Method for processing micro-bonding surface of accelerometer coil skeleton

Abstract

The application provides a micro-bonding surface processing method for an accelerometer coil skeleton, which comprises the following steps: step one, installing the coil skeleton of the accelerometer on a machine tool workbench, and selecting and installing a milling cutter; taking the micro-bonding surface structure of the coil skeleton as a surface reference, establishing a workpiece-cutter milling system, and determining the spatial relationship between the milling cutter and the micro-bonding surface structure of the coil skeleton; step two, based on the determined spatial relationship between the milling cutter and the micro-bonding surface structure of the coil skeleton, milling the micro-bonding surface structure of the coil skeleton to obtain a coil skeleton micro-bonding surface with a pattern structure morphology, so as to complete the micro-bonding surface processing of the coil skeleton of the accelerometer. The technical scheme of the application improves the bonding strength between the coil skeleton and the sensitive structure, and effectively prevents the bonding between the coil skeleton and the sensitive structure from loosening when the accelerometer experiences high and low temperatures or high-intensity vibration impact.

Description

Technical Field

[0001] This invention relates to the field of machining technology, and in particular to a method for processing the micro-bonded surface of an accelerometer coil skeleton. Background Technology

[0002] Currently, micro-components are widely used in various fields, such as precision instruments, microelectronics manufacturing, communication equipment, and biomedicine, among many other micro-structural components. In a single-axis pendulum accelerometer (hereinafter referred to as "accelerometer"), the coil frame is a typical micro-thin-walled structural component with a complex structure and various micro-structures. The micro-bonding surface, as an important component of the coil frame, is the direct bonding surface between the coil frame and the sensing structure, formed by structural adhesive bonding to create the sensitive detection pendulum. The bonding strength of this surface largely determines the accelerometer's resistance to high and low temperatures and its ability to withstand vibration and shock. Therefore, improving the high-strength bonding capability of the micro-bonding surface of the coil frame is of great significance while meeting various parameter requirements.

[0003] As accelerometers operate in increasingly harsh environments, the coil frame and sensing structure are prone to loosening of their bonds when subjected to high and low temperatures or high-intensity vibration and impact. This can directly lead to accelerometer malfunction. Therefore, a method to improve the bonding strength of the sensing pendulum is urgently needed. The sensing structure is made of quartz glass through etching, making surface treatment relatively difficult. The coil frame is made of aluminum alloy and machined, but its small, complex structure is easily deformed. Re-surface treatment after machining could easily cause deformation and damage to the coil frame. Therefore, improving and controlling the surface treatment of the coil frame during the machining process is of great significance. Summary of the Invention

[0004] This invention provides a method for processing the micro-bonded surface of an accelerometer coil skeleton, which can solve one of the above-mentioned technical problems in the prior art.

[0005] This invention provides a method for machining the micro-bonded surface of an accelerometer coil skeleton. The method includes: Step 1, mounting the accelerometer coil skeleton on a machine tool workbench, selecting and installing a milling cutter; establishing a workpiece-cutter milling system using the micro-bonded surface structure of the coil skeleton as a surface reference, and determining the spatial relationship between the milling cutter and the micro-bonded surface structure of the coil skeleton; Step 2, based on the determined spatial relationship between the milling cutter and the micro-bonded surface structure of the coil skeleton, milling the micro-bonded surface structure of the coil skeleton to obtain a micro-bonded surface with a patterned structure morphology, thus completing the machining of the micro-bonded surface of the accelerometer coil skeleton.

[0006] Furthermore, in step one, the milling cutter is a micro ball end mill.

[0007] Furthermore, the diameter of the micro ball end mill is no greater than 0.5 mm.

[0008] Furthermore, in step two, the milling process uses a rotational speed of 15000 N / min or higher.

[0009] Furthermore, in step two, the feed range for milling is 20-40 μm / z.

[0010] Furthermore, in step two, the cutting depth of the milling process ranges from 15 to 25 μm.

[0011] Furthermore, the inclination angle range of micro ball end mills in milling is 20-30°.

[0012] Furthermore, the inclination angle of the micro ball end mill in milling is 25°.

[0013] Furthermore, after step two, the method for processing the micro-bonding surface of the accelerometer coil skeleton also includes: step three, using a microscopic surface imaging system to perform morphological inspection on the micro-bonding surface of the coil skeleton after milling.

[0014] Furthermore, the morphology detection of the micro-bonding surface of the coil skeleton after milling is performed using a micro-surface imaging system, including: using a three-dimensional morphology measuring instrument or an optical 3D surface profilometer to perform morphology detection of the micro-bonding surface of the coil skeleton after milling.

[0015] The present invention provides a method for processing the micro-bonding surface of an accelerometer coil skeleton. This method involves milling the micro-bonding surface of the accelerometer coil skeleton to obtain a micro-bonding surface with a patterned structure, thereby improving the bonding strength between the coil skeleton and the sensitive structure and effectively preventing the bonding between the coil skeleton and the sensitive structure from loosening when the accelerometer is subjected to high or low temperatures or high-intensity vibration and impact. Attached Figure Description

[0016] The accompanying drawings, which form part of this specification, are provided to further illustrate embodiments of the invention and, together with the textual description, explain the principles of the invention. It is obvious that the drawings described below are merely some embodiments of the invention, and those skilled in the art can obtain other drawings based on these drawings without any creative effort.

[0017] Figure 1 A schematic flowchart of a method for fabricating a micro-adhesive surface for an accelerometer coil skeleton according to a specific embodiment of the present invention is shown.

[0018] Figure 2 A top view of an accelerometer coil skeleton structure according to a specific embodiment of the present invention is shown;

[0019] Figure 3 A schematic diagram of the workpiece-tool milling system provided according to a specific embodiment of the present invention is shown;

[0020] Figure 4 A schematic diagram of the microstructure of the micro-bonding surface of the accelerometer coil skeleton after milling is shown according to a specific embodiment of the present invention. Detailed Implementation

[0021] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the present invention or its application or use. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0022] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0023] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the invention. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following figures denote similar items; therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0024] like Figure 1As shown, a specific embodiment of the present invention provides a method for machining the micro-bonded surface of an accelerometer coil skeleton. This method includes: Step 1, mounting the accelerometer coil skeleton on a machine tool workbench, selecting and installing a milling cutter; establishing a workpiece-cutter milling system using the micro-bonded surface structure of the coil skeleton as a surface reference, and determining the spatial relationship between the milling cutter and the micro-bonded surface structure of the coil skeleton; Step 2, based on the determined spatial relationship between the milling cutter and the micro-bonded surface structure of the coil skeleton, milling the micro-bonded surface structure of the coil skeleton to obtain a micro-bonded surface of the coil skeleton with a patterned structure morphology to complete the machining of the micro-bonded surface of the accelerometer coil skeleton.

[0025] This configuration provides a method for machining the micro-bonding surface of an accelerometer coil skeleton. This method involves milling the micro-bonding surface of the accelerometer coil skeleton to obtain a micro-bonding surface with a patterned structure, thereby improving the bonding strength between the coil skeleton and the sensitive structure and effectively preventing the bonding between the coil skeleton and the sensitive structure from loosening when the accelerometer is subjected to high or low temperatures or high-intensity vibration and impact.

[0026] Furthermore, in this invention, to achieve the surface processing of the micro-bonding of the accelerometer coil frame, firstly, the accelerometer coil frame is mounted on a machine tool table, and a milling cutter is selected and installed. If the surface of the coil frame, after mechanical processing, is further processed, it can easily cause deformation and damage to the coil frame. Therefore, this invention focuses on surface processing of the coil frame surface used for bonding and not yet finished, such as... Figure 2 As shown. The area of ​​the miniature bonding surface structure of the coil bobbin is related to the overall size of the accelerometer, and the area of ​​the miniature bonding surface structure of the coil bobbin ranges from approximately 10-50 mm². 2 As a specific embodiment of the present invention, the area of ​​the micro-adhesive surface structure of the coil bobbin is approximately 15 mm². 2 Accordingly, the machining contact area of ​​the selected milling cutter should not be too large. In this embodiment, a micro ball end mill with a diameter of no more than 0.5 mm can be selected.

[0027] Furthermore, in this invention, after the accelerometer coil frame and milling cutter are installed, the workpiece-cutter milling system is established using the micro-bonded surface structure of the coil frame as a surface reference, and the spatial relationship between the milling cutter and the micro-bonded surface structure of the coil frame is determined, such as... Figure 3 As shown. In this invention, an alignment operation is used to determine the spatial relationship between the milling cutter and the micro-bonded surface structure of the coil bobbin.

[0028] Furthermore, in this invention, after establishing the workpiece-cutter milling system, the micro-bonding surface structure of the coil frame is milled based on the determined spatial relationship between the milling cutter and the micro-bonding surface structure of the coil frame to obtain a micro-bonding surface of the coil frame with a pattern structure morphology in order to complete the micro-bonding surface machining of the accelerometer coil frame.

[0029] In this invention, to achieve refined milling of micro-adhesive surface structures, the micro-ball end mill can be set to maintain a certain tilt angle during milling, and machining parameters of high speed, low feed rate, and small depth of cut can be used. As a specific embodiment of this invention, a speed of 15000 N / min or higher, a feed rate of 20-40 μm / z, and a depth of cut of 15-25 μm can be used, with the tilt angle of the micro-ball end mill set to 20-30°. Furthermore, the milling method can be further set to climb milling, liquid cooling can be used for temperature reduction, and the feed trajectory should preferably be linear.

[0030] Furthermore, in this invention, after step two, the method for processing the micro-bonding surface of the accelerometer coil skeleton further includes: step three, using a microscopic surface imaging system to perform morphological inspection on the micro-bonding surface of the coil skeleton after milling. In this invention, a microscopic surface imaging system can be used to perform morphological inspection on the micro-bonding surface of the coil skeleton after milling to determine whether the aforementioned milling process successfully altered the morphology of the micro-bonding surface of the coil skeleton. The morphological inspection equipment can be a real-time inspection device or a separate inspection device. As a specific embodiment of this invention, a three-dimensional morphological measuring instrument or an optical 3D surface profilometer can be used to perform morphological inspection on the micro-bonding surface of the coil skeleton after milling.

[0031] The present invention provides a method for machining the micro-bonded surface of the accelerometer coil skeleton. Based on the existing machining of the accelerometer coil skeleton, the method uses milling to finely machine the surface morphology of the micro-bonded surface of the coil skeleton, ensuring production efficiency, controllable quality, and simple operation. The machining is completed in one step, avoiding deformation and damage to the coil skeleton surface caused by secondary machining. The processed micro-bonded surface can significantly improve the bonding strength between the coil skeleton and the sensitive structure, prevent the bonding from loosening, and ensure the normal performance of the accelerometer.

[0032] To gain a further understanding of the present invention, the following description is provided in conjunction with... Figures 1 to 4 The method for processing the micro-adhesive surface of the accelerometer coil skeleton of the present invention will be described in detail.

[0033] like Figures 1 to 4 As shown in the figure, a method for processing the micro-adhesive surface of an accelerometer coil skeleton is provided according to a specific embodiment of the present invention, which specifically includes the following steps.

[0034] Step 1: Install the accelerometer coil frame onto the machine tool worktable and select a micro ball end mill; using the micro-bonded surface structure of the coil frame as the surface reference, establish the workpiece-tool milling system and determine the spatial relationship between the end mill and the micro-bonded surface structure of the coil frame.

[0035] Step 2: The micro-bonding surface of the coil frame is machined by climb milling at a rotation speed of 18000 N / min, a feed rate of 30 μm / z, a cutting depth of 20 μm, and a micro ball end mill tilt angle of 25° to obtain a micro-bonding surface of the coil frame with a patterned structure.

[0036] Step 3: The micro-bonding surface of the coil skeleton after milling is inspected using a Keyence 3D topography measuring instrument or a CHOTEST optical 3D surface profilometer. Figure 4 As shown, the surface of the coil skeleton after being processed by the micro-adhesive surface of the present invention has a typical uneven pattern structure.

[0037] As can be seen from the comparison table of bonding strength of the micro-bonding surface of the coil skeleton after the above milling process shown in Table 1, the micro-bonding surface processing method of the accelerometer coil skeleton of the present invention significantly improves the bonding strength between the coil skeleton and the sensitive structure while ensuring production efficiency and quality. It can prevent the bonding from loosening after the accelerometer has undergone high and low temperatures and high intensity vibration, thus ensuring the normal performance of the accelerometer.

[0038] Table 1 Comparison of Bond Strength Tests After Milling the Surface of the Coil Frame's Miniature Bonding Surface

[0039] Surface unimproved Shear tension / N Surface Improvement Shear tension / N Sample 1 2253 Sample 11 3768 Sample 2 2146 Sample 12 3989 Sample 3 2103 Sample 13 4098 Sample 4 3157 Sample 14 4776 Sample 5 1963 Sample 15 2369 Sample 6 1794 Sample 16 1972 Sample 7 2108 Sample 17 4653 Sample 8 2657 Sample 18 2427 Sample 9 2317 Sample 19 3763 Sample 10 1813 Sample 20 3449

[0040] In summary, this invention provides a method for processing the micro-bonding surface of an accelerometer coil skeleton. This method involves milling the micro-bonding surface of the accelerometer coil skeleton to obtain a micro-bonding surface with a patterned structure, thereby improving the bonding strength between the coil skeleton and the sensitive structure and effectively preventing the bonding between the coil skeleton and the sensitive structure from loosening when the accelerometer is subjected to high or low temperatures or high-intensity vibration and impact.

[0041] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0042] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore should not be construed as limiting the scope of protection of this invention.

[0043] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A method for processing a micro-bonding surface of an accelerometer coil former, characterized by, The accelerometer coil skeleton micro-bonding surface processing method comprises the following steps: Step one, install the coil skeleton of the accelerometer on the machine tool workbench, select and install a micro ball-end mill, the diameter of the micro ball-end mill is not greater than 0.5 mm; take the micro-bonding surface structure of the coil skeleton as the surface reference, establish the workpiece-tool milling system, and determine the spatial relationship between the micro ball-end mill and the micro-bonding surface structure of the coil skeleton; Step two, based on the determined spatial relationship between the micro ball-end mill and the micro-bonding surface structure of the coil skeleton, mill the micro-bonding surface structure of the coil skeleton to obtain a coil skeleton micro-bonding surface with a pattern structure morphology to complete the accelerometer coil skeleton micro-bonding surface processing; the milling adopts a rotation speed of 15000 n / min or above, the milling feed range is 20-40 μm / z, the milling cutting depth range is 15-25 μm, and the inclination angle of the micro ball-end mill in the milling is 20-30°; Step three, use a micro surface imaging system to detect the morphology of the micro-bonding surface of the coil skeleton after the milling processing.

2. The accelerometer coil former microbonding surface finishing method according to claim 1, wherein The inclination angle of the micro ball-end mill in the milling is 25°.

3. The accelerometer coil former microbonding surface finishing method of claim 1 wherein, The morphology detection of the micro-bonding surface of the coil skeleton after the milling processing by the micro surface imaging system comprises: using a three-dimensional morphology measuring instrument or an optical 3D surface profilometer to detect the morphology of the micro-bonding surface of the coil skeleton after the milling processing.

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