Chip radiators and electronic equipment

Abstract

The present invention belongs to the field of semiconductor heat dissipation technology, and in particular relates to a chip radiator for being attached to a chip of an electronic device. The chip radiator includes a base, on which a plurality of heat sinks are arranged; there are two bases, one of the two bases is connected to a power supply, and the other is connected to a ground wire, and the two bases are arranged at intervals, and the heat sink of one base is arranged relative to the heat sink of the other base to form a capacitor structure. According to the chip radiator of the present invention, the heat sinks on the two bases are arranged corresponding to each other, and one of the two bases is connected to a power supply, and the other base is grounded. The gap between the heat sinks of the radiator is used to create a capacitor structure, which can achieve the purpose of signal filtering by the radiator. The filtering effect of the present invention can be improved by 5-15%.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor heat dissipation, and in particular relates to a chip heat sink and electronic equipment. Background Art

[0002] With the continuous advancement and widespread application of large-scale integrated circuit technology, the information industry has developed rapidly. Electronic equipment is widely used in various industries. To adapt to the ever-increasing data processing volume and the increasing real-time requirements, the operating speed of electronic equipment must continue to increase. Electronic equipment generally refers to all devices that use chips, including computers, servers, switches, and storage. As we all know, chips are the core components of electronic equipment systems, and their performance directly determines the performance of the entire device. Therefore, high-frequency chips are continuously being introduced. However, due to the high frequency and high speed of chip operation, chips generate a large amount of heat per unit time. If this heat is not removed in a timely manner, the chip temperature will rise, significantly affecting the safety and performance of the system. Currently, heat dissipation has become a must-solve issue with the release of new generation chips.

[0003] Traditional heat dissipation methods use metal heat sinks on the chip, leveraging the metal's excellent thermal conductivity. For example, conventional fin-shaped chip heat sinks in the prior art have numerous metal structures, with gaps between each metal sheet providing airflow. These metal structures and the gaps between them simply serve to dissipate heat.

[0004] Traditional capacitors function as filters. Capacitors and heat sinks are separate components added to semiconductor chips at the package level. Capacitors stabilize the voltage level provided, thereby attenuating or filtering any noise spikes. Heat sinks dissipate heat generated by the chip and provide a large surface area. Existing techniques use separate filter capacitors to filter the chip, but the filtering effect is limited by the distance between the filter capacitor and the chip or the structure of the filter capacitor itself, resulting in limited improvement. Summary of the Invention

[0005] The purpose of the present invention is to at least solve the problem of a single function of a chip heat sink. This purpose is achieved through the following technical solutions:

[0006] A first aspect of the present invention provides a chip heat sink for attaching to a chip of an electronic device, comprising a base on which a plurality of heat sinks are provided;

[0007] There are two bases, one of the two bases is connected to the power supply, and the other is connected to the ground wire. The two bases are arranged at intervals, and the heat sink of one base is arranged opposite to the heat sink of the other base to form a capacitor structure.

[0008] According to the chip heat sink of the present invention, the heat sinks on the two bases are arranged corresponding to each other, and one of the two bases is connected to the power supply and the other base is connected to the ground wire. The gap between the heat sinks of the heat sink is used to create a capacitor structure, which can achieve the purpose of signal filtering by the heat sink. The filtering effect of the present invention can be improved by 5-15%.

[0009] In addition, the chip heat sink according to the present invention may also have the following additional technical features:

[0010] In some embodiments of the present invention, the base is a comb-tooth structure.

[0011] In some embodiments of the present invention, the comb-shaped structure of the base connected to the power supply and the comb-shaped structure of the base connected to the ground wire are arranged alternately.

[0012] In some embodiments of the present invention, along a direction perpendicular to the chip, a size of the base is within the interval of [5 mm, 30 mm].

[0013] In some embodiments of the present invention, the spacing distance between the two bases is within the interval of [50 μm, 5 mm].

[0014] In some embodiments of the present invention, along a direction perpendicular to the chip, a size of the heat sink is within the range of [2 cm, 8 cm].

[0015] In some embodiments of the present invention, each base is provided with at least two screw holes, and the screw holes are used to fix the base and connect electric wires or ground wires.

[0016] In some embodiments of the present invention, the base and the heat sink are an integrated structure;

[0017] And / or the outer side of the base is covered with an insulating layer.

[0018] In some embodiments of the present invention, along a direction perpendicular to the chip, a size of the heat sink connected to the ground line is larger than a size of the heat sink connected to the power supply.

[0019] A second aspect of the present invention provides an electronic device, comprising:

[0020] chip;

[0021] The chip heat sink is attached to the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Various other advantages and benefits will become apparent to those skilled in the art upon reading the detailed description of the preferred embodiment below. The accompanying drawings are for illustration purposes only and are not to be considered as limiting the present invention. The same reference numerals are used throughout the accompanying drawings to denote the same components. In the accompanying drawings:

[0023] Figure 1 Schematically shows a schematic structural diagram of a chip heat sink according to an embodiment of the present invention;

[0024] Figure 2 Schematically shows a schematic structural diagram of a chip heat sink according to an embodiment of the present invention from a first perspective;

[0025] Figure 3 The structure diagram of the chip heat sink according to the embodiment of the present invention is schematically shown from a second viewing angle.

[0026] The reference numerals are as follows:

[0027] 10 is a base, 11 is a power supply base, 12 is a grounding base, 13 is a heat sink, 131 is a power supply heat sink, 132 is a grounding heat sink, 14 is a screw hole, 141 is a power supply hole, and 142 is a grounding hole. DETAILED DESCRIPTION

[0028] Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments described herein. Rather, these embodiments are provided to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0029] It should be understood that the terms used herein are for the purpose of describing specific example embodiments only and are not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms "one", "an" and "said" as used herein may also be meant to include plural forms. The terms "comprise", "include", "contain" and "have" are inclusive and therefore specify the presence of stated features, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, steps, operations, elements, parts, and / or combinations thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring them to be performed in the specific order described or illustrated, unless the order of execution is clearly indicated. It should also be understood that additional or alternative steps may be used.

[0030] Although the terms first, second, third, etc. can be used in the text to describe multiple elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms can only be used to distinguish an element, component, region, layer or section from another region, layer or section. Unless the context clearly indicates otherwise, terms such as "first", "second" and other numerical terms do not imply order or sequence when used in the text. Therefore, the first element, component, region, layer or section discussed below can be referred to as the second element, component, region, layer or section without departing from the teaching of the example embodiments.

[0031] For ease of description, spatially relative terms may be used herein to describe the relationship of one element or feature relative to another element or feature as shown in the figures, such as "inside," "outside," "inside," "outside," "below," "beneath," "above," and the like. Such spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is flipped, an element described as "below" or "below" another element or feature would then be oriented as "above" or "above" another element or feature. Thus, the example term "below" can include both above and below orientations. The device may be otherwise oriented (rotated 90 degrees or in other orientations) and the spatially relative descriptors used herein are interpreted accordingly.

[0032] like Figures 1 to 3 As shown, according to an embodiment of the present invention, a chip heat sink is provided. The chip heat sink includes a base 10, on which a plurality of heat sinks 13 are disposed. There are two bases 10, one of which is connected to a power source, and the other is connected to a ground line. The two bases 10 are spaced apart, and the heat sinks 13 of one base 10 are arranged opposite to the heat sinks 13 of the other base 10 to form a capacitor structure.

[0033] In traditional digital circuits, a 0.1uF capacitor is typically connected in parallel to the power pin of each chip. This capacitor is called a decoupling capacitor, and can also be understood as a power filter capacitor. The closer this capacitor is to the chip, the better, because the signals near the chip are mainly high-frequency signals, which can be filtered with a smaller capacitor. The two heat sinks of the present invention are arranged relative to each other and form a capacitor structure, which is equivalent to the decoupling capacitor in traditional digital circuits.

[0034] According to the chip heat sink of the present invention, the heat sinks 13 on the two bases 10 are arranged corresponding to each other and form a capacitor structure, and one of the two bases 10 is connected to the power supply, and the other base 10 is connected to the ground wire. The gap between the heat sink fins 13 of the heat sink is used to create a capacitor structure, which can achieve the purpose of signal filtering by the heat sink. The filtering effect of the present invention can be improved by 5-15%.

[0035] It should be understood that both the base 10 and the heat sink 13 are made of metal. Specifically, the metal material can be, but is not limited to, copper or aluminum. Copper has better thermal and electrical conductivity, while aluminum has better heat dissipation performance. The base 10 can be made of different metal materials depending on the electronic device it is used in.

[0036] It is understandable that the base 10 is a comb-tooth structure, and the comb teeth between the two bases 10 are interspersed and staggered (such as Figure 2 As shown in the figure, the base 10 has a comb-like structure. This allows the teeth of the base 10 to be closely arranged, while also increasing the corresponding area between the heat sinks 13, thereby improving the filtering capability of the capacitors between the heat sinks 13. The comb-like structure of the base 10 also ensures air flow between the heat sinks 13, thereby improving the heat dissipation effect of the filter radiator.

[0037] Specifically, the base 10 has a comb-tooth structure, which includes a comb handle and comb teeth. The comb handle and comb teeth of the base 10 may be integrated into one, or the comb teeth may be welded to the comb handle.

[0038] It is understood that the heat sinks 13 are arranged in a straight line on the comb-shaped structure of the base 10, with the same number of heat sinks 13 on each comb-shaped tooth of the base 10. The heat sinks 13 on the base 10 connected to the power supply and the heat sink 13 on the base 10 connected to the ground wire are arranged opposite each other, forming a capacitor structure, stabilizing the power supply and filtering it, reducing the noise coupled from the chip to the power supply terminal, and indirectly reducing the impact of the chip noise on other components.

[0039] It is understood that the size of the base 10 is determined by the size of the chip to be cooled. Generally, the size of the base 10 perpendicular to the chip is within the range of [5mm, 30mm]. The size of the base 10 within the range of [5mm, 30mm] can meet the cooling requirements of most chips.

[0040] It is understood that the spacing between the two bases 10 is within the range of [50 μm, 5 mm]. The spacing between the bases 10 is controlled between 50 μm and 5 mm, which can achieve improved filtering effect while ensuring heat dissipation effect.

[0041] It is understandable that the heat sink 13 is perpendicular to the chip direction, and the size of the heat sink 13 is in the range of [2cm, 8cm]. The height of the heat sink 13 will affect the corresponding area between the power heat sink 131 and the ground heat sink 132, and thus affect the filtering effect. The larger the corresponding area between the power heat sink 131 and the ground heat sink 132, the larger the capacitance, and the better the filtering effect. However, if the height of the heat sink 13 is too high, it will affect the air intake between the heat sink 13, resulting in a decrease in the heat dissipation effect. In addition, the chip radiator is limited by the installation environment, so under limited conditions, the height of the heat sink 13 is controlled between 2-8 cm to achieve the best filtering effect, and the heat dissipation effect is not significantly reduced.

[0042] Specifically, each base 10 is provided with at least two screw holes 14. These two screw holes 14, when engaged with metal nuts, can more securely secure the base 10 to the printed circuit board. Whether the base 10 is grounded or connected to a power source determines whether these two screw holes 14 are connected to the ground or power source. If the base 10 is grounded, both screw holes 14 on the grounding base 10 are connected to the ground wire. If the base 10 is connected to a power source, both screw holes 14 on the power supply base 10 are connected to the power source.

[0043] It is understandable that the screw hole 14 can be set in the position according to the shape of the base 10 and the direction of the air duct. Figure 2 As shown, the base 10 has a comb-like structure, and screw holes 14 are provided on the comb handle of the comb-like structure, one at the top and one at the bottom. Furthermore, the direction of the screw holes 14 on the base 10 is perpendicular to the direction of the air duct. This arrangement allows for more uniform power distribution. Therefore, the screw holes 14 should be evenly distributed on the base 10 according to the shape of the base 10.

[0044] It is understood that the base 10 and the heat sink 13 are an integrated structure. The base 10 and the heat sink 13 are integrally formed during the molding process, which does not affect the electrical conductivity between the base 10 and the heat sink 13. In some embodiments, the heat sink 13 can also be welded to the base 10, but this method will reduce the electrical conductivity and increase labor costs.

[0045] It is understandable that the base 10 and the heat sink 13 are not an integrated structure. The heat sink 13 is fixed on the base 10 by welding, or the heat sink 13 is rotatably arranged on the base 10. At this time, the capacitance formed between the heat sink 13 on the base 10 connected to the power supply and the heat sink 13 on the grounded base 10 can be adjusted within a certain range.

[0046] It is understood that the outer side of the base 10 is coated with an insulating layer. The insulating layer can be made of an insulating material with a high dielectric constant, and the thickness of the insulating layer cannot be too thick. Therefore, the insulating material can be a gate oxide layer, aluminum oxide, or insulating varnish. When the outer surface of the base 10 is coated with an insulating material with a very high dielectric constant, the two bases 10 also form a capacitor, where the dielectric constant is between 100 and 250,000. In this way, the capacitance formed on the base 10 can be in the range of nanofarads to microfarads.

[0047] It is understandable that if Figure 3 As shown, the length of the heat sink 13 connected to the ground wire, perpendicular to the chip, is longer than the length of the heat sink 13 connected to the power supply, perpendicular to the chip. The grounded heat sink 13 is slightly higher than the power supply heat sink 13 to prevent foreign objects from falling on the power supply heat sink 13, causing electric shock and damage.

[0048] It is understandable that air is filled between the heat sinks 13. The dielectric constant of air is 1, and dry air is a good dielectric, so the capacitor formed between the powered heat sink 13 and the grounded heat sink 13 can effectively filter

[0049] It is understandable that the power supply connected to the power base 10 can be a core power supply, and the capacitor formed between the heat sink 13 on the power base 10 and the heat sink 13 on the grounding base can achieve the purpose of filtering the high-speed signal of the power supply.

[0050] In some specific embodiments, such as Figures 1 to 3 As shown, first, the base size, thickness and opening position should be determined according to the size of the chip. The base is divided into a power base 11 and a ground base 12.

[0051] The power supply base 11 and the grounding base 12 have the same structure, both of which are comb-shaped structures. The comb teeth between the power supply base 11 and the grounding base 12 intersect each other but do not touch each other, that is, the comb teeth on the power supply base 11 are spaced apart from the comb teeth on the grounding power supply.

[0052] The power supply base 11 is provided with two power supply holes 141, which are respectively arranged at the top and bottom of one side of the power supply base 11. The grounding base 12 is provided with a grounding hole 142, which are respectively arranged at the top and bottom of one side of the grounding base 12. Figure 2 As shown, the top end and the bottom end here refer to the top end and the bottom end of the comb handle with a comb-tooth structure.

[0053] Fix the power line to the power connection hole 141 with a metal screw, and fix the ground line to the grounding hole 142 with a metal screw.

[0054] The power supply base 11 and the grounding base 12 have the same structure, and the thickness of the power supply base 11 and the grounding base 12 are both 8 mm, and the distance between the two bases 10 is 1 mm, that is, the distance between the comb teeth of the two comb-shaped structures is 1 mm.

[0055] The power supply base 11 is provided with a power supply heat sink 131, and the grounding base 12 is provided with a grounding heat sink 132. The power supply heat sink 131 is integrated with the power supply base 11, and the grounding heat sink 132 is also integrated with the grounding base 12. The integrated design method can be to cast the base 10 and the heat sink 13 together during the molding process, and after demolding, the base 10 and the heat sink 13 are integrated.

[0056] In order to prevent foreign objects from squeezing the power fins 131 and causing conduction, the power fins 131 are slightly shorter than the ground fins 132. The height of the power fins 131 is 3 cm, and the height of the ground fins 132 is 5 cm.

[0057] The space between the grounded heat sink 132 and the powered heat sink 131 is filled with air.

[0058] The outer sides of the power supply base 11 and the ground base 12 are both covered with an insulating layer, and the material of the insulating layer is a gate oxide layer.

[0059] Compared with the traditional fin-shaped chip heat sink, the chip heat sink of this embodiment can improve the filtering effect by 5% to 15%.

[0060] An embodiment of the present invention further provides an electronic device, which includes a chip and the above-mentioned chip heat sink, wherein the chip heat sink is attached to the chip.

[0061] The above description is merely a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present invention should be included in the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.

Claims

1. A chip heat sink for attaching to a chip of an electronic device, characterized in that: It includes a base, on which a plurality of heat sinks are provided; There are two bases, one of the two bases is connected to the power supply, and the other is connected to the ground wire. The two bases are arranged at intervals, and the heat sink of one base is arranged opposite to the heat sink of the other base to form a capacitor structure. Each base is provided with at least two screw holes, and the screw holes are used to fix the base and connect the wires or ground wires.

2. The chip heat sink according to claim 1, characterized in that: The base is a comb-tooth structure.

3. The chip heat sink according to claim 2, characterized in that: The comb-tooth structure of the base connected to the power supply and the comb-tooth structure of the base connected to the ground wire are arranged alternately.

4. The chip heat sink according to claim 1, characterized in that: Along a direction perpendicular to the chip, the size of the base is within the interval of [5 mm, 30 mm].

5. The chip heat sink according to claim 1, characterized in that: The spacing distance between the two bases is within the range of [50 μm, 5 mm].

6. The chip heat sink according to claim 1, characterized in that Along a direction perpendicular to the chip, the size of the heat sink is within the range of [2 cm, 8 cm].

7. The chip heat sink according to claim 1, characterized in that: The base and the heat sink are an integrated structure; And / or the outer side of the base is covered with an insulating layer.

8. The chip heat sink according to claim 1, characterized in that: Along a direction perpendicular to the chip, a size of the heat sink connected to the ground line is larger than a size of the heat sink connected to the power supply.

9. An electronic device, characterized in that: The electronic device comprises: chip; According to the chip heat sink according to any one of claims 1 to 8, the chip heat sink is attached to the chip.

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