A flip-type resistor loading system

Abstract

The present invention provides a flip-type resistor chip loading system, which includes a first conveying component, a cover component, a pushing component, a flip component, a second conveying member, and a panel component; the first conveying component is used to convey stacked resistor chips with temporary placement plates; the cover component is used to place gaskets on the stacked resistor chips, and to cover the stacked resistor chips with a sagger with an opening facing downward; the pushing component sagger is used to push the sagger out of the first conveying component; the flip component is used to receive the sagger and drive the sagger to flip so that the opening of the sagger faces upward; the second conveying member is used to receive and convey the sagger with stacked resistor chips and an opening facing upward; the panel component is used to place the sagger in the sagger and take out the temporary placement plate in the sagger. Compared with the prior art, the flip-type resistor chip loading system of the present invention has a high degree of automation, can reduce the intensity of manual labor, and improve the efficiency and quality of resistor chip loading.

Description

Technical Field

[0001] The invention relates to the technical field of resistor production, and in particular to a flip-type resistor packing system. Background Art

[0002] During the production process of resistors, multiple resistors need to be stacked in a sagger, and enclosures and gaskets need to be installed in the gap between the resistors and the sagger. On the one hand, this can play a buffering role, and on the other hand, it can reduce the gap between the resistors and the sagger and reduce shaking during transportation.

[0003] However, currently, the packaging of resistors is usually done manually or by semi-automatic + manual methods, which is labor-intensive and inefficient. At the same time, it is greatly affected by human factors, and errors are easy to occur during the packaging process, which affects the quality of resistor packaging. Summary of the invention

[0004] Aiming at the technical problem that the packing of resistors in the prior art is usually carried out manually or semi-automatically + manually, with high labor intensity, low packing efficiency and inability to ensure the packing quality, the present invention provides a flip-type resistor packing system, which can stack resistors in a sagger through the cooperation between mechanical structures, and add a panel and a gasket between the sagger and the resistors, thereby reducing the labor intensity and improving the packing efficiency. At the same time, it also avoids the influence of human factors as much as possible and improves the packing quality.

[0005] A flip-type resistor chip loading system comprises a first conveying component, a cover plate component, a pushing component, a flipping component, a second conveying component, and a surrounding plate component;

[0006] The first conveying assembly is used to convey stacked resistor sheets with temporary placement plates;

[0007] The cover plate assembly is arranged corresponding to the first conveying assembly, and is used to place a gasket on the stacked resistor sheets, and to cover the stacked resistor sheets with a sagger with an opening facing downward, so as to form a partial assembly sagger;

[0008] The pushing component is arranged at the output end of the first conveying component, and is used to push the partially assembled sagger out of the first conveying component;

[0009] The flip assembly is arranged at the output end of the first conveying assembly, and the input end of the flip assembly is arranged corresponding to the pushing assembly, so as to receive the partially assembled sagger and drive the partially assembled sagger to flip so that the opening of the sagger faces upward to form a semi-assembled sagger;

[0010] The second conveying member is arranged at the output end of the turning assembly, and is used to receive and convey the semi-assembled sagger;

[0011] The enclosure assembly is arranged corresponding to the second conveying member, and is used for placing enclosures into the semi-assembly sagger, and taking out the temporarily placed plates in the semi-assembly sagger.

[0012] Preferably, the first conveying assembly includes a first conveying member and a resistor sheet stacking assembly;

[0013] The first conveying member is used to convey the temporary placement plate;

[0014] The resistor sheet stacking assembly is arranged corresponding to the first conveying member, and is used to stack the resistor sheets to form a stack, and push the stack of resistor sheets into the temporary placement plate, so as to convey the stack of resistor sheets with the temporary placement plate through the first conveying member;

[0015] The cover plate assembly, the pushing assembly, and the flipping assembly are respectively arranged at the output end of the first conveying member.

[0016] Preferably, the resistor stack assembly includes a first stacking mechanism, a first pushing mechanism, a second stacking mechanism, and a second pushing mechanism;

[0017] The first stacking mechanism is used to sequentially receive single resistor sheets and stack multiple resistor sheets into a stack of resistor sheets;

[0018] The first pushing mechanism is arranged corresponding to the first stacking mechanism, and is used to push a stack of the resistor sheets out of the first stacking mechanism;

[0019] The input end of the second stacking mechanism is arranged corresponding to the first stacking mechanism to sequentially receive a stack of the resistor sheets and stack multiple stacks of the resistor sheets into the stacked resistor sheets; and the output end of the second stacking mechanism is arranged corresponding to the first conveying member;

[0020] The second pushing mechanism is arranged corresponding to the second stacking mechanism, and is used for pushing the stacked resistor sheets from the second stacking mechanism into the first conveying member.

[0021] Preferably, the second stacking mechanism comprises a containing box, a first baffle, a second baffle, a rotating shaft, and a rotating driving mechanism;

[0022] The containing box is provided with a first containing cavity with two sides open;

[0023] The first baffle plate and the second baffle plate are disposed on opposite sides of the containing box, and the second baffle plate is located on a side close to the first conveying member;

[0024] The rotating shaft is connected to the containing box to drive the containing box to rotate;

[0025] The rotary drive mechanism is connected to the rotating shaft to drive the rotating shaft to rotate;

[0026] The containing box has a receiving position for receiving the resistor sheet conveyed by the first pushing mechanism, and a feeding position after being rotated by the rotating shaft;

[0027] The first baffle is provided with a first channel at the material receiving position for connecting the first accommodating cavity with the first stacking mechanism;

[0028] The first baffle is also provided with a second channel at the feeding position for communicating with the first accommodating cavity;

[0029] The second baffle is provided with a third channel corresponding to the second channel at the feeding position, for connecting the first accommodating cavity with the first conveying member;

[0030] The second pushing mechanism is arranged corresponding to the second channel.

[0031] Preferably, the second pushing mechanism comprises a first pushing cylinder, a second pushing cylinder, a first flat-head pushing block, and a second pushing plate;

[0032] The first pushing cylinder and the second pushing cylinder are arranged on opposite sides of the first conveying member; and the first pushing cylinder is arranged on a side of the first baffle away from the first conveying member and facing the second channel; the second pushing cylinder is arranged facing the third channel;

[0033] The first flat-head push block is arranged on the push rod of the first push cylinder, so as to push the stacked resistor sheets in the storage box into the first conveying member when the storage box is in the feeding position;

[0034] The second push plate is disposed on the push rod of the second push cylinder to cooperate with and abut against the stacked resistor sheets.

[0035] Preferably, the first stacking mechanism includes a stacking piston, a feeding funnel, a vibration mechanism, a support rod, a first lifting mechanism, and a blocking mechanism;

[0036] The stacking piston is arranged on a side of the first baffle away from the first conveying member, and a second accommodating chamber for accommodating a stack of the resistor sheets is arranged in the stacking piston, and a side of the second accommodating chamber close to the first baffle is open and communicated with the first channel;

[0037] The feeding hopper is in communication with the second accommodating chamber to transport the single resistor sheet into the second accommodating chamber;

[0038] The vibration mechanism is connected to the feeding funnel;

[0039] The support rod is disposed in the second accommodating cavity to support the resistor sheet;

[0040] The first lifting mechanism is connected to the support rod to drive the support rod to rise and fall;

[0041] The blocking mechanism is arranged corresponding to the stacking piston and has a first blocking state and a second blocking state. In the first blocking state, the blocking mechanism blocks the first channel and the second accommodating chamber; in the second blocking state, the blocking mechanism blocks the feeding funnel and the second accommodating chamber.

[0042] Preferably, the first pushing mechanism includes a third pushing cylinder, a fourth pushing cylinder, a first pushing plate, and a second pushing plate;

[0043] The third pushing cylinder is arranged on a side of the stacking piston away from the first baffle;

[0044] The fourth pushing cylinder is arranged on a side of the second baffle plate away from the first baffle plate;

[0045] The first push plate is arranged on the push rod of the third push cylinder, so as to push a stack of the resistor sheets into the first receiving cavity through the first channel when the receiving box is in the material receiving position;

[0046] The second pushing plate is arranged on the pushing rod of the fourth pushing cylinder, so as to extend into the first accommodating cavity and abut against the resistor sheet pushed in by the first pushing plate when the accommodating box is in the material receiving position.

[0047] Preferably, along the conveying direction of the first conveying member, a plurality of the resistor stacking assemblies are provided, and each of the resistor stacking assemblies is correspondingly provided with the temporary placement plate.

[0048] Preferably, the cover assembly includes a first frame, a first translation mechanism, a second lifting mechanism and a first adsorption mechanism;

[0049] The first frame portion is disposed at an output end of the first conveying assembly;

[0050] The first translation mechanism is disposed on the first frame to reciprocate between the first material supply area and the output end of the first conveying assembly;

[0051] The second lifting mechanism is arranged at the moving end of the first translation mechanism;

[0052] The first adsorption mechanism is arranged at the lifting end of the second lifting mechanism to absorb the gaskets and the saggers in the first material supply area, and to place the gaskets and the saggers at the stacked resistor sheets at the output end of the first conveying component.

[0053] Preferably, a lifting baffle and a third lifting mechanism are further provided at the output end of the first conveying assembly;

[0054] The lifting baffle is connected to the lifting end of the third lifting mechanism to abut against the sagger transported by the first adsorption mechanism.

[0055] Preferably, the pushing assembly includes a guide rail, a second translation mechanism, and a rectangular pushing block;

[0056] The guide rail and the flip assembly are located on opposite sides of the output end of the first conveying assembly, and the guide rail is parallel to the second conveying member;

[0057] The rectangular push block is arranged on the guide rail and connected to the moving end of the second translation mechanism to push the partially assembled sagger.

[0058] Preferably, the flip assembly includes a first rotating mechanism and a flip cylinder;

[0059] The turning cylinder is disposed between the output end of the first conveying component and the input end of the second conveying member, and the turning cylinder is connected to the first rotating mechanism to rotate under the drive of the first rotating mechanism;

[0060] The turning cylinder is provided with a turning cavity which is connected with the output end of the first conveying component and the input end of the second conveying component, and the turning cavity is used to receive the partially assembled sagger and drive the partially assembled sagger to turn over to form the semi-assembled sagger;

[0061] The rectangular push block is also used to push the semi-assembled sagger out of the turning chamber.

[0062] Preferably, the enclosure assembly includes a second frame, a third translation mechanism, a second rotation mechanism, a fourth lifting mechanism, a flip mechanism, a second adsorption mechanism, a fifth lifting mechanism, and a third adsorption mechanism;

[0063] The second frame is arranged corresponding to the second conveying member;

[0064] The third translation mechanism is disposed on the second frame to reciprocate between the second material supply area and the second conveying member;

[0065] The second rotating mechanism and the fifth lifting mechanism are both arranged at the moving end of the third translation mechanism;

[0066] The fourth lifting mechanism is arranged at the bottom of the second rotating mechanism, and the flipping mechanisms are arranged on both sides of the lifting end of the fourth lifting mechanism, and the second adsorption mechanism is arranged at the bottom of each flipping mechanism;

[0067] The second adsorption mechanism is used to adsorb the enclosure of the second material supply area and to place the enclosure in the semi-assembled sagger;

[0068] The third adsorption mechanism is arranged at the lifting end of the fifth lifting mechanism to adsorb and take out the temporary placement plate in the semi-assembled sagger.

[0069] Preferably, the flipping mechanism includes a rotating plate and a fifth pushing cylinder;

[0070] The middle portion of the rotating plate is hinged to the side of the lifting end of the fourth lifting mechanism;

[0071] One end of the fifth push cylinder is hinged to the top of the lifting end of the fourth lifting mechanism, and the other end is hinged to the top of the rotating plate, so as to drive the rotating plate to rotate in a vertical plane;

[0072] The second adsorption mechanism is arranged at the bottom of the rotating plate.

[0073] Compared with the prior art, the present invention provides a flip-type resistor chip loading system, which includes a first conveying component, a cover component, a push component, a flip component, a second conveying component, and a panel component; the first conveying component is used to convey a stack of stacked resistor chips with a temporary placement plate; the cover component is arranged corresponding to the first conveying component, and is used to place a gasket on the stack of stacked resistor chips, and to cover the stack of stacked resistor chips with a downward opening to form a partial assembly sagger; the push component is arranged at the output end of the first conveying component, and is used to transfer the partial assembly sagger to the stack of stacked resistor chips. The first conveying component is pushed out from the first conveying component; the flipping component is arranged at the output end of the first conveying component, and the input end of the flipping component is arranged corresponding to the pushing component, so as to receive the partially assembled sagger and drive the partially assembled sagger to flip so that the opening of the sagger faces upward to form a semi-assembled sagger; the second conveying member is arranged at the output end of the flipping component, so as to receive and convey the semi-assembled sagger; the enclosure plate assembly is arranged corresponding to the second conveying member, so as to place the enclosure plate into the semi-assembled sagger and take out the temporarily placed plate in the semi-assembled sagger. The flip-type resistor chip loading system can place gaskets on the stacked resistor chips and place the sagger cover on the pre-fixed stacked resistor chips through the cooperation between the first conveying component, the cover component, the pushing component, the flipping component, the second conveying component and the enclosure component, and can also flip the sagger to load the enclosure into the sagger and take out the temporary placement plate used to pre-fix the stacked resistor chips. The system has a high degree of automation, reduces the intensity of manual labor, improves the loading efficiency, and also avoids the influence of human factors as much as possible, thereby improving the loading quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0074] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0075] Figure 1 A schematic diagram of the three-dimensional structure of a flip-type resistor packing system provided by an embodiment from a first viewing angle;

[0076] Figure 2 A schematic diagram of the three-dimensional structure of a flip-type resistor packing system provided by an embodiment from a second viewing angle;

[0077] Figure 3 A schematic diagram of the three-dimensional structure of a flip-type resistor packing system provided by an embodiment from a third viewing angle;

[0078] Figure 4 A schematic diagram of the three-dimensional structure of a flip-type resistor packing system provided by an embodiment from a fourth viewing angle;

[0079] Figure 5 for Figure 1 A partial enlarged view of area A shown;

[0080] Figure 6 for Figure 2 A partial enlarged view of area B is shown;

[0081] Figure 7 A schematic cross-sectional structure diagram of a first conveying member and a resistor stacking assembly in a flip-type resistor packing system provided by an embodiment;

[0082] Figure 8 for Figure 7 A partial enlarged view of the F region shown;

[0083] Fig. 9 for Figure 3 A local enlarged view of the D region shown;

[0084] Fig.10 for Figure 2 A local enlarged view of the C region is shown;

[0085] Fig.11 for Figure 4 A partial enlarged view of area E is shown. DETAILED DESCRIPTION

[0086] In order to enable those skilled in the art to better understand the technical solutions in this application, the technical solutions in the embodiments of this application will be clearly and completely described below. Obviously, the described embodiments are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0087] It should be noted that when a component is referred to as being "fixed on", "installed on" or "set on" another component, it can be directly on the other component or indirectly set on the other component; when a component is "connected" to another component, or a component is referred to as being "connected to" another component, it can be directly connected to the other component or indirectly connected to the other component.

[0088] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the conditions under which this application can be implemented. Therefore, they have no substantive technical significance. Any structural modification, change in proportional relationship or adjustment of size should still fall within the scope of the technical content disclosed in this application without affecting the effects and purposes that can be achieved by this application.

[0089] The invention provides a flip-type resistor sheet loading system, which comprises a first conveying component, a cover plate component, a pushing component, a flipping component, a second conveying member, and a panel component; the first conveying component is used to convey stacked resistor sheets with temporary placement plates; the cover plate component is arranged corresponding to the first conveying component, and is used to place gaskets on the stacked resistor sheets, and to cover the stacked resistor sheets with a sagger with an opening facing downward, so as to form a partially assembled sagger; the pushing component is arranged at the output end of the first conveying component, and is used to push the partially assembled sagger out of the first conveying component; the flipping component is arranged at the output end of the first conveying component, and the input end of the flipping component is arranged corresponding to the pushing component, and is used to receive the partially assembled sagger, and drive the partially assembled sagger to flip, so that the opening of the sagger faces upward, so as to form a semi-assembled sagger; the second conveying member is arranged at the output end of the flipping component, and is used to receive and convey the semi-assembled sagger; the panel component is arranged corresponding to the second conveying member, and is used to place a sagger in the semi-assembled sagger, and take out the temporarily placed plate in the semi-assembled sagger. The flip-type resistor chip loading system can place gaskets on the stacked resistor chips and place the sagger cover on the pre-fixed stacked resistor chips through the cooperation between the first conveying component, the cover component, the pushing component, the flipping component, the second conveying component and the enclosure component, and can also flip the sagger to load the enclosure into the sagger and take out the temporary placement plate used to pre-fix the stacked resistor chips. The system has a high degree of automation, reduces the intensity of manual labor, improves the loading efficiency, and also avoids the influence of human factors as much as possible, thereby improving the loading quality.

[0090] Please refer to Figures 1 to 4 The present embodiment provides a flip-type resistor chip loading system, which includes a first conveying component 10 , a cover component 40 , a pushing component 50 , a flipping component 60 , a second conveying component 70 and a surrounding plate component 80 .

[0091] The first conveying assembly 10 is used to convey the stacked resistor sheets with the temporary placement board 200. The cover assembly 40 is arranged corresponding to the first conveying assembly 10, and is used to place the gasket 400 on the stacked resistor sheets, and to cover the stacked resistor sheets with a sagger 500 with the opening facing downward, so as to form a partial assembly sagger. That is, the partial assembly sagger is a sagger with the opening facing downward, and the stacked resistor sheets, the gasket and the temporary placement board are accommodated in the sagger.

[0092] Specifically, in this embodiment, the gasket 400 is a square gasket.

[0093] The pushing assembly 50 is disposed at the output end of the first conveying assembly 10 to push the partially assembled sagger out of the first conveying assembly 10 .

[0094] The flip assembly 60 is arranged at the output end of the first conveying assembly 10, and the input end of the flip assembly 60 is arranged corresponding to the pushing assembly 50, so as to receive the partially assembled sagger and drive the partially assembled sagger to flip, so that the opening of the sagger 500 faces upward, so as to form a semi-assembled sagger. That is, the semi-assembled sagger is a sagger with an opening facing upward, and the sagger contains stacked resistor sheets, gaskets and temporary placement plates.

[0095] The second conveying member 70 is disposed at the output end of the turning assembly 60 to receive and convey the semi-assembled sagger.

[0096] The enclosure assembly 80 is provided corresponding to the second conveying member 70, and is used to place the enclosure 600 in the semi-assembled sagger, and take out the temporary placement board 200 in the semi-assembled sagger. After the enclosure 600 is placed in the sagger 500 and the temporary placement board 200 is taken out by the enclosure assembly 80, the stacking of the stacked resistor sheets is finally completed.

[0097] The flip-type resistor packing system provided in the present embodiment can automatically load the stacked resistor sheets into the sagger 500 through the cooperation between various components. At the same time, during the assembly process, the gasket 400 and the enclosure 600 can be placed between the sagger 500 and the stacked resistor sheets, thereby realizing overall automated assembly, effectively reducing labor intensity, and improving packing efficiency and quality.

[0098] Specifically, the stack of stacked resistor sheets with the temporary placement plate 200 is transported by the first conveying component 10, and the temporary placement plate 200 can temporarily fix the stack of stacked resistor sheets, thereby ensuring that the subsequent gasket 400 can be smoothly placed on the stack of stacked resistor sheets, and at the same time ensuring that the subsequent sagger 500 can smoothly cover the stack of stacked resistor sheets.

[0099] Preferably, the first conveying assembly 10 includes a first conveying member 30 and a resistor sheet stacking assembly 20. The first conveying member 30 is used to convey the temporary placement plate 200. The resistor sheet stacking assembly 20 is arranged corresponding to the first conveying member 30, and is used to stack the stacked resistor sheets, and push the stacked resistor sheets into the temporary placement plate 200, so as to convey the stacked resistor sheets with the temporary placement plate 200 through the first conveying member 30. The cover plate assembly 40, the pushing assembly 50, and the flip assembly 60 are respectively arranged at the output end of the first conveying member 30.

[0100] That is to say, in this embodiment, the stacked resistor sheets with the temporary placement plate 200 are assembled by components in the first conveying assembly 10, which further improves the automation of the flip-type resistor sheet loading system and reduces labor intensity.

[0101] In this embodiment, the temporary placement plate 200 is specifically a “U”-shaped temporary placement plate, and in the horizontal direction, along a conveying direction perpendicular to the first conveying member 30 , both sides of the temporary placement plate 200 are open.

[0102] Specifically, the first conveying member 30 is used to sequentially convey the temporary placement plate 200 with the resistor sheet to the cover plate assembly 40 , and stops conveying after the temporary placement plate 200 with the resistor sheet reaches the assembly position of the cover plate assembly 40 .

[0103] Please refer to Figures 5 to 8 Preferably, the resistor stack assembly 20 includes a first stacking mechanism 21 , a first pushing mechanism 22 , a second stacking mechanism 23 , and a second pushing mechanism 24 .

[0104] The first stacking mechanism 21 is used to sequentially receive single resistor sheets and stack multiple resistor sheets into a stack of resistor sheets.

[0105] The first pushing mechanism 22 is provided corresponding to the first stacking mechanism 21, and is used to push a stack of the resistor sheets out of the first stacking mechanism 21. That is, when the number of resistor sheets stacked in the first stacking mechanism 21 is completed, the first pushing mechanism 22 pushes out the stack of resistor sheets stacked in the first stacking mechanism 21.

[0106] The input end of the second stacking mechanism 23 is arranged corresponding to the first stacking mechanism 21, so as to sequentially receive a stack of the resistor sheets, and stack multiple stacks of the resistor sheets into the stack of stacked resistor sheets. And the output end of the second stacking mechanism 23 is arranged corresponding to the first conveying member 30. That is, the second stacking mechanism 23 is used to receive a stack of the resistor sheets pushed out from the first stacking mechanism 21, and gradually stack multiple stacks of the resistor sheets, and finally stack them into the stack of stacked resistor sheets.

[0107] The second pushing mechanism 24 is provided corresponding to the second stacking mechanism 23, and is used to push the stacked resistor sheets from the second stacking mechanism 23 into the first conveying member 30. That is, the second pushing mechanism 24 is used to push the stacked resistor sheets stacked by the second stacking mechanism 23 into the first conveying member 30, so that the stacked resistor sheets can enter the temporary placement plate 200 accordingly.

[0108] Specifically, in this embodiment, the second stacking mechanism 23 is arranged beside the first conveying member 30, and the first stacking mechanism 23 is used to sequentially receive the single-chip resistor sheets and stack them into a vertical stack of the resistor sheets. The first pushing mechanism 22 is used to translate a stack of the resistor sheets into the second stacking mechanism 23. The second stacking mechanism 23 is used to sequentially receive multiple stacks of the resistor sheets, and after receiving a preset number of rows of the resistor sheets, the stack of stacked resistor sheets is obtained, and the stack of stacked resistor sheets in the vertical state is driven to rotate 90° in the vertical plane to obtain the stack of stacked resistor sheets in the horizontal state. The second pushing mechanism 24 is used to translate the stack of stacked resistor sheets in the horizontal state into the temporary placement plate 200 on the first conveying member 30.

[0109] Preferably, the second stacking mechanism 23 includes a accommodating box 231, a first baffle 232, a second baffle 233, a rotating shaft 234, and a rotating driving mechanism 235. A first accommodating cavity 2311 with two sides open is provided in the accommodating box 231. The first baffle 232 and the second baffle 233 are arranged on opposite sides of the accommodating box 231, and the second baffle 233 is located on a side close to the first conveying member 30. The rotating shaft 234 is connected to the accommodating box 231 to drive the accommodating box 231 to rotate. The rotating driving mechanism 235 is connected to the rotating shaft 234 to drive the rotating shaft 234 to rotate.

[0110] The receiving box 231 has a receiving position for receiving the resistor sheet delivered by the first pushing mechanism 22, and a feeding position after being rotated by the rotating shaft 234. In this embodiment, the receiving position of the receiving box 231 is specifically the position of the receiving box 231 when the receiving box 231 is in a vertical state, and the feeding position of the receiving box 231 is specifically the position of the receiving box 231 when the receiving box 231 is in a horizontal state.

[0111] The first baffle 232 has a first channel 2321 at the receiving position, and the first channel 2321 is used to connect the first accommodating cavity 2311 and the first stacking mechanism 21. The first baffle 232 also has a second channel 2322 at the feeding position, and the second channel 2322 is used to connect the first accommodating cavity 2311.

[0112] The second baffle 233 is provided with a third channel 2331 corresponding to the second channel 2322 at the feeding position, and the third channel 2331 is used to connect the first accommodating cavity 2311 with the first conveying member 30. The second pushing mechanism 24 is provided corresponding to the second channel 2322.

[0113] Specifically, in this embodiment, the rotating shaft 234 is horizontally arranged beside the first conveying member 30, and the arrangement direction of the rotating shaft 234 is perpendicular to the conveying direction of the first conveying member 30. The first baffle 232 and the second baffle 233 are both perpendicular to the axis of the rotating shaft 234. The containing box 231 is arranged on the outer peripheral surface of the rotating shaft 234, and the rotating driving mechanism 235 is used to drive the rotating shaft 234 to rotate so that the containing box 231 rotates around the rotating shaft 234 in a vertical plane.

[0114] Preferably, the second pushing mechanism 24 includes a first pushing cylinder 241, a second pushing cylinder 242, a first flat-head pushing block 243, and a second pushing plate 244. The first pushing cylinder 241 and the second pushing cylinder 242 are disposed on opposite sides of the first conveying member 30, and the first pushing cylinder 241 is disposed on a side of the first baffle 232 away from the first conveying member 30, the first pushing cylinder 241 is disposed opposite to the second channel 2322, and the second pushing cylinder 242 is disposed opposite to the third channel 2331.

[0115] The first flat-head push block 243 is disposed on the push rod of the first push cylinder 241, so as to push the stacked resistor sheets in the storage box 231 into the first conveying member 30 when the storage box 231 is in the feeding position. The second push plate 244 is disposed on the push rod of the second push cylinder 242, so as to cooperate with and abut against the stacked resistor sheets.

[0116] Specifically, in this embodiment, the first flat-head pushing block 243 can move along the second channel 2322 and the third channel 2331 , so as to push the stacked resistor sheets into the first conveying member 30 .

[0117] When the number of resistor sheets in the first accommodating chamber 2311 reaches the maximum, the rotating shaft 234 drives the accommodating box 231 to rotate to the receiving position, the second pushing cylinder 242 pushes the second push plate 244 to move into the third channel 2331, and the first pushing cylinder 241 pushes the first flat-head push block 243 to pass through the second channel 2322 and the second push plate 244 to jointly push the stacked resistor sheets in the first accommodating chamber 2311 from the third channel 2331 to the temporary placement plate 200 on the first conveying member 30. In this process, the first flat-head push plate 243 and the second push plate 244 are respectively located on both sides of the stacked resistor sheets. When the stacked resistor sheets are moved into the temporary placement plate 200, the second pushing cylinder 242 pushes the second push plate 244 to reset, and the first pushing cylinder 241 pushes the first flat-head push block 243 to reset. In this way, the stacked resistor sheets are better prevented from being scattered.

[0118] Preferably, the first stacking mechanism 21 includes a stacking piston 211 , a feeding funnel 212 , a vibration mechanism 213 , a support rod 214 , a first lifting mechanism 215 , and a blocking mechanism 216 .

[0119] The stacking piston 211 is arranged on the side of the first baffle 232 away from the first conveying member 30, and a second accommodating chamber 2111 for accommodating a stack of the resistor sheets is arranged in the stacking piston 211. The second accommodating chamber 2111 is open on the side close to the first baffle 232 and communicates with the first channel 2321.

[0120] The feeding hopper 212 is connected to the second accommodating chamber 2111 to transport the single resistor into the second accommodating chamber 2111. The vibration mechanism 213 is connected to the feeding hopper 212. The support rod 214 is disposed in the second accommodating chamber 2111 to support the resistor. The first lifting mechanism 215 is connected to the support rod 214 to drive the support rod 214 to rise and fall.

[0121] The blocking mechanism 216 is arranged corresponding to the stacking piston 211 and has a first blocking state and a second blocking state. In the first blocking state, the blocking mechanism 214 blocks the first channel 2321 from the second accommodating chamber 2111. In the second blocking state, the blocking mechanism 214 blocks the feeding funnel 212 from the second accommodating chamber 2111.

[0122] Specifically, in this embodiment, the stacking piston 211 is vertically arranged on the side of the first baffle 232 away from the first conveying member 30. The feeding funnel 212 is vertically arranged on the top of the stacking piston 211, and the bottom end of the feeding funnel 212 is connected to the top end of the second accommodating chamber 2111. The vibration mechanism 213 is used to drive the feeding funnel 212 to vibrate, so that the resistor sheets fall from the feeding funnel 212 into the second accommodating chamber 2111 in sequence. The support rod 214 is vertically arranged in the second accommodating chamber 2111, and a support plate 2141 is horizontally arranged on the top of the support rod 214, and the first lifting mechanism 215 is connected to the bottom of the support rod 214. The blocking mechanism 216 is used to close the open side of the second accommodating chamber 2111 and open the top of the second accommodating chamber 2111 when the stacking piston 211 is not full of a stack of the resistor sheets. The blocking mechanism 216 is also used to open the open side of the second accommodating cavity 2111 and close the top of the second accommodating cavity 2111 when the feed funnel 212 is full of the resistor sheets.

[0123] When the stack of resistor sheets in the second accommodating chamber 2111 is full, the blocking mechanism 216 opens the open side of the second accommodating chamber 2111 and closes the top of the second cavity 2111. The accommodating box 231 rotates to a vertical state and one side of the first accommodating chamber 2311 is connected to the first channel 2321, and the other side of the first accommodating chamber 2311 is closed by the second baffle 233. The first pushing mechanism 22 pushes the stack of resistor sheets in the second accommodating chamber 2111 from the first channel 2321 into the first accommodating chamber 2311. When the number of resistor sheets in the first accommodating chamber 2311 reaches the full value, the accommodating box 231 rotates to a horizontal state and one side is connected to the second channel 2322 and the other side is connected to the third channel 2331. The second pushing mechanism 24 pushes the resistor sheets in the first accommodating chamber 2311 from the third channel 2331 to the temporary placement plate 200 on the first conveying member 30.

[0124] The resistor sheets are stacked in sequence into a stack of resistor sheets by the cooperation of the feeding funnel 212 and the stacking piston 211, and then multiple stacks of resistor sheets are input into the first accommodating chamber 2311 to form the stacked resistor sheets, and finally moved to the temporary placement plate 200. The whole process is automated and no manual stacking is required, thus reducing the amount of labor.

[0125] Preferably, the first pushing mechanism 22 includes a third pushing cylinder 221, a fourth pushing cylinder 222, a first pushing plate 223, and a second pushing plate 224. The third pushing cylinder 221 is disposed on a side of the stacking piston 211 away from the first baffle 232, and the fourth pushing cylinder 222 is disposed on a side of the second baffle 233 away from the first baffle 232. The first pushing plate 223 is disposed on a push rod of the third pushing cylinder 221, so as to push a stack of the resistor sheets into the first accommodating cavity 2311 through the first channel 2321 when the accommodating box 231 is in the material receiving position. The second pushing plate 224 is disposed on the fourth pushing cylinder 222, so as to extend into the first accommodating cavity 2311 and abut against the resistor sheets pushed in by the first pushing plate 223 when the accommodating box 231 is in the material receiving position.

[0126] Specifically, in this embodiment, the first push plate 223 is vertically disposed in the second accommodating cavity 2111 , the second push plate 224 is vertically disposed in the first accommodating cavity 2311 , and the fourth push cylinder 222 is disposed on the second baffle plate 233 .

[0127] When the stack of resistor sheets in the second accommodating chamber 2111 is full, the third pushing cylinder 221 pushes the first pushing plate 223 to move so as to push the stack of resistor sheets in the second accommodating chamber 2111 from the first channel 2321 into the first accommodating chamber 2311. The fourth pushing cylinder 222 is used to push the second pushing plate 224 against the side of the stack of resistor sheets away from the first pushing plate 223.

[0128] The first pushing mechanism 22 can completely push a stack of resistor sheets in the second accommodating cavity 2111 into the first accommodating cavity 2311. During the pushing process, the first pushing plate 223 and the second pushing plate 224 are pressed against both ends of the stacked resistor sheets to prevent the stacked resistor sheets from tilting or falling.

[0129] Preferably, along the conveying direction of the first conveying member 30, the resistor stacking assembly 20 is provided with a plurality of (at least two) resistor stacking assemblies, and each resistor stacking assembly 20 is provided with a corresponding temporary placement plate 200. This can further improve the efficiency of resistor loading.

[0130] Please refer to Fig. 9. Preferably, the cover plate assembly 40 includes a first frame 41, a first translation mechanism 42, a second lifting mechanism 43 and a first adsorption mechanism 44, and the first frame 41 is partially arranged at the output end of the first conveying assembly 10. Specifically, in the present embodiment, the first frame 41 is partially arranged at the output end of the first conveying member 30. The first translation mechanism 42 is arranged on the first frame 41 to reciprocate between the first material supply area and the output end of the first conveying assembly 10. The second lifting mechanism 43 is arranged at the moving end of the first translation mechanism 42, and the first adsorption mechanism 44 is arranged at the lifting end of the second lifting mechanism 43 to adsorb the gasket 400 and the sagger 500 in the first material supply area, and to place the gasket 400 and the sagger 500 at the stacked resistor sheets at the output end of the first conveying assembly 10.

[0131] Specifically, in this embodiment, the first material supply area is provided with a first placement platform, and the first placement platform is used to stack the gasket 400 and the sagger 500. The first translation mechanism 42 is provided directly above the first conveying assembly 10 and the first placement platform, and the first translation mechanism 42 is used to drive the second lifting mechanism 43 to reciprocate between the position of the gasket 400 and the sagger 500 on the first placement platform and the output end of the first conveying assembly 10. The second lifting mechanism 43 is used to drive the first adsorption mechanism 44 to rise or fall directly above the gasket 400, the sagger 500 or the output end of the first conveying assembly 10.

[0132] When the second lifting mechanism 43 drives the first adsorption mechanism 44 to descend directly above the gasket 400 or the sagger 500 on the first placement platform, the first adsorption mechanism 44 is used to adsorb the gasket 400 or the sagger 500. When the second lifting mechanism 43 drives the first adsorption mechanism 44 to descend directly above the output end of the first conveying assembly 10, the first adsorption mechanism 44 is used to release the gasket 400 or the sagger 500. Through this structure, the gasket 400 and the sagger 500 can be automatically installed in sequence on the top of the temporary placement plate 200.

[0133] Preferably, the second conveying member 70 and the first conveying member 30 are both conveyor belts, and the conveying direction of the first conveying member 30 is perpendicular to the conveying direction of the second conveying member 70. This makes it easier to arrange the components and more stable to convey the materials to be assembled.

[0134] Preferably, a lifting baffle 90 and a third lifting mechanism 91 are further provided at the output end of the first conveying assembly 10 . The lifting baffle 90 is connected to the lifting end of the third lifting mechanism 91 to abut against the sagger 500 conveyed by the first adsorption mechanism 44 .

[0135] Specifically, the lifting baffle 90 is disposed on both sides of the output end of the first conveying member 30. When the sagger 500 is assembled above the temporary placement plate 200, the upper surface of the lifting baffle 90 abuts against the lower surface of the sagger 500, and the third lifting mechanism 91 is used to drive the lifting baffle 90 to descend so that the sagger 500 completely covers the top of the temporary placement plate 200. This structure allows the sagger 500 to better cover the top of the temporary placement plate 200.

[0136] Please refer to Fig.10 Preferably, the pushing assembly 50 includes a guide rail 51, a second translation mechanism 52, and a rectangular push block 53. The guide rail 51 and the flip assembly 60 are located on opposite sides of the output end of the first conveying assembly 10, and the guide rail 51 is parallel to the second conveying member 70. The rectangular push block 53 is disposed on the guide rail 51 and connected to the moving end of the second translation mechanism 52 to push the partially assembled sagger.

[0137] Specifically, the two sides of the rectangular push block 53 are arranged on the guide rail 51 and can translate along the guide rail 51. When the cover assembly 40 is assembled, the second translation mechanism 52 pushes the rectangular push block 53 to extend in the horizontal plane to push the assembled part of the sagger into the flip assembly 60.

[0138] Please continue reading Fig. 9 . Preferably, the flip assembly 60 includes a first rotating mechanism 61 and a flip cylinder 62. The flip cylinder 62 is disposed between the output end of the first conveying assembly 10 and the input end of the second conveying member 70, and the flip cylinder 62 is connected to the first rotating mechanism 61 so as to rotate under the drive of the first rotating mechanism 61. A flip chamber 621 connecting the output end of the first conveying assembly 10 and the input end of the second conveying member 70 is provided in the flip cylinder 62, and the flip chamber 621 is used to receive the partially assembled sagger and drive the partially assembled sagger to flip to form the semi-assembled sagger. The rectangular push block 53 is also used to push the semi-assembled sagger out of the flip chamber 621.

[0139] Specifically, in this embodiment, the turning cylinder 62 is a hollow cylinder and is horizontally arranged between the first conveying member 30 and the second conveying member 70, and a transportation channel is arranged between the turning cylinder 62 and the first conveying member 30 and the second conveying member 70. The turning cavity 621 is opened in the middle of the turning cylinder 62, and the turning cavity 621 is open to the side facing the first conveying member 30 and the side facing the second conveying member 70. When the turning cavity 621 is in a horizontal state, the turning cavity 621 is connected to the first conveying member 30 and the second conveying member 70 through the transportation channel.

[0140] After the pushing assembly 50 pushes the partially assembled sagger into the flip chamber 621, the first rotating mechanism 61 drives the flip cylinder 62 and the flip chamber 621 to rotate 180° in a vertical plane, so that the opening direction of the partially assembled sagger changes from downward to upward, forming the semi-assembled sagger, and then the semi-assembled sagger is pushed onto the second conveying member 70 by the pushing assembly 50. With this structure, the structure of the overall device is made more compact. At the same time, the flip assembly 60 can facilitate the subsequent installation of the enclosure 600 and the removal of the temporary placement plate 200.

[0141] Please refer to Fig.11 Preferably, the enclosure assembly 80 includes a second frame 81 , a third translation mechanism 82 , a second rotation mechanism 83 , a fourth lifting mechanism 84 , a flipping mechanism 85 , a second adsorption mechanism 86 , a fifth lifting mechanism 87 , and a third adsorption mechanism 88 .

[0142] The second frame 81 is disposed corresponding to the second conveying member 70. The third translation mechanism 82 is disposed on the second frame 81 to reciprocate between the second material supply area and the second conveying member 70.

[0143] Specifically, in this embodiment, the second material providing area is specifically a second placement platform and a third placement platform arranged on both sides of the second conveying member 70, the upper surface of the second placement platform is used to place the enclosure 600, and the upper surface of the third placement platform is used to place the enclosure 600 and the temporary placement plate 200.

[0144] The second rotating mechanism 83 and the fifth lifting mechanism 87 are both arranged at the moving end of the third translation mechanism 82. The fourth lifting mechanism 84 is arranged at the bottom of the second rotating mechanism 83, and the flipping mechanism 85 is arranged on both sides of the lifting end of the fourth lifting mechanism 84, and the second adsorption mechanism 86 is arranged at the bottom of each flipping mechanism 85. The second adsorption mechanism 86 is used to adsorb the enclosure 600 of the second material supply area, and to place the enclosure 600 in the semi-assembled sagger.

[0145] The third adsorption mechanism 88 is disposed at the lifting end of the fifth lifting mechanism 87 to adsorb and take out the temporary placement plate 200 in the semi-assembled sagger.

[0146] Specifically, the third translation mechanism 82 is used to drive the second rotation mechanism 83 to move to the top of the enclosure 600, the second rotation mechanism 83 is used to drive the fourth lifting mechanism 84 to rotate 90° in the horizontal plane, the fourth lifting mechanism 84 is used to drive the flipping mechanism 85 and the second adsorption mechanism 86 to rise or fall above the enclosure 600, when the fourth lifting mechanism 84 drives the second adsorption mechanism 86 to descend, the second adsorption mechanism 86 is used to adsorb the enclosure 600, the flipping mechanism 85 is used to drive the second adsorption mechanism 86 to rotate 90° in the vertical plane after the second adsorption mechanism 86 adsorbs the enclosure 600, so that the enclosure 600 is changed from a horizontal state to a vertical state, and the second adsorption mechanism 86 is also used to release the enclosure 600 after the enclosure 600 is in the vertical state, so that the enclosure 600 can be inserted into the corresponding space between the sagger 500 and the stacked resistor sheets.

[0147] The third translation mechanism 82 is also used to drive the third adsorption mechanism 88 to reciprocate between the enclosure installation position of the second conveying member 70 and the position directly above the temporary placement plate 200 on the third placement platform. The fifth lifting mechanism 87 is used to drive the third adsorption mechanism 88 to rise or fall between the enclosure installation position and the position directly above the temporary placement plate 200 on the third placement platform. When the fifth lifting mechanism 87 drives the third adsorption mechanism 88 to descend directly above the enclosure installation position, the third adsorption mechanism 88 adsorbs the temporary placement plate 200; when the fifth lifting mechanism 87 drives the third adsorption mechanism 88 to descend directly above the temporary placement plate 200 on the third placement platform, the third adsorption mechanism 88 is used to release the temporary placement plate 200.

[0148] Through this structure, the enclosure 600 can be automatically installed in the gap between the four side plates of the temporary placement plate 200 and the inner wall of the sagger 500, and then the temporary placement plate 200 can be disassembled.

[0149] Preferably, the flipping mechanism 85 includes a rotating plate 851 and a fifth pushing cylinder 852. The middle portion of the rotating plate 851 is hinged to the side of the lifting end of the fourth lifting mechanism 84. One end of the fifth pushing cylinder 852 is hinged to the top of the lifting end of the fourth lifting mechanism 84, and the other end is hinged to the top of the rotating plate 851, so as to drive the rotating plate 851 to rotate in a vertical plane. The second adsorption mechanism 86 is arranged at the bottom of the rotating plate 851. The fifth pushing cylinder 852 pushes the rotating plate 851 to rotate in a vertical plane, so that the second adsorption mechanism 86 can be more stably converted between the vertical state and the horizontal state.

[0150] Among them, in this embodiment, the translation mechanism can be composed of a horizontal guide rail slider mechanism and a screw mechanism, and the screw mechanism is used to drive the slider to translate along the guide rail to achieve the translation effect; the lifting mechanism can be composed of a vertical guide rail slider mechanism and a screw mechanism, and the screw mechanism is used to drive the slider to move up and down along the vertical guide rail to achieve the effect of rising or falling; the adsorption mechanism is composed of a suction cup and a conduit, and the conduit is connected to an air pipeline. When adsorption is performed, negative pressure is formed at the suction cup to suck up the workpiece.

[0151] The working process of the flip resistor packing system provided in this embodiment is as follows:

[0152] The single-chip resistors are sequentially fed into the feeding hopper 212, and the vibration mechanism 213 drives the feeding hopper 212 to vibrate, so that the resistors are sequentially fed from the bottom end of the feeding hopper 212 into the second accommodating chamber 2111 of the stacking piston 211 under the action of the vibration. The support rod 214 is located at the top of the second accommodating chamber 2111 in the initial state, and the resistors are supported upward by the support rod 214. As the number of resistors entering the stacking piston 211 increases, the first lifting mechanism 215 drives the support rod 214 to descend in the second accommodating chamber 2111, so that more resistors enter the second accommodating chamber 2111.

[0153] When a preset number of resistor sheets are stacked in the second accommodating chamber 2111, the blocking mechanism 216 opens the open side of the second accommodating chamber 2111 and closes the top of the second accommodating chamber 2111. The rotating drive mechanism 235 drives the rotating shaft 234 to rotate, so that the accommodating box 231 rotates in a vertical plane until the accommodating box 231 is in a vertical state. At this time, the first accommodating chamber 2311 is in a vertical state, one side of which is connected to the first channel 2321, and the other side is closed by the second baffle 233. The third pushing cylinder 221 pushes the first pushing plate 223 in the second accommodating chamber 2111 to move toward the first channel 2321, so as to push the stack of resistor sheets in the second accommodating chamber 2111 from the first channel 2321 into the first accommodating chamber 2311. After the stack of resistor sheets enters the first accommodating chamber 2311, the fourth pushing cylinder 222 pushes the second pushing plate 224 to press against the side of the resistor sheets away from the first pushing plate 223.

[0154] When the first accommodating chamber 2311 receives a preset number of rows of resistor sheets, a stack of resistor sheets is obtained. The rotating drive mechanism 235 drives the rotating shaft 234 to rotate, so that the accommodating box 231 containing the stack of resistor sheets rotates in a vertical plane until the accommodating box 231 is in a horizontal state. At this time, the first accommodating chamber 2311 is in a horizontal state and one side is connected to the second channel 2322, and the other side is connected to the third channel 2331. The second pushing cylinder 242 pushes the second push plate 244 to move in a horizontal plane into the third channel 2331 and against one side of the stack of resistor sheets. Then, the first pushing cylinder 241 and the second pushing cylinder 242 push the first flat-head push block 243 and the second push plate 244 respectively to move toward the first conveying member 30, so as to push the stack of resistor sheets in the first accommodating chamber 2311 from the third channel 2331 to the temporary placement plate 200 on the first conveying member 30.

[0155] The first conveying member 30 drives the temporary placement plate 200 equipped with the resistor sheet to move toward the cover plate assembly 40 until the temporary placement plate 200 equipped with the resistor sheet moves to the assembly position and stops.

[0156] The first translation mechanism 42 drives the first adsorption mechanism 44 to move to the top of the gasket 400 placed on the first placement platform, and the second lifting mechanism 43 drives the first adsorption mechanism 44 to descend until the first adsorption mechanism 44 contacts the upper surface of the gasket 400 and adsorbs the gasket 400. After the second lifting mechanism 43 drives the first adsorption mechanism 44 to rise to a preset height, the first translation mechanism 42 drives the first adsorption mechanism 44 to move to the top of the assembly position, and the second lifting mechanism 43 drives the first adsorption mechanism 44 to descend until the gasket 400 is placed on the top of the temporary placement plate 200, and then the first adsorption mechanism 44 releases the gasket 400. After the second lifting mechanism 43 drives the first adsorption mechanism 44 to rise to a preset height, the first translation mechanism 42 drives the first adsorption mechanism 44 to move to the top of the sagger 500 placed on the first placement platform, and the second lifting mechanism 43 drives the first adsorption mechanism 44 to descend until the first adsorption mechanism 44 contacts the upper surface of the sagger 500 and adsorbs the sagger 500. After the second lifting mechanism 43 drives the first adsorption mechanism 44 to rise to a preset height, the first translation mechanism 42 drives the first adsorption mechanism 44 to move to just above the assembly position, and the second lifting mechanism 43 drives the first adsorption mechanism 44 to descend until the bottom of the sagger 500 contacts the top of the lifting baffle 90, and then the first adsorption mechanism 44 releases the sagger 500, and the second lifting mechanism 43 drives the first adsorption mechanism 44 to rise and reset.

[0157] The third lifting mechanism 91 drives the lifting baffle plate 90 to descend, so that the sagger 500 completely covers the top of the temporary placement plate 200;

[0158] The second translation mechanism 52 pushes the rectangular push block 53 to move along the guide rail 51 toward the flip assembly 60, so as to push the sagger 500 from the assembly position into the flip chamber 621. The first rotation mechanism 61 drives the flip cylinder 62 to rotate 180° in the vertical plane, and the sagger 500 in the flip chamber 621 rotates 180° together, so that the opening of the sagger 500 changes from facing downward to facing upward. Then, the second translation mechanism 52 pushes the rectangular push block 53 to move along the guide rail 51 toward the enclosure installation position, until the sagger 500 moves to the enclosure installation position of the second conveying member 70;

[0159] When the sagger 500 is located at the enclosure installation position on the second conveying member 70, the third translation mechanism 82 drives the fourth lifting mechanism 84 to move to the top of the enclosure installation position, and the lifting end of the fourth lifting mechanism 84 descends until the second adsorption mechanisms 86 on both sides of the lifting end of the fourth lifting mechanism 84 contact the enclosure 600 on the second placement platform and the third placement platform and adsorb the enclosure 600, and then the lifting end of the fourth lifting mechanism 84 rises to a preset height. The flip mechanism 85 drives the second adsorption mechanism 86 to rotate 90° in the vertical plane, so that the enclosure 600 is transformed from a horizontal state to a vertical state and just aligned with the gap between the side of the temporary placement plate 200 and the inner wall of the sagger 500. After the lifting end of the fourth lifting mechanism 84 is lowered until the enclosure 600 is spaced apart from the upper surface of the sagger 500 by a preset distance, the second adsorption mechanism 86 releases the enclosure 600, so that the enclosure 600 falls into the gap between the side of the temporary placement plate 200 and the inner wall of the sagger 500. The lifting end of the fourth lifting mechanism 84 rises to a preset height, and the flip mechanism 85 drives the second adsorption mechanism 86 to rotate and reset in a vertical plane. After the lifting end of the fourth lifting mechanism 84 is lowered until the second adsorption mechanisms 86 on both sides of the lifting end of the fourth lifting mechanism 84 contact the enclosure 600 on the second placement platform and the third placement platform and adsorb the enclosure 600, the lifting end of the fourth lifting mechanism 84 rises to a preset height, and the flip mechanism 85 drives the second adsorption mechanism 86 to rotate 90° in a vertical plane, so that the enclosure 600 is transformed from a horizontal state to a vertical state. The second rotating mechanism 83 drives the fourth lifting mechanism 84 to rotate 90° in the horizontal plane, so that the two enclosures 600 are respectively aligned with the gaps between the other two side edges of the temporary placement plate 200 and the inner wall of the sagger 500. After the lifting end of the fourth lifting mechanism 84 is lowered until the enclosure 600 is spaced a preset distance from the upper surface of the sagger 500, the second adsorption mechanism 86 releases the enclosure 600 so that the enclosure 600 falls into the gap between the other two side edges of the temporary placement plate 200 and the inner wall of the sagger 600. The lifting end of the fourth lifting mechanism 84 rises to a preset height, the second rotating mechanism 83 drives the fourth lifting mechanism 84 to rotate and reset in the horizontal plane, and the flipping mechanism 85 drives the second adsorption mechanism 86 to rotate and reset in the vertical plane.

[0160] The third translation mechanism 82 drives the third adsorption mechanism 88 to move to the top of the enclosure installation position, and the fifth lifting mechanism 87 drives the third adsorption mechanism 88 to descend until the third adsorption mechanism 88 contacts the temporary placement plate 200 and adsorbs the temporary placement plate 200. The fifth lifting mechanism 87 drives the third adsorption mechanism 88 to rise to a preset height, and the third translation mechanism 82 drives the third adsorption mechanism 88 to move to the top of the position on the third placement platform for placing the temporary placement plate 200. The fifth lifting mechanism 87 drives the third adsorption mechanism 88 to descend until the temporary placement plate 200 at the bottom of the third adsorption mechanism 88 contacts the upper surface of the third placement platform or the upper surface of the temporary placement plate 200 on the third placement platform, and the third adsorption mechanism 88 releases the temporary placement plate 200, and the fifth lifting mechanism 87 drives the third adsorption mechanism 88 to rise and reset.

[0161] The second conveying member 70 outputs the assembled sagger 500 to an output end of the second conveying member 70 .

[0162] The above description is only an implementation mode of the present invention. It should be pointed out that, for ordinary technicians in this field, improvements can be made without departing from the creative concept of the present invention, but these all belong to the protection scope of the present invention.

Claims

1. A flip-type resistor chip loading system, characterized in that: It includes a first conveying component, a cover plate component, a pushing component, a flipping component, a second conveying component, and a panel component; The first conveying assembly is used to convey stacked resistor sheets with temporary placement plates; The cover plate assembly is arranged corresponding to the first conveying assembly, and is used to place a gasket on the stacked resistor sheets, and to cover the stacked resistor sheets with a sagger with an opening facing downward, so as to form a partial assembly sagger; The pushing component is arranged at the output end of the first conveying component, and is used to push the partially assembled sagger out of the first conveying component; The flip assembly is arranged at the output end of the first conveying assembly, and the input end of the flip assembly is arranged corresponding to the pushing assembly, so as to receive the partially assembled sagger and drive the partially assembled sagger to flip so that the opening of the sagger faces upward to form a semi-assembled sagger; The second conveying member is arranged at the output end of the turning assembly, and is used to receive and convey the semi-assembled sagger; The enclosure assembly is arranged corresponding to the second conveying member, and is used to place enclosures into the semi-assembled sagger, and take out the temporarily placed plates in the semi-assembled sagger; The first conveying assembly includes a first conveying member and a resistor sheet stacking assembly; The first conveying member is used to convey the temporary placement plate; The resistor sheet stacking assembly is arranged corresponding to the first conveying member, and is used to stack the resistor sheets to form a stack, and push the stack of resistor sheets into the temporary placement plate, so as to convey the stack of resistor sheets with the temporary placement plate through the first conveying member; The cover plate assembly, the pushing assembly, and the flipping assembly are respectively arranged at the output end of the first conveying member; The resistor stacking assembly comprises a first stacking mechanism, a first pushing mechanism, a second stacking mechanism, and a second pushing mechanism; The first stacking mechanism is used to sequentially receive single resistor sheets and stack multiple resistor sheets into a stack of resistor sheets; The first pushing mechanism is arranged corresponding to the first stacking mechanism, and is used to push a stack of the resistor sheets out of the first stacking mechanism; The input end of the second stacking mechanism is arranged corresponding to the first stacking mechanism to sequentially receive a stack of the resistor sheets and stack multiple stacks of the resistor sheets into the stacked resistor sheets; and the output end of the second stacking mechanism is arranged corresponding to the first conveying member; The second pushing mechanism is arranged corresponding to the second stacking mechanism, and is used to push the stacked resistor sheets from the second stacking mechanism into the first conveying member; The second stacking mechanism includes a accommodating box, a first baffle, a second baffle, a rotating shaft, and a rotating driving mechanism; The containing box is provided with a first containing cavity with two sides open; The first baffle plate and the second baffle plate are disposed on opposite sides of the containing box, and the second baffle plate is located on a side close to the first conveying member; The rotating shaft is connected to the containing box to drive the containing box to rotate; The rotary drive mechanism is connected to the rotating shaft to drive the rotating shaft to rotate; The containing box has a receiving position for receiving the resistor sheet conveyed by the first pushing mechanism, and a feeding position after being rotated by the rotating shaft; The first baffle is provided with a first channel at the material receiving position for connecting the first accommodating cavity with the first stacking mechanism; The first baffle is also provided with a second channel at the feeding position for communicating with the first accommodating cavity; The second baffle is provided with a third channel corresponding to the second channel at the feeding position, for connecting the first accommodating cavity with the first conveying member; The second pushing mechanism is arranged corresponding to the second channel.

2. The flip resistor cartridge system according to claim 1, characterized in that: The second pushing mechanism includes a first pushing cylinder, a second pushing cylinder, a first flat-head pushing block, and a second pushing plate; The first pushing cylinder and the second pushing cylinder are arranged on opposite sides of the first conveying member; and the first pushing cylinder is arranged on a side of the first baffle away from the first conveying member and facing the second channel; the second pushing cylinder is arranged facing the third channel; The first flat-head push block is arranged on the push rod of the first push cylinder, so as to push the stacked resistor sheets in the storage box into the first conveying member when the storage box is in the feeding position; The second push plate is disposed on the push rod of the second push cylinder to cooperate with and abut against the stacked resistor sheets.

3. The flip resistor cartridge system according to claim 1 or 2, characterized in that: The first stacking mechanism includes a stacking piston, a feeding funnel, a vibration mechanism, a support rod, a first lifting mechanism, and a blocking mechanism; The stacking piston is arranged on a side of the first baffle away from the first conveying member, and a second accommodating chamber for accommodating a stack of the resistor sheets is arranged in the stacking piston, and a side of the second accommodating chamber close to the first baffle is open and communicated with the first channel; The feeding hopper is in communication with the second accommodating chamber to transport the single resistor sheet into the second accommodating chamber; The vibration mechanism is connected to the feeding funnel; The support rod is disposed in the second accommodating cavity to support the resistor sheet; The first lifting mechanism is connected to the support rod to drive the support rod to rise and fall; The blocking mechanism is arranged corresponding to the stacking piston and has a first blocking state and a second blocking state. In the first blocking state, the blocking mechanism blocks the first channel and the second accommodating chamber. In the second blocking state, the blocking mechanism blocks the feeding funnel from the second containing chamber.

4. The flip resistor cartridge system according to claim 3, characterized in that: The first pushing mechanism includes a third pushing cylinder, a fourth pushing cylinder, a first pushing plate, and a second pushing plate; The third pushing cylinder is arranged on a side of the stacking piston away from the first baffle; The fourth pushing cylinder is arranged on a side of the second baffle plate away from the first baffle plate; The first push plate is arranged on the push rod of the third push cylinder, so as to push a stack of the resistor sheets into the first receiving cavity through the first channel when the receiving box is in the material receiving position; The second pushing plate is arranged on the pushing rod of the fourth pushing cylinder, so as to extend into the first accommodating cavity and abut against the resistor sheet pushed in by the first pushing plate when the accommodating box is in the material receiving position.

5. The flip resistor cartridge system according to any one of claims 1, 2 and 4, characterized in that: Along the conveying direction of the first conveying member, a plurality of the resistor stacking assemblies are provided, and each of the resistor stacking assemblies is correspondingly provided with the temporary placement plate.

6. The flip resistor cartridge system according to claim 1, characterized in that: The cover assembly includes a first frame, a first translation mechanism, a second lifting mechanism and a first adsorption mechanism; The first frame portion is disposed at an output end of the first conveying assembly; The first translation mechanism is disposed on the first frame to reciprocate between the first material supply area and the output end of the first conveying assembly; The second lifting mechanism is arranged at the moving end of the first translation mechanism; The first adsorption mechanism is arranged at the lifting end of the second lifting mechanism to absorb the gaskets and the saggers in the first material supply area, and to place the gaskets and the saggers at the stacked resistor sheets at the output end of the first conveying component.

7. The flip resistor cartridge system according to claim 6, characterized in that: A lifting baffle and a third lifting mechanism are also provided at the output end of the first conveying assembly; The lifting baffle is connected to the lifting end of the third lifting mechanism to abut against the sagger transported by the first adsorption mechanism.

8. The flip resistor cartridge system according to claim 1, characterized in that: The enclosure assembly includes a second frame, a third translation mechanism, a second rotation mechanism, a fourth lifting mechanism, a flip mechanism, a second adsorption mechanism, a fifth lifting mechanism, and a third adsorption mechanism; The second frame is arranged corresponding to the second conveying member; The third translation mechanism is disposed on the second frame to reciprocate between the second material supply area and the second conveying member; The second rotating mechanism and the fifth lifting mechanism are both arranged at the moving end of the third translation mechanism; The fourth lifting mechanism is arranged at the bottom of the second rotating mechanism, and the flipping mechanisms are arranged on both sides of the lifting end of the fourth lifting mechanism, and the second adsorption mechanism is arranged at the bottom of each flipping mechanism; The second adsorption mechanism is used to adsorb the enclosure of the second material supply area and to place the enclosure in the semi-assembled sagger; The third adsorption mechanism is arranged at the lifting end of the fifth lifting mechanism to adsorb and take out the temporary placement plate in the semi-assembled sagger.

9. The flip-type resistor chip loading system according to claim 8, characterized in that: The flipping mechanism includes a rotating plate and a fifth pushing cylinder; The middle portion of the rotating plate is hinged to the side of the lifting end of the fourth lifting mechanism; One end of the fifth push cylinder is hinged to the top of the lifting end of the fourth lifting mechanism, and the other end is hinged to the top of the rotating plate, so as to drive the rotating plate to rotate in a vertical plane; The second adsorption mechanism is arranged at the bottom of the rotating plate.

10. A flip-type resistor chip loading system, characterized in that: It includes a first conveying component, a cover plate component, a pushing component, a flipping component, a second conveying component, and a panel component; The first conveying assembly is used to convey stacked resistor sheets with temporary placement plates; The cover plate assembly is arranged corresponding to the first conveying assembly, and is used to place a gasket on the stacked resistor sheets, and to cover the stacked resistor sheets with a sagger with an opening facing downward, so as to form a partial assembly sagger; The pushing component is arranged at the output end of the first conveying component, and is used to push the partially assembled sagger out of the first conveying component; The flip assembly is arranged at the output end of the first conveying assembly, and the input end of the flip assembly is arranged corresponding to the pushing assembly, so as to receive the partially assembled sagger and drive the partially assembled sagger to flip so that the opening of the sagger faces upward to form a semi-assembled sagger; The second conveying member is arranged at the output end of the turning assembly, and is used to receive and convey the semi-assembled sagger; The enclosure assembly is arranged corresponding to the second conveying member, and is used to place enclosures into the semi-assembled sagger, and take out the temporarily placed plates in the semi-assembled sagger; The pushing assembly includes a guide rail, a second translation mechanism, and a rectangular pushing block; The guide rail and the flip assembly are located on opposite sides of the output end of the first conveying assembly, and the guide rail is parallel to the second conveying member; The rectangular push block is arranged on the guide rail and connected to the moving end of the second translation mechanism to push the partially assembled sagger; The turning assembly includes a first rotating mechanism and a turning cylinder; The turning cylinder is disposed between the output end of the first conveying component and the input end of the second conveying member, and the turning cylinder is connected to the first rotating mechanism to rotate under the drive of the first rotating mechanism; The turning cylinder is provided with a turning cavity which is connected with the output end of the first conveying component and the input end of the second conveying component, and the turning cavity is used to receive the partially assembled sagger and drive the partially assembled sagger to turn over to form the semi-assembled sagger; The rectangular push block is also used to push the semi-assembled sagger out of the turning chamber.

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