A method for detecting copper layer on a PCB board
By detecting the position of copper layers on PCB boards through changes in drill bit capacitance, this method solves the problem of inaccurate detection of the relative position of copper layers in existing technologies, and achieves non-destructive, low-cost detection of copper layers on multilayer PCB boards.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- NANJING TALIANG TECH CO LTD
- Filing Date
- 2022-11-02
- Publication Date
- 2026-05-26
AI Technical Summary
Existing technologies cannot effectively detect the accurate relative position of copper layers on PCB boards, especially in multilayer PCB boards. X-ray inspection is slow and costly, while cross-section inspection is destructive and cannot represent the overall result.
Drilling is performed using a drill bit. The position of each copper layer is detected by monitoring the capacitance change of the drill bit. The capacitance effect changes when the copper layer is in contact with the copper layer. Combined with drilling and dust collection, the position of conductive material residue can be determined, thus achieving non-destructive detection of the copper layer position.
It enables accurate detection of the copper layer position on PCB boards, avoids destructive testing, reduces testing costs, and can monitor the relative position of copper layers on multilayer PCB boards in real time.
Smart Images
Figure CN115791900B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of circuit board technology, and in particular to a method for detecting the copper layer of a PCB board. Background Technology
[0002] With the rapid development of 3C products and advanced communication, the manufacturing of PCB boards has become increasingly complex. With the integration of many functions and the miniaturization of terminal products, the circuits on PCB boards are becoming increasingly dense, and the number of stacked layers on PCB boards is also increasing. In the process of adding layers, whether by lamination or by adding layers one by one, it becomes difficult to determine the actual position of the copper layers in the inner layers, that is, the actual depth of each copper layer in the PCB board.
[0003] Currently, there are several detection methods for confirming the position of copper layers. The most common is X-ray inspection, which utilizes the penetrating properties of X-rays to accurately determine the relative position of copper layers. While this method offers high accuracy, it is slow and the equipment is expensive. Another method involves slicing the PCB board in half and observing the position of each copper layer in the cross-section using a microscope. This method also yields accurate results, but it is destructive and unsuitable for products. Furthermore, PCB boards with multiple layers may have varying thicknesses, meaning that local slice results cannot represent the actual position of the copper layers across the entire product. Therefore, the aforementioned detection techniques cannot effectively and in real-time determine the accurate relative position of copper layers on a PCB board. Summary of the Invention
[0004] The purpose of this invention is to provide a method for detecting the copper layer of a PCB board, which aims to solve the technical problem in the prior art that the accurate relative position of the copper layer on the PCB board cannot be determined during copper layer detection.
[0005] To achieve the above objectives, the present invention provides a PCB copper layer detection method, comprising the following steps:
[0006] Place the PCB board to be drilled on the drilling machine table;
[0007] Drilling operations are performed using drill bits, and the changes in the capacitance of the drill bits are monitored to detect and record the positions of each copper layer in the PCB board.
[0008] Among the steps involving drilling with a drill bit, monitoring the capacitance change of the drill bit, and detecting and recording the position of each copper layer within the PCB board:
[0009] When the drill bit touches the L0 copper layer, it triggers a signal indicating a change in the drill bit's capacitance and records the drill bit's position.
[0010] As the drilling depth continues to increase, after the drill bit removes the L0 copper layer, the tip of the drill bit contacts the insulating layer below the L0 copper layer. The capacitance of the drill bit then returns to a non-conductive state, indicating that it has detached from the L0 copper layer.
[0011] The removed copper wire travels upwards along the drill bit and is removed by the dust collector of the drilling machine. This process determines whether there is any conductive material residue left during drilling and completes the detection of the L0 copper layer position.
[0012] In the process of drilling, the copper wire is removed upwards along the drill bit and then removed by the dust collector of the drilling machine. This process is used to determine whether there is any conductive residue left during the drilling process, thus completing the detection of the L0 copper layer position.
[0013] If the drill bit is raised back 0.01mm, and the capacitance value of the drill bit does not change, it means that the drill bit has detached from the L0 copper layer during the drilling process and there is no conductive material residue.
[0014] The process involves drilling out copper wires that travel upwards along the drill bit and are removed by the drilling machine's dust collector. This process is followed by determining if any conductive material remains after drilling, and then completing the L0 copper layer location detection step.
[0015] The drill bit continues to drill down. When the drill bit contacts the L1 copper layer, it triggers a signal indicating a change in the drill bit's capacitance and records the drill bit's position.
[0016] As the drilling depth continues to increase, after the drill bit removes the L1 copper layer, the tip of the drill bit contacts the insulating layer below the L1 copper layer, and the capacitance of the drill bit returns to a non-conductive state. This indicates that the drill bit has been removed from the L1 copper layer.
[0017] The removed copper wires travel upwards along the drill bit and are removed by the dust collector of the drilling machine. This process determines whether there are any conductive materials remaining during drilling and completes the detection of the L1 copper layer position.
[0018] In the process of drilling, the copper wire is removed upwards along the drill bit and then removed by the dust collector of the drilling machine. This process is used to determine whether there is any conductive residue left during the drilling process, thus completing the detection of the L1 copper layer position.
[0019] If the drill bit is raised back 0.01mm, and the capacitance value of the drill bit does not change, it means that the drill bit has detached from the L1 copper layer during the drilling process and there is no conductive material residue.
[0020] The process involves drilling out copper wires that travel upwards along the drill bit and are removed by the drilling machine's dust collector. This process is followed by determining if any conductive material remains after drilling, and then completing the L1 copper layer location detection step.
[0021] The drill bit continues to drill down. When the drill bit contacts the L2 copper layer, it triggers a signal indicating a change in the drill bit's capacitance and records the drill bit's position.
[0022] As the drilling depth continues to increase, after the drill bit removes the L2 copper layer, the tip of the drill bit contacts the insulating layer below the L2 copper layer. The capacitance of the drill bit then returns to a non-conductive state, indicating that it has detached from the L2 copper layer.
[0023] The removed copper wire travels upwards along the drill bit and is removed by the dust collector of the drilling machine. This process determines whether there are any conductive materials remaining during drilling and completes the detection of the L2 copper layer position.
[0024] In the process of detecting the location of the L2 copper layer, the copper wire removed during drilling travels upwards along the drill bit and is removed by the dust collector of the drilling machine. This process is used to determine whether there is any conductive residue left during drilling.
[0025] If the drill bit is raised back 0.01mm, and the capacitance value of the drill bit does not change, it means that the drill bit has detached from the L2 copper layer during the drilling process and there is no conductive material residue.
[0026] The present invention discloses a method for detecting copper layers on a PCB board. First, the PCB board to be drilled is placed on the table of a drilling machine. Then, a drill bit is used to perform drilling operations. The capacitance change of the drill bit is monitored, and the position of each copper layer in the PCB board is detected and recorded. By utilizing the change of capacitance effect, there will be a capacitance reaction in each different copper layer. By monitoring the change of capacitance effect, the accurate relative position of the copper layers on the PCB board can be determined in the copper layer detection process. Attached Figure Description
[0027] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0028] Figure 1 This is a flowchart of the steps of the PCB copper layer detection method of the present invention.
[0029] Figure 2 This is a flowchart of the steps of the PCB copper layer detection method of the present invention.
[0030] Figure 3 This is a schematic diagram of the PCB board and drill bit structure of the present invention.
[0031] Figure 4 This is a schematic diagram of the L0 copper layer detection process of the present invention.
[0032] Figure 5 This is a signal diagram showing the change in drill bit capacitance during the L0 copper layer detection process of this invention.
[0033] Figure 6 This is a schematic diagram of the L1 copper layer detection process of the present invention.
[0034] Figure 7 This is a signal diagram showing the change in drill bit capacitance during the L1 copper layer detection process of this invention.
[0035] Figure 8 This is a schematic diagram of the L2 copper layer detection process of the present invention.
[0036] Figure 9 This is a signal diagram showing the change in drill bit capacitance during the L2 copper layer detection process of this invention.
[0037] 1-L0 copper layer, 2-L1 copper layer, 3-L2 copper layer, 4-insulating layer, 5-drill bit. Detailed Implementation
[0038] Please see Figures 1 to 9 , Figure 1 This is a flowchart of the steps involved in the PCB copper layer inspection method. Figure 2 This is a flowchart of the steps involved in the PCB copper layer inspection method. Figure 3 This is a structural diagram of the PCB board and drill bits. Figure 4 This is a schematic diagram of the L0 copper layer detection process. Figure 5 This is a signal diagram showing the change in drill bit capacitance during the L0 copper layer detection process. Figure 6 This is a schematic diagram of the L1 copper layer detection process. Figure 7 This is a signal diagram showing the change in drill bit capacitance during the L1 copper layer detection process. Figure 8 This is a schematic diagram of the L2 copper layer detection process. Figure 9 This is a signal diagram showing the change in drill bit capacitance during the L2 copper layer detection process.
[0039] This invention provides a method for detecting the copper layer of a PCB board, comprising the following steps:
[0040] S1: Place the PCB board to be drilled on the drilling machine table;
[0041] S2: Use drill bit 5 to perform drilling operations, monitor the capacitance change of drill bit 5, and detect and record the position of each copper layer in the PCB board.
[0042] In this embodiment, the PCB board to be drilled is first placed on the table of the drilling machine, and then the drill bit 5 is used to perform the drilling operation. The capacitance change of the drill bit 5 is monitored, and the position of each copper layer in the PCB board is detected and recorded. By utilizing the change of capacitance effect, there will be capacitance reaction in each different copper layer. By monitoring the change of capacitance effect, the accurate relative position of the copper layer of the PCB board can be determined in the copper layer detection of the PCB board.
[0043] Furthermore, in the steps of using drill bit 5 to perform drilling operations, monitoring the capacitance change of drill bit 5, and detecting and recording the position of each copper layer in the PCB board:
[0044] S21: When drill bit 5 contacts L0 copper layer 1, a signal is triggered to change the capacitance of drill bit 5, and the position of drill bit 5 is recorded.
[0045] S22: Continue to increase the current drilling depth. After the drill bit 5 removes the L0 copper layer 1, the tip of the drill bit 5 contacts the insulating layer 4 below the L0 copper layer 1. The capacitance value of the drill bit 5 then returns to a non-conductive state, which means that it has been removed from the L0 copper layer 1.
[0046] S23: The drilled copper wire goes up along the drill bit 5 and is removed by the dust collector of the drilling machine. Determine whether there is any conductive material residue during the drilling process. Raise the drill bit 5 back by 0.01mm. If the capacitance value of the drill bit 5 does not change at this time, it means that the L0 copper layer 1 has been separated during the drilling process and there is no conductive material residue. The detection of the position of L0 copper layer 1 is completed.
[0047] S24: Drill bit 5 continues to drill down. When drill bit 5 contacts the L1 copper layer, a signal is triggered to change the capacitance of drill bit 5, and the position of drill bit 5 is recorded.
[0048] S25: Continue to increase the current drilling depth. After the drill bit 5 removes the L1 copper layer 2, the tip of the drill bit 5 contacts the insulating layer 4 below the L1 copper layer 2. The capacitance value of the drill bit 5 then returns to a non-conductive state, which means that it has been removed from the L1 copper layer 2.
[0049] S26: The drilled copper wire goes up along the drill bit 5 and is removed by the dust collector of the drilling machine. To determine whether there is any conductive material residue during the drilling process, the drill bit 5 is raised back by 0.01mm. If the capacitance value of the drill bit 5 does not change at this time, it means that the L1 copper layer 2 has been separated during the drilling process and there is no conductive material residue. The detection of the position of the L1 copper layer 2 is completed.
[0050] S27: Drill bit 5 continues to drill down. When drill bit 5 contacts the L2 copper layer, a signal is triggered to change the capacitance of drill bit 5, and the position of drill bit 5 is recorded.
[0051] S28: Continue to increase the current drilling depth. After the drill bit 5 removes the L2 copper layer 3, the tip of the drill bit 5 contacts the insulating layer 4 below the L2 copper layer 3. The capacitance value of the drill bit 5 then returns to a non-conductive state, which means that it has been removed from the L2 copper layer 3.
[0052] S29: The drilled copper wire goes up along the drill bit 5 and is removed by the dust collector of the drilling machine. To determine whether there is any conductive material residue during the drilling process, the drill bit 5 is raised back by 0.01mm. If the capacitance value of the drill bit 5 does not change at this time, it means that the L2 copper layer 3 has been separated during the drilling process and there is no conductive material residue. The detection of the position of the L2 copper layer 3 is completed.
[0053] In this embodiment, when the drill bit 5 first contacts the L0 copper layer 1, a signal indicating a change in the capacitance of the drill bit 5 is triggered, and the position of the drill bit 5 is recorded to obtain a signal graph of the capacitance change of the drill bit 5 during the L0 copper layer 1 detection process. As the drilling depth is continuously increased, after the drill bit 5 removes the L0 copper layer 1, the tip of the drill bit 5 contacts the insulating layer 4 below the L0 copper layer 1, and the capacitance of the drill bit 5 returns to a non-conductive state. This indicates that it has detached from the L0 copper layer 1. During this process, the removed copper wire travels upwards along the drill bit 5 and is removed by the dust collector of the drilling machine. To determine if any conductive material remains during the drilling process, the drill bit 5 is raised back by 0.01 mm. If the capacitance value remains unchanged, it indicates that the L0 copper layer 1 has been removed during drilling, and no conductive material remains. The location of the L0 copper layer 1 is then detected. Drill bit 5 continues drilling. When drill bit 5 contacts the L1 copper layer, a signal indicating a change in the capacitance of drill bit 5 is triggered, and the position of drill bit 5 is recorded. This yields a signal graph of the capacitance change of drill bit 5 during the L1 copper layer 2 detection process. As the drilling depth continues to increase, after drill bit 5 removes the L1 copper layer 2, the tip of drill bit 5 contacts the insulating layer 4 below the L1 copper layer 2. The capacitance value of drill bit 5 then returns to a non-conductive state, indicating that the L1 copper layer 2 has been removed. During this process, the removed copper wire travels upwards along drill bit 5. The dust is removed by the drill press's dust collector. To check for any conductive residue during drilling, the drill bit 5 is raised back 0.01mm. If the capacitance of the drill bit 5 remains unchanged at this point, it indicates that the L1 copper layer 2 has been removed during drilling, and no conductive residue remains. This completes the detection of the L1 copper layer 2 position. The drill bit 5 continues drilling downwards. When it contacts the L2 copper layer, a signal indicating a change in capacitance is triggered, and the position of the drill bit 5 is recorded. This yields a signal graph showing the capacitance change of the drill bit 5 during the L2 copper layer 3 detection process. The drilling depth is continuously increased until the drill bit 5 removes the L2 copper layer 3. At this point, the tip of the drill bit 5 contacts the insulating layer 4 below the L2 copper layer 3. The capacitance of drill bit 5 returns to a non-conductive state, indicating that it has detached from the L2 copper layer 3. During this process, the drilled copper wire goes up along drill bit 5 and is removed by the dust collector of the drilling machine. To determine if there is any conductive material residue during the drilling process, drill bit 5 is raised back 0.01mm. If the capacitance of drill bit 5 does not change at this time, it means that it has detached from the L2 copper layer 3 during the drilling process and there is no conductive material residue, thus completing the detection of the position of L2 copper layer 3. In this embodiment, the position of three copper layers is detected and recorded. When the PCB board has multiple copper layers, the drilling step of drill bit 5 is repeated to detect the position of each copper layer in the PCB board and record the position of the copper layers.
[0054] The above description discloses only one preferred embodiment of the present invention, and should not be construed as limiting the scope of the present invention. Those skilled in the art will understand that all or part of the processes of the above embodiments can be implemented, and equivalent changes made in accordance with the claims of the present invention are still within the scope of the invention.
Claims
1. A method for detecting the copper layer of a PCB board, characterized in that, Includes the following steps: Place the PCB board to be drilled on the drilling machine table; Drilling is performed using a drill bit, and the capacitance change of the drill bit is monitored to detect and record the position of each copper layer on the PCB board; the specific process is as follows: When the drill bit touches the L0 copper layer, it triggers a signal indicating a change in the drill bit's capacitance and records the drill bit's position. As the drilling depth continues to increase, after the drill bit removes the L0 copper layer, the tip of the drill bit contacts the insulating layer below the L0 copper layer. The capacitance of the drill bit then returns to a non-conductive state, indicating that it has detached from the L0 copper layer. The removed copper wire travels upwards along the drill bit and is removed by the dust collector of the drilling machine. This process determines whether there is any conductive material residue during drilling and completes the detection of the L0 copper layer position. Specifically, if the drill bit is raised back by 0.01mm and the capacitance value of the drill bit does not change, it means that the L0 copper layer has been removed during drilling and no conductive material residue remains.
2. The PCB copper layer detection method as described in claim 1, characterized in that, After the drilled copper wire travels upwards along the drill bit and is removed by the drilling machine's dust collector, it is determined whether any conductive material remains after the drilling process. This completes the step of detecting the L0 copper layer location. The drill bit continues to drill down. When the drill bit contacts the L1 copper layer, it triggers a signal indicating a change in the drill bit's capacitance and records the drill bit's position. As the drilling depth continues to increase, after the drill bit removes the L1 copper layer, the tip of the drill bit contacts the insulating layer below the L1 copper layer, and the capacitance of the drill bit returns to a non-conductive state. This indicates that the drill bit has been removed from the L1 copper layer. The removed copper wires travel upwards along the drill bit and are removed by the dust collector of the drilling machine. This process determines whether there are any conductive materials remaining during drilling and completes the detection of the L1 copper layer position.
3. The PCB copper layer detection method as described in claim 2, characterized in that, The copper wire removed during drilling travels upwards along the drill bit and is removed by the drilling machine's dust collector. This process is used to determine if any conductive material remains after drilling, thus completing the detection of the L1 copper layer location. If the drill bit is raised back 0.01mm, and the capacitance value of the drill bit does not change, it means that the drill bit has detached from the L1 copper layer during the drilling process and there is no conductive material residue.
4. The PCB copper layer detection method as described in claim 2, characterized in that, After the drilled copper wire travels upwards along the drill bit and is removed by the drilling machine's dust collector, it is determined whether any conductive material remains after the drilling process. This completes the step of detecting the location of the L1 copper layer. The drill bit continues to drill down. When the drill bit contacts the L2 copper layer, it triggers a signal indicating a change in the drill bit's capacitance and records the drill bit's position. As the drilling depth continues to increase, after the drill bit removes the L2 copper layer, the tip of the drill bit contacts the insulating layer below the L2 copper layer. The capacitance of the drill bit then returns to a non-conductive state, indicating that it has detached from the L2 copper layer. The removed copper wire travels upwards along the drill bit and is removed by the dust collector of the drilling machine. This process determines whether there are any conductive materials remaining during drilling and completes the detection of the L2 copper layer position.
5. The PCB copper layer detection method as described in claim 4, characterized in that, The copper wire removed during drilling travels upwards along the drill bit and is removed by the drilling machine's dust collector. This process is used to determine if any conductive material remains after drilling, thus completing the step of detecting the location of the L2 copper layer. If the drill bit is raised back 0.01mm, and the capacitance value of the drill bit does not change, it means that the drill bit has detached from the L2 copper layer during the drilling process and there is no conductive material residue.