Light-emitting module and electronic device

Abstract

The application provides a light-emitting module and an electronic device. The light-emitting module comprises: a carrier circuit board, a through structure is opened in the thickness direction; a plurality of light-emitting chips are packaged on one side of the carrier circuit board, each light-emitting chip is used for emitting light under the driving of the carrier circuit board, wherein the packaging position of the light-emitting chip on the carrier circuit board and the opening position of the through structure on the carrier circuit board are staggered with each other; a filling medium layer is arranged on the carrier circuit board, the filling medium layer wraps each light-emitting chip and covers at least the through structure; a reflective film is arranged on the side of the filling medium layer away from the carrier circuit board, the reflective film is used for reflecting the light emitted by the light-emitting chip and passing through the filling medium layer, and the light reflected by the reflective film passes through the part of the filling medium layer covering the through structure and is emitted through the through structure. The light-emitting module provided by the application has obvious bright-dark boundaries when emitting light, is easy to realize the required light-emitting shape, and is helpful to expand the application scenarios of the light-emitting module.

Description

Technical Field

[0001] This invention belongs to the field of display technology, and particularly relates to a light-emitting module and an electronic device. Background Technology

[0002] In related technologies, LED light strips mainly consist of a circuit board, LED chips encapsulated on the circuit board, and phosphor adhesive wrapped around the LED chips through molding. The LED chips emit a first color light (usually blue light) driven by the circuit board. The phosphor adhesive converts the first color light emitted by the LED chips into a second color light (usually white light). This second color light is the final light emitted by the LED light strip from the side away from the circuit board via the phosphor adhesive. The entire surface of the phosphor adhesive on the side away from the circuit board is the light-emitting surface of the LED light strip. However, because the phosphor adhesive has a light-scattering and homogenizing effect, when the LED light strip emits light from the entire surface of the phosphor adhesive on the side away from the circuit board, there is a problem of unclear distinction between bright and dark areas. Even by controlling the different luminous power of the LED chips in different areas of the LED light strip, the LED light strip cannot be manufactured into the desired light-emitting shape, limiting the application scenarios of LED light strips. Summary of the Invention

[0003] The present invention aims to at least solve one of the technical problems existing in the prior art. To this end, the present invention provides a light-emitting module and an electronic device, wherein the light-emitting module has a clear distinction between bright and dark areas when emitting light, making it easy to achieve the desired light-emitting shape and helping to expand the application scenarios of the light-emitting module.

[0004] To achieve the above objectives, in one respect, the present invention provides a light-emitting module, comprising:

[0005] The carrier circuit board has a through structure along its thickness direction;

[0006] A plurality of light-emitting chips are packaged on one side of the carrier circuit board. Each light-emitting chip is used to emit light under the drive of the carrier circuit board. The packaging position of each light-emitting chip on the carrier circuit board is offset from the opening position of the through structure on the carrier circuit board.

[0007] A filling dielectric layer is disposed on the carrier circuit board, the filling dielectric layer encapsulating each of the light-emitting chips and at least covering the through-structure; and

[0008] A reflective film is applied to the side of the filling medium layer away from the carrier circuit board. The reflective film is used to reflect the light emitted by the light-emitting chip and transmitted through the filling medium layer. The light reflected by the reflective film passes through the portion of the filling medium layer covering the through structure and is emitted out through the through structure.

[0009] In one embodiment, the filling medium layer is a transparent adhesive layer, and the reflective film is a colored reflective film. The light emitted by the light-emitting chip has a first color, the colored reflective film has a second color, and the colored reflective film is used to convert the color of the light emitted by the light-emitting chip into a predetermined third color.

[0010] In one embodiment, the filling medium layer is a light conversion medium layer, and the reflective film is a mirror reflective film. The light emitted by the light-emitting chip has a first color, the light conversion medium layer has a second color, and the light conversion medium layer is used to convert the color of the light emitted by the light-emitting chip into a predetermined third color.

[0011] In one embodiment, the filling medium layer further fills the entire through structure, and the surface of the filling medium layer in the through structure away from the reflective film is flush with the surface of the carrier circuit board away from the reflective film.

[0012] Alternatively, the filling medium layer may also fill the portion of the through structure near the reflective film, wherein the surface of the filling medium layer in the through structure away from the reflective film is lower than the surface of the carrier circuit board away from the reflective film.

[0013] In one embodiment, the filling medium layer further fills the entire through structure and protrudes from the side of the carrier circuit board away from the reflective film, with the surface of the filling medium layer protruding from the carrier circuit board on the side away from the reflective film parallel to the surface of the carrier circuit board on the side away from the reflective film.

[0014] In one embodiment, the light-emitting module further includes a leveling medium layer covering the side of the carrier circuit board away from the reflective film. The leveling medium layer is spliced ​​with the filling medium layer protruding from the carrier circuit board, and the surface of the filling medium layer protruding from the carrier circuit board away from the reflective film is flush with the surface of the leveling medium layer away from the reflective film.

[0015] In one embodiment, the light-emitting module further includes a decorative film disposed on the side of the carrier circuit board away from the reflective film, the decorative film at least covering the surface of the filling medium layer exposed through the through structure away from the reflective film.

[0016] In one embodiment, the through structure includes at least one through hole and / or at least one through groove.

[0017] In one embodiment, the reflectivity of the reflective film is greater than or equal to 90%.

[0018] On the other hand, the present invention provides an electronic device including a housing and a light-emitting module of any of the above embodiments, wherein the housing has a transparent area, the light-emitting module is disposed on the inner side of the housing, and the light-emitting module is visualized on the housing through the transparent area.

[0019] Compared with the prior art, the present invention has the following advantages: In the light-emitting module provided by the present invention, by opening a through-structure that runs through both sides of the carrier circuit board, and by setting a reflective film on the side of the filling medium layer that wraps each light-emitting chip and at least covers the through-structure away from the carrier circuit board, the light emitted by the light-emitting chip and passing through the filling medium layer can be reflected by the reflective film. The light reflected by the reflective film can pass through the portion of the filling medium layer covering the through-structure and be emitted out through the through-structure. In this way, the portion of the carrier circuit board without the through-structure can block part of the reflected light, while the through-structure allows another portion of the reflected light to pass through, making the light-emitting module have a clear distinction between bright and dark when emitting light. By reasonably designing the shape and arrangement of the through-structure, the required light-emitting shape can be achieved relatively easily, which helps to expand the application scenarios of the light-emitting module.

[0020] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0022] Figure 1 This is a cross-sectional structural diagram of a light-emitting module provided in one embodiment of the present invention.

[0023] Figure 2 This is a schematic diagram of one embodiment of a through-structure on a carrier circuit board.

[0024] Figure 3 This is a schematic diagram of another implementation method for creating a through structure on a carrier circuit board.

[0025] Figure 4 This is a cross-sectional structural diagram of a light-emitting module provided in another embodiment of the present invention.

[0026] Figure 5 This is a cross-sectional structural schematic diagram of a light-emitting module provided in another embodiment of the present invention.

[0027] Figure 6 This is a cross-sectional structural diagram of a light-emitting module provided in another embodiment of the present invention.

[0028] Figure 7 This is a cross-sectional structural diagram of one embodiment of the decorative film.

[0029] Figure 8 This is a three-dimensional structural schematic diagram of an electronic device provided in one embodiment of the present invention.

[0030] Figure 9 yes Figure 8 A three-dimensional structural diagram of the electronic device shown from another perspective.

[0031] Explanation of key figure labels:

[0032] 1. Light-emitting module; 5. Wireless charging module; 7. Camera module;

[0033] 11. Carrier circuit board; 112. Through-structure; 12. Light-emitting chip; 13. Filling dielectric layer; 14. Reflective film;

[0034] 15. Decorative film; 151. Film body; 152. Semi-transparent colored ink layer; 153. Uniform gloss ink layer; 154. First texture layer; 155. Second texture layer; 1551. Microstructure; 1552. Brightening film; 16. Leveling medium layer;

[0035] 100, Display panel; 300, Housing; 310, Transparent area; 1000, Electronic device. Detailed Implementation

[0036] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0037] Please see Figure 1 The present invention provides a light-emitting module 1, including a carrier circuit board 11, a plurality of light-emitting chips 12, a filling dielectric layer 13 and a reflective film 14.

[0038] Specifically, such as Figure 1As shown, in an embodiment of the present invention, the carrier circuit board 11 has a through structure 112 extending through its opposite sides along the thickness direction. The through structure 112 includes, but is not limited to, one or a combination of through holes and through slots, and the number of through holes and through slots can be one or more, without limitation. A plurality of light-emitting chips 12 are encapsulated on one side of the carrier circuit board 11 in the thickness direction. Each light-emitting chip 12 is used to emit light under the drive of the carrier circuit board 11. The encapsulation position of each light-emitting chip 12 on the carrier circuit board 11 is staggered from the opening position of the through structure 112. A filling dielectric layer 13 is disposed on the carrier circuit board 11, and the filling dielectric layer 13 encapsulates each light-emitting chip 12 and at least covers the through structure 112. A reflective film 14 covers the side of the filling dielectric layer 13 away from the carrier circuit board 11. The reflective film 14 is used to reflect light emitted by the light-emitting chip 12 and transmitted through the filling dielectric layer 13 (not limited to...). Figure 1 The light rays indicated by the downward arrow shown, and the light rays reflected by the reflective film 14 (not limited to...) Figure 1 The upward-pointing arrow indicates the light rays that pass through the portion of the filling medium layer 13 covering the through-structure 112 and are emitted through the through-structure 112. It is easy to understand that the light rays that pass through the portion of the filling medium layer 13 covering the through-structure 112 and are emitted through the through-structure 112 are the light rays emitted by the light-emitting module 1. To improve reflectivity, in embodiments of the present invention, the reflective film 14 is a high-reflectivity reflective film, preferably a reflective film with a reflectivity greater than or equal to 90%.

[0039] In the light-emitting module 1 provided by the present invention, by forming a through-structure 112 that penetrates both sides of the carrier circuit board 11, and by providing a reflective film 14 on the side of the filling medium layer 13 that wraps around each light-emitting chip 12 and at least covers the through-structure 112 away from the carrier circuit board 11, the light emitted by the light-emitting chip 12 and passing through the filling medium layer 13 can be reflected by the reflective film 14. Furthermore, the light reflected by the reflective film 14 can pass through the portion of the filling medium layer 13 covering the through-structure 112 and finally be emitted through the through-structure 112. In this way, the portion of the carrier circuit board 11 without the through-structure 112 can block the reflected light, while the through-structure 112 allows the reflected light to pass through, making the bright and dark boundaries of the light-emitting module 1 obvious when it emits light. By reasonably designing the shape and arrangement of the through-structure 112, the required light-emitting shape can be achieved relatively easily, which helps to expand the application scenarios of the light-emitting module 1.

[0040] For example, please see Figure 2 In one possible implementation, the through-structure 112 can be designed as an array of multiple through holes (not limited to circular through holes) formed on the carrier circuit board 11. With the carrier circuit board 11 providing cover and the through-structure 112 allowing light to pass through, the light-emitting module 1 emits multiple light-emitting points, thus enabling its application in scenarios requiring multiple light-emitting points. For example, please refer to... Figure 3 In another possible implementation, the through-structure 112 can also be designed as a serpentine through-slot formed on the carrier circuit board 11. With the carrier circuit board 11 providing cover and the through-structure 112 allowing light to pass through, the light-emitting module 1 emits a serpentine light strip, thus applicable to some application scenarios requiring serpentine light strips. In other implementations, the through-structure 112 can also be designed with other shapes and arrangements according to actual needs, which will not be elaborated upon. The through-structure 112 can be formed on the carrier circuit board 11 by, but is not limited to, drilling, as long as it avoids the drive lines on the carrier circuit board 11, which will not be elaborated upon.

[0041] It should be noted that, in the embodiments of the present invention, the carrier circuit board 11 can be a flexible circuit board with driving lines or a printed circuit board with driving lines, preferably a flexible circuit board, so that the light-emitting module 1 made of the flexible circuit board as a carrier can be bent and folded as needed, and is suitable for various occasions, thus expanding the application range of the light-emitting module 1.

[0042] Optionally, the plurality of light-emitting chips 12 include at least one of LED, MiniLED, and MicroLED. Those skilled in the art know that LED, MiniLED, and MicroLED light-emitting chips can emit one of the three primary colors of light (red, blue, and green) under the drive of their carrier circuit board; that is, the light emitted by the light-emitting chip 12 is red, blue, or green. In the embodiments of the present invention, the plurality of light-emitting chips 12 preferably all adopt MiniLED, and more preferably, blue MiniLED with high energy efficiency, with each light-emitting chip 12 emitting blue light. Using the same type of MiniLED light-emitting chip for the plurality of light-emitting chips 12 not only reduces the design difficulty of the driving circuit on the carrier circuit board 11, but also, because MiniLED is smaller than LED and MicroLED, it can reduce the thickness of the light-emitting module 1 (i.e., the dimension perpendicular to the carrier circuit board 11), thereby helping to reduce the thickness of electronic devices using the light-emitting module 1 as a backlight. The light-emitting module 1 may contain one or more light-emitting chips 12. Preferably, in an embodiment of the present invention, the number of light-emitting chips 12 is multiple and arranged in a uniform array to ensure the uniformity of light emission of the light-emitting module 1.

[0043] As described above, the light emitted by the light-emitting chip 12 using LED, MiniLED or MicroLED is one of red light, blue light or green light. In related technologies, the light emitted by the light-emitting module 1 is usually a color other than the three primary colors (generally white light). Therefore, in the embodiments of the present invention, the filling dielectric layer 13 and / or the reflective film 14 are also used to convert the color of the light emitted by the light-emitting chip 12.

[0044] Specifically, in one possible implementation, the filling medium layer 13 can be a transparent adhesive layer, and the reflective film 14 is a colored reflective film. The light emitted by the light-emitting chip 12 has a first color, and the colored reflective film has a second color. The colored reflective film is used to convert the color of the light emitted by the light-emitting chip 12 into a predetermined third color. For example, in one embodiment, the light-emitting chip 12 is a blue MiniLED, and the first color of the light it emits is blue. Correspondingly, the reflective film 14 can be a fluorescent yellow (i.e., the second color) colored reflective film. Thus, when the blue light emitted by the light-emitting chip 12 passes through the filling medium layer 13 (which uses a transparent adhesive layer), the color of the light remains unchanged. However, when it shines on the fluorescent yellow reflective film 14, the blue and fluorescent yellow mix to form white (i.e., the third color) light. This white light, reflected by the reflective film 14, passes through the transparent adhesive layer covering the through-structure 112, and is emitted through the through-structure 112, so that the light-emitting module 1 ultimately emits white light. It is understood that in other embodiments, when the light emitted by the light-emitting chip 12 has a color other than blue, the reflective film 14 can be a colored reflective film with a corresponding color, so that the color of the light emitted by the light-emitting chip 12 is mixed and converted into white light, which will not be elaborated further. Of course, when the light-emitting module 1 needs to emit light of a color other than white, that is, when the predetermined third color is a color other than white, the color of the light emitted by the light-emitting chip 12 and the color of the colored reflective film can also be reasonably configured so that the two are mixed into the predetermined third color. For example, when the light emitted by the light-emitting chip 12 is red and the reflective film 14 is a blue colored reflective film, the light-emitting module 1 can emit purple light.

[0045] It is also understood that in the above embodiments, the transparent adhesive layer serves only as a filler and adhesive, therefore the thickness of the transparent adhesive layer (i.e., the filling medium layer 13) does not need to be very thick, thereby reducing the overall thickness and volume of the light-emitting module 1, allowing the light-emitting module 1 to be applied in some confined spaces. Furthermore, the light-emitting chip 12 is located between the reflective film 14 and the portion of the carrier circuit board 11 where the through structure 112 is not formed. The light-emitting chip 12 is obscured, and even if the thickness of the transparent adhesive layer is small, the outline of the light-emitting chip 12 will not be visible through the transparent adhesive layer, thus not affecting the appearance of the light-emitting module 1. The transparent adhesive layer can be any existing transparent optical adhesive, without limitation; the colored reflective film can be obtained by, but is not limited to, attaching a colored fluorescent film to a substrate sheet (not limited to PET), without limitation.

[0046] Optionally, auxiliary substances, including but not limited to diffusion powder, may be added to the transparent adhesive layer to enhance the brightness of the light emitted by the light-emitting chip 12. As long as the auxiliary substances do not affect the propagation of the light emitted by the light-emitting chip 12, no further details will be provided.

[0047] In another possible implementation, the filling medium layer 13 may also be a light conversion medium layer (e.g., a fluorescent adhesive layer or a QD adhesive layer), and the reflective film 14 may be a mirror reflective film (i.e., a film that can perform mirror reflection). The light emitted by the light-emitting chip 12 has a first color, the light conversion medium layer has a second color, and the light conversion medium layer is used to convert the color of the light emitted by the light-emitting chip 12 into a predetermined third color. For example, in one embodiment, the light-emitting chip 12 is a blue MiniLED, and the first color of the light emitted is blue. Correspondingly, the light conversion medium layer can be a fluorescent yellow (i.e., the second color) phosphor layer. Thus, when the blue light emitted by the light-emitting chip 12 passes through the fluorescent yellow phosphor layer, the blue light is converted into near-white light. When this light shines on the reflective film 14, which uses a mirror reflective film, its color does not change. Under the reflection of the reflective film 14, it passes through the phosphor layer covering the through-structure 112. When it passes through the phosphor layer covering the through-structure 112, the light undergoes another color conversion and becomes white (i.e., the third color) light, thereby being emitted through the through-structure 112, so that the light-emitting module 1 ultimately emits white light. The mirror reflective film can be, but is not limited to, a mirror aluminum film, a mirror polyester film, a mirror PET film, or a high-brightness mirror reflective film with chrome plating on the surface of an ABS plastic sheet.

[0048] In other embodiments, when the light emitted by the light-emitting chip 12 has a color other than blue, the filling medium layer 13 may be a light conversion medium layer with a corresponding color, so that the color of the light emitted by the light-emitting chip 12 is harmonized and converted into white light, which will not be elaborated further.

[0049] It is understood that the light emitted by the light-emitting chip 12 is converted into different colors after passing through the light conversion medium layer of different thicknesses. In other words, the color of the light emitted by the light-emitting chip 12 and passing through the light conversion medium layer to illuminate the reflective film 14 (i.e., the light reflected by the reflective film 14) is different from the color of the light emitted by the light-emitting chip 12, and also different from the color of the light reflected by the reflective film 14 and emitted through the light conversion medium layer and its corresponding through-structure 112 (i.e., the light emitted by the light-emitting module 1). The color of the light emitted by the light-emitting module 1 can be adjusted by reasonably designing the thickness of the light conversion medium layer. Therefore, when the light-emitting module 1 needs to emit light of a color other than white, that is, when the predetermined third color is a color other than white, the color of the light emitted by the light-emitting chip 12 and the color of the light conversion medium layer can be reasonably configured to harmonize the two into the predetermined third color. For example, when the light emitted by the light-emitting chip 12 is red and the light conversion medium layer is blue, the light-emitting module 1 can emit purple light. The specific conversion principle of the light conversion medium layer is the same as that of the existing fluorescent adhesive layer or QD adhesive layer, and will not be elaborated further.

[0050] It is also understood that the light emitted by the light-emitting chip 12 passes through the light conversion medium layer and is reflected by the reflective film 14, then passes through the light conversion medium layer again to cover the portion of the through-structure 112 and is finally emitted through the through-structure 112. This is equivalent to using the reflective effect of the reflective film 14 to extend the propagation path of the light emitted by the light-emitting chip 12 in the light conversion medium layer. This also reduces the thickness of the light conversion medium layer (i.e., the filling medium layer 13), thereby reducing the overall thickness and volume of the light-emitting module 1, allowing it to be used in confined spaces. Similar to the aforementioned embodiment, the light-emitting chip 12 is located between the reflective film 14 and the portion of the carrier circuit board 11 where the through-structure 112 is not formed. The light-emitting chip 12 is obscured, and even if the thickness of the light conversion medium layer is reduced, the outline of the light-emitting chip 12 will not be visible through the light conversion medium layer, thus not affecting the appearance of the light-emitting module 1.

[0051] In the two embodiments described above, the light-emitting module 1 emits light only by covering part of the through structure 112 with the filling medium layer 13 (transparent adhesive layer or light conversion medium layer). The portion of the through structure 112 covered by the filling medium layer 13 accounts for a small proportion of the entire filling medium layer 13. This can greatly reduce the problem of the light-emitting module 1's light emission effect being affected by defects such as bubbles and foreign matter in the filling medium layer 13, and is conducive to ensuring that the light-emitting module 1 has a better light emission effect.

[0052] In an embodiment of the present invention, the filling medium layer 13 can not only cover the through structure 112, but also fill the through structure 112.

[0053] Specifically, please refer to [the relevant document] again. Figure 1 In one embodiment of the present invention, the filling medium layer 13 may further fill the entire through-structure 112, and the surface of the filling medium layer 13 in the through-structure 112 away from the reflective film 14 is flush with the surface of the carrier circuit board 11 away from the reflective film 14. Please refer to Figure 4 In another embodiment of the present invention, the filling medium layer 13 may also fill the portion of the through structure 112 near the reflective film 14. The surface of the filling medium layer 13 in the through structure 112 away from the reflective film 14 is lower than the surface of the carrier circuit board 11 away from the reflective film 14, and preferably the two surfaces are parallel to each other. Please refer to [link to previous document]. Figure 5 and Figure 6 In another embodiment of the present invention, the filling medium layer 13 may also fill the entire through structure 112 and protrude from the side of the carrier circuit board 11 away from the reflective film 14. The surface of the filling medium layer 13 protruding from the carrier circuit board 11 away from the reflective film 14 is parallel to the surface of the carrier circuit board 11 away from the reflective film 14.

[0054] In the above embodiments, filling at least a portion of the through structure 112 with the filling medium layer 13 can increase the bonding area between the adhesive filling medium layer 13 and the carrier circuit board 11, and enhance the connection strength between the filling medium layer 13 and the carrier circuit board 11. The exposed surfaces of the filling medium layer 13 through the through structure 112 (i.e., the surface away from the reflective film 14) are all configured to be parallel to the surface of the carrier circuit board 11 away from the reflective film 14, which helps to improve the light emission uniformity of the light-emitting module 1.

[0055] Furthermore, in Figure 1 and Figure 4In the illustrated embodiment, the light-emitting module 1 further includes a decorative film 15 disposed on the side of the carrier circuit board 11 away from the reflective film 14. The decorative film 15 at least covers the surface of the filling medium layer 13 in the through-structure 112 away from the reflective film 14, that is, at least covers the exposed portion of the filling medium layer 13 through the through-structure 112 away from the reflective film 14. Preferably, the decorative film 15 covers the entire surface of the carrier circuit board 11 on the side away from the reflective film 14. The decorative film 15 not only serves a decorative function but also protects the filling medium layer 13 in the through-structure 112, preventing damage to the filling medium layer 13, thereby helping to ensure the uniformity of light emission from the light-emitting module 1. Furthermore, the fact that the decorative film 15 covers the entire surface of the carrier circuit board 11 on the side away from the reflective film 14 also helps to improve the overall appearance and refinement of the light-emitting side of the light-emitting module 1.

[0056] exist Figure 5 and Figure 6 In the illustrated embodiment, the light-emitting module 1 may also include a decorative film 15 disposed on the side of the carrier circuit board 11 away from the reflective film 14, wherein the decorative film 15 at least covers the surface of the filling dielectric layer 13 protruding from the carrier circuit board 11 away from the reflective film 14. It is easy to understand that by providing the decorative film 15, it can also serve a decorative purpose and protect the filling dielectric layer 13 protruding from the carrier circuit board 11, preventing damage to the filling dielectric layer 13, thereby ensuring the uniformity of light emission of the light-emitting module 1.

[0057] Among them, such as Figure 5 As shown, in one possible implementation, when the filling medium layer 13 protrudes from the carrier circuit board 11, the decorative film 15 can only cover one side of the surface of the filling medium layer 13 protruding from the carrier circuit board 11, so that there is a height difference between the part of the light-emitting side of the light-emitting module 1 that is not covered by the decorative film 15 and the part covered by the decorative film 15. This can produce a visual depth effect with a sense of layering and three-dimensionality. Furthermore, the intensity of the depth effect perceived by the user when observing the light-emitting side of the light-emitting module 1 from different angles is different, thereby enhancing the aesthetic appearance of the light-emitting module 1 and providing the user with a better visual experience.

[0058] In addition, such as Figure 6As shown, in another possible implementation, when the filling medium layer 13 protrudes from the carrier circuit board 11, the light-emitting module 1 may further include a leveling medium layer 16 covering the side of the carrier circuit board 11 away from the reflective film 14. The leveling medium layer 16 is spliced ​​with the filling medium layer 13 protruding from the carrier circuit board 11, and the surface of the filling medium layer 13 protruding from the carrier circuit board 11 away from the reflective film 14 is flush with the surface of the leveling medium layer 16 away from the reflective film 14. In this way, the decorative film 15 can cover both the surface of the leveling medium layer 16 away from the reflective film 14 and the surface of the filling medium layer 13 protruding from the carrier circuit board 11 away from the reflective film 14. That is, the decorative film 15 covers the entire surface of the carrier circuit board 11 away from the reflective film 14, which helps to improve the overall appearance refinement of the light-emitting side of the light-emitting module 1. Optionally, the leveling medium layer 16 may be, but is not limited to, a transparent adhesive layer or a white adhesive layer, and there is no limitation on this.

[0059] In the above embodiment, the decorative film 15 is disposed on the side of the carrier circuit board 11 away from the plurality of light-emitting chips 12, so it will not be affected by the unevenness of the surface of the plurality of light-emitting chips 12, thereby avoiding the problem of deformation of the decorative film 15 and improving the appearance flatness of the light-emitting module 1.

[0060] Please see Figure 7 The decorative film 15 in the above embodiments may specifically include a film body 151 and a decorative layer disposed on the film body 151. The decorative layer includes at least one of a semi-transparent colored ink layer 152, a uniform ink layer 153, and a texture layer. The texture layer is transparent or semi-transparent.

[0061] The film body 151 can be made of, but is not limited to, one or a combination of PET, fiberglass board, glass, and PMMA. The translucent colored ink layer 152, the uniform light ink layer 153, and the texture layer can all transmit light emitted from the light-emitting module 1 through the through-structure 112. The translucent colored ink layer 152 is used to make the decorative film 15 display the same color as the translucent colored ink layer 152 when the light-emitting chip 12 is not emitting light. The texture layer is used to make the decorative film 15 display at least one of the following appearance effects when the light-emitting chip 12 is not emitting light: pattern effect, dazzling effect, matte effect, and color-changing effect. The uniform light ink layer 153 is used to uniformly disperse the light passing through the through-structure 112 and then through the uniform light ink layer 153 when the light-emitting chip 12 is emitting light, thereby further improving the light emission uniformity of the light-emitting module 1.

[0062] Preferably, in Figure 7 In the illustrated embodiment, the decorative layer includes the translucent colored ink layer 152, the uniform gloss ink layer 153, the first texture layer 154, and the second texture layer 155.

[0063] The translucent colored ink layer 152 allows light emitted through the through-structure 112 to pass through, and enables the light-emitting module 1 to display color when it is not emitting light, thus enhancing the aesthetic appearance of the light-emitting module 1. The light-diffusing ink layer 153 can play a role in light uniformity, thereby improving the light emission uniformity of the light-emitting module 1.

[0064] The translucent colored ink layer 152 and the uniform light ink layer 153 are both formed on the surface of the film body 151 near the carrier circuit board 11, with the translucent colored ink layer 152 located between the film body 151 and the uniform light ink layer 153. Alternatively, the translucent colored ink layer 152 can be disposed on the side of the uniform light ink layer 153 away from the film body 151. In embodiments of the present invention, the uniform light ink layer 153 can be one or more layers. Compared to a single-layer uniform light ink layer, multiple layers can further improve the light emission uniformity of the light-emitting module 1.

[0065] It is understood that the semi-transparent colored ink layer 152 can be formed using existing semi-transparent colored inks and by printing or other methods. Similarly, any of the uniform gloss ink layers can be formed using existing uniform gloss inks (usually white inks) and by printing or other methods. This will not be elaborated further.

[0066] like Figure 7 As shown, in one embodiment of the present invention, the second texture layer 155 includes a plurality of microstructures 1551 disposed on the side surface of the film body 151 away from the carrier circuit board 11, and a brightening film 1552 for covering the plurality of microstructures 1551. Each microstructure 1551 has at least one reflective surface, and the angle between the reflective surface and the film body 151 is greater than 90 degrees. The second texture layer 155 is used to present a glare effect. The first texture layer 154 is disposed on the side surface of the brightening film 1552 away from the film body 151. The first texture layer 154 includes at least one stripe texture selected from linear texture, coil texture, and wavy texture. The stripe texture can be arranged according to a preset pattern, so that the first texture layer 154 is used to present a pattern effect.

[0067] By sequentially forming the second texture layer 155 and the first texture layer 154 on the film body 151 of the decorative film 15, when the light-emitting module 1 is not emitting light and light shines on the decorative film 15, the texture pattern of the first texture layer 154 can be clearly presented, allowing the user to see a preset pattern corresponding to the texture on the first texture layer 154, thus enhancing the aesthetic appeal of the decorative film 15 to the light-emitting module 1. Furthermore, light can pass through the transparent or semi-transparent first texture layer 154 and further illuminate the second texture layer 155. Since the second texture layer 155 includes multiple microstructures 1551 with reflective surfaces, the light illuminating the decorative film 15 can be reflected from multiple angles and its brightness can be increased under the action of the brightening film 1552, thereby presenting a dazzling effect and reducing the visual blind spots of the decorative film 15, thus improving the brightness of the decorative film 15. Furthermore, the reflected light from the first texture layer 154 and the second texture layer 155 has a certain optical path difference, which distinguishes the brightness of the reflected light from different texture layers. This increases the contrast between different texture layers of the decorative film 15, resulting in a more layered and three-dimensional appearance. It can also be understood that the color of the translucent colored ink layer 152, combined with the shimmering effect produced by the second texture layer 155, allows at least a portion of the decorative film 15 to display a dazzling color. Moreover, the area and color of the dazzling effect on the decorative film 15 will change depending on the user's viewing angle.

[0068] It should be noted that the brightening film 1552 in the second texture layer 155 can be formed using existing coating processes. The brightening film 1552 covers the plurality of microstructures 1551, which not only increases the brightness of the light reflected by the microstructures 1551, thereby further improving the brightness of the decorative film 15, but also improves the flatness of the second texture layer 155 by covering the microstructures 1551 with the brightening film 1552. A flatter second texture layer 155 is more conducive to the formation of the first texture layer 154. It should also be noted that both the first texture layer 154 and the second texture layer 155 can be prepared using any existing texture forming method, including but not limited to printing, pad printing, and CNC machining. Specifically, in the embodiments of the present invention, both the first texture layer 154 and the second texture layer 155 can be formed by printing UV texture adhesive. By adjusting the thickness of the printed UV texture adhesive and controlling the printing process, a texture layer with a certain thickness can be formed to obtain a better texture effect.

[0069] Optionally, in embodiments of the present invention, the stripe texture on the first texture layer 154 may be, but is not limited to, one or a combination of linear textures, spiral textures, coil textures, and wavy textures, and there is no limitation thereto.

[0070] Alternatively, such as Figure 7 As shown, in embodiments of the present invention, each microstructure 1551 in the second texture layer 155 may be, but is not limited to, a pyramidal structure or a frustum structure. Specifically, in Figure 7 In the illustrated embodiment, the plurality of microstructures 1551 are a plurality of square pyramid structures arranged in an array, each of the microstructures 1551 comprising four reflective surfaces (i.e., the four lateral faces of the square pyramid). Of course, in other embodiments, the plurality of microstructures 1551 may also be a plurality of triangular pyramid structures, or a plurality of pentagonal pyramid structures, or other pyramid structures with multiple reflective surfaces arranged in an array; this is not limited. Figure 7 In the illustrated embodiment, each microstructure 1551 in the second texture layer 155 has multiple reflective surfaces, thereby enabling multi-angle reflection of light. This allows the user to receive light reflected from the decorative film 15 over a wide range, which is beneficial for improving the brightness and smoothness of the decorative film 15. Of course, in other embodiments, the plurality of microstructures 1551 can also be a plurality of frustum structures arranged in an array, each of the microstructures 1551 including an annular reflective surface (i.e., the annular cone surface of the frustum structure), which can also achieve multi-angle reflection of light and improve the brightness and smoothness of the decorative film 15. This will not be elaborated further.

[0071] It is understood that, in the embodiments of the present invention, each of the microstructures 1551 has an angle exceeding 90 degrees between its reflective surface and the diaphragm body 151. If the angle is too small, meaning the reflective surface is too tilted relative to the diaphragm body 151, the user can only receive the light reflected from the reflective surface from a side view, reducing the perceived surface smoothness of the decorative diaphragm 15. Conversely, if the angle is too large, meaning the reflective surface is too tilted relative to the diaphragm body 151, the user can only receive the light reflected from the reflective surface from a frontal or near-frontal view, but since the user often views the decorative diaphragm 15 from the side, this reduces the brightness of the decorative diaphragm 15. Therefore, the angle between the reflective surface of each microstructure 1551 and the diaphragm body 151 should be reasonably designed, preferably within the range of 120-160 degrees.

[0072] It should be noted that, in the embodiments of the present invention, the filling medium layer 13, the reflective film 14, the decorative film 15 and the leveling medium layer 16 can all be formed by, but not limited to, molding, which will not be elaborated further.

[0073] Further, please refer to Figure 8 The present invention also provides an electronic device 1000, which is not limited to mobile phones, tablets, displays, or other electronic devices. Figure 8 As shown, the electronic device 1000 includes a housing 300 and a display panel 100 disposed on the front of the housing 300 (i.e. the side facing the user when the user uses the electronic device 1000).

[0074] Further, please refer to Figure 9 In some embodiments of the present invention, the housing 300 is provided with a transparent area 310, and the light-emitting module 1 described in any of the above embodiments is provided on the inner side of the housing 300. The light-emitting module 1 can be visually displayed on the housing 300 through the transparent area 310. It is understood that since the light-emitting module 1 in the electronic device 1000 provided by the present invention includes all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments. That is, the light-emitting module 1 has a clear distinction between light and dark when emitting light, so that the desired light-emitting shape can be displayed, which helps to improve the aesthetics of the light-emitting module 1 when it is visually displayed through the transparent area 310.

[0075] It should be noted that, similar to existing electronic devices, the electronic device 1000 may also include other electronic components such as a control module, a camera module, a wireless charging module, a memory, and sensors. The carrier circuit board 11 in the light-emitting module 1 can be electrically connected to the control module of the electronic device 1000. The control module can control the light-emitting chip 12 on the carrier circuit board 11 to emit or not emit light, thereby using the light-emitting chip 12 to indicate the charging status, incoming call information, and other statuses of the electronic device 1000, realizing interaction between the light-emitting module 1 and the status of the electronic device 1000.

[0076] like Figure 9 As shown, in an embodiment of the present invention, the housing 300 includes a back cover opposite to the display panel 100, and a middle frame for fixing the display panel 100 and the back cover. Optionally, both the back cover and the middle frame may be made wholly or partially of a transparent material (not limited to glass, transparent plastic, etc.), and the transparent portions of the back cover and the middle frame constitute the transparent area 310. Figure 9In the illustrated embodiment, the entire back cover of the housing 300 is made of transparent material, i.e., the entire back cover is a transparent area 310. Making the entire back cover into the transparent area 310 not only facilitates processing and manufacturing, but also allows multiple electronic components inside the electronic device 1000, such as the camera module 7 and the wireless charging module 5, to be visually displayed on the housing 300 through the transparent back cover (i.e., the transparent area 310). This allows users to see various electronic components and their arrangement on the back of the electronic device 1000, which helps to enhance the technological feel and overall aesthetics of the electronic device 1000.

[0077] Preferably, in an embodiment of the invention, the light-emitting module 1 is disposed around a portion of the electronic components visually displayed on the housing 300. For example, in Figure 9 In the illustrated embodiment, both the camera module 7 and the wireless charging module 5 of the electronic device 1000 are visualized on the housing 300 through the transparent area 310, and each is surrounded by a light-emitting module 1. Thus, when the camera module 7 is used to take a picture, the control module of the electronic device 1000 can control the light-emitting module 1 around the camera module 7 to provide supplementary lighting, improving the picture quality and avoiding defects such as overexposure from the built-in flash of the electronic device 1000. Similarly, when the wireless charging module 5 is used to charge, the control module of the electronic device 1000 can control the light-emitting module 1 around the wireless charging module 5 to provide a prompt, indicating the current charging progress of the electronic device 1000. For example, the light-emitting module 1 may emit multiple light points, displaying different numbers of light points to indicate the charging progress.

[0078] In other embodiments, the electronic device 1000 may also provide multiple light-emitting modules 1 at different positions inside the housing 300, so that the multiple light-emitting modules 1 together form a preset pattern, which will not be elaborated further.

[0079] It is easy to understand that the light-emitting module 1 included in the electronic device 1000 can be the light-emitting module 1 described in any of the above embodiments. Therefore, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments. For a more specific description, please refer to the relevant content of the light-emitting module 1 in the foregoing embodiments, which will not be repeated here.

[0080] In the description of this invention, the terms "embodiment," "specific embodiment," "example," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0081] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A light-emitting module, characterized in that, include: The carrier circuit board has a through structure along its thickness direction; A plurality of light-emitting chips are packaged on one side of the carrier circuit board. Each light-emitting chip is used to emit light under the drive of the carrier circuit board. The packaging position of the light-emitting chip on the carrier circuit board is offset from the opening position of the through structure on the carrier circuit board. A filling dielectric layer is disposed on the carrier circuit board, the filling dielectric layer wraps around each of the light-emitting chips and at least covers the through structure, and the filling dielectric layer protrudes from the side of the carrier circuit board away from the reflective film; A reflective film is applied to the side of the filling dielectric layer away from the carrier circuit board. The reflective film reflects light emitted by the light-emitting chip and transmitted through the filling dielectric layer. The light reflected by the reflective film passes through the portion of the filling dielectric layer covering the through-structure and is emitted through the through-structure. A leveling medium layer covers the side of the carrier circuit board away from the reflective film. The leveling medium layer is spliced ​​with the filling medium layer that protrudes from the carrier circuit board, and the surface of the filling medium layer that protrudes from the carrier circuit board away from the reflective film is flush with the surface of the leveling medium layer away from the reflective film.

2. The light-emitting module as described in claim 1, characterized in that, The filling medium layer is a transparent adhesive layer, and the reflective film is a colored reflective film. The light emitted by the light-emitting chip has a first color, the colored reflective film has a second color, and the colored reflective film is used to convert the color of the light emitted by the light-emitting chip into a predetermined third color.

3. The light-emitting module as described in claim 1, characterized in that, The filling medium layer is a light conversion medium layer, and the reflective film is a mirror reflective film. The light emitted by the light-emitting chip has a first color, the light conversion medium layer has a second color, and the light conversion medium layer is used to convert the color of the light emitted by the light-emitting chip into a predetermined third color.

4. The light-emitting module as described in claim 1, characterized in that, The surface of the filling medium layer protruding from the carrier circuit board on the side away from the reflective film is parallel to the surface of the carrier circuit board on the side away from the reflective film.

5. The light-emitting module as described in claim 1, characterized in that, It also includes a decorative film disposed on the side of the carrier circuit board away from the reflective film, the decorative film at least covering the portion of the filling medium layer exposed through the through structure on the side surface away from the reflective film.

6. The light-emitting module as described in claim 5, characterized in that, The decorative film covers the entire surface of the carrier circuit board on the side away from the reflective film.

7. The light-emitting module as described in claim 5 or 6, characterized in that, The decorative film includes a film body and a decorative layer disposed on the film body. The decorative layer includes at least one of a translucent colored ink layer, a uniform ink layer, and a texture layer.

8. The light-emitting module as described in claim 1, characterized in that, The through structure includes at least one through hole and / or at least one through groove.

9. The light-emitting module as described in claim 1, characterized in that, The reflectivity of the reflective film is greater than or equal to 90%.

10. An electronic device, characterized in that, The device includes a housing and a light-emitting module as described in any one of claims 1 to 9, wherein the housing has a transparent area, the light-emitting module is disposed on the inner side of the housing, and the light-emitting module is visualized on the housing through the transparent area.

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