Component mounting system and electronic component supply method

Abstract

The component mounting system comprises: a belt-type component supply feeder, which is detachably mounted on a component mounting machine for mounting electronic components on a substrate, and a component feeding mechanism for delivering the electronic components accommodated in the belt to a supply position, and for supplying the electronic components delivered to the supply position to the component mounting machine; a storage unit for storing shape data of the electronic components; and a control unit for determining the speed of the component feeding mechanism from the time the electronic components are delivered to the supply position to the time they stop, based on the shape data of the electronic components.

Description

Technical Field

[0001] The technology disclosed in this specification relates to a component mounting system for mounting electronic components on a substrate and a method for supplying electronic components to a component mounting machine. Background Art

[0002] In a component mounting machine for mounting electronic components on a substrate, there is a structure in which a component supply feeder is detachably mounted on the component mounting machine, and electronic components are supplied from the component supply feeder. As a component supply feeder, for example, a belt-type component supply feeder is known: a plurality of electronic components are stored in a belt, and the electronic components are supplied by sending the belt to a supply position. In the belt-type component supply feeder, conditions such as the speed and acceleration of sending out the electronic components (hereinafter also referred to as supply conditions) are set so that the electronic components are supplied to the supply position at constant time intervals. Appropriate supply conditions sometimes differ depending on the type of electronic component. For example, in the belt-type component supply feeder, there is a structure in which a magnet is arranged under the belt, and for magnetic electronic components, the magnet is used to prevent the electronic components from being deviated when being sent out (for example, flying out of a cavity provided in the belt for storing electronic components). On the other hand, for electronic components that are not magnetic, it is not possible to prevent the electronic components from being deviated by magnets. Therefore, for example, in the component mounting machine disclosed in Japanese Patent Application Laid-Open No. 2019-096664, whether the electronic component is magnetic is determined, and when supplying non-magnetic electronic components, the supply conditions are changed to slow down the delivery speed. As a result, even non-magnetic electronic components are less likely to be offset during supply. Summary of the Invention

[0003] Problems to be solved by the invention

[0004] In the component mounting machine described in Japanese Patent Application Laid-Open No. 2019-096664, the feeding conditions are modified to slow the speed at which electronic components are fed, depending on whether or not the components are magnetic. However, the deflection of electronic components during feeding is affected not only by the magnetic nature of the components but also by their shape. Determining which shapes of electronic components are most likely to deflect during feeding depends on the operator's experience and skills.

[0005] This specification discloses a technology for facilitating normal supply of electronic components from a component supply feeder.

[0006] Technical solutions to problems

[0007] The component mounting system disclosed in this specification comprises: a belt-type component supply feeder, which is detachably mounted on a component mounting machine for mounting electronic components on a substrate, and has a component feeding mechanism for delivering electronic components accommodated in the belt to a supply position, and supplies the electronic components delivered to the supply position to the component mounting machine; a storage unit for storing shape data of the electronic components; and a control unit for determining the speed of the component feeding mechanism from the time the electronic components are delivered to the supply position to the time they stop, based on the shape data of the electronic components.

[0008] In addition, the component mounting system disclosed in this specification includes: a belt-type component supply feeder, which is detachably mounted on a component mounting machine that mounts electronic components on a substrate, and has a component feeding mechanism that delivers the electronic components accommodated in the belt to the supply position, and supplies the electronic components delivered to the supply position to the component mounting machine; a storage unit that stores shape data of the electronic components; and a control unit that determines the acceleration of the component feeding mechanism from the time the electronic components are delivered to the supply position to the time they stop, based on the shape data of the electronic components.

[0009] In the component mounting system described above, the speed or acceleration of the component feed mechanism when delivering the electronic component to the supply position is determined based on the electronic component's shape data. This allows the speed or acceleration of the electronic component to be determined in accordance with its shape, preventing deviation during the supply of the electronic component. Consequently, the electronic component can be appropriately supplied in accordance with its shape.

[0010] In addition, the supply method disclosed in this specification is a method for supplying electronic components from a belt-type component supply feeder to a supply position. The belt-type component supply feeder is installed in a detachable manner on a component mounting machine that mounts electronic components on a substrate, and electronic components contained in the belt are delivered to the component mounting machine. The supply method includes the following steps: a determination step, which determines the speed from the time the electronic component is delivered to the supply position to the time it stops based on the shape data of the electronic component being supplied; and a supply step, which supplies the electronic component based on the speed determined in the determination step.

[0011] In addition, the supply method disclosed in this specification is a method for supplying electronic components from a belt-type component supply feeder to a supply position. The belt-type component supply feeder is installed in a detachable manner on a component mounting machine that mounts electronic components on a substrate, and electronic components contained in the belt are delivered to the component mounting machine. The supply method includes the following steps: a determination step, which determines the acceleration from the time the electronic component is delivered to the supply position to the time it stops based on the shape data of the supplied electronic component; and a supply step, which supplies the electronic component based on the acceleration determined in the determination step.

[0012] In the supply method, the speed or acceleration of the electronic component when it is fed to the supply position is determined based on the shape data of the electronic component. Therefore, the same effects as those of the component supply system can be achieved. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a diagram showing a schematic configuration of a component mounting line included in the component mounting system according to the embodiment.

[0014] Figure 2 This is a diagram showing a schematic configuration of a component mounting machine.

[0015] Figure 3 yes Figure 2 Cross-sectional view at line III-III in FIG.

[0016] Figure 4 This is a diagram showing a schematic structure of a component supply feeder.

[0017] Figure 5 This is a block diagram showing a control system of a component mounting machine.

[0018] Figure 6 1 is an example of a schematic diagram showing an electronic component having pins, (a) is a top view of the electronic component, and (b) is a side view showing a state where the electronic component is housed in a base tape.

[0019] Figure 7 This is an example of a schematic diagram showing a thin electronic component, and shows a state in which the electronic component is displaced from a cavity provided in a base tape.

[0020] Figure 8 This is a flowchart showing an example of a process for setting tape supply conditions when the tape feed mechanism supplies electronic components. DETAILED DESCRIPTION

[0021] The main features of the embodiments described below are listed. In addition, the technical elements described below are independent technical elements that can demonstrate technical usefulness alone or in various combinations, and are not limited to the combinations described in the claims at the time of application.

[0022] In the component mounting system disclosed in this specification, it is also possible that, among the electronic components being supplied, when the shape data of the electronic components stored in the storage unit have specific characteristics, the control unit determines the speed or acceleration of the electronic components from the time they are sent to the supply position to the time they stop in a manner that is lower than the speed or acceleration of other electronic components that do not have the specific characteristics from the time they are sent to the supply position to the time they stop. According to such a structure, the speed or acceleration when supplying the electronic components becomes smaller for components with a shape that has specific characteristics. Thus, for example, for electronic components with a shape that has specific characteristics that are easy to move when supplied, the speed or acceleration when supplying becomes smaller, and on the other hand, for components with a shape that does not have specific characteristics, the speed or acceleration when supplying does not become smaller. Therefore, the electronic components can be appropriately supplied according to the shape of the electronic components.

[0023] The component mounting system disclosed in this specification may also include a suction nozzle that adsorbs electronic components at a supply position. The control unit may also determine whether the shape data of the electronic component stored in the storage unit has specific characteristics when the suction nozzle adsorbs the same type of electronic component multiple times and the adsorption rate is lower than a predetermined value. According to such a structure, the control unit determines whether the shape data has specific characteristics for electronic components with a low adsorption rate. Thus, for electronic components with a low adsorption rate, the reason for the low adsorption rate (the shape data has specific characteristics) can be determined by determining whether its shape data has specific characteristics, and the adsorption rate of the electronic component can be improved.

[0024] The component mounting system disclosed in this specification may further include a reporting unit that reports that the speed or acceleration has been reduced. With this configuration, the operator can be notified that the absolute value of the acceleration has decreased when the electronic component is delivered to the supply position and then stopped.

[0025] In the component mounting system disclosed in this specification, a specific feature may be that, when viewed from above, the electronic component includes leads extending from a main body of the electronic component. With this configuration, the absolute value of the acceleration of an electronic component that has a shape susceptible to displacement during supply can be reduced when the component stops at a supply position.

[0026] In the component mounting system disclosed in this specification, a specific feature may be that the thickness of the electronic component is less than or equal to a predetermined thickness. With such a structure, the absolute value of the acceleration when the electronic component stops at the supply position can be reduced for electronic components having a shape that is easily deflected during supply.

[0027] Example

[0028] The component mounting system 1 according to the embodiment will be described with reference to the accompanying drawings. Figure 1 As shown, the component mounting system 1 includes a component mounting machine 10 and a management device 8 .

[0029] The component mounting machine 10 is connected to the management device 8 in a communicative manner. The management device 8 is connected to the plurality of component mounting machines 10 in a communicative manner and manages the plurality of component mounting machines 10. The management device 8 and the plurality of component mounting machines 10 constitute a component mounting line 100. The management device 8 is constructed using a computer having a CPU and a storage device. The management device 8 controls the entire component mounting line 100 by controlling the operation of each component mounting machine 10. That is, the management device 8 determines the type and position of the electronic component 4 to be mounted on the circuit substrate 2 by each component mounting machine 10 among the plurality of component mounting machines 10, and instructs the component mounting machine 10 on these. The component mounting machine 10 operates based on the instructions of the management device 8, thereby mounting the required electronic component 4 on the circuit substrate 2.

[0030] The component mounting machine 10 mounts the electronic component 4 on the circuit substrate 2. The circuit substrate 2 is transported from one end to the other end of the component mounting line 100. In each component mounting machine 10, a predetermined electronic component 4 is mounted on the circuit substrate 2. The circuit substrate 2 transported to the other end of the component mounting line 100 is shipped as a final product or transported to a subsequent process as a semi-finished product. A plurality of component supply feeders 30 can be provided in the component mounting machine 10. By providing the component supply feeder 30 in the component mounting machine 10, the electronic component 4 is supplied from the component supply feeder 30 to the component mounting machine 10. In addition, the component supply feeder 30 can be provided in any one of the plurality of component mounting machines 10 in the component mounting line 100. Which type of component supply feeder 30 is provided in the component mounting machine 10 is determined by the management device 8.

[0031] like Figure 2 and Figure 3 As shown, the component mounting machine 10 includes a plurality of component supply feeders 30, a feeder holder 14, a mounting head 16, a head moving device 18, a substrate conveyor 20, a touch panel 24, and a control device 26. Each component supply feeder 30 accommodates a plurality of electronic components 4. The component supply feeders 30 are detachably mounted on the feeder holder 14 and supply electronic components 4 to the mounting head 16. The specific structure of the component supply feeders 30 will be described in detail later.

[0032] The feeder holding portion 14 has a plurality of slots, and a component supply feeder 30 can be detachably arranged in each of the plurality of slots. The feeder holding portion 14 can be fixed to the component mounting machine 10 or can be detachably mounted relative to the component mounting machine 10. The mounting head 16 detachably holds one or more suction nozzles 6, picks up the electronic component 4 supplied by the component supply feeder 30 using the suction nozzle 6, and mounts the electronic component 4 on the circuit substrate 2. At this time, the head moving device 18 moves the mounting head 16 relative to the component supply feeder 30 and the circuit substrate 2. Thus, the electronic component 4 is picked up from a specific component supply feeder 30 among the plurality of component supply feeders 30, and the electronic component 4 is mounted to a predetermined position on the circuit substrate 2. The substrate conveyor 20 carries out the loading, supporting, and unloading of the circuit substrate 2. The touch panel 24 is a display device that provides the operator with various information of the component mounting machine 10, and is an input device that receives instructions and information from the operator. The control device 26 is configured using a computer having a CPU and a storage device. The control device 26 controls the operation of each unit of the component mounting machine 10 based on the production program transmitted from the management device 8 .

[0033] Reference Figure 4 , the component supply feeder 30 will be described. Figure 4 As shown, the component supply feeder 30 includes a housing 32 , a tape reel 34 , a tape reel support portion 36 , and a tape delivery mechanism 38 .

[0034] A long tape 40 containing a plurality of electronic components 4 at regular intervals is wound around the tape reel 34. The tape 40 comprises a base tape 42 and a cover tape 44, with the electronic components 4 being stored between the base tape 42 and the cover tape 44. An opening 34a is provided in the center of the tape reel 34. The opening 34a is larger than the radial dimension of a reel support portion 36, described later. The reel support portion 36 is inserted into and engaged with the opening 34a, thereby placing the tape reel 34 in the component feeder 30. The tape reel 34 can be replaced with respect to the component feeder 30.

[0035] The reel support portion 36 has a cylindrical shape, and one end of the reel support portion 36 is attached to the housing 32. The reel support portion 36 rotatably supports the reel 34.

[0036] The tape delivery mechanism 38 delivers the tape 40 wound on the tape reel 34 supported by the reel support portion 36 from the reel 34 in a constant amount. The delivery amount of the tape 40 by the tape delivery mechanism 38 is set according to the interval between the electronic components 4 stored in the tape 40. The delivered tape 40 is located at a predetermined pickup position (i.e., supply position) A (see Figure 2) is peeled off from the position on the side of the reel 34. When the cover tape 44 is peeled off, the electronic components 4 stored in the tape 40 are exposed and picked up by the mounting head 16 at the pickup position A. The peeled cover tape 44 is transported to the discard position by the cover tape conveying mechanism (not shown). The speed and acceleration and other conditions (hereinafter also referred to as the supply conditions of the tape 40) at which the tape 40 (i.e., the electronic components 4 stored in the tape 40) are fed out by the tape feeding mechanism 38 can be changed according to the type of electronic components 4 stored in the tape 40. The setting of the supply conditions of the tape 40 will be described in detail later.

[0037] like Figure 5 As shown, the control device 26 is connected to the component supply feeder 30, the mounting head 16, the head moving device 18, the substrate conveyor 20, and the touch panel 24, and controls each part of the component supply feeder 30, the mounting head 16, the head moving device 18, the substrate conveyor 20, and the touch panel 24. The control device 26 also controls the tape delivery mechanism 38 provided in the component supply feeder 30. Alternatively, the tape delivery mechanism 38 may be controlled by a control unit (not shown) of the component supply feeder 30.

[0038] In addition, the control device 26 includes a storage unit 50 and a supply condition setting unit 52. The storage unit 50 stores shape data of each electronic component 4. The shape data is stored in the management device 8, and the control device 26 obtains the shape data from the management device 8 and stores the obtained shape data in the storage unit 50. The shape data includes, for example, information related to the outer shape of the electronic component 4 and information related to the components of the electronic component 4. The information related to the outer shape of the electronic component 4 includes, for example, the shape when viewed from above (for example, a rectangle, etc.), the presence of pins, the presence of bumps, the thickness of the electronic component 4, etc. The information related to the components of the electronic component 4 includes, for example, the position of the pins when the pins are provided (for example, the configuration position of the pins relative to the center of the electronic component 4, etc.), the number of the pins, etc.

[0039] The supply condition setting unit 52 sets the supply condition of the tape 40 when supplying the electronic component 4 for each electronic component 4 based on the shape data of the electronic component 4. That is, the control device 26 functions as the supply condition setting unit 52 by executing the program stored in the storage unit 50. The tape feeding mechanism 38 feeds the tape 40 by a predetermined amount and positions the electronic component 4 at the pickup position A (see FIG. 1 ). Figure 2 ) stops the tape 40. When the tape 40 is fed out under the same supply conditions as other electronic components 4, depending on the type of electronic component 4, the electronic component 4 may shift from the predetermined position on the base tape 42 when it stops at the pickup position A. One reason for the electronic component 4 shifting when it stops is the shape of the electronic component 4. For example, Figure 6 (a) and Figure 6(b) shows an electronic component 4a having pins 5 such as a 2-pin diode, Figure 7 The thin electronic components 4b such as the BGA (Ball Grid Array) shown in the figure have a shape that is easily displaced when stopped at the pickup position A. Figure 7 In FIG, the bumps included in the electronic component 4b are omitted from illustration.

[0040] like Figure 6 As shown in (a), the electronic component 4a whose pins 5 extend in a direction (i.e., X direction) perpendicular to and horizontal to the conveying direction (i.e., Y direction) is more likely to be offset in the conveying direction (i.e., Y direction) where the pins 5 are not provided than in the direction (i.e., X direction) in which the pins 5 extend. In addition, as described above, the electronic component 4 is stored between the base tape 42 and the cover tape 44, and more specifically, is stored in a cavity provided in the base tape 42. Figure 6 As shown in (b), in the cavity 60a provided on the base tape 42a, the first portion 62a provided at the position supporting the pins 5 is sometimes higher than the second portion 64a between the first portion 62a. In such a case, the electronic component 4a is supported only by the pins 5 (i.e., only the portion of the pins 5 is in contact with the base tape 42a). When the electronic component 4a stops at the pickup position A, it is easy to move in the direction of inertial force, i.e., in the conveying direction (in the direction of the pick-up position). Figure 6 Therefore, when the electronic component 4a is fed, if the same feeding conditions as those for the tape 40 storing other electronic components 4 (for example, electronic components 4 without leads 5) are applied, the electronic component 4a is more likely to be misaligned than the other electronic components 4.

[0041] In addition, if Figure 7 As shown in FIG. 1 , the depth dimension of the cavity 60b provided in the base tape 42b is also reduced in the thin electronic component 4b. Therefore, when feeding the electronic component 4b, if the same feeding conditions as those for the tape 40 storing other electronic components 4 (e.g., electronic components 4 other than BGAs) are applied, the electronic component 4b is more likely to shift than the other electronic components 4.

[0042] Furthermore, in the component supply feeder 30, a magnet (not shown) is disposed below the belt 40 near the pickup position A. The magnet prevents the magnetic electronic components 4 from shifting at the pickup position A. However, the electronic components 4a and 4b may not obtain a magnetic attraction force appropriate for their mass, and the magnet may not be able to prevent them from shifting at the pickup position A.

[0043] The supply condition setting unit 52 determines whether the electronic component 4 has specific features that are prone to displacement (e.g., leads 5 extending in the X direction or a thin BGA) based on the shape data of the electronic component 4 stored in the storage unit 50. Based on the determination result, the supply condition setting unit 52 changes the supply condition of the belt 40 that holds the electronic component 4. Specifically, if the shape data of the electronic component 4 includes the specific features, the supply condition setting unit 52 changes the supply condition of the belt 40 to reduce the speed or acceleration during the feeding of the belt 40 (i.e., the period from the start of the belt 40's movement to the stop at the pickup position A). Examples of supply conditions for the belt 40 that reduce the speed or acceleration during the feeding of the belt 40 include reducing the deceleration time Δt when stopping without changing the speed v of the belt 40, reducing the speed v of the belt 40 without changing the deceleration time Δt when stopping, and reducing both the speed v and the deceleration time Δt when stopping.

[0044] Reference Figure 8 , the process of setting the supply conditions of the tape 40 when the electronic components 4 are supplied by the tape delivery mechanism 38 will be described. Figure 8 As shown, first, the supply condition setting unit 52 (i.e., the control device 26) determines whether the adsorption rate of the supplied electronic component 4 to the suction nozzle 6 is below the predetermined value (step S12). When the electronic component 4 is offset at the pick-up position A, the electronic component 4 cannot be adsorbed by the suction nozzle 6. Therefore, the adsorption rate of the electronic component 4 with a shape that is easily offset when it stops at the pick-up position A to the suction nozzle 6 is lower than that of other electronic components 4. In this embodiment, the predetermined value is set to 99.7%, but it is not particularly limited. The predetermined value can be set to be lower than the adsorption rate of other electronic components 4 with a shape that is not easily offset when it stops at the pick-up position A to the suction nozzle 6. When the adsorption rate of the electronic component 4 to the suction nozzle 6 is greater than the predetermined value ("No" in step S12), the adsorption rate of the electronic component 4 to the suction nozzle 6 is sufficiently high, so there is no need to change the current supply conditions of the belt 40. Therefore, the supply condition setting unit 52 ends the processing without changing the supply conditions of the belt 40.

[0045] When the adsorption rate of the electronic component 4 to the suction nozzle 6 is less than a predetermined value ("Yes" in step S12), the supply condition setting unit 52 determines whether the shape data of the electronic component 4 stored in the storage unit 50 includes a feature such as having a pin (S14). When the shape data includes a feature such as having a pin ("Yes" in step S14), the supply condition setting unit 52 determines whether the shape data includes a feature such as the pin extending along the X direction (i.e., a direction perpendicular to and horizontal to the direction of being supplied) (S16). As described above, the electronic component 4a whose pin 5 extends along the X direction is prone to deviation in the conveying direction (i.e., the Y direction) when it stops at the pickup position A (refer to Figure 6 (a) and Figure 6 (b)). Therefore, if the shape data includes the feature that the pins extend in the X direction ("YES" in step S16), the supply condition setting unit 52 changes the supply conditions of the tape 40 (S18). Specifically, the supply condition setting unit 52 changes the supply conditions of the tape 40 so as to reduce the speed or acceleration when feeding the tape 40.

[0046] On the other hand, when the shape data does not include a feature that the pins extend along the X direction ("No" in step S16), the supply condition setting unit 52 determines that although the electronic component 4 has pins, it is not configured so that the pins are easily offset when it stops at the pickup position A. That is, the supply condition setting unit 52 determines that the adsorption rate of the electronic component 4 to the suction nozzle 6 is lowered due to a reason different from the reason envisaged in the present embodiment (the reason caused by the shape of the electronic component 4). In addition, the control device 26 notifies the operator that the adsorption rate of the electronic component 4 to the suction nozzle 6 is lower (S26). Specifically, the control device 26 displays the fact that the adsorption rate of the electronic component 4 to the suction nozzle 6 is lower on the touch panel 24. At this time, the control device 26 may also report that the reason for the lower adsorption rate of the electronic component 4 to the suction nozzle 6 cannot be determined (the reason is unknown).

[0047] If the shape data does not include the feature of having pins ("No" in step S14), the supply condition setting unit 52 determines whether the shape data of the electronic component 4 stored in the storage unit 50 includes the feature of having bumps (S22). As described above, the electronic component 4b (i.e., BGA) with bumps is often thin and is prone to displacement in the conveying direction (i.e., Y direction) when it stops at the pickup position A (see FIG. Figure 7 ). Therefore, when the shape data includes a feature such as having a bump ("Yes" in step S22), the supply condition setting unit 52 determines whether the shape data includes a feature that the thickness of the electronic component 4 is less than a predetermined value (S24). In the present embodiment, the predetermined value is 0.5 mm, but is not particularly limited. A value indicating that the thickness of the electronic component 4 is thinner can be set, and can be appropriately selected based on the size of the electronic component 4, etc. When the thickness of the electronic component 4 is less than the predetermined value ("Yes" in step S24), the supply condition setting unit 52 changes the supply condition of the belt 40 in such a way that the speed or acceleration when the belt 40 is fed out is reduced (S18).

[0048] When the supply conditions of the tape 40 are changed, the control device 26 notifies the operator of the change in the supply conditions of the tape 40 (S20). Specifically, the control device 26 displays the change in the supply conditions of the tape 40 (specifically, the change in the supply conditions of the tape 40 to reduce the speed or acceleration when feeding the tape 40) on the touch panel 24. At this time, the control device 26 may also notify the operator that the supply conditions of the tape 40 have been changed because the electronic component 4 has a shape that easily causes it to deviate when it stops at the pickup position A.

[0049] On the other hand, if the thickness of the electronic component 4 is not less than the predetermined value ("No" in step S24), the supply condition setting unit 52 determines that, although the electronic component 4 is a BGA, it is sufficiently thick that it is unlikely to shift when stopped at the pickup position A due to the thickness of the electronic component 4. Furthermore, if the shape data does not include a feature such as having a bump ("No" in step S22), the supply condition setting unit 52 determines that the electronic component 4 has neither a pin shape nor a bump shape. In other words, in either case, the control device 26 determines that the suction rate of the electronic component 4 to the suction nozzle 6 has decreased due to a reason different from the reason envisioned in this embodiment (the reason caused by the shape of the electronic component 4). Furthermore, the control device 26 notifies the operator of the low suction rate of the electronic component 4 to the suction nozzle 6 (S28). The processing of step S28 is the same as that of step S26 above, and therefore a detailed description thereof will be omitted.

[0050] In addition, in this embodiment, as examples of the shape of the electronic component 4 that is prone to displacement when stopping at the pickup position A, a shape in which the pins extend in a direction perpendicular to and horizontal to the conveying direction (i.e., the X direction) and a thin shape are listed, but the present invention is not limited thereto. As long as it is a shape that is predicted to be prone to displacement when stopping at the pickup position A, a shape other than the above-mentioned shape may be used. In addition, regarding the example of the shape of the electronic component 4 with pins that is prone to displacement when stopping at the pickup position A, the shape is not limited to a shape in which the pins extend in a direction perpendicular to and horizontal to the conveying direction (i.e., the X direction). For example, a shape in which the pins extend in the conveying direction (i.e., the Y direction) may also be used.

[0051] In addition, in this embodiment, the storage unit 50 and the supply condition setting unit 52 are provided in the control device 26 of the component mounting machine 10, but this configuration is not limited thereto. The storage unit 50 and the supply condition setting unit 52 may also be provided in the management device 8 or the component supply feeder 30. Furthermore, the storage unit 50 and the supply condition setting unit 52 may be provided in any one of the management device 8, the component mounting machine 10, and the component supply feeder 30, and may not be provided in the same device but in different devices.

[0052] The following describes points to note regarding the component mounting system 1 described in the embodiment. The tape delivery mechanism 38 of the embodiment is an example of a "component feeding mechanism," the control device 26 is an example of a "control unit," the suction nozzle 6 is an example of a "suction nozzle," and the touch panel 24 is an example of a "reporting unit."

[0053] While specific examples of the technology disclosed in this specification have been described in detail above, these are merely examples and do not limit the scope of the claims. The technology described in the claims includes technologies resulting from various modifications and alterations to the specific examples exemplified above. Furthermore, the technical elements described in this specification or the accompanying drawings may exhibit technical usefulness individually or in various combinations, and are not limited to the combinations described in the claims at the time of filing. Furthermore, the technology exemplified in this specification or the accompanying drawings may achieve multiple objectives simultaneously, and achieving one of these objectives alone may be technically useful.

Claims

1. A component mounting system comprising: A belt-type component supply feeder is detachably mounted on a component mounting machine for mounting electronic components on a substrate, and includes a component feeding mechanism for delivering the electronic components stored in the belt to a supply position, and supplies the electronic components delivered to the supply position to the component mounting machine; a storage unit for storing shape data of the electronic component; and The control unit determines the speed of the component feeding mechanism from the time the electronic component is fed to the supply position to the time the electronic component stops, based on the shape data of the electronic component. Among the electronic components being supplied, when the shape data of the electronic component stored in the storage unit has specific characteristics, the control unit determines the speed from the time the electronic component is sent to the supply position to the time it stops in a manner that is lower than the speed from the time other electronic components that do not have the specific characteristics are sent to the supply position to the time they stop.

2. The component mounting system according to claim 1, wherein: The component mounting system further includes a suction nozzle that sucks the electronic component at the supply position. When a suction rate when the suction nozzle suctions the same type of electronic component multiple times is lower than a predetermined value, the control unit determines whether the shape data of the electronic component stored in the storage unit has the specific feature.

3. The component mounting system according to claim 1, wherein: The component mounting system further includes a reporting unit configured to report that the control unit has decided to reduce the speed.

4. The component mounting system according to claim 2, wherein: The component mounting system further includes a reporting unit configured to report that the control unit has decided to reduce the speed.

5. The component mounting system according to any one of claims 1 to 4, wherein: The specific feature is that the electronic component includes leads extending from a main body of the electronic component when viewed from above.

6. The component mounting system according to any one of claims 1 to 4, wherein: The specific feature is that the thickness of the electronic component is equal to or smaller than a predetermined thickness.

7. A component mounting system comprising: A belt-type component supply feeder is detachably mounted on a component mounting machine for mounting electronic components on a substrate, and includes a component feeding mechanism for delivering the electronic components stored in the belt to a supply position, and supplies the electronic components delivered to the supply position to the component mounting machine; a storage unit for storing shape data of the electronic component; and The control unit determines the acceleration of the component feeding mechanism from the time the electronic component is fed to the supply position to the time the electronic component stops, based on the shape data of the electronic component. Among the supplied electronic components, when the shape data of the electronic component stored in the storage unit has specific characteristics, the control unit determines the acceleration from the time the electronic component is sent to the supply position to the time it stops in a manner that is smaller than the acceleration from the time other electronic components that do not have the specific characteristics are sent to the supply position to the time they stop.

8. A method for supplying electronic components from a tape-type component feeder to a supply position, wherein the tape-type component feeder is detachably mounted on a component mounting machine for mounting the electronic components on a substrate, and the electronic components stored in the tape are fed out to the component mounting machine. The supply method comprises the following steps: a determining step of determining, based on shape data of the supplied electronic component, a speed from the time the electronic component is fed to the supply position until it stops, and, when the shape data of the supplied electronic component has a specific feature, determining the speed from the time the electronic component is fed to the supply position until it stops in a manner that is reduced compared to a speed from the time another electronic component not having the specific feature is fed to the supply position until it stops; and The supplying step supplies the electronic components based on the speed determined in the determining step.

9. A method for supplying electronic components from a tape-type component feeder to a supply position, wherein the tape-type component feeder is detachably mounted on a component mounting machine for mounting the electronic components on a substrate, and the electronic components stored in the tape are fed out to the component mounting machine. The supply method comprises the following steps: a determining step of determining, based on shape data of the supplied electronic component, an acceleration from the time the electronic component is delivered to the supply position until it stops, and, when the shape data of the supplied electronic component has a specific feature, determining the acceleration from the time the electronic component is delivered to the supply position until it stops in a manner that is smaller than the acceleration from the time another electronic component not having the specific feature is delivered to the supply position until it stops; and The supplying step supplies the electronic component based on the acceleration determined in the determining step.

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