Cleaning device

Abstract

The present invention provides a cleaning device that can reduce the situation where an end face brush for cleaning the peripheral end face of a substrate becomes a source of contamination of the substrate or an obstacle during maintenance. The cleaning device of an embodiment comprises: a chamber having a cleaning chamber for cleaning a loaded substrate; a rotation drive unit that rotates a plurality of rollers holding the periphery of the substrate within the cleaning chamber, thereby rotationally driving the substrate; a cleaning liquid spray unit that sprays cleaning liquid onto the substrate; a cleaning unit that causes a brush to contact at least one surface of the rotating substrate, thereby cleaning the surface of the substrate; a peripheral cleaning unit that causes the end face brush to contact the peripheral end face of the substrate, thereby cleaning the peripheral end face of the substrate; a receiving chamber having a receiving chamber for receiving the peripheral cleaning unit; and a moving mechanism that causes the peripheral cleaning unit to move between a cleaning position where it can clean the peripheral end face and a receiving position where it is received in the receiving chamber.

Description

Technical Field

[0001] The invention relates to a cleaning device. Background Art

[0002] During the semiconductor device manufacturing process, it is sometimes necessary to clean the surface of the semiconductor wafer, which serves as the substrate, with a high degree of cleanliness. For example, after chemical mechanical polishing (CMP) is performed to flatten the substrate surface, contaminants (hereinafter referred to as particles) such as organic matter, metal polishing debris, and slurry residue adhere to the substrate surface.

[0003] Particles can hinder smooth film formation or cause short circuits in circuit patterns, leading to product defects. Therefore, it is necessary to remove particles by cleaning the substrate with a cleaning solution. A known cleaning device for this purpose uses a rotating brush.

[0004] The cleaning device rotates the substrate and moves the rotating brush parallel to the substrate, contacting the substrate surface through the cleaning liquid. As a result, particles adhering to the substrate surface are lifted by the cleaning liquid and discharged to the outside of the substrate by the brush, thereby cleaning the entire substrate.

[0005] Furthermore, if particles adhere to the peripheral end surfaces of the substrate rather than the substrate surface, they can also affect the circuit pattern. Therefore, particles adhering not only to the substrate surface but also to the peripheral end surfaces must be removed. Patent Document 1 discloses a cleaning device that includes a brush mechanism for cleaning the peripheral end surfaces of such substrates.

[0006] [Prior art literature]

[0007] [Patent Document]

[0008] [Patent Document 1] Japanese Patent No. 5064331 Summary of the Invention

[0009] [Problems to be solved by the invention]

[0010] However, the brush mechanism for cleaning the peripheral end surface of the substrate needs to be arranged adjacent to the substrate, which causes the following problem: when cleaning the surface of the substrate, the cleaning liquid hits the brush mechanism and splashes back, causing particles to adhere to the surface of the substrate again.

[0011] Furthermore, when maintaining the cleaning device, the operator's hand may sometimes bump into the brush mechanism, damaging it. For example, within the chamber housing the cleaning device, a brush mechanism cannot be installed near the loading / unloading port where substrates are loaded and unloaded, due to concerns about interference with the substrate handling robot. Furthermore, when rollers are used to hold the outer edges of the substrates and rotate them, a brush mechanism cannot be installed where the rollers move toward or away from the substrates. Therefore, a brush mechanism must be installed near the maintenance port of the chamber. However, this becomes an obstacle when the operator inserts or removes their hand from the port.

[0012] The embodiments of the present invention are proposed to solve the above-mentioned problems, and an object thereof is to provide a cleaning device that can reduce the situation where an end surface brush for cleaning the outer peripheral end surface of a substrate becomes a source of contamination of the substrate or an obstacle during maintenance.

[0013] [Technical means to solve the problem]

[0014] In order to solve the above-mentioned problem, the cleaning device of the present invention comprises: a chamber having a cleaning chamber for cleaning a brought-in substrate; a rotation driving unit for rotating a plurality of rollers holding the periphery of the substrate in the cleaning chamber, thereby rotationally driving the substrate; a cleaning liquid spraying unit for spraying cleaning liquid onto the substrate; a cleaning unit for making a brush contact at least one of the surfaces of the rotating substrate, thereby cleaning the surface of the substrate; a peripheral cleaning unit for making an end face brush contact the peripheral end face of the substrate, thereby cleaning the peripheral end face of the substrate; a receiving chamber having a receiving chamber for receiving the peripheral cleaning unit; and a moving mechanism for moving the peripheral cleaning unit between a cleaning position at which the peripheral end face can be cleaned and a receiving position in which the unit is received in the receiving chamber.

[0015] [Effects of the Invention]

[0016] According to the embodiment of the present invention, it is possible to reduce the situation where an end surface brush for cleaning the outer peripheral end surface of a substrate becomes a contamination source of the substrate or becomes an obstacle during maintenance. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a perspective view showing a schematic structure of a cleaning device according to an embodiment.

[0018] Figure 2 It is a rear view showing the schematic structure of the cleaning device according to the embodiment.

[0019] Figure 3 (A) is a plan view showing the roller in the released position. Figure 3 (B) is a plan view showing the roller in the holding position.

[0020] Figure 4 (A) is a front view showing the roller in the released position. Figure 4(B) is a front view showing the roller in the holding position.

[0021] Figure 5 (A) is a plan view showing the cleaning section at the start position of cleaning. Figure 5 (B) is a plan view showing the cleaning portion during cleaning. Figure 5 (C) is a plan view showing the cleaning section at the end position.

[0022] Figure 6 (A) is an explanatory diagram showing the peripheral cleaning portion at the cleaning position. Figure 6 (B) is an explanatory diagram showing the peripheral cleaning portion in the process of being stored in the storage chamber. Figure 6 (C) is an explanatory diagram showing the peripheral cleaning portion in the storage position.

[0023] Figure 7 is an example of a display screen of the display unit, and Figure 7 (A) is an explanatory diagram showing the selection screen for operation mode and maintenance mode. Figure 7 (B) is an explanatory diagram showing a display screen of an operation mode. Figure 7 (C) is an explanatory diagram showing a display screen in the maintenance mode.

[0024] Figure 8 It is an explanatory diagram showing a modified example of the storage chamber.

[0025] [Explanation of Symbols]

[0026] 1: Cleaning device

[0027] 10: Chamber

[0028] 10a: Bottom

[0029] 11: Cleaning room

[0030] 12: Moving in and out

[0031] 13: Operation port

[0032] 14: Opening

[0033] 15: Shielding

[0034] 20: Rotation drive unit

[0035] 20a: Roller

[0036] 21: First holding part

[0037] 22: Second holding unit

[0038] 23: First drive unit

[0039] 24: Second drive unit

[0040] 25, 26: Driving mechanism

[0041] 27: Guide component

[0042] 28: Cylinder

[0043] 30: Cleaning Department

[0044] 31: Body part

[0045] 35: Brush

[0046] 40: Brush drive unit

[0047] 41: Arm

[0048] 42: Driving mechanism

[0049] 50: Cleaning fluid spraying part

[0050] 51: Nozzle

[0051] 60: Peripheral cleaning department

[0052] 61: End brush

[0053] 62: Head

[0054] 63: Shaking head mechanism

[0055] 64: Support

[0056] 65: Brush cleaning department

[0057] 65a: Inclined surface

[0058] 66: Cleaning fluid supply unit

[0059] 66a: Column

[0060] 66b: Arm

[0061] 66c: Liquid supply pipe

[0062] 70: Containment Chamber

[0063] 70a: bottom

[0064] 71: Containment Chamber

[0065] 72: Supply Department

[0066] 73: Discharge unit

[0067] 80: Mobile mechanism

[0068] 81: Cylinder

[0069] 81a: Drive rod

[0070] 100: Control Department

[0071] 110: Display unit

[0072] 120: Input DETAILED DESCRIPTION

[0073] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. Figure 1 As shown, this embodiment is a cleaning apparatus 1 that uses a cleaning liquid and a brush to clean a substrate W while rotating the substrate W. The substrate W to be cleaned is typically a semiconductor wafer, but may also be a substrate for a display device or the like.

[0074] The substrate W is circular, and its outer peripheral end surfaces are beveled. In other words, they are chamfered by grinding. In the following description, the upper and lower surfaces of the substrate W are referred to as the front and back surfaces. When both the front and back surfaces are indicated, these are referred to as the front and back surfaces of the substrate W. Furthermore, the outer peripheral end surfaces refer to the side surfaces of the substrate W other than the front and back surfaces.

[0075] [structure]

[0076] like Figure 1 and Figure 2 As shown, the cleaning device 1 includes a chamber 10, a rotation drive unit 20, a cleaning unit 30, a brush drive unit 40, a cleaning liquid spray unit 50, a peripheral cleaning unit 60, a storage chamber 70, a moving mechanism 80, and a control unit 100. Figure 1 and Figure 2 It is a perspective view of the interior of the chamber 10 .

[0077] (Chamber)

[0078] The chamber 10 is a container having a cleaning chamber 11 for cleaning the loaded substrates W. The chamber 10 is a rectangular parallelepiped housing, and the space inside it serves as the cleaning chamber 11. The bottom of the chamber 10 is indicated by 10a. A loading / unloading port 12 is provided on one of the two facing side surfaces of the chamber 10, through which a transfer robot loads and unloads substrates W.

[0079] A work opening 13 for maintenance work is provided on the side of the chamber 10 opposite the side having the loading / unloading port 12. The loading / unloading port 12 and the work opening 13 are configured to be openable and closable by doors (not shown). Each door is opened and closed by an opening / closing mechanism (not shown).

[0080] An opening 14 is provided on the side of the working port 13 of the bottom 10a of the chamber 10. Figure 2As shown, a shielding portion 15 is provided. The shielding portion 15 is a shutter comprising a pair of plate-like bodies, which are moved in horizontal and opposite directions by an opening and closing mechanism (not shown), thereby opening and closing the opening 14 (see Figure 6 ).

[0081] (Rotation drive unit)

[0082] like Figure 3 As shown in FIG. 1 , the rotation drive unit 20 rotates a plurality of rollers 20 a holding the outer periphery of the substrate W, thereby rotationally driving the substrate W. Figure 1 and Figure 2 As shown, the rotation drive unit 20 includes a first holding unit 21, a second holding unit 22, a first drive unit 23, and a second drive unit 24. The first holding unit 21 and the second holding unit 22 are disposed at positions facing each other with the substrate W interposed therebetween.

[0083] The first holding portion 21 and the second holding portion 22 each include a pair of rollers 20a. The rollers 20a are rotatable about an axis perpendicular to the substrate W. Each roller 20a has a large-diameter cylindrical portion and a small-diameter cylindrical portion coaxially disposed with the large-diameter portion. The rollers 20a hold the substrate W by contacting the side surfaces of the small-diameter portions against the outer circumference of the substrate W. The rollers 20a are formed from a material resistant to cleaning fluids, such as polyetheretherketone (PEEK).

[0084] like Figure 2 and Figure 3 As shown, the first drive unit 23 and the second drive unit 24 respectively support the first holding unit 21 and the second holding unit 22, so that the roller 20a rotates around its axis. The first drive unit 23 and the second drive unit 24 house a rotating mechanism (not shown) that drives the roller 20a.

[0085] The rotation mechanism is, for example, a belt drive mechanism. Specifically, a belt is provided between the drive shaft of a motor serving as a drive source and the pulley of the drive shaft of one roller 20a, or between the pulleys of the drive shafts of the pair of rollers 20a, to transmit the driving force. This arrangement allows the pair of rollers 20a to be rotated by the drive source. The rotation mechanism is not limited to this; for example, a motor provided to each roller 20a may be used to rotate each roller 20a.

[0086] Furthermore, the first driving unit 23 and the second driving unit 24 are configured to move the roller 20a in a direction close to or away from the substrate W. Figure 2As shown, a driving mechanism 25 and a driving mechanism 26 are provided at the lower ends of the first driving portion 23 and the second driving portion 24, respectively. The driving mechanism 25 and the driving mechanism 26 enable the first driving portion 23 and the second driving portion 24 to move in a direction approaching or moving away from the substrate W. As a result, the first holding portion 21 and the second holding portion 22 also move in a direction approaching or moving away from the substrate W.

[0087] The drive mechanisms 25 and 26 each include a guide member 27 and an air cylinder 28. The guide member 27 is located below the bottom 10a of the chamber 10 and supports the first drive unit 23 and the second drive unit 24 so that they can slide horizontally. The drive rods of the air cylinders 28 are connected to the first and second drive units 23, 24, respectively, causing them to move in opposite directions.

[0088] By using the driving mechanism 25 and the driving mechanism 26 to move the first holding portion 21 and the second holding portion 22 in the direction away from each other, Figure 3 (A) Figure 4 As shown in (A), the roller 20a becomes the release position away from the substrate W. By using the driving mechanism 25 and the driving mechanism 26 to move the first holding portion 21 and the second holding portion 22 toward each other, as shown in FIG. Figure 3 (B) Figure 4 As shown in FIG. 2 (B), the roller 20a is in a holding position where it contacts and holds the substrate W.

[0089] (Cleaning Department)

[0090] like Figure 4 and Figure 5 As shown, the cleaning unit 30 cleans the surface of the rotating substrate W by contacting a rotating brush 35 with the surface. The term "contact" herein includes both direct contact by the brush 35 and contact via a cleaning liquid. The brush 35 is a cylindrical member formed of a flexible and elastic material.

[0091] The brush 35 of this embodiment is made of a sponge-like resin such as polyvinyl alcohol (PVA) (a nylon-based resin) or polytetrafluoroethylene (PTFE) (a fluorine-based resin). Alternatively, a brush made of the same resin may be used. Specifically, the brush 35 of this embodiment includes both a sponge-like block and a collection of multiple bristles. Furthermore, a brush 35 that is a sponge-like block also includes a block formed by collecting multiple fibers. Furthermore, the number of brushes 35 may be single or multiple.

[0092] like Figure 2 and Figure 4As shown, the brush 35 is detachably mounted on a support body via a brush holder, and the support body is mounted on the cylindrical main body 31. The main body 31 has a built-in motor (not shown) as a driving source for rotating the brush 35.

[0093] (Brush drive unit)

[0094] like Figure 5 As shown in FIG. 1 , the brush driving unit 40 moves the cleaning unit 30 in a direction parallel to the surface of the substrate W. Figure 1 and Figure 2 As shown, the brush driving unit 40 includes an arm 41 and a driving mechanism 42. The arm 41 is a member parallel to the direction of the substrate W, and the cleaning unit 30 is mounted on one end. The driving mechanism 42 includes a swing mechanism and a lifting mechanism.

[0095] Shaking mechanism such as Figure 5 (A)~ Figure 5 As shown in (C), the arm 41 is moved back and forth parallel to the substrate W from the outer periphery of the substrate W to the outer periphery on the opposite side of the cleaning section 30 along a circular arc trajectory with the end portion on the opposite side as the axis. In addition, the rocking mechanism causes the arm 41 to move back and forth from the standby position to the outer periphery of the substrate W. The rocking mechanism includes a support shaft extending from the arm 41 in a direction perpendicular to the surface of the substrate W, and a motor (not shown) serving as a driving source for rocking the support shaft. When the substrate W is not being cleaned, the arm 41 is positioned in a standby position (not shown) outside the substrate W.

[0096] like Figure 4 (A) Figure 4 As shown in FIG. 5 (B), the lifting mechanism moves the arm 41 in a direction in which the cleaning unit 30 approaches or moves away from the substrate W. As the lifting mechanism, a ball screw mechanism, an air cylinder, or the like that lifts and lowers the support shaft of the arm 41 can be used.

[0097] (Cleaning fluid spraying part)

[0098] The cleaning liquid ejection unit 50 ejects cleaning liquid onto the substrate W. The cleaning liquid ejection unit 50 ejects cleaning liquid from a nozzle 51 onto both surfaces of the rotating substrate W. The cleaning liquid in this embodiment is ozone water, pure water, or SC-1 (a cleaning liquid mixed with ammonia water and hydrogen peroxide water). The cleaning liquid ejection unit 50 is connected to a cleaning liquid supply mechanism (not shown) via piping. The supply mechanism includes a liquid delivery device and a valve connected to a pure water production device (pure water storage tank), an ozone water production device (ozone water storage tank), and an SC-1 supply device, and can switch between supplying pure water, ozone water, and SC-1.

[0099] like Figure 2 and Figure 4As shown in FIG. 1 , the cleaning unit 30, brush driving unit 40, and cleaning liquid ejecting unit 50 described above are arranged in pairs above and below the substrate W so as to be able to clean both the front and back surfaces of the substrate W. Specifically, the pair of arms 41 of the brush driving unit 40 are arranged above and below the substrate W so that the brushes 35 of the pair of cleaning units 30 are directed toward the substrate W. The driving mechanism 42 causes the pair of arms 41 to contact the substrate W in a manner such that the brushes 35 of the pair of cleaning units 30 contact the substrate W. Figure 4 (B)), and the position away from the substrate W ( Figure 4 Move between (A)).

[0100] Furthermore, the driving mechanism 42 swings the pair of arms 41, thereby Figure 5 (A)~ Figure 5 As shown in (C), the pair of brushes 35 at the contact position are moved along the arc trajectory. Figure 5 As shown in (A), it is the starting point of the brush 35 shaking, and the distance from the position is as shown in Figure 5 (C) shows the end point of the oscillation of the brush 35. The contact position is located on the outer periphery of the substrate W, and the separation position is located on the outer periphery of the substrate W opposite to the contact position.

[0101] (Peripheral cleaning part)

[0102] The peripheral cleaning unit 60 cleans the peripheral end surface of the substrate W by bringing the end surface brush 61 into contact with the peripheral end surface. Figure 1 、 Figure 2 and Figure 6 As shown, the outer periphery cleaning unit 60 includes an end surface brush 61 , a head 62 , an oscillating mechanism 63 , a support portion 64 , a brush cleaning portion 65 , and a cleaning liquid supply portion 66 .

[0103] The end face brush 61 is a cylindrical brush. The end face brush 61 uses a hard resin such as PTFE (fluorine-based resin) or PVA (nylon-based resin). The end face brush 61 cleans the beveled peripheral end face of the substrate W, and is therefore also called a bevel brush. The peripheral surface of the end face brush 61 is parallel to the peripheral end face of the substrate W. However, the axis of the end face brush 61 is tilted in a twisted position relative to the rotation axis of the substrate W (the rotation axis of the roller 20a). The reason is that it is easy for contaminants to fall downward together with the cleaning liquid. The head 62 rotatably supports the end face brush 61. The head 62 is tilted and is provided with a motor (not shown), the main shaft of which is connected to the axis of the end face brush 61.

[0104] The oscillating mechanism 63 can rotate the head 62 supporting the end surface brush 61 in the direction toward or away from the outer peripheral end surface of the substrate W. Although not shown, the oscillating mechanism 63 includes a vertical support connected to the head 62 and a rotary actuator for rotating the support.

[0105] The support portion 64 supports the lower end of the oscillating mechanism 63. The support portion 64 is a plate-shaped member that can close the opening 14 provided in the bottom 10a of the chamber 10. When the support portion 64 closes the opening 14, the shielding portion 15 of the opening 14 is open.

[0106] The brush cleaning portion 65 cleans the end surface brush 61 by contacting the end surface brush 61. Specifically, the end surface brush 61 is cleaned by contacting the inclined surface of the brush cleaning portion 65 with the cleaning surface of the end surface brush 61 (the surface in contact with the outer peripheral end surface of the substrate W). The brush cleaning portion 65 is vertically disposed adjacent to the oscillating mechanism 63 and has an inclined surface 65a at its upper end that is parallel to the axis of the end surface brush 61. The end surface brush 61 is configured to move between a peripheral cleaning position in contact with the outer peripheral end surface of the substrate W and a self-cleaning position in contact with the inclined surface 65a of the brush cleaning portion 65, as the head portion 62 rotates through the oscillating mechanism 63.

[0107] The cleaning liquid supply unit 66 includes a column 66a, an arm 66b, and a liquid supply pipe 66c. The column 66a is vertically disposed on the bottom 10a of the chamber 10. The arm 66b extends horizontally from the upper end of the column 66a. The liquid supply pipe 66c is supported so that its top end faces downward from the top of the arm 66b, and its other end is connected to a cleaning liquid supply mechanism. The supply mechanism can use the same supply mechanism as the cleaning liquid ejection unit 50. Furthermore, a portion of the supply mechanism, such as the cleaning liquid supply source, can be shared with the cleaning liquid ejection unit 50.

[0108] In addition, the column portion 66a is configured so that the top end of the arm 66b, that is, the top end of the liquid supply tube 66c can be moved between a contact position between the end face brush 61 and the outer peripheral end face of the substrate W and a retreat position away from the end face brush 61 and the substrate W, and can be rotated by a rotating mechanism such as a rotary actuator.

[0109] (Containment Chamber)

[0110] like Figure 1 、 Figure 2 and Figure 6 As shown, the storage chamber 70 is a container having a storage chamber 71 for accommodating the peripheral cleaning unit 60. The storage chamber 70 is connected to the lower portion of the opening 14, and the peripheral cleaning unit 60, including the support portion 64, is lowered and accommodated in the storage chamber 71. Specifically, the storage chamber 70 is located below the bottom 10a of the chamber 10. As a result, the storage chamber 71 is positioned away from the cleaning chamber 11.

[0111] The storage chamber 71 is provided with a supply unit 72 and a discharge unit 73. The supply unit 72 supplies cleaning liquid for cleaning the end surface brush 61. Therefore, when the peripheral cleaning unit 60 is stored in the storage chamber 71, the supply unit 72 is located in a position where it can supply cleaning liquid to the end surface brush 61 in the brush cleaning position.

[0112] The supply unit 72 is connected to a cleaning liquid supply mechanism. The supply mechanism can be the same as that of the cleaning liquid ejection unit 50. Furthermore, a portion of the supply mechanism, such as the cleaning liquid supply source, can be shared with the cleaning liquid ejection unit 50. The supply unit 72 in this embodiment is a nozzle that ejects cleaning liquid toward the end face brush 61. The discharge unit 73 discharges cleaning liquid from the storage chamber 71. The discharge unit 73 is connected to a cleaning liquid recovery mechanism via piping.

[0113] (Mobile mechanism)

[0114] like Figure 1 、 Figure 2 and Figure 6 As shown, the moving mechanism 80 moves the peripheral cleaning unit 60 between a cleaning position where the peripheral end surface of the substrate W can be cleaned and a storage position where the substrate W is stored in the storage chamber 71. The moving mechanism 80 includes, for example, a cylinder 81 connected to the bottom 70a of the storage chamber 70. A vertical drive rod 81a of the cylinder 81 extends upward within the storage chamber 71 and is connected to the support portion 64. The moving mechanism 80 is not limited to the cylinder 81. For example, the moving mechanism 80 may be configured to move the peripheral cleaning unit 60 using a ball screw mechanism.

[0115] (Control Department)

[0116] like Figure 2 As shown, the control unit 100 is a computer that controls each unit of the cleaning apparatus 1 and includes a storage unit that stores various information and programs related to substrate cleaning, and a processor that executes various programs.

[0117] The control unit 100 controls each mechanism by outputting action instructions to the drive circuit that drives the following mechanisms, namely, the opening and closing mechanism of the door of the loading and unloading port 12 and the working port 13 of the chamber 10, the opening and closing mechanism of the shielding portion 15, the rotation mechanism of the roller 20a of the rotation drive portion 20, the drive mechanism 25, the drive mechanism 26, the drive mechanism 42 of the brush drive portion 40, the supply mechanism of the cleaning liquid spraying portion 50, the shaking mechanism 63 of the peripheral cleaning portion 60, the supply mechanism and the rotation mechanism of the cleaning liquid supply portion 66, the supply mechanism of the supply portion 72, the moving mechanism 80, etc.

[0118] The control unit 100 is connected to a display unit 110 and an input unit 120. The display unit 110 is an output device such as a display, a light, or a meter that displays information for confirming the status of the cleaning device 1 to the operator. The input unit 120 is an input device such as a switch, a touch screen, a keyboard, or a mouse that allows the operator to operate the cleaning device 1 or input settings via the control unit 100.

[0119] The display unit 110 displays the status of the cleaning device 1. The input unit 120 allows input of instructions for setting the peripheral cleaning unit 60 to the cleaning position or the storage position. For example, the display unit 110, which includes the input unit 120 in the form of a touch screen, displays buttons for prompting information input, and the desired instructions can be input by selecting the buttons.

[0120] More specifically, the control unit 100 is set with an operation mode for cleaning the substrate W and a maintenance mode for maintaining the cleaning device 1. Figure 7 As shown in (A) of FIG. 1 , a button for selecting a mode is displayed on the display unit 110 .

[0121] When the operation mode is selected, Figure 7 As shown in (B), a cleaning start button and a storage button are displayed on the display unit 110. When the cleaning start button is selected, cleaning of the front and back surfaces of the substrate W and cleaning of the outer peripheral end surface of the substrate W are performed.

[0122] To clean the front and back surfaces of the substrate W but not the outer peripheral end surfaces of the substrate W, the storage button is selected. The control unit 100 then outputs an instruction to set the outer peripheral cleaning unit 60 to the storage position, and the outer peripheral cleaning unit 60 is stored in the storage chamber 70. Subsequently, if the cleaning start button is selected, the front and back surfaces of the substrate W are cleaned but the outer peripheral end surfaces of the substrate W are not cleaned.

[0123] Furthermore, if you select maintenance mode, Figure 7 As shown in (C), a maintenance start button and an ascending button are displayed on the display unit 110. When the maintenance start button is selected, the door of the work opening 13 is opened.

[0124] When the periphery cleaning unit 60 is to be maintained for the substrate W, the up button is selected. Then, the periphery cleaning unit 60 is raised from the storage chamber 70 to the cleaning position. Then, when the maintenance start button is selected, the door of the work port 13 is opened.

[0125] Furthermore, instead of using button operations, the control unit 100 may be set to automatically and continuously clean the substrate W. In this case, the processing sequence may be pre-programmed (recipe setting) so that the end surface of the substrate W can be cleaned or not during cleaning.

[0126] [action]

[0127] The operation of the cleaning device 1 having the above-described structure will now be described. Initially, the control unit 100 is in operation mode, and the peripheral cleaning unit 60 is in the raised cleaning position. At this point, the opening 14 of the chamber 10 is closed by the support portion 64 forming the lower end of the peripheral cleaning unit 60.

[0128] (Mounting of substrates)

[0129] First, the loading operation of the substrate W will be described. Specifically, in the previous step, ozone water is applied to the surface of the processed substrate W to form an oxide film, thereby hydrophilizing the substrate W. The surface of the substrate W with the oxide film formed thereon is still contaminated with organic contaminants (such as slurry) and metallic contaminants remaining from the previous step, namely the CMP step.

[0130] This means that the ozone water is supplied while the contaminants remain attached to the surface of the substrate W. In other words, the contaminants remain attached, forming an oxide film. Although ozone water has the ability to remove organic matter, the preceding step is not a step for removing organic matter, but is only a step for hydrophilizing the front and back surfaces of the substrate W.

[0131] The transport robot carries out the substrate W from the previous process, such as Figure 3 (A) Figure 4 As shown in (A), it is carried from the loading and unloading port 12 of the cleaning device 1 to between the rollers 20a of the first holding portion 21 and the second holding portion 22. Figure 3 As shown in FIG. 5 (B), the first holding portion 21 and the second holding portion 22 move toward each other. Then, the four rollers 20a move toward the substrate W and contact the outer periphery of the substrate W, thereby holding the substrate W.

[0132] At this time, the upper and lower arms 41 are in a standby position outside the substrate W. The outer periphery cleaning unit 60 is in the cleaning position, but the end surface brush 61 is positioned away from and adjacent to the outer periphery of the substrate W in the chamber 10 .

[0133] (Cleaning of substrate surface)

[0134] Next, the cleaning operation of the substrate W will be described. First, the following operation will be described: when cleaning the front and back surfaces of the substrate W, the outer peripheral end surface of the substrate W will be cleaned. If the operation mode displayed on the display unit 110 is selected and the cleaning start button (see Figure 7 (A) Figure 7 (B)), then Figure 3 As shown in FIG. 1 , the roller 20 a rotates clockwise in the figure, thereby rotating the substrate W counterclockwise.

[0135] The upper and lower arms 41 in the standby position rotate the brush 35 by the motor while Figure 5 As shown in (A), the brushes 35 of the upper and lower cleaning parts 30 are moved to the outer periphery of the substrate W and stopped temporarily. Figure 4 As shown in (B), the front and back surfaces of the substrate W are contacted, thereby clamping the substrate W.

[0136] Next, the upper and lower arms 41 rotate, thereby the upper and lower brushes 35 move horizontally. At this time, the nozzle 51 ejects the cleaning liquid, so that the cleaning liquid flows between the brush 35 and the substrate W. Figure 5 (A) Figure 5 As shown in FIG. 1B , the brush 35 , which starts moving from one side of the outer periphery of the substrate W, gradually pushes the contaminants and the cleaning liquid toward the outer periphery of the substrate W while moving along the arc trajectory shown by the white arrow in the figure.

[0137] like Figure 5 As shown in (C), when the brush 35 passes over the other side of the outer periphery of the substrate W and leaves the substrate W, the brush 35 stops rotating, and the discharge of the cleaning liquid from the nozzle 51 stops, thereby completing the cleaning process.

[0138] Then, the upper and lower arms 41 move away from each other, thereby moving the upper and lower brushes 35 away from each other, and the arms 41 swing and retreat to a standby position outside the periphery of the substrate W. In addition, by repeating the above-mentioned operation, cleaning with the brushes 35 is performed multiple times. At this time, each time cleaning is performed, the arms 41 returns to the starting position of cleaning (see Figure 5 (A)).

[0139] In addition, when cleaning the front and back surfaces of the substrate W as described above, the outer peripheral end surface of the substrate W is cleaned as follows. Figure 5 (A) Figure 5 As shown in (B), while the substrate W is rotated counterclockwise by the rotation of the roller 20a and its front and back surfaces are cleaned by the brush 35, the end face brush 61 is rotated by the motor and moved to the peripheral cleaning position in contact with the peripheral end face of the substrate W by the shaking mechanism 63.

[0140] At the same time, the column 66a of the cleaning liquid supply unit 66 rotates, and the end of the liquid supply tube 66c at the top of the arm 66b moves above the end surface brush 61 to supply cleaning liquid.

[0141] When the brush 35 finishes cleaning the front and back surfaces of the substrate W, Figure 5 As shown in (C), the end surface brush 61 is moved to a position away from the outer peripheral end surface of the substrate W by the oscillating mechanism 63, and the supply of the cleaning liquid by the cleaning liquid supply unit 66 is stopped.

[0142] In addition, when the outer peripheral end surface of the substrate W is not to be cleaned, the operator selects the storage button displayed on the display unit 110 before selecting the cleaning start button. Figure 6 (A) Figure 6As shown in (B), the moving mechanism 80 works, thereby the peripheral cleaning portion 60 descends and passes through the opening 14, as shown in FIG. Figure 6 As shown in FIG. 1 (C), the housing 14 is housed in the housing chamber 70. In addition, the opening 14 is closed by the shielding portion 15.

[0143] Then, when the operator selects the cleaning start button, the brush 35 cleans the front and back surfaces of the substrate W as described above. At this time, the peripheral cleaning unit 60 is housed in the housing chamber 70, and the opening 14 is closed by the shielding portion 15, so that the cleaning liquid does not hit the peripheral cleaning unit 60.

[0144] (maintain)

[0145] When the operator is performing maintenance on the cleaning device 1, he selects the maintenance mode button displayed on the display unit 110. Then, as described above, the moving mechanism 80 is operated, whereby the peripheral cleaning portion 60 is accommodated in the accommodation chamber 70, and the opening 14 is closed by the shielding portion 15 (see Figure 6 ).

[0146] Next, if the operator presses the maintenance start button, the door of the work port 13 is opened by the opening and closing mechanism. Thus, the operator can perform maintenance inside the chamber 10 through the work port 13. At this time, the peripheral cleaning unit 60 is housed in the housing chamber 70, so the operator's maintenance is not hindered.

[0147] Furthermore, when the operator needs to perform maintenance on the peripheral cleaning unit 60, they select the raise button. The opening and closing mechanism then opens the shielding portion 15, and the moving mechanism 80 raises the peripheral cleaning unit 60 to a cleaning position above the bottom 10a of the chamber 10. This allows the operator to perform maintenance such as replacing the end face brush 61.

[0148] (Cleaning of end face brush)

[0149] Next, the following operation will be described: cleaning the end surface brush 61 of the peripheral cleaning unit 60 housed in the housing chamber 70. While housed in the housing chamber 70, the end surface brush 61 is positioned in a self-cleaning position where it contacts the inclined surface 65a of the brush cleaning unit 65 by the oscillating mechanism 63, and the nozzle of the supply unit 72 is positioned to supply cleaning liquid to the end surface brush 61.

[0150] When the cleaning liquid is supplied from the supply unit 72 while the end surface brush 61 is rotated in this state, the side surfaces of the end surface brush 61 are rubbed and cleaned by the brush cleaning unit 65. The cleaning liquid that has fallen to the bottom of the storage chamber 70 is discharged from the discharge unit 73.

[0151] (Effect)

[0152] (1) The cleaning device 1 of the present embodiment as described above comprises: a chamber 10 having a cleaning chamber 11 for cleaning a brought-in substrate W; a rotation drive unit 20 for rotating a plurality of rollers 20a holding the periphery of the substrate W in the cleaning chamber 11, thereby rotationally driving the substrate W; a cleaning liquid spraying unit 50 for spraying cleaning liquid onto the substrate W; a cleaning unit 30 for cleaning the surface of the substrate W by bringing the brush 35 into contact with at least one of the surfaces of the rotating substrate W; a peripheral cleaning unit 60 for cleaning the peripheral end surface of the substrate W by bringing the end surface brush 61 into contact with the peripheral end surface of the substrate W; a receiving chamber 70 having a receiving chamber 71 for receiving the peripheral cleaning unit 60; and a moving mechanism 80 for moving the peripheral cleaning unit 60 between a cleaning position for cleaning the peripheral end surface and a receiving position in the receiving chamber 71.

[0153] Therefore, during maintenance, the peripheral cleaning unit 60 is housed in the housing chamber 70 to prevent the peripheral cleaning unit 60 from contacting the operator's hand and damaging the end surface brush 61. Furthermore, when the peripheral end surface of the substrate W is not being cleaned, housing the peripheral cleaning unit 60 in the housing chamber 70 reduces the possibility of the cleaning liquid splashing back from the peripheral cleaning unit 60 and adhering to the surface of the substrate W when cleaning the front and back surfaces of the substrate W.

[0154] (2) The accommodation chamber 70 is provided below the bottom 10a of the chamber 10. Therefore, the peripheral cleaning portion 60 is accommodated further downward than the substrate W being cleaned, thereby further reducing the possibility of adhesion of the cleaning liquid.

[0155] (3) This embodiment includes the shielding portion 15 that shields the storage chamber 71 from the cleaning chamber 11. Therefore, it is possible to reliably prevent the cleaning liquid from adhering to the outer peripheral cleaning portion 60 stored in the storage chamber 71.

[0156] (4) The chamber 10 has a loading / unloading port 12 for loading and unloading substrates W and a work port 13 for maintenance, and the peripheral cleaning unit 60 is located on the side of the work port 13. Therefore, even if the peripheral cleaning unit 60 cannot be arranged on the side of the loading / unloading port 12 for substrates W and must be located on the side of the work port 13, the peripheral cleaning unit 60 can be stored in the storage chamber 71 of the storage chamber 70 during maintenance, thereby reliably preventing it from becoming an obstacle for operators.

[0157] (5) The peripheral cleaning section 60 includes a brush cleaning section 65 that cleans the end surface brush 61 by contacting the end surface brush 61. A supply section 72 for supplying a cleaning liquid for cleaning the end surface brush 61 and a discharge section 73 for discharging the cleaning liquid are provided in the storage chamber 71. Therefore, the end surface brush 61 of the peripheral cleaning section 60 stored in the storage chamber 71 can be cleaned by the brush cleaning section 65 and the cleaning liquid.

[0158] (6) The supply portion 72 includes a nozzle for spraying the cleaning liquid toward the end surface brush 61. Therefore, the end surface brush 61 can be cleaned by spraying the cleaning liquid while the rotating end surface brush 61 hits the brush cleaning portion 65.

[0159] (7) The cleaning device 1 includes: a control unit 100 for controlling the moving mechanism 80; a display unit 110 for displaying the status of the cleaning device 1; and an input unit 120 for inputting an instruction to set the peripheral cleaning unit 60 to the cleaning position or the storage position.

[0160] Therefore, the operator can check the status of the cleaning apparatus 1 through the display unit 110. When the peripheral cleaning unit 60 is in the cleaning position, the operator can use the input unit 120 to set the peripheral cleaning unit 60 to the storage position, thereby preventing the cleaning liquid from hitting the peripheral cleaning unit 60 when cleaning the front and back surfaces of the substrate W. Furthermore, when the peripheral cleaning unit 60 is in the storage position, the operator can use the input unit 120 to set the peripheral cleaning unit 60 to the cleaning position, thereby allowing maintenance of the peripheral cleaning unit 60.

[0161] (Variation)

[0162] This embodiment is not limited to the above-described form, and the following modified examples may be configured.

[0163] (1) Figure 8 As shown, the storage chamber 71 can also be configured to immerse the end surface brush 61 in the cleaning liquid. Specifically, the storage chamber 71 is designed to be waterproof so that the cleaning liquid supplied from the supply unit 72 can accumulate at a higher position than the end surface brush 61. In this state, the end surface brush 61 is rotated while contacting the brush cleaning unit 65, thereby cleaning the end surface brush 61. The cleaning liquid supply from the supply unit 72 and the discharge from the discharge unit 73 can be adjusted to maintain a clean cleaning liquid at all times.

[0164] (2) The shielding portion 15 may be a structure in which a single shutter moves in one direction to open and close, rather than a pair of shutters. Furthermore, by providing a curved labyrinth-like structure at the boundary between the opening 14 and the shielding portion 15, the ingress of cleaning liquid into the receiving chamber 71 can be further reduced. Furthermore, the shielding portion 15 may not be provided at the opening 14. In this case, as long as the cleaning liquid is contained within the receiving chamber 71, adhesion of the cleaning liquid to the peripheral cleaning portion 60 can be reduced.

[0165] (3) The number of rollers 20a is not limited to the above-described configuration. The configuration of the cleaning unit 30 is also not limited to the above-described configuration. For example, a configuration in which only one surface of the substrate W is cleaned by the brush 35 may be employed.

[0166] [Other embodiments]

[0167] While the embodiments and variations of the various components of the present invention have been described above, these embodiments and variations are provided as examples and are not intended to limit the scope of the invention. The novel embodiments described above can be implemented in various other ways, and various omissions, substitutions, and modifications may be made without departing from the spirit of the invention. These embodiments and their variations are included within the scope and spirit of the invention and are encompassed by the invention as set forth in the claims.

Claims

1. A cleaning device, characterized in that: include: The chamber has a cleaning chamber for cleaning the loaded substrate; a rotation driving unit that rotates a plurality of rollers holding the outer periphery of the substrate in the cleaning chamber, thereby rotationally driving the substrate; a cleaning liquid spraying unit for spraying cleaning liquid onto the substrate; a cleaning unit that cleans the surface of the substrate by bringing a brush into contact with at least one surface of the rotating substrate; a peripheral cleaning portion that causes an end surface brush to contact an outer peripheral end surface of the substrate, thereby cleaning the outer peripheral end surface of the substrate; a receiving chamber having a receiving chamber for receiving the peripheral cleaning portion; a moving mechanism for moving the peripheral cleaning portion between a cleaning position capable of cleaning the peripheral end surface and a storage position for being stored in the storage chamber; as well as The shielding portion shields the storage chamber from the cleaning chamber.

2. The cleaning device according to claim 1, characterized in that The receiving chamber is arranged below the bottom of the chamber.

3. The cleaning device according to claim 1 or 2, characterized in that: The chamber has a loading and unloading port for loading and unloading substrates, and a work port for maintenance. The peripheral cleaning portion is provided on the side of the working port.

4. The cleaning device according to claim 1 or 2, characterized in that: The outer periphery cleaning portion includes a brush cleaning portion that cleans the end surface brush by contacting the end surface brush. The containment room is equipped with: a supplying portion for supplying a cleaning liquid for cleaning the end face brush; and The discharge part discharges the cleaning liquid.

5. The cleaning device according to claim 4, characterized in that The supply unit includes a nozzle configured to spray the cleaning liquid toward the end surface brush.

6. The cleaning device according to claim 4, characterized in that: The storage chamber is provided so as to be able to immerse the end surface brush in the cleaning liquid.

7. The cleaning device according to claim 1 or 2, characterized in that: include: a control unit, configured to control the moving mechanism; a display unit that displays information indicating a status of the cleaning device; as well as The input unit inputs an instruction as to whether to set the peripheral cleaning unit to the storage position or the cleaning position.

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