Semiconductor Equipment

By introducing induction, transmission and drive control devices into semiconductor devices, the automatic replacement of the accommodating device is achieved, which solves the problem of manual operation of raw material replacement, improves the degree of automation and reduces the risk of leakage.

CN115799105BActive Publication Date: 2025-06-06CHANGXIN MEMORY TECH INC
View PDF 2 Cites 0 Cited by

Patent Information

Application Number
CN202111062404.X
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2021-09-10
Publication Date
2025-06-06
Estimated Expiration
2041-09-10

AI Technical Summary

Technical Problem

In semiconductor manufacturing processes, replacement of raw materials requires manual operation, which poses a risk of leakage and affects the degree of automation.

Method used

A semiconductor device is designed, including an induction device, a transmission device and a drive control device. By induction of the margin of the storage medium, the locking device and the transmission device are automatically controlled to realize automatic replacement of the accommodating device.

Benefits of technology

It improves the degree of automation of semiconductor devices, reduces the risk of storage media leakage, and steadily improves the replacement efficiency of the accommodating device.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN115799105B_ABST
    Figure CN115799105B_ABST
Patent Text Reader

Abstract

The embodiment of the present application relates to the semiconductor field, and provides a semiconductor device, including: a pipeline having a locking device suitable for locking an opening portion and a receiving device having a control valve and an opening portion; a sensing device for obtaining the remaining amount of storage medium in the receiving device; a conveying device for moving the receiving device along the extension direction of the receiving device and along a direction perpendicular to the extension direction of the receiving device to a preset position; a locking drive device is fixedly connected to the locking device, and if the receiving device reaches the preset position, the locking drive device drives the locking device to lock the opening portion, and if the remaining amount of the storage medium is less than the preset value, the locking drive device drives the locking device to separate the locking device from the opening portion; a driving control device, which is used to determine whether the remaining amount of the storage medium is less than the preset value, and generate a driving signal to drive the locking drive device to move. The embodiment of the present application can at least improve the automation level of semiconductor equipment and reduce the risk of storage medium leakage.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The embodiments of the present application relate to the semiconductor field, and in particular to a semiconductor device. Background Art

[0002] In the semiconductor manufacturing process, different semiconductor equipment is required to process semiconductor structures. Many semiconductor equipments have containers for supplying raw materials. Raw materials used in semiconductor processes are usually filled into these containers at high pressure. Due to the needs of the processing steps, the raw materials are transported to the chamber of the semiconductor equipment through pipelines. When the raw materials in the container are exhausted, the container usually needs to be replaced manually.

[0003] However, these raw materials are often toxic to the human body and harmful to the external environment. In the process of manually replacing the storage device, there is a high risk of storage medium leakage due to improper operation by personnel. If these raw materials are inhaled into the human body or diffused into the air in large quantities, it will cause safety accidents and environmental pollution. Summary of the invention

[0004] The embodiments of the present application provide a semiconductor device, which is at least beneficial to improving the automation level of the semiconductor device and reducing the risk of storage medium leakage.

[0005] The embodiment of the present application provides a semiconductor device, comprising: a pipeline and a accommodating device, wherein the accommodating device has a control valve and an opening portion, wherein the control valve controls the opening portion to be in an on or off state, and the pipeline has a locking device, wherein the locking device is suitable for locking the opening portion so that the accommodating device is connected to the pipeline; a sensing device, used to obtain the remaining amount of a storage medium in the accommodating device; a conveying device, wherein the accommodating device is located on the conveying device, and wherein the conveying device is used to move the accommodating device along an extension direction of the accommodating device and in a direction perpendicular to the extension direction of the accommodating device so that the accommodating device is conveyed to a preset position; a locking driving device, which is fixedly connected to the locking device, wherein if the accommodating device reaches the preset position, the locking driving device drives the locking device to move so that the locking device locks the opening portion, and if the remaining amount of the storage medium is less than a preset value, the locking driving device drives the locking device to move so that the locking device is separated from the opening portion; and a driving control device, which is used to determine whether the remaining amount of the storage medium is less than the preset value, and to generate a driving signal for driving the locking driving device to move.

[0006] In addition, the conveying device includes: a first conveying unit, the accommodating device is located on the first conveying unit, and the first conveying unit is used to move the accommodating device along the extension direction of the accommodating device; a second conveying unit, which is in contact with and connected to the first conveying unit and is used to enable the first conveying unit to drive the accommodating device to move in a direction perpendicular to the extension direction of the accommodating device, and the first conveying unit and the second conveying unit are used together to convey the accommodating device to the preset position.

[0007] In addition, the first transmission unit includes: a first transmission unit and a second transmission unit adapted to the first transmission unit, and the accommodating device is detachably connected to the second transmission unit, so that the second transmission unit drives the accommodating device to move along the extension direction of the accommodating device when the first transmission unit makes a circumferential motion.

[0008] In addition, the first transmission unit includes a slide rail and a lead screw, wherein the first transmission unit includes the slide rail and the screw in the lead screw, and the extension direction of the slide rail and the extension direction of the screw are both the same as the extension direction of the accommodating device; the second transmission unit includes a nut in the lead screw, and the nut is embedded in the slide rail, and the accommodating device is engaged with the nut, so that the nut drives the accommodating device to move along the extension direction of the accommodating device when the screw makes a circumferential motion.

[0009] In addition, the first transmission unit includes a gear and a rack meshing with the gear, wherein the first transmission unit includes the gear; the second transmission unit includes the rack, and the accommodating device is engaged with the rack, so that the rack drives the accommodating device to move along the extension direction of the accommodating device when the gear moves circumferentially.

[0010] In addition, the first transmission unit includes a slide rail and a crank slider mechanism, wherein the first transmission unit includes a crank in the crank slider mechanism; the second transmission unit includes a slide rail and a slider in the crank slider mechanism, and the extension direction of the slide rail is the same as the extension direction of the accommodating device, the slider is embedded in the slide rail, and the accommodating device is engaged on the slider, so as to enable the slider to drive the accommodating device to move along the extension direction of the accommodating device when the crank makes a circumferential motion.

[0011] In addition, the second conveying unit is located at the bottom of the first conveying unit away from the containing device, and the second conveying unit includes a component for making the first conveying unit perform linear reciprocating motion.

[0012] In addition, the locking device and the opening portion have a connection point, the locking device has a first thread at the connection point, and the opening portion has a second thread at the connection point, and the first thread and the second thread are adapted to ensure that the opening portion is sealed and connected to the pipe.

[0013] In addition, the locking drive device includes: a driving wheel, a driven wheel and an annular belt tensioned on the driving wheel and the driven wheel, the pipeline passes through the center of the driven wheel and is connected to the opening, and the driven wheel is coaxially arranged with the locking device.

[0014] In addition, the locking drive device includes: a first gear and a second gear meshing with the first gear, the pipeline passes through the center of the second gear and is connected with the opening, and the second gear is coaxially arranged with the locking device.

[0015] In addition, the locking drive device further includes: a judging unit, configured to judge whether the accommodating device has reached the preset position.

[0016] In addition, the judgment unit includes: a laser emitting unit and a laser receiving unit, and the laser emitting unit is in a normally open state. If the laser receiving unit does not receive the laser, it indicates that the accommodating device has reached the preset position.

[0017] In addition, if the driving control device determines that the remaining amount of the storage medium is less than the preset value, the driving control device generates a first driving signal to drive the locking driving device to move, so that the locking driving device separates the opening portion from the locking device; the driving control device also receives the judgment information of whether the accommodating device has reached the preset position determined by the judgment unit. If the accommodating device reaches the preset position, the driving control device generates a second driving signal to drive the locking driving device to move, so that the locking driving device locks the opening portion and the locking device.

[0018] In addition, the sensing device also includes acquiring the current position of the accommodating device; the driving control device is also used to generate a third driving signal to drive the conveying device according to the current position of the accommodating device.

[0019] Additionally, the sensing device includes a position sensor and a flow meter.

[0020] Furthermore, the position sensor is located on the receiving device or on the conveying device.

[0021] The technical solution provided by the embodiments of the present application has at least the following advantages:

[0022] In the above technical solution, a sensing device, a conveying device, a driving device and other devices for realizing automation are arranged in the semiconductor device. The remaining amount of the storage medium in the storage device is obtained in real time by the sensing device, and the driving control device is used to judge whether the remaining amount of the storage medium is less than the preset value. If the remaining amount of the storage medium is less than the preset value, the driving control device generates a driving signal, so that the locking driving device drives the locking device to move so that the locking device is separated from the opening part, and then the storage device is sent out of the semiconductor device by the conveying device, and a new storage device is replaced on the conveying device, and the storage device is sent into the semiconductor device by the conveying device. If the storage device reaches the preset position, the locking driving device drives the locking device to move so that the locking device locks the opening part, so that the storage device is connected with the pipeline, which is used to provide storage medium to the semiconductor device in the processing process. By using various devices of the semiconductor device to perform the above steps, the automatic replacement of the storage device in the semiconductor device can be realized, which is conducive to improving the automation degree of the semiconductor device and reducing the risk of storage medium leakage. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] One or more embodiments are exemplarily described by pictures in the corresponding drawings, and these exemplifications do not constitute limitations on the embodiments. Unless otherwise stated, the pictures in the drawings do not constitute proportional limitations.

[0024] Figure 1 A schematic diagram of a front view module in a semiconductor device provided in an embodiment of the present application;

[0025] Figure 2 for Figure 1 A schematic diagram of a local enlarged module of a semiconductor device including a locking drive device;

[0026] Figure 3 for Figure 1 A partial side view module diagram of a semiconductor device including a conveying device;

[0027] Figure 4 for Figure 1 Another partial side view module diagram of a semiconductor device including a conveying device;

[0028] Figure 5 for Figure 1 Another schematic diagram of a local enlarged module of a semiconductor device including a locking drive device;

[0029] Figure 6 for Figure 1 Schematic diagram of the front view module outside the semiconductor device. DETAILED DESCRIPTION

[0030] As can be seen from the background technology, the automation level of semiconductor equipment needs to be improved.

[0031] Analysis shows that the raw materials needed in many semiconductor devices are usually filled into containers at high pressure, such as cylinders used to store gases in ion implantation equipment. The gases used in ion implantation processes include toxic gases such as arsine, phosphine or boron trifluoride, which are extremely toxic and can cause fatal harm to operators if inhaled into their respiratory tract.

[0032] When the gas in the cylinder is exhausted, there are the following problems when the operator replaces the cylinder:

[0033] First, when the gas runs out, operators are required to manually remove and install the cylinders. Replacing the cylinders is time-consuming, and the efficiency of replacement varies depending on the operator.

[0034] Secondly, during the process of replacing the cylinder, the operator needs to open the semiconductor equipment that stores the cylinder, and the cylinder is directly exposed to the environment. If a leak occurs, the gas will diffuse into the environment and cause damage to the surrounding environment.

[0035] Third, affected by factors such as the operator's proficiency and the operator's working status, the risk of gas leakage caused by improper operation by the operator is high.

[0036] The present application provides a semiconductor device, in which a sensing device, a conveying device, a driving control device and other devices for realizing automation are arranged. If it is sensed that the remaining amount of the storage medium is less than a preset value, the driving control device generates a driving signal, so that the locking driving device drives the locking device to move so that the locking device is separated from the opening part, and the containing device is sent out of the semiconductor device by the conveying device, and a new containing device is replaced on the conveying device, and the containing device is sent into the semiconductor device by the conveying device. If the containing device reaches the preset position, the locking driving device drives the locking device to move so that the locking device locks the opening part, so that the containing device is connected to the pipeline. Therefore, by using various devices of the semiconductor device to perform the above steps, the automatic replacement of the containing device can be realized in the semiconductor device, which is conducive to improving the automation degree of the semiconductor device and reducing the risk of storage medium leakage, and is also conducive to stabilizing and improving the replacement efficiency of the containing device.

[0037] The following will describe the various embodiments of the present application in detail with reference to the accompanying drawings. However, it will be appreciated by those skilled in the art that in the various embodiments of the present application, many technical details are provided in order to enable the reader to better understand the present application. However, even without these technical details and various changes and modifications based on the following embodiments, the technical solution claimed in the present application can be implemented.

[0038] Figure 1 A schematic diagram of a front view module in a semiconductor device provided in an embodiment of the present application; Figure 2 for Figure 1 A schematic diagram of a local enlarged module of a semiconductor device including a locking drive device; Figure 3 for Figure 1 A partial side view module diagram of a semiconductor device including a conveying device; Figure 4 for Figure 1 Another partial side view module diagram of a semiconductor device including a conveying device; Figure 5 for Figure 1 Another schematic diagram of a local enlarged module of a semiconductor device including a locking drive device; Figure 6 for Figure 1 Schematic diagram of the front view module outside the semiconductor device.

[0039] refer to Figures 1 to 4 The semiconductor device comprises: a pipeline 100 and a receiving device 101, the receiving device 101 has a control valve 111 and an opening 121, the control valve 111 controls the opening 121 to be in an on or off state, the pipeline 100 has a locking device 102, the locking device 102 is suitable for locking the opening 121, so that the receiving device 101 is connected to the pipeline 100; a sensing device 103, used to obtain the remaining amount of the storage medium in the receiving device 101; a conveying device 104, the receiving device 101 is located on the conveying device 104, and the conveying device 104 is used to move the receiving device 101 along the extension direction X of the receiving device 101 and along the direction perpendicular to the receiving device 101 The device 101 moves in the direction Y along the extension direction X so that the accommodating device 101 is transferred to the preset position; the locking drive device 105 is fixedly connected to the locking device 102. If the accommodating device 101 reaches the preset position, the locking drive device 105 drives the locking device 102 to move so that the locking device 102 locks the opening 121, and if the remaining amount of the storage medium is less than the preset value, the locking drive device 105 drives the locking device 102 to move so that the locking device 102 is separated from the opening 121; the drive control device 106 is used to determine whether the remaining amount of the storage medium is less than the preset value, and generate a drive signal to drive the locking drive device 105 to move.

[0040] It should be noted that the pipeline 100, the containing device 101, the locking device 102, the sensing device 103, the conveying device 104, the locking driving device 105 and the driving control device 106 are all located in the chamber 108 of the semiconductor device.

[0041] The storage device 101 further includes a storage portion 131 for storing a storage medium. In some embodiments, the semiconductor device includes an ion implantation device, and the storage medium may be a gas, that is, the storage portion 131 stores a gas filled with high pressure into the storage portion 131, and the pipeline 100 is a gas pipeline. In other embodiments, the semiconductor device includes an etching processing device, and the storage medium may also be a liquid, that is, the storage portion stores a liquid, and the pipeline is a liquid pipeline.

[0042] In the semiconductor device, if the remaining amount of the storage medium obtained by the sensing device 103 is less than the preset value, the driving control device 106 generates a driving signal, so that the locking driving device 105 drives the locking device 102 to move so that the locking device 102 is separated from the opening 121, and the receiving device 101 is sent out of the semiconductor device by the conveying device 104, and a new receiving device 101 is replaced on the conveying device 104, and the receiving device 101 is transported to a preset position by the conveying device 104, and then the locking driving device 105 drives the locking device 102 to move so that the locking device 102 locks the opening 121, so that the receiving device 101 is sealed and connected with the pipeline 100. In this way, the automatic replacement of the receiving device 101 can be realized in the semiconductor device, and the replacement efficiency and the risk of storage medium leakage are less affected by the operator, which is conducive to improving the automation degree of the semiconductor device and reducing the risk of storage medium leakage, and is also conducive to stabilizing and improving the replacement efficiency of the receiving device 101.

[0043] It should be noted that the specific circumstances in which the control valve 111 controls the opening 121 to be in an on or off state include at least: if the locking device 102 locks the opening 121, the control valve 111 controls the opening 121 to be in an on state; if the locking device 102 is separated from the opening 121, the control valve 111 controls the opening 121 to be in a off state, thereby avoiding leakage of the storage medium in the container 101 during automatic replacement of the container 101.

[0044] The receiving device 101 corresponds to the pipeline 100, the locking device 102, the sensing device 103 and the conveying device 104. Figure 1 The number of the accommodating devices 101 is taken as an example. In actual applications, the number of the accommodating devices 101 can be reasonably set according to the needs of semiconductor equipment.

[0045] The embodiments of the present application will be described in more detail below with reference to the accompanying drawings.

[0046] In some embodiments, the sensing device 103 can not only obtain the remaining amount of the storage medium in the receiving device 101, but also obtain the current position of the receiving device 101. For example, the sensing device 103 can include a flow meter 113 and a position sensor 123.

[0047] When the storage medium in the containing device 101 is gas, the flowmeter 113 can be a gas flowmeter. At this time, the preset value of the storage medium can be one percent of the capacity of the containing device or close to 0. When the remaining amount of the storage medium reaches the preset value, the flow rate of the flowmeter 113 will decrease, and the remaining amount of the storage medium can be judged by the flow rate change of the flowmeter 113; when the storage medium in the containing device 101 is liquid, the flowmeter 113 can be a liquid flowmeter.

[0048] In addition, the position sensor 123 may be located on the accommodating device 101 or on the conveying device 104 to obtain the current position of the accommodating device 101 in real time.

[0049] In some embodiments, the drive control device 106 may include: a control unit (not marked) for determining the relationship between the margin and a preset value; and a drive unit (not marked) for generating a drive signal for driving the locking drive device 105 to move.

[0050] The drive control device 106 can also be used to generate a third drive signal for driving the transmission device 104 according to the current position of the accommodating device 101. The drive control device 106 can also determine whether the accommodating device 101 has reached the preset position, and generate a drive signal for driving the locking drive device 105 to move. When the drive control device 106 includes a control unit and a drive unit, the control unit can also receive the current position of the accommodating device 101 sensed by the position sensor 123, and determine whether the accommodating device 101 has reached the preset position accordingly. The drive unit can also generate a drive signal for driving the locking drive device 105 to move. For example, the position sensor obtains the current position of the accommodating device 101 in real time, and transmits the current position information of the accommodating device 101 to the control unit in the drive control device 106. When the control unit determines that the accommodating device 101 is located at the preset position, the drive unit generates a drive signal for driving the locking drive device 105 to move.

[0051] It should be noted that how the drive control device 106 generates the third drive signal for driving the transmission device 104 according to the current position of the accommodating device 101 will be described in detail later.

[0052] In other embodiments, the locking drive device 105 may include: a judgment unit 185, which is used to judge whether the accommodating device 101 has reached the preset position. If the judgment unit 185 judges that the accommodating device 101 has reached the preset position, the judgment information is transmitted to the drive control device 106, and the drive control device 106 generates a drive signal to drive the locking drive device 105 to move.

[0053] It should be noted that in the above two embodiments, if the accommodating device 101 reaches the preset position, the driving control device 106 generates a driving signal for driving the locking driving device 105 to move, and if the remaining amount of the storage medium is less than the preset value, the driving control device 106 generates a driving signal for driving the locking driving device 105 to move, which is different. The two driving signals will be described in detail later.

[0054] In some embodiments, the conveying device 104 may include: a first conveying unit 114, on which the accommodating device 101 is located, and the first conveying unit 114 is used to move the accommodating device 101 along the extension direction X of the accommodating device 101; a second conveying unit 124, which is in contact with and connected to the first conveying unit 114, and is used to enable the first conveying unit 114 to drive the accommodating device 101 to move in a direction perpendicular to the extension direction X of the accommodating device 101, and the first conveying unit 114 and the second conveying unit 124 are used together to convey the accommodating device 101 to a preset position.

[0055] In this way, the movement of the conveying device 104 can drive the containing device 101 to move in two directions, direction X and direction Y, so that the containing device 101 can reach a preset position, and then the opening 121 is locked with the locking device 102 through the locking drive device 105 to supply the storage medium in the containing device 101 to the semiconductor device.

[0056] It should be noted that if the remaining amount of the storage medium is less than the preset value, the locking device 102 is separated from the opening portion 121, the second transmission unit is used to move the accommodating device 101 in a direction opposite to direction Y to a predetermined position, the first transmission unit is used to move the accommodating device 101 in a direction opposite to direction X to the outside of the semiconductor device, the new accommodating device 101 is replaced on the second transmission unit, and then the first transmission unit is used to move the accommodating device 101 in direction X to a predetermined position, and the second transmission unit is used to move the accommodating device 101 in direction Y to a preset position.

[0057] In a specific application scenario, the accommodating device 101 can be first transported to a predetermined position by the first conveying unit 114, and then when the first conveying unit 114 is driven to move by the second conveying unit 124, the first conveying unit 114 drives the accommodating device 101 to move to the preset position; in another specific application scenario, while the accommodating device 101 moves in the X direction with the first conveying unit 114, the first conveying unit 114 also moves in the Y direction with the second conveying unit 124, so that the accommodating device 101 also moves in the Y direction with the first conveying unit 114.

[0058] In other embodiments, the conveying device may also be a multifunctional conveying device, that is, in addition to moving the containing device in the X direction and the Y direction, the conveying device may also move the containing device in other directions. The embodiment of the present application does not restrict whether the containing device will move in directions other than the X direction and the Y direction through the conveying device, as long as the containing device can eventually move to a preset position and move outside the semiconductor device through the conveying device.

[0059] In some embodiments, when the conveying device 104 includes a first conveying unit 114 and a second conveying unit 124, the first conveying unit 114 may include: a first transmission unit and a second transmission unit adapted to the first transmission unit, and the accommodating device 101 is detachably connected to the second transmission unit, so that the second transmission unit drives the accommodating device 101 to move along the extension direction X of the accommodating device 101 when the first transmission unit makes a circumferential motion.

[0060] It should be noted that the detachable connection between the accommodating device 101 and the second transmission unit means that if the accommodating device 101 moves outside the semiconductor device and needs to be replaced, the accommodating device 101 can be removed from the second transmission unit; if the accommodating device 101 needs to move with the movement of the second transmission unit, the accommodating device 101 and the second transmission unit are detachably connected, for example, the accommodating device 101 and the second transmission unit are snap-fitted. In addition, the drive control device 106 can drive the first transmission unit to make a clockwise or counterclockwise circumferential motion, so that the second transmission unit drives the accommodating device 101 to make a reciprocating linear motion in the direction X, so as to realize the movement of the accommodating device 101 to a predetermined position or to the outside of the semiconductor device. In some embodiments, when the first transmission unit makes a clockwise circumferential motion, the accommodating device 101 is moved to a predetermined position.

[0061] The specific structures of the first transmission unit and the second transmission unit can be described at least through the following three embodiments.

[0062] In some embodiments, reference Figure 3 The first transmission unit 114 may include a slide rail 134 and a lead screw 144, wherein the first transmission unit includes the slide rail 134 and a screw 154 in the lead screw 144, and the extension direction of the slide rail 134 and the extension direction of the screw 154 are both the same as the extension direction X of the accommodating device 101; the second transmission unit includes a nut 164 in the lead screw 144, and the nut 164 is embedded in the slide rail 134, and the accommodating device 101 is engaged on the nut 164, and is used to make the nut 164 drive the accommodating device 101 to move along the extension direction X of the accommodating device 101 when the screw 154 makes a circumferential motion.

[0063] Among them, since the nut 164 is embedded in the slide rail 134, when the screw rod 154 makes a circumferential motion, the nut 164 is restricted by the slide rail 134 and can only make a reciprocating linear motion in the direction X. In addition, the nut 164 is equivalent to a tray for the receiving device 101, which is used to support the receiving device 101, and the nut 164 is detachably connected to the receiving device 101. In other embodiments, the nut may also have a tray fixedly connected to the nut, the tray is used to support the receiving device, and the tray is detachably connected to the receiving device.

[0064] In addition, when the position sensor 123 is located at the nut 164 in the conveying device 104, since the movement trajectories of the nut 164 and the containing device 101 are consistent, the current position of the containing device 101 can be indirectly obtained.

[0065] In other embodiments, reference Figure 4 The first transmission unit 114 may include a gear 174 and a rack 184 meshing with the gear 174, wherein the first transmission unit includes the gear 174; the second transmission unit includes the rack 184, and the accommodating device 101 is engaged with the rack 184, and is used to enable the rack 184 to drive the accommodating device 101 to move along the extension direction X of the accommodating device 101 when the gear 174 moves circumferentially.

[0066] The rack 184 drives the receiving device 101 to perform reciprocating linear motion in the direction X. In addition, the rack 184 is equivalent to a tray for the receiving device 101, which is used to support the receiving device 101, and the rack 184 is detachably connected to the receiving device 101. In other embodiments, the rack may also have a tray fixedly connected to the rack, and the tray is used to support the receiving device, and the tray is detachably connected to the receiving device.

[0067] In addition, when the position sensor 123 is located on the rack 184 in the conveying device 104, since the motion trajectories of the rack 184 and the accommodating device 101 are consistent, the current position of the accommodating device 101 can be indirectly obtained.

[0068] In other embodiments, the first transmission unit may include a slide rail and a crank slider mechanism, wherein the first transmission unit includes a crank in the crank slider mechanism; the second transmission unit includes a slide rail and a slider in the crank slider mechanism, and the extension direction of the slide rail is the same as the extension direction of the accommodating device, the slider is embedded in the slide rail, and the accommodating device is engaged on the slider, so that the slider drives the accommodating device to move along the extension direction of the accommodating device when the crank makes a circumferential motion.

[0069] Among them, since the slider is embedded in the slide rail, when the crank makes a circumferential motion, the slider is restricted by the slide rail and can only make a reciprocating linear motion in the direction X. In addition, the slider is equivalent to a tray for the receiving device, which is used to support the receiving device, and the slider is detachably connected to the receiving device 101. In other embodiments, the slider may also have a tray fixedly connected to the slider, the tray is used to support the receiving device, and the tray is detachably connected to the receiving device.

[0070] In addition, when the position sensor is located on a slider in the conveying device, the current position of the containing device can be indirectly obtained because the movement trajectories of the slider and the containing device are consistent.

[0071] It should be noted that the above three embodiments are only specific transmission mechanisms for enabling the accommodating device 101 to perform reciprocating linear motion in the X direction. In actual applications, the reciprocating linear motion of the accommodating device in the X direction can also be achieved through other transmission structures. For example, the reciprocating linear motion of the accommodating device in the X direction can also be achieved through belt transmission.

[0072] Combined with reference Figure 1 and Figure 3 The second conveying unit 124 is located at the bottom of the first conveying unit 114 away from the containing device 101, and the second conveying unit 124 includes a component for making the first conveying unit 114 perform linear reciprocating motion.

[0073] The second conveying unit 124 is used to realize the reciprocating linear motion of the first conveying unit 114 in the direction Y. In some embodiments, the second conveying unit 124 can be a pneumatic cylinder or a hydraulic cylinder. Since the first conveying unit 114 and the receiving device 101 are detachably connected, when the first conveying unit 114 performs reciprocating linear motion in the direction Y, it can drive the receiving device 101 to perform reciprocating linear motion in the direction Y.

[0074] How the drive control device 106 generates the third drive signal for driving the transmission device 104 according to the current position of the accommodating device 101 will be described in detail below.

[0075] In some embodiments, when the conveying device 104 includes a first conveying unit 114 and a second conveying unit 124, the third driving signal includes a fourth driving signal and a fifth driving signal for driving the first conveying unit 114, and a sixth driving signal and a seventh driving signal for driving the second conveying unit 124. For example, if the remaining amount of the storage medium obtained by the sensing device 103 is less than a preset value, the locking device 102 is separated from the opening 121, and at this time, the current position information of the accommodating device 101 obtained by the driving control device 106 from the sensing device 103 is the preset position of the accommodating device 101 when the locking device 102 is separated from the opening 121, then the driving control device 106 generates a sixth driving signal for driving the second conveying unit 124 to move in a direction opposite to the direction Y; if the current position information of the accommodating device 101 obtained by the driving control device 106 from the sensing device 103 is the preset predetermined position of the accommodating device 101, then the driving control device 106 controls the second conveying unit 124 to stop moving, and A fourth driving signal is generated to drive the first conveying unit 114 to move in a direction opposite to the direction X; if the current position information of the accommodating device 101 obtained by the driving control device 106 from the sensing device 103 is a pre-set position of the accommodating device 101 outside the semiconductor device, the driving control device 106 generates a fifth driving signal to drive the first conveying unit 114 to move in the direction X; if the current position information of the accommodating device 101 obtained by the driving control device 106 from the sensing device 103 is again a pre-set predetermined position of the accommodating device 101, the driving control device 106 controls the first conveying unit 114 to stop moving, and generates a seventh driving signal to drive the second conveying unit 124 to move in the direction Y.

[0076] It should be noted that there may be a certain time interval between the step of determining that the current position information of the accommodating device 101 is a certain preset position information and the step of the drive control device 106 generating a corresponding drive signal. In addition, in other embodiments, the determination unit may determine whether the locking device and the opening are in a locked state or a separated state, and transmit the state information to the drive control device, which then generates a sixth drive signal for driving the second transmission unit to move in a direction opposite to the direction Y or generates a seventh drive signal for driving the second transmission unit to move in the direction Y.

[0077] refer to Figures 1 to 3 The locking device 102 and the opening portion 121 have a connection, the locking device 102 has a first thread (not shown) at the connection, and the opening portion 121 has a second thread (not shown) at the connection, and the first thread and the second thread are adapted to make the opening portion 121 and the pipeline 100 sealed and connected.

[0078] In some embodiments, the first thread may be an external thread, and the second thread may be an internal thread; in other embodiments, the first thread may be an internal thread, and the second thread may be an external thread.

[0079] When the locking device 102 is connected to the opening portion 121 through threaded sealing, the specific structure of the locking drive device 105 can be described by at least the following two embodiments.

[0080] In some embodiments, reference Figure 2 The locking drive device 105 includes: a driving wheel 115, a driven wheel 125, and an annular belt 135 tensioned on the driving wheel 115 and the driven wheel 125. The pipeline 100 passes through the center of the driven wheel 125 and the opening 121 (reference Figure 1 ) are connected, and the driven wheel 125 is coaxially arranged with the locking device 102.

[0081] The driving control device 106 drives the driving wheel 115 to make a clockwise or counterclockwise circumferential motion, so that the driven wheel 125 drives the locking device 102 to make a clockwise or counterclockwise circumferential motion, so as to achieve the locking or separation between the locking device 102 and the opening 121. In some embodiments, when the locking device 102 makes a clockwise circumferential motion, the locking device 102 and the opening 121 are locked.

[0082] In other embodiments, reference Figure 5 The locking drive device 105 includes: a first gear 145 and a second gear 155 meshing with the first gear 145 , the pipe 100 passes through the center of the second gear 155 and is connected to the opening 121 , and the second gear 155 is coaxially arranged with the locking device 102 .

[0083] The driving control device 106 drives the first gear 145 to make a clockwise or counterclockwise circumferential motion, so that the second gear 155 drives the locking device 102 to make a clockwise or counterclockwise circumferential motion, so as to achieve locking or separation between the locking device 102 and the opening 121. In some embodiments, when the locking device 102 makes a clockwise circumferential motion, the locking device 102 and the opening 121 are locked.

[0084] In the above two embodiments, a bearing 107 is further provided between the locking device 102 and the driven wheel 125 and the pipeline 100, so that when the locking device 102 and the driven wheel 125 make circumferential motion, the pipeline 100 does not make circumferential motion.

[0085] It should be noted that the above two embodiments are only specific transmission mechanisms for making the locking device 102 perform circumferential motion. In practical applications, the circumferential motion of the locking device can also be achieved through other transmission structures.

[0086] In the above various embodiments, when the locking drive device 105 includes a judgment unit 185, the judgment unit may include: a laser emitting unit 165 and a laser receiving unit 175, and the laser emitting unit 165 is in a normally open state. If the laser receiving unit 175 does not receive the laser, it indicates that the accommodating device 101 has reached the preset position.

[0087] How the drive control device 106 generates a drive signal for driving the locking drive device 105 to move will be described in detail below.

[0088] In some embodiments, if the remaining amount of the storage medium determined by the drive control device 106 is less than a preset value, the drive control device 106 generates a first drive signal to drive the locking drive device 105 to move, so that the locking drive device 105 separates the opening 121 from the locking device 102; the drive control device 106 also receives the judgment information of whether the accommodating device 101 has reached the preset position determined by the judgment unit 185. If the accommodating device 101 has reached the preset position, the drive control device 106 generates a second drive signal to drive the locking drive device 105 to move, so that the locking drive device 105 locks the opening 121 with the locking device 102. In addition, in other embodiments, the current position of the accommodating device obtained from the position sensor by the drive control device can be compared with a preset position, thereby generating a second drive signal to drive the locking drive device to move.

[0089] In addition, in the above-mentioned embodiments, the motor that moves the conveying device 104 and the locking drive device 105 can be the same, or different motors can control different motion devices. In some embodiments, when the conveying device 104 includes a first conveying unit 114 and a second conveying unit 124, and the second conveying unit 124 is a pneumatic cylinder or a hydraulic cylinder, the motor that controls the first conveying unit 114 and the motor that controls the locking drive device 105 can be different.

[0090] In some embodiments, the semiconductor device also includes: a first solenoid valve 110 and a second solenoid valve 120 located on the pipeline 100, wherein the first solenoid valve 110 is located on the side of the flow meter 113 away from the locking device 120, and is used to regulate the flow rate of the storage medium supplied to the semiconductor device, and the second solenoid valve 120 is located on the side of the flow meter 113 close to the locking device 120, and is used to control whether the storage medium is supplied to the semiconductor device.

[0091] In some embodiments, reference Figure 6, an isolation valve 118, a connecting rod 128 and a driving unit 138 are located on the side wall outside the semiconductor equipment chamber 108, wherein one end of the connecting rod 128 is fixedly connected to the isolation valve 118, and the driving unit 138 is fixedly connected to the other end of the connecting rod 128 away from the isolation valve 118.

[0092] In a specific application scenario, when the containing device 101 moves from the inside of the chamber 108 to the isolation valve 118, the driving unit 138 controls the connecting rod 128 to move in the direction Y, and the isolation valve 118 also moves in the direction Y with the movement of the connecting rod 128, so as to open the chamber 108 of the semiconductor device, so that the containing device 101 can move to the outside of the semiconductor device. It should be noted that the position information of the containing device 101 when approaching the isolation valve 118 can be pre-set, and then the driving control device 106 determines whether the current position information of the containing device 101 detected by the position sensor 123 is the pre-set information, and then the driving control device 106 generates a driving signal to move the driving unit 138. In special cases, the driving unit 138 can be controlled by an operator. In this way, when the storage medium leaks in the semiconductor device of the storage device 101, corresponding measures can be taken, such as the operator controlling the driving unit 138 to prevent the isolation valve 118 from moving in the direction Y, preventing the storage medium from diffusing to the outside of the semiconductor device, and preventing harm to the human body and the external environment, thereby further reducing the risk of the storage medium leaking to the outside of the semiconductor device. In other embodiments, the driving unit can also be controlled by the operator all the time.

[0093] It should be noted that Figure 6 In the example, one containing device 101 corresponds to one isolating valve 118. In practical applications, multiple containing devices may correspond to the same isolating valve, that is, there is no restriction on the correspondence between the containing devices and the isolating valves.

[0094] To sum up, the semiconductor device is provided with a sensing device 103, a conveying device 104, a driving control device 106 and other devices for realizing automation. If it is sensed that the remaining amount of the storage medium is less than a preset value, the driving control device 106 generates a driving signal, so that the locking driving device 105 drives the locking device 102 to move so that the locking device 102 is separated from the opening 121, and the containing device 101 is sent out of the semiconductor device through the conveying device 104, and a new containing device 101 is replaced on the conveying device 104, and the containing device 01 is sent into the semiconductor device through the conveying device 104. If the containing device 101 reaches the preset position, the locking driving device 105 drives the locking device 102 to move so that the locking device 102 locks the opening 121, so that the containing device 101 is connected to the pipeline 100. Therefore, by performing the above steps using various devices of the semiconductor equipment, it is possible to realize automatic replacement of the container 101 in the semiconductor equipment, which is beneficial to improving the automation level of the semiconductor equipment and reducing the risk of storage medium leakage, and is also beneficial to stabilizing and improving the replacement efficiency of the container 101.

[0095] Those skilled in the art can understand that the above-mentioned embodiments are specific examples for implementing the present application, and in practical applications, various changes can be made to them in form and detail without departing from the spirit and scope of the present application. Any person skilled in the art can make their own changes and modifications without departing from the spirit and scope of the present application, so the scope of protection of the present application shall be based on the scope defined in the claims.

Claims

1. A semiconductor device, It is characterized in that include: A pipeline and a receiving device, wherein the receiving device has a control valve and an opening, wherein the control valve controls the opening to be in an on or off state, and the pipeline has a locking device, wherein the locking device is adapted to lock the opening so that the receiving device is connected to the pipeline; A sensing device, used for obtaining the remaining amount of the storage medium in the containing device; A conveying device, on which the accommodating device is located, and the conveying device is used to move the accommodating device along an extension direction of the accommodating device and along a direction perpendicular to the extension direction of the accommodating device, so as to transfer the accommodating device to a preset position; a locking drive device, fixedly connected to the locking device, wherein if the accommodating device reaches the preset position, the locking drive device drives the locking device to move so that the locking device locks the opening, and if the remaining amount of the storage medium is less than a preset value, the locking drive device drives the locking device to move so that the locking device is separated from the opening; The drive control device is used to determine whether the remaining amount of the storage medium is less than the preset value, and generate a drive signal to drive the locking drive device to move.

2. The semiconductor device according to claim 1, It is characterized in that The transmission device comprises: a first conveying unit, the accommodating device is located on the first conveying unit, and the first conveying unit is used to move the accommodating device along an extending direction of the accommodating device; The second conveying unit is in contact with and connected to the first conveying unit, and is used to enable the first conveying unit to drive the accommodating device to move in a direction perpendicular to the extending direction of the accommodating device. The first conveying unit and the second conveying unit are used together to convey the accommodating device to the preset position.

3. The semiconductor device according to claim 2, It is characterized in that The first transmission unit includes: a first transmission unit and a second transmission unit adapted to the first transmission unit, and the accommodating device is detachably connected to the second transmission unit, so that the second transmission unit drives the accommodating device to move along the extension direction of the accommodating device when the first transmission unit makes a circumferential motion.

4. The semiconductor device according to claim 3, It is characterized in that The first transmission unit includes a slide rail and a lead screw, wherein: The first transmission unit includes the slide rail and a screw in the lead screw, and the extending direction of the slide rail and the extending direction of the screw are both the same as the extending direction of the accommodating device; The second transmission unit includes a nut in the lead screw, and the nut is embedded in the slide rail. The accommodation device is engaged with the nut, and is used to enable the nut to drive the accommodation device to move along the extension direction of the accommodation device when the screw rod moves circumferentially.

5. The semiconductor device according to claim 3, It is characterized in that The first transmission unit includes a gear and a rack meshing with the gear, wherein: The first transmission unit includes the gear; The second transmission unit includes the rack, and the accommodating device is engaged with the rack, so that the rack drives the accommodating device to move along the extending direction of the accommodating device when the gear moves circumferentially.

6. The semiconductor device according to claim 3, It is characterized in that The first transmission unit includes a slide rail and a crank slider mechanism, wherein: The first transmission unit includes a crank in the crank slider mechanism; The second transmission unit includes a slide rail and a slider in the crank slider mechanism, and the extension direction of the slide rail is the same as the extension direction of the accommodating device. The slider is embedded in the slide rail, and the accommodating device is engaged on the slider, so that the slider drives the accommodating device to move along the extension direction of the accommodating device when the crank makes a circumferential motion.

7. The semiconductor device according to claim 2, It is characterized in that The second conveying unit is located at the bottom of the first conveying unit away from the containing device, and the second conveying unit includes a component for making the first conveying unit perform linear reciprocating motion.

8. The semiconductor device according to claim 1, It is characterized in that The locking device and the opening have a connection point, the locking device has a first thread at the connection point, and the opening has a second thread at the connection point, and the first thread and the second thread are adapted to enable the opening to be sealed and connected to the pipe.

9. The semiconductor device according to claim 8, It is characterized in that The locking drive device comprises: A driving wheel, a driven wheel and an annular belt tensioned on the driving wheel and the driven wheel, the pipeline passes through the center of the driven wheel and is connected with the opening, and the driven wheel is coaxially arranged with the locking device.

10. The semiconductor device according to claim 8, It is characterized in that The locking drive device comprises: A first gear and a second gear meshing with the first gear, the pipeline passes through the center of the second gear and is connected with the opening, and the second gear is coaxially arranged with the locking device.

11. The semiconductor device according to claim 1, 9 or 10, It is characterized in that The locking drive device further includes: a judging unit, configured to judge whether the accommodating device has reached the preset position.

12. The semiconductor device according to claim 11, It is characterized in that The judging unit comprises: a laser emitting unit and a laser receiving unit, and the laser emitting unit is in a normally open state. If the laser receiving unit does not receive the laser, it indicates that the accommodating device has reached the preset position.

13. The semiconductor device according to claim 11, It is characterized in that If the remaining amount of the storage medium determined by the drive control device is less than the preset value, the drive control device generates a first drive signal to drive the locking drive device to move, so that the locking drive device separates the opening portion from the locking device; the drive control device also receives the judgment information of whether the accommodating device has reached the preset position determined by the judgment unit; if the accommodating device reaches the preset position, the drive control device generates a second drive signal to drive the locking drive device to move, so that the locking drive device locks the opening portion and the locking device.

14. The semiconductor device according to claim 1, It is characterized in that The sensing device also includes acquiring the current position of the accommodating device; the driving control device is also used to generate a third driving signal for driving the conveying device according to the current position of the accommodating device.

15. The semiconductor device according to claim 14, It is characterized in that The sensing device includes a position sensor and a flow meter.

16. The semiconductor device according to claim 15, It is characterized in that The position sensor is located on the receiving device or on the conveying device.

Citation Information

Patent Citations

  • Transferring method, manufacture method and manufacture device of single chip articles

    CN105304542A

  • Device and method for monitoring the leak-tightness of a transport enclosure for the atmospheric conveyance and storage of semiconductor substrates

    CN109937473A