Substrate processing apparatus and substrate processing method

Abstract

The application discloses a substrate processing device and a substrate processing method, wherein the method comprises: driving at least two conveying mechanisms to move in a horizontal direction and a vertical direction to drive a carrier to sequentially pass through a feeding station, a processing station and a discharging station, and driving the at least two conveying mechanisms to alternately and continuously pass through the processing station; the conveying mechanism is attached to at least one carrier, and the carrier is configured to support at least one substrate; during the process that the carrier receives the substrate at the feeding station and then is conveyed to the processing station, the horizontal position of the substrate is adjusted by a horizontal adjustment module on the carrier. The substrate processing device and the substrate processing method of the embodiment of the application can convey the substrate to the processing station by alternately and continuously passing the at least two conveying mechanisms through the processing station, the processing equipment processes the substrate, the waiting time of laser processing is reduced, the utilization rate of laser is improved, and the production efficiency is improved.

Description

Technical Field

[0001] The present application relates to the field of laser processing technology, and in particular to a substrate processing device and a substrate processing method. Background Art

[0002] In the photovoltaic industry, laser processing has been increasingly used in solar cell processing. Traditional laser processing equipment generally uses a step-by-step structure to carry out cyclic loading, processing, unloading and other processes. After completing the corresponding operations at the loading, processing, unloading and other stations, it enters the next station. Due to the movement and laser waiting time, this processing method has low laser utilization, cannot achieve continuous processing, and the production capacity needs to be improved. At present, there is a transmission mechanism with an interactive platform structure in the existing technology, that is, while one platform is performing laser processing at the processing station, the other platform performs auxiliary processes, such as unloading, returning to the loading station, loading, etc. When one platform completes processing and transfers to the next process, the other platform moves to the processing station for processing, and the processing operation is completed in a cycle. However, due to the working conditions where the time required for the auxiliary process is longer than the time required for laser processing, there is still a waiting time for laser processing, resulting in low laser processing utilization. In addition, in order to improve the laser processing utilization rate and processing effect, high processing positioning accuracy is often required. Current laser processing equipment cannot meet high precision requirements. Summary of the Invention

[0003] The purpose of this application is to solve one of the above technical problems at least to a certain extent.

[0004] To this end, the first purpose of this application is to propose a substrate processing device to ensure that the substrate enters the processing area stably and continuously, the laser runs at full load, improves laser utilization, and increases production capacity.

[0005] The second objective of this application is to provide a substrate processing method.

[0006] To achieve the above objectives, the first embodiment of the present application provides a substrate processing device, comprising:

[0007] base;

[0008] at least two conveying mechanisms, the conveying mechanisms being disposed on the base, each of the conveying mechanisms being attached to at least one carrier, the carrier being configured to support at least one substrate;

[0009] The at least two conveying mechanisms are configured to move in a horizontal direction and a vertical direction to drive the carrier to pass through a loading station, a processing station and an unloading station in sequence, and the at least two conveying mechanisms are configured to pass through the processing stations alternately and continuously;

[0010] a processing device, disposed above a processing station and processing the substrate on the carrier when the carrier is located at the processing station;

[0011] The carrier includes a horizontal adjustment module and a support plate located on the horizontal adjustment module, the support plate is used to support at least one substrate, and the horizontal adjustment module is configured to adjust the horizontal position of the substrate on the support plate during the process of transferring the substrate from the loading station to the processing station after the support plate receives the substrate at the loading station.

[0012] Optionally, the transmission mechanism includes an X-axis module and a Z-axis module, which respectively drive the carrier to move left and right in the horizontal direction and up and down in the vertical direction.

[0013] Optionally, the X-axis module is configured to compensate for the X-direction position deviation generated when the horizontal adjustment module adjusts the position of the substrate during the process of transferring the support plate from the loading station to the processing station.

[0014] Optionally, the Z-axis module is configured to adjust the position of the substrate in the Z direction on the support plate during the process of transferring the support plate from the loading station to the processing station.

[0015] Optionally, the horizontal adjustment module includes an angle adjustment module and / or a Y-axis adjustment module, which is configured to adjust the horizontal angle position and / or Y-axis position of the substrate.

[0016] Optionally, the substrate processing device also includes a position acquisition device arranged above the loading station, and the position acquisition device is configured to obtain the position information of the substrate on the support plate after the support plate receives the substrate at the loading station, so that the horizontal adjustment module adjusts the horizontal position of the substrate according to the position information.

[0017] Optionally, each of the conveying mechanisms passes through the processing station continuously at a first transmission speed, and the first transmission speed matches the processing speed of the processing equipment above the processing station, so that the substrate just leaves the processing station when the processing is completed.

[0018] Optionally, the first transmission speed is uniform.

[0019] Optionally, the two adjacent conveying mechanisms are configured so that when or before processing of the substrate on the previous conveying mechanism is completed, the transmission speed of the latter conveying mechanism reaches the first transmission speed before being transferred from the loading station to the processing station.

[0020] Optionally, the conveying mechanism is configured to move at a speed greater than the first transmission speed during a portion of a period of time during the process of conveying from the loading station to the processing station.

[0021] Optionally, the two adjacent conveying mechanisms are configured so that when processing of the substrate on the previous conveying mechanism is completed, the interval between the next conveying mechanism moving from the loading station to the processing station and the previous conveying mechanism is the target distance.

[0022] Optionally, the target distance is equal to a first transmission speed multiplied by a processing jump time, where the first transmission speed is a speed of the conveying mechanism when passing through the processing station.

[0023] Optionally, the substrate processing device further includes a printing quality detection mechanism, which is arranged in the area between the processing station and the unloading station or at the unloading station, and the printing quality detection mechanism is configured to perform quality inspection on the processed substrate.

[0024] Optionally, the number of the carriers is two.

[0025] Optionally, the substrate processing device further includes at least one feeding device and at least one discharging device, wherein the feeding device is located at the loading station and is configured to transfer the substrate transferred by the feeding mechanism to the carrier; the discharging device is located at the unloading station and is configured to transfer the substrate from the carrier.

[0026] Optionally, the feeding device includes two conveyor belts arranged at intervals, and the feeding device includes a position sensor.

[0027] Optionally, there are two carriers, each configured to support a substrate, and there are two feeders, each configured to control the distance between the substrates on the two feeders to be a target distance. The substrate processing apparatus of the present embodiment uses at least two conveying mechanisms that alternately and continuously pass through the processing stations to convey the substrates to the processing stations, where the processing equipment processes the substrates. This reduces waiting time for laser processing, improves laser utilization, and enhances production efficiency.

[0028] To achieve the above objectives, a second embodiment of the present application provides a substrate processing method, comprising:

[0029] driving at least two conveying mechanisms to move horizontally and vertically to drive the carrier to sequentially pass through a loading station, a processing station, and an unloading station, and driving the at least two conveying mechanisms to alternately and continuously pass through the processing stations; the conveying mechanisms are attached to at least one carrier, and the carrier is configured to support at least one substrate;

[0030] During the process of the carrier receiving the substrate at the loading station and transferring it to the processing station, the horizontal position of the substrate is adjusted by the horizontal adjustment module on the carrier.

[0031] Optionally, the speed at which each of the conveying mechanisms passes through the processing station matches the processing speed, so that the substrate just leaves the processing station when processing is completed.

[0032] Optionally, when or before the processing of the substrate on the previous conveying mechanism is completed, the transmission speed of the subsequent conveying mechanism reaches a first transmission speed before being transmitted from the loading station to the processing station, and the first transmission speed is the speed of the conveying mechanism when passing through the processing station.

[0033] Optionally, when processing of the substrate on the previous conveying mechanism is completed, the interval between the next conveying mechanism moving from the loading station to the processing station and the previous conveying mechanism is the target distance.

[0034] The substrate processing method of the embodiment of the present application transmits the substrate to the processing station through at least two conveying mechanisms alternately and continuously passing through the processing station, and the processing equipment processes the substrate, thereby reducing the waiting time of laser processing, improving laser utilization, and improving production efficiency.

[0035] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 is a top view of a substrate processing device according to an embodiment of the present application;

[0037] Figure 2 is a side view of a substrate processing device according to an embodiment of the present application;

[0038] Figure 3 This is a right side view of a substrate processing device according to an embodiment of the present application;

[0039] Figure 4 is a perspective view of a substrate processing device according to an embodiment of the present application;

[0040] Figure 5 This is a front view of a carrier according to an embodiment of the present application;

[0041] Figure 6 is a perspective view of a carrier according to an embodiment of the present application;

[0042] Figure 7 This is a schematic diagram of the position of the carrier according to an embodiment of the present application;

[0043] Figure 8 is a structural schematic diagram of a substrate processing device according to another embodiment of the present application;

[0044] Figure 9is a structural schematic diagram of a substrate processing device according to another embodiment of the present application;

[0045] Figure 10 is a flow chart of a substrate processing method according to an embodiment of the present application;

[0046] Figure 11 is a flow chart of a substrate processing method according to a specific embodiment of the present application;

[0047] Figure 12 is a top view of a substrate processing device according to an embodiment of the present application;

[0048] Figure 13 is a flow chart of a substrate processing method according to another specific embodiment of the present application;

[0049] Figure 14 This is a flow chart of a substrate processing method according to another specific embodiment of the present application. DETAILED DESCRIPTION

[0050] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments of the present invention can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0051] The present invention is further described in detail below with reference to specific examples. These examples should not be construed as limiting the scope of protection claimed in the present invention.

[0052] The following describes a substrate processing device and a substrate processing method according to embodiments of the present application with reference to the accompanying drawings.

[0053] like Figure 1-Figure 3 As shown, the substrate processing apparatus includes a base 100 , at least two conveying mechanisms 200 and a processing device 400 .

[0054] The conveying mechanism 200 is disposed on the base 100 , and each conveying mechanism 200 is attached with at least one carrier 231 , which is configured to support at least one substrate 232 .

[0055] At least two conveying mechanisms 200 are configured to move in the horizontal and vertical directions to drive the carrier 231 to pass through the loading station A01, the processing station A03 and the unloading station A05 in sequence, and at least two conveying mechanisms 200 are configured to pass through the processing station A03 alternately and continuously.

[0056] The processing equipment 400 is disposed above the processing station A03 and processes the substrate 232 on the carrier 231 when the carrier 231 is located at the processing station A03.

[0057] like Figure 4-Figure 6As shown, the carrier 232 includes a horizontal adjustment module 2311 and a support plate 2312 positioned on the horizontal adjustment module 2311. The support plate 2312 is used to support at least one substrate 232. The horizontal adjustment module 2311 is configured to adjust the horizontal position of the substrate 232 on the support plate 2312 during the process of transferring the substrate 232 from the loading station A01 to the processing station A03 after the support plate 2312 receives the substrate 232 at the loading station A01. The horizontal adjustment module 2311 can adjust the horizontal position of the substrate on the support plate, achieving precise positioning and facilitating processing of the substrate by the processing equipment.

[0058] The substrate processing device of the embodiment of the present application uses at least two conveying mechanisms to alternately and continuously pass through the processing stations to convey the substrate to the processing station, and the processing equipment processes the substrate, thereby reducing the waiting time for laser processing, improving laser utilization, and improving production efficiency. Because the substrate processing device of the present application adjusts the horizontal position of the substrate 232 during the process of transferring the substrate 232 from the loading station A01 to the processing station A03 after the support plate 2312 receives the substrate 232 at the loading station A01, this not only achieves dynamic adjustment of the position of each substrate before processing, but also improves operational efficiency because it is carried out during the continuous conveying process, further reducing the waiting time for laser processing, improving laser utilization, and improving production efficiency.

[0059] In one embodiment of the present application, Figure 2-Figure 3 As shown, each conveyor mechanism 200 includes an X-axis module 210 and a Z-axis module 220. The X-axis module 210 and the Z-axis module 220 are configured to respectively drive a carrier 231 to move horizontally and vertically. The carrier 232 is located on the Z-axis module 220, which is in turn located on the X-axis module 210, which is in turn located on the base 100.

[0060] In addition, considering that adjusting the Y-direction and angular position of the substrate during the process of transferring the support plate from the loading station to the processing station may affect the position of the substrate in the X-direction, the X-axis module 210 is configured to compensate for the X-direction position deviation generated when the horizontal adjustment module 2311 adjusts the position of the substrate 232 during the process of transferring the support plate 2312 from the loading station A01 to the processing station A03.

[0061] In addition, the Z-axis module 220 is configured to adjust the Z-direction position of the substrate 232 on the support plate 2312 during the process of transferring the support plate 2312 from the loading station A01 to the processing station A03 to meet the processing scenario where there is a demand for the substrate in the Z direction during processing at the processing station.

[0062] In one embodiment of the present application, Figure 4As shown, the horizontal adjustment module 2311 includes an angle adjustment module 23111 and / or a Y-axis adjustment module 23112, which are respectively used to adjust the horizontal angle position and / or Y-axis position of the substrate 232. The substrate 232 can rotate clockwise or counterclockwise along the horizontal direction under the drive of the angle adjustment module 23111.

[0063] In another embodiment, the horizontal adjustment module 2311 includes an angle adjustment module 23111 and a Y-axis adjustment module 23112, and the angle adjustment module 23111 and the Y-axis adjustment module 23112 are located at the same level. This not only shortens the operating time in the Z direction, but also reduces the Z-axis travel and lowers the height of the entire device.

[0064] The angle adjustment module 23111 is connected to the Y-axis adjustment module 23112 via a guide rail assembly 23113. The support plate 2312 is mounted on the angle adjustment module 23111, which is in turn mounted on the guide rail assembly 23113. The guide rail assembly 23113 is connected to the Y-axis adjustment module 23112, and the Y-axis adjustment module is configured to drive the angle adjustment module 23111 and the support plate 2312 to move along the guide rail assembly 23113.

[0065] The angle adjustment module 23111 and the Y-axis adjustment module 23112 can adopt the translation adjustment module and angle adjustment module of the existing technology.

[0066] In this embodiment, the angle adjustment module 2311 and the Y-axis adjustment module 23112 are provided to adjust the position of the substrate 232 so that it matches the position of the processing equipment 400 before processing. That is, when the substrate 232 is located below the processing equipment 400, the position and angle of the substrate 232 correspond to those of the processing equipment 400, thereby achieving high-precision processing.

[0067] In the substrate processing device of the embodiment of the present application, the same conveying mechanism realizes displacement control in the X-direction and Z-direction through the X-axis module and the Z-axis module; at the same time, the Y-direction and angular direction of the carrier are independently controlled. On the one hand, the X-axis module and the Z-axis module can reduce the volume occupied by the position adjustment module and the manufacturing cost, while making the load of the substrate processing device lighter and the movement speed faster; on the other hand, this structure makes it possible to adjust the Y-direction and angular direction of the carrier during continuous movement (without the need to separately configure the time required to adjust the position of the substrate), and then the adjustment and change of direction in the X-direction can be integrated into the process of the subsequent conveying mechanism "catching up" with the previous conveying mechanism, saving the X-axis drive and helping to improve the adjustment accuracy, so that the substrate can enter the processing area continuously and stably, further improving the processing efficiency.

[0068] In one embodiment of the present application, the conveying mechanism 200 includes two carriers 231 .

[0069] The X-direction of the carriers on the same conveyor mechanism is controlled together (sharing a single X-axis module and arranged in parallel along the X-direction), while the Y-direction and angle of each carrier are independently controlled. This makes it possible to adjust the Y-direction and angle of the substrate during continuous motion. Furthermore, integrating the X-direction adjustment and direction change into the speed matching process saves the X-axis drive, making the carrier lighter and further contributing to improved adjustment accuracy.

[0070] Multiple carriers are coordinated with at least two conveying mechanisms so that the two adjacent conveying mechanisms are configured so that while the substrate on the previous conveying mechanism is continuously passing through the processing area for laser processing, the latter conveying mechanism can complete all auxiliary processes and "catch up" with the previous conveying mechanism before the previous conveying mechanism completes the laser processing. The two carriers of the latter conveying mechanism continuously enter the processing station in sequence at a certain speed and interval for processing, so that the processing is carried out continuously, the laser utilization rate is improved, and the production efficiency is improved.

[0071] See also Figure 1 and Figure 7 During the substrate transmission process, the carrier 231 loads the substrate in turn at the loading station A01 of the substrate processing device, and then continuously transmits it through the preparation station A02, the processing station A03, and the waiting station A03, and unloads it at the unloading station A05 of the substrate processing device, and then continuously transmits it to the waiting station A06, and then to the loading station A01, completing a cycle.

[0072] The specific location of each workstation can be as follows Figure 7 As shown, it includes loading station A01, preparation station A02, processing station A03, waiting station A04, unloading station A05 and waiting station A06. It should be understood that the above stations are only the definition of functional areas. For example, preparation station A02 is the functional area between loading station A01 and processing station A03, not the functional area between the loading station A01 and processing station A03. Figure 7 The specific position is displayed. Among them, the loading station A01, preparation station A02, processing station A03, waiting station A04, and unloading station A05 are basically the same in the Z direction, that is, the height is basically the same. However, due to higher processing accuracy requirements for certain processing substrates, the height in the Z direction is required when processing such substrates. The carrier 231 can be raised, that is, the height of the processing station A03 is slightly higher than that of other stations. After the processing is completed, it will be lowered to the original height. The waiting station A06 is consistent with the loading station A01 in the X direction. The difference is that the loading station A01 is located above the waiting station A06.

[0073] During the substrate conveying process, the carriers 231 of different conveying mechanisms, driven by their respective X-axis modules 210 and Z-axis modules 220, cyclically and interactively move among the loading station, preparation station, processing station, waiting station, unloading station and waiting station. As a non-limiting embodiment, the carrier of the first conveying mechanism is driven by the Z-axis module 220 to rise to the loading station A01 at the waiting station A06, where the loading of the two substrates 232 is completed, and then the substrate 232 is driven by the X-axis module 210 to move continuously in the X direction, and moves to the processing station A03 via the preparation station A02. In the process of passing through the processing station A03, the corresponding processing is completed by the processing equipment 400 arranged above the processing station, and then it continues to be driven by the X-axis module 210 to move continuously along the X direction to the waiting station A04, and then arrives at the unloading station A05, where the transfer and unloading of the substrate 232 is completed, and then it moves downward through the Z-axis module 220, and then (or at the same time) it is driven by the X-axis module 210 to move in the opposite direction to the waiting station A06, and then moves upward through the Z-axis module 220 to the loading station A01, completing a cycle. The movement of the carrier of the second conveyor mechanism is similar to that of the carrier of the first conveyor mechanism, except that the movement of the carrier of the second conveyor mechanism precedes the movement of the carrier of the first conveyor mechanism. The first conveyor mechanism and the second conveyor mechanism cyclically interact to complete the corresponding processing.

[0074] In another embodiment, Figure 1 As shown, the substrate processing apparatus further includes at least one feeding device 300 and at least one discharging device 500 .

[0075] The feeder 300 is located at the front of the base 100, corresponding to the loading station A01. The discharger 500 is located at the rear of the base 100, corresponding to the unloading station A05. The feeder 300 receives the substrate 232 to be processed from the feeding mechanism at the front position and transfers it to the carrier 231. The discharger 500 then transfers the processed substrate 232 from the carrier 231 to the unloading station A05.

[0076] In a specific embodiment of the present application, the number of feeding devices 300 is the same as the number of carriers 231. The feeding devices 300 include two spaced apart conveyor belts, so that when the carrier 231 at the loading station A01 moves upward along the Z axis and passes through the two conveyor belts, the carrier 231 receives the substrate 232 thereon. The unloading device 500 includes two spaced apart conveyor belts, so that when the carrier 231 at the loading station moves downward along the Z axis and passes through the two conveyor belts, the carrier 231 receives the substrate 232 thereon.

[0077] Taking two feeding devices as an example, the feeding device 300 includes a first feeding device 301 and a second feeding device 302. Both feeding devices include two spaced-apart conveyor belts that transport materials in the X-direction, with the distance between the conveyor belts exceeding the size of the carrier. Each carrier 231 is configured to support a substrate 232. The two feeding devices 300 are configured to control the distance between the substrates 232 on the two feeding devices to a target distance. When a carrier 231 is located at the waiting station A06, the substrate 232 is transported from the first feeding device 301 and the second feeding device 302 to the loading station A01. When the carrier 231 reaches the loading station A01 from A06, it passes between the two conveyor belts of the first feeding device 301 and the second feeding device 302 to transfer the substrate 232 onto the carrier 231. The distance between the two conveyor belts must be greater than the size of the carrier 231 to ensure that the carrier 231 can pass between them.

[0078] In one embodiment, the first feeding device 301 and the second feeding device 302 may each include a positioning sensor (not shown). The positioning sensor is used to position the substrate 232 to a predetermined position of the first feeding device 301 and the second feeding device 302. The positioning sensor can be respectively disposed on the first feeding device 301 and the second feeding device 302.

[0079] In addition, the first feeding device 301 and the second feeding device 302 can be independently controlled to start and stop. The first substrate 232 is transferred from the first feeding device 301 to the second feeding device 302 and is detected in place by the first positioning sensor. The second substrate 232 is detected in place by the first positioning sensor.

[0080] By providing the first feeding device 301 and the second feeding device 302, the initial adjustment of the substrate 232 in the first X direction can also be completed, especially for the initial adjustment of the two substrates in the X direction on the two carriers on the same conveyor mechanism. Specifically, the positions of the two substrates on the two carriers on the support plate can be made substantially the same, so that they meet the processing requirements when they are processed through the processing station. For example, the substrate is conveyed to the right (X direction), and the two carriers are of the same height. The carrier on the right is the first carrier, which is used to carry the first substrate; the carrier on the left is the second carrier, which is used to carry the second substrate. During loading, the first substrate follows the two conveyor belts of the first feeding device 301 to the corresponding position of the first feeding device 301. The belts stop conveying and the first substrate stays in this position, completing its first adjustment and positioning in the X direction. The second substrate follows the two conveyor belts of the second feeding device 302 to the corresponding position of the second feeding device 302. The belts stop conveying and the second substrate stays in this position, completing its first adjustment and positioning in the X direction. When both the first substrate and the second substrate stop, the distance between them is the target distance, which is equal to the first transmission speed multiplied by the jump time. The jump time is the time interval between the end position of the previous substrate and the start position of the next substrate. The first transmission speed is the speed of the conveying mechanism when passing through the processing station.

[0081] It should be understood that the base 100 may be made of marble, and the angle adjustment module 23111 may be a rotating motor.

[0082] In this embodiment, two carriers are used as an example for explanation. However, in the actual workflow, a larger number of carriers can be set on the transmission mechanism, which can further reduce the laser waiting time and improve the laser utilization rate.

[0083] In another embodiment of the present application, Figure 8 As shown, the substrate processing apparatus further includes a position acquisition device 600, which is disposed above the loading station. The position acquisition device 600 is configured to acquire position information of the substrate 232 on the support plate 2312 after the support plate 2312 receives the substrate 232 at the loading station, thereby enabling the horizontal adjustment module 2311 to adjust the horizontal position of the substrate 232 based on the position information. The position acquisition device 600 covers at least two carriers 231 on a conveyor mechanism and is used to acquire position information of the substrates 232 on the at least two carriers 231.

[0084] Specifically, the position acquisition device 600 can be a visual device such as a CCD camera, which can obtain the position information of the substrate by shooting an image of the substrate downward. Specifically, the position information in the X direction, Y direction, and angle is obtained. Figure 8It can be seen that the coverage of the position acquisition device 600 covers the substrates of the two carriers on the same conveying mechanism.

[0085] At least two conveying mechanisms 200 are configured so that when one of them is processed by the processing equipment 400 at the processing station, the other conveying mechanism completes the conveying of the processed substrate to the feeding equipment 500 at the unloading station, receives the unprocessed substrate conveyed by the feeding equipment 300 at the loading station, obtains the position of the substrate through the position obtaining equipment 600 at the position obtaining station and conveys it to the processing station.

[0086] The specific process is as follows: the position acquisition device 600 can be placed directly above the loading station A01. After the carrier 231 completes loading, it captures the position information of the substrate 232. Generally speaking, during loading, the position of the substrate 232 cannot be guaranteed to be exactly the same each time. When it is transported to the processing station A03 for processing, the position of the substrate 232 and the processing equipment 400 need to be aligned to achieve high-precision processing. Therefore, based on the captured position information, the position of the substrate 232 can be adjusted horizontally (in the X and Y directions) and angularly (i.e., the second adjustment).

[0087] Specifically, horizontal position adjustment (X and Y directions) can be achieved by adjusting the substrate using the X-axis module 210 and the Y-axis adjustment module 23112, while the angle is adjusted using the angle adjustment module 23111. As a preferred solution, horizontal and angular adjustments are performed while the conveyor mechanism passes through preparation station A02. This allows for dynamic position adjustment of each substrate before laser processing, and position adjustment is performed during continuous conveyance, improving efficiency. Furthermore, the device is compact, takes up less space, and enhances operational efficiency.

[0088] Furthermore, adjustments in the Y direction and angle will also affect the substrate's accurate X-direction positioning, necessitating compensatory adjustments in the X direction. Specifically, secondary adjustments in the X direction can be performed by obtaining the Y-direction and angle deviations using the position acquisition device 600. The resulting X-direction position deviation resulting from correct Y-direction and angle adjustments can then be calculated. Specifically, adjustments can be made to the Y-direction and angle positions during preparation station A02, followed by compensatory adjustments to the X-direction position deviation using the X-axis module 210.

[0089] In another embodiment of the present application, a grating ruler is provided on the base 100 at the position corresponding to the X-axis module 210. The grating ruler can be used to obtain real-time X-direction position information of the carrier 231. By obtaining X-direction information through the grating ruler, the precise X-direction position of the carrier 231 can be determined, making the X-direction position adjustment more accurate.

[0090] In addition, when the substrate processing device transfers the substrate to the processing station, Figure 2 As shown, processing equipment 400 positioned above a processing station begins processing substrate 232. In this application, substrate 232 is continuously transported through a first transmission speed that matches the processing speed of processing equipment 400. That is, processing of substrate 232 is completed as the processing platform continuously moves through the processing stations. In other words, each transport mechanism 200 continuously passes through the processing stations at a first transmission speed that matches the processing speed of processing equipment 400 above the processing station, ensuring that substrate 232 has just left the processing station when processing is completed. Specifically, the processing can be either on-the-fly marking or dynamic marking.

[0091] Preferably, the first transmission speed is uniform.

[0092] Furthermore, the two adjacent conveying mechanisms 200 are configured so that when or before processing of the substrate on the previous conveying mechanism is completed, the transmission speed of the latter conveying mechanism reaches the first transmission speed before being transferred from the loading station A01 to the processing station A03.

[0093] Preferably, the conveying mechanism 200 is configured such that the moving speed in a partial period of time during the process of conveying from the loading station A01 to the processing station A03 is greater than the first transmission speed.

[0094] In one embodiment, two adjacent conveying mechanisms 200 are configured such that when substrate processing on the previous conveying mechanism is completed, the interval between the next conveying mechanism moving from the loading station to the processing station and the previous conveying mechanism is the target distance.

[0095] The target distance is equal to the first transmission speed multiplied by the jump time. The first transmission speed is the speed of the conveyor mechanism when passing through the processing station. The jump time is the time interval between the end position of the previous substrate and the start position of the next substrate after processing.

[0096] In another embodiment of the present application, Figure 9 As shown, the substrate processing device further includes a printing quality detection mechanism 700, which is disposed above the unloading station or in the area between the processing station and the unloading station. The printing quality detection mechanism 700 is configured to perform quality inspection on the processed substrate.

[0097] The printing quality inspection mechanism 700 is a CCD camera. When the printing quality inspection mechanism 700 is set above the unloading station A05, the substrate on the carrier can be transferred to the discharge device first, and then the processed substrate can be photographed above the discharge device for quality inspection; when the printing quality inspection mechanism 700 is set in the area between the processing station A03 and the unloading station A05A, the substrate can be photographed for quality inspection during the movement of the substrate.

[0098] The substrate processing device of the embodiment of the present application can simultaneously pick up and place multiple substrates by arranging at least two carriers in each conveying mechanism, coupling the laser processing time, ensuring that the substrates enter the processing area stably and continuously, and the laser operates at full load, thereby improving laser utilization and increasing production capacity.

[0099] To implement the above embodiments, the present application also provides a substrate processing method.

[0100] like Figure 10 As shown, the substrate processing method includes:

[0101] S1, drive at least two conveying mechanisms to move in the horizontal direction and the vertical direction to drive the carrier to pass through the loading station, the processing station and the unloading station in sequence, and drive at least two conveying mechanisms to pass through the processing station alternately and continuously.

[0102] The transport mechanism is attached to at least one carrier, which is configured to support at least one substrate.

[0103] S2, when the carrier receives the substrate at the loading station and is transferred to the processing station, the horizontal position of the substrate is adjusted by the horizontal adjustment module on the carrier.

[0104] In one embodiment of the present application, the speed of each transport mechanism passing through the processing station matches the processing speed, so that the substrate just leaves the processing station when the processing is completed.

[0105] Furthermore, when or before the processing of the substrate on the previous conveying mechanism is completed, the transmission speed of the subsequent conveying mechanism reaches a first transmission speed before being transmitted from the loading station to the processing station. The first transmission speed is the speed of the conveying mechanism when passing through the processing station.

[0106] When the processing of the substrate on the previous conveying mechanism is completed, the next conveying mechanism moves to the processing station, and the distance between it and the previous conveying mechanism is the target distance. The target distance is equal to the first transmission speed multiplied by the jump time. The jump time is the time interval between the end position of the previous substrate and the starting position of the next substrate. The first transmission speed is the speed of the conveying mechanism when passing through the processing station.

[0107] The substrate processing method of the embodiment of the present application transmits the substrate to the processing station through at least two conveying mechanisms alternately and continuously passing through the processing station, and the processing equipment processes the substrate, thereby reducing the waiting time of laser processing, improving laser utilization, and improving production efficiency.

[0108] The substrate processing method of the present application includes adjusting the horizontal position of the substrate through a horizontal adjustment module on the carrier during the process of transferring the substrate from the loading station to the processing station after receiving the substrate. This not only realizes the dynamic adjustment of the position of each substrate before laser processing, but also improves the operating efficiency because it is carried out during the continuous transfer process, further reduces the waiting time of laser processing, improves laser utilization, and improves production efficiency.

[0109] The substrate processing and transfer process is described in detail below using a specific embodiment. Figure 11 As shown, the method includes:

[0110] S601: At least two carriers receive substrates to be processed.

[0111] Each stage corresponds to a substrate to be processed. Figure 7 As shown in the workstation location diagram, it can be seen that the carrier can pass through the loading station A01, preparation station A02, processing station A03, waiting station A04, unloading station A05 and waiting station A06 in sequence. It should be understood that the above-mentioned stations are only the definition of functional areas. For example, the preparation station A02 is the functional area between the loading station A01 and the processing station A03, not the processing station A06. Figure 7 The specific location displayed.

[0112] When at least two carriers of the same conveying mechanism move to the loading station A01 , they receive at least two substrates to be processed.

[0113] Preferably, before the at least two carriers receive the substrate to be processed, the substrate is received by a feeding device and an initial position of the substrate is adjusted.

[0114] Specifically, there are at least two feeding devices. Each of the at least two feeding devices adjusts the initial position of a corresponding substrate, and the number of feeding devices is equal to the number of substrates. Each feeding device has a positioning sensor for positioning a substrate. The feeding device is a conveyor belt.

[0115] Take two platforms as an example, Figure 12As shown, the feed mechanism first transfers the substrates to loading station A01. The first substrate is transferred to the first conveyor belt. Once the positioning sensor detects the first substrate is in place, the first conveyor belt stops. During this process, the second substrate follows closely behind the first substrate and is transferred to the second conveyor belt. Once the positioning sensor detects the second substrate is in place, the second conveyor belt stops. During this process, the first and second substrates remain in essentially the same pre-set position, completing the first X-direction adjustment of the first and second substrates. This adjustment is a position adjustment on the conveyor belt. Figure 12 The thick solid line frame B01 represents a substrate.

[0116] When both substrates are placed on the two conveyor belts at the preset positions or before (the distance between the two substrates is the target distance), the carrier moves from the waiting station A06 to the loading station A01. After sensing that the two substrates are in place, the Z-axis module is used to raise the carrier to pick up the materials.

[0117] During the rising process, the carrier passes through the gap between the two first conveyor belts to remove the first substrate resting on the first conveyor belts; similarly, it passes through the gap between the two second conveyor belts to remove the second substrate resting on the second conveyor belts.

[0118] S602 , before transferring the received substrate to the processing station, synchronously adjusting the position of the substrate on the carrier during the transfer process.

[0119] Before adjusting the position of the substrate on the carrier during the transmission process, the position information of the substrate on the carrier is obtained by the position acquisition device. Specifically, taking the case of two carriers in the same conveyor mechanism, the CCD camera set above the loading station A01 can be used to take pictures and locate, thereby obtaining the positions of the first substrate and the second substrate ( Figure 12 The thin solid line frame B02 represents the photographing range of the CCD camera, providing a basis for secondary adjustment.

[0120] Specifically, when loading at the loading station, it cannot be guaranteed that the position of the substrate is exactly the same every time. When it is transported to the processing station A03 for processing, the position of the substrate and the processing equipment need to be aligned to complete high-precision processing. Therefore, the position of the substrate can be adjusted in the horizontal direction and angle based on the position information obtained by shooting (that is, the second adjustment).

[0121] As the carrier passes through preparation station A02, the Y-axis module and angle adjustment module are used to adjust the substrate's position and rotation angle on the Y-axis. This adjustment is a dynamic adjustment during the transfer process.

[0122] In addition, adjustments in the Y direction and the rotation angle will also affect the position accuracy of the substrate in the X direction, so position compensation of the substrate in the X direction is required.

[0123] The compensation in the X direction is a micro-compensation. If the compensation distance is long, it will take more time, resulting in chaotic action rhythm. The distance between the two carriers on the same platform of the present application is required, and in order to be able to well realize the temporal continuity when the two conveying mechanisms pass through the processing station in turn, the spacing and speed between the two conveying mechanisms before and after entering the processing station are required (the spacing required here is calculated based on the laser processing spacing and the edge of the substrate, and the speed here is calculated based on the laser processing interval and the X-axis movement speed). Each carrier on the conveying mechanism can adjust the horizontal position and angle separately, and the position adjustment of the substrate is completed in the continuous movement process before entering the processing station after the conveying mechanism receives the substrate and positions it. There is no need to configure the substrate position adjustment time separately, so that the substrate can enter the processing area continuously and stably, further improving the processing efficiency.

[0124] S603 , before the received substrate is transferred to the processing station, the transfer speed of the carrier in the X direction is synchronously adjusted during the transfer process to achieve matching with the laser processing speed and the target distance.

[0125] Specifically, when processing of a substrate on the preceding conveyor mechanism is completed or before processing is completed, the transport speed of the succeeding conveyor mechanism reaches a first transport speed before transporting the substrate from the loading station to the processing station. The first transport speed is the speed of the conveyor mechanism as it passes through the processing station. Furthermore, when processing of the substrate on the preceding conveyor mechanism is completed, the distance between the succeeding conveyor mechanism and the preceding conveyor mechanism becomes the target distance.

[0126] Generally speaking, it's best to have a uniform speed when conveyors pass through processing stations. While the preceding conveyor is processing, the succeeding conveyor performs auxiliary motions, including loading, position adjustment, positioning, and unloading. Speed ​​matching means that after the succeeding conveyor has finished loading and has moved to the target distance from the first stage, the speed of the succeeding conveyor is consistent with that of the preceding conveyor, which is currently processing, and preferably uniform.

[0127] In the present invention, before at least two substrates to be processed are transferred to the processing station, the speed matching with the laser processing speed is completed, and the speed matching is performed during the movement.

[0128] As previously mentioned, before and after laser processing, auxiliary processes such as loading, positioning, and unloading are required, and the conveyor mechanism needs to be cyclically moved from one processing station to another. At least during the transition from the loading station to the processing station, at least a portion of the conveyor mechanism needs to operate at a speed higher than the first speed. In other words, to save waiting time for laser processing, the conveyor mechanism's speed changes from the loading station to the processing station, first accelerating and then decelerating. Speed ​​matching at least includes achieving uniform motion at the first speed before reaching the processing station.

[0129] S604 , sequentially performing laser processing on at least two substrates to be processed that have passed through the processing stations.

[0130] Laser processing also involves speed matching control. Specifically, the processing speed of the laser processing equipment can be matched with the transport speed of the substrate being processed, so that the substrate being processed has just left the processing station when the laser processing equipment completes the laser processing.

[0131] When the carrier moves to the processing station, the substrates on the carrier of the same conveyor mechanism can be laser processed in sequence. Laser processing can be laser scribing, laser transfer, etc. Figure 12 The thin solid circle B03 represents laser processing)

[0132] In the present invention, dynamic processing or flying marking processing is adopted, that is, the laser processing is performed while the carrier moves through the processing station at a certain speed.

[0133] Preferably, the laser processing is completed when the carrier passes through the processing station at a uniform speed.

[0134] Preferably, the preceding stage and the following stage enter the processing position at a target distance, which is equal to the first transmission speed multiplied by a jump time, where the jump time is the time interval between the end position of processing the preceding substrate and the start position of processing the following substrate.

[0135] The advantage of this setting is that it effectively utilizes the laser jump time and maximizes the laser utilization rate.

[0136] S605 , sequentially discharging at least two processed substrates.

[0137] Continuing with the above example, after the laser processing is completed, the previous carrier of the same conveyor mechanism enters the waiting station A04, and when the next carrier also enters the waiting station A04, both enter the unloading station A05 for unloading at the same time. Figure 12 B04 in the diagram indicates the production line, which means waiting for discharge)

[0138] After the two substrates arrive at unloading station A05, they are unloaded and transferred to unloading equipment 500. The conveyor mechanism then moves from unloading station A05 to waiting station A06. This is achieved by lowering the conveyor mechanism via the Z-axis module and then (or simultaneously) returning it to waiting station A06 via the X-axis module. Once a new substrate arrives, the conveyor mechanism is again raised by the Z-axis module and moves to loading station A01 for the next cycle. The waiting station A04 is vertically aligned with loading station A01.

[0139] It should be noted that while the substrate on the rear conveyor is being laser processed, the front conveyor completes its unloading, retrieving, and preparation operations. When it reaches the target distance from the rear conveyor, its speed adjusts to the same speed as the rear conveyor and waits for laser processing. The front and rear conveyors rotate in a cycle, completing continuous, dynamic laser processing.

[0140] When the two conveying mechanisms intersect while moving along the X-axis, the Z-axis module is controlled to lower the conveying mechanism that is not in the processing state, or the conveying mechanisms on both sides of the base are arranged to be stacked in the vertical direction to avoid the conveying mechanism that is in the processing state, and then return to the waiting station A06 to wait for the next round of material collection.

[0141] The substrate processing method of the embodiment of the present application, except for the auxiliary actions of loading and unloading and positioning, the rest of the actions such as position adjustment and speed matching of the preparation station, continuous processing of the processing station, movement of the waiting station, etc., are all performed during the continuous movement of the transmission mechanism, so as to maximize the parallelization of the auxiliary actions. Compared with the step-by-step transmission of the prior art, the continuous movement greatly improves the production efficiency. Compared with the traditional continuous transmission, it maximizes the parallelization of the auxiliary actions and realizes the continuous processing of the laser, thereby maximizing the utilization rate of the laser and greatly improving the production efficiency and capacity.

[0142] In another embodiment, Figure 13 As shown, the substrate processing method further includes:

[0143] S606 , before sequentially laser processing at least two substrates to be processed, adjusting the processing height of the substrates.

[0144] For some laser processing technologies, the processing substrate has certain requirements for its height in the Z direction (such as the laser transfer process, which requires very high height accuracy in the Z direction during processing). In this case, the conveying mechanism needs to be lifted up again during the movement, and then lowered after the processing is completed.

[0145] In yet another embodiment, Figure 14 As shown, the substrate processing method further includes:

[0146] S607: inspect at least two processed substrates at a blanking station.

[0147] When the printing quality inspection mechanism 700 is set above the unloading station, the substrate on the carrier can be transferred to the discharge device first, and then the printing quality inspection mechanism 700 takes a photo of the processed substrate above the discharge device for quality inspection.

[0148] The substrate processing method of the embodiment of the present application adopts a technical solution of at least two conveying mechanisms, each conveying mechanism is provided with multiple carriers (at least one carrier) for carrying substrates, so that while the substrate on the previous conveying mechanism continuously passes through the processing area for laser processing, the latter conveying mechanism can complete all auxiliary processes and "catch up" with the previous conveying mechanism (which is set at a fixed interval with the previous platform module) before the previous conveying mechanism completes the laser processing and completes speed matching (the speed is the same as the speed of the previous conveying mechanism) and distance matching with the previous conveying mechanism. The two adjacent conveying mechanisms continuously enter the processing position in sequence at a certain speed and interval for processing, and the processing time is coupled, so that the processing can be carried out stably and continuously, the laser runs at full load, the laser utilization rate is improved, and the production efficiency is improved.

[0149] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of other identical elements in the process, method, article, or device comprising the element.

[0150] The logic and / or steps represented in the flowcharts or otherwise described herein, for example, can be considered as a sequenced list of executable instructions for implementing the logical functions, and can be embodied in any computer-readable medium for use by, or in conjunction with, an instruction execution system, apparatus, or device (e.g., a computer-based system, a system including a processor, or other system that can fetch and execute instructions from an instruction execution system, apparatus, or device). For purposes of this specification, a "computer-readable medium" can be any device that can contain, store, communicate, propagate, or transport a program for use by, or in conjunction with, an instruction execution system, apparatus, or device. More specific examples (a non-exhaustive list) of computer-readable media include the following: an electrical connection with one or more wires (electronic devices), a portable computer disk cartridge (magnetic device), random access memory (RAM), read-only memory (ROM), erasable and programmable read-only memory (EPROM or flash memory), fiber optic devices, and a portable compact disc read-only memory (CDROM). Furthermore, the computer-readable medium may even be paper or other suitable medium on which the program is printed, since the program may be obtained electronically, for example, by optically scanning the paper or other medium and then editing, interpreting or otherwise processing it in a suitable manner if necessary, and then storing it in a computer memory.

[0151] It should be understood that various parts of the present application can be implemented using hardware, software, firmware, or a combination thereof. In the above embodiments, multiple steps or methods can be implemented using software or firmware stored in a memory and executed by a suitable instruction execution system. For example, if implemented using hardware, as in another embodiment, any one of the following technologies known in the art or a combination thereof can be used to implement: a discrete logic circuit having a logic gate circuit for implementing a logic function on a data signal, an application-specific integrated circuit having a suitable combination of logic gate circuits, a programmable gate array (PGA), a field programmable gate array (FPGA), etc.

[0152] It should be noted that, in the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in an appropriate manner in any one or more embodiments or examples. In addition, those skilled in the art may combine and combine different embodiments or examples described in this specification and the features of different embodiments or examples, unless they are contradictory.

Claims

1. A substrate processing device, characterized in that: include: base; at least two conveying mechanisms, the conveying mechanisms being disposed on the base, each of the conveying mechanisms being attached to at least one carrier, the carrier being configured to support at least one substrate; The at least two conveying mechanisms are configured to move in a horizontal direction and a vertical direction to drive the carrier to pass through a loading station, a processing station and an unloading station in sequence, and the at least two conveying mechanisms are configured to pass through the processing stations alternately and continuously; a processing device, disposed above a processing station and processing the substrate on the carrier when the carrier is located at the processing station; The carrier includes a horizontal adjustment module and a support plate located on the horizontal adjustment module, the support plate is used to support at least one substrate, and the horizontal adjustment module is configured to adjust the horizontal position of the substrate on the support plate during the process of transferring the substrate from the loading station to the processing station after the support plate receives the substrate at the loading station; The two adjacent conveying mechanisms are configured so that when the substrate processing on the previous conveying mechanism is completed, the distance between the next conveying mechanism moving from the loading station to the processing station and the previous conveying mechanism is the target distance; The target distance is equal to the first transmission speed multiplied by the jump time. The first transmission speed is the speed of the conveyor mechanism when passing through the processing station. The jump time is the time interval between the end position of the previous substrate and the start position of the next substrate. The transmission mechanism includes an X-axis module and a Z-axis module, which respectively drive the carrier to move left and right in the horizontal direction and up and down in the vertical direction; The X-axis module is configured to compensate for the X-direction position deviation generated when the horizontal adjustment module adjusts the position of the substrate during the process of transferring the support plate from the loading station to the processing station.

2. The substrate processing device according to claim 1, wherein The Z-axis module is configured to adjust the position of the substrate in the Z direction on the support plate during the process of the support plate being transferred from the loading station to the processing station.

3. The substrate processing device according to claim 1, wherein The horizontal adjustment module includes an angle adjustment module and / or a Y-axis adjustment module, which is configured to adjust the horizontal angle position and / or Y-axis position of the substrate.

4. The substrate processing device according to claim 1, wherein It also includes a position acquisition device arranged above the loading station, which is configured to obtain position information of the substrate on the support plate after the support plate receives the substrate at the loading station, so that the horizontal adjustment module adjusts the horizontal position of the substrate according to the position information.

5. The substrate processing device according to claim 1, wherein Each of the conveying mechanisms passes through the processing station continuously at a first transmission speed, which matches the processing speed of the processing equipment above the processing station, so that the substrate just leaves the processing station when the processing is completed.

6. The substrate processing device according to claim 5, wherein: The first transmission speed is a uniform speed.

7. The substrate processing device according to claim 5, wherein: The two adjacent conveying mechanisms are configured so that when or before processing of the substrate on the previous conveying mechanism is completed, the transmission speed of the latter conveying mechanism reaches the first transmission speed before being transferred from the loading station to the processing station.

8. The substrate processing device according to claim 5, wherein: The conveying mechanism is configured to move at a speed greater than the first transmission speed during a portion of a period of time during a process of conveying from a loading station to a processing station.

9. The substrate processing device according to claim 1, wherein: It also includes a printing quality detection mechanism, which is arranged in the area between the processing station and the unloading station or at the unloading station, and is configured to perform quality detection on the processed substrate.

10. The substrate processing device according to any one of claims 1 to 9, wherein: The number of the carriers is two.

11. The substrate processing device according to claim 1, wherein It also includes at least one feeding device and at least one discharging device, wherein the feeding device is located at the loading station and is configured to transfer the substrate transferred by the feeding mechanism to the carrier; the discharging device is located at the unloading station and is configured to transfer the substrate from the carrier.

12. The substrate processing device according to claim 11, wherein The feeding device comprises two conveyor belts arranged at intervals, and the feeding device comprises a position sensor.

13. The substrate processing device according to claim 11, wherein There are two carriers, each of which is configured to support a substrate. There are two feeding devices, and the two feeding devices are configured to control the distance between the substrates on the two feeding devices to be a target distance.

14. A substrate processing method, performed by the substrate processing device according to any one of claims 1 to 13, characterized in that: include: driving at least two conveying mechanisms to move horizontally and vertically to drive the carrier to sequentially pass through a loading station, a processing station, and an unloading station, and driving the at least two conveying mechanisms to alternately and continuously pass through the processing stations; the conveying mechanisms are attached to at least one carrier, and the carrier is configured to support at least one substrate; During the process of the carrier receiving the substrate at the loading station and transferring it to the processing station, the horizontal position of the substrate is adjusted by a horizontal adjustment module on the carrier; When the substrate processing on the previous conveyor mechanism is completed, the distance between the next conveyor mechanism moving from the loading station to the processing station and the previous conveyor mechanism is the target distance; The target distance is equal to the first transmission speed multiplied by the jump time. The first transmission speed is the speed of the conveyor mechanism when passing through the processing station. The jump time is the time interval between the end position of the previous substrate and the start position of the next substrate after processing.

15. The substrate processing method according to claim 14, wherein: The speed of each conveying mechanism passing through the processing station matches the processing speed, so that the substrate just leaves the processing station when the processing is completed.

16. The substrate processing method according to claim 14, wherein: When or before the processing of the substrate on the previous conveying mechanism is completed, the transmission speed of the subsequent conveying mechanism reaches the first transmission speed before being transmitted from the loading station to the processing station.

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