Temperature control system, temperature control method, and image sensor testing apparatus having the same

Abstract

The present application relates to a temperature control system, a temperature control method and an image sensor testing apparatus with the system, which mainly comprises the following means: firstly, a plurality of test pieces are regulated to a specific temperature in a temperature control area; then, the plurality of test pieces are moved to a testing base and respectively placed in a plurality of test slots; a temperature sensing component in each test slot respectively measures the temperature of the test piece; when a temperature sensing component senses that the test piece in the test slot corresponding to the temperature sensing component does not conform to the specific temperature, a temperature control component corresponding to the test slot regulates the temperature of the test piece. Accordingly, the temperature of the plurality of test pieces is regulated in batches by using the temperature control area, and before or during the test, the temperature of the test piece can be individually sensed and compensated, thereby improving the test efficiency and accuracy.

Description

TECHNICAL FIELD

[0001] The present application relates to a temperature control system, a temperature control method and an image sensor testing apparatus with the system, in particular to a system and a method for regulating the temperature of electronic components before and during testing, and an image sensor testing apparatus using the system or the method. BACKGROUND

[0002] In order to understand the operation of electronic components at high or low temperatures, high and low temperature tests are usually performed before the product is shipped or packaged. For example, high temperature testing, the temperature of the electronic component is first raised to a certain temperature and then testing is started. The common method is to directly raise the temperature in the test station and perform the test. However, when using this method, the idle time of the test module is too long because the temperature of the electronic component must be raised. Moreover, repeated large temperature rises and drops can easily cause circuit or mechanism failures for the test equipment, significantly affecting the service life.

[0003] Another way is to first place the electronic component in a preheating area for temperature rise, and then move it to the test station for testing after the electronic component reaches a certain temperature. However, this method is difficult to accurately maintain the temperature of each electronic component because the temperature of some electronic components may drop significantly during batch transfer or even during batch testing, thereby affecting the accuracy of the test.

[0004] For related background art, please refer to Taiwan Patent No. I502206 "Image sensing electronic component testing device and testing apparatus using the same", which discloses moving the test piece into a sealed chamber and delivering temperature control fluid (cold source) into the sealed chamber through multiple delivery pipelines to regulate the temperature of the test piece. Moreover, a vacuum extraction structure must be additionally provided to prevent condensation in the chamber.

[0005] From the above background art, it can be seen that a single test device can only test a single test piece and cannot be batch tested, which is inefficient. Moreover, the structure of the test device is complex, bulky, and has high installation and maintenance costs. Therefore, a temperature control system, a temperature control method, and a testing apparatus that can batch test electronic components and independently control or compensate the temperature of individual test electronic components to accurately regulate or maintain the temperature of each test electronic component and effectively improve test accuracy and efficiency are highly desired by the industry and the public. SUMMARY

[0006] The main purpose of the present application is to provide a temperature control system, a temperature control method and an image sensor testing apparatus with the system, which can batch test electronic components, especially image sensors, and independently control or compensate the temperature of individual test electronic components, accurately regulate or maintain the temperature of each test electronic component, and effectively improve test accuracy and efficiency.

[0007] To achieve the above object, the present application provides a temperature control method, which mainly comprises the following steps: first, a plurality of test objects are regulated to a specific temperature in a temperature control area; then, the plurality of test objects are moved to a test base and are respectively placed in a plurality of test slots; the test base comprises a plurality of temperature sensing components and a plurality of temperature control components, and each test slot is provided with a temperature sensing component and a temperature control component; in addition, the plurality of temperature sensing components respectively measure the temperature of the plurality of test objects in the plurality of test slots; when the plurality of temperature sensing components sense that the test object in the test slot corresponding thereto does not conform to the specific temperature, the temperature control component corresponding to the test slot regulates the temperature of the test object.

[0008] Overall, in the method provided by the present application, the temperature of the plurality of test objects is first regulated in batches by using the temperature control area, thereby greatly saving the test idle time of the test objects directly heated or cooled in the test slots, so as to improve the test efficiency of the machine. Before or during the test, the temperature of each test object can be individually sensed, and once it is found that the temperature of a test object does not conform to the default specific temperature, the temperature of the test object can be independently compensated to maintain the consistency of the test temperature of all test objects, thereby improving the test accuracy.

[0009] To achieve the above object, the present application provides a temperature control system, which mainly comprises a temperature control area, a test base, a plurality of temperature sensing components, a plurality of temperature control components and a controller; the temperature control area is used to regulate the temperature of a plurality of test objects to a specific temperature; the test base comprises a plurality of test slots, and the plurality of test slots are respectively used to accommodate a plurality of test objects; the plurality of temperature sensing components are arranged on the test base and respectively correspond to the plurality of test slots, and the plurality of temperature sensing components are respectively used to measure the temperature of the plurality of test objects; the plurality of temperature control components are arranged on the test base and respectively correspond to the plurality of test slots, and the plurality of temperature control components are used to regulate the temperature of the plurality of test objects; the controller is electrically connected to the test base, the plurality of temperature sensing components and the plurality of temperature control components; when the plurality of temperature sensing components sense that the test object in the test slot corresponding thereto does not conform to the specific temperature, the controller controls the temperature control component corresponding to the test slot to regulate the temperature of the test object.

[0010] In other words, in the temperature control system of the present application, the temperature of the test objects is first regulated in the temperature control area until the temperature of the test objects approaches, exceeds or equals the test temperature (specific temperature), and then the test objects are batched and moved to the test base, and the controller controls the temperature sensing components to individually sense the temperature of each test object. When the temperature of one or more test objects does not meet the test temperature, the controller controls the corresponding temperature control components to compensate the temperature of the test objects, so that the temperature of all test objects is maintained at the test temperature, and the test result error caused by the temperature difference is avoided. Moreover, because the test objects have been first regulated in the temperature control area, the temperature of the test objects is usually not much different from the test temperature when the test objects are moved to the test base, and if temperature compensation is needed, the default temperature can be quickly reached, so the waiting time of the test equipment is significantly shortened, and the test efficiency is improved.

[0011] To achieve the above-mentioned purpose, the present application provides a test equipment for image sensors, which comprises the temperature control system as described above and a pressing head, and the pressing head is electrically connected to the controller; and the controller controls the pressing head to selectively approach or move away from the test base to press against the test objects. Moreover, the pressing head can comprise a plurality of light emitting units and a plurality of light guide channels, one end of each of the light guide channels is connected to one of the light emitting units, and the other end of each of the light guide channels corresponds to one of the test slots. In addition, the pressing head can further comprise a negative pressure channel, one end of the negative pressure channel is connected to the light guide channels, and the other end of the negative pressure channel is connected to a negative pressure source. In this way, the light guide channels can not only guide light, but also form negative pressure to adsorb and take the test objects.

[0012] In addition, the temperature control system of the present application can further comprise a plurality of pressing head temperature control units, which can be arranged in the pressing head and electrically connected to the controller; and each of the pressing head temperature control units corresponds to one of the test slots. Accordingly, when the temperature sensing components sense that the temperature of the test objects in the test slots does not meet the specific temperature, the controller can also control the pressing head temperature control units corresponding to the test slots to regulate the temperature of the test objects. In other words, the temperature control system of the present application can simultaneously use the temperature control components in the test base and the pressing head temperature control units in the pressing head to compensate the temperature of the test objects, so as to create a complete temperature control environment, and the test objects can be immersed in the high-temperature or low-temperature temperature control environment, so as to accelerate the temperature rise or fall, and further improve the test efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0013] Figure 1 is a schematic diagram of the module configuration of the preferred embodiment of the test equipment of the present application.

[0014] Figure 2 is a system architecture diagram of the preferred embodiment of the temperature control system of the present application.

[0015] Figure 3is a perspective view of a preferred embodiment of the test object carrier of the present invention.

[0016] Figure 4 is a perspective view of a preferred embodiment of the crimping head of the present invention.

[0017] Figure 5A is a cross-sectional view of the crimping head and the test base during testing of the present invention.

[0018] Figure 5B is an enlarged cross-sectional view of the crimping head and the test base during testing of the present invention. DETAILED DESCRIPTION

[0019] Before the temperature control system, the temperature control method and the image sensor testing apparatus of the present invention are described in detail in the present embodiment, it is to be noted that similar components will be denoted by the same reference numerals in the following description. Furthermore, the drawings of the present invention are merely illustrative and are not necessarily drawn to scale, and all details are not necessarily shown in the drawings.

[0020] Please refer to Figure 1 and Figure 2 , Figure 1 is a schematic diagram of the module configuration of a preferred embodiment of the testing apparatus of the present invention, Figure 2 is a system architecture diagram of a preferred embodiment of the temperature control system of the present invention. The testing apparatus of an image sensor is described as an embodiment below, but the present invention is not limited to image sensors, and can be applied to testing apparatuses that need temperature control, such as high-temperature testing or low-temperature testing.

[0021] As shown in Figure 1 , the testing apparatus of the present embodiment mainly includes an in-feed area In, an empty tray area E, an out-feed area Out, a temperature control area 1, two test object carriers 6 and a testing area 20. The in-feed area In is used to load test objects that have not yet been tested. The empty tray area E is used to load empty chip trays, that is, when the test objects on the chip trays (not shown in the figure) in the in-feed area are all moved, the empty chip trays will be moved from the in-feed area In to the empty tray area E. The out-feed area Out is used to load test objects that have been tested.

[0022] Furthermore, the temperature control area 1 of the present embodiment includes a low-temperature preheating area 12 and a high-temperature preheating area 13. The low-temperature preheating area 12 and the high-temperature preheating area 13 of the present embodiment each include a temperature regulating disc 11, which is respectively used to raise the temperature of the test objects to a first specific high temperature (for example, 60°C) and a second specific high temperature (for example, 120°C). It needs to be particularly pointed out that in the present embodiment, the temperature set by the temperature regulating disc 11 is usually greater than or equal to the specific temperature.

[0023] In addition, please refer toFigure 3 Fig. 2 is a perspective view of a preferred embodiment of the test piece carrying device 6 of the present application; two test piece carrying devices 6 are respectively used for feeding and discharging the test pieces into and out of the test area 20, and are arranged on the two sides of the test area 20. In this embodiment, feeding refers to moving the test pieces from the temperature control area 1 to the test area 20, and discharging refers to moving the test pieces from the test area 20 to the discharge area Out. As shown in the figure, each test piece carrying device 6 includes eight chip seats 60, and each chip seat 60 includes four chip slots 61; that is, the test piece carrying device 6 of this embodiment can carry 32 test pieces at a time. In addition, a temperature control module 62 is arranged in the chip seat 60, which can be used to heat, cool or maintain the temperature of the test pieces during the carrying process.

[0024] Please refer to Figure 4 、 Figure 5A and Figure 5B , Figure 4 Fig. 3 is a perspective view of a preferred embodiment of the crimping joint of the present application, Figure 5A Fig. 4 is a cross-sectional view of the crimping joint and the test base during testing, Figure 5B Fig. 5 is an enlarged exploded view of the cross section of the crimping joint and the test base during testing. The test area 20 of this embodiment mainly includes the test base 2 and the crimping joint 7, which is arranged above the test base 2 and can be controlled to approach the test base 2 to press against the test piece C or move away from the test base 2.

[0025] In this embodiment, the test area 20 includes eight test bases 2, and each test base 2 includes four test slots 21 for accommodating the test piece C. In addition, a temperature sensing component 3 and a temperature control component 4 are arranged correspondingly in each test slot 21; the temperature sensing component 3 is used to measure the temperature of the test piece C, and the temperature control component 4 is used to regulate the temperature of the test piece C.

[0026] In addition, as shown in Figure 2 , this embodiment includes a controller 5, which can be applied in a digital system or cloud platform such as a personal computer (PC), a notebook computer, an industrial computer (IPC), or a cloud server, or installed in the above-mentioned computer devices in the form of a software program, so that the user can operate the computer device to automatically execute the operation of the entire test device including temperature regulation. In this embodiment, the controller 5 is electrically connected to the temperature control area 1, the test base 2, the test piece carrying device 6, and the crimping joint 7.

[0027] As shown in Figure 4 、 Figure 5A and Figure 5BAs shown, the crimping head 7 of the present embodiment comprises a lifting arm 70 and eight crimping blocks 75, which are arranged on the lifting arm 70. The lifting arm 70 can be controlled to lower to approach the test base 2 to press the test piece C against the crimping blocks 75 or to raise to move away from the test base 2, for example, by a motor and a screw rod. In addition, the crimping blocks 75 comprise four light emitting units 71 and four light guide channels 72. One end of each light guide channel 72 is connected to one light emitting unit 71, and the other end corresponds to the test slot 21, respectively. Furthermore, a lens unit 76 is arranged in each light guide channel 72, which mainly serves as a light diffusion purpose, so that the light emitted by the light emitting unit 71 can be diffused uniformly in the light guide channel 72.

[0028] In addition, four crimping head temperature control units 74 are arranged in the crimping blocks 75 of the present embodiment, which are electrically connected to the controller 5, and each crimping head temperature control unit 74 corresponds to the test slot 21. In addition, in the present embodiment, a negative pressure channel 73 is arranged in each crimping block 75, one end of which is connected to the light guide channel 72, and the other end is connected to the negative pressure source Vs. That is, by means of the negative pressure channel 73, the light guide channel 72 can form a negative pressure, and the opening 77 of the light guide channel 72 can adsorb the test piece C and perform the work of taking and placing the test piece C.

[0029] The overall operation process and temperature control method of the test equipment of the present embodiment will be described below, please refer to Figures 1 to 5B ; first, the test piece C located in the feeding area In is moved by the feeding and placing device 81 to the temperature control area 1 and placed on the temperature control disc 11 of the low-temperature preheating area 12. Then, after the test piece C in the low-temperature preheating area 12 is adjusted to a specific temperature (for example, 60°C), the feeding and placing device 81 moves it to the test piece carrying device 6, and the test piece carrying device 6 moves the test piece C into the test area 20.

[0030] It is worth mentioning that the test piece carrying device 6 of the present embodiment can still maintain the temperature of the test piece C during the moving process by moving the temperature control module 62, and even warm up the test piece C. In addition, the chip slot 61 is provided with an adsorption hole 63 (see Figure 3 ) connected to a negative pressure source (not shown in the figure), which is used to adsorb and fix the test piece C so that it does not jump out of the chip slot 61 during the moving process. Moreover, in the present embodiment, the chip slot 61 is also provided with a pressure sensing component (not shown in the figure) to detect the pressure (negative pressure) in the chip slot 61, which is used to determine whether the test piece C is completely placed in the chip slot 61; because if the pressure in the chip slot 61 is abnormal, it means that the test piece C is not completely placed in the chip slot 61, and the controller 5 controls the feeding and placing device 81 to take and place the test piece C again.

[0031] Furthermore, after the test object carrier 6 moves the test object C into the test area 20, the compression head 7 is controlled to approach the test object carrier 6 and adsorbs the test object C through the opening 77 of the light guide channel 72; thereafter, the test object carrier 6 moves out of the test area, and the compression head 7 is controlled to place the test object C into the test slot 21; at this time, the compression block 75 still continuously presses against the test object C.

[0032] Next, the temperature sensing assembly 3 of each test slot 21 respectively measures the temperature of the test object C in the slot and returns the measurement result to the controller 5. However, when the temperature sensing assembly 3 senses that the temperature of the test object C in the test slot 21 corresponding thereto does not conform to a specific temperature, the controller 5 controls the temperature control assembly 4 corresponding to the test slot 21 and the compression head temperature control unit 74 in the compression block 75 to simultaneously perform temperature regulation on the test object C, which can be temperature increase or temperature decrease.

[0033] In this process, the temperature sensing assembly 3 continuously measures the temperature, and when the measured temperature reaches the test temperature (specific temperature), the controller stops the operation of the temperature control assembly 4 and the compression head temperature control unit 74 and controls to start the test.

[0034] Once the test is completed, the compression head 7 directly adsorbs the test object C and rises, at this time, another test object carrier 6 moves into the test area 20, the compression head 7 descends and places the test object C into the test object carrier 6; thereafter, the test object carrier 6 moves out of the test area, and the discharge and taking device 82 places the test object C that has completed the test into the corresponding discharge area Out according to the test result.

[0035] It should be particularly pointed out that the temperature control assembly, temperature control unit, temperature control module and temperature regulation disc mentioned in the embodiment can adopt, but not limited to, an electric heating generation unit, a circulating pipeline module of cold and hot temperature control fluid, a thermoelectric cooling chip, or other equivalent components, devices or modules that can provide temperature regulation.

[0036] From the above, it can be seen that the embodiment at least has the following unexpected effects:

[0037] First, the temperature of the plurality of test objects C is regulated in batches by using the temperature control area 1, thereby the idle time of the test objects for temperature increase or decrease in the test slot 21 can be greatly saved, so as to improve the test efficiency of the machine;

[0038] Batch transfer, 32 test objects C can be transferred by the test object carrier 6 at a time; and in the transfer process, the transfer temperature control module 62 is used to maintain the temperature of the test objects C, or even increase or decrease the temperature of the test objects C;

[0039] Batch testing, 32 test pieces C can be tested at a time; and, before or during testing, temperature sensing can be performed on each test piece C individually, and once a test piece C is found to have a temperature that does not meet the default specific temperature, temperature compensation can be performed on the test piece C independently to maintain the consistency of the test temperature of all test pieces C, thereby improving the testing accuracy;

[0040] At the same time, the temperature of the test piece C that does not meet the test temperature is regulated by the temperature control assembly 4 of the test slot 21 and the pressure contact temperature control unit 74 in the pressure contact block 75, a complete temperature control environment is created, the test piece C is immersed in a high-temperature or low-temperature temperature control environment, the temperature rising or falling is accelerated, and the test efficiency is further improved;

[0041] The light guide channel of the pressure contact can not only be used for guiding light, but also can form a negative pressure to adsorb, pick and place the test piece C.

[0042] The above embodiments are only examples for convenience of illustration, and the scope of the claimed rights of the present application should be described in the scope of the claims, not limited to the above embodiments.

[0043] Explanation of reference numerals

[0044] 1: temperature control area

[0045] 2: test base

[0046] 3: temperature sensing assembly

[0047] 4: temperature control assembly

[0048] 5: controller

[0049] 6: test piece carrying device

[0050] 7: pressure contact

[0051] 11: temperature regulation disc

[0052] 12: low-temperature preheating area

[0053] 13: high-temperature preheating area

[0054] 20: test area

[0055] 21: test slot

[0056] 60: chip seat

[0057] 61: chip slot

[0058] 62: transfer temperature control module

[0059] 63: adsorption hole

[0060] 70: lifting arm

[0061] 71: light emitting unit

[0062] 72: light guide channel

[0063] 73: negative pressure channel

[0064] 74: crimping head temperature control unit

[0065] 75: crimping block

[0066] 76: lens unit

[0067] 77: opening

[0068] 81: in-feed pick-and-place device

[0069] 82: out-feed pick-and-place device

[0070] C: piece to be tested

[0071] E: empty area

[0072] In: in-feed area

[0073] Out: out-feed area

[0074] Vs: negative pressure source

Claims

1. A temperature control method comprising the steps of: (A). regulating a plurality of test pieces to a specific temperature in a temperature control area; (B). transferring the plurality of test pieces to a test base and placing the plurality of test pieces in a plurality of test slots respectively, wherein the test base comprises a plurality of temperature sensing components and a plurality of temperature control components, and each test slot is provided with a temperature sensing component and a temperature control component respectively; (C). measuring the temperature of the plurality of test pieces in the plurality of test slots by the plurality of temperature sensing components respectively, and when the plurality of temperature sensing components sense that the test piece in the test slot corresponding to the temperature sensing component does not meet the specific temperature, the temperature control component corresponding to the test slot controls the temperature of the test piece; wherein in the step (B), the plurality of test pieces are transferred to the test base by a test piece transfer device, and the test piece transfer device comprises a transfer temperature control module for regulating or maintaining the temperature of the test pieces. In the step (A), the temperature control area comprises a temperature control plate, and the temperature of the temperature control plate is greater than or equal to the specific temperature.

2. The temperature control method of claim 1, wherein, 3.A temperature control system comprising: a temperature control area for regulating the temperature of a plurality of test pieces to a specific temperature; a test base comprising a plurality of test slots for accommodating the plurality of test pieces respectively; a plurality of temperature sensing components provided on the test base and corresponding to the plurality of test slots respectively, wherein the plurality of temperature sensing components are used for measuring the temperature of the plurality of test pieces respectively; a plurality of temperature control components provided on the test base and corresponding to the plurality of test slots respectively, wherein the plurality of temperature control components are used for regulating the temperature of the plurality of test pieces respectively; a test piece transfer device for transferring the plurality of test pieces from the temperature control area to the test base, wherein the test piece transfer device comprises a transfer temperature control module for regulating or maintaining the temperature of the plurality of test pieces during the transferring process; a controller electrically connected to the test base, the plurality of temperature sensing components and the plurality of temperature control components; wherein when the plurality of temperature sensing components sense that the test piece in the test slot corresponding to the temperature sensing component does not meet the specific temperature, the controller controls the temperature control component corresponding to the test slot to regulate the temperature of the test piece. The temperature control area comprises a temperature control plate electrically connected to the controller, and the controller controls the temperature of the temperature control plate to be greater than or equal to the specific temperature.

4. The temperature control system of claim 3, wherein, 5.A test device for image sensors comprising: the temperature control system according to any one of claims 3-4; and a pressure head electrically connected to the controller; the controller controls the pressure head to approach the test base to press against the plurality of test pieces or to move away from the test base. The pressure head comprises a plurality of light emitting units and a plurality of light guide channels, one end of each light guide channel is connected to the plurality of light emitting units respectively, and the other end of each light guide channel corresponds to the plurality of test slots respectively. The pressure head further comprises a negative pressure channel, one end of the negative pressure channel is connected to the plurality of light guide channels, and the other end of the negative pressure channel is connected to a negative pressure source.

6. The test apparatus for image sensors of claim 5, wherein, ​ 7. The test apparatus for image sensors of claim 6, wherein, ​ 8. The test apparatus for image sensors of claim 5, wherein, The temperature control system further comprises a plurality of crimping head temperature control units arranged in the crimping head and electrically connected to the controller; the plurality of crimping head temperature control units correspond to the plurality of test slots respectively; when the plurality of temperature sensing components sense that the plurality of test pieces in the plurality of test slots corresponding to the plurality of crimping head temperature control units do not meet the specific temperature, the controller controls the plurality of crimping head temperature control units corresponding to the plurality of test slots to regulate the temperature of the plurality of test pieces.

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