Semiconductor packaging device and semiconductor packaging method

Abstract

The present invention discloses a semiconductor packaging device and a semiconductor packaging method, the device includes a mounting frame, a template and a packaging hole opened on the template, and also includes a packaging mechanism, the packaging mechanism mainly includes a pressing plate and a glue storage box installed on the pressing plate; the connecting plate is arranged above the glue storage box, and the upper side is connected to a telescopic mechanism for driving the connecting plate to move; the hose is connected to the lower side of the connecting plate in an array manner, and is movably passed through the wall of the glue storage box and extends into the pressing plate, the hose is provided with a glue hole on the tube wall inside the glue storage box, and an electromagnetic valve is installed at the lower end of the hose; the modules are embedded in the lower side of the pressing plate in an array manner, each module corresponds to the packaging hole and the hose one by one and is provided with a channel, and the hose passes through the channel of the module; using the device for packaging, the entire semiconductor can be completely sealed in glue, the semiconductor is fully protected, the packaging effect is good, and the protection effect can be improved.

Description

Technical Field

[0001] The present invention relates to the technical field of packaging equipment, and in particular to a semiconductor packaging equipment and a semiconductor packaging method. Background Art

[0002] Semiconductor packaging is the process of covering the circuits arranged on the semiconductor, effectively preventing the semiconductor circuits from contacting with the air and reducing the rate of circuit aging. At the same time, the packaged semiconductor can cope with relatively harsh working environments and effectively extend the service life of the semiconductor.

[0003] In the existing technology, due to the small size and difficulty in handling of semiconductors, only the side of the semiconductor equipped with circuits is often packaged, which cannot provide good protection for the semiconductor as a whole. Moreover, after packaging, manual unloading is usually required, which is time-consuming and labor-intensive, and the unloading efficiency is low, which urgently needs to be improved. Summary of the Invention

[0004] The purpose of the present invention is to provide a semiconductor packaging device and a semiconductor packaging method to solve the following technical problems:

[0005] (1) In the prior art, due to the small size and difficulty in handling of semiconductors, only one side of the semiconductor equipped with circuits is usually packaged, which does not provide good protection for the semiconductor as a whole.

[0006] (2) After packaging, manual unloading is usually required, which is time-consuming and labor-intensive. The unloading efficiency is low and needs to be improved urgently.

[0007] The purpose of the present invention can be achieved through the following technical solutions:

[0008] A semiconductor packaging device comprising

[0009] The mounting frame mainly includes

[0010] The mounting platform has an upper surface with a through hole.

[0011] The supporting legs are fixedly mounted on the lower side of the mounting platform.

[0012] The mounting plate is mounted on one side of the upper surface of the mounting platform.

[0013] The template is fixedly mounted on the upper portion of the through hole formed on the mounting platform.

[0014] Packaging holes are arranged in an array on the upper surface of the template.

[0015] The packaging mechanism is flip-mounted on the top through a flip mechanism, and the packaging mechanism mainly includes

[0016] Pressure plate,

[0017] A glue storage box is fixedly mounted on the pressing plate.

[0018] The connecting plate is arranged above the glue storage box, and the upper side is connected to a telescopic mechanism for driving the connecting plate to move.

[0019] The rubber hose is connected to the lower side of the connecting plate in an array, and is movably passed through the wall of the rubber storage box and extends into the pressure plate. The rubber hose is provided with a rubber hole on the tube wall inside the rubber storage box, and a solenoid valve is installed at the lower end of the rubber hose.

[0020] Modules are embedded in an array on the lower side of the pressing plate. Each module corresponds to a packaging hole and a hose one by one and is provided with a channel. The hose passes through the channel of the module.

[0021] A gluing system, wherein the glue outlet end of the gluing system is connected to the glue storage box.

[0022] The movable plate is movably mounted on the lower side of the mounting platform.

[0023] In a further embodiment: the gluing system mainly includes

[0024] A material box is provided with a pump body.

[0025] A delivery pipe, one end of which is connected to the pump body and the other end of which is connected to the glue storage box.

[0026] In a further embodiment: the telescopic mechanism mainly includes

[0027] The installation box is fixedly installed on the upper side of the glue storage box.

[0028] The expander is fixedly installed inside the installation box, and the extended end of the expander is connected to the connecting plate.

[0029] In a further solution: the movable plate is movably arranged on the mounting frame and one end of the movable plate is connected to a driving mechanism. The movable plate mainly includes

[0030] bottom plate,

[0031] The leakage plate is seamlessly connected to the bottom plate and is provided with leakage holes for allowing the packaged semiconductors to pass through.

[0032] In a further solution: a collection box is detachably mounted below the movable plate, and the collection box is disposed between the two legs.

[0033] In a further embodiment, the modules are refrigeration blocks, and several of the modules are electrically connected and refrigeration is controlled by a refrigeration unit.

[0034] A packaging method for the semiconductor packaging device as described above comprises the following steps:

[0035] Step 1: Start the driving mechanism to drive the bottom plate to move to the bottom of the template to seal the lower end of the packaging hole, and then drive the packaging mechanism to move to a horizontal state and be located above the template through the flip mechanism.

[0036] Step 2: Start the gluing system to feed glue into the glue storage box. When the glue is full in the glue storage box and the glue hose, open the solenoid valve of the glue hose and inject an appropriate amount of glue into the packaging hole through the glue hose so that the glue is spread horizontally on the bottom plate at the bottom end of the packaging hole. Then, the packaging mechanism is reset by the flip mechanism.

[0037] Step 3: Place the semiconductor to be packaged into each packaging hole, and then use the flip mechanism to drive the packaging mechanism to move again to the top of the template until each module is stuck in the upper end of the packaging hole.

[0038] Step 4: Start the gluing system so that the glue hose injects a certain amount of glue into the packaging hole so that the glue fills the entire packaging hole. Start the retractor to move the glue hose upward until it is no longer in contact with the glue in the packaging hole.

[0039] Step 5: Start the refrigeration unit to cool the module so that the glue can be quickly cooled and set.

[0040] Step 6: Start the driving mechanism to drive the bottom plate away from the bottom of the template so that the leak plate moves to the bottom of the template, and at the same time start the telescopic device to drive the hose downward to squeeze the packaged semiconductor out of the packaging hole and drop it onto the collection box.

[0041] Beneficial effects of the present invention:

[0042] (1) The use of this equipment for packaging can completely seal the entire semiconductor in glue, providing comprehensive protection for the semiconductor, with good packaging effect and improved protection effect;

[0043] (2) After the semiconductor is packaged, it can be automatically unloaded without manual demolding, which can save time and labor and improve the overall packaging efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] The present invention will be further described below with reference to the accompanying drawings.

[0045] Figure 1 It is a structural schematic diagram of the present invention;

[0046] Figure 2 In the present invention Figure 1Front view of

[0047] Figure 3 In the present invention Figure 2 A partial structural enlarged schematic diagram;

[0048] Figure 4 It is a structural schematic diagram of the present invention in a working state.

[0049] Description of the figures in the figure:

[0050] 100, mounting frame; 110, mounting platform; 120, supporting legs; 130, mounting plate;

[0051] 200, template;

[0052] 300, packaging hole;

[0053] 400, packaging mechanism; 410, pressing plate; 420, glue storage box; 430, installation box; 440, retractor; 450, connecting plate; 460, hose; 470, module; 480, refrigeration unit;

[0054] 500, gluing system; 510, material box; 520, conveying pipe;

[0055] 600, movable plate; 610, bottom plate; 620, drain plate;

[0056] 700, driving mechanism;

[0057] 800. Collection box. DETAILED DESCRIPTION

[0058] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts shall fall within the scope of protection of the present invention.

[0059] See also Figure 1-4 As shown, the present invention is a semiconductor packaging device, comprising

[0060] The mounting frame 100 mainly includes a mounting platform 110, a support leg 120 and a mounting plate 130. A through hole is provided on the upper surface of the mounting platform 110. The shape of the through hole can be formulated according to actual conditions, such as rectangular or circular. Preferably, in the embodiment of the present invention, the through hole is rectangular; the support leg 120 is fixedly mounted on the lower side of the mounting platform 110, and the support leg 120 does not pass under the through hole provided on the mounting platform 110 to avoid affecting the subsequent production process. On this basis, the support leg 120 can be any structure that plays a good supporting role for the mounting platform 110; the mounting plate 130 is installed on one side of the upper surface of the mounting platform 110 and is located at the edge of the through hole. It can also be on any side of the front, back, left, or right. For example, in the embodiment of the present invention, please see Figure 1 The mounting plate 130 is disposed on the left side of the upper surface of the mounting platform 110 .

[0061] Template 200, template 200 is fixedly mounted on the upper part of the through hole opened in the mounting platform 110, the shape of the template 200 is consistent with the shape of the through hole, and the outer wall size of the template 200 is consistent with the inner wall size of the through hole. The template 200 can be fixedly mounted in the through hole in a variety of ways, such as welding, gluing, and riveting. In an embodiment of the present invention, the template 200 and the inner wall of the through hole are connected by welding.

[0062] The packaging holes 300 are arranged in an array on the upper surface of the template 200. The number and shape of the packaging holes 300 are not limited and can be formulated according to actual production needs (production volume, semiconductor shape and size, etc.). For example, in the embodiment of the present invention, please see Figure 1 The packaging holes 300 are arranged in a rectangular array of 6 rows and 9 columns on the template 200, and the shape of the packaging holes 300 is square.

[0063] The packaging mechanism 400 is flip-mounted on the mounting plate 130 via a flip mechanism. The flip mechanism can be any mechanism that can flip. For example, in an embodiment of the present invention, the flip mechanism uses a motor and a rotating shaft to achieve a flip effect. The packaging mechanism 400 mainly includes

[0064] The pressing plate 410 has a shape that is the same as or similar to that of the template 200 .

[0065] The glue storage box 420 is fixedly mounted on the pressing plate 410 . The glue storage box 420 is used to store packaging glue and has the same shape and size as the pressing plate 410 .

[0066] The connecting plate 450 is arranged above the glue storage box 420, and the upper side is connected to a telescopic mechanism for driving the connecting plate 450 to move. The telescopic mechanism can be any mechanism that can achieve a telescopic effect on the connecting plate 450, such as an electric telescopic rod, an electric cylinder, a screw transmission mechanism, etc. In the embodiment of the present invention, please see Figure 3 The telescopic mechanism preferably includes an installation box 430 and a cylinder telescope 440. The installation box 430 is fixedly installed on the upper side of the glue storage box 420. The telescope 440 is fixedly installed inside the installation box 430, and the extended end of the telescope 440 is connected to the connecting plate 450. Then, when the telescope 440 is started, the connecting plate 450 can be driven to perform telescopic movement.

[0067] The rubber hose 460 is connected to the lower side of the connecting plate 450 in an array, and is movably arranged through the wall of the glue storage box 420 and extends into the pressing plate 410. The rubber hose 460 is provided with a rubber hole on the wall of the glue storage box 420, and a solenoid valve is installed at the lower end of the rubber hose 460;

[0068] Module 470, module 470 is embedded in an array on the lower side of the pressure plate 410, each module 470 corresponds to the packaging hole 300 and the hose 460 one by one and is provided with a channel, and the hose 460 passes through the module 470; when the packaging mechanism 400 is working, the packaging mechanism 400 will be in a horizontal state as a whole through the flipping mechanism. At this time, when the telescopic mechanism is started, it will drive each hose 460 to move in the channel through the connecting plate 450. In a normal state, the bottom end of the hose 460 is flush with the lower side of the module 470, so under the action of the telescopic mechanism, the hose 460 will move upward to the lower end to detach from the lower side of the module 470 and enter the channel, or move downward to extend out of the channel; it should be noted that no matter whether the hose 460 moves up or down, the glue hole on the hose 460 is always located in the glue storage box 420, thereby preventing glue from seeping out.

[0069] The gluing system 500, the glue outlet end of the gluing system 500 is connected to the glue storage box 420, and the gluing system 500 is used to pour glue into the glue storage box 420; one thing that needs to be noted is that before starting the work, the glue storage box 420 needs to be prepared, that is: start the gluing system 500 to fill the glue storage box 420 with glue, and allow the glue to fill the inside of the hose 460 through the glue hole, then, when glue needs to be discharged, it is only necessary to open the solenoid valve in the hose 460, and continue to start the gluing system 500 to fill the glue storage box 420 with glue, and the glue in the glue storage box 420 can be squeezed into the inside of the hose 460 through the glue hole, so that the glue is discharged from the lower end of the hose 460, and glue discharge can be achieved.

[0070] The movable plate 600 is movably mounted on the lower side of the mounting platform 110 . The movable plate 600 is used to seal the lower side of the packaging hole 300 during packaging and to restore the lower side of the packaging hole 300 to an unobstructed state after packaging is completed.

[0071] Specifically, when packaging a semiconductor, first, the lower side of the packaging hole 300 is sealed by the movable plate 600, and then the packaging mechanism 400 is flipped to a horizontal state by the flip mechanism. At this time, each module 470 is embedded in the corresponding packaging hole 300, and the gluing system 500 is started, and the glue hose 460 injects glue into the inside of the packaging hole 300, so that a layer of glue is spread on the bottom surface of the packaging hole 300, that is, on the movable plate 600. Then, the packaging mechanism 400 is reset by the flip mechanism, and then the semiconductor is placed in the packaging hole 300, and the packaging mechanism 400 is flipped again by the flip mechanism. The flipping mechanism moves the packaging mechanism 400 to a horizontal state, and then the gluing system 500 is started to inject glue into the packaging hole 300, so that the glue fills the entire packaging hole 300, and the semiconductor is completely sealed in the glue. The telescopic device 440 is started to drive the hose 460 to move upward to separate from the glue. After the glue is fixed and formed, the movable plate 600 is adjusted to restore the lower side of the packaging hole 300 to an unobstructed state. The telescopic device 440 is started again to drive the hose 460 to move downward to the bottom of the channel, and the packaged semiconductor will be ejected from the packaging hole 300 to realize automatic unloading.

[0072] In the above operation, compared with the packaging equipment in the prior art, there are the following two advantages:

[0073] First, the entire semiconductor can be completely sealed in the glue, and the packaging effect is good;

[0074] Second, after the semiconductor is packaged, it can be automatically unloaded without manual demolding, which can save time and labor and improve overall packaging efficiency.

[0075] Furthermore, the gluing system 500 mainly includes

[0076] The material box 510 is provided with a pump body, which is used to transport the glue in the material box 510. Any pump body suitable for driving the glue transportation can be selected;

[0077] The delivery pipe 520 has one end connected to the pump body and the other end connected to the glue storage box 420. When the pump body is started, the glue in the material box 510 can be pumped into the glue storage box 420 through the delivery pipe 520, thereby achieving gluing.

[0078] Furthermore, the movable plate 600 is movably provided on the mounting frame 100 and one end of the movable plate 600 is connected to a driving mechanism 700. The driving mechanism 700 is any linear driving mechanism that can drive the movable plate 600 to move horizontally on the lower side of the template 200 close to the lower end of the packaging hole 300. For example, in the embodiment of the present invention, the driving mechanism 700 adopts a screw transmission mechanism; the movable plate 600 mainly includes

[0079] The bottom plate 610 is a plate without holes, used to block the lower side of the packaging hole 300.

[0080] The leakage plate 620 is seamlessly connected to the bottom plate 610 and has a leakage hole for allowing the packaged semiconductors to pass through. The size of the leakage hole is larger than the size of the periphery of all the packaging holes 300.

[0081] In detail, the driving mechanism 700 can be used to adjust the bottom plate 610 or the leak plate 620 to move to the lower side of the template 200. When the bottom plate 610 is below the template 200, it is convenient for packaging, and when the leak plate 620 is below the template 200, it is convenient for unloading. The design is ingenious and serves two purposes.

[0082] Furthermore, a collecting box 800 is detachably mounted below the movable plate 600 and is disposed between the two legs 120 . When unloading, the packaged semiconductors fall into the collecting box 800 for collection.

[0083] Furthermore, the module 470 is a refrigeration block, and several modules 470 are electrically connected and refrigeration is controlled by a refrigeration unit 480. The refrigeration unit 480 can be any refrigeration system used for refrigeration in the existing technology and suitable for the structure of the invention. After the module 470 is cooled by the refrigeration unit 480, heat is exchanged with the glue in the packaging hole 300, so that the glue is quickly fixed and formed, thereby improving the packaging efficiency.

[0084] A packaging method based on the above semiconductor packaging device, the method comprising the following steps:

[0085] Step 1: Start the driving mechanism 700 to move the bottom plate 610 to the bottom of the template 200 to seal the lower end of the packaging hole 300, and then use the flip mechanism to drive the packaging mechanism 400 to move to a horizontal state and be located directly above the template 200;

[0086] Step 2: Start the gluing system 500 to feed glue into the glue storage box 420. When the glue storage box 420 and the glue tube 460 are filled with glue, open the solenoid valve of the glue tube 460, and inject an appropriate amount of glue into the packaging hole 300 through the glue tube 460 so that the glue is horizontally spread on the bottom plate 610 at the bottom end of the packaging hole 300. Then, the packaging mechanism 400 is reset by the flip mechanism.

[0087] Step 3: Place the semiconductor to be packaged into each packaging hole 300, and then drive the packaging mechanism 400 to move again to just above the template 200 through the flip mechanism until each module 470 is stuck in the upper end of the packaging hole 300;

[0088] Step 4: Start the gluing system 500 to inject a fixed amount of glue into the packaging hole 300 through the glue hose 460 until the glue fills the entire packaging hole 300. Start the retractor 440 to move the glue hose 460 upward until it is no longer in contact with the glue in the packaging hole 300.

[0089] Step 5: Start the refrigeration unit 480 to cool the module 470 so that the glue is quickly cooled and set;

[0090] Step 6: Start the driving mechanism 700 to drive the bottom plate 610 away from the bottom of the template 200 so that the leak plate 620 moves to the bottom of the template 200, and at the same time start the telescoping device 440 to drive the hose 460 to move downward until the packaged semiconductor is squeezed out of the packaging hole 300 and falls onto the collection box 800.

[0091] Working principle of the present invention:

[0092] When packaging a semiconductor, first, the lower side of the packaging hole 300 is sealed by the movable plate 600, and then the packaging mechanism 400 is flipped to a horizontal state by the flip mechanism. At this time, each module 470 is embedded in the corresponding packaging hole 300, and the gluing system 500 is started. The glue hose 460 injects glue into the inside of the packaging hole 300, so that a layer of glue is spread on the bottom surface of the packaging hole 300, that is, on the movable plate 600. Then, the packaging mechanism 400 is reset by the flip mechanism, and then the semiconductor is placed in the packaging hole 300. The packaging mechanism 400 is moved to a horizontal state by the flip mechanism again, and the gluing system 500 is started to inject glue into the packaging hole 300. 0, so that the glue fills the entire packaging hole 300, the semiconductor is completely sealed in the glue, the telescopic device 440 is started to drive the hose 460 to move upward to separate from the glue, and after the glue is fixed and formed, the movable plate 600 is adjusted to restore the lower side of the packaging hole 300 to an unobstructed state, and the telescopic device 440 is started again to drive the hose 460 to move downward to the bottom of the channel, which will push the packaged semiconductor out of the packaging hole 300 to realize automatic unloading. The entire semiconductor can be completely sealed in the glue, and the packaging effect is good. After the packaging is completed, the semiconductor can be automatically unloaded without manual demolding, which can save time and labor and improve the overall packaging efficiency.

[0093] In the description of the present invention, it should be understood that the terms "upper", "lower", "left", "right" and the like indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, and a specific direction structure and operation, and therefore, cannot be understood as limiting the present invention. In addition, "first" and "second" are only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0094] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0095] The above is a detailed description of an embodiment of the present invention. However, the content described is only a preferred embodiment of the present invention and should not be considered to limit the scope of the present invention. All equivalent changes and improvements made within the scope of the present invention should still fall within the scope of the patent coverage of the present invention.

Claims

1. A semiconductor packaging device, characterized in that: include: The mounting frame (100) mainly comprises: A mounting platform (110), wherein a through hole is provided on an upper surface of the mounting platform (110); A supporting leg (120), wherein the supporting leg (120) is fixedly mounted on the lower side of the mounting platform (110); A mounting plate (130), the mounting plate (130) being mounted on one side of an upper surface of the mounting platform (110); A template (200), the template (200) being fixedly mounted on an upper portion of a through hole formed in the mounting platform (110); Packaging holes (300), the packaging holes (300) are arranged in an array on the upper surface of the template (200); A packaging mechanism (400), wherein the packaging mechanism (400) is flip-mounted on the mounting plate (130) via a flip mechanism, and the packaging mechanism (400) mainly comprises: Pressure plate (410), A glue storage box (420), wherein the glue storage box (420) is fixedly mounted on the pressing plate (410); A connecting plate (450), the connecting plate (450) being arranged above the glue storage box (420), and having an upper side connected to a telescopic mechanism for driving the connecting plate (450) to move; A rubber hose (460), the rubber hose (460) is connected to the lower side of the connecting plate (450) in an array manner, and is movably arranged through the wall of the rubber storage box (420) and extends into the pressing plate (410), the rubber hose (460) is provided with a rubber hole on the wall of the rubber storage box (420), and a solenoid valve is installed at the lower end of the rubber hose (460); Modules (470), the modules (470) are embedded in an array on the lower side of the pressing plate (410), each module (470) corresponds to the packaging hole (300) and the hose (460) one by one and each module (470) has a channel, and the hose (460) passes through the channel of the module (470); A gluing system (500), wherein a glue outlet end of the gluing system (500) is connected to the glue storage box (420); A movable plate (600), the movable plate (600) being movably mounted on the lower side of the mounting platform (110); The movable plate (600) is movably arranged on the mounting frame (100) and one end of which is connected to a driving mechanism (700). The movable plate (600) mainly includes: Bottom plate (610), A leakage plate (620), wherein a leakage hole is provided on the leakage plate (620) for allowing the packaged semiconductor to pass through; The driving mechanism 700 can adjust the bottom plate 610 or the drain plate 620 to move to the lower side of the template 200. When the bottom plate 610 is below the template 200, it is convenient for packaging, and when the drain plate 620 is below the template 200, it is convenient for unloading. The driving mechanism (700) is started to drive the bottom plate (610) away from below the template (200) so that the leak plate (620) moves to below the template (200), and at the same time, the telescopic device (440) is started to drive the hose (460) to move downward until the packaged semiconductor is squeezed out of the packaging hole (300) and falls onto the collection box (800).

2. The semiconductor packaging device according to claim 1, wherein: The gluing system (500) mainly includes A material box (510), wherein a pump body is provided in the material box (510); A delivery pipe (520), one end of which is connected to the pump body and the other end of which is in communication with the glue storage box (420).

3. The semiconductor packaging device according to claim 1, wherein: The telescopic mechanism mainly includes An installation box (430), the installation box (430) being fixedly mounted on the upper side of the glue storage box (420); The retractor (440) is fixedly installed inside the installation box (430), and the extended end of the retractor (440) is connected to the connecting plate (450).

4. The semiconductor packaging device according to claim 1, wherein A collection box (800) is detachably mounted below the movable plate (600), and the collection box (800) is disposed between the two supporting legs (120).

5. The semiconductor packaging device according to claim 1, wherein The modules (470) are refrigeration blocks, and several modules (470) are electrically connected and refrigeration control is performed through a refrigeration unit (480).

6. A packaging method for a semiconductor packaging device according to any one of claims 1 to 5, characterized in that: The following steps are involved: Step 1: Start the driving mechanism (700) to drive the bottom plate (610) to move to the bottom of the template (200) to seal the lower end of the packaging hole (300), and then drive the packaging mechanism (400) to move to a horizontal state and be located above the template (200) through the flip mechanism; Step 2: Start the gluing system (500) to feed glue into the glue storage box (420). When the glue is full in the glue storage box (420) and the glue tube (460), open the solenoid valve of the glue tube (460) and inject an appropriate amount of glue into the packaging hole (300) through the glue tube (460) so that the glue is horizontally spread on the bottom plate (610) at the bottom end of the packaging hole (300). Then, the packaging mechanism (400) is driven to reset by the flip mechanism. Step 3: placing the semiconductor to be packaged into each packaging hole (300), and then driving the packaging mechanism (400) to move again to the top of the template (200) through the flip mechanism until each module (470) is stuck in the upper end of the packaging hole (300); Step 4: Start the gluing system (500) so that the glue tube (460) injects a fixed amount of glue into the packaging hole (300) so that the glue fills the entire packaging hole (300), and start the retractor (440) so that the glue tube (460) moves upward until it is no longer in contact with the glue in the packaging hole (300); Step 5: Start the refrigeration unit (480) to refrigerate the module (470), so that the glue is quickly cooled and set; Step 6: Start the driving mechanism (700) to drive the bottom plate (610) away from the bottom of the template (200) so that the leak plate (620) moves to the bottom of the template (200), and at the same time start the telescopic device (440) to drive the hose (460) to move downward until the packaged semiconductor is squeezed out of the packaging hole (300) and falls onto the collection box (800).

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