End state confirmation device

Abstract

An end portion state confirmation device includes a rotation holding device, a light exit portion, and an imaging portion. A substrate having at least a portion in a circular shape and a protective member provided at an outer peripheral end portion thereof is carried into the end portion state confirmation device. The carried substrate is held by the rotation holding device. The imaging portion has an imaging region and is configured to be able to receive infrared light transmitted through the substrate and the protective member. The light exit portion emits infrared light to the imaging region of the imaging portion. At least a portion of the outer peripheral end portion of the substrate is disposed in a predetermined prescribed posture at a predetermined prescribed position in the imaging region of the imaging portion.

Description

Technical Field

[0001] The present invention relates to an end verification device for verifying the end state of a substrate having a coating film formed on its outer peripheral end. Background Technology

[0002] A substrate processing apparatus is used to perform various processing on substrates such as semiconductor substrates, substrates for FPD (Flat Panel Display) devices (such as liquid crystal display devices or organic EL (Electro Luminescence) display devices), substrates for optical discs, substrates for magnetic disks, substrates for magneto-optical discs, substrates for photomasks, ceramic substrates, or substrates for solar cells.

[0003] Depending on the processing performed on the substrate, there are cases where high strength is required for the substrate. Therefore, as the substrate to be processed, there are cases where a substrate in which two substrates are bonded together with an adhesive (hereinafter referred to as a bonded substrate) is used.

[0004] In a bonded substrate, if a defect (e.g., a void) exists between the two substrates, sufficient strength cannot be obtained. Therefore, a device is proposed for inspecting a bonded substrate to check for any defective portions arising between the two substrates.

[0005] In the inspection apparatus described in Japanese Patent Application Publication No. 2013-26260, the loaded bonding substrate (overlapping wafer) is held by a chuck. Furthermore, infrared light is irradiated onto the bonding substrate held by the chuck, and an image of the entire surface of the bonding substrate is captured. The bonding substrate is inspected based on the image obtained from the captured image. Summary of the Invention

[0006] In the bonding substrate, for example, a protective member is disposed at the outer peripheral end of the bonding substrate in such a way that the boundary of the bonding portion of the two substrates with beveled faces is not exposed to the outside. The protective member is formed, for example, by filling the space between adjacent beveled faces in the lamination direction of the two bonded substrates with a coating liquid for the protective member, and then hardening the filling coating liquid.

[0007] However, if a portion of the protective component formed at the outer peripheral end of the bonding substrate peels off, it becomes a cause of particulate matter generation. Peeling off the protective component may be caused by defects (e.g., voids) originating within the protective component. Furthermore, defects originating within the protective component can also reduce the strength of the bonding substrate. Defects originating within the protective component are not directly visible. For bonding substrates with protective components at their outer peripheral ends, it is desirable to determine not only the defects generated during the bonding of the two substrates but also the presence of defects originating within the protective component.

[0008] The purpose of this invention is to provide an end-state confirmation device that can determine whether there are internal defects in a protective component formed on the outer periphery of a substrate.

[0009] (1) An end state confirmation device according to one aspect of the present invention confirms the end state of at least a portion of a substrate having a circular shape and having a protective member provided at its outer peripheral end, and includes: a substrate holding portion for holding the substrate; a light emitting portion for emitting light of a wavelength that can pass through the substrate and the protective member toward the outer peripheral end of the substrate held by the substrate holding portion; and an imaging portion for capturing an image of the outer peripheral end of the substrate by receiving light emitted from the light emitting portion and passing through the outer peripheral end of the substrate and the protective member.

[0010] In the end-state confirmation device, light is emitted toward the outer peripheral end of the substrate held by the substrate holding portion. The emitted light is incident on at least a portion of the substrate and the protective member. Depending on whether there is a defect at the outer peripheral end of the substrate, the light emitted from the light emitting portion and passing through the outer peripheral end of the substrate and the protective member is received by the imaging unit. By capturing an image of the outer peripheral end of the substrate using the imaging unit, image data representing the state of the outer peripheral end of the substrate and the interior of the protective member can be obtained. As a result, based on the obtained image data, internal defects formed in the protective member at the outer peripheral end of the substrate can be determined.

[0011] (2) The camera unit has a cross-sectional strip-shaped imaging area extending in the first direction. The light emitting unit and the camera unit are arranged in a preset positional relationship such that the light emitted from the light emitting unit travels toward the imaging area of ​​the camera unit. The substrate holding unit is configured to hold the substrate while rotating the substrate. The end state confirmation device may also include a position and posture adjustment unit, which adjusts the position and posture of the substrate holding unit by rotating the substrate held by the substrate holding unit when the camera unit is shooting the outer peripheral end of the substrate. This adjustment is achieved by rotating the substrate and sequentially passing multiple parts of the outer peripheral end of the substrate in the circumferential direction through preset reference positions in the imaging area in a preset reference posture in a second direction that intersects the first direction.

[0012] In this case, it is not necessary to increase the imaging area; the entire outer periphery of the substrate can be imaged. This allows for miniaturization of the light emitting section and the imaging section, preventing the need for a large-scale end-state confirmation device.

[0013] (3) The end state confirmation device may also include: an eccentric shape information acquisition unit, which acquires eccentric information including the eccentricity amount and eccentricity direction of the center of the substrate relative to the rotation center of the substrate held by the substrate holding unit, and shape information indicating the shape of the outer periphery of the substrate before the camera unit captures the outer periphery of the substrate; and the position and posture adjustment unit adjusts the position and posture of the substrate holding unit based on the eccentricity information and shape information acquired by the eccentric shape information acquisition unit when the camera unit captures the outer periphery of the substrate.

[0014] In this case, the position and orientation of the outer periphery of the substrate relative to the light emitting part and the imaging part can be more accurately adjusted to a reference position and reference orientation based on the holding state of the substrate by the substrate holding part and the shape of the substrate.

[0015] (4) The end state confirmation device may also include: an image data generation unit that generates image data based on the output signal from the camera unit; and a defect determination unit that determines whether there is a defect at the outer periphery end of the substrate based on whether the image data generated by the image data generation unit meets the preset determination conditions.

[0016] In this case, it is not necessary for the user to be skilled in judging defects, but a uniform judgment can be made as to whether there are defects in the outer peripheral end of the substrate and the interior of the protective component.

[0017] (5) The substrate can also be a bonding substrate in which multiple single substrates are bonded together. Thus, it is possible to determine whether there are defects at the boundary of the multiple single substrates that are bonded together.

[0018] (6) Each of the plurality of single substrates constituting the bonding substrate has a beveled portion at the outer peripheral end of the substrate, the protective member is disposed at the outer peripheral end of the bonding substrate in such a way that it fills the space between two adjacent bevels in the stacking direction of the plurality of single substrates, and the camera is configured to receive light transmitted through the outer peripheral end of the substrate and the protective member and reflected from one of the bevels.

[0019] When the protective component is seamlessly embedded in the space between the two beveled portions, light emitted toward the outer peripheral end of the substrate passes through each beveled portion without reflection. On the other hand, if the protective component is not sufficiently embedded in the space between the two beveled portions, and a gap exists on one of the beveled portions, light emitted toward the outer peripheral end of the substrate is reflected on the beveled portion with the gap. Therefore, according to the above configuration, based on the amount of light received from the outer peripheral end of the substrate and incident on the imaging unit, it is easy to determine whether a gap exists inside the protective component.

[0020] (7) The end state confirmation device may further include: a protective member forming part, which forms a substrate by forming a protective member at the outer peripheral end of the untreated substrate while the substrate holding part holds the untreated substrate without a protective member.

[0021] In this case, a protective component can be formed on the outer peripheral end of the substrate in the end condition verification device. Therefore, the efficiency of substrate processing is improved. Attached Figure Description

[0022] Figure 1 This is a schematic side view of the end state confirmation device according to the first embodiment.

[0023] Figure 2 yes Figure 1 A schematic top view of the end status confirmation device.

[0024] Figure 3 This figure shows an example of a protective component disposed at the outer peripheral end of a substrate.

[0025] Figure 4 It indicates that it may arise from Figure 3 A diagram illustrating an example of an internal defect in a protective component.

[0026] Figure 5 This indicates that for a bonding substrate without a protective component, it can be achieved through... Figure 1 An example of an end image obtained by a camera unit.

[0027] Figure 6 This indicates that the bonding substrate is free of internal defects in the protected component and can be bonded through... Figure 1 An example of an end image obtained by a camera unit.

[0028] Figure 7 This indicates that the bonding substrate has internal defects in the protective component, and can be... Figure 1 An example of an end image obtained by a camera unit.

[0029] Figure 8 It means Figure 1 A block diagram illustrating the configuration of the control system for the end-state confirmation device.

[0030] Figure 9 This is a flowchart illustrating an example of end-state verification processing performed in an end-state verification device.

[0031] Figure 10 This is a schematic side view of the end state confirmation device according to the second embodiment.

[0032] Figure 11 yes Figure 10 A schematic top view of the end status confirmation device. Detailed Implementation

[0033] The following is a reference to the appendix. Figure 1 The following describes an end state verification device according to one embodiment of the present invention. In the following description, "substrate" refers to substrates suitable for use in FPD (Flat Panel Display) devices or organic EL (Electro Luminescence) display devices, such as substrates for FPDs, semiconductor substrates, optical discs, magnetic disks, magneto-optical discs, photomasks, ceramic substrates, or solar cells. Furthermore, the substrates described below have a circular shape when viewed from above, excluding the portion forming the notch.

[0034] Furthermore, the substrate described below includes a substrate manufactured by bonding multiple substrates together using an adhesive. In the following description, to distinguish between a single substrate and a substrate manufactured by bonding multiple substrates together, a single substrate will be referred to as a single substrate, and a substrate manufactured by bonding multiple substrates will be referred to as a bonded substrate. At the outer peripheral end of the bonded substrate, a protective member is provided to protect the boundary of the bonding portion of each of two adjacent single substrates in the stacking direction (the direction in which the substrates overlap). The specific configuration of the protective member will be described later. The state of the outer peripheral end of the substrate is checked using the end state verification device described below. As a result, it can be determined whether there are internal defects in the protective member.

[0035] 1. First Implementation Method

[0036] [1] Composition of the end state confirmation device

[0037] Figure 1 This is a schematic side view of the end state confirmation device according to the first embodiment. Figure 2 yes Figure 1 A schematic top view of the end status confirmation device 1. (See attached image.) Figure 1 As shown, the end-state confirmation device 1 mainly comprises a tilting device 20, a moving device 30, a rotation holding device 40, an eccentric detector 50, a height detector 60, a light emitting unit 70, a camera unit 80, and a control device 90 housed within a housing 10. Alternatively, the control device 90 may be located outside the housing 10. The control device 90 includes a CPU (Central Processing Unit) 91 and a storage unit 99, as described later. Figure 8 The control unit 90 controls the operation of the tilting device 20, the moving device 30, the rotating holding device 40, the eccentricity detector 50, the height detector 60, the light emitting unit 70, and the camera unit 80. Alternatively, the control unit 90 can replace the CPU 91 and the storage unit 99, and be composed of a microcomputer.

[0038] Figure 1 and Figure 2 In the specific figures described later, arrows indicating the mutually orthogonal X, Y, and Z directions are used to clarify positional relationships. The X and Y directions are orthogonal in the horizontal plane, and the Z direction is equivalent to the vertical direction.

[0039] The outer shell 10 has a generally cubic shape including a top surface, a bottom surface and four side walls. Figure 1 In this illustration, the side wall is omitted to show the configuration of the end state confirmation device 1 inside the housing 10. Additionally, Figure 2 The top surface is omitted from the diagram. At least one of the four sidewalls is formed with a transport opening for moving the substrate W into or out of the housing 10.

[0040] A tilting device 20 is provided on the bottom surface of the outer casing 10. The tilting device 20 includes a tilting stage 21, two support components 22, a rotating shaft 22s, and a tilting drive unit 23. Figure 2 As shown, two support components 22 are disposed near two opposing sidewalls in the X direction and are arranged in the X direction.

[0041] A rotating shaft 22s is provided by connecting two support members 22. The rotating shaft 22s is rotatably supported by the two support members 22 about its central axis ax1. A tilting drive unit 23 is provided near one of the two support members 22. The tilting drive unit 23 includes a motor configured to rotate the rotating shaft 22s about its central axis ax1 and to maintain the rotating shaft 22s at any rotation angle about the central axis ax1. An encoder is built into the motor of the tilting drive unit 23. The encoder outputs a signal to the control device 90 indicating the rotation angle of the motor or a signal corresponding to a change in the rotation angle.

[0042] The tilting stage 21 is, for example, constructed from a rectangular plate-like component, with a portion mounted on the rotation axis 22s. The tilting stage 21 is fixed to the rotation axis 22s in the direction about the central axis ax1. Thus, the tilting stage 21 and the tilting drive unit 23 rotate together about the central axis ax1 in relation to the rotation axis 22s. Furthermore, when the tilting stage 21 is held by the tilting drive unit 23 at any rotation angle about the central axis ax1, it is held in a fixed posture together with the rotation axis 22s. In this way, depending on the holding state of the tilting drive unit 23 on the rotation axis 22s, the tilting stage 21 maintains a state parallel to the horizontal plane and a state tilted relative to the horizontal plane. The Y and Z directions shown below represent the Y and Z directions of the tilting stage 21 when it is parallel to the horizontal plane, respectively.

[0043] A moving device 30 is provided on the upper surface of the tilting stage 21. The moving device 30 includes a moving stage 31 and a moving drive unit 32. The moving stage 31 has a mounting surface for mounting the rotation holding device 40 (described later), and is configured to allow the mounting surface to move in the X and Y directions on the tilting stage 21. The moving drive unit 32 includes multiple motors, configured to allow the mounting surface of the moving stage 31 to move in the X and Y directions on the tilting stage 21 and to hold the mounting surface at any position on the tilting stage 21. Encoders are built into the multiple motors of the moving drive unit 32. The encoders output signals corresponding to the rotation angle of the motors or changes in the rotation angle to the control device 90.

[0044] A rotating holding device 40 is provided on the mounting surface of the movable stage 31. The rotating holding device 40 includes an adsorption holding part 41 and a rotating adsorption drive part 42. The rotating holding device 40 includes a motor. The motor is mounted on the mounting surface. In addition, the rotation shaft of the motor extends upward. The adsorption holding part 41 is provided at the upper end of the rotation shaft. The adsorption holding part 41 is connected to a suction system (not shown) and is configured to adsorb and hold the central part of the lower surface of the substrate W.

[0045] The rotary adsorption drive unit 42 switches the suction path between the adsorption holding unit 41 and the suction system (not shown) between a connected state and a disconnected state. Thus, the rotary adsorption drive unit 42 can adsorb and hold the central portion of the lower surface of the substrate W through the adsorption holding unit 41. Furthermore, the rotary adsorption drive unit 42 can rotate the substrate W held by the adsorption holding unit 41 around the rotation axis of the motor.

[0046] In the rotary holding device 40, the center of the substrate W held by the adsorption holding part 41 may not be the center of the rotation axis of the motor of the rotary adsorption drive part 42; that is, the rotation center of the adsorption holding part 41 is aligned with that of the substrate W. Therefore, in the end state confirmation mount 1, the amount and direction of eccentricity of the substrate W held on the adsorption holding part 41 are detected. To detect the amount and direction of eccentricity of the substrate W, an eccentricity detector 50 can be used. In the following description, the information indicating the amount and direction of eccentricity will be referred to as eccentricity information.

[0047] On the upper surface of the tilting stage 21, a support post 59 is disposed near one end of the tilting stage 21 in the Y direction. The support post 59 extends upward from the upper surface of the tilting stage 21. An eccentricity detector 50 is mounted on the upper end of the support post 59. The eccentricity detector 50 includes, for example, a line sensor, which, when fixed to the upper end of the support post 59, can detect the position of the outer peripheral end of the substrate W rotated by the rotation holding device 40.

[0048] The motor of the rotary holding device 40 incorporates an encoder (not shown) for detecting the rotation angle of the adsorption holding section 41. When detecting eccentricity information, the substrate W is rotated while held on the adsorption holding section 41. At this time, for every small angle the substrate W rotates, the encoder of the motor in the rotary holding device 40 outputs a signal generated by the small angle of rotation of the motor. Additionally, the eccentricity detector 50 outputs a signal indicating the position of the outer peripheral end of the substrate W on the tilting stage 21. Therefore, based on the detection results of the encoder of the rotary holding device 40's motor and the eccentricity detector 50, multiple rotation angles of the substrate W corresponding to multiple portions of the outer peripheral end of the substrate W are detected, using the notch as a reference. Furthermore, for each of the detected multiple rotation angles, the difference between the distance from the rotation center of the adsorption holding section 41 to the position of the outer peripheral end of the substrate W detected by the eccentricity detector 50 and the radius of the substrate W is measured as the eccentricity amount corresponding to the rotation angle.

[0049] However, the shape of the outer periphery of the substrate W held by the adsorption holding portion 41 may not be flat. Therefore, in the end state confirmation device 1, the shape of the outer periphery of the substrate W held on the adsorption holding portion 41 is detected. In order to detect the shape of the outer periphery of the substrate W, a height detector 60 can be used.

[0050] The height detector 60 includes, for example, a laser shifter, such as... Figure 2 As shown, the height detector 60 is fixed to the upper surface of the tilting stage 21 in a manner that overlaps with the outer periphery of the substrate W held by the rotation holding device 40 when viewed from above. Figure 1 The arrow, indicated by a dashed line, indicates that the laser is emitted upwards from the tilted stage 21, while simultaneously receiving the laser reflected from the lower surface of the substrate W. Thus, the height detector 60 can, for example, detect the distance (hereinafter referred to as the inter-stage distance) from the upper surface of the tilted stage 21 to the portion of the lower surface of the substrate W illuminated by the laser, based on the amount of light received from the reflected laser.

[0051] When detecting the shape of substrate W, the substrate W is rotated while held on the adsorption holding part 41. Similar to detecting eccentricity information, the rotation angle of substrate W is detected for every small rotation. Additionally, the distance between substrate stages is detected by the height detector 60. Thus, multiple distances between substrate stages corresponding to multiple eccentricity directions are detected, providing shape information representing the shape of the outer periphery of substrate W.

[0052] like Figure 1As shown, a light emitting section 70 is provided on the top surface of the housing 10 via a support plate 79. The light emitting section 70 is located above the substrate W held by the rotation holding device 40. The light emitting section 70 includes a light source and an emitting section. The light source generates infrared light with a wavelength that can pass through the substrate W and the aforementioned protective member. The emitting section emits the infrared light generated by the light source obliquely downward toward the imaging area of ​​the imaging unit 80, which will be described later. In this embodiment, the infrared light emitted from the light emitting section 70 has a wavelength of approximately 1000 nm to 2500 nm. Alternatively, the light source of the light emitting section 70 may be provided outside the housing 10. In this case, the infrared light generated by the light source outside the housing 10 is guided to the emitting section of the light emitting section 70, for example, through an optical fiber or other light guide.

[0053] A support post 89 extending upward from the bottom surface of the outer casing 10 is provided. The height of the upper end of the support post 89 in the Z direction is as follows: Figure 1 As shown, it is approximately the same size as or slightly higher than the substrate W held by the rotation holding device 40. An imaging unit 80 is mounted on the upper end of the support column 89.

[0054] The imaging unit 80 includes an imaging element with multiple pixels arranged in a linear pattern, one or more condenser lenses, and a shutter. In this example, a CCD (Charge-Coupled Device) line sensor capable of detecting infrared light wavelengths can be used as the imaging element of the imaging unit 80. In this case, the imaging unit 80 has a cross-sectional strip-shaped imaging area extending parallel to the direction of the multiple pixel arrangement. Alternatively, a CMOS (Complementary Metal Oxide Semiconductor) line sensor capable of detecting infrared light wavelengths can also be used as the imaging element of the imaging unit 80.

[0055] like Figure 2 As shown, the light emitting unit 70 and the camera unit 80 are arranged in a top-view configuration along the Y direction, and this positional relationship is fixed by the housing 10. The cross-section of the imaging area of ​​the camera unit 80 extends in a strip shape parallel to the Y direction when viewed from above.

[0056] [2] Basic operation of the end state confirmation device

[0057] In the end state confirmation device 1 of this embodiment, the substrate W, which is moved into the housing 10, is held by the rotation holding device 40, and the substrate W rotates at least 360°. At this time, the eccentricity information of the substrate W is calculated by the eccentricity detector 50. In addition, the shape information of the substrate W is detected by the height detector 60.

[0058] Next, infrared light is emitted from the light emitting section 70 toward the imaging area of ​​the imaging section 80, and the substrate W is further rotated by at least 360°. At this time, multiple portions of the outer peripheral end of the substrate W sequentially pass through preset positions (hereinafter referred to as predetermined positions) RP in the imaging area of ​​the imaging section 80 in a preset posture (hereinafter referred to as predetermined posture), thereby controlling the operation of the tilting device 20 and the moving device 30. Specifically, by having multiple portions of the outer peripheral end of the substrate W sequentially pass through predetermined positions RP in predetermined postures, the angle relative to the horizontal plane of the tilting stage 21 and the position of the mounting surface of the moving device 30 are adjusted based on the eccentricity information and shape information obtained in the previous moment.

[0059] Furthermore, for every minute rotation of the substrate W, the imaging unit 80 captures an image of the outer peripheral end of the substrate W illuminated by infrared light from the light emitting unit 70. Additionally, the end-state confirmation device 1 defines a predefined three-dimensional coordinate system. The predetermined position RP is set as a fixed position on the predefined three-dimensional coordinate system.

[0060] Based on the eccentricity information, the position of the notch on the substrate W can be determined. Therefore, when the outer peripheral end of the substrate W is photographed, the control device 90 controls the rotating holding device 40 based on the eccentricity information, thereby orienting the notch of the substrate W toward a predetermined direction.

[0061] Finally, based on the light distribution of the imaging element of the imaging unit 80 obtained by capturing images at each minute angle as the substrate W rotates once, image data corresponding to the entire outer peripheral end of the substrate W is generated. The presence of defects at the outer peripheral end of the substrate W is determined based on the generated image data. In the following description, the image data obtained by capturing images using the imaging unit 80 during the period when the substrate W rotates once is referred to as end image data, and the image represented by the end image data is referred to as an end image.

[0062] [3] Defects that may occur at the outer peripheral end of the bonding substrate W

[0063] Figure 3 This diagram shows an example of a protective component disposed at the outer peripheral end of the substrate W. Figure 4 It indicates that it may arise from Figure 3 The image shows an example of an internal defect in a protective component. Figure 3 and Figure 4 The image shows an enlarged cross-sectional view of the outer periphery of the substrate W.

[0064] like Figure 3 As shown, the bonding substrate W of this embodiment has a configuration in which two single substrates w1 and w2 are bonded together by an adhesive w3. Each single substrate w1 and w2 has an outer peripheral end including a beveled portion.

[0065] Each inclined surface includes a first inclined surface e1, an end surface e2, and a second inclined surface e3. The first inclined surface e1 is a surface that slopes from the upper surface of the outer periphery of the single substrates w1 and w2 toward their outermost periphery when the single substrates w1 and w2 are held in a horizontal position. The second inclined surface e3 is a surface that slopes from the lower surface of the outer periphery of the single substrates w1 and w2 toward their outermost periphery when the single substrates w1 and w2 are held in a horizontal position. The end surface e2 is a surface that connects the lowermost end of the first inclined surface e1 and the uppermost end of the second inclined surface e3 when the single substrates w1 and w2 are held in a horizontal position.

[0066] The protective component w4 is formed by burying the space between the second inclined surface e3 of the single substrate w1 and the first inclined surface e1 of the single substrate w2. Therefore, since the boundary between the single substrate w1 and the single substrate w2 is not exposed, the number of single substrates w1 and w2 that need to be peeled off from their outer peripheral ends is reduced. The material used for the protective component w4 is, for example, the same material as the adhesive w3. However, the material used for the protective component w4 is not limited to the same material as the adhesive w3; materials used for forming SOG (Spin On Glass) films or SOC (Spin On Carbon) films can also be used.

[0067] When forming a protective member w4 at the outer peripheral end of the bonding substrate W, a coating liquid for the protective member is filled into the space between the second inclined surface e3 of the single substrate w1 and the first inclined surface e1 of the single substrate w2. The protective member w4 is formed by hardening the filled coating liquid.

[0068] However, if the space between the second inclined surface e3 and the first inclined surface e1 adjacent to each other in the deposition direction of the substrate is not filled with a sufficient amount of coating liquid, then as Figure 4 As shown, there is a possibility that a void vi may form inside the protective component w4. The presence of such defects, such as voids, inside the protective component w4 can cause the protective component w4 to peel off. Furthermore, it reduces the bonding strength between the individual substrates w1 and w2. According to the end state verification device 1 of this embodiment, it is possible to easily and accurately determine the occurrence of such defects. Figure 4 The defect shown is caused inside the protective component w4.

[0069] [4] Example of image data acquired by camera unit 80

[0070] Figure 5 This indicates that the bonding substrate W, for which no protective component w4 is formed, can be... Figure 1 An example of an end image obtained by the camera unit 80. Figure 6 This indicates that the bonding substrate W, which has no internal defects for the protective component w4, can pass through Figure 1 An example of an end image obtained by the camera unit 80. Figure 7 This indicates that the bonding substrate W, which has internal defects in the protective component w4, can be... Figure 1 An example of an end image obtained by the camera unit 80.

[0071] exist Figures 5-7 In the upper section, a schematic cross-sectional view shows the state of infrared light illuminating the outer peripheral end of the bonding substrate W. In the middle section, a schematic perspective view shows the state of the outer peripheral end of the rotating bonding substrate W captured by the imaging unit 80. In the lower section, an example of an end image obtained by imaging through the upper and middle sections is shown.

[0072] exist Figures 5-7 In the lower end image, the horizontal axis corresponds to the rotation angle of the bonding substrate W, and the vertical axis corresponds to the position of each pixel of the imaging element of the imaging unit 80. In this case, the horizontal axis of the end image represents the distribution of the brightness of the reflected light at the outer peripheral end in the circumferential direction of the bonding substrate W. Furthermore, the vertical axis of the end image represents the distribution of the brightness of the reflected light at the outer peripheral end in the approximate radial direction of the bonding substrate W.

[0073] In addition, Figures 5-7 In the end image of the lower section, the portion of the imaging element of the imaging unit 80 that receives a large amount of infrared light is represented in white, while the portion of the imaging element of the imaging unit 80 that receives a small amount of infrared light or does not receive any infrared light is represented by a dot pattern.

[0074] As in Figure 5 The upper section, indicated by a thick solid arrow, specifies the position RP and the orientation, for example, in the absence of the protective member w4, so that reflected light from the infrared light emitted from the light emitting section 70 is reflected only by the first inclined surface e1 of the single substrate w2 and incident on the imaging section 80. Thus, as... Figure 5 As shown in the lower section, in the end image of the bonding substrate W without the protective member w4, the brightness of image portion i2 corresponding to the first inclined surface e1 of the single substrate w2 is significantly greater than the brightness of other image portions i1 and i3. Furthermore, the other image portions i1 correspond to a fixed-width annular portion in the bonding substrate W located closer to the center of the bonding substrate W than the first inclined surface e1 of the single substrate w2. Additionally, the other image portions i3 correspond to the space outside the bonding substrate W.

[0075] As described, a predetermined position RP and a predetermined posture are set. In this case, in the end image of the bonding substrate W where there are no defects inside the protective component w4, as shown... Figure 6 As shown in the lower paragraph, the brightness of image portion i2 is approximately equal to the brightness of other image portions i1 and i3. This is because... Figure 6As shown in the upper section, most of the infrared light passes through the first inclined surface e1 of the single substrate w2, which is covered by the protective member w4. Moreover, it is assumed that even if a portion of the infrared light is reflected by the first inclined surface e1 of the single substrate w2, the reflected light is attenuated by the protective member w4 or travels to a position different from that of the camera unit 80.

[0076] Compared to Figure 6 For example, in the end image of the bonding substrate W where there is a defect (a void in this example) inside the protective component w4, the defect is more clearly visible. Specifically, as in Figure 7 The lower segment is shown as an ellipse with thick dashed lines. The brightness of the portion of image i2 corresponding to the gap vi inside the protective component w4 is significantly greater than the brightness of other portions. This is because... Figure 7 As shown in the upper section, infrared light incident only on the portion of the single substrate w2 that generates the gap vi is positively reflected by the first inclined surface e1 and incident on the imaging unit 80.

[0077] Therefore, based on the end image data, it can be determined whether defects inside the protective component w4 can be detected based on whether the amount of light received by a specific portion corresponding to the bonded substrate W meets preset conditions (defect determination conditions). Furthermore, in Figure 6 and Figure 7 In the example, a specific portion of the substrate W is a portion of the first inclined surface e1 of the single substrate w2.

[0078] Defect determination criteria may include, for example, whether the detected light intensity is greater than a preset light intensity. In this case, if the detected light intensity is greater than the preset light intensity, a defect is determined to exist. Alternatively, defect determination criteria may include whether a light intensity greater than the preset light intensity is detected within a range larger than a preset area. In this case, if a light intensity greater than the preset light intensity is detected within a range larger than the preset area, a defect is determined to exist.

[0079] [5] Control system of end status confirmation device 1

[0080] Figure 8 It means Figure 1 A block diagram illustrating the configuration of the control system for the end-state confirmation device 1. (See diagram for example.) Figure 8As shown, the control device 90 includes a CPU 91 and a storage unit 99. The CPU 91, as a functional unit, includes a rotation adsorption control unit 92, a movement control unit 93, a tilt control unit 94, an eccentric shape information acquisition unit 95, a camera control unit 96, an image data generation unit 97, and a defect determination unit 98. The storage unit 99 stores the end-state confirmation program used by the end-state confirmation device 1 to confirm the state of the outer peripheral end of the substrate W. Additionally, the storage unit 99 stores various information input from an operation unit (not shown). This various information includes the specified position RP, the specified posture, and defect determination conditions.

[0081] Each functional unit of CPU91 is implemented by causing CPU91 to execute an end-state confirmation program stored in storage unit 99. In addition, some or all of the multiple functional units of CPU91 may also be implemented by hardware such as electronic circuits.

[0082] The operation of each functional unit of CPU 91 is explained. When the rotation adsorption control unit 92 obtains the eccentricity and shape information of the substrate W, and confirms the state of the outer peripheral end of the substrate W, it controls the rotation adsorption drive unit 42. As a result, the substrate W to be confirmed is adsorbed and held on the adsorption holding unit 41. Furthermore, the adsorbed and held substrate W is rotated.

[0083] The motion control unit 93 controls the motion drive unit 32 based on motion commands input from an operation unit (not shown). Furthermore, based on eccentricity and shape information acquired by the eccentricity shape information acquisition unit 95 (described later), the motion control unit 93 controls the motion drive unit 32 to move the outer peripheral end of the substrate W through a predetermined position RP in a predetermined posture. As a result, the mounting surface of the movable stage 31 moves on the tilting stage 21.

[0084] The tilt control unit 94 controls the tilt drive unit 23 based on tilt commands input from an operation unit (not shown). Furthermore, the tilt control unit 94 controls the tilt drive unit 23 by moving the outer peripheral end of the substrate W through a predetermined position RP in a predetermined posture, based on eccentricity and shape information acquired by the eccentricity shape information acquisition unit 95 (described later). This adjusts the tilt angle of the tilt stage 21 relative to the horizontal plane.

[0085] The eccentricity shape information acquisition unit 95 calculates the eccentricity information of the substrate W adsorbed and held on the adsorption holding unit 41 based on signals output from the encoders of the motors provided in the motion drive unit 32 and the rotary adsorption drive unit 42, and signals output from the eccentricity detector 50. Additionally, the eccentricity shape information acquisition unit 95 calculates the shape information of the substrate W adsorbed and held on the adsorption holding unit 41 based on signals output from the encoders of the motors provided in the motion drive unit 32 and the rotary adsorption drive unit 42, and signals output from the height detector 60.

[0086] When the camera control unit 96 confirms the state of the outer peripheral end of the substrate W, it controls the light emitting unit 70 and the camera unit 80 to emit infrared light into the imaging area of ​​the camera unit 80 and capture an image of the outer peripheral end of the substrate W. The image data generation unit 97 generates end image data based on the signal (pixel data) output from the camera unit 80. The defect determination unit 98 determines whether there is a defect at the outer peripheral end of the substrate W based on the end image data generated by the image data unit 97 and the defect determination conditions pre-stored in the storage unit 99.

[0087] [6] End state processing

[0088] Figure 9 This is a flowchart illustrating an example of the end-state verification process performed in the end-state verification device 1. The end-state verification process begins when the substrate W is moved into the end-state verification device 1 by causing the CPU 91 to execute the end-state verification program stored in the storage unit 99.

[0089] When the end state confirmation process begins, the rotary adsorption control unit 92 controls the rotary adsorption drive unit 42 to adsorb and hold the substrate W that has been moved into the end state confirmation device 1 and placed on the adsorption holding unit 41 (step S11).

[0090] Next, the eccentricity information of the substrate W is obtained (step S12). Specifically, when obtaining the eccentricity information, the rotation adsorption control unit 92 controls the rotation adsorption drive unit 42 to rotate the substrate W 360°. As a result, the eccentricity shape information acquisition unit 95 calculates the eccentricity information based on the output signal from the encoder of the rotation adsorption drive unit 42 and the output signal from the eccentricity detector 50.

[0091] Next, the shape information of the substrate W is obtained (step S13). Specifically, when obtaining the shape information, the rotation adsorption control unit 92 controls the rotation adsorption drive unit 42 to rotate the substrate W 360°. Therefore, the eccentric shape information acquisition unit 95 detects the shape information based on the output signal from the encoder of the rotation adsorption drive unit 42 and the output signal from the height detector 60. In addition, the processing of steps S12 and S13 can be performed in reverse order or simultaneously.

[0092] Next, an image of the outer peripheral end of the substrate W is captured (step S14). Specifically, when capturing the image of the outer peripheral end of the substrate W, the rotation adsorption control unit 92 controls the rotation adsorption drive unit 42 to rotate the substrate W 360°. At this time, the movement control unit 93 and the tilt control unit 94 control the movement drive unit 32 and the tilt drive unit 23 based on the predetermined position RP and predetermined posture stored in the storage unit 99, and the acquired eccentricity information and shape information. As a result, the outer peripheral end of the substrate W passes the predetermined position RP in a predetermined posture. In addition, the image control unit 96 captures the entire circumference of the outer peripheral end of the substrate W by controlling the light emission unit 70 and the imaging unit 80. Furthermore, the image data generation unit 97 generates end image data based on the output signal from the encoder of the rotation adsorption drive unit 42 and the output signal from the imaging unit 80.

[0093] Finally, the defect determination unit 98 determines whether there is a defect at the outer peripheral end of the substrate W based on the end image data generated in the previous step S14 and the defect determination conditions pre-stored in the storage unit 99 (step S15). In addition, in step S15, the rotation of the substrate W is stopped along with the defect determination, and the adsorption and holding unit 41 releases the adsorption and holding state of the substrate W. Afterwards, the series of processes for end state confirmation ends.

[0094] In the end-state confirmation process, the defect determination unit 98 may replace step S15 in determining whether a defect exists, and output the end-state image data to the outside of the end-state confirmation device 1. In this case, the user can evaluate the presence of defects in the outer peripheral end of the substrate W by analyzing the end-state image data output from the end-state confirmation device 1.

[0095] In addition, in the end state confirmation process, if it is determined in step S15 that there is a defect at the outer peripheral end of the substrate W, the defect determination unit 98 may also output an alarm signal indicating the presence of a defect to the outside of the end state confirmation device 1.

[0096] [7] Effects

[0097] (1) In the end state confirmation device 1, infrared light is emitted from the light emitting section 70 toward the outer peripheral end of the substrate W held in the adsorption holding section 41. The emitted infrared light is incident on at least a portion of the substrate W and the protective member w4. Depending on whether there is a defect at the outer peripheral end of the substrate W, the light transmitted through the outer peripheral end of the substrate W and the protective member w4 is received by the imaging section 80.

[0098] By capturing an image at the outer periphery of the substrate W using the imaging unit 80, end image data representing the outer periphery of the substrate W and the internal state of the protective member w4 is generated. As a result, internal defects in the protective member w4 formed at the outer periphery of the substrate W can be determined based on the generated end image data.

[0099] (2) In the end-state confirmation device 1, the imaging unit 80 has a cross-sectional strip-shaped imaging area. Furthermore, multiple portions of the outer peripheral end of the substrate W pass through the imaging area of ​​the imaging unit 80, thereby capturing images of the entire circumference of the outer peripheral end of the substrate W. This configuration enables miniaturization of the light-emitting unit 70 and the imaging unit 80, and prevents the end-state confirmation device 1 from becoming too large.

[0100] (3) In the end state confirmation device 1, the presence of a defect at the outer peripheral end of the substrate W is determined based on the end image data obtained by the camera unit 80 and preset defect determination conditions. Thus, it is not necessary to require the user to be proficient in defect determination, and the presence of a defect at the outer peripheral end of the substrate W can be determined uniformly.

[0101] (4) In the end state confirmation device 1 of the first embodiment, such as Figure 2 As shown, the central axis ax1 of the rotation axis 22s of the tilting stage 21 overlaps with a predetermined position when viewed from above. In this case, compared to when the central circumference ax1 deviates significantly from the predetermined position RP when viewed from above, the outer peripheral end of the substrate W held by the adsorption holding part 41 is less prone to large vertical movement when the tilting device 20 is activated. Therefore, when photographing the outer peripheral end of the substrate W, it is easier to control the movement drive part 32 and the tilt drive part 23 used to make the outer peripheral end of the substrate W pass through the predetermined position RP in a predetermined posture.

[0102] 2. Second Implementation Method

[0103] Figure 10 This is a schematic side view of the end state confirmation device 1 according to the second embodiment. Figure 11 yes Figure 10 A schematic top view of the end state confirmation device 1. Regarding the end state confirmation device 1 of the second embodiment, the difference from that of the first embodiment will be described. Figure 1 and Figure 2 The difference between the end state confirmation device 1 and the other device is that the bonding substrate W without the protective member w4 is moved into the end state confirmation device 1 of this embodiment and held by the adsorption holding part 41.

[0104] like Figure 10 and Figure 11 As shown, the end state confirmation device 1 of the second embodiment, in addition to the configuration of the end state confirmation device 1 of the first embodiment, also includes a protection member forming section LN for forming a protection member w4 at the outer peripheral end of the substrate W. The protection member forming section LN includes a nozzle member connected to a supply system (not shown) for supplying coating liquid for the protection member, and capable of spraying the coating liquid supplied from the supply system.

[0105] The front end of the nozzle component of the protective component forming part LN is positioned upstream of the imaging area of ​​the imaging part 80 in the rotation direction of the substrate W and near the outer peripheral end of the substrate W.

[0106] The control device 90 controls and protects the supply system (not shown) connected to the component forming section LN. Thus, before the imaging unit 80 captures an image of the outer periphery of the bonding substrate W, as... Figure 10 As shown in the dialog box, a protective coating liquid is filled into the space between the beveled portion of a single substrate w1 and the beveled portion of a single substrate w2 of a rotating bonding substrate W. The protective component w4 is formed by hardening the filled coating liquid.

[0107] According to the above configuration, the formation of the protective member w4 and the status confirmation of the outer peripheral end of the bonding substrate W can be performed within the end status confirmation device 1. Therefore, the processing efficiency of the bonding substrate W is improved.

[0108] 3. Other implementation methods

[0109] (1) In the described embodiment, the specified position RP and specified posture are determined as follows: In the absence of the protective component w4, only the infrared light emitted from the light emitting section 70 contains... Figure 5 The reflected light from the first inclined surface e1 of the single substrate w2 is incident on the imaging unit 80, but the present invention is not limited thereto.

[0110] The specified position RP and specified posture can also be determined as follows: In the absence of the protective component w4, only the infrared light emitted from the light emitting section 70... Figure 5 The reflected light from the second inclined surface e3 of the single substrate w1 is incident on the imaging unit 80. Under the condition of such a fixed position RP and fixed posture, the detection accuracy of the gap vi generated on the second inclined surface e3 of the single substrate w1 attached to the substrate W is mainly improved.

[0111] The positions of the light emitting unit 70 and the camera unit 80 in the end-state confirmation device 1 can also be appropriately changed according to the specified position RP and the specified posture. For example, in a situation where only... Figure 5 When the reflected light from the second inclined surface e3 of the single substrate w1 is orthogonally reflected and incident on the imaging unit 80, and a predetermined position RP and predetermined posture are set, the positions of the light emitting unit 70 and the imaging unit 80 can also be relative to each other. Figure 1 The example is the change in the way the Z direction is reversed.

[0112] Alternatively, in the end-state confirmation device 1, multiple light-emitting units 70 and multiple imaging units 80 may be provided, each corresponding to a multiple portion of the outer peripheral end of the bonding substrate W (such as the second inclined surface e3 of a single substrate w1 and the first inclined surface e1 of a single substrate w2). In this case, based on multiple end-state image data acquired by the multiple imaging units 80, internal defects existing at the outer peripheral end of the bonding substrate W can be detected with higher precision.

[0113] When using multiple light emitting units 70 and multiple camera units 80, it is desirable to synchronize the emission time of infrared light in each corresponding light emitting unit 70 with the shutter release time in each camera unit 80. This prevents infrared light emitted from a light emitting unit 70 corresponding to another camera unit 80 from entering a single camera unit 80, thus preventing false detection of defects.

[0114] (2) Considering the wavelength of infrared light, the material of substrate W, the thickness of substrate W, and the material of protective component w4, a discernible difference is generated between the attenuation of infrared light passing through the defective portion and the attenuation of infrared light passing through the non-defective portion. Therefore, defect determination can also be performed based on end image data obtained by directly receiving infrared light passing through the outer peripheral end of substrate W by the imaging unit 80.

[0115] In this case, the light emitting unit 70 and the imaging unit 80 may, for example, be arranged facing each other. Based on the defect determination, it is not necessary to limit the infrared light used to determine the defect to infrared light reflected from a specific portion of the substrate W. Therefore, the state of the outer peripheral end of the substrate W can be determined with higher accuracy without considering the orientation of the outer peripheral end of the substrate W.

[0116] (3) The bonding substrate W is not limited to a configuration in which two single substrates w1 and w2 are bonded together, but may also have a laminated configuration in which three or four or more single substrates are bonded together. In the case of this, a protective member w4 is formed between each of two adjacent beveled portions in the lamination direction.

[0117] (4) In the described embodiment, although the height detector 60 includes a laser displacement meter, the present invention is not limited thereto. In order to obtain shape information, the height detector 60 may also replace the laser displacement meter and include a detector (such as an ultrasonic displacement sensor) that can detect the distance between the tilted stage 21 and the outer periphery of the substrate W in a non-contact manner.

[0118] (5) In the described embodiment, although the protective member w4 is formed at the outer peripheral end of the substrate W, the present invention is not limited thereto. When the substrate W held in the adsorption holding portion 41 is a single substrate, the protective member w4 may also be provided in a manner that covers the outer peripheral end (beveled portion) of the single substrate.

[0119] (6) In the described embodiment, although the eccentricity information and shape information are calculated and detected based on the outputs from the eccentricity detector 50 and the height detector 60, respectively, the present invention is not limited thereto. The eccentricity shape information acquisition unit 95 may also acquire at least one of the eccentricity information and shape information through input from outside the end state confirmation device 1.

[0120] (7) In the end state confirmation device 1 of the described embodiment, although the imaging element of the imaging unit 80 includes imaging elements arranged in a linear arrangement, the present invention is not limited thereto. The imaging unit 80 may also include imaging elements arranged in a matrix arrangement of multiple pixels instead of imaging elements arranged in a linear arrangement. That is, the imaging unit 80 may also include imaging elements that arrange multiple pixels in a two-dimensional arrangement.

[0121] (8) In the end state confirmation device 1 of the above embodiment, although the presence of defects at the outer peripheral end of the substrate W is determined based on the end image data obtained by the camera unit 80, the present invention is not limited thereto. It is also possible not to determine whether defects exist.

[0122] (9) In the end state confirmation device 1 of the above embodiment, a display device for displaying an end image based on the generated end image data may also be provided. In this case, the user can easily grasp the shape and size of the defects existing at the outer peripheral end of the substrate W through the end image.

[0123] (10) In the end state confirmation device 1 of the embodiment, a multispectral camera or a hyperspectral camera may also be used as the camera unit 80.

[0124] (11) In the end state confirmation device 1 of the embodiment, although the light emitting part 70 and the imaging part 80 are fixed to the housing 10, and the tilting device 20, the moving device 30 and the rotating holding device 40 are operated by passing through the imaging area of ​​the imaging part 80 in a predetermined posture at the outer peripheral end of the substrate W, the present invention is not limited to this.

[0125] For example, with the tilting device 20, the moving device 30 and the rotating holding device 40 all fixed inside the housing 10, the light emitting part 70 and the camera part 80 can be moved inside the housing 10 by passing the outer peripheral end of the substrate W through the predetermined position RP of the imaging area of ​​the camera part 80 in a predetermined posture.

[0126] 4. The correspondence between the constituent elements of the claims and the constituent elements of the embodiments.

[0127] Hereinafter, examples of the correspondence between the constituent elements of the claims and the constituent elements of the embodiments will be described, but the present invention is not limited to the following examples. Various other elements having the structure or function described in the claims may also be used as constituent elements of the claims.

[0128] In the embodiment described above, the end state confirmation device 1 is an example of an end state confirmation device, the rotation holding device 40 is an example of a substrate holding part, the light emitting part 70 is an example of a light emitting part, the infrared light is an example of light with a wavelength that can pass through the substrate and the protective member, and the imaging part 80 is an example of an imaging part.

[0129] In addition, the tilting device 20, the moving device 30, the moving control unit 93 and the tilting control unit 94 are examples of position and posture adjustment units; the eccentricity detector 50, the height detector 60 and the eccentricity shape information acquisition unit 95 are examples of eccentricity shape information acquisition units; the image data generation unit 97 is an example of an image data generation unit; the defect determination unit 98 is an example of a defect determination unit; the single substrates w1 and w2 are examples of single substrates; the bonding substrate W is an example of a bonding substrate; and the protective component forming unit LN is an example of a protective component forming unit.

Claims

1. An end portion state confirmation device that confirms a state of an end portion of a substrate having a circular shape and provided with a protective member at an outer peripheral end portion of the substrate, and the substrate is a bonded substrate in which a plurality of single substrates are bonded, each of the plurality of single substrates that constitute the bonded substrate has a bevel portion at an outer peripheral end portion of the substrate, the protective member is provided at the outer peripheral end portion of the bonded substrate in a manner to fill a space between two bevels adjacent in a stacking direction of the plurality of single substrates; the end portion state confirmation device comprises: a substrate holding portion that holds the substrate; a light emitting portion that emits light of a wavelength that can pass through the substrate and the protective member toward an outer peripheral end portion of the substrate held by the substrate holding portion; and an imaging portion that images the outer peripheral end portion of the substrate by receiving light that is emitted from the light emitting portion and passes through the outer peripheral end portion of the substrate and the protective member; and the imaging portion is arranged in a manner to receive light that passes through the outer peripheral end portion of the substrate and the protective member and is reflected by one of the two bevel portions.

2. The end portion state confirmation device according to claim 1, wherein the imaging portion has an imaging region of a cross-sectional strip shape extending in a first direction, the light emitting portion and the imaging portion are arranged in a predetermined positional relationship in a manner that light emitted from the light emitting portion travels toward the imaging region of the imaging portion, the substrate holding portion is configured to be capable of rotating the substrate while holding the substrate, the end portion state confirmation device further comprises: a position and posture adjusting portion that adjusts a position and a posture of the substrate holding portion in a manner that a plurality of portions of the outer peripheral end portion of the substrate in a circumferential direction pass through a predetermined position in the imaging region in order in a second direction that intersects the first direction, by rotating the substrate held by the substrate holding portion, when the imaging portion images the outer peripheral end portion of the substrate.

3. The end portion state confirmation device according to claim 2, further comprising: an eccentric shape information acquisition portion that acquires eccentric information including an eccentric amount and an eccentric direction of a center of the substrate with respect to a center of rotation of the substrate held by the substrate holding portion, and shape information that indicates a shape of an outer peripheral portion of the substrate, before the imaging portion images the outer peripheral end portion of the substrate; and the position and posture adjusting portion adjusts the position and the posture of the substrate holding portion based on the eccentric information and the shape information acquired by the eccentric shape information acquisition portion, when the imaging portion images the outer peripheral end portion of the substrate.

4. The end portion state confirmation device according to any one of claims 1 to 3, further comprising: an image data generation portion that generates image data based on an output signal from the imaging portion; and a defect determination portion that determines whether or not a defect exists in the outer peripheral end portion of the substrate based on whether or not the image data generated by the image data generation portion satisfies a predetermined determination condition.

5. The end state confirming apparatus according to any one of claims 1 to 3, further comprising a protective member forming section that produces the substrate by forming the protective member at an outer peripheral end portion of an unprocessed substrate that is held by the substrate holding section in a state in which the unprocessed substrate is held without the protective member being formed.

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