Electronic device

Abstract

The application discloses an electronic device, which comprises a shell, a wind guide cover, a plurality of devices to be cooled and a cooling fan. The wind guide cover is accommodated in the inner cavity. The wind guide cover divides the inner cavity of the shell into a ventilation cavity and an isolation cavity. The ventilation cavity comprises a main air duct and a plurality of branch air ducts communicated with the main air duct. Each branch air duct is provided with an exhaust hole communicated with the isolation cavity. One end of the shell is provided with an air inlet communicated with the main air duct, and the other end of the shell is provided with an air outlet communicated with the isolation cavity. The plurality of devices to be cooled are arranged in the isolation cavity. The cooling fan is used for guiding air flow into the air inlet. The air flow guided into the air inlet flows into the plurality of branch air ducts through the main air duct and flows to the plurality of devices to be cooled through the plurality of branch air ducts, so as to cool the plurality of devices to be cooled, thereby realizing the control of the electronic device on precise air supply, meeting the diversified use demand of the cooling air direction, and being capable of cooling each device to be cooled through the branch air duct.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of heat dissipation of electronic devices, and in particular to an electronic device. BACKGROUND

[0002] With the continuous development of cloud computing and big data technology, the power consumption of heat generating components of electronic devices gradually increases, and the heat dissipation requirement increases day by day. At present, the heat dissipation mode of electronic devices mainly dissipates heat through a heat dissipation fan. The existing heat dissipation air duct of the electronic device adopts a front-to-back air duct, and a baffle is arranged at the bypass of the air duct to optimize air duct management. However, in the front-to-back air duct scene, the electronic device cannot realize accurate air supply, the heat dissipation direction of the air duct is single, and the upstream heat dissipation devices arranged in sequence on the air outlet path have a heating and air blocking effect on the downstream heat dissipation devices, which cannot meet the heat dissipation requirement. SUMMARY

[0003] Therefore, the present application provides an electronic device to solve the problem that in the front-to-back air duct scene, the electronic device cannot realize accurate air supply, the heat dissipation direction of the air duct is single, and the upstream heat dissipation devices arranged in sequence on the air outlet path have a heating and air blocking effect on the downstream heat dissipation devices, which cannot meet the heat dissipation requirement.

[0004] In a first aspect, the present application provides an electronic device, comprising:

[0005] a housing, the housing having an inner cavity;

[0006] a wind guide cover connected with the housing, the wind guide cover separating the inner cavity of the housing into a ventilation cavity and an isolation cavity arranged in isolation with the ventilation cavity, the ventilation cavity comprising a main air duct and a plurality of branch air ducts in communication with the main air duct and arranged in isolation with each other, each branch air duct being provided with an exhaust hole in communication with the isolation cavity; the front side of the housing being provided with an air inlet in communication with the main air duct, and the rear side of the housing being provided with an air outlet in communication with the isolation cavity;

[0007] a plurality of heat dissipation devices, the plurality of heat dissipation devices being arranged in the isolation cavity;

[0008] a heat dissipation fan for guiding air flow into the air inlet, the air flow guided into the air inlet flowing into the plurality of branch air ducts through the main air duct, and flowing to the plurality of heat dissipation devices through the plurality of branch air ducts to dissipate heat from the plurality of heat dissipation devices.

[0009] With reference to the first aspect, in some implementations of the first aspect, the electronic device further comprises a liquid cooling radiator, and the liquid cooling radiator is located in the isolation cavity and is isolated from the ventilation cavity, so as to avoid the liquid cooling radiator being exposed to the cold air flow introduced by the cooling fan, thereby reducing the heat leakage problem of the liquid cooling radiator.

[0010] With reference to the first aspect, in some implementations of the first aspect, the device to be cooled comprises a heat generating element and a radiator attached to the heat generating element, and the air outlet hole is directed towards the windward surface of the radiator, so as to increase the air flow into the radiator, increase the contact area of the air flow and the radiator, improve the heat exchange efficiency between the radiator and the air flow, enable the device to be cooled to be quickly cooled, and improve the cooling performance.

[0011] The device to be cooled comprises a heat generating element, and the air outlet hole is directed towards the heat generating surface of the heat generating element, so as to increase the contact area of the air flow and the heat generating element, improve the heat exchange efficiency between the heat generating element and the air flow, enable the device to be cooled to be quickly cooled, and improve the cooling performance.

[0012] With reference to the first aspect, in some implementations of the first aspect, the distance between the air outlet hole and the windward surface or the heat generating surface is less than or equal to 5 mm, so as to ensure that the air flow guided by the branch air duct can quickly enter the air cooling radiator, and improve the air cooling efficiency.

[0013] With reference to the first aspect, in some implementations of the first aspect, the electronic device further comprises a circuit board for arranging a plurality of devices to be cooled, and the air deflector is suspended in a containing space above or below the circuit board, and a gap for air flow is formed between the circuit board and the air deflector, so as to ensure that the air flow passing through the device to be cooled is discharged to the outside of the shell through the air outlet.

[0014] With reference to the first aspect, in some implementations of the first aspect, the air deflector is configured as a hollow cover, and the inner cavity of the air deflector serves as the ventilation cavity; or,

[0015] The air deflector is sealingly connected with the shell, and the air deflector and the shell jointly form the ventilation cavity.

[0016] With reference to the first aspect, in some implementations of the first aspect, the plurality of branch air ducts includes a first air duct and a second air duct, the plurality of devices to be cooled includes a first device to be cooled corresponding to the first air duct and a second device to be cooled corresponding to the second air duct, the first device to be cooled and the second device to be cooled are arranged in sequence along a length direction of the electronic device; air flowing through the first air duct flows to the first device to be cooled to cool the first device to be cooled; and air flowing through the second air duct flows to the second device to be cooled to cool the second device to be cooled. In this way, on the one hand, by arranging the first air duct and the second air duct in different directions, the air flowing through the first air duct and passing through the first device to be cooled is prevented from flowing to the second device to be cooled, thereby better preventing the heat passing through the first device to be cooled from heating the second device to be cooled; on the other hand, by providing cold air to the first device to be cooled and the second device to be cooled through the first air duct and the second air duct respectively, the cooling effect of the first device to be cooled and the second device to be cooled is improved.

[0017] With reference to the first aspect, in some implementations of the first aspect, the first air duct is arranged to extend along a length direction of the electronic device, and the second air duct is arranged to extend along a width direction of the electronic device, thereby ensuring that the first air duct and the second air duct have sufficient space to arrange the air outlet hole to provide a suitable air outlet amount, and ensuring that the installation positions of the first device to be cooled and the second device to be cooled are matched within a certain range to cool the first device to be cooled and the second device to be cooled, thereby improving the cooling efficiency of the electronic device.

[0018] With reference to the first aspect, in some implementations of the first aspect, the air outlet direction of the first air duct and the air outlet direction of the second air duct form an included angle, thereby reducing the influence of the first device to be cooled arranged upstream of the air outlet path on the second device to be cooled downstream, thereby improving the cooling effect and meeting the cooling requirements of each device to be cooled.

[0019] With reference to the first aspect, in some implementations of the first aspect, the air outlet direction of the first air duct is perpendicular to the air outlet direction of the second air duct, thereby simplifying the structure of the air guide cover and improving the assembly efficiency between the air guide cover and the shell.

[0020] With reference to the first aspect, in some implementations of the first aspect, the height of the first air duct is less than the height of the second air duct, so that the height of the air cooling radiator can be increased in the limited space of the shell to improve the heat dissipation effect of the second device to be cooled, and the second air duct functions as a baffle to block the air flow from the first air duct and passing through the first device to be cooled from flowing to the second device to be cooled, to realize directional guidance of the air flow and enhance the heat dissipation effect.

[0021] With reference to the first aspect, in some implementations of the first aspect, the plurality of devices to be cooled further includes a third device to be cooled corresponding to the first air duct, and the third device to be cooled is arranged apart from the first device to be cooled, so that the first device to be cooled and the third device to be cooled share the same first air duct, to concentrate on the first device to be cooled and the third device to be cooled, and simplify the air duct design of the air deflector.

[0022] With reference to the first aspect, in some implementations of the first aspect, the number of the first air ducts includes two, and the two first air ducts are arranged at two sides of the main air duct in the width direction of the electronic device, and the second air duct is arranged at one side of the main air duct in the length direction of the electronic device, so that more space can be provided in the area enclosed by the two first air ducts and the second air duct for installing other functional devices of the electronic device, so that the overall structure of the electronic device is more compact; on the other hand, the first device to be cooled and the second device to be cooled can be arranged apart in different areas of the isolation cavity, so that the air supply and heat dissipation range can be adjusted by optimizing the layout of the first air duct and the second air duct, and the air flow is dispersed to make the heat dissipation effect of the electronic device better.

[0023] With reference to the first aspect, in some implementations of the first aspect, the projection of the first air duct on the projection plane in the width direction of the electronic device is arranged apart from or adjacent to the projection of the second air duct on the projection plane, so that the air flow guided by the first air duct can quickly guide to the outside of the shell after passing through the first device to be cooled, to enhance the heat dissipation effect of the first device to be cooled and the second device to be cooled.

[0024] In some implementations of the first aspect, the number of the first air ducts includes at least three, and the at least three first air ducts are arranged in sequence and at intervals in a width direction of the electronic device, two of the first air ducts are arranged at two sides of the main air duct in the width direction of the electronic device, and the rest of the first air ducts are arranged at a middle part of the main air duct, and the second air duct is arranged at one side of the main air duct, thereby enhancing the heat dissipation effect of the first air duct corresponding to the to-be-cooled device arranged at the middle part of the main air duct.

[0025] In some implementations of the first aspect, the plurality of branch air ducts further include a third air duct, and the third air duct is arranged at a different side of the main air duct in the height direction of the electronic device from the first air duct, so that each to-be-cooled device can be arranged more dispersedly in different areas of the isolation cavity, and thus the heat dissipation range can be adjusted by optimizing the layout of the branch air duct, and the heat dissipation effect of the electronic device is improved.

[0026] In some implementations of the first aspect, the outflow direction of the third air duct is different from the outflow directions of the first air duct and the second air duct, so that the spatial layout of each to-be-cooled device in the electronic device is more optimized, the structure is more compact, the function is more diverse, and the heat dissipation is more efficient.

[0027] In some implementations of the first aspect, at least one of the first air duct, the second air duct, and the third air duct includes a plurality of sub-air ducts arranged at intervals, so that the to-be-cooled devices can be more accurately controlled, and heat interference between the to-be-cooled devices is prevented.

[0028] The electronic device provided in the application allocates air flow from the main air duct to the branch air duct, on the one hand, precise air supply control of the electronic device is achieved, and energy consumption is reduced; on the other hand, the to-be-cooled devices are separately cooled through different branch air ducts, and the flow direction of the air flow is changed through the design of the branch air duct to meet the diversified use requirements of the heat dissipation air direction, and the problem that the upstream to-be-cooled device arranged in sequence in the outflow path heats and blocks the downstream to-be-cooled device in the front-in and rear-out air duct scenario is solved, thereby improving the heat dissipation effect and meeting the heat dissipation requirements of each to-be-cooled device. BRIEF DESCRIPTION OF DRAWINGS

[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description only some of the embodiments of the present application, and for those skilled in the art, other drawings can also be obtained from these drawings without creative labor.

[0030] Figure 1 is a structural schematic diagram of an electronic device provided by the present application.

[0031] Figure 2 is Figure 1 is a structural schematic diagram of an electronic device in which the shell is omitted.

[0032] Figure 3 is Figure 1 is a front view of an electronic device in which the shell is omitted.

[0033] Figure 4 is Figure 1 is a left view of an electronic device in which the shell is omitted.

[0034] Figure 5 is Figure 2 is a structural schematic diagram of the first view of the first embodiment of the air deflector of the electronic device in

[0035] Figure 6 is Figure 5 is a structural schematic diagram of the second view of the air deflector of the electronic device in

[0036] Figure 7 is Figure 5 is a structural schematic diagram of the third view of the air deflector of the electronic device in

[0037] Figure 8 is Figure 1 is a schematic diagram of the air flow direction of the electronic device in

[0038] Figure 9 is Figure 1 is a structural schematic diagram of the second embodiment of the air deflector of the electronic device in

[0039] Figure 10 is Figure 1 is a structural schematic diagram of the third embodiment of the air deflector of the electronic device in

[0040] Figure 11 is Figure 1 is a structural schematic diagram of the fourth embodiment of the air deflector of the electronic device in

[0041] Main element symbol explanation

[0042]

[0043]

[0044] The following detailed description will further describe the present application with reference to the above mentioned drawings. DETAILED DESCRIPTION

[0045] In order to make the person skilled in the art better understand the present application, the technical solutions in the present application will be described clearly and completely in combination with the drawings in the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by the person skilled in the art without creative labor should belong to the protection scope of the present application.

[0046] The terms "first", "second", and the like (if any) in the description and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and do not necessarily have to be used to describe a specific order or sequence. It should be understood that the data thus used can be interchanged under appropriate circumstances, so that the embodiments described herein can be implemented in an order other than that illustrated or described herein. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion, for example, a process, method, system, product or device including a series of steps or units does not have to be limited to those steps or units clearly listed, but can include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0047] Please refer to Figure 1 , Figure 1The figure shows a schematic structural diagram of an electronic device 100 provided in an embodiment of the present application. The electronic device 100 includes a housing 10, an air duct 20, a plurality of heat dissipation devices 30 and a heat dissipation fan 40. The housing 10 has an inner cavity 110. The air duct 20 is accommodated in the inner cavity 110. In some embodiments, the air duct 20 is connected to the housing 10. In other embodiments, the air duct 20 can also be placed in the inner cavity 110 of the housing 10. The air duct 20 divides the inner cavity 110 of the housing 10 into a ventilation cavity 120 and an isolation cavity 130. The ventilation cavity 120 includes a main air duct 21 and a plurality of branch air ducts 23 connected to the main air duct 21. Each branch air duct 23 is provided with an exhaust hole 230 connected to the isolation cavity 130. An air inlet 101 connected to the main air duct 21 is provided at one end of the housing 10, and an air outlet 102 connected to the isolation cavity 130 is provided at the other end of the housing 10. Multiple components 30 to be cooled are disposed within the isolation chamber 130. A heat dissipation fan 40 is configured to direct airflow into the air inlet 101. The airflow directed through the air inlet 101 flows through the main air duct 21 into the multiple branch air ducts 23, and then flows through the multiple branch air ducts 23 to the multiple components 30 to be cooled, thereby dissipating heat from the multiple components 30 to be cooled.

[0048] The electronic device 100 provided in the present application distributes airflow to the branch air duct 23 based on the main air duct 21. On the one hand, it realizes precise air supply control of the electronic device 100, which is beneficial to reducing energy consumption; on the other hand, it realizes separate heat dissipation of multiple heat sinks through different branch air ducts 23, and the branch air duct 23 is designed to change the flow direction of the airflow to meet the diversified use requirements of the heat dissipation direction, and solves the problem of heating and wind blocking of the downstream heat dissipation devices 30 by the upstream heat dissipation devices 30 arranged in sequence on the air outlet path in the forward and rear air duct scenario, thereby improving the heat dissipation effect and meeting the heat dissipation requirements of each heat dissipation device 30.

[0049] It should be noted that Figure 1 The purpose is only to schematically describe the arrangement of the housing 10, the air guide cover 20, the plurality of heat dissipation devices 30 and the heat dissipation fan 40, and is not to make specific limitations on the connection position, connection relationship and specific structure of each component. Figure 1 The structure of the electronic device 100 is merely an example of the present application and does not constitute a specific limitation on the electronic device 100. In other embodiments of the present application, the electronic device 100 may include: Figure 1 More or fewer components, or combinations of certain components, or different components may be shown. For example, the electronic device 100 may also include, but is not limited to, a power button, input and output interfaces, etc. The electronic device 100 includes, but is not limited to, communication systems such as servers, computer systems, communication rooms, data exchange centers, and network control systems.

[0050] In some embodiments, the electronic device 100 further comprises a liquid cooling radiator 60. The liquid cooling radiator 60 is in contact with the plurality of devices 30 to be cooled to cool the plurality of devices 30 to be cooled. The liquid cooling radiator 60 cooperates with the cooling fan 40 to improve the cooling capacity of the electronic device 100 and reduce the requirement of power usage effectiveness (PUE). PUE is an index for evaluating the energy efficiency of a data center, which is the ratio of the total energy consumed by the data center to the energy consumed by the IT load.

[0051] It can be understood that when the liquid cooling radiator 60 is arranged on the air outlet path of the cooling fan 40, the airflow will carry away part of the heat of the liquid cooling radiator 60 after flowing through the liquid cooling area, that is, the liquid cooling radiator 60 has a heat leakage phenomenon, thereby reducing the cooling capacity of the liquid cooling radiator 60 to the devices 30 to be cooled. In the present embodiment, the liquid cooling radiator 60 is arranged outside the isolation chamber 130, that is, the liquid cooling radiator 60 is arranged in isolation from the ventilation chamber 120 of the air baffle 20, thereby avoiding the liquid cooling radiator 60 from being exposed to the cold airflow introduced by the cooling fan 40, and further reducing the heat leakage problem of the liquid cooling radiator 60. In the present embodiment, the liquid cooling radiator 60 is a contact type liquid cooling radiator.

[0052] Optionally, in some embodiments, the main air duct 21 and the plurality of branch air ducts 23 jointly define a limiting space 140 accommodating at least part of the liquid cooling radiator 60. On the one hand, the relevant functional devices are arranged as much as possible in the limited internal space of the electronic device 100, thereby reducing the overall volume of the electronic device 100; on the other hand, the liquid cooling radiator 60 is avoided from being exposed to the air outlet path of the branch air duct 23, thereby further reducing the heat leakage problem of the liquid cooling radiator 60. In other embodiments, the liquid cooling radiator 60 can also be arranged outside the limiting space 140.

[0053] In the embodiment, the relatively large heat-emitting parts of the heat-emitting devices 30 can include the heat-emitting elements 31 and the air-cooled heat sinks 32 attached to the heat-emitting elements 31. The air outlet holes 230 of each branch air duct 23 are directed towards the corresponding heat-emitting device 30. Optionally, the air outlet holes 230 are directed towards the windward faces 321 of the air-cooled heat sinks 32, thereby increasing the air flow into the air-cooled heat sinks 32, increasing the contact area between the air flow and the air-cooled heat sinks 32, improving the heat exchange efficiency between the air-cooled heat sinks 32 and the air flow, allowing the heat-emitting devices 30 to dissipate heat quickly, and improving the heat dissipation performance. It should be noted that the windward faces 321 of the air-cooled heat sinks 32 are the faces through which the air flow enters the heat dissipation fins of the air-cooled heat sinks 32. Specifically, the windward faces 321 of the air-cooled heat sinks 32 are provided with grooves to form a plurality of heat dissipation fins. The relatively small heat-emitting parts of the heat-emitting devices 30 can also only include the heat-emitting elements 31. The air outlet holes 230 can also be directed towards the heat-emitting faces 311 of the heat-emitting elements 31, thereby increasing the contact area between the air flow and the heat-emitting elements 31, improving the heat exchange efficiency between the heat-emitting elements 31 and the air flow, allowing the heat-emitting devices 30 to dissipate heat quickly, and improving the heat dissipation performance. In other embodiments, all the heat-emitting devices 30 can include the heat-emitting elements 31 and the air-cooled heat sinks 32; or can only include the heat-emitting elements 31.

[0054] Optionally, the distances L between the air outlet holes 230 and the windward faces 321 and between the air outlet holes 230 and the heat-emitting faces 311 are substantially less than or equal to 5 mm, thereby ensuring that the air flow guided by the branch air ducts 23 can quickly enter the air-cooled heat sinks 32, improving the air-cooled heat dissipation efficiency. The size of the air outlet holes 230 is equal to the area of the windward faces 321, on the one hand, improving the air flow into the air-cooled heat sinks 32, and improving the air-cooled heat dissipation efficiency; on the other hand, increasing the opening size of the air outlet holes 230 in the limited space, to ensure that the windward faces 321 of the air-cooled heat sinks 32 receive the air flow guided by the branch air ducts 23 in a flow much larger than the flow of the hot air flow in the surrounding environment, thereby reducing the heat crosstalk between the plurality of heat-emitting devices 30, and enhancing the heat dissipation effect.

[0055] The heating element 31 can be a functional device in the electronic device 100 that needs to be cooled, such as a chip, a fuse, a power supply, a memory, or other heating components. The chip includes, but is not limited to, a central processing unit (CPU), a graphics processing unit (GPU), and the like. The air-cooled heat sink 32 covers the heating element 31, thereby increasing the contact area between the air-cooled heat sink 32 and the heating element 31 and enhancing the heat dissipation effect. The air-cooled heat sink 32 is provided with a plurality of spaced apart heat dissipation fins on the side away from the heating element 31, thereby increasing the heat dissipation area of the air-cooled heat sink 32 and enabling the heat generated by the heating element 31 to be effectively dissipated to the external environment in a timely manner. The air-cooled heat sink 32 is made of a metal material or an alloy material, such as, but not limited to, aluminum, magnesium, copper, stainless steel, ceramic, graphite, and the like, and an alloy material such as, but not limited to, an aluminum alloy, a magnesium alloy, and the like. It should be noted that the material of the air-cooled heat sink 32 can be selected according to actual needs, and the embodiments of the present application do not make specific limitations thereto.

[0056] The plurality of devices to be cooled 30 includes a first device to be cooled 310 and a second device to be cooled 320. The first device to be cooled 310 and the second device to be cooled 320 can each include one or more heating elements 31. Alternatively, the plurality of heating elements 31 can correspond to the same air-cooled heat sink 32, so as to realize that the plurality of heating elements 31 share one air-cooled heat sink 32, thereby simplifying the assembly process of the electronic device 100 and the design of the branch air duct 23, improving the space utilization of the air-cooled heat sink 32, and enhancing the heat dissipation effect. In some embodiments, each heating element 31 can also correspond to an air-cooled heat sink 32, thereby reducing the heat crosstalk between the plurality of chips and enhancing the heat dissipation effect. In the present embodiment, the first device to be cooled 310 and the second device to be cooled 320 each include a plurality of chips and an air-cooled heat sink 32 disposed on the plurality of chips. The first device to be cooled 310 and the second device to be cooled 320 can include, but are not limited to, a CPU heat sink, a memory heat sink, a mainboard chipset heat sink, a storage hard disk heat sink, a graphics card heat sink, a power supply heat sink, and the like. In the present embodiment, the heat sink types of the first device to be cooled 310 and the second device to be cooled 320 are different, specifically, the first device to be cooled 310 is a CPU heat sink, and the second device to be cooled 320 is a memory heat sink. In some embodiments, the heat sink types of the first device to be cooled 310 and the second device to be cooled 320 are the same, such as both being CPU heat sinks. The plurality of devices to be cooled 30 further includes a third device to be cooled 330, such as a fuse, a power supply, and the like.

[0057] In order to more clearly describe, the opposite two ends of an object are defined as the front side and the back side, respectively. For example, as shown inFigure 1 As shown, when describing the front side or the rear side of the shell 10, the air inlet side of the shell 10 is the front side, and the air outlet side of the shell 10 is the rear side. In the present embodiment, the shell 10 is a cuboid. Of course, in other embodiments, the shell 10 can also be other shapes. The shell 10 includes a front side plate 11, a rear side plate 12, a left side plate 13, a right side plate 14, a bottom plate 15, and a top plate 16. The front side plate 11, the rear side plate 12, the left side plate 13, the right side plate 14, the bottom plate 15, and the top plate 16 collectively enclose an inner cavity 110 of the shell 10. The air guide cover 20, the devices to be cooled 30, and the liquid cooling heat sink 60 are all accommodated in the inner cavity 110 of the shell 10. The front side plate 11 is provided with an air inlet 101, and the rear side plate 12 is provided with an air outlet 102. The inner cavity 110 of the shell 10 forms a front-to-rear air duct between the air inlet 101 and the air outlet 102. The air inlet 101 of the main air duct 21 of the air guide cover 20 is connected to the shell air inlet 101, so that the airflow from the outside can directly enter the main air duct 21, thereby ensuring that each branch air duct 23 can output ambient fresh air, improving the cooling efficiency of each device to be cooled 30. The heat dissipation fan 40 can include one or more. The heat dissipation fan 40 can be arranged at a position corresponding to the air inlet 101 of the shell 10; or, arranged at a position corresponding to the air outlet 102. In some other embodiments, the heat dissipation fan 40 can be arranged at a position corresponding to the air inlet 101 of the shell 10 and at a position corresponding to the air outlet 102, thereby accelerating the convection of airflow, increasing the speed of heat dissipation, and improving the heat dissipation efficiency. The heat dissipation fan 40 can be arranged inside the shell 10 of the electronic device 100; or, can also be arranged outside the shell 10 of the electronic device 100; or, can also be arranged inside and outside the shell 10 of the electronic device 100. The heat dissipation fan 40 includes but is not limited to a fan or an airflow compressor.

[0058] The electronic device 100 further includes a circuit board 50 for arranging a plurality of devices to be cooled 30. The circuit board 50 is accommodated in the inner cavity 110 of the shell 10 and located in the isolation cavity 130. The heat generating element 31 is arranged between the air cooling heat sink 32 and the circuit board 50. The liquid cooling heat sink 60 is attached to the region of the circuit board 50 corresponding to the heat generating element 31. The liquid cooling heat sink 60 can also be in contact with the heat generating element to achieve the heat dissipation of the liquid cooling heat sink 60 to the circuit board 50 and the heat generating element 31 and other functional elements arranged on the circuit board 50, thereby enhancing the heat dissipation effect of the electronic device 100. The air guide cover 20 is suspended in the accommodation space above or below the circuit board 50, and a gap 150 for airflow passing is formed between the circuit board 50 and the air guide cover 20, thereby ensuring that the airflow passing through the devices to be cooled 30 is discharged to the outside of the shell 10 through the air outlet 102.

[0059] In the embodiment, the air deflector 20 is configured as a hollow cover, and the inner cavity of the air deflector 20 is used as the ventilation cavity 120, so as to simplify the assembly process between the air deflector 20 and the shell 10, and ensure good isolation effect between the ventilation cavity 120 and the isolation cavity 130. In some embodiments, the air deflector 20 is sealingly connected with the shell 10, and the air deflector 20 and the shell 10 jointly form the ventilation cavity 120, that is, the shell 10 is used as a part of the cavity wall of the ventilation cavity 120, so as to save materials and reduce production cost. The air deflector 20 can be fixed to the shell 10 by means of, but not limited to, clamping, welding, screwing and the like.

[0060] Please refer to Figures 1 to 4 , Figure 2 It is shown that the electronic device 100 in Figure 1 omits the structure of the shell 10, Figure 3 is a front view of the electronic device 100 omitting the shell 10, Figure 4 is a left view of the electronic device 100 omitting the shell 10. It should be noted that, in order to more clearly describe, the X-axis direction is defined as the direction parallel to the length direction of the electronic device 100, the Y-axis direction is defined as the direction parallel to the width direction of the electronic device 100, and the Z-axis direction is defined as the direction parallel to the thickness direction of the electronic device 100. The X-axis direction, the Y-axis direction and the Z-axis direction jointly constitute three orthogonal directions of the electronic device 100. Exemplarily, the arrow direction of the X-axis direction in Figure 1 is rear, and the direction opposite to the arrow direction of the X-axis direction is front, that is, the X-axis direction is the front-rear direction of the electronic device 100; the arrow direction of the Y-axis direction is left, and the direction opposite to the arrow direction of the Y-axis direction is right, that is, the Y-axis direction is the left-right direction of the electronic device 100; the arrow direction of the Z-axis direction is up, and the direction opposite to the arrow direction of the Z-axis direction is down, that is, the Z-axis direction is the up-down direction of the electronic device 100.

[0061] In the embodiment, the plurality of branch air ducts 23 include a first air duct 231 and a second air duct 232. The first air duct 231 and the second air duct 232 can be vertically arranged, that is, the extension direction of the first air duct 231 is perpendicular to the extension direction of the second air duct 232. In some embodiments, the first air duct 231 and the second air duct 232 can also be arranged at other angles, for example, the extension direction of the first air duct 231 and the extension direction of the second air duct 232 form an obtuse angle or an acute angle.

[0062] In some embodiments, the first air duct 231 and the second air duct 232 are respectively arranged on the same side of the main air duct 21 in the height direction of the main air duct 21, i.e., the first air duct 231 and the second air duct 232 are both on the lower side of the main air duct 21. The second air duct 232 is arranged independently of the main air duct 21. In other embodiments, the first air duct 231 is arranged on the lower side of the main air duct 21, the second air duct 232 is arranged on the rear side of the main air duct 21, and part of the structure of the second air duct 232 constitutes part of the main air duct 21. The second air duct 232 is configured in a T-shaped structure. The length direction of the main air duct 21 is parallel to the length direction of the electronic device 100, the width direction of the main air duct 21 is parallel to the width direction of the electronic device 100, and the height direction of the main air duct 21 is parallel to the height direction of the electronic device 100.

[0063] The plurality of heat dissipation devices 30 includes a first heat dissipation device 310 corresponding to the first air duct 231 and a second heat dissipation device 320 corresponding to the second air duct 232. The first heat dissipation device 310 and the second heat dissipation device 320 are arranged in sequence along the length direction of the electronic device 100 (i.e., the X-axis direction). The airflow flowing through the first air duct 231 flows to the first heat dissipation device 310 to dissipate heat from the first heat dissipation device 310, and the airflow flowing through the second air duct 232 flows to the second heat dissipation device 320 to dissipate heat from the second heat dissipation device 320. In this way, on the one hand, by arranging the first air duct 231 and the second air duct 232 in different directions, the airflow flowing through the first heat dissipation device 310 and flowing to the second heat dissipation device 320 is reduced, thereby better preventing the heat flowing through the first heat dissipation device 310 from heating the second heat dissipation device 320. On the other hand, by providing cold airflow to the first heat dissipation device 310 and the second heat dissipation device 320 through the first air duct 231 and the second air duct 232 respectively, the heat dissipation effect of the first heat dissipation device 310 and the second heat dissipation device 320 is improved.

[0064] In some embodiments, as Figures 2 to 4As shown, the number of the first air ducts 231 includes two. Two first air ducts 231 are respectively arranged at two side portions of the main air duct 21 in the width direction (i.e., the Y-axis direction) of the main air duct 21, and the second air duct 232 is arranged at one side portion of the main air duct 21 in the length direction of the main air duct 21. In the present embodiment, the two first air ducts 231 are located at the left side portion and the right side portion of the main air duct 21, and the second air duct 232 is located at the rear side portion of the main air duct 21, so that more space can be provided in the area enclosed by the two first air ducts 231 and the second air duct 232 for installing other functional devices of the electronic device 100, such as the liquid cooling radiator 60, so that the overall structure of the electronic device 100 is more compact. In the present embodiment, one of the first air ducts 231, the second air duct 232, and the other of the first air ducts 231 are arranged in sequence along the width direction of the main air duct 21, and the second air duct 232 and the second device to be cooled 320 are arranged in sequence along the length direction of the main air duct 21. In this way, the first device to be cooled 310 and the second device to be cooled 320 can be dispersedly arranged in different areas of the isolation cavity 130, so that the air supply and cooling range can be adjusted by optimizing the layout of the first air duct 231 and the second air duct 232, and the air force is dispersed to make the cooling effect of the electronic device 100 better. It should be noted that the number and arrangement of the first air ducts 231 and the second air duct 232 can be set according to the arrangement of the devices to be cooled, and the present application does not make specific limitations.

[0065] For example, according to the distribution of the devices to be cooled, the first air duct 231 is located between the main air duct 21 and the first device to be cooled 310, the second air duct 232 is located at the front side of the second device to be cooled 320 and is arranged close to the second device to be cooled 320, so as to optimize the arrangement of the first device to be cooled 310 and the second device to be cooled 320 in the limited internal space of the electronic device 100, reduce the overall volume of the machine, and optimize the air cooling direction of the air duct to enhance the cooling effect. The first air duct 231 is arranged to extend along the length direction of the main air duct 21, and the second air duct 232 is arranged to extend along the width direction of the main air duct 21, so as to ensure that the first air duct 231 and the second air duct 232 have enough space to arrange the air outlet hole 230 to provide appropriate air volume, and to ensure that the installation positions of the first device to be cooled 310 and the second device to be cooled 320 are matched within a certain range to cool the first device to be cooled 310 and the second device to be cooled 320, thereby improving the cooling efficiency of the electronic device 100.

[0066] In some embodiments, the projection of the first air duct 231 on a projection plane perpendicular to the length of the main air duct 21 is spaced apart from or adjacent to the projection of the second air duct 232 on the projection plane. That is, the first air duct 231 and the second air duct 232 are staggered along the width of the main air duct 21. This allows the airflow from the first air duct 231 to pass through the first device to be cooled 310 and quickly be directed to the exterior of the housing 10, avoiding the second air duct 232. This enhances the heat dissipation effect of the first device to be cooled 310 and the second device to be cooled 320. In other embodiments, the projection of the first air duct 231 on a projection plane perpendicular to the length of the main air duct 21 is arranged so that the projection of the second air duct 232 on the projection plane partially overlaps.

[0067] In some embodiments, the outlet directions of at least two branch air ducts 23 are different. The outlet direction of the first air duct 231 can form an angle with the outlet direction of the second air duct 232, thereby reducing the heating and wind blocking effect of the first heat dissipation device 310 located upstream of the air outlet path on the second heat dissipation device 320 downstream, thereby improving the heat dissipation effect and meeting the heat dissipation requirements of each heat dissipation device. Please refer to Figures 5 to 7 , Figure 5 yes Figure 2 A schematic structural diagram of a first embodiment of the air guide cover 20 of the electronic device 100 from a first perspective, Figure 6 yes Figure 5 A schematic structural diagram of the air guide cover 20 of the electronic device 100 from a second perspective, Figure 7 for Figure 6 yes Figures 2 to 7 FIG1 is a schematic structural diagram of the air scoop 20 of the electronic device 100 from a third perspective. In this embodiment, the air outlet direction of the first air duct 231 is perpendicular to the air outlet direction of the second air duct 232, thereby simplifying the structure of the air scoop 20 and improving the assembly efficiency between the air scoop 20 and the housing 10.

[0068] The first air duct 231 is provided with a first air outlet hole 2301 facing the first device to be cooled 310, and the second air duct 232 is provided with a second air outlet hole 2302 facing the second device to be cooled 320. On the one hand, the airflow can be gathered and then flow to the first device to be cooled 310 and the second device to be cooled 320 to increase the turbulence of the indoor airflow, thereby improving the cooling effect. On the other hand, the size of the first air outlet hole 2301 and the second air outlet hole 2302 can more accurately realize the distribution of the airflow, thereby improving the cooling effect of the server. The first air outlet hole 2301 is provided at the bottom of the first air duct 231, and the second air outlet hole 2302 is provided at the rear side of the second air duct 232. In this embodiment, the second air outlet hole 2302 can penetrate through the rear side wall of the main air duct 21 and the second air duct 232, thereby reducing the air resistance, increasing the air flow, and thereby enhancing the cooling effect. In some embodiments, the second air outlet hole 2302 can also only penetrate through the rear side wall of the second air duct 232. It can be understood that the number, size and arrangement position of the air outlet hole 230 can be designed according to the actual situation, and the present application is not limited specifically.

[0069] In other embodiments, the air outlet direction of the first air duct 231 and the air outlet direction of the second air duct 232 form an acute angle or an obtuse angle. The air outlet direction of the first air duct 231 and the air outlet direction of the second air duct 232 can be designed according to the layout of the device to be cooled 30 in the isolation cavity 130, and the present application is not limited specifically.

[0070] In some embodiments, the third device to be cooled 330 corresponds to the first air duct 231, and the third device to be cooled 330 is arranged apart from the first device to be cooled 310, so that the first device to be cooled 310 and the third device to be cooled 330 share the same first air duct 231, thereby concentrating on the first device to be cooled 310 and the third device to be cooled 330, and simplifying the air duct design of the air deflector 20. In this embodiment, the structure of the third device to be cooled 330 can be different from the structure of the first device to be cooled 310, and in other embodiments, the structure of the third device to be cooled 330 can be the same as the structure of the first device to be cooled 310. For example, as shown in FIG. 2, the third device to be cooled 330 is a storage device, and the first device to be cooled 310 is a server. Figure 8As shown, the third heat-dissipation device 330 and the first heat-dissipation device 310 are arranged along the X-axis direction in sequence. The first air duct 231 is provided with a third air outlet hole 2303 facing the third heat-dissipation device 330. The third air outlet hole 2303 is arranged in a spaced manner with the first air outlet hole 2301, i.e., the first air outlet hole 2301 and the third air outlet hole 2303 are different holes, so as to realize accurate air supply. In some embodiments, the first air outlet hole 2301 and the third air outlet hole 2303 can be the same hole, so as to simplify the manufacturing process of the first air duct 231 and the assembly process of the first heat-dissipation device 310 and the third heat-dissipation device 330. In the embodiment, the third heat-dissipation device 330 is a fuse. In other embodiments, the third heat-dissipation device 330 is but not limited to other functional devices such as transistors, capacitors, inductors, etc.

[0071] In some embodiments, the electronic device 100 further comprises a regulating valve for regulating the air flow, so as to realize personalized accurate air supply, so that the air flow reaches the required place, and ensures that each heat-generating device in the electronic device 100 can be effectively cooled. The regulating valve can be arranged in the main air duct 21; or in the branch air duct 23; or at the position corresponding to the air outlet hole 230.

[0072] Optionally, the height of the first air duct 231 is less than the height of the second air duct 232, so as to increase the height of the air-cooled heat sink 32 of the second heat-dissipation device 320 in the limited space of the shell 10, to improve the heat dissipation effect of the second heat-dissipation device 320, and realize the function of the second air duct 232 as a baffle to block the air flow from the first heat-dissipation device 310 guided by the first air duct 231 to the second heat-dissipation device 320, realize directional guidance of air force, and enhance the heat dissipation effect. The length of the first air duct 231 is less than or equal to the length of the main air duct 21, and the width of the first air duct 231 is less than the width of the main air duct 21; the length of the second air duct 232 is less than the length of the main air duct 21, and the width of the second air duct 232 is less than or equal to the width of the main air duct 21, so as to optimize the spatial layout of the first air duct 231 and the second air duct 232 on the main air duct 21, improve the space utilization of the shell 10, and avoid air flow turbulence through the first air duct 231 and the second air duct 232, so as to have good heat dissipation effect and simple structure and easy to process and produce.

[0073] It should be noted that the term "length" herein refers to the distance between the two sides of the main air duct 21 in the length direction of the main air duct 21; the term "width" refers to the distance between the two sides of the main air duct 21 in the width direction of the main air duct 21; and the term "height" refers to the distance between the two sides of the main air duct 21 in the height direction of the main air duct 21.

[0074] Please refer to Figure 8 , Figure 1 isFigure 1 The electronic device 100 in the air flow direction schematic diagram in the working mode. When the electronic device 100 is in the fresh air mode, the heat dissipation fan guides the air flow from the air inlet 101 into the main air duct 21, and is guided out to the first and third heat dissipation devices 310 and 330 through the first air duct 231, and is guided out to the second heat dissipation device 320 through the second air duct 232. Specifically, the first air duct 231 guides the air flow to the first heat dissipation device 310 through the first exhaust hole 2301 in the Z-axis direction, and to the third heat dissipation device 330 through the third exhaust hole 2303 in the Z-axis direction, and the air flow passing through the first heat dissipation device 310 and the air flow passing through the third heat dissipation device 330 are combined and then discharged out of the shell 10 through the air outlet 102; the second air duct 232 guides the air flow to the second heat dissipation device 320 through the second exhaust hole 2302 in the X-axis direction, and the air flow passing through the second heat dissipation device 320 is then discharged out of the shell 10 through the air outlet 102. The main air duct 21 is connected with the first and second air ducts 231 and 232. Thus, on the one hand, the electronic device 100 of the present application can realize accurate air duct management by controlling the size of the air inlet 101 and / or the first, second and third exhaust holes 2301, 2302 and 2303, which is beneficial to reducing energy consumption; on the other hand, the multiple heat dissipation devices are separated and cooled by different branch air ducts 23, and the flow direction of the air flow is changed by the design of the branch air ducts 23 to meet the diversified use requirements of the cooling air direction, and the problem of heating and blocking of the upstream heat dissipation device 30 on the downstream heat dissipation device 30 in the front-to-back air duct scene is solved, thereby improving the cooling effect of the electronic device 100; on the other hand, the main air duct 21 and the branch air ducts are designed to be closed except for the first, second and third exhaust holes 2301, 2302 and 2303, thereby realizing the heat leakage prevention design of the electronic device 100 and improving the cooling effect of the liquid cooling radiator 60.

[0075] Please refer to Figure 9 and Figure 9 , Figure 1 is Figure 1 The structure schematic diagram of the second embodiment of the air deflector 20A of the electronic device 100 in the working mode. In the second embodiment of the present application, the same contents as the first embodiment will not be described again, and the structure of the air deflector 20A is different from that of the air deflector 20 of the first embodiment.

[0076] Specifically, the number of the first air ducts 231 of the branch air ducts 23 includes at least three. The at least three first air ducts 231 are arranged on the same side of the Z-axis direction of the main air duct 21, i.e., the at least three first air ducts 231 are arranged to extend below the main air duct 21. The at least three first air ducts 231 are arranged in sequence and spaced apart in the width direction of the main air duct 21. Specifically, two of the first air ducts 231 are arranged at the two side portions of the main air duct 21, and the remaining first air ducts 231 are arranged at the middle portion of the main air duct 21. The second air duct 232 is arranged at one side portion, e.g., the rear side portion, of the main air duct 21 in the length direction of the main air duct 21, thereby enhancing the heat dissipation effect of the first air duct 231 corresponding to the heat dissipation device 30 located at the middle portion of the main air duct 21.

[0077] In the present embodiment, the number of the first air ducts 231 of the air deflector 20A includes three. The plurality of heat dissipation devices 30 includes three first heat dissipation devices 310 corresponding to the three first air ducts 231, respectively. The height of the first air duct 231 located at the middle portion of the main air duct 21 is equal to or less than the height of the second air duct 232, thereby avoiding air flow turbulence and enhancing the heat dissipation effect. Each first air duct 231 is provided with a first air outlet hole 2301 on the side away from the main air duct 21. In the present embodiment, the rear side of the second air duct 232 is provided with a second air outlet hole 2302. The first air outlet hole 2301 can partially or entirely penetrate the bottom wall of the first air duct 231, and the second air outlet hole 2302 can only penetrate the rear wall of the second air duct 232; or simultaneously penetrate the rear wall of the second air duct 232 and the rear wall of the main air duct 21. The air outlet directions of the three first air ducts 231 are perpendicular to the air outlet direction of the second air duct 232. In other embodiments, the air outlet directions of at least some of the first air ducts 231 are at other angles, e.g., acute angles or obtuse angles, with the air outlet direction of the second air duct 232.

[0078] Please refer to Figure 10 and Figure 10 , Figure 1 are Figure 1 the structure schematic diagram of the third embodiment of the air deflector 20B of the electronic device 100 in . In the third embodiment of the present application, the structure of the air deflector 20B of the third embodiment can be applied to the structure of the air deflector 20, 20A of the first embodiment or the second embodiment without conflict. In the present embodiment, the same content as the first embodiment will not be described again. Different from the first embodiment, the plurality of branch air ducts 23B of the air deflector 20B further include a third air duct 233, and the third air duct 233 is arranged spaced apart from the first air duct 231 in the height direction of the main air duct 21, so that each heat dissipation device 30 can be more dispersedly arranged in different areas of the isolation chamber 130. Therefore, by optimizing the layout of the branch air ducts 23B, the air supply and heat dissipation range can be adjusted, and the heat dissipation effect of the electronic device 100 is improved.

[0079] The air outlet direction of the third air duct 233 is different from the air outlet directions of the first air duct 231 and the second air duct 232, so that the spatial layout of each device to be cooled 30 in the electronic device 100 is more optimized, the structure is more compact, the function is more diverse, and the heat dissipation is more efficient. In the embodiment, the air outlet direction of the first air duct 231 is perpendicular to the air outlet directions of the first air duct 231 and the third air duct 233, and the air outlet direction of the third air duct 233 is opposite to the air outlet direction of the first air duct 231, that is, the air outlet direction of the first air duct 231 is downward, the air outlet direction of the second air duct 232 is rearward, and the air outlet direction of the third air duct 233 is upward. In other embodiments, the air outlet direction of the third air duct 233 can be arranged at other angles with respect to the air outlet directions of the first air duct 231 and the second air duct 232. In the embodiment, a fourth exhaust hole 2304 is formed on the side of the third air duct 233 away from the main air duct 21, so as to realize that the devices to be cooled are arranged above and below the air baffle 20B.

[0080] Optionally, the extension direction of the third air duct 233 can be the same as the extension direction of the first air duct 231 and / or the second air duct 232, that is, the extension direction of the third air duct 233 is parallel to the first air duct 231; or the extension direction of the second air duct 232, so as to facilitate the processing technology of the air baffle 20. In some embodiments, the extension direction of the third air duct 233 can be different from the extension direction of the first air duct 231 and / or the second air duct 232. The extension direction of the third air duct 233 can be designed according to the setting position of the device to be cooled corresponding to the third air duct 233, which is not limited in the present application.

[0081] Please refer to Figure 11 and Figure 11 , Figure 1 is ​ the structure schematic diagram of the fourth embodiment of the air baffle 20C of the electronic device 100 in

[0082] In the embodiment, the first air duct 231C includes a plurality of sub-air ducts 235 arranged at intervals. The plurality of sub-air ducts 235 are located at the front side of the second air duct 232, thereby reducing heat crosstalk between the plurality of heat dissipation devices 30 and enhancing the heat dissipation effect. Each sub-air duct 235 can correspond to a corresponding first heat dissipation device, thereby more accurately controlling air supply. In the embodiment, the first air outlet hole 2301C of each sub-air duct 235 is downward (i.e., the air outlet direction of the sub-air duct 235). In some embodiments, the air outlet holes of at least some of the sub-air ducts 235 can also be oriented differently. The air outlet direction of each sub-air duct 235 can be designed according to the arrangement position of the heat dissipation device corresponding to the sub-air duct 235, which is not limited in the present application.

[0083] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and units described above can refer to the corresponding processes in the foregoing method embodiments, which will not be repeated here. In the above embodiments, the description of each embodiment has its own emphasis, and the parts not described in detail in a certain embodiment can be referred to the related description of other embodiments.

[0084] It should be noted that, for the foregoing method embodiments, in order to simply describe, they are all expressed as a series of action combinations, but those skilled in the art should know that the present application is not limited to the action sequence described, because according to the present application, certain steps can be performed in other sequences or at the same time. Secondly, those skilled in the art should know that the embodiments described in the specification all belong to preferred embodiments, and the actions and modules involved are not necessarily necessary for the present application.

[0085] In several embodiments provided in the present application, it should be understood that the disclosed system, device and method can be implemented by other manners. For example, the device embodiments described above are only schematic.

[0086] The above, the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. An electronic device, comprising: The electronic device comprises: a shell having an inner cavity; a wind deflector accommodated in the inner cavity, the wind deflector separating the inner cavity of the shell into a ventilation cavity and an isolation cavity, the ventilation cavity comprising a main air duct and a plurality of branch air ducts in communication with the main air duct, each of the branch air ducts being provided with an air outlet hole in communication with the isolation cavity; one end of the shell is provided with an air inlet hole in communication with the main air duct, and the other end of the shell is provided with an air outlet hole in communication with the isolation cavity; the wind deflector and the shell are independently arranged, and the inner cavity of the wind deflector serves as the ventilation cavity; or the wind deflector is sealingly connected with the shell, and the wind deflector and the shell jointly form the ventilation cavity; a plurality of devices to be cooled, the plurality of devices to be cooled being arranged in the isolation cavity; a cooling fan for guiding air flow into the air inlet hole, the air flow guided into the air inlet hole flowing into the plurality of branch air ducts through the main air duct, and then flowing to the plurality of devices to be cooled through the plurality of branch air ducts to cool the plurality of devices to be cooled.

2. The electronic device of claim 1, wherein, The electronic device further comprises a liquid cooling radiator in the isolation cavity, the liquid cooling radiator being used to contact the plurality of devices to be cooled to cool the plurality of devices to be cooled.

3. The electronic device of any of claims 1-2, wherein, The device to be cooled comprises a heating element and a heat sink arranged on the heating element, and the air outlet hole faces a windward surface of the heat sink; or The device to be cooled comprises a heating element, and the air outlet hole faces a heating surface of the heating element.

4. The electronic device of claim 3, wherein, The distance between the air outlet hole and the windward surface or the heating surface is less than or equal to 5 mm.

5. The electronic device of any of claims 1-4, wherein, The plurality of branch air ducts comprises a first air duct and a second air duct, and the plurality of devices to be cooled comprises a first device to be cooled corresponding to the first air duct and a second device to be cooled corresponding to the second air duct, the first device to be cooled and the second device to be cooled being arranged in sequence along a length direction of the electronic device; Air flow flowing through the first air duct flows to the first device to be cooled to cool the first device to be cooled, and air flow flowing through the second air duct flows to the second device to be cooled to cool the second device to be cooled.

6. The electronic device of claim 5, wherein, The first air duct is arranged in extension along the length direction of the electronic device, and the second air duct is arranged in extension along a width direction of the electronic device.

7. The electronic device of any of claims 5-6, wherein, The air outlet direction of the first air duct and the air outlet direction of the second air duct form an included angle.

8. The electronic device of claim 7, wherein, The air outlet direction of the first air duct is perpendicular to the air outlet direction of the second air duct.

9. The electronic device of any of claims 5-8, wherein, The height of the first air duct is less than the height of the second air duct.

10. The electronic device of any of claims 5-9, wherein, The number of the first air ducts comprises two, and the two first air ducts are arranged at two side portions of the main air duct in the width direction of the electronic device, respectively, and the second air duct is arranged at one side portion of the main air duct in the length direction of the electronic device.

11. The electronic device of any of claims 5-10, wherein, The projection of the first air duct on a projection plane in the width direction of the electronic device and the projection of the second air duct on the projection plane are arranged in separation or in abutment.

12. The electronic device of any of claims 5-9, wherein, The number of the first air ducts comprises at least three, and the at least three first air ducts are arranged in sequence and at intervals in the width direction of the electronic device, wherein two of the first air ducts are arranged at two side portions of the main air duct, and the remaining first air ducts are arranged at a middle portion of the main air duct, and the second air duct is arranged at one side portion of the main air duct in the length direction of the electronic device.

13. The electronic device of any of claims 5-12, wherein, The plurality of branch air ducts further comprises a third air duct, and the third air duct and the first air duct are respectively located at different sides of the main air duct in the height direction of the electronic device.

14. The electronic device of claim 13, wherein, At least one of the first air duct, the second air duct and the third air duct comprises a plurality of sub-air ducts arranged at intervals.

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