Heat dissipation device for electronic components

Abstract

The present invention relates to a heat dissipating device for electronic components, comprising: a first chamber provided with a printed circuit board on which a heat generating component is mounted; a second chamber provided with an injection portion which injects refrigerant and a refrigerant supply portion which supplies the refrigerant to the injection portion, the second chamber being used for heat exchange with heat transferred from the first chamber; a heat transfer portion provided between the first chamber and the second chamber, which receives heat from the heat generating component of the first chamber to supply the second chamber; and a condensing portion which condenses the refrigerant injected into the second chamber, a plurality of evaporation inducing ribs being formed on the surface of the heat transfer portion exposed to the second chamber, the plurality of evaporation inducing ribs being induced in such a manner that liquid refrigerant injected by the injection portion flows downward along a zigzag-shaped corrugated flow path after being adsorbed, thereby providing the advantage of improving heat dissipation performance without expanding the size.

Description

Technical Field

[0001] This invention relates to a cooling apparatus for electronic components, and more specifically, to a cooling apparatus for electronic components that effectively dissipates heat generated in heat sources such as antenna elements mounted on a printed circuit board. Background Technology

[0002] Wireless communication technologies, such as Multiple Input Multiple Output (MIMO), are techniques that use multiple antennas to dramatically increase data transmission capacity. MIMO is a spatial multiplexing technique where different data are transmitted through separate transmitting antennas in the transmitter, and the receiver distinguishes the transmitted data through appropriate signal processing.

[0003] Therefore, by simultaneously increasing the number of transmit and receive antennas, channel capacity can be increased, allowing more data to be transmitted. For example, when the number of antennas is increased to 10, approximately 10 times the channel capacity is ensured compared to the current single-antenna system using the same frequency band.

[0004] 4G LTE-advanced uses 8 antennas, while current pre-5G products are developing and installing 64 or 128 antennas. It is anticipated that 5G will use base station equipment with even more antennas, a technology known as Massive MIMO. Current cell operation is two-dimensional; conversely, with the introduction of Massive MIMO, three-dimensional beamforming can be achieved, hence it is also called FD-MIMO (Full Dimension).

[0005] In massive MIMO technology, as the number of antennas (ANTs) increases, the number of transmitters and filters also increases accordingly. Even so, due to rental costs or space constraints at the installation site, RF components (antennas, filters, power amplifiers, transceivers, etc.) are made small, lightweight, and inexpensive. Massive MIMO requires high power to extend coverage, and the power consumption and heat generated by this high power negatively impact weight and size reduction.

[0006] In particular, when a MIMO antenna, which combines RF and digital components in a stacked structure, is placed in a confined space, the necessity of designing the multiple layers constituting the MIMO antenna to be compact and miniaturized in order to maximize ease of installation or space utilization becomes prominent. In this case, a new heat dissipation structure design is required to address the heat generated in the communication components installed in multiple layers.

[0007] Korean Patent Publication No. 10-2019-0118979 (published on October 21, 2019) (hereinafter referred to as the "Prior Art") discloses a "Multiple Input Multiple Output Antenna Device" applicable to designing multiple layers constituting a MIMO antenna into a compact and miniaturized heat dissipation structure.

[0008] The aforementioned prior art includes: a heat dissipation body, with heat dissipation pins protruding therefrom; and a plurality of unit heat dissipation bodies disposed on the heat dissipation body. The plurality of unit heat dissipation bodies are configured such that one end contacts a heat-generating element of the antenna substrate, and the other end is provided with a plurality of sub-heat dissipation pins to dissipate heat conducted from the heat-generating element to the outside.

[0009] However, in the prior art described above, the structure used to dissipate heat from the heating element is formed only by a mechanical structure that serves as an air-cooled heat dissipation structure for heat exchange with the outside air. As a result, it is not only difficult to dissipate heat quickly, but also requires more mechanical heat dissipation structures to dissipate heat quickly, thus leading to the problem of increased size. Summary of the Invention

[0010] Technical issues

[0011] The present invention is proposed to solve the above-mentioned technical problems, and its purpose is to provide a heat dissipation device for electronic components that prevents size expansion and improves heat dissipation performance.

[0012] Meanwhile, another object of the present invention is to provide a heat dissipation device for electronic components that sprays refrigerant onto one side of a space in which a heating element is disposed, causing the sprayed refrigerant to evaporate rapidly, thereby rapidly dissipating the heat generated in the heating element.

[0013] Furthermore, another object of the present invention is to provide a heat dissipation device for electronic components that, after actively drawing in stored refrigerant through a refrigerant supply section inside a second chamber that performs substantial heat dissipation, sprays it outward from the second chamber and uses an air supply section to increase the condensation rate of refrigerant passing through the outside air.

[0014] The problems of this invention are not limited to those mentioned above. Those skilled in the art to which this invention pertains will clearly understand other problems not mentioned from the following description.

[0015] Technical solution

[0016] An embodiment of the heat dissipation device for electronic components of the present invention includes: a first chamber, on which a printed circuit board in which a heat-generating element is mounted; a second chamber, on which a spray section and a refrigerant supply section are disposed, wherein the spray section sprays refrigerant and the refrigerant supply section supplies refrigerant to the spray section, and the second chamber is used for heat exchange with heat transferred from the first chamber; a heat transfer section disposed between the first chamber and the second chamber, which receives heat from the heat-generating element in the first chamber and supplies it to the second chamber; and a condensation section for condensing the refrigerant sprayed into the second chamber, wherein a plurality of evaporation-inducing ribs are formed on the surface of the heat transfer section exposed to the second chamber, and the plurality of evaporation-inducing ribs induce the liquid refrigerant sprayed by the spray section to flow downward in a Z-shaped direction after adsorption.

[0017] The aforementioned plurality of evaporation-inducing ribs include: a refrigerant inflow portion, which is arranged close to the aforementioned spray portion and is arranged vertically; a one-sided inclined portion, which extends downward and bends to one side from the lower end of the aforementioned refrigerant inflow portion; and a other-sided inclined portion, which extends downward and bends to the other side from the lower end of the aforementioned one-sided inclined portion. The aforementioned one-sided inclined portion and the other-sided inclined portion can be repeatedly formed.

[0018] Furthermore, the aforementioned plurality of evaporation-inducing ribs can protrude from the aforementioned first chamber toward the direction where the aforementioned second chamber is provided, thereby adsorbing the refrigerant sprayed from the aforementioned spray section. The aforementioned plurality of evaporation-inducing ribs can form a Z-shaped flow path, so as to increase the heat exchange area and adsorption time for heat exchange with the heat exchange element transferred from the aforementioned first chamber.

[0019] Furthermore, the heat transfer section includes: a dividing plate portion configured to divide the first chamber and the second chamber; and a plurality of contact protrusions formed protrudingly on one side of the dividing plate portion exposed to the first chamber, and in contact with the printed circuit board, wherein the plurality of evaporation induction ribs can be integrally formed protrudingly on the one side of the dividing plate portion exposed to the second chamber.

[0020] Furthermore, the second chamber is a space recessed forward from the edge of the dividing plate, and a heat dissipation plate constituting the condensation section can be formed by covering and joining the dividing plate behind it.

[0021] Furthermore, the shape of the aforementioned multiple contact protrusions can be designed according to the heat generation at the mounting location of the aforementioned heat-generating element on the aforementioned printed circuit board.

[0022] Furthermore, the aforementioned condensation section includes: a heat dissipation plate portion, which forms the rear side shape of the aforementioned second chamber and constitutes a portion of the space of the aforementioned second chamber; and a plurality of condensation ribs, which are formed protrudingly toward the rear side of the aforementioned heat dissipation plate portion and recessed in the space of the aforementioned second chamber to facilitate the expansion of a portion of the space of the aforementioned second chamber. The condensation ribs are formed in multiple stages in the vertical direction of the aforementioned heat dissipation plate portion, and the plurality of condensation ribs can be formed such that the vertical cross-sectional area gradually decreases toward the rear side of the aforementioned heat dissipation plate portion.

[0023] Furthermore, the second chamber is a space recessed rearward from the edge of the heat dissipation plate portion, and a dividing plate portion constituting the heat transfer portion can be formed by covering and joining the heat dissipation plate portion in front of it.

[0024] Furthermore, the aforementioned multiple condensation ribs can be formed such that the upper inner side faces downward in the rearward direction, and the lower inner side faces upward in the rearward direction.

[0025] Furthermore, the upward tilt angle of the aforementioned inner lower surface relative to any horizontal plane can be greater than or the same as the downward tilt angle of the aforementioned inner upper surface relative to any horizontal plane.

[0026] Furthermore, the internal surfaces of the aforementioned multiple condensation ribs can be formed to have multiple minute height differences.

[0027] Furthermore, the aforementioned condensation section may also include multiple support rods to support the front ends of the multiple condensation ribs and the back of the dividing plate that separates the first chamber and the second chamber.

[0028] Furthermore, the heat dissipation device for the aforementioned electronic component may also include an antenna cover panel, which is configured to form the front side shape of the first chamber. The first chamber may be formed between the antenna cover and the dividing plate portion that forms the heat transfer portion, and the second chamber may be formed between the dividing plate portion and the heat dissipation plate portion of the condensation portion that forms the rear side shape of the second chamber.

[0029] Furthermore, the heat dissipation device for the aforementioned electronic component may also include a mounting bracket, which surrounds the rear side of the aforementioned heat sink portion, with its left and right ends respectively fixed to the dividing plate portion of the aforementioned heat transfer portion, thereby achieving connection with the specified portion through the aforementioned mounting bracket.

[0030] Furthermore, the heat dissipation device for the aforementioned electronic components may also include a shielding seal, which intervenes along the edge between the dividing plate portion and the heat dissipation plate portion to shield and seal the second chamber and the external space.

[0031] Furthermore, the heat transfer section can be configured such that the heat transferred from the first chamber to the second chamber is exchanged with the total heat of the refrigerant, and the refrigerant stored in the second chamber can achieve phase change of evaporation and condensation through enthalpy change of sensible heat and latent heat, and can transfer heat from the first chamber to the second chamber.

[0032] Furthermore, the heat dissipation device for the aforementioned electronic components may also include an air supply section, which is located behind the aforementioned condenser section and supplies external air to one side of the aforementioned condenser section.

[0033] Furthermore, the aforementioned air supply section may include: multiple blowers arranged in multiple stages at the rear of the aforementioned condenser section; and a pair of guide bracket panels, which, through the aforementioned pair of guide bracket panels, enable the multiple blowers to be combined with the multiple condenser ribs while guiding the air supplied by the multiple blowers to the side.

[0034] Furthermore, the aforementioned air supply unit may also include a printed circuit board for air supply control, which is disposed on one of the pair of guide bracket panels to facilitate control of the operation of the plurality of blowers.

[0035] Furthermore, the heat dissipation device of the aforementioned electronic component may also include a pair of air supply sections, which are respectively disposed at the left and right ends of the aforementioned condenser section, and supply external air in the left and right horizontal directions.

[0036] Furthermore, the refrigerant supply section may be formed by a refrigerant supply pump located in the lower part of the second chamber, and the injection section may be located in the upper part of the second chamber and formed by a refrigerant nozzle that sprays the refrigerant supplied by the refrigerant supply section. The refrigerant supply pump and the refrigerant nozzle may be connected by a refrigerant flow pipe.

[0037] Furthermore, the refrigerant flow tube can be vertically fixed to the left or right end of the dividing plate, the refrigerant nozzle can be connected to the upper end of the refrigerant flow tube and horizontally fixed to the upper end of the dividing plate, and the refrigerant nozzle can be formed with multiple nozzle holes that discharge the refrigerant downwards, spaced apart in the left and right directions.

[0038] Furthermore, the heat dissipation device of the aforementioned electronic component may also include a pair of connecting pins configured to pass through the heat transfer section between the first chamber and the second chamber, thereby electrically connecting the printed circuit board inside the first chamber and the refrigerant supply pump inside the second chamber.

[0039] Furthermore, the heat dissipation device for the aforementioned electronic components may also include a pressure regulator, which regulates the pressure inside the aforementioned second chamber.

[0040] Furthermore, the aforementioned heat-generating element may include at least one of an antenna element and a wireless signal processing unit (Radio Unit).

[0041] The effects of the invention

[0042] According to one embodiment of the heat dissipation device for electronic components of the present invention, a spray section sprays refrigerant supplied by a refrigerant supply section into a second chamber, and the heat transferred from the first chamber to the second chamber by the heat transfer section exchanges heat with each other through the total heat of the refrigerant. The refrigerant stored in the second chamber undergoes a phase change of evaporation and condensation through the enthalpy change of sensible heat and latent heat, and heat is transferred from the first chamber to the second chamber. Through the phase change of the refrigerant, the heat generated by the heat-generating element installed on the printed circuit board disposed in the first chamber can be quickly dissipated.

[0043] Furthermore, according to one embodiment of the heat dissipation device for electronic components of the present invention, the condenser section for the phase change of the refrigerant is effectively cooled by the air supply section, thereby greatly improving the heat dissipation performance.

[0044] The effects of this invention are not limited to those mentioned above. Those skilled in the art can clearly understand other effects not mentioned from the description of the scope of protection of this invention. Attached Figure Description

[0045] Figure 1a and Figure 1b This is a perspective view of a heat dissipation device for an electronic component according to an embodiment of the present invention.

[0046] Figure 2a and Figure 2b This is a perspective view of a heat dissipation device for an electronic component according to another embodiment of the present invention.

[0047] Figure 3 To indicate Figure 2a and Figure 2b An exploded perspective view of the antenna radome panel configuration within the structure.

[0048] Figure 4a and Figure 4b for Figure 1a and Figure 1b The various decomposed 3D diagrams.

[0049] Figure 5 for Figure 2a An exploded 3D diagram.

[0050] Figure 6 For along Figure 1a A cross-sectional view along line AA.

[0051] Figure 7 For along Figure 1a A cutaway 3D view of the BB line and a partial enlarged view.

[0052] Figure 8 This is a cut-through perspective view of a portion of the back side of the heat transfer section, along with a magnified view of a part thereof.

[0053] Figure 9a and Figure 9b An exploded perspective view showing the heat transfer section and the condensation section.

[0054] Figure 10a and Figure 10b This is an exploded perspective view showing the structure of each air supply section in the heat dissipation device for electronic components according to one embodiment and another embodiment of the present invention.

[0055] Figure 11 This is a rear perspective view showing a modified example of the air supply section in the structure of a heat dissipation device for an electronic component according to another embodiment of the present invention.

[0056] Figure 12 for Figure 2b An exploded 3D diagram.

[0057] Figure 13 For along Figure 12 A cutaway 3D model of a portion of the BB line.

[0058] Explanation of reference numerals in the attached figures

[0059] 1: Heat dissipation device for electronic components; 10: Partition board section

[0060] 11: Edge of the dividing plate 12: Threaded joint

[0061] 13: Contact protrusion; 15: Evaporation induction rib

[0062] 16: Refrigerant inlet section 17: One-sided inclined section

[0063] 18: The other side inclined section 19: Refrigerant outlet

[0064] 20: Antenna radome panel; 30: Printed circuit board

[0065] 31: Heating element; 33: Heat transfer groove

[0066] 40: Heat sink section; 43: Refrigerant storage rib

[0067] 45: Condensation ribs 46: Fine height difference section

[0068] 51: Blower; 53a, 53b: Guide bracket panel

[0069] 55: Printed circuit board for blower 60: Mounting bracket

[0070] 61a: Left end 61b: Right end

[0071] 63: Placement slot; 70: Shielding seal.

[0072] 81: Refrigerant Supply Section 83: Injection Section

[0073] 85: Refrigerant flow pipe; 87: Connecting pin

[0074] 90: Pressure regulator; 110: Heat transfer section

[0075] 140: Condensation section; 150: Air supply section

[0076] C1: First chamber; C2: Second chamber Detailed Implementation

[0077] Hereinafter, the heat dissipation device for electronic components according to embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0078] It should be noted that, in labeling the structural elements of each figure, the same structural element should be labeled with the same identifier, even if it is shown in other figures. Furthermore, in describing embodiments of the present invention, detailed descriptions of known structures or functions are omitted when it is determined that such descriptions would hinder understanding of the embodiments.

[0079] In describing the structural elements of embodiments of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are used only to distinguish one structural element from another, and the nature, order, or sequence of these structural elements is not limited by the terminology. Furthermore, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. As terms defined in commonly used dictionaries should be interpreted as having a meaning consistent with the context of the relevant art, they are not to be construed as having an ideal or overly formal meaning unless explicitly defined herein.

[0080] Figure 1a and Figure 1b This is a perspective view showing a heat dissipation device for an electronic component according to an embodiment of the present invention. Figure 2a and Figure 2b This is a perspective view showing a heat dissipation device for an electronic component according to another embodiment of the present invention. Figure 3 To indicate Figure 2aand Figure 2b An exploded perspective view of the antenna radome panel configuration within the structure. Figure 4a and Figure 4b for Figure 1a and Figure 1b The various decomposed 3D diagrams, Figure 5 for Figure 2a An exploded 3D diagram.

[0081] like Figures 1a to 4b According to the reference, the heat dissipation device 1 for electronic components of the present invention includes: a first chamber C1, on which a printed circuit board 30 is disposed; a second chamber C2, which is disposed separately from the first chamber C1 to facilitate cooling of heat transferred from the first chamber C1; a heat transfer section 110 for transferring heat from the first chamber C1 to the second chamber C2; and a condensation section 140 for condensing refrigerant injected into the second chamber C2.

[0082] The first chamber C1 may be equipped with a printed circuit board 30. The printed circuit board 30 may mount multiple heating elements 31. These heating elements 31 may be mounted on the front side of both sides of the printed circuit board 30. However, it is not limited to mounting the multiple heating elements 31 only on the front side of the printed circuit board 30; they may be mounted on both sides of the printed circuit board 30, or even on the back side. In particular, heating elements 31 that generate relatively more heat may be mounted on the back side of the printed circuit board 30, allowing them to directly contact the front surface of the heat transfer section 110 (described later) for direct heat conduction.

[0083] On the other hand, the first chamber C1 can be in a non-vacuum state. Meanwhile, the second chamber C2 can be a space where the pressure can be adjusted using the pressure regulator 90 described later.

[0084] That is, a pressure regulator 90 for adjusting the internal pressure of the second chamber C2 may be provided at the upper or lower part of the second chamber C2. The pressure regulator 90 can automatically adjust according to the internal pressure of the second chamber C2, and the heat dissipation performance can be arbitrarily adjusted by the user by manually adjusting the internal pressure of the second chamber C2 through manual opening and closing.

[0085] like Figure 3 Referring to the above, the edge 11 of the dividing plate portion 10 protrudes forward to form a space constituting the first chamber C1, and an antenna cover panel 20 may be attached to the edge 11 of the dividing plate portion 10. Therefore, the first chamber C1 can be defined as an internal space shielded by the dividing plate portion 10 and the antenna cover panel 20.

[0086] The second chamber C2 may be equipped with a spray section 83 and a refrigerant supply section 81. The spray section 83 can spray refrigerant. The refrigerant supply section 81 may be formed by a refrigerant supply pump located in the lower part of the second chamber C2. Meanwhile, the spray section 83 may be located in the upper part of the second chamber C2 and is formed by a refrigerant nozzle that sprays the refrigerant supplied by the refrigerant supply section 81. The refrigerant supply pump, which is the refrigerant supply section 81, and the refrigerant nozzle, which is the spray section 83, can be connected by a refrigerant flow pipe 85. The specific connection relationship between the refrigerant supply section 81, the refrigerant flow pipe 85, and the spray section 83, as well as the refrigerant supply structure, will be explained in more detail later.

[0087] The heat transfer section 110 can be disposed between the first chamber C1 and the second chamber C2. Therefore, the front side of the dividing plate section 10 performs the function of capturing the heat generated from the first chamber C1, and the back side of the dividing plate section 10 performs the function of dispersing the heat transferred from the first chamber C1 through the dividing plate section 10 to the second chamber C2 by means of a plurality of evaporation induction ribs 15 integrally formed thereon.

[0088] This heat transfer section 110 serves to transfer the heat generated from the first chamber C1 to the second chamber C2 via direct heat conduction, while simultaneously exchanging heat with the refrigerant injected into the second chamber C2. Specifically, the refrigerant supplied by the refrigerant supply section 81 via the injection section 83 utilizes the latent heat adsorbed on the back side of the second chamber C2 side of the heat transfer section 110 and vaporized to cool the sensible heat transferred from the first chamber C1 to the heating element 31 of the printed circuit board 30, thereby causing the refrigerant to evaporate.

[0089] In this heat transfer section 110, the heat transferred from the first chamber C1 to the second chamber C2 can be exchanged through the total heat of the refrigerant. At the same time, the refrigerant stored in the second chamber C2 undergoes phase change through evaporation and condensation due to the enthalpy change of sensible heat and latent heat, thus transferring heat from the first chamber C1 to the second chamber C2.

[0090] like Figures 1a to 4b According to the reference, the condenser 140 may include: a heat dissipation plate 40, formed of a thermally conductive material, forming the rear side shape of the second chamber C2 and constituting a part of the space of the second chamber C2; and a plurality of condensation ribs 45, which are formed protruding towards the rear side of the heat dissipation plate 40 and recessed in the space of the second chamber C2 to facilitate the expansion of a part of the space of the second chamber C2, and are formed in multiple stages in the vertical direction of the heat dissipation plate 40.

[0091] This condenser section 140 performs the function of re-condensing and liquefying the liquid refrigerant injected through the injection section 83 into the second chamber C2 via the back surface of the heat transfer section 110, as described above, based on the principles of sensible heat and latent heat. The specific condensation principle and structure of the condenser section 140 will be explained in more detail later.

[0092] like Figure 1a and Figure 1b Referring to the present invention, a heat dissipation device 1 for an electronic component can be fixedly mounted on a predetermined part such as a support rod (not shown) by means of a mounting bracket 60 that is combined with the back side of the heat dissipation plate portion 40 described later.

[0093] However, it is not necessary to fix it to the support pole (not shown) with the help of the mounting bracket 60, as... Figure 2a and Figure 2b In the heat dissipation device 1 of the electronic component of another embodiment of the present invention, which is referenced in the present invention, it can be tilted or rotated while being connected to the support rod (not shown), and can be connected by means of the clamping device 200, so as to easily set the directionality of the antenna device, which includes electronic components such as antenna elements as heat-generating elements 31.

[0094] like Figure 2b According to the reference, the clamping device 200 may include: an inclined portion 210, which is coupled to the back of the heat sink portion 40 and tilts and rotates in the up and down direction about a left and right tilt axis (not marked in the figure); a rotating portion 220, which realizes the tilting engagement of the inclined portion 210 and rotates in the left and right direction about an up and down rotation axis (not marked in the figure); and a connecting portion 230, which realizes the rotation engagement of the rotating portion 220 and realizes the engagement with the support rod.

[0095] The clamping device 200 is equipped with an electrically driven tilting motor (not shown) and a rotary motor (not shown), which can remotely adjust the tilting and rotary movements.

[0096] On the other hand, such as Figure 1a As referenced herein, the first chamber C1 can be defined as the space formed by the dividing plate portion 10 described later and the antenna cover panel 20 combined with its front end.

[0097] The radome panel 20 can be attached by a screw fixing method, which uses a fixing screw (not shown) to fasten to the edge end 11 of the dividing plate portion 10.

[0098] However, the radome panel 20 does not necessarily need to be joined by screws, such as Figure 2a and Figure 2b and Figure 3Referring to the above, the antenna cover panel 20 can be attached to the front end of the dividing plate portion 10 by means of multiple clip components 25. For this purpose, a front end locking portion 25a of the clip is formed at the edge of the antenna cover panel 20, and a rear end locking portion 25b of the clip is formed at the edge of the dividing plate portion 10. The front end and rear end of each of the multiple clip components 25 can be elastically deformed and fixed to the front end locking portion 25a and the rear end locking portion 25b of the clip.

[0099] On the other hand, such as Figure 4a and Figure 4b As referenced herein, the second chamber C2 can be defined as the space formed between the rear space of the dividing plate portion 10 (described later) and the front end of the heat dissipation plate portion 40.

[0100] More in detail, such as Figure 4a Referring to the above, a predetermined space is formed on the back side of the dividing plate portion 10, recessed to a predetermined depth from the rear end to the front, which can be covered and combined with the heat dissipation plate portion 40 to form the space of the second chamber C2 described above. The front ends of the plurality of condensing ribs 45 provided in the condensation portion 140 of the heat dissipation plate portion 40 can be set to the same position as the front end of the heat dissipation plate portion 40.

[0101] However, the second chamber C2 does not necessarily need to be as described. Figure 4a The definition referenced in the text, such as Figure 4b Referring to the above, the rear end of the heat transfer section 110 formed on the back side of the dividing plate section 10 is set to the same position as the rear end of the dividing plate section 10, and the front ends of the plurality of condensing ribs 45 in the condensation section 140 are set to be located at a predetermined depth behind the front end of the heat dissipation plate section 40 (refer to the above). Figure 4b As indicated by reference numeral D1 in the attached drawing, by dividing the front cover of the plate portion 10 and the heat sink portion 40, it can be essentially defined as having a second chamber C2 formed on the side of the heat sink portion 40. In this case, the heat sink portion 40 can be interpreted as serving as an integral heat sink housing for the condenser portion 140.

[0102] On the other hand, such as Figures 1a to 4b According to reference, the heat dissipation device 1 for electronic components in one embodiment of the present invention may further include an air supply section 150.

[0103] The air supply unit 150 is located behind the condenser unit 140 and functions to supply outside air by utilizing the condenser unit 140, which is made of metal, to more rapidly condense the evaporating refrigerant inside the second chamber C2. The specific air supply principle and structure of the air supply unit 150 will be explained in more detail later.

[0104] Figure 6 For along Figure 1a A cross-sectional view of line AA. Figure 7 For along Figure 1aA cutaway 3D view of the BB line and a partial enlarged view. Figure 8 This is a cut-through perspective view of a portion of the back side of the heat transfer section, along with a magnified view of a part thereof.

[0105] like Figure 6 and Figure 7 Referring to the present invention, a heat dissipation device 1 for an electronic component according to an embodiment of the present invention may include a first chamber C1 and a second chamber C2. A printed circuit board 30 is vertically disposed in the first chamber C1 in the upward and downward direction, and at least one of a plurality of electrically driven heating elements 31 may be mounted on the front or back of the printed circuit board 30. In this embodiment, the heating elements 31 are mounted on the front of both sides of the printed circuit board 30, and the back of both sides of the printed circuit board 30 are formed with a plurality of heat transfer grooves 33 into which a plurality of contact protrusions 13 of the heat transfer portion 110 described later are inserted and surface-contacted.

[0106] The heating element 31 mounted on the front of the printed circuit board 30 may include at least one of an antenna element and a wireless signal processing unit (Radio Unit). The antenna element can transmit and receive wireless signals. The wireless signal processing unit can process wireless signals.

[0107] In this way, when the heat-generating element 31 is composed of an antenna element, the heat dissipation device 1 of the electronic component in this embodiment of the invention can become a multiple-input multiple-output antenna device for a communication service provider that sets up a base station.

[0108] Furthermore, when the heat-generating element 31 is composed of a wireless signal processing unit, the heat dissipation device 1 of the electronic component in this embodiment of the invention can be a wireless signal processing device of a network equipment company that establishes a base station.

[0109] like Figure 6 and Figure 7 According to the reference, the first chamber C1 and the second chamber C2 can be divided into front and rear sections by the heat transfer section 110.

[0110] More specifically, the heat transfer section 110 may include: a dividing plate section 10 dividing the space between the first chamber C1 and the second chamber C2; and a plurality of contact protrusions 13, which are formed on one side exposed to the first chamber C1 side of the dividing plate section 10 and in contact with the printed circuit board 30.

[0111] Meanwhile, the heat transfer section 110 may also include a plurality of evaporation-inducing ribs 15 integrally formed on the back side corresponding to the second chamber C2 side. Preferably, the dividing plate section 10, the plurality of contact protrusions 13, and the plurality of evaporation-inducing ribs 15 are integrally formed and are made of a metal material with excellent thermal conductivity.

[0112] In the dividing plate portion 10, the edge portion 11 protrudes forward to form a space constituting the first chamber C1. An antenna radome panel 20 may be attached to the edge 11 of the dividing plate portion 10. Therefore, the first chamber C1 can be defined as an internal space shielded by the dividing plate portion 10 and the antenna radome panel 20. However, the first chamber C1 need not necessarily be defined as described above. Although not shown, it can be defined as a substantial space formed by the rearward extension of the edge portion of the antenna radome panel 20.

[0113] Preferably, the printed circuit board 30 is disposed between the partition plate portion 10 constituting the first chamber C1 and the radome panel 20, and is disposed in close contact with the partition plate portion 10 so that the plurality of contact protrusions 13 formed on the front side of the partition plate portion 10 can be inserted into the heat transfer groove 33 formed on the back side of the printed circuit board 30 for surface contact. However, when the heat transfer groove 33 is not separately provided on the back side of the printed circuit board 30, and the heating element 31 is directly mounted, the plurality of contact protrusions 13 can directly make surface thermal contact with the back side of the heating element 31. The size and shape of the heat transfer groove 33 and the size and shape of the plurality of contact protrusions 13 formed therein can be designed according to the heat generation of the mounting position of the heating element 31 mounted on the front side of the printed circuit board 30.

[0114] like Figure 7 and Figure 8 Referring to the enlarged view, a plurality of evaporation-inducing ribs 15 formed on the back side of the side exposed to the second chamber C2 side of the double-sided dividing plate portion 10 may include: a refrigerant inflow portion 16, disposed close to the spray portion 83 disposed on the upper side of the second chamber C2, and arranged vertically; a one-sided inclined portion 17, extending inclinedly downward to one side from the lower end of the refrigerant inflow portion 16; and a other-sided inclined portion 18, extending inclinedly downward to the other side from the lower end of the one-sided inclined portion 17. Meanwhile, as Figure 5 Referring to the enlarged view, the plurality of evaporation induction ribs 15 may also include a refrigerant outlet portion 19 extending vertically upward and downward for a predetermined length at the end of the repeated shape of the inclined portion 17 on one side and the inclined portion 18 on the other side on the lower side of the second chamber C2.

[0115] In this way, in the evaporation-inducing ribs 15 formed on the back side of the dividing plate portion 10, while one side inclined portion 17 and the other side inclined portion 18 are repeatedly formed in an upward and downward direction, multiple Z-shaped corrugated refrigerant flow paths that allow liquid refrigerant to be adsorbed and flow can be formed between adjacent evaporation-inducing ribs 15. The repeated formation of one side inclined portion 17 and the other side inclined portion 18 is to maximize the total heat exchange surface area of ​​the multiple evaporation-inducing ribs 15. In this way, the multiple evaporation-inducing ribs 15 perform the function of increasing the heat exchange area transferred from the heating element 31 and the refrigerant adsorption time.

[0116] That is, when the liquid refrigerant in the spray form sprayed by the spray section 83 is adsorbed in the upper part of the second chamber C2, it evaporates in a gaseous state due to the heat transferred from the first chamber C1, which helps the unevaporated remaining liquid refrigerant to flow downward in a Z-shape along the refrigerant flow path and evaporate at a faster speed.

[0117] Furthermore, the heat transfer section 110 can be defined as a structure that utilizes the principle of mutual heat exchange between sensible heat transferred from the first chamber C1 to the second chamber C2 and the latent heat of refrigerant evaporation in the liquid state. More specifically, in the heat transfer section 110, the heat transferred from the first chamber C1 to the second chamber C2 can be mutually exchanged through the total heat of the refrigerant. The refrigerant filling the second chamber C2 achieves phase change through evaporation and condensation by the enthalpy change of the sensible heat and latent heat of the refrigerant, thus transferring heat from the first chamber C1 to the second chamber C2.

[0118] On the other hand, such as Figure 6 and Figure 7 According to the reference, the condensation section 140 may include: a heat dissipation plate section 40, which forms the rear side shape of the second chamber C2 and forms a part of the space of the second chamber C2; and a plurality of condensation ribs 45, which are formed protruding towards the rear side of the heat dissipation plate section 40 and recessed towards the rear in the space of the second chamber C2 to facilitate the expansion of a part of the space of the second chamber C2, and are formed in multiple stages in the vertical direction of the heat dissipation plate section 40.

[0119] The condenser section 140 can perform the function of condensing the gaseous refrigerant evaporated by the multiple evaporation induction ribs 15 into a liquid refrigerant through heat exchange.

[0120] Multiple cooling ribs 45 can penetrate the heat dissipation plate portion 40 to form an empty space connected to the second chamber C2, and protrude to the rear side of the heat dissipation plate portion 40 to form a predetermined length, having a rectangular vertical cross section that is roughly elongated from left to right.

[0121] More in detail, such as Figure 6 and Figure 7 As referenced herein, the multiple condensation ribs 45 may be formed such that their vertical cross-sectional area gradually decreases towards the rear side of the heat dissipation plate portion 40. Specifically, the multiple condensation ribs 45 may be formed such that their upper inner surface slopes downwards towards the rear, and their lower inner surface slopes upwards towards the rear.

[0122] Therefore, when the liquid refrigerant condenses (condenses) on the inner surface of the multiple condensing ribs 45 inside the second chamber C2, it can flow down along the inclined upper inner surface or the inclined lower inner surface in the direction of gravity, and the liquid refrigerant is easily captured in the lower space of the second chamber C2.

[0123] Preferably, among the plurality of condensing ribs 45, the upward tilt angle of the inner lower surface relative to any horizontal plane is greater than or the same as the downward tilt angle of the inner upper surface relative to any horizontal plane, which makes it easier to capture liquid refrigerant to the lower side of the second chamber C2.

[0124] Simultaneously, the internal surfaces of the multiple condensing ribs 45 can be formed with multiple fine height difference portions 46. This is to increase the surface area of ​​the multiple condensing ribs 45 to shorten the condensation (condensation) time of the gaseous evaporating refrigerant. That is, by treating the surface of the multiple condensing ribs 45, the hydrophobicity of the surface is improved to increase the refrigerant recovery. Therefore, the vaporized refrigerant evaporating from the interior of the second chamber C2 can exchange heat with the multiple condensing ribs 45, and while transferring heat to the multiple condensing ribs 45, it rapidly condenses (condenses) by utilizing the increased surface area of ​​the multiple fine height difference portions 46 and flows down into the lower space of the second chamber C2, where it is captured.

[0125] That is, the condenser 140 can be defined as a structure that uses the sensible heat of the outside air and the latent heat of the refrigerant condensing in the gas phase in the second chamber C2 to exchange heat with each other.

[0126] And, as Figure 5 and Figure 6 According to the reference, the condenser section 140 may also include multiple support rods 48 that support the front ends of multiple condenser ribs 45 and the back end of the dividing plate section 10 at the front and rear ends respectively. The multiple support rods 48 perform the function of supporting the front ends of the multiple condenser ribs 45 that are spaced forward and backward to form the second chamber C2 at multiple points, so as to prevent the shape from being deformed by external forces.

[0127] On the other hand, the edge portion 11 of the dividing plate portion 10 in the structure of the heat transfer portion 110 is combined with the edge portion of the heat dissipation plate portion 40 in the structure of the condensation portion 140 in a face-to-face contact manner, and the shielding seal 70 can be inserted along the edge between the dividing plate portion 10 and the heat dissipation plate portion 40 to shield and seal the second chamber C2 and the external space.

[0128] The shielding seal 70 is made of rubber. When the partition plate portion 10 of the heat transfer section 110 and the heat dissipation plate portion 40 of the condenser section 140 are joined by the force of multiple assembly screws, it performs a tight fit between the back of the partition plate portion 10 and the front of the heat dissipation plate portion 40, respectively, to completely seal the space between the second chamber C2 and the external space. Therefore, it prevents the refrigerant filled in the second chamber C2 from leaking to the outside.

[0129] Figure 9a and Figure 9b To show the exploded perspective view of the heat transfer section and the condensation section, Figure 10a and Figure 10bThis is an exploded perspective view showing the structure of each air supply section in the heat dissipation device for electronic components according to one embodiment and another embodiment of the present invention. Figure 11 This is a rear perspective view showing a modified example of the air supply section in the structure of a heat dissipation device for an electronic component according to another embodiment of the present invention. Figure 12 for Figure 2b Decomposed 3D diagram, Figure 13 For along Figure 12 A cutaway 3D model of a portion of the BB line.

[0130] like Figure 9a and Figure 9b According to the reference, a refrigerant supply unit 81 may be provided in the lower part of the space of the second chamber C2, and an injection unit 83 may be provided in the upper part of the space of the second chamber C2.

[0131] The refrigerant supply section 81 may be formed by a refrigerant supply pump located in the lower part of the second chamber C2, and the injection section 83 may be located in the upper part of the second chamber C2 and is formed by a refrigerant nozzle that sprays the liquid refrigerant supplied by the refrigerant supply section 81 in a spray form.

[0132] Meanwhile, the refrigerant supply pump and refrigerant nozzle can be connected via refrigerant flow pipe 85.

[0133] More in detail, such as Figure 6 and Figure 9b As referenced herein, the refrigerant flow pipe 85 can be vertically fixed to one of the left or right ends of the dividing plate portion 10. The lower end of the refrigerant flow pipe 85 can be connected to a refrigerant supply pump, and the upper end of the refrigerant flow pipe 85 can be connected to a refrigerant nozzle.

[0134] On the other hand, the refrigerant nozzle can be connected in communication with the upper end of the refrigerant flow pipe 85 and fixed horizontally to the upper end of the dividing plate portion 10. The refrigerant nozzle can be formed with a plurality of nozzle holes 84 spaced apart in the left and right directions to discharge refrigerant downwards.

[0135] Therefore, when the refrigerant supply section 81 formed by the refrigerant supply pump draws and captures the liquid refrigerant in the lower space of the second chamber C2, the liquid refrigerant can be supplied to the upper space of the second chamber C2 along the refrigerant flow pipe 85. The spray section 83 formed by the refrigerant nozzle sprays the liquid refrigerant downward from the upper space of the second chamber C2 in a spray form. The liquid refrigerant is adsorbed into the multiple evaporation induction ribs 15 on the back side of the dividing plate section 10 formed in the structure of the heat transfer section 110. After evaporating in a gaseous state, the liquid refrigerant is condensed into a liquid state by the multiple condensing ribs 45 of the condensing section 140. The liquid refrigerant is then captured in the lower space of the second chamber C2. This process is repeated to dissipate the heat of the first chamber C1 more quickly.

[0136] The refrigerant supply pump, which serves as the refrigerant supply unit 81, can be fixedly installed in the liquid refrigerant storage rib 43, which is formed in the lower space of the second chamber C2 in a manner that includes more than a plurality of condensing ribs 45. The liquid refrigerant condensed and liquefied by the plurality of condensing ribs 45 can be stored in the liquid refrigerant storage rib 43, so that at least the refrigerant intake pipe (not shown) of the refrigerant supply pump is immersed in it.

[0137] At the same time, such as Figure 6 As referenced herein, the refrigerant supply pump can be electrically connected to the printed circuit board 30 of the first chamber C1 via a pair of connecting pins 87. More specifically, as... Figure 6 Referring to the above, a pair of connecting pins 87 are configured to pass through the heat transfer portion 110 (i.e., the dividing plate portion 10) between the first chamber C1 and the second chamber C2, and perform the function of connecting the printed circuit board 30 in the first chamber C1 and the refrigerant supply pump in the second chamber C2 in a manner that enables electrical communication. One of the pair of connecting pins 87 performs a function corresponding to the cathode power supply terminal, and the other of the pair of connecting pins 87 performs a function corresponding to the anode power supply terminal, thereby controlling the supply and cutoff of the operating power to the refrigerant supply pump.

[0138] Reference Figure 9a , Figure 9b and Figure 10a The air supply section 150 may include: multiple blowers 51 arranged in multiple stages on the rear side of the condenser section 140; a pair of guide bracket panels 53a and 53b, which, by means of the pair of guide bracket panels 53a and 53b, enable the multiple blowers 51 to be combined with the multiple condenser ribs 45 while guiding the air supplied by the multiple blowers 51 to the side.

[0139] That is, the multiple blowers 51 can perform the function of supplying external air from the rear to the space between the multiple condensing fins 45. Therefore, by supplying external air supplied by the multiple blowers 51 to the outside of the multiple condensing fins 45, the condensation time of the gaseous refrigerant present inside the second chamber C2 can be shortened.

[0140] Among them, such as Figure 10a Referring to the above, a pair of guide bracket panels 53a and 53b perform the function of blocking the left and right portions respectively based on the multiple blowers 51 in the middle of the rear side of the multiple condensing ribs 45 in the structure of the condensing section 140, so that the external air flowing in by the multiple blowers 51 flows laterally between the multiple condensing ribs 45.

[0141] On the other hand, such as Figure 10bAccording to the reference, in the structure of the air supply section 150, a pair of guide bracket panels 53a and 53b serve to guide the air supply direction of multiple blowers 51, while multiple heat dissipation pins 54 are formed on their back sides, which can absorb the heat transferred through the front end of multiple condensing fins 45 for heat dissipation.

[0142] And, as Figure 10a Referring to the present invention, in one embodiment of the electronic component heat dissipation device, multiple fans 51 are directly assembled onto a pair of guide brackets 53a and 53b, respectively. However, as... Figure 10b Referring to the above, multiple blowers 51 can also be fixed to the blower bracket 52 at one time, so as to achieve connection with a pair of guide brackets 53a and 53b, and then be integrally assembled onto the pair of guide brackets 53a and 53b. For example, Figure 10b Referring to the above, the air supply section 150 may further include a support cover panel 57 covering the front of the blower bracket 52. Preferably, the support cover panel 57 is in the form of a grille that allows external air to flow in from the rear using the blower 51.

[0143] At the same time, such as Figures 9a to 10a Referring to the reference, the air supply unit 150 may further include a printed circuit board 55 for the air supply fan disposed on one of the pair of guide bracket panels 53a, 53b, to control the operation of the plurality of air supply fans 51. Although not shown, the printed circuit board 55 for the air supply fan is configured to be energized with the printed circuit board 30 located inside the first chamber C1, or to be controlled in a manner that allows it to receive power independently of the printed circuit board 30 of the first chamber C1 to supply operating power to the plurality of air supply fans 51.

[0144] On the other hand, such as Figure 11 Referring to the reference, air supply units 150a and 150b can be provided in pairs at the left and right ends of the condenser unit 140. The air supply units 150a and 150b can be configured such that the air supply direction varies depending on the height of the multiple condenser ribs 45. For example... Figure 11 As referenced in the text, the blower 51 located at the top of the condenser section 140 is configured to blow air in one of the left and right horizontal directions through at least three condenser ribs 45, and the blower 51 located below it is configured to blow air in the other of the left and right horizontal directions through at least three condenser ribs 45. The air blowing direction can be configured to be repeatedly in the opposite state.

[0145] Among them, such as Figure 12As referenced herein, when the air supply section 150 is arranged in an odd number at the center of the back side of the condenser section 140, the rear ends of the plurality of condenser ribs 45 can be in the form of pointed ribs 45', so as to minimize the air supply resistance using the air supply fan 51. The pointed ribs 45' are formed in a way that they converge towards the rear, with the ends having a more triangular cross section, so that when air is supplied between the plurality of condenser ribs 45 using the air supply fan 51, the air supply resistance can be minimized.

[0146] On the other hand, such as Figure 7 and Figure 10a According to the reference, the heat dissipation device 1 of the electronic component in one embodiment of the present invention may further include a mounting bracket 60, which surrounds the rear side of the heat dissipation plate portion 40, and the left end and the right end are respectively fixed to the dividing plate portion 10 of the heat transfer portion 110, thereby achieving the connection with the specified portion by means of the mounting bracket 60.

[0147] like Figure 7 and Figure 10a As referenced herein, the mounting bracket 60 performs the function of connecting the antenna device (not shown) on the printed circuit board 30 to a support rod (not shown) and other specified parts at the installation location.

[0148] The left end 61a and right end 61b of the mounting bracket 60 extend forward by a predetermined length from the rear side of the air supply section 150 toward the left and right sides of the heat sink section 40, respectively, so as to allow temporary assembly to be made at the threaded joints 13 (see reference) provided at the left and right ends of the dividing plate section 10. Figure 4a After the unshown fixing screw is placed in the screw placement slot 63, which is open from bottom to top, the fixing is completed by firmly tightening the fixing screw.

[0149] The left end 61a and right end 61b of the mounting bracket 60 are connected by the bracket body panel 62. The bracket body panel 62 is fixed to the aforementioned support rod and other specified parts, and can fix the heat dissipation device 1 of the electronic component in this embodiment.

[0150] However, it is not necessary to provide a mounting bracket 60 for the purpose of providing a heat dissipation device 1 for the electronic components relative to the support rod. As another embodiment of the present invention, such as Figure 10b , Figures 11 to 13 According to the reference, when the clamping device 200 is installed on the support rod, the front end of the inclined portion 210 of the clamping device 200 can be directly connected to the rear end of the plurality of cooling ribs 45.

[0151] In this case, the inclined portion 210 is combined in a form that surrounds the air supply portion 150 from the rear. A pair of guide bracket panels 53a and 53b can be formed with avoidance cut-off portions 58a and 58b that cut off the specified portion, so that the connecting flange 211 formed at the front end of the inclined portion 210 can be directly connected to the rear end bolts or screws of the plurality of condensing ribs 45 without interference.

[0152] On the other hand, such as Figure 13 As referenced herein, in the structure of the condenser section 140, the front ends of the plurality of condenser ribs 45 may be integrally formed with a plurality of support rods 48, which can be screwed together with the front end of the support rods 48 and the back end of the dividing plate section 10 using assembly screws 49. However, the plurality of support rods 48 need not necessarily be integrally formed with the plurality of condenser ribs 45. Although not shown, they may be in the shape of individual rods, so that the front and rear ends are screwed together with assembly screws 49 respectively.

[0153] The above description, with reference to the accompanying drawings, details one embodiment of the heat dissipation device for the electronic component of the present invention. However, the embodiments of the present invention are not necessarily limited to the one described above. Of course, those skilled in the art can make various modifications within the equivalent scope. Therefore, the true scope of protection of the present invention is determined by the appended claims.

[0154] Industrial applicability

[0155] The present invention provides a heat dissipation device for electronic components that prevents dimensional expansion and improves heat dissipation performance by spraying refrigerant onto one side of a space where a heat-generating element is disposed, causing the sprayed refrigerant to evaporate rapidly, thereby rapidly dissipating the heat generated in the heat-generating element.

Claims

1. A heat dissipation device for an electronic component, characterized in that, include: The first chamber is equipped with a printed circuit board containing heating elements; The second chamber is equipped with a spray section and a refrigerant supply section. The spray section sprays refrigerant, and the refrigerant supply section supplies refrigerant to the spray section. The second chamber is used to exchange heat with the heat transferred from the first chamber. A heat transfer section, disposed between the first chamber and the second chamber, receives heat from the heating element in the first chamber and supplies it to the second chamber; and The condenser section condenses the refrigerant injected into the second chamber. A plurality of evaporation-inducing ribs are formed on the surface of the heat transfer section exposed to the second chamber, and the plurality of evaporation-inducing ribs induce the liquid refrigerant sprayed by the spray section to flow downward in a zigzag direction after adsorption. The aforementioned multiple evaporation-inducing ribs include: The refrigerant inlet section is arranged close to the aforementioned injection section and is vertically arranged vertically. A sloping portion extends downwards and to one side from the lower end of the refrigerant inlet; and The other inclined portion extends downwards and bends at an angle from the lower end of the aforementioned inclined portion on one side. The aforementioned inclined portion on one side and inclined portion on the other side are repeatedly formed; The aforementioned condensation section includes: The heat sink portion forms the rearward shape of the second chamber and constitutes a portion of the space of the second chamber; and Multiple condensation ribs are formed protruding towards the rear side of the aforementioned heat dissipation plate portion and recessed within the space of the aforementioned second chamber to facilitate the expansion of a portion of the space of the aforementioned second chamber. They are formed in multiple stages in the vertical direction of the aforementioned heat dissipation plate portion. The aforementioned condensation ribs are formed such that the vertical cross-sectional area gradually decreases towards the rear of the heat dissipation plate.

2. The heat dissipation device for electronic components according to claim 1, characterized in that, The aforementioned plurality of evaporation-inducing ribs protrude from the first chamber toward the direction where the second chamber is located, thereby adsorbing the refrigerant sprayed from the injection section. The aforementioned plurality of evaporation-inducing ribs form a Z-shaped flow path to increase the heat exchange area and adsorption time for heat exchange with the heat-generating element transferred from the first chamber.

3. The heat dissipation device for electronic components according to claim 1, characterized in that, The aforementioned heat transfer section includes: The dividing plate is configured to divide the space between the first chamber and the second chamber; and Multiple contact protrusions are formed prominently on one side of the first chamber of the aforementioned partition plate, exposing one side and contacting the aforementioned printed circuit board. The aforementioned plurality of evaporation-inducing ribs are integrally formed on one side of the second chamber of the aforementioned dividing plate portion, which is exposed on the other side.

4. The heat dissipation device for electronic components according to claim 3, characterized in that, The second chamber is a space recessed forward from the edge of the dividing plate, and a heat dissipation plate constituting the condensation section is formed by covering and joining the dividing plate behind it.

5. The heat dissipation device for electronic components according to claim 3, characterized in that, The aforementioned multiple contact protrusions are shaped with reference to the heat generated at the mounting location of the aforementioned heat-generating element on the aforementioned printed circuit board.

6. The heat dissipation device for electronic components according to claim 1, characterized in that, The second chamber is a space recessed rearward from the edge of the heat sink portion, and a dividing plate portion constituting the heat transfer portion is formed by covering and joining the heat sink portion in front of it.

7. The heat dissipation device for electronic components according to claim 1, characterized in that, The aforementioned multiple condensation ribs are formed such that the upper inner side slopes downward in a rearward direction, and the lower inner side slopes upward in a rearward direction.

8. The heat dissipation device for electronic components according to claim 7, characterized in that, The upward tilt angle of the lower inner surface relative to any horizontal plane is greater than or the same as the downward tilt angle of the upper inner surface relative to any horizontal plane.

9. The heat dissipation device for electronic components according to claim 1, characterized in that, The internal surfaces of the aforementioned multiple condensation ribs are formed to have multiple minute height differences.

10. The heat dissipation device for electronic components according to claim 1, characterized in that, The aforementioned condensation section also includes multiple support rods to support the front ends of the multiple condensation ribs and the back of the dividing plate that separates the first chamber and the second chamber.

11. The heat dissipation device for electronic components according to claim 1, characterized in that, It also includes an antenna radome configured to form the front side profile of the first chamber. The first chamber is formed between the antenna radome and the partition plate constituting the heat transfer section. The second chamber is formed between the dividing plate portion and the heat dissipation plate portion of the condensation portion that constitutes the rear side shape of the second chamber.

12. The heat dissipation device for electronic components according to claim 11, characterized in that, It also includes a mounting bracket, which surrounds the rear side of the heat sink portion, with its left and right ends fixed to the dividing plate portion of the heat transfer portion, and the mounting bracket is used to achieve the connection with the specified portion.

13. The heat dissipation device for electronic components according to claim 11, characterized in that, It also includes a shielding seal that intervenes along the edge between the dividing plate and the heat dissipation plate to shield and seal the second chamber and the external space.

14. The heat dissipation device for electronic components according to claim 1, characterized in that, The heat transfer section is configured such that the heat generated from the first chamber to the second chamber is exchanged with each other through the total heat of the refrigerant. The refrigerant stored in the second chamber achieves phase change through evaporation and condensation by the enthalpy change of sensible heat and latent heat, and heat is transferred from the first chamber to the second chamber.

15. The heat dissipation device for electronic components according to claim 1, characterized in that, It also includes an air supply unit, which is located behind the condenser and supplies outside air to one side of the condenser.

16. The heat dissipation device for electronic components according to claim 15, characterized in that, The aforementioned air supply unit includes: Multiple blowers are arranged in a multi-stage configuration behind the aforementioned condenser section; and A pair of guide bracket panels are used to combine the multiple blowers with the multiple condenser fins while guiding the air supplied by the multiple blowers to the side.

17. The heat dissipation device for electronic components according to claim 16, characterized in that, The aforementioned air supply unit also includes a printed circuit board for air supply control, which is disposed on one of the pair of guide bracket panels to facilitate control of the operation of the plurality of air supply fans.

18. The heat dissipation device for electronic components according to claim 1, characterized in that, It also includes a pair of air supply sections, which are respectively located at the left and right ends of the condenser section, and supply external air in the left and right horizontal directions.

19. The heat dissipation device for electronic components according to claim 1, characterized in that, The aforementioned refrigerant supply section is formed by a refrigerant supply pump located in the lower part of the aforementioned second chamber. The aforementioned injection section is located in the upper part of the second chamber and is formed by a refrigerant nozzle that injects the refrigerant supplied by the refrigerant supply section. The aforementioned refrigerant supply pump is connected to the aforementioned refrigerant nozzle via a refrigerant flow pipe.

20. The heat dissipation device for electronic components according to claim 19, characterized in that, The aforementioned heat transfer section includes: The dividing plate is configured to divide the space between the first chamber and the second chamber; and Multiple contact protrusions are formed prominently on one side of the first chamber of the aforementioned partition plate, exposing one side and contacting the aforementioned printed circuit board. The aforementioned plurality of evaporation-inducing ribs are integrally formed on one side of the second chamber of the aforementioned partition plate that is exposed to the double sides of the aforementioned partition plate. Furthermore, the aforementioned refrigerant flow pipe is vertically fixed to the left or right end of the aforementioned dividing plate. The refrigerant nozzle is connected in communication with the upper end of the refrigerant flow pipe and is fixed horizontally to the upper end of the dividing plate. The refrigerant nozzle is provided with multiple nozzle holes spaced apart in the left and right directions to discharge the refrigerant downwards.

21. The heat dissipation device for electronic components according to claim 19, characterized in that, It also includes a pair of connecting pins configured to pass through the heat transfer section between the first chamber and the second chamber, so that the printed circuit board inside the first chamber and the refrigerant supply pump inside the second chamber are electrically connected.

22. The heat dissipation device for electronic components according to claim 1, characterized in that, It also includes a pressure regulator, which regulates the pressure inside the second chamber.

23. The heat dissipation device for electronic components according to claim 1, characterized in that, The aforementioned heat-generating element includes at least one of an antenna element and a wireless signal processing unit.

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