synchronously with the rotating disk.

[0043] In this embodiment, the rotating mechanism includes a pulley mechanism 35 horizontally mounted on the vertical moving part 22. The drive motor of the pulley mechanism is controlled by a foot switch. The middle part of the rotating disk 28 is connected to the left end of the pulley mechanism 35. The pulley mechanism 35 drives the rotating disk 28 to rotate horizontally. A positioning block 36 is provided in the middle of the bottom surface of the rotating disk 28. A vertical slot 29 is opened in the middle of the positioning block 36, and the vertical slot 29 passes through the radial direction of the rotating disk 28. The detection component includes a miniature light sensor 37, which is fixedly mounted on the bottom of the rotating disk 28 and rotates synchronously with the rotating disk 28. The U-shaped sensing groove of the miniature light sensor 37 is distributed opposite to the vertical slot 29 to facilitate the vertical insertion of the sensing block 34. Under normal conditions, the rotating lever 33 is always inserted into the vertical slot, while the sensing block 34 is located below the sensing groove of the miniature light sensor 37. The sensing block 34 moves upward to the sensing groove of the miniature light sensor 37 under the action of the negative pressure suction nozzle 26. It should be noted that the miniature optical sensor can be a U-shaped miniature photoelectric sensor, which is a mature product. Its specific structure and detection principle will not be described in detail here.

[0044] In this embodiment, the pulley mechanism 35 is located above the rotating disk 28. It includes a driving pulley 38, a driven pulley 39, and a drive motor 40. The drive motor 40 is vertically mounted on the vertical moving member 22. The motor shaft of the drive motor 40 is connected to the horizontally arranged driving pulley 38. The driven pulley 39 is horizontally arranged, and its central axis is connected to the middle of the rotating disk 28. The driven pulley 39 and the driving pulley 38 are connected by a transmission belt 41. The drive motor drives the rotating disk to rotate horizontally via the transmission belt. For ease of operation, the drive motor is controlled by a foot switch (not shown in the figure). The drive motor is vertically mounted on a motor base 49, which is fixedly mounted on the vertical moving member and moves together with the vertical moving member.

[0045] In this embodiment, the vertical slide 25 is provided with three circumferentially distributed vertical guide members. Each vertical guide member includes a pair of guide wheels 42 distributed vertically and horizontally for contacting the outer wall of the negative pressure nozzle. By providing guide wheels on the circumferential side, the horizontal degree of freedom of the negative pressure nozzle can be restricted, so that the negative pressure nozzle can only rotate vertically and move vertically within the vertical sliding range.

[0046] This embodiment also includes a manually adjustable slide table mounted on the operating table. The manually adjustable slide table is located directly below the negative pressure adsorption assembly and is used to place the items to be bonded and the chip-containing container. It should be noted that the manually adjustable slide table is an existing product; by manually adjusting the height of the items and the container, it can adapt to different types of bonding requirements.

[0047] In this embodiment, the alarm module includes a buzzer, which is electrically connected to the miniature optical sensor via a control unit (e.g., a microcontroller or PLC). When the sensing block enters the sensing slot of the miniature optical sensor under the action of the negative pressure nozzle, the miniature optical sensor sends an electrical signal to the control unit, which then controls the buzzer to issue an alarm indication.

[0048] In this embodiment, the size or model of the negative pressure nozzle can be changed as needed to meet the surface mount requirements of optical chips of different sizes and packages, thereby improving versatility.

[0049] In this embodiment, a microscope 43 is provided on the front side of the negative pressure suction nozzle. A vertical support 50, fixed to the operating table, is provided on the left side of the microscope 43. A longitudinal sliding rail 44 is installed on the upper end of the vertical support 50. A vertical sliding rail 45 is installed on the sliding part of the longitudinal sliding rail 44. A transverse sliding rail 51 is installed on the sliding part of the vertical sliding rail 45. A microscope mounting bracket 52 is installed on the sliding part of the transverse sliding rail 51 for mounting the microscope. Locking screws 53 for locking the sliding parts are provided on the longitudinal, vertical, and transverse sliding rails. It should be noted that the longitudinal, vertical, and transverse sliding rails can all adopt existing technology, and their construction will not be described in detail here.

[0050] In this embodiment, the negative pressure suction nozzle 26 is set to move a certain distance by means of a tension spring 30 and a photosensitive sensor. The purpose of setting the vertical movement distance of the negative pressure suction nozzle is to provide a visually observable buffer stage for the stress during the patch application process, so as to avoid reaching or even exceeding the pressure value required for patch application at once. After the set distance is reached, the photosensitive sensor will generate an electrical signal output to the buzzer, thereby issuing an alarm prompt. In practical use: The item 20 to be mounted and the chip-containing container 21 are placed on the material platform. The negative pressure nozzle 26 is located above the material platform. The vertical moving part 22 is controlled to move downward using the operating handle 4. The vertical moving part 22 drives the negative pressure nozzle 26, the rotating disk 28 and the connecting parts to move downward synchronously. The suction port at the lower end of the negative pressure nozzle 26 picks up a chip in the container. Then the vertical moving part 22 moves above the item to be mounted. Then the vertical moving part 22 is manually controlled to move downward. The chip at the suction port at the lower end of the negative pressure nozzle 26 comes into contact with the item on the material platform (such as the inside of a circuit board or optical device). As the vertical moving part 22 continues to move downward, the negative pressure nozzle 26 moves upward along the vertical slide 25 to avoid reaching or exceeding the pressure value required for mounting at once, which could damage the chip. At this time, the nozzle clamping block 27 applies an upward pulling force to the tension spring 30. When the negative pressure suction nozzle 26 moves upward until the sensing block 34 enters the sensing slot of the micro photoelectric sensor 37, the micro photoelectric sensor 37 sends an electrical signal to the control unit. The control unit controls the buzzer to issue an alarm indication, and the operator stops the vertical moving part from moving downward to complete the patch placement operation. Afterward, the vertical moving part is controlled to move upward, while the negative pressure suction nozzle returns to its original position downward under the action of the tension spring 30.

[0051] Specific implementation process: In the initial state, the negative pressure adsorption component is located directly above the material box. (1) Press down the operating handle 4 with your right hand. The operating handle 4 drives the horizontal rotating shaft 3 to rotate counterclockwise around its axis. The horizontal rotating shaft 3 drives the horizontal moving part 5 to rotate downward. When the horizontal moving part 5 rotates downward, the sliding roller 15 and the longitudinal slide groove 13 form relative sliding and drive the vertical moving part 22 to move downward along the vertical slide rail 17. At this time, the vertical moving part 22 drives the negative pressure adsorption component 2 to move downward synchronously to the material box 21. The negative pressure adsorption component 2 adsorbs the chip in the material box 21. At the same time, the left hand moves the item to be attached on the manual lifting slide to quickly complete the material picking and feeding. (2) Lift the operating handle 4 upward. At this time, the horizontal rotating shaft 3 rotates in the opposite direction. The horizontal rotating shaft 3 drives the horizontal moving part 5 to rotate upward to reset. The horizontal moving part 5 drives the vertical moving part 22 to move upward to reset. (3) Swing the operating handle 4 to the left. The operating handle 4 drives the first connecting rod 9 to rotate to the left in the horizontal direction. The first connecting rod 9 drives the horizontal movement through the second connecting rod 10. Component 5 slides to the left along the first horizontal slide rail 8. At this time, the horizontal moving component 5 drives the vertical moving component 22 and the negative pressure adsorption component 2 to move synchronously until the negative pressure adsorption component 2 is directly above the item 20 to be patched; (4) The angle of the chip is checked by visual inspection with a microscope. If the angle needs to be rotated, the drive motor 40 is started by stepping on the switch. The drive motor drives the negative pressure suction nozzle 26 to rotate and rotate the chip to the required angle. Then, step (1) is repeated to make the negative pressure adsorption component 2 move down and get closer to the item to be patched. Then, the negative pressure adsorption component releases the chip and makes the chip fall on the item to be patched, thus completing the patching operation; (5) When patching, the chip at the lower adsorption port of the negative pressure suction nozzle 26 is in contact with the item on the material table (such as the inside of a circuit board or optical device). As the vertical moving component 22 continues to move down, the negative pressure suction nozzle 26 will move up along the vertical slide rail 25 to avoid reaching or even exceeding the required pressure value for patching at once, which would damage the chip. At this time, the suction nozzle clamping block 27 applies an upward pulling force to the tension spring 30. When the negative pressure suction nozzle 26 moves upward until the sensing block 34 enters the sensing slot of the micro photoelectric sensor 37, the micro photoelectric sensor 37 sends an electrical signal to the control unit. The control unit controls the buzzer to issue an alarm indication, and the operator stops the vertical moving part from moving downward to complete the patch placement operation. Afterward, the vertical moving part is controlled to move upward, while the negative pressure suction nozzle returns to its original position downward under the action of the tension spring 30.

[0052] If this invention discloses or relates to mutually fixedly connected components or structural parts, then, unless otherwise stated, a fixed connection can be understood as: a detachable fixed connection (e.g., using bolts or screws), or a non-detachable fixed connection (e.g., riveting, welding). Of course, mutually fixed connections can also be replaced by an integral structure (e.g., manufactured in one piece using a casting process) (except where it is obviously impossible to use an integral molding process).

[0053] In addition, unless otherwise stated, the terms used in any of the technical solutions disclosed in this invention to indicate positional relationships or shapes include states or shapes that are similar to, close to, or approximate with those states or shapes.

[0054] Any component provided by this invention can be assembled from multiple individual components or can be a single component manufactured by a one-piece molding process.

[0055] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and not to limit them; although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications can still be made to the specific implementation of the present invention or equivalent substitutions can be made to some technical features without departing from the spirit of the technical solutions of the present invention, and all such modifications and substitutions should be covered within the scope of the technical solutions claimed in the present invention.

Claims

1. A chip mounter applicable to optical devices and optical modules, characterized in that: The device includes an operating table, a negative pressure adsorption assembly positioned above the operating table for adsorbing chips, a horizontal rotating shaft, and an operating handle for driving the horizontal rotating shaft to rotate. The horizontal rotating shaft is equipped with a horizontal moving component, which is connected to the operating handle via a linkage mechanism. The operating handle drives the horizontal moving component to move horizontally. A vertical moving component is located in front of the horizontal moving component, and its lower end slides longitudinally with the horizontal moving component. When the horizontal rotating shaft rotates, the horizontal moving component drives the vertical moving component to move vertically. The vertical moving component has a vertically penetrating vertical slide rail. The negative pressure adsorption assembly includes a negative pressure suction nozzle that slides with the vertical slide rail. A detection component connected to an alarm module is located on the upper side of the negative pressure suction nozzle. When the detection component detects the upper end of the negative pressure suction nozzle, the alarm module issues an alarm indication.

2. The chip mounter for optical devices and optical modules according to claim 1, characterized in that: The lateral moving component slides in conjunction with a lateral slide rail mounted at the bottom left end of the lateral rotating shaft; the linkage mechanism includes a first link and a second link, the rear end of the first link is hinged to the right end of the lateral rotating shaft in the horizontal direction, the front end of the first link is hinged to the right end of the second link in the horizontal direction, and the left end of the second link is hinged to the lateral moving component in the horizontal direction; the operating handle is fixedly connected to the front end of the first link.

3. A chip mounter for optical devices and optical modules according to claim 1, characterized in that: The upper front end of the lateral moving part is provided with a pair of longitudinal sliding grooves distributed on the left and right; the vertical moving part is located between the pair of longitudinal sliding grooves, and the vertical moving part slides in cooperation with the vertical slide rail located behind it. The lower left and right sides of the vertical moving part are provided with sliding rollers, and the sliding rollers are housed in the longitudinal sliding grooves and slide in cooperation with the longitudinal sliding grooves.

4. A chip mounter for optical devices and optical modules according to claim 1, characterized in that: The lower end of the vertical moving part is fixedly connected to a mounting block, and the mounting block is provided with a vertical slide rail; the upper end of the negative pressure suction nozzle is connected to a suction nozzle clamping block movably disposed on the top of the mounting block, and a connector connected to the negative pressure suction nozzle is provided above the suction nozzle clamping block. A rotating disk driven by a rotating mechanism to rotate in the horizontal direction is provided above the connector, and a vertical slot for the connector to extend into is provided at the lower end of the rotating disk; the detection component is located on the upper side of one side of the vertical slot and is used to detect the connector.

5. A chip mounter for optical devices and optical modules according to claim 4, characterized in that: The suction nozzle clamping block and the vertical moving part are connected by an elastic element that can deform vertically. The elastic element includes a pair of tension springs on the left and right sides of the suction nozzle clamping block. The tension springs are vertically arranged, and the upper and lower ends of the tension springs are respectively connected to the suction nozzle clamping block and the vertical moving part by connecting bolts.

6. A chip mounter for optical devices and optical modules according to claim 4, characterized in that: The connector includes a connecting tube with a negative pressure air tube connected to its side wall. The lower end of the connecting tube is connected to a negative pressure suction nozzle. The upper outer wall of the connecting tube is provided with a rotating block for extending into a vertical slot. On the opposite side of the rotating block, there is a sensing block to facilitate sensing by the detection component. The sensing block is fixed to the upper outer wall of the connecting tube. The detection component includes a miniature light sensor. The miniature light sensor is fixedly installed at the bottom of the rotating disk. The sensing slot of the miniature light sensor is distributed opposite to the vertical slot to facilitate the vertical extension of the sensing block.

7. A chip mounter for optical devices and optical modules according to claim 6, characterized in that: The rotating mechanism includes a pulley mechanism horizontally mounted on a vertical moving part, and the drive motor of the pulley mechanism is controlled by a foot switch; the middle part of the rotating disk is connected to the left end of the pulley mechanism, and the pulley mechanism drives the rotating disk to rotate in the horizontal direction. A positioning block is provided in the middle of the bottom surface of the rotating disk, and a vertical slot is opened in the middle of the positioning block, which runs through the radial direction of the rotating disk.

8. A chip mounter for optical devices and optical modules according to claim 4, characterized in that: The vertical slide is provided with several circumferentially distributed vertical guide members, each including a pair of guide wheels that are distributed vertically and horizontally and are used to contact the outer wall of the negative pressure suction nozzle.

9. A chip mounter for optical devices and optical modules according to claim 1, characterized in that: It also includes a manually operated lifting slide on the operating table, which is located directly below the negative pressure adsorption component. The manually operated lifting slide is used to place the items to be patched and the material box containing the chip.

10. A chip mounter for optical devices and optical modules according to claim 1, characterized in that: A microscope is provided on the front side of the negative pressure suction nozzle. A vertical bracket fixed to the operating table is provided on the left side of the microscope. A longitudinal moving slide rail is installed on the upper end of the vertical bracket. A vertical moving slide rail is installed on the sliding part of the longitudinal moving slide rail. A horizontal moving slide rail is installed on the sliding part of the vertical moving slide rail. A microscope mounting bracket is installed on the sliding part of the horizontal moving slide rail for mounting the microscope. Locking screws for locking the sliding parts are provided on the longitudinal moving slide rail, the vertical moving slide rail and the horizontal moving slide rail.

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