Adjustable rack for semiconductor packaging

Abstract

The application discloses an adjustable rack for semiconductor packaging, which comprises a rack base, an adjusting support, an upper feeding rack, a lower feeding rack and a connecting mechanism. The adjusting support is detachably installed on the rack base and can freely move on the top of the rack base. The upper feeding rack is used for installing upper feeding equipment, and the lower feeding rack is used for installing lower feeding equipment. One connecting mechanism is arranged on each of the left and right sides of the rack base. The connecting mechanism comprises a first connecting plate, the position of which can be adjusted forward and backward. The first connecting plate on the left side of the rack base is used for connecting with the upper feeding rack, and the first connecting plate on the right side of the rack base is used for connecting with the lower feeding rack. The rack can not only conveniently install semiconductor packaging equipment, but also adjust the positions of the upper feeding rack and the lower feeding rack according to the position of the semiconductor packaging equipment, so that the applicability of the adjustable rack for semiconductor packaging is greatly improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor packaging equipment technology, and more specifically to an adjustable rack for semiconductor packaging. Background Technology

[0002] Semiconductor packaging refers to the process of processing tested wafers into individual chips according to product models and functional requirements. This process requires the use of semiconductor packaging equipment, which needs to be mounted on a rack.

[0003] A utility model patent with application number CN202120901114.9 discloses a rack for a semiconductor packaging equipment, including a frame, a base, a positioning component, and a locking component. The frame has a first bottom frame and a mounting frame disposed on the first bottom frame. A first connecting plate perpendicular to the horizontal plane is disposed on the mounting frame. The base includes a rectangular second bottom frame and a support seat in the shape of a right quadrangular prism disposed on the second bottom frame. The edges of the support seat are perpendicular to the horizontal plane, and the support seat is used to install the packaging equipment. By designing the frame and base separately, the loading and unloading components can be easily installed through the frame, which also simplifies the processing of the rack and makes it more convenient to transport. By placing the loading frame and unloading frame on opposite sides of the base, and placing the first connecting plate on the side of the mounting frame facing the support seat and parallel to the side wall of the support seat, the first connecting plate and the support seat can be aligned by the positioning component during rack assembly, and the first bottom frame and the second bottom frame can be locked by the locking component to connect the rack into a whole, which is very convenient during installation.

[0004] However, the base in the above-mentioned frame has poor adaptability. When installing different types of packaging equipment, holes need to be drilled on the support base according to the positioning holes of the packaging equipment, so that the packaging equipment can be installed on the support base. The installation process is troublesome and inconvenient. Moreover, different types of packaging equipment have different requirements for the position of the loading frame and unloading frame. The above-mentioned frame has the disadvantage that the front and rear positions of the loading frame and unloading frame cannot be adjusted. Summary of the Invention

[0005] The purpose of this invention is to provide an adjustable rack for semiconductor packaging, in order to solve the problems mentioned in the background art, such as the poor adaptability of existing fixed racks for semiconductor packaging equipment, the need to drill holes in the rack according to the positioning holes of different equipment when installing them, which is quite troublesome, and the inability to adjust the front and rear positions of the loading and unloading frames.

[0006] The objective of this invention can be achieved through the following technical solutions:

[0007] Adjustable racks for semiconductor packaging include:

[0008] A frame base, wherein a plurality of transverse sliding grooves and a plurality of longitudinal sliding grooves of the same shape are evenly provided on the top of the frame base, each of the longitudinal sliding grooves being perpendicular to and intersecting with each of the transverse sliding grooves, and a cross intersection being formed at the intersection of the longitudinal sliding grooves and the transverse sliding grooves, and a threaded blind hole being provided at the bottom center of each cross intersection;

[0009] Adjustable support, comprising:

[0010] A rectangular mounting plate is movably disposed on the top end face of the frame base, and a plurality of blind mounting holes are evenly provided on the rectangular mounting plate;

[0011] The slider is fixedly mounted on the bottom of the rectangular mounting plate, the slider is adapted to the cross intersection, and the slider can slide freely in the transverse slide groove and the longitudinal slide groove;

[0012] A threaded through hole, wherein the threaded through hole connects the top end face of the rectangular mounting plate to the center of the bottom end face of the slider, and the threaded through hole is adapted to the threaded blind hole.

[0013] As a further aspect of the present invention: the transverse slide groove connects the left side of the frame base to the right side of the frame base, and the longitudinal slide groove connects the front side of the frame base to the rear side of the frame base.

[0014] As a further aspect of the present invention: the cross-sections of the transverse slide and the longitudinal slide are convex.

[0015] As a further aspect of the present invention: the rectangular mounting plate includes:

[0016] A first rectangular mounting plate, wherein a slider is fixedly disposed at the bottom center of the first rectangular mounting plate;

[0017] A second rectangular mounting plate has two sliders fixedly installed at its bottom, with the two sliders located on a diagonal line at the bottom of the second rectangular mounting plate.

[0018] A third rectangular mounting plate, wherein three sliders are fixedly mounted on the bottom of the third rectangular mounting plate.

[0019] The three sliders are arranged at equal intervals on the horizontal axis center line at the bottom of the third rectangular mounting plate.

[0020] As a further aspect of the present invention, the adjustable rack for semiconductor packaging described above also includes:

[0021] The feeding rack is used to install feeding equipment;

[0022] A feeding rack, used for mounting feeding equipment;

[0023] A connecting mechanism is provided on each of the left and right sides of the frame base. The connecting mechanism includes a first connecting plate, which is movably disposed on the side of the frame base. The first connecting plate on the left side of the frame base is used to connect with the loading rack, and the first connecting plate on the right side of the frame base is used to connect with the unloading rack.

[0024] As a further aspect of the present invention: the connecting mechanism further includes:

[0025] The mounting chamber is provided on each of the left and right sides of the frame base;

[0026] The drive mechanism is disposed on the front end face of the frame base;

[0027] Two threaded rods are spaced apart in the installation chamber. The front end of each threaded rod is fixedly connected to the drive mechanism, and the rear end of each threaded rod is movably connected to the rear wall of the installation chamber.

[0028] A sliding seat has two threaded holes that match the threaded rods. The sliding seat is movably fitted between the two threaded rods through the threaded holes. The end of the sliding seat away from the threaded rod is fixedly connected to the first connecting plate.

[0029] As a further aspect of the present invention: the driving mechanism includes:

[0030] A rotating shaft, the rear end of which is movably connected to the front end face of the frame base;

[0031] A drive gear, which is fixedly sleeved on the rotating shaft;

[0032] A driving component, which is fixedly connected to the front end of the rotating shaft;

[0033] There are two driven gears, each of which meshes with the driving gear, and each driven gear is fixedly connected to the front end of the corresponding threaded rod.

[0034] As a further aspect of the present invention, the driving component is a manual turntable.

[0035] As a further aspect of the present invention: the driving mechanism further includes:

[0036] A protective housing is detachably mounted on the front end face of the frame base. The rotating shaft, the driving gear, and the driven gear are disposed inside the protective housing, and the driving component is disposed outside the protective housing.

[0037] As a further aspect of the present invention: a plurality of first connecting holes are uniformly formed on the first connecting plate, and a second connecting plate is respectively provided on the bottom side of the loading rack and the unloading rack, and a plurality of second connecting holes adapted to the first connecting holes are formed on the second connecting plate.

[0038] Compared with the prior art, the beneficial effects of the present invention are:

[0039] (1) By uniformly opening several horizontal and vertical grooves of the same shape on the top of the rack base, and an adjustable support that can move freely on the horizontal and vertical grooves, the adaptability of the rack base is greatly improved. When installing different types of packaging equipment, it is not necessary to open holes on the rack base with a hole-opening machine according to the positioning holes of the semiconductor packaging equipment. It is only necessary to move the rectangular mounting plate to the appropriate position by moving the slider. The installation is convenient and quick. In the event of a sudden power outage or damage to the hole-opening machine, the installation of the semiconductor packaging equipment can also be completed.

[0040] (2) By setting a first connecting plate, a second connecting plate and a connecting mechanism, the first connecting plate is controlled to move back and forth on the left and right sides of the frame base through the connecting mechanism, the position of the first connecting plate is adjusted, the loading rack and unloading rack are moved until the second connecting plate coincides with the first connecting plate, and the second connecting plate and the first connecting plate are fixedly connected together, so that the position of the loading rack and unloading rack can be adjusted according to the position of the semiconductor packaging equipment, and the applicability of the adjustable frame of the semiconductor packaging of the present invention is greatly improved. Attached Figure Description

[0041] The invention will now be further described with reference to the accompanying drawings.

[0042] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0043] Figure 2 This is a schematic diagram of the frame base structure of the present invention;

[0044] Figure 3 This is a schematic diagram of the threaded blind hole structure of the present invention;

[0045] Figure 4 This is a cross-sectional schematic diagram of the adjustable support member and frame base assembly of the present invention;

[0046] Figure 5 This is a schematic diagram of the adjustable support component of the present invention mounted on the frame base;

[0047] Figure 6 These are schematic diagrams of different types of adjustable support structures of the present invention;

[0048] Figure 7 This is a schematic diagram of the connection mechanism structure of the present invention.

[0049] In the diagram: 1. Frame base; 2. Transverse slide groove; 3. Longitudinal slide groove; 4. Threaded blind hole; 5. Adjustable support; 6. Rectangular mounting plate; 7. Mounting blind hole; 8. Slider; 9. Threaded through hole; 10. First rectangular mounting plate; 11. Second rectangular mounting plate; 12. Third rectangular mounting plate; 13. Loading rack; 14. Unloading rack; 15. Connecting mechanism; 16. First connecting plate; 17. Mounting chamber; 18. Drive mechanism; 19. Threaded rod; 20. Sliding seat; 21. Rotating shaft; 22. Drive gear; 23. Drive component; 24. Driven gear; 25. Protective housing; 26. First connecting hole; 27. Second connecting plate; 28. Second connecting hole. Detailed Implementation

[0050] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0051] Example 1

[0052] Please see Figure 2-5 An adjustable rack for semiconductor packaging is shown, including a rack base 1 and adjustable support members 5. The adjustable support members 5 are detachably mounted on the rack base 1 and can move freely on the top of the rack base 1. Specifically, depending on the type of semiconductor packaging equipment to be installed, an appropriate number and size of adjustable support members 5 are selected and moved to a suitable position. Then, the adjustable support members 5 are fixedly connected to the rack base 1, and the semiconductor packaging equipment is fixedly installed on the adjustable support members 5, thus completing the installation of the semiconductor packaging equipment. The installation process is convenient.

[0053] Specifically:

[0054] like Figure 2 , Figure 3 As shown, in this embodiment, several horizontal slide grooves 2 and several vertical slide grooves 3 of the same shape are evenly opened on the top of the frame base 1. The horizontal slide grooves 2 connect from the left side of the frame base 1 to the right side of the frame base 1, and the vertical slide grooves 3 connect from the front side of the frame base 1 to the rear side of the frame base 1. The horizontal slide grooves 2 are equally spaced and parallel to each other, and the vertical slide grooves 3 are equally spaced and parallel to each other. The number of horizontal slide grooves 2 and vertical slide grooves 3 are 10 each. Each vertical slide groove 3 is perpendicular to each horizontal slide groove 2 and intersects with each horizontal slide groove 2. A cross intersection is formed at the intersection of the vertical slide groove 3 and the horizontal slide groove 2. A threaded blind hole 4 is opened at the bottom center of each cross intersection.

[0055] like Figure 5 , Figure 6 As shown, in this embodiment, the adjustable support 5 includes a rectangular mounting plate 6, a slider 8, and a threaded through hole 9. The rectangular mounting plate 6 is preferably a steel plate with a thickness of about 5 cm that has strong support and is not easily deformed. A plurality of mounting blind holes 7 are pre-drilled evenly on the rectangular mounting plate 6. The mounting blind holes 7 are used to cooperate with the positioning holes of the semiconductor packaging equipment to be installed to fix the semiconductor packaging equipment on the rectangular mounting plate 6. Preferably, the sizes of the plurality of mounting blind holes 7 are not the same to suit the installation and fixing of various types of semiconductor packaging equipment. The slider 8 is fixedly set at the bottom of the rectangular mounting plate 6. The slider 8 is adapted to the cross intersection. The threaded through hole 9 connects from the top end face of the rectangular mounting plate 6 to the center of the bottom end face of the slider 8. The threaded through hole 9 is adapted to the threaded blind hole 4. After the rectangular mounting plate 6 is moved to a suitable position, the threaded through hole 9 is used to fix the rectangular mounting plate 6 to the top of the frame base 1 to prevent the rectangular mounting plate 6 from continuing to move, which would cause the semiconductor packaging equipment to be not securely installed.

[0056] It should be noted that, as Figure 6 As shown, the rectangular mounting plate 6 may include, but is not limited to, the first rectangular mounting plate 10, the second rectangular mounting plate 11, and the third rectangular mounting plate 12;

[0057] The first rectangular mounting plate 10 is preferably a square steel plate, and a slider 8 is fixedly installed at the bottom center of the first rectangular mounting plate 10;

[0058] The second rectangular mounting plate 11 is preferably a rectangular steel plate with an area larger than that of the first rectangular mounting plate 10. Two sliders 8 are fixedly installed at the bottom of the second rectangular mounting plate 11, and the two sliders 8 are located on a diagonal line at the bottom of the second rectangular mounting plate 11.

[0059] The third rectangular mounting plate 12 is preferably a long strip steel plate, and three sliders 8 are fixedly installed at the bottom of the third rectangular mounting plate 12. The three sliders 8 are arranged at equal intervals on the horizontal axis center line at the bottom of the third rectangular mounting plate 12.

[0060] During installation, depending on the actual situation of the semiconductor packaging equipment to be installed, select a suitable rectangular mounting plate 6 or a combination of multiple rectangular mounting plates 6 to improve installation efficiency.

[0061] Preferred, such as Figure 4 As shown, in this embodiment, the cross-sections of the transverse slide 2 and the longitudinal slide 3 are convex, and a matching protrusion is provided at the bottom of the slider 8. During installation, the slider 8 is engaged with the transverse slide 2 or the longitudinal slide 3 by the protrusion at the bottom of the slider 8, making the slider 8 more stable during movement, and making the connection between the rectangular mounting plate 6 and the frame base 1 more stable.

[0062] When using the aforementioned adjustable rack for semiconductor packaging to mount semiconductor packaging equipment, select the appropriate type and quantity of rectangular mounting plates 6 according to the type of semiconductor packaging equipment to be installed. Then, the slider 8 below the rectangular mounting plate 6 is fitted into the horizontal slide groove 2 or the vertical slide groove 3 from one side port. The slider 8 can slide freely in the horizontal slide groove 2 and the vertical slide groove 3. The bottom end face of the rectangular mounting plate 6 is attached to the top end face of the rack base 1. Then, push the rectangular mounting plate 6 to move it to the required position. Then, insert the fixing bolt into the threaded through hole 9 and the threaded blind hole 4, and tighten the bolt. The top height of the bolt should not exceed the top surface of the rectangular mounting plate 6 to fix the rectangular mounting plate 6 in the required position. Finally, align the positioning hole on the semiconductor packaging equipment with the mounting blind hole 7 on the rectangular mounting plate 6, and insert and tighten the fixing bolt to fix the semiconductor packaging equipment on the rectangular mounting plate 6. This completes the fixing of the semiconductor packaging equipment on the top of the rack base 1.

[0063] The aforementioned adjustable rack for semiconductor packaging greatly improves the adaptability of the rack base 1. When installing different models of packaging equipment, it is not necessary to use a drilling machine to drill holes in the rack base 1 according to the positioning holes of the semiconductor packaging equipment. Simply move the slider 8 to move the rectangular mounting plate 6 to the appropriate position. The installation is convenient and quick. In the event of a sudden power outage or damage to the drilling machine, the installation of the semiconductor packaging equipment can also be completed.

[0064] Example 2

[0065] Please see Figure 1 , Figure 5 , Figure 7As shown, based on the adjustable rack for semiconductor packaging described in Embodiment 1, in this embodiment, the adjustable rack for semiconductor packaging further includes a loading rack 13 for mounting loading equipment, a unloading rack 14 for mounting unloading equipment, and a connecting mechanism 15. A connecting mechanism 15 is provided on each of the left and right sides of the rack base 1. The connecting mechanism 15 includes a first connecting plate 16, the size of which must not exceed the size of the left and right sides of the rack base 1. The first connecting plate 16 on the left side of the rack base 1 is used to connect to the loading rack 13, and the first connecting plate 16 on the right side of the rack base 1 is used to connect to the unloading rack 14. Preferably, A plurality of first connecting holes 26 are evenly opened on the first connecting plate 16. The bottom sides of the loading rack 13 and the unloading rack 14 are respectively provided with second connecting plates 27. A plurality of second connecting holes 28 are opened on the second connecting plate 27 to match the first connecting holes 26. The first connecting plate 16 and the second connecting plate 27 are fixedly connected together by bolts and the cooperation of the first connecting holes 26 and the second connecting holes 28. The first connecting plates 16 on the left and right sides of the frame base 1 can move back and forth under the drive of the connecting mechanism 15 to adjust the position of the first connecting plate 16 to meet the position requirements of different types of semiconductor packaging equipment for the loading frame and the unloading frame.

[0066] Specifically, such as Figure 7 As shown, in this embodiment, the connecting mechanism 15 further includes an installation chamber 17, a drive mechanism 18, two threaded rods 19, and a sliding seat 20. The drive mechanism 18 is disposed on the front end face of the frame base 1. An installation chamber 17 is opened on each of the left and right sides of the frame base 1. The two threaded rods 19 are spaced apart in the installation chambers 17. The front end of the threaded rod 19 is fixedly connected to the drive mechanism 18, and the rear end of the threaded rod 19 is movably connected to the rear wall of the installation chamber 17. The drive mechanism 18 is used to drive the two threaded rods 19 to rotate synchronously. The sliding seat 20 has two threaded holes that match the threaded rods 19. The sliding seat 20 is movably sleeved between the two threaded rods 19 through the threaded holes. The end of the sliding seat 20 away from the threaded rods 19 is fixedly connected to the first connecting plate 16. As the two threaded rods 19 rotate synchronously, the sliding seat 20 moves back and forth between the two threaded rods 19, thereby controlling the back and forth movement of the first connecting plate 16. Preferably, in this embodiment, two sliding seats 20 are provided. The distance between the two sliding seats 20 shall not exceed half the length of the threaded rod 19, and they are symmetrically arranged in the middle of the first connecting plate 16.

[0067] Specifically, the drive mechanism 18 may include a rotating shaft 21, a driving gear 22, a driven gear 24, and a drive member 23. The rear end of the rotating shaft 21 is movably connected to the front end face of the frame base 1. The drive member 23 is fixedly connected to the front end of the rotating shaft 21 and is used to drive the rotating shaft 21 to rotate. The driving gear 22 is fixedly sleeved on the rotating shaft 21 and rotates synchronously with the rotating shaft 21. The two driven gears 24 mesh with the driving gear 22 respectively and rotate with the driving gear 22. The driven gear 24 is fixedly connected to the front end of the corresponding threaded rod 19, so that the threaded rod 19 rotates with the driven gear 24. The drive mechanism 18 is not limited to the above structure. Any other structure that can drive the two threaded rods 19 to rotate can be used as the drive mechanism 18.

[0068] In this embodiment, the driving component 23 is set as a manual turntable, and the operator can adjust the front and rear positions of the first connecting plate 16 by rotating the manual turntable. Of course, the driving component 23 can also be a motor, etc.

[0069] In this embodiment, the drive mechanism 18 further includes a protective housing 25, which is detachably mounted on the front end face of the frame base 1. The specific connection method can be by bolts or snap-fit, etc. The rotating shaft 21, the driving gear 22 and the driven gear 24 are disposed inside the protective housing 25, and the drive component 23 is disposed outside the protective housing 25. The protective housing 25 is used to protect the rotating shaft 21, the driving gear 22 and the driven gear 24 to prevent moisture, dust and other substances from adhering to it, which would cause the drive mechanism 18 to rotate unevenly.

[0070] During installation, based on the actual position of the semiconductor packaging equipment installed on the rack base 1, the two threaded rods 19 are rotated synchronously by controlling the drive mechanism 18, thereby adjusting the first connecting plate 16 to a suitable position. Then, the second connecting plate 27 is fixedly connected to the first connecting plate 16, so that the loading rack 13 and the unloading rack 14 can be installed in a suitable position. When the position of the loading rack 13 and the unloading rack 14 needs to be adjusted again, the second connecting plate 27 is first separated from the first connecting plate 16, then the first connecting plate 16 is adjusted to another position, the loading rack 13 and the unloading rack 14 are moved until the second connecting plate 27 coincides with the first connecting plate 16, and then the second connecting plate 27 is fixedly connected to the first connecting plate 16 again.

[0071] The adjustable rack for semiconductor packaging in this embodiment not only allows for convenient installation of semiconductor packaging equipment, but also allows for adjustment of the positions of the loading rack 13 and unloading rack 14 according to the position of the semiconductor packaging equipment, thus greatly improving the applicability of the adjustable rack for semiconductor packaging.

[0072] The preferred embodiments of the present invention have been described in detail above and should not be construed as limiting the scope of the invention. All equivalent variations and modifications made within the scope of the claims of this invention should still fall within the patent coverage of this invention.

Claims

1. An adjustable rack for semiconductor packaging, characterized in that, include: A frame base (1) has several horizontal sliding grooves (2) and several vertical sliding grooves (3) of the same shape evenly opened on the top of the frame base (1). Each vertical sliding groove (3) is perpendicular to and intersects with each horizontal sliding groove (2). A cross intersection is formed at the intersection of the vertical sliding groove (3) and the horizontal sliding groove (2). A threaded blind hole (4) is opened at the bottom center of each cross intersection. Adjustable support (5), comprising: A rectangular mounting plate (6) is movably disposed on the top end face of the frame base (1), and a plurality of blind mounting holes (7) are evenly opened on the rectangular mounting plate (6); The slider (8) is fixedly disposed at the bottom of the rectangular mounting plate (6). The slider (8) is adapted to the cross intersection. The slider (8) can slide freely in the transverse groove (2) and the longitudinal groove (3). A threaded through hole (9) is provided, which is connected from the top end face of the rectangular mounting plate (6) to the center of the bottom end face of the slider (8), and the threaded through hole (9) is adapted to the threaded blind hole (4); The transverse slide (2) is connected from the left side of the frame base (1) to the right side of the frame base (1), and the longitudinal slide (3) is connected from the front side of the frame base (1) to the rear side of the frame base (1); The cross-sections of the transverse groove (2) and the longitudinal groove (3) are convex. The rectangular mounting plate (6) includes: a first rectangular mounting plate (10), wherein a slider (8) is fixedly disposed at the bottom center of the first rectangular mounting plate (10); A second rectangular mounting plate (11) is provided with two sliders (8) fixedly disposed at the bottom of the second rectangular mounting plate (11), and the two sliders (8) are located on a diagonal line at the bottom of the second rectangular mounting plate (11); The third rectangular mounting plate (12) has three sliders (8) fixedly installed at its bottom. The three sliders (8) are arranged at equal intervals on the horizontal axis center line at the bottom of the third rectangular mounting plate (12). By pushing the rectangular mounting plate (6), the rectangular mounting plate (6) is moved to the required position. Then, the fixing bolts are inserted into the threaded through hole (9) and the threaded blind hole (4) and tightened. The height of the bolt top must not exceed the top surface of the rectangular mounting plate (6) to fix the rectangular mounting plate (6) in the required position. Finally, the positioning hole on the semiconductor packaging equipment is aligned with the mounting blind hole (7) on the rectangular mounting plate (6). The semiconductor packaging equipment is fixedly installed on the rectangular mounting plate (6) by inserting and tightening the fixing bolts. This completes the fixing of the semiconductor packaging equipment on the top of the rack base (1).

2. The adjustable rack for semiconductor packaging according to claim 1, characterized in that, It also includes: a feeding rack (13), which is used to install feeding equipment; A feeding rack (14) is used to install feeding equipment; A connecting mechanism (15) is provided on the left and right sides of the frame base (1). The connecting mechanism (15) includes a first connecting plate (16). The first connecting plate (16) is movably disposed on the side of the frame base (1). The first connecting plate (16) on the left side of the frame base (1) is used to connect with the loading rack (13), and the first connecting plate (16) on the right side of the frame base (1) is used to connect with the unloading rack (14).

3. The adjustable rack for semiconductor packaging according to claim 2, characterized in that, The connecting mechanism (15) further includes: Installation chamber (17), one of the installation chambers (17) is opened on the left and right sides of the frame base (1); A drive mechanism (18) is disposed on the front end face of the frame base (1); Two threaded rods (19) are spaced apart in the mounting chamber (17). The front end of the threaded rod (19) is fixedly connected to the drive mechanism (18), and the rear end of the threaded rod (19) is movably connected to the rear wall of the mounting chamber (17). A sliding seat (20) has two threaded holes that match the threaded rods (19). The sliding seat (20) is movably fitted between the two threaded rods (19) through the threaded holes. The end of the sliding seat (20) away from the threaded rods (19) is fixedly connected to the first connecting plate (16).

4. The adjustable rack for semiconductor packaging according to claim 3, characterized in that, The drive mechanism (18) includes: a rotating shaft (21), the rear end of which is movably connected to the front end face of the frame base (1); A drive gear (22) is fixedly sleeved on the rotating shaft (21); A driving component (23) is fixedly connected to the front end of the rotating shaft (21); Driven gear (24), there are two driven gears (24), the two driven gears (24) mesh with the driving gear (22) respectively, and the driven gear (24) is fixedly connected to the front end of the corresponding threaded rod (19).

5. The adjustable rack for semiconductor packaging according to claim 4, characterized in that, The drive unit (23) is a manual turntable.

6. The adjustable rack for semiconductor packaging according to claim 4, characterized in that, The drive mechanism (18) further includes: a protective housing (25), which is detachably disposed on the front end face of the frame base (1), the rotating shaft (21), the driving gear (22) and the driven gear (24) are disposed inside the protective housing (25), and the drive member (23) is disposed outside the protective housing (25).

7. The adjustable rack for semiconductor packaging according to claim 2, characterized in that, A plurality of first connecting holes (26) are evenly provided on the first connecting plate (16). The bottom sides of the loading rack (13) and the unloading rack (14) are respectively provided with second connecting plates (27). A plurality of second connecting holes (28) adapted to the first connecting holes (26) are provided on the second connecting plate (27).

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