A semiconductor system integrated circuit package module

Abstract

The application belongs to the technical field of semiconductor packaging, and discloses a semiconductor system integrated circuit packaging module, which comprises an organic plate, a shell fixedly installed on the top of the organic plate, a bottom block fixedly installed on the top of the organic plate, and chips installed on the top of the bottom block, wherein the number of the chips is three. The application is provided with chips, heat-conducting adhesive, copper heat-conducting plates, isolation plates and supporting balls. The heat and conductivity between adjacent two chips are blocked by the isolation plates, so as to avoid mutual influence. The heat emitted by the chips is transmitted to the copper heat-conducting plates under the good heat-conducting effect of the heat-conducting adhesive, and is transmitted outward by the copper heat-conducting plates in a heat-conducting mode. Due to the design of the supporting balls, there is a certain space gap between the copper heat-conducting plates and the isolation plates. The contact area between the copper heat-conducting plates and the isolation plates is reduced through the gap, and the heat dissipation efficiency is improved.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor packaging technology, specifically a semiconductor system integrated circuit packaging module. Background Technology

[0002] Semiconductor packaging technology can effectively protect chips, ensuring a stable operating environment. However, traditional packaging technologies typically only package single semiconductor chips. As technology advances, the functional requirements of chips become increasingly demanding, and single chips can no longer meet these needs. This has led to the development of multi-chip packaging technology. Current multi-chip packaging technologies are usually stacked, which, while maximizing space savings, suffers from poor heat dissipation due to the stacking process. Therefore, improvements and optimizations are needed. Summary of the Invention

[0003] The purpose of this invention is to provide a semiconductor system integrated circuit packaging module to solve the problems mentioned in the background art.

[0004] To achieve the above objectives, the present invention provides the following technical solution: a semiconductor system integrated circuit packaging module, comprising an organic board, a shell fixedly mounted on the top of the organic board, a base block fixedly mounted on the top of the organic board, and a chip mounted on the top of the base block. The number of chips is three, and the three chips are staggered left and right. A copper heat-conducting plate is fixedly mounted between every two chips. A copper heat-conducting plate is fixedly mounted at the bottom of each chip. A thermally conductive adhesive is coated on the top of the copper heat-conducting plate at the bottom of the chip. The copper heat-conducting plate and an isolation plate are fixedly connected by a support ball. Pins are fixedly soldered between the chip and the isolation plate. A first transfer plate is fixedly mounted on the top of the organic board. The bottommost chip is soldered to the first transfer plate through the isolation plate. Adjacent isolation plates and the bottommost chip are connected to the first transfer plate by connecting blocks.

[0005] The heat and conductivity between two adjacent chips are blocked by the isolation plate to avoid mutual interference. During normal operation, the heat emitted by the chip will be transferred to the copper heat-conducting plate by the good thermal conductivity of the thermal adhesive. The copper heat-conducting plate will then transfer the heat outward by heat conduction. Due to the design of the support ball, there is a certain space gap between the copper heat-conducting plate and the isolation plate. The gap reduces the contact area between the copper heat-conducting plate and the isolation plate and improves the heat dissipation efficiency.

[0006] By staggering the chips on the left and right, the overlapping area between adjacent chips is reduced, thereby reducing heat accumulation. Compared with traditional devices, this device uses staggered stacking to arrange chips, which reduces the overlapping area between adjacent chips, saves installation space, achieves better heat dissipation, and exposes more area, making it easier for staff to observe and maintain the outer surface of the chips.

[0007] By using multiple isolation plates, the pin length between the chip and the isolation plate is shortened. Compared with traditional devices, this device isolates and supports multiple stacked chips by setting multiple isolation plates, while greatly reducing the pin length and avoiding tangling and crossing of pins during the pin length process, thus improving the stability of chip operation.

[0008] Preferably, a second transfer plate, a third transfer plate, and a fourth transfer plate are fixedly installed inside the organic board. The first, second, third, and fourth transfer plates are connected in sequence. Solder balls are fixedly installed at the bottom of the organic board, and the fourth transfer plate is fixedly connected to the solder balls. Through the design of the second, third, and fourth transfer plates and the solder balls, the electrical frequency signals of the chip are transmitted downward to the circuit board, realizing information transmission. Soldering is performed by soldering, which greatly saves installation space.

[0009] Preferably, a fixing block is fixedly installed on the top of the organic board, and heat dissipation holes are opened on the surface of the fixing block. The inner side of the fixing block is fixedly connected to the isolation plate. Due to the design of the fixing block, the cooperation between the fixing block and the isolation plate plays a certain role in limiting the overall position of the internal chip, thereby limiting the installation space of the chip and avoiding the installation position deviation during installation.

[0010] Preferably, heat dissipation blocks are fixedly installed on both sides of the top of the fixing block, and the heat dissipation blocks are connected to several copper heat-conducting plates through heat conduction plates; due to the design of the heat conduction plates, the heat absorbed by the copper heat-conducting plates is conducted to the heat dissipation blocks through the heat conduction plates, and then the heat is released to the outside through the heat dissipation blocks to avoid the internal temperature from being too high.

[0011] Preferably, the bottom end of the fourth transfer plate is provided with a groove, which divides the bottom end of the fourth transfer plate into multiple small squares. Due to the design of the groove, the contact area between the fourth transfer plate and the air is increased, thereby playing a certain role in heat dissipation.

[0012] Preferably, the thickness of the isolation plate is 1.5μm to 2μm. The two chips are connected by an isolation plate, two layers of support balls, two layers of copper heat-conducting plates, and two layers of thermally conductive adhesive. The spacing between the two chips is 5μm to 6.5μm. Due to the design of the thermally conductive adhesive, copper heat-conducting plates, isolation plate, and support balls, the difference from traditional isolation plates is that the thickness can be reduced to the maximum extent while achieving good heat dissipation.

[0013] Preferably, the interior of the outer casing is filled with a filler material, which is specifically filled in the gap between the bottom chip and the organic board. The filler material is a liquid encapsulant formed by adding silica particles to epoxy resin, which can disperse the heat at the solder joint and prevent the heat from concentrating at the solder joint and causing melting.

[0014] Preferably, there are two heat sinks, and each heat sink has a heat dissipation groove inside. Due to the design of the heat sink, the heat dissipation groove allows for a larger contact area between the heat sink and the heat transfer resin, thereby improving the heat dissipation effect of the device.

[0015] The beneficial effects of this invention are as follows:

[0016] 1. This invention comprises a chip, a thermally conductive adhesive, a copper heat-conducting plate, an isolation plate, and a support ball. The isolation plate blocks heat and conductivity between two adjacent chips, preventing mutual interference. During normal operation, the heat emitted by the chip is transferred to the copper heat-conducting plate through the excellent thermal conductivity of the thermally conductive adhesive. The heat is then transferred outward through the copper heat-conducting plate via thermal conduction. Due to the design of the support ball, there is a certain space gap between the copper heat-conducting plate and the isolation plate. This gap reduces the contact area between the copper heat-conducting plate and the isolation plate, thereby improving heat dissipation efficiency.

[0017] 2. This invention reduces the superposition area between adjacent chips by staggering the chips on the left and right sides, thereby reducing heat accumulation. Compared with traditional devices, this device uses staggered stacking to arrange chips, which reduces the superposition area between adjacent chips, saves installation space, achieves better heat dissipation, and exposes more area, making it easier for staff to observe and maintain the outer surface of the chips.

[0018] 3. By setting up isolation plates and pins, the design of multiple isolation plates makes the pin length between the chip and the isolation plate shorter. Compared with traditional devices, this device isolates multiple stacked chips while supporting them by setting up multiple isolation plates, and at the same time greatly reduces the pin length, avoids the situation of pin entanglement and crossover during the pin length process, and improves the stability of chip operation. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the structure of the present invention;

[0020] Figure 2 This is a cross-sectional view of the front of the present invention;

[0021] Figure 3 For the present invention Figure 2 A magnified schematic diagram of the partial structure at point A in the middle;

[0022] Figure 4 This is a schematic cross-sectional view of the side of the present invention;

[0023] Figure 5 This is a schematic diagram of the structure of the solder ball of the present invention;

[0024] Figure 6 This is a top view of the structure of the present invention;

[0025] Figure 7 This is a schematic diagram of the groove structure of the present invention;

[0026] Figure 8 This is a schematic diagram of the structure of the fixing block of the present invention.

[0027] In the diagram: 1. Organic board; 2. Shell; 3. Base block; 4. Chip; 5. Thermally conductive adhesive; 6. Copper thermally conductive plate; 7. Isolation plate; 8. Support ball; 9. Pin; 10. First transfer plate; 11. Second transfer plate; 12. Third transfer plate; 13. Fourth transfer plate; 14. Solder ball; 15. Connecting block; 16. Fixing block; 17. Heat sink; 18. Heat conduction plate; 19. Heat dissipation hole; 20. Groove. Detailed Implementation

[0028] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0029] like Figures 1 to 8As shown, this embodiment of the invention provides a semiconductor system integrated circuit packaging module, including an organic board 1, a shell 2 fixedly mounted on the top of the organic board 1, a base block 3 fixedly mounted on the top of the organic board 1, and a chip 4 mounted on the top of the base block 3. There are three chips 4, which are staggered from left to right. A copper heat-conducting plate 6 is fixedly mounted between every two chips 4. A copper heat-conducting plate 6 is fixedly mounted at the bottom of the chip 4. The top of the copper heat-conducting plate 6 is coated with a thermally conductive adhesive 5 located at the bottom of the chip 4. The copper heat-conducting plate 6 and the isolation plate 7 are fixedly connected by a support ball 8. A pin 9 is fixedly soldered between the chip 4 and the isolation plate 7. A first transfer plate 10 is fixedly mounted on the top of the organic board 1. The bottommost chip 4 is soldered to the first transfer plate 10 through the isolation plate 7. Adjacent isolation plates 7 and the bottommost chip 4 and the first transfer plate 10 are connected by a connecting block 15.

[0030] Among them, the heat and conductivity between two adjacent chips 4 are blocked by the isolation plate 7 to avoid mutual interference. During normal operation, the heat emitted by the chip 4 will be transferred to the copper heat-conducting plate 6 under the good thermal conductivity of the thermally conductive adhesive 5. The heat is then transferred outward by the copper heat-conducting plate 6 through heat conduction. Due to the design of the support ball 8, there is a certain space gap between the copper heat-conducting plate 6 and the isolation plate 7. The gap reduces the contact area between the copper heat-conducting plate 6 and the isolation plate 7, thereby improving the heat dissipation efficiency.

[0031] By staggering the left and right sides of the chip 4, the overlapping area between two adjacent chips 4 is reduced, thereby reducing heat accumulation. Compared with traditional devices, this device uses staggered stacking to arrange the chips 4, which reduces the overlapping area between adjacent chips 4, saves installation space, achieves better heat dissipation, and exposes more area, making it easier for staff to observe and maintain the outer surface of the chip 4.

[0032] By designing multiple isolation plates 7, the pins 9 connecting the chip 4 and the isolation plates 7 are shorter. Compared with traditional devices, this device isolates and supports multiple stacked chips 4 by setting multiple isolation plates 7, while greatly reducing the length of the pins 9 and avoiding entanglement and crossover during the lengthening process, thus improving the stability of chip 4 operation.

[0033] like Figure 5 As shown, a second transfer plate 11, a third transfer plate 12 and a fourth transfer plate 13 are fixedly installed inside the organic plate 1. The first transfer plate 10, the second transfer plate 11, the third transfer plate 12 and the fourth transfer plate 13 are connected in sequence. A solder ball 14 is fixedly installed at the bottom of the organic plate 1. The fourth transfer plate 13 is fixedly connected to the solder ball 14.

[0034] The design of the second transmission board 11, the third transmission board 12, the fourth transmission board 13 and the solder ball 14 enables the electrical frequency signal of the chip 4 to be transmitted downward to the circuit board, realizing the transmission of information. The solder ball 14 is used for soldering, which greatly saves installation space.

[0035] like Figure 8 As shown, a fixing block 16 is fixedly installed on the top of the organic plate 1. The surface of the fixing block 16 is provided with heat dissipation holes 19, and the inner side of the fixing block 16 is fixedly connected to the isolation plate 7.

[0036] The design of the fixing block 16, through the cooperation between the fixing block 16 and the isolation plate 7, plays a certain role in limiting the overall position of the internal chip 4, thereby limiting the installation space of the chip 4 and avoiding installation position deviation during installation.

[0037] like Figure 6 As shown, heat sinks 17 are fixedly installed on both sides of the top of the fixed block 16, and the heat sinks 17 are connected to several copper heat conduction plates 6 through heat conduction plates 18.

[0038] Due to the design of the heat conduction plate 18, the heat absorbed by the copper heat conduction plate 6 is conducted to the heat sink 17 through the heat conduction plate 18, and then the heat is released to the outside through the heat sink 17 to avoid the internal temperature from being too high.

[0039] like Figure 7 As shown, a groove 20 is provided at the bottom of the fourth transfer plate 13, which divides the bottom of the fourth transfer plate 13 into multiple small squares.

[0040] The groove 20 increases the contact area between the fourth transfer plate 13 and the air, thereby playing a certain role in heat dissipation.

[0041] like Figure 3 As shown, the thickness of the isolation plate 7 is 1.5μm to 2μm. The two chips 4 are connected by an isolation plate 7, two layers of support balls 8, two layers of copper heat-conducting plates 6 and two layers of thermally conductive adhesive 5. The spacing between the two chips 4 is 5μm to 6.5μm.

[0042] Among them, due to the design of the thermally conductive adhesive 5, copper thermally conductive plate 6, isolation plate 7 and support ball 8, the difference from the traditional partition is that it can achieve a good heat dissipation effect while reducing the thickness to the maximum extent.

[0043] like Figure 2 As shown, the interior of the outer casing 2 is filled with a lower material, which is specifically filled in the gap between the bottom chip 4 and the organic board 1;

[0044] The filler is a liquid encapsulant formed by adding silica particles to epoxy resin. It can disperse the heat at the solder joint and prevent the heat from concentrating at the solder joint and causing it to melt.

[0045] like Figure 6 As shown, there are two heat sinks 17, and each of the two heat sinks 17 has a heat dissipation groove inside;

[0046] Due to the design of the heat sink 17, the heat sink grooves allow for a larger contact area between the heat sink 17 and the heat transfer resin, thereby improving the heat dissipation effect of the device.

[0047] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0048] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A semiconductor system integrated circuit packaging module, comprising an organic board (1), characterized in that: The top of the organic plate (1) is fixedly mounted with a shell (2), the top of the organic plate (1) is fixedly mounted with a base block (3), the top of the base block (3) is mounted with a chip (4), the number of chips (4) is three, the three chips (4) are staggered left and right, a copper heat-conducting plate (6) is fixedly mounted between every two chips (4), a copper heat-conducting plate (6) is fixedly mounted at the bottom of the chip (4), the top of the copper heat-conducting plate (6) is coated with a thermally conductive adhesive (5) located at the bottom of the chip (4), the copper heat-conducting plate (6) and the isolation plate (7) are fixedly connected by a support ball (8), the chip (4) and the isolation plate (7) are fixedly welded with pins (9), the top of the organic plate (1) is fixedly mounted with a first transfer plate (10), the bottommost chip (4) is welded to the first transfer plate (10) through pins (9), and adjacent two isolation plates (7) are connected by a connecting block (15); The organic plate (1) is internally fixedly equipped with a second transfer plate (11), a third transfer plate (12) and a fourth transfer plate (13). The first transfer plate (10), the second transfer plate (11), the third transfer plate (12) and the fourth transfer plate (13) are connected in sequence. A solder ball (14) is fixedly installed at the bottom of the organic plate (1). The fourth transfer plate (13) is fixedly connected to the solder ball (14).

2. The semiconductor system integrated circuit packaging module according to claim 1, characterized in that: A fixing block (16) is fixedly installed on the top of the organic plate (1). The surface of the fixing block (16) is provided with heat dissipation holes (19). The inner side of the fixing block (16) is fixedly connected to the isolation plate (7).

3. A semiconductor system integrated circuit packaging module according to claim 2, characterized in that: Heat sinks (17) are fixedly installed on both sides of the top of the fixed block (16), and the heat sinks (17) are connected to several copper heat conduction plates (6) through heat conduction plates (18).

4. A semiconductor system integrated circuit packaging module according to claim 1, characterized in that: The bottom end of the fourth transfer plate (13) is provided with a groove (20), which divides the bottom end of the fourth transfer plate (13) into multiple small squares.

5. A semiconductor system integrated circuit packaging module according to claim 1, characterized in that: The thickness of the isolation plate (7) is 1.5-2μm. The two chips (4) are connected by an isolation plate (7), two layers of support balls (8), two layers of copper heat-conducting plates (6) and two layers of thermally conductive adhesive (5). The distance between the two chips (4) is 5-6.5μm.

6. A semiconductor system integrated circuit packaging module according to claim 1, characterized in that: The interior of the outer shell (2) is filled with a lowering material, which is specifically filled in the gap between the bottom chip (4) and the organic plate (1).

7. A semiconductor system integrated circuit packaging module according to claim 3, characterized in that: There are two heat sinks (17), and each of the two heat sinks (17) has a heat dissipation groove inside.

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