Wafer corner missing automatic alignment device

Abstract

The application provides a wafer corner missing automatic alignment device, which comprises a body, a wafer rotating mechanism and a wafer positioning mechanism. The body has a wafer boat placing part. The wafer rotating mechanism is arranged on the body and comprises a rotating shaft, the rotating shaft extends through the wafer boat placing part, and the angle between the axis of the rotating shaft and the body is greater than 0° and less than 90°. The wafer positioning mechanism is arranged on the body and comprises a positioning member, the positioning member extends through the wafer boat placing part, and the axis of the positioning member is parallel to the axis of the rotating shaft. Therefore, the application can present multiple wafers in a stepped distribution through the inclined rotating shaft and the positioning member, prevent the serial number of each wafer from being blocked by other wafers, and achieve the functions of rotating the wafer, aligning the corner missing and identifying the serial number.

Description

TECHNICAL FIELD

[0001] The present application relates to an alignment device, in particular to an automatic wafer corner alignment device. BACKGROUND

[0002] In hybrid floor shop production, there are often situations where wafers from different suppliers are processed simultaneously. If the wafers of different batches all need to be reconfigured and trained for optical character recognition (OCR), it will greatly affect the production speed, making the inspection link a bottleneck in the production line. Therefore, wafer number recognition has become an important link in semiconductor packaging factories, which can quickly distinguish wafers to improve management efficiency and reduce the risk of wafer confusion or loss.

[0003] Manual wafer corner alignment devices usually drive a rotating shaft to rotate by manually rotating a hand wheel. The rotating shaft further drives multiple wafers to rotate. The corners of the wafers are positioned on a positioning member, so that the rotating wafers, corner alignment, and number recognition functions can be achieved. However, manual operation is time-consuming and labor-intensive, and the rotation torque cannot be controlled, which can easily cause the wafers to shake and be damaged. In addition, the rotating shaft is parallel to the body, so that the height of the wafers on the rotating shaft is equal, which causes the numbers of the wafers to be blocked by other wafers, affecting the number recognition efficiency.

[0004] Electric wafer corner alignment devices replace the hand wheel with a driving device to achieve the effect of automatic rotation of the rotating shaft, saving time and effort, and effectively controlling the rotation torque, so that the wafers are less likely to shake and be damaged. In addition, the electric wafer corner alignment device can sequentially lift the wafers by a lifting device to prevent the numbers of the wafers from being blocked by other wafers, thereby improving the number recognition efficiency.

[0005] However, the electric wafer corner alignment device has the following problems: first, the cost of setting up the lifting device is high, and the volume is large and cumbersome; second, it needs to be plugged into the mains to supply sufficient power, and cannot be moved at will; third, the mains is alternating current, which has high energy consumption, unstable output, and the risk of electric shock and electromagnetic interference; fourth, the heat dissipation effect is poor.

[0006] In addition, the manual and electric wafer corner devices have the following common problems: first, the distance between the rotating shaft and the positioning member is fixed, and cannot be applied to wafers of different sizes; second, the particles in the surrounding environment cannot be removed, causing particles to adhere to the surface of the wafers, which can affect the yield of the subsequent process of the wafers. SUMMARY

[0007] The main purpose of the present application is to provide a wafer corner missing automatic alignment device, which can present a plurality of wafers in a stepped distribution by means of an inclined rotating shaft and a positioning member, prevent the number of the wafer from being blocked, and achieve the functions of rotating the wafer, aligning the corner missing, and identifying the number.

[0008] Another purpose of the present application is to provide a wafer corner missing automatic alignment device, which can control the rotation of the rotating shaft by means of a single driving device to achieve the above-mentioned functions.

[0009] Still another purpose of the present application is to provide a wafer corner missing automatic alignment device, which can be powered by a direct current mobile power supply.

[0010] Still another purpose of the present application is to provide a wafer corner missing automatic alignment device, which can be applied to wafers of different sizes.

[0011] Still another purpose of the present application is to provide a wafer corner missing automatic alignment device, which can remove the particles in the peripheral environment of the wafer boat and has good heat dissipation effect.

[0012] In order to achieve the above-mentioned purposes, the present application provides a wafer corner missing automatic alignment device, which comprises a body, a wafer rotating mechanism, and a wafer positioning mechanism. The body has a wafer boat placing portion. The wafer rotating mechanism is arranged on the body and comprises a rotating shaft, which extends through the wafer boat placing portion, and the angle between the axis of the rotating shaft and the body is greater than 0° and less than 90°. The wafer positioning mechanism is arranged on the body and comprises a positioning member, which extends through the wafer boat placing portion, and the axis of the positioning member is parallel to the axis of the rotating shaft.

[0013] In some embodiments, the wafer rotating mechanism comprises a driving device, which is close to a first side of the wafer boat placing portion, and a driving shaft of the driving device is connected to a first end of the rotating shaft; wherein the wafer positioning mechanism comprises a base, which is arranged on the body and close to the first side of the wafer boat placing portion, and a first end of the positioning member is connected to the base; and wherein the wafer corner missing automatic alignment device further comprises a power supply device and a control device, the power supply device is arranged on the body, the control device is arranged on the body and electrically connected to the driving device and the power supply device, the power supply device provides power to the control device, and the control device controls the driving shaft of the driving device to drive the rotating shaft to rotate.

[0014] In some embodiments, the wafer rotating mechanism further comprises a moving device, which is arranged on the body and close to the first side of the wafer boat placing portion, the driving device is arranged on the moving device, the control device is electrically connected to the moving device, and the moving device controls the driving device to move towards or away from the positioning member to adjust the distance between the rotating shaft and the positioning member.

[0015] In some embodiments, the base includes a second fixing seat and a plate body, the second fixing seat is disposed on the body and is close to the first side of the wafer boat placing portion, the plate body is disposed on the second fixing seat, an axis of the plate body is parallel to the axis of the rotating shaft, the plate body is provided with a plurality of positioning holes, the positioning holes are different in height position and different in distance from the rotating shaft, and the first end of the positioning member is selectively fixed in one of the positioning holes to adjust the distance between the rotating shaft and the positioning member.

[0016] In some embodiments, the wafer rotating mechanism includes a first support member, the first support member is disposed on the body, is close to a second side of the wafer boat placing portion, and supports a second end of the rotating shaft; and the wafer positioning mechanism includes a second support member, the second support member is disposed on the body, is close to the second side of the second support member, and supports a second end of the positioning member.

[0017] In some embodiments, the first support member is capable of adjusting the angle of the angle between the axis of the rotating shaft and the body by adjusting the height thereof or by adjusting the distance between the first support member and the driving device; and the second support member is capable of adjusting the angle of the angle between the axis of the positioning member and the body by adjusting the height thereof or by adjusting the distance between the second support member and the base.

[0018] In some embodiments, the base includes a second fixing seat and a plate body, the second fixing seat is disposed on the body and is close to the first side of the wafer boat placing portion, the plate body is disposed on the second fixing seat, an axis of the plate body is parallel to the axis of the rotating shaft, the plate body is provided with a plurality of positioning holes, the positioning holes are different in height position and different in distance from the rotating shaft, and the first end of the positioning member is selectively fixed in one of the positioning holes to adjust the distance between the rotating shaft and the positioning member.

[0019] In some embodiments, the driving device is a direct current stepper motor, and the power supply device is a direct current mobile power supply.

[0020] In some embodiments, the body is provided with a plurality of air suction holes and a plurality of air exhaust holes, the air suction holes are communicated with the inside of the body, and the air exhaust holes are communicated with the inside of the body; and the wafer corner automatic alignment device further includes at least one air suction device, the at least one air suction device is disposed in the inside of the body and is located at one side of the air exhaust holes, the control device is electrically connected with the at least one air suction device, and the at least one air suction device is used to guide external air to enter the inside of the body through the air suction holes and to be exhausted outward through the air exhaust holes.

[0021] In some embodiments, the wafer corner missing automatic alignment device further comprises a first image capturing device and a second image capturing device; wherein the first image capturing device is disposed on the body, close to the first side of the wafer boat placing portion, electrically connected to the control device, and used to capture the images of the marks of the plurality of wafers from the front surface of the wafers; and wherein the second image capturing device is disposed on the body, close to the third side or the fourth side of the wafer boat placing portion, electrically connected to the control device, and used to capture the images of the marks of the plurality of wafers from the side surface of the wafers.

[0022] The wafer corner missing automatic alignment device of the present application has the advantages that the plurality of wafers are distributed in a stepped manner by the inclined rotating shaft and the positioning member, the marks of the wafers are prevented from being blocked by other wafers, and the rotating of the wafers, the corner missing alignment and the mark recognition can be achieved without additional lifting device, and the wafer corner missing automatic alignment device has low cost, small size and light weight.

[0023] In addition, the rotating of the wafers, the corner missing alignment and the mark recognition can be achieved by the single driving device, and the wafer corner missing automatic alignment device has the advantages of power saving, small size, light weight and easy to move.

[0024] Furthermore, the wafer corner missing automatic alignment device can obtain the required power by the direct current mobile power supply, and does not need to be plugged into the mains power supply, and has the advantages of low power consumption, stable output, no risk of electric leakage and low electromagnetic interference.

[0025] In addition, the wafer corner missing automatic alignment device can provide the bottom of the wafers of different sizes to contact the rotating shaft and the positioning member by adjusting the distance between the rotating shaft and the positioning member, and has the effect of being suitable for wafers of different sizes.

[0026] In addition, the wafer corner missing automatic alignment device can guide the external air to sequentially pass through the air suction hole, the inside of the body and the air exhaust hole and be exhausted outward, so as to remove the particles in the surrounding environment of the wafer boat and provide good heat dissipation effect. BRIEF DESCRIPTION OF DRAWINGS

[0027] Figure 1 is a perspective view of the first embodiment of the present application.

[0028] Figure 2 is an exploded view of the first embodiment of the present application.

[0029] Figure 3 is a front view of the first embodiment of the present application.

[0030] Figure 4 is a top view of the first embodiment of the present application.

[0031] Figure 5 is a side view of the first embodiment of the present application.

[0032] Figure 6 is a cross-sectional view of the first embodiment of the present application.

[0033] Figure 7 shows a schematic view of a boat placed in the boat placing portion of the present application.

[0034] Figure 8 shows a schematic view of the present application aligning the corner defects of multiple wafers and marking the top of the wafers.

[0035] Figure 9 is an exploded view of the wafer rotating mechanism of the present application.

[0036] Figure 10 is an exploded view of the wafer positioning mechanism of the present application.

[0037] Figure 11 shows a schematic view of external air passing through the air extraction hole, air extraction device, and air exhaust hole of the present application.

[0038] Figure 12 is a schematic view of the height increase of the first and second support members of the present application.

[0039] Figure 13 is a perspective view of the second embodiment of the present application.

[0040] Figure 14 shows a schematic view of a boat pressing the pressure switch of the present application.

[0041] BRIEF DESCRIPTION OF THE DRAWINGS

[0042] 10: body; 101: boat placing portion; 11: top plate; 111: air extraction hole; 112: third sliding groove; 113: fourth sliding groove; 12: bottom plate; 13: first side plate; 131: air exhaust hole; 14: second side plate; 15: third side plate; 16: fourth side plate; 17: partition plate; 18: mounting seat; 20: wafer rotating mechanism; 21: rotating shaft; 211: axis; 22: driving device; 221: driving shaft; 23: moving device; 231: first fixing seat; 2311: first sliding groove; 2312: second sliding groove; 232: first sliding block; 233: second sliding block; 24, 24A: first support member; 241: through hole; 30: wafer positioning mechanism; 31: positioning member; 311: axis; 312: protruding column; 32: base; 321: second fixing seat; 322: plate body; 3221: positioning hole; 33, 33A: second support member; 331: recess; 40: power supply device; 50: control device; 51: pressure switch; 60: air extraction device; 70: first image capturing apparatus; 80: second image capturing apparatus; 90: boat; 91: wafer; 911: corner defect; 912: mark; θ1-2: included angle. DETAILED DESCRIPTION

[0043] The embodiments of the present application will be described in more detail with reference to the drawings and component symbols, so that those skilled in the art can carry out the present application after reading the description.

[0044] As shown in Figures 1 to 6 , the present application provides a wafer corner missing automatic alignment device, which includes a body 10, a wafer rotating mechanism 20 and a wafer positioning mechanism 30. The body 10 has a wafer boat placing portion 101. The wafer rotating mechanism 20 is disposed on the body 10, and includes a rotating shaft 21, which extends through the wafer boat placing portion 101, and an angle θ1 between an axis 211 of the rotating shaft 21 and the body 10 is greater than 0° and less than 90°. In other words, the rotating shaft 21 is inclined relative to the body 10. The wafer positioning mechanism 30 is disposed on the body 10, and includes a positioning member 31, which extends through the wafer boat placing portion 101, and an angle θ2 between an axis 311 of the positioning member 31 and the body 10 is equal to the angle θ1 between the axis 211 of the rotating shaft 21 and the body 10.

[0045] As shown in Figure 7 , a plurality of wafers 91 with the same size are placed in a wafer boat 90, and each wafer 91 has a corner missing 911; the wafer boat 90 is placed on the wafer boat placing portion 101, and the bottoms of the wafers 91 contact the rotating shaft 21 and the positioning member 31. Because the rotating shaft 21 is inclined relative to the body 10, the rotating shaft 21 can cause the wafers 91 to have different heights and present a stepped distribution, and the top of the front side of each wafer 91 can be exposed and not blocked by other wafers 91.

[0046] As shown in Figure 8 , the rotating shaft 21 drives the wafers 91 to rotate until the corner missing 911 of each wafer 91 is positioned on the positioning member 31. At this time, the marks 912 on the front side of each wafer 91 are aligned and just on the top of each wafer 91. Therefore, the marks 912 of each wafer 91 can be exposed and not blocked by other wafers 91, so that the wafers 91 can be smoothly identified by the marks 912.

[0047] As shown in Figure 3 , the angle θ1 between the axis 211 of the rotating shaft 21 and the body 10 is between 30° and 40°, which can just provide the marks 912 of a plurality of eight-inch wafers 91 to be exposed and not blocked by other eight-inch wafers 91.

[0048] Therefore, the wafer 91 can be arranged in a stepped manner by the inclined rotating shaft 21 and the positioning member 31, the serial number 912 of each wafer 91 is prevented from being blocked by other wafers 91, and the rotating wafer, the missing corner alignment, and the serial number recognition can be further achieved without the additional lifting device, and the wafer missing corner automatic alignment device has the advantages of low cost, small size, and light weight.

[0049] More specifically, as shown in Figure 1 and Figure 2 , in the first embodiment, the body 10 includes a top plate 11, a bottom plate 12, a first side plate 13, a second side plate 14, a third side plate 15, a fourth side plate 16, two partition plates 17, and a mounting seat 18, the first side plate 13 and the second side plate 14 are opposite to each other, the third side plate 15 and the fourth side plate 16 are opposite to each other, the partition plates 17 are arranged on the top plate 11 and jointly form a wafer boat placement part 101 with the top plate 11, and the mounting seat 18 is arranged on the third side plate 15. One side of the wafer boat placement part 101 close to the first side plate 13 is defined as a first side, one side of the wafer boat placement part 101 close to the second side plate 14 is defined as a second side, one side of the wafer boat placement part 101 close to the third side plate 15 is defined as a third side, and one side of the wafer boat placement part 101 close to the fourth side plate 16 is defined as a fourth side. As shown in Figure 1 and Figure 2 , in the first embodiment, the wafer rotating mechanism 20 includes a driving device 22, the driving device 22 is close to the first side of the wafer boat placement part 101, and a driving shaft 221 (see Figure 9 ) of the driving device 22 is connected to a first end of the rotating shaft 21. As shown in Figure 1 and Figure 2 , in the first embodiment, the wafer positioning mechanism 30 includes a base 32, the base 32 is arranged on the top plate 11 and close to the first side of the wafer boat placement part 101, and a first end of the positioning member 31 is connected to the base 32. As shown in Figure 1 and Figure 2 , in the first embodiment, the wafer missing corner automatic alignment device further includes a power supply device 40 and a control device 50, the power supply device 40 is arranged on the mounting seat 18, the control device 50 is arranged inside the body 10 and close to the first side plate 13, and is electrically connected to the driving device 22 and the power supply device 40, the power supply device 40 provides power to the control device 50, and the control device 50 controls the driving shaft 221 of the driving device 22 to drive the rotating shaft 21 to rotate.

[0050] Therefore, the wafer missing corner automatic alignment device can control the rotating shaft 21 to rotate by the single driving device 22 to achieve the rotating wafer, the missing corner alignment, and the serial number recognition, and has the advantages of power saving, small size, light weight, and easy to move.

[0051] Preferably, the driving device 22 is a direct current (DC) stepper motor, which can achieve the following functions: first, precisely control the rotation angle of the rotation shaft 21, so that the corner defects 911 of the wafers 91 can be precisely aligned; second, provide stable rotation speed and torque of the rotation shaft 21, so that the rotation shaft 21 can rotate the wafers 91 smoothly, avoiding shaking and damaging the wafers 91.

[0052] Preferably, because the wafer corner defect automatic alignment device of the present application is very energy-saving, the power supply device 40 is a DC mobile power supply, which can supply the required power. Therefore, the wafer corner defect automatic alignment device of the present application does not need to be plugged into the mains power supply, is easy to move, and the DC mobile power supply has the advantages of low power consumption, stable output, no risk of electric shock, and low electromagnetic interference.

[0053] As shown in FIG. 1, Figures 1 to 6 In the first embodiment, the wafer rotating mechanism 20 further includes a moving device 23 disposed on the body 10 and close to the first side of the wafer boat placing portion 101, and the driving device 22 is disposed on the moving device 23. The control device 50 is electrically connected to the moving device 23, and the moving device 23 controls the driving device 22 to move towards or away from the positioning member 31 to adjust the distance between the rotation shaft 21 and the positioning member 31.

[0054] Specifically, as shown in FIG. 2, Figure 1 , Figure 2 and Figure 9 , the moving device 23 includes a first fixed seat 231, a first sliding block 232, and a second sliding block 233. The first fixed seat 231 is disposed on the top plate 11, close to the first side of the wafer boat placing portion 101, and a first sliding groove 2311 and a second sliding groove 2312 are formed therein. The first sliding block 232 is slidably disposed in the first sliding groove 2311, and the second sliding block 233 is slidably disposed in the second sliding groove 2312. A first end of the driving device 22 is disposed on the first sliding block 232, and the second sliding block 233 supports a second end of the driving device 22, and an axis of the driving device 22 is parallel to the axis 211 of the rotation shaft 21. The control device 50 controls the first sliding block 232 and the second sliding block 233 to move synchronously, so that the first sliding block 232 and the second sliding block 233 synchronously control the driving device 22 to move towards or away from the positioning member 31 to adjust the distance between the rotation shaft 21 and the positioning member 31.

[0055] As shown in FIG. 3, Figure 1 , Figure 2 and Figure 10As shown, in the first embodiment, the base 32 includes a second fixing seat 321 and a plate 322. The second fixing seat 321 is disposed on the top plate 11 and near the first side of the crystal boat placement part 101. The plate 322 is disposed on the second fixing seat 321, and one axis of the plate 322 is parallel to the axis 211 of the rotating shaft 21. The plate 322 has a plurality of positioning holes 3221, which are at different heights and at different distances from the rotating shaft 21. The first end of the positioning member 31 is selectively fixed through one of the positioning holes 3221 to adjust the distance between the rotating shaft 21 and the positioning member 31.

[0056] Whether the bottom of wafers 91 of different sizes can contact the pivot 21 and the positioning element 31 depends on the distance between the pivot 21 and the positioning element 31. Taking 12-inch, 8-inch, and 6-inch wafers 91 as examples, since the 12-inch wafer 91 has the largest diameter, the 8-inch wafer 91 has a medium diameter, and the 6-inch wafer 91 has the smallest diameter, the 12-inch wafer 91 requires the largest distance between the pivot 21 and the positioning element 31, the 8-inch wafer 91 requires a medium distance, and the 6-inch wafer 91 requires the smallest distance. Therefore, the automatic wafer corner alignment device of the present invention can adjust the distance between the pivot 21 and the positioning element 31 by moving the driving device 22 via the moving device 23 or by having the first end of the positioning element 31 fixed in different positioning holes 3221, thus ensuring that the bottom of wafers 91 of different sizes contacts the pivot 21 and the positioning element 31, achieving an effect suitable for wafers 91 of different sizes.

[0057] like Figures 1 to 3 As shown, in the first embodiment, the wafer rotation mechanism 20 includes a first support member 24, which is disposed on the top plate 11, near the second side of the wafer boat placement portion 101, and supports a second end of the rotating shaft 21. More specifically, the first support member 24 has a through hole 241, and the second end of the rotating shaft 21 is located in the through hole 241. Therefore, the first support member 24 can provide sufficient supporting force to support the rotating shaft 21, preventing the rotating shaft 21 from being pressed down by the weight of the wafers 91 and falling or even breaking, so that the angle θ1 between the axis 211 of the rotating shaft 21 and the body 10 can remain unchanged.

[0058] like Figures 1 to 3As shown, in the first embodiment, the wafer positioning mechanism 30 includes a second support member 33, which is disposed on the top plate 11, near the second side of the wafer boat placement portion 101, and supports a second end of the positioning member 31. More specifically, a groove 331 is formed on the top of the second support member 33, and a protrusion 312 is provided on the second end of the positioning member 31, with the protrusion 312 located in the groove 331. Therefore, the second support member 33 can provide sufficient supporting force to support the positioning member 31, preventing the positioning member 31 from being pressed down by the weight of the wafers 91 and falling or even breaking, so that the angle θ2 between the axis 311 of the positioning member 31 and the body 10 can remain unchanged.

[0059] like Figure 1 , Figure 2 and Figure 6 As shown, in the first embodiment, the top plate 11 has a plurality of suction holes 111, and the first side plate 13 has a plurality of exhaust holes 131. The suction holes 111 and the exhaust holes 131 communicate with the interior of the body 10. The automatic wafer corner alignment device of the present invention further includes a plurality of suction devices 60, which are disposed inside the body 10 and located on one side of each of the exhaust holes 131. The control device 50 is electrically connected to the suction devices 60.

[0060] like Figure 11 As shown, the air extraction device 60 guides external air into the body 10 through the air extraction holes 111 and exhausts it outward through the exhaust holes 131. More specifically, the external air surrounding the wafer placement section 101 actually contains many particles (not shown). These particles enter the body 10 through the air extraction holes 111 and are exhausted outward through the exhaust holes 131, thus removing particles from the surrounding environment of the wafer placement section 101, preventing these particles from adhering to the surface of the wafers 91, and improving the yield of subsequent processes on the wafers 91. It is worth mentioning that the heat generated during the operation of the control device 50 can also be exhausted outward with the flow of external air, achieving a heat dissipation effect.

[0061] Preferably, the first support member 24 can adjust the angle θ1 between the axis 211 of the rotating shaft 21 and the body 10 by adjusting its height; simultaneously, the second support member 33 can adjust the angle θ2 between the axis 311 of the positioning member 31 and the body 10 by adjusting its height. Specifically, Figure 3 The first support member 24 and the second support member 33 shown are relatively low in height, which makes the angle θ1 between the axis 211 of the rotating shaft 21 and the body 10 smaller, and the angle θ2 between the axis 311 of the positioning member 31 and the body 10 smaller. Figure 12The heights of the first support 24A and the second support 33A are high, so that the angle θ1 between the axis 211 of the rotating shaft 21 and the body 10 is large, and the angle θ2 between the axis 311 of the positioning member 31 and the body 10 is large.

[0062] Whether the notches 912 of the wafers 91 of different sizes can be exposed and not blocked by other wafers 91 depends on whether the angle θ1 between the axis 211 of the rotating shaft 21 and the body 10 is appropriate. Taking twelve-inch, eight-inch and six-inch wafers 91 as examples, because the diameter of the twelve-inch wafer 91 is the largest, the diameter of the eight-inch wafer 91 is in the middle, and the diameter of the six-inch wafer 91 is the smallest, the angle θ1 between the axis 211 of the rotating shaft 21 and the body 10 required by the twelve-inch wafer 91 is the smallest and is more appropriate, the angle θ1 between the axis 211 of the rotating shaft 21 and the body 10 required by the eight-inch wafer 91 is in the middle and is more appropriate, and the angle θ1 between the axis 211 of the rotating shaft 21 and the body 10 required by the six-inch wafer 91 is the largest and is more appropriate. Thus, the wafer notch automatic alignment device of the present application can adjust the angle θ1 between the axis 211 of the rotating shaft 21 and the body 10 to an appropriate angle by replacing the first supports 24, 24A of different heights, so that the notches 912 of wafers 91 of different sizes can be exposed and not blocked by other wafers 91.

[0063] Whether the notches 912 of the wafers 91 of different sizes can be exposed and not blocked by other wafers 91 depends on whether the angle θ1 between the axis 211 of the rotating shaft 21 and the body 10 is appropriate. Taking twelve-inch, eight-inch and six-inch wafers 91 as examples, because the diameter of the twelve-inch wafer 91 is the largest, the diameter of the eight-inch wafer 91 is in the middle, and the diameter of the six-inch wafer 91 is the smallest, the angle θ1 between the axis 211 of the rotating shaft 21 and the body 10 required by the twelve-inch wafer 91 is the smallest and is more appropriate, the angle θ1 between the axis 211 of the rotating shaft 21 and the body 10 required by the eight-inch wafer 91 is in the middle and is more appropriate, and the angle θ1 between the axis 211 of the rotating shaft 21 and the body 10 required by the six-inch wafer 91 is the largest and is more appropriate. Thus, the wafer notch automatic alignment device of the present application can adjust the angle θ1 between the axis 211 of the rotating shaft 21 and the body 10 to an appropriate angle by replacing the first supports 24, 24A of different heights, so that the notches 912 of wafers 91 of different sizes can be exposed and not blocked by other wafers 91.

[0064] Preferably, as shown in Figure 1 , Figure 2 and Figure 10As shown, the plate 322 is pivotally mounted on the second fixed base 321. The first end of the positioning member 31 is connected to the plate 322. The plate 322 can rotate relative to the second fixed base 321 to adjust the angle θ2 between the axis 311 of the positioning member 31 and the body 10.

[0065] In other embodiments, the first support member 24 can also adjust the angle θ1 between the axis 211 of the rotating shaft 21 and the body 10 by adjusting the distance between it and the drive device 22; at the same time, the second support member 33 can also adjust the angle θ2 between the axis 311 of the positioning member 31 and the body 10 by adjusting the distance between it and the base 32.

[0066] like Figures 1 to 6 As shown, in the first embodiment, the automatic wafer corner alignment device of the present invention further includes a first image capture device 70 and a second image capture device 80. The first image capture device 70 is disposed on the top plate 11, near the first side of the wafer boat placement portion 101, electrically connected to the control device 50, and is used to capture images of the markings 912 of the wafers 91 from the front side. The second image capture device 80 is disposed on the top plate 11, near the third side of the wafer boat placement portion 101, electrically connected to the control device 50, and is used to capture images of the markings 912 of the wafers 91 from the side side. After receiving the images of the markings 912 of the wafers 91, the control device 50 further transmits them to a marking recognition module (not shown) for marking recognition. In other embodiments, the second image capture device 80 may also be located near the fourth side of the wafer boat placement portion 101, with the same function.

[0067] More specifically, because wafer 91 comes in various sizes and its surface is reflective, the first image capture device 70 and the second image capture device 80 need to capture the serial number 912 on wafer 91 from different angles. This ensures that at least one of the first image capture device 70 and the second image capture device 80 captures an image of the serial number 912 on wafer 91, guaranteeing focus and ensuring both the quantity and quality of the images. Only then can the serial number recognition module obtain a better image to accurately identify the serial number 912 on wafer 91.

[0068] like Figure 1 , Figure 2 and Figure 4As shown in the first embodiment, two third sliding grooves 112 are formed on the top plate 11, and are located on the two sides of the first fixed seat 231 near the first side of the wafer boat placing portion 101. Two fourth sliding grooves 113 are also formed on the top plate 11, and are located near the third side and the fourth side of the wafer boat placing portion 101, respectively. The first image capturing device 70 is slidably arranged in one of the two third sliding grooves 112, and the second image capturing device 80 is slidably arranged in one of the two fourth sliding grooves 113. The first image capturing device 70 can be moved along one of the two third sliding grooves 112 to adjust its relative position with the wafers 91, so that the images of the serial numbers 912 of the wafers 91 can be captured from the front side of the wafers 91 at a better angle. The second image capturing device 80 can be moved along one of the two fourth sliding grooves 113 to adjust its relative position with the wafers 91, so that the images of the serial numbers 912 of the wafers 91 can be captured from the side of the wafers 91 at a better angle.

[0069] Referring to Figure 13 and Figure 14 , Figure 13 is a perspective view of the second embodiment of the present application, Figure 14 Fig. 6 shows a schematic view of the wafer boat 90 pressing the pressure switch of the present application. As Figure 13 shown, the difference between the second embodiment and the first embodiment is that the control device 50 comprises a pressure switch 51, and is arranged on one of the partitions 17. As Figure 14 shown, the wafer boat 90 presses the pressure switch 51 to activate the driving device 22, the moving device 23, the air pumping device 60, the first image capturing device 70 and the second image capturing device 80. After the wafer boat 90 is removed from the wafer boat placing portion 101, the pressure switch 51 is reset by the elastic force of an elastic member (not shown).

[0070] The above merely explains the preferred embodiments of the present application, and is not intended to limit the present application in any form. Any modification or change related to the present application made under the same inventive spirit should still be included in the scope of the present application.

Claims

1. An automatic wafer corner alignment device, characterized in that, include: The main body has a crystal boat placement section; A wafer rotation mechanism is disposed on the body and includes a rotating shaft extending through the wafer boat placement portion, wherein an angle between an axis of the rotating shaft and the body is greater than 0 and less than 90 degrees; and A wafer positioning mechanism is disposed on the body and includes a positioning member that extends through the wafer boat placement portion, and an axis of the positioning member is parallel to the axis of the rotating shaft. The wafer rotation mechanism includes a driving device, which is located near a first side of the wafer boat placement portion, and a driving shaft of the driving device is connected to a first end of the rotating shaft; the wafer positioning mechanism includes a base, which is disposed on the body and located near the first side of the wafer boat placement portion, and a first end of the positioning member is connected to the base. The base includes a second fixing seat and a plate. The second fixing seat is disposed on the main body and close to the first side of the crystal boat placement part. The plate is disposed on the second fixing seat. One axis of the plate is parallel to the axis of the rotating shaft. The plate has multiple positioning holes with different heights and different distances from the rotating shaft. The first end of the positioning member is selectively fixed through one of the multiple positioning holes to adjust the distance between the rotating shaft and the positioning member.

2. The automatic wafer corner alignment device according to claim 1, characterized in that, The automatic wafer corner alignment device also includes: A power supply device and a control device are provided. The power supply device is disposed on the main body, and the control device is disposed on the main body and electrically connected to the drive device and the power supply device. The power supply device provides power to the control device, and the control device controls the drive shaft of the drive device to drive the rotating shaft to rotate.

3. The automatic wafer corner alignment device according to claim 2, characterized in that, The wafer rotation mechanism further includes a moving device, which is disposed on the main body and close to the first side of the wafer boat placement portion. The driving device is disposed on the moving device, and the control device is electrically connected to the moving device. The moving device controls the driving device to move closer to or further away from the positioning member to adjust the distance between the rotating shaft and the positioning member.

4. The automatic wafer corner alignment device according to claim 2, characterized in that, The wafer rotation mechanism includes a first support member, which is disposed on the body, near a second side of the wafer boat placement portion, and supports a second end of the rotating shaft. The wafer positioning mechanism includes a second support member disposed on the body, near the second side of the second support member, and supporting a second end of the positioning member.

5. The automatic wafer corner alignment device according to claim 4, characterized in that, The first support member can adjust the angle between the axis of the rotating shaft and the body by adjusting its height or by adjusting the distance between it and the drive device; And wherein the second support member can adjust the angle between the axis of the positioning member and the body by adjusting its height or by adjusting the distance between it and the base.

6. The automatic wafer corner alignment device according to claim 2, characterized in that, The base includes a second fixed seat and a plate. The second fixed seat is disposed on the main body and close to the first side of the crystal boat placement part. The plate is pivotally mounted on the second fixed seat. The first end of the positioning member is connected to the plate. The plate can rotate relative to the second fixed seat to adjust the angle between the axis of the positioning member and the main body.

7. The automatic wafer corner alignment device according to claim 2, characterized in that, The driving device is a DC stepper motor, and the power supply device is a DC power supply.

8. The automatic wafer corner alignment device according to claim 2, characterized in that, The main body has multiple air extraction holes and multiple air exhaust holes. The multiple air extraction holes are connected to the interior of the main body, and the multiple air exhaust holes are connected to the interior of the main body. Furthermore, the wafer corner-cutting automatic alignment device further includes at least one air extraction device, which is disposed inside the main body and located on one side of the plurality of exhaust holes. The control device is electrically connected to the at least one air extraction device, which is used to guide external air into the main body through the plurality of air extraction holes and discharge it outward through the plurality of exhaust holes.

9. The automatic wafer corner alignment device according to claim 2, characterized in that, It also includes a first image capture device and a second image capture device; The first image capture device is disposed on the main body, near the first side of the crystal boat placement part, electrically connected to the control device, and used to capture images of the markings on the multiple wafers from the front side of the multiple wafers. The second image capture device is disposed on the main body, near a third or fourth side of the crystal boat placement portion, electrically connected to the control device, and used to capture images of the markings on the multiple wafers from the side of the multiple wafers.

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