A transparent LED display

Abstract

The application provides a transparent LED display screen, comprising a transparent substrate and a light-emitting component; a circuit pattern is arranged on the transparent substrate; the light-emitting component is arranged in an array on the transparent substrate; the light-emitting component comprises a driving chip and a light-emitting wafer arranged separately; the circuit pattern comprises a power supply pad, a power supply circuit and a switching circuit; the switching circuit comprises a switching jumper and a switching pad arranged on both sides of the driving chip; the driving chip comprises a pair of power supply pins and a plurality of color control pins; the pair of power supply pins are divided into a first power supply pin and a second power supply pin; the first power supply pin and the second power supply pin on each light-emitting component are respectively connected to the switching pads on both sides of the driving chip through power supply jumpers; the light-emitting wafer is arranged on a switching pad, and the light-emitting wafer is connected to the color control pins on the driving chip. By using the application, the pixel pitch can be effectively reduced, the resolution can be effectively improved, and the transparency of the transparent LED display screen can be further improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of LED display, especially to the field of transparent LED display. BACKGROUND

[0002] Transparent LED display screen is gradually widely used in the market, and various product forms are developed. A transparent LED display screen technology of arraying LED lamp beads on a transparent substrate begins to appear. The existing transparent LED display screen is shown in the scheme Figure 1 、 Figure 2 , which comprises a transparent substrate 1', a printed circuit layer 3' provided on the transparent substrate 1', and LED lamp beads 2' with encapsulated driving chips arrayed on the transparent substrate 1'. Then a glue filling layer 5' is formed by filling glue on the surface of the transparent substrate 1' on which the LED lamp beads 2' are arranged. Then a protective cover plate 4' is covered on the surface of the glue filling layer 5'. The LED lamp beads 2' adopt the power supply circuit 6' shown in the figure to be directly connected to the electrode pin pad of the lamp bead welding area for power supply, wherein the power supply circuit 6' is divided into a positive power supply circuit 6a' and a negative power supply circuit 6b'. One positive power supply circuit 6a' and one negative power supply circuit 6b' are arranged on both sides of each column of LED lamp beads. And the LED lamp beads 2' are connected in series through the signal circuit 7' shown in the figure. The design of the power supply circuit 6' and the signal circuit 7' also reduces the transparency of the transparent LED display screen.

[0003] As shown in Figure 3 , the LED lamp beads 2' thereon are LED lamp beads 2' with encapsulated driving chips 21'; the LED lamp beads 2' comprise a shell 22', a driving chip 21', and red, green, and blue light emitting chips 20'; a chip mounting surface is formed on the shell 22', and a pin 23' is led out from the chip mounting surface; the driving chip 21' is mounted on the shell 22'; and the light emitting chip 20' is mounted on the driving chip 21'. The transparent LED display screen made of the LED lamp beads 2' with encapsulated driving chips 21' has high transparency, but due to the size constraint of the LED lamp beads 2', the general smaller encapsulation size is also 2.0 mm x 2.0 mm, and when the LED lamp beads 2' are arrayed and arranged with a pixel pitch of 5 mm x 5 mm or less, the size of the LED lamp beads 2' is relatively large, which obviously blocks the line of sight, and the transparent effect is not very ideal due to the dense arrangement of the power supply circuit and the signal circuit. If the resolution and the transparency are to be continuously improved, there is still a space for technical breakthrough. SUMMARY

[0004] In order to overcome the problems of low resolution and poor transparent effect of the transparent LED display screen with arrayed LED lamp beads in the prior art, the present application provides a transparent LED display screen.

[0005] The present application provides a transparent LED display screen, comprising a transparent substrate and a light-emitting component; a circuit pattern is arranged on the transparent substrate; the light-emitting component is arranged in an array on the transparent substrate; the light-emitting component comprises a driving chip and a light-emitting wafer arranged separately;

[0006] The circuit pattern comprises a power supply pad, a power supply circuit and a switching circuit; the power supply circuit comprises a plurality of first power supply circuits and second power supply circuits with opposite polarities; the power supply pad is connected to the first power supply circuit and the second power supply circuit; the switching circuit comprises a switching jumper and a switching pad arranged on both sides of the driving chip; the switching pad is directly or indirectly connected to the first power supply circuit and the second power supply circuit through the switching jumper;

[0007] The driving chip comprises a pair of power supply pins and a plurality of color control pins; the pair of power supply pins are divided into a first power supply pin and a second power supply pin;

[0008] The first power supply pin and the second power supply pin on each light-emitting component are respectively connected to the switching pad on both sides of the driving chip through a power supply jumper;

[0009] The light-emitting wafer is arranged on one of the switching pads, and the light-emitting wafer is connected to the color control pin on the driving chip.

[0010] Further, the circuit pattern further comprises a signal pad, and the driving chip further comprises a pair of signal pins; the pair of signal pins are divided into a first signal pin and a second signal pin; one of the first signal pin and the second signal pin is an input signal pin, and the other of the first signal pin and the second signal pin is an output signal pin;

[0011] The driving chip of the light-emitting component is connected to the signal pad or the driving chip of the light-emitting component in front of or behind it through a signal jumper, so as to realize the series connection of the light-emitting components and form a light bead string; so that the control signal for controlling the light-emitting components can be input from the signal pad through the signal jumper and transmitted in turn through the series-connected light-emitting components.

[0012] Further, one of the first power supply pins is arranged on one side edge of the driving chip, and the other of the second power supply pins is arranged on the other side edge.

[0013] Further, the driving chip is connected to the transparent substrate by COG.

[0014] Further, the light-emitting wafer is mounted on the switching pad by CSP or COC.

[0015] Further, the adapter pads include a first adapter pad and a second adapter pad; the first adapter pad is located on one side of the driving chip, and the first adapter pad is directly or indirectly electrically connected with the first power supply circuit through the adapter jumper; the second adapter pad is located on the other side of the driving chip, and the second adapter pad is directly or indirectly electrically connected with the second power supply circuit through the adapter jumper.

[0016] The light-emitting wafer is mounted on the second adapter pad.

[0017] Further, the light-emitting assembly further includes a light-emitting PCB board; the driving chip and the second adapter pad are arranged on the light-emitting PCB board; and the light-emitting PCB board is mounted on the transparent substrate.

[0018] Further, the driving chip further includes a pair of short-circuit pins, the pair of short-circuit pins are divided into a short-circuit pin for input signal and a short-circuit pin for output signal; the pair of short-circuit pins are short-circuited inside the driving chip, so that the control signal is directly transmitted between the pair of short-circuit pins without passing through the circuit inside the driving chip.

[0019] Further, each of the lamp bead strings is provided with two signal pads, respectively referred to as a first signal pad and a second signal pad.

[0020] In the lamp bead string, the signal pin for input signal of the first light-emitting assembly is connected to the first signal pad, and the short-circuit pin for input signal of the first light-emitting assembly is connected to the second signal pad.

[0021] Alternatively, the signal pin for input signal of the first light-emitting assembly is connected to the second signal pad, and the short-circuit pin for input signal of the first light-emitting assembly is connected to the first signal pad.

[0022] The signal pin for input signal of each of the remaining light-emitting assemblies is connected to the short-circuit pin for output signal of the previous light-emitting assembly, and the short-circuit pin for input signal of each of the light-emitting assemblies is connected to the signal pin for output signal of the previous light-emitting assembly; the signal pin for output signal of each of the light-emitting assemblies is connected to the short-circuit pin for input signal of the next light-emitting assembly, and the short-circuit pin for output signal of each of the light-emitting assemblies is connected to the signal pin for input signal of the next light-emitting assembly.

[0023] Further, the power supply circuit comprises a plurality of the first power supply circuit and the second power supply circuit arranged in rows or columns; a plurality of the light emitting components are arranged between the first power supply circuit and the second power supply circuit; the first power supply circuit and the second power supply circuit are shared by the plurality of the light emitting components arranged in rows or columns.

[0024] Further, the power supply circuit is a conductive grid, an ITO conductive film or a nano-silver film.

[0025] Further, the light emitting component is adhered to the conductive grid by an insulation die bonding method.

[0026] Further, a transparent substrate on which the light emitting component is arranged is provided with a glue filling layer, the glue filling layer encapsulates the light emitting component; an upper surface of the glue filling layer is provided with a protective cover plate.

[0027] Further, the transparent substrate is provided with a plurality of transparent unit plates; the light emitting component is arranged on the transparent unit plate; metal strips are arranged on both sides of the transparent unit plate as the power supply circuit; the light emitting component on the transparent unit plate is connected to the power supply circuit.

[0028] Further, the adapter pad is mounted on the transparent substrate or the conductive grid by an insulation die bonding method.

[0029] By removing the shell of the existing LED lamp bead, only the driving chip and the light emitting wafer arranged in a split manner are reserved, the light emitting component is arranged on one adapter pad to form a light emitting component without a shell, the light emitting component is arranged on the transparent substrate to replace the existing LED lamp bead array, and the size of the light emitting component can be as small as 0.5mm x 1mm, which is smaller than the size of the LED lamp bead. Therefore, the pixel pitch can be effectively reduced, and the resolution can be greatly improved. A transparent LED display screen with a pitch smaller than 3mm x 3mm can be made, and even under the condition of a high-density pixel pitch of 2mm x 2mm, the transparency can reach more than 80% according to calculation, and the transparent effect is very obvious. The power supply and signal transmission are realized by the jumper binding method, the binding wire with a small diameter is selected, the conductive material is reduced to block the line of sight under the condition of ensuring the power supply and signal transmission of the light emitting component, so as to further improve the transparency of the transparent LED display screen. Meanwhile, a pair of power supply pins and a plurality of color control pins are arranged on the driving chip of the light emitting component, and the adapter pad is arranged on the circuit pattern, the adapter pad is bound and connected to the power supply pin, and in this way, each light emitting component can independently take power from the power supply circuit through the adapter circuit, and the overall stability of the product is improved. BRIEF DESCRIPTION OF DRAWINGS

[0030] Figure 1 This is a cross-sectional schematic diagram of a transparent LED display screen disclosed in the prior art;

[0031] Figure 2 This is a top view schematic diagram of a transparent LED display screen disclosed in the prior art;

[0032] Figure 3 This is a schematic diagram of an LED lamp bead disclosed in the prior art;

[0033] Figure 4 A top view of a transparent LED display screen is provided in the specific embodiments of this application.

[0034] Figure 5 This is provided in the specific embodiments of this application. Figure 4 A partial cross-sectional view of a transparent LED display screen;

[0035] Figure 6 This is a three-dimensional schematic diagram of the driver chip provided in a specific embodiment of this application;

[0036] Figure 7 This is a top view schematic diagram of the driver chip provided in a specific embodiment of this application;

[0037] Figure 8 yes Figure 4 Enlarged view of point A in the middle;

[0038] Figure 9 This is a top view schematic diagram of a further preferred light-emitting component provided in a specific embodiment of this application;

[0039] Figure 10 This is a specific embodiment of the present application. Figure 9 A further extension of the transparent LED display screen;

[0040] Figure 11 This is provided in the specific embodiments of this application. Figure 9 A three-dimensional schematic diagram of the driver chip in the diagram;

[0041] Figure 12 This is another arrangement provided in the specific embodiments of this application. Figure 11 A top view of a transparent LED display screen with a central light-emitting component;

[0042] Figure 13 This is another setting provided in the specific embodiments of this application. Figure 11 A top view of a transparent LED display screen with a central light-emitting component;

[0043] Figure 14 yes Figure 13a partial sectional view of the transparent LED display screen in the embodiment of the present application is shown in Fig. 1;

[0044] Figure 15 a top view of another further improved transparent LED display screen provided in the embodiment of the present application is shown in Fig. 2;

[0045] Figure 16 a schematic view of another preferred light emitting assembly provided in the embodiment of the present application is shown in Fig. 3.

[0046] In the background art, the reference signs are as follows: 1', transparent substrate; 2', LED lamp bead; 3', printed circuit layer; 4', protective cover plate; 5', glue filling layer; 6', power supply circuit; 7', signal circuit; 6a', positive power supply circuit; 6b', positive power supply circuit; 20', light emitting wafer; 21', driving chip; 22', shell; 23', pin;

[0047] In the embodiment, the reference signs are as follows: 1, transparent substrate; 2, light emitting assembly; 3, circuit pattern; 4, protective cover plate; 5, glue filling layer; 6, transparent unit plate; 20, light emitting wafer; 21, driving chip; 22, light emitting PCB plate; 20r, red light emitting wafer; 20g, green light emitting wafer; 20b, blue light emitting wafer; 211, signal pin; 212, first power supply pin; 213, second power supply pin; 214, shorting pin; 215, color control pin; 215r, red control pin; 215g, green control pin; 215b, blue control pin; 31, power supply circuit; 31a, first power supply circuit; 31b, second power supply circuit; 32, signal circuit; 33, signal pad; 311, power supply jumper; 312, adapter pad; 313, adapter jumper; 312a, first adapter pad; 312b, second adapter pad; 321, signal jumper; 331, first signal pad; 332, second signal pad. EMBODIMENT

[0048] In order to make the technical problems solved by the present application, technical solutions and beneficial effects more clearly understood, the present application will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and not used to limit the present application.

[0049] In the description of the present application, it is to be understood by those skilled in the art that the orientation or positional relationship indicated by the terms "longitudinal", "radial", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise specified.

[0050] In the description of the present application, it should be noted that, unless otherwise specified and limited, the terms "mounting", "connection", "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0051] Embodiment

[0052] The present application will be specifically explained and described as follows: Figure 4 , Figure 5 As shown in Figure 6 , Figure 7 The light-emitting component 2 includes a driving chip 21 and a light-emitting wafer 20 arranged separately; the light-emitting component 2 in the present application cancels the packaging shell (English name: housing, Chinese also named as support or base) on the basis of the traditional LED lamp bead. The light-emitting wafer 20 and the driving chip 21 are arranged separately, without the need for packaging, but directly using the light-emitting wafer 20 and the driving chip 21 as the light-emitting structure to replace the traditional LED lamp bead with the shell. In this way, not only the size of the light-emitting component 2 is reduced, but also the light-emitting wafer 20 and the driving chip 21 are arranged separately, which can control the product quality of the light-emitting wafer 20 and the driving chip 21 respectively, is conducive to controlling the stability of processing, and is also convenient for replacing either of the light-emitting wafer 20 and the driving chip 21 when any of them fails, without the need to replace the entire light-emitting component 2, thereby reducing the maintenance cost.

[0053] The size of the light-emitting component 2 ranges from 0.5mm x 1mm to 1mm x 2mm; which is smaller than the traditional LED lamp bead. Therefore, the resolution of the transparent LED display screen can be effectively improved.

[0054] Preferably, a glue-filling layer 5 is arranged on the transparent substrate 1 with the light-emitting components 2, and the glue-filling layer 5 encapsulates the light-emitting components 2; and a protective cover plate 4 is arranged on the upper surface of the glue-filling layer 5. The design of the glue-filling layer 5 and the protective cover plate 4 is known to those skilled in the art, and will not be described herein.

[0055] As shown in FIG. 1, the driving chip 21 includes a pair of signal pins 211, a pair of power supply pins, and a plurality of color control pins 215; the pair of signal pins 211 includes a first signal pin and a second signal pin; the pair of power supply pins includes a first power supply pin 212 and a second power supply pin 213. Figure 6 Figure 7 As shown in FIG. 1, the driving chip 21 includes a pair of signal pins 211, a pair of power supply pins, and a plurality of color control pins 215; the pair of signal pins 211 includes a first signal pin and a second signal pin; the pair of power supply pins includes a first power supply pin 212 and a second power supply pin 213.

[0056] Specifically, the driving chip 21 is known to the public, and generally has a driving circuit integrated inside the driving chip 21, and has a passivation layer arranged on the driving chip 21. The passivation layer is a surface insulating layer formed when the driving chip 21 is manufactured. The driving chip 21 has a plurality of pins arranged on the passivation layer. The pin (English name: PAD) is a terminal inside the chip. As shown in the figure, the driving chip 21 is divided into upper, lower, left, and right directions; as can be seen, the pair of signal pins 211 are arranged at the right upper corner and the left lower corner of the driving chip 21, respectively, and the pair of power supply pins are arranged at the left upper corner and the right lower corner, respectively.

[0057] As shown in FIG. 1, the driving chip 21 includes a pair of signal pins 211, a pair of power supply pins, and a plurality of color control pins 215; the pair of signal pins 211 includes a first signal pin and a second signal pin; the pair of power supply pins includes a first power supply pin 212 and a second power supply pin 213. Figure 8 Figure 9 As shown in FIG. 1, the driving chip 21 includes a pair of signal pins 211, a pair of power supply pins, and a plurality of color control pins 215; the pair of signal pins 211 includes a first signal pin and a second signal pin; the pair of power supply pins includes a first power supply pin 212 and a second power supply pin 213.

[0058] As shown in FIG. 1, the driving chip 21 includes a pair of signal pins 211, a pair of power supply pins, and a plurality of color control pins 215; the pair of signal pins 211 includes a first signal pin and a second signal pin; the pair of power supply pins includes a first power supply pin 212 and a second power supply pin 213.

[0059] ​​The light emitting chip 20 is arranged on a conversion pad 312, and the light emitting chip 20 is connected to the color control pin 215 on the driving chip 21 by binding; after the light emitting chip 20 is installed on the conversion pad 312, the light emitting chip 20 is installed on the transparent substrate 1 as a whole, so that the installation requirement is low, the installation can be realized by binding, and the process efficiency and the yield are improved.

[0060] In the example, as a preferred mode, the light emitting chip 20 includes red, green and blue light emitting chips 20, which are respectively referred to as a first light emitting chip, a second light emitting chip and a third light emitting chip; the first light emitting chip is a red light emitting chip 20r, the second light emitting chip is a green light emitting chip 20g, and the third light emitting chip is a blue light emitting chip 20b. Figure 8 As shown in FIG. 2, the red light emitting chip 20r, the green light emitting chip 20g and the blue light emitting chip 20b are sequentially installed on the conversion pad 312. The driving chip 21 includes three color control pins 215, which are respectively referred to as a first color control pin, a second color control pin and a third color control pin; the first color control pin is a red control pin 215r, the second color control pin is a green control pin 215g, and the third color control pin is a blue control pin 215b. Figure 8 As shown in FIG. 2, the red control pin 215r, the green control pin 215g and the blue control pin 215b are sequentially arranged on the driving chip 21, the red control pin 215r is connected to the red light emitting chip 20r by binding, the green control pin 215g is connected to the green light emitting chip 20g by binding, and the blue control pin 215b is connected to the blue light emitting chip 20b by binding.

[0061] As a preferred mode, regarding the installation mode of the light emitting chip 20, for example, one of the conversion pads 312 is provided with three branches, and the branches are respectively provided with a connection part of the light emitting chip; one electrode of the light emitting chip is connected to the connection part of the branch, and the other electrode of the light emitting chip is connected to the color control pin 215 on the driving chip 21 through a circuit etched between the conversion pad 312 and the driving chip 21. At this time, the light emitting chip is installed in a flip-chip mode.

[0062] In the example, as shown in FIG. 3, Figure 4 Figure 6 As shown in FIG. 3, the driving chip 21 of the light emitting component 2 is connected to the signal pad 33 or the driving chip 21 of the light emitting component 2 before or after the signal pad 33 by a signal line 32 (specifically a signal jumper 321 in the application) to realize the series connection of the light emitting components 2 and form a light bead string; and the control signal for controlling the light and dark of each light emitting component 2 can be input from the signal pad 33 through the signal jumper 321 and then transmitted through the series connected light emitting components 2.

[0063] ​The input and output of the signal pin 211 are opposite, for example, the first signal pin is a signal input pin, and the second signal pin is a signal output pin. Conversely, the first signal pin is a signal output pin, and the second signal pin is a signal input pin. As a preferred mode, the two signal pins 211 can be switched with each other. One of the two signal pins 211 is a signal input pin, and the other is a signal output pin. As a preferred solution, the light emitting component 2 is preferably a bidirectional transmission light emitting component. The first signal pin of the bidirectional transmission light emitting component is an input signal pin, and the second signal pin is an output signal pin. Conversely, the second signal pin of the bidirectional transmission light emitting component 2 is an input signal pin, and the first signal pin is an output signal pin. With such a bidirectional transmission light emitting component, bidirectional input signals of the light emitting component 2 can be transmitted when the light emitting component 2 is connected in series. The bidirectional transmission solution is the applicant's original technology, and the applicant has already patented the bidirectional transmission driving chip 21 and the lamp bead (for details, please refer to CN111341247A). In this example, the bidirectional transmission solution can be directly quoted. No further description is given.

[0064] In this example, as shown in Figure 7 , Figure 8 , a first power pin 212 is arranged on one side of the driving chip 21, and a second power pin 213 is arranged on the other side. The side is a relative concept, for example, the first power pin 212 is arranged on the left side of the driving chip 21, and the second power pin 213 is arranged on the right side of the driving chip 21. Conversely, it is also possible. In this example, two adapter pads 312 are arranged on the left upper corner and the right lower corner of each light emitting component 2, of course, they can also be arranged on the upper and lower sides or the left and right sides of the light emitting component 2, which are all possible.

[0065] It should be noted that the signal transmission in this example does not necessarily have to be achieved through the signal pads and signal lines and the light emitting components, and other implementation modes are also possible, such as transmitting signals through power lines. It is also possible to transmit signals through power lines based on the current technology. In this example, the mode of connecting the light emitting components in series through the signal pads and the signal jumpers is the preferred mode.

[0066] As shown in Figure 4 , Figure 8 , on the one hand, the adapter pads 312 in the adapter lines are bound and connected to the first power supply line 31a or the second power supply line 31b through the adapter jumpers 313, so that the adapter lines with opposite polarities are formed on the upper and lower sides of each row of light emitting components 2. Specifically, the adapter pads are respectively named as the first adapter pad and the second adapter pad, as shown in Figure 9As shown, the first adapter pad 312a is arranged on the upper portion of the driving chip 21, and the second adapter pad 312b is arranged on the lower portion of the driving chip 21. The adapter circuit on the upper portion with the first adapter pad 312a is referred to as the first adapter circuit, and the adapter circuit on the lower portion with the second adapter pad 312b is referred to as the second adapter circuit. The first adapter circuit is connected to the first power supply circuit 31a, and the second adapter circuit is connected to the second power supply circuit 31b. The light emitting wafer 20 is mounted on the second adapter pad 312b. The first power supply pin 212 and the second power supply pin 213 on each driving chip 21 are respectively bound to the first adapter pad 312a and the second adapter pad 312b, so as to achieve the purpose of each light emitting component 2 taking power from the first power supply circuit 31a and the second power supply circuit 31b.

[0067] The power jumper 311, the signal jumper 321 and the adapter jumper 313 in the example are the binding wires or bonding wires understood by those skilled in the art, which usually include gold wires, copper wires, palladium-plated copper wires and alloy wires. No further description is given. Here, only the devices are distinguished and named respectively. The power jumper 311, the signal jumper 321 and the adapter jumper 313 described above are preferably 15 μm-70 μm in diameter and made of gold wires, copper wires or alloy wires. Since the diameter is very small and almost invisible to the naked eye, the blocking of the line of sight is reduced while ensuring that the working current of the connected light emitting components 2 is met, and the transparency of the product is improved.

[0068] In the example, the size of the adapter pad without the light emitting wafer 20 can be as small as 0.1 mm x 0.3 mm, and the size of the adapter pad with the light emitting wafer 20 can be as small as 0.5 mm x 1 mm. The small-sized metal sheet can be formed when the circuit pattern 3 is made on the transparent substrate 1, or the small-sized metal sheet can be bound on the transparent substrate 1 by die bonding.

[0069] In the example, the light emitting wafer 20 is preferably mounted on the adapter pad 312 by the CSP (Chip Scale Package) method. The light emitting wafer 20 can also be mounted on the adapter pad 312 by the COC (Chip On Chip) method.

[0070] Preferably, the light emitting wafer 20 is mounted on the adapter pad 312 and then mounted on the transparent substrate 1 as a whole, which is conducive to improving the process efficiency and the yield.

[0071] In the example, as shown in FIG. 4, the light emitting wafer 20 is mounted on the adapter pad 312 by the CSP method. Figure 16As shown, the light-emitting assembly 2 further comprises a light-emitting PCB board 22, the driving chip 21 and the second adapter pad 312b are arranged on the light-emitting PCB board 22; the light-emitting PCB board 22 is mounted on the transparent substrate 1. The driving chip 21 and the second adapter pad 312b are mounted on the light-emitting PCB board 22 as a whole and then mounted on the transparent substrate 1, which is conducive to improving the process efficiency and yield.

[0072] Preferably, the light-emitting PCB board 22 is connected to the transparent substrate 1 by COG (English full name: chip on glass) mode. The COG mode means that the chip is directly bonded on the transparent substrate. This is known to those skilled in the art. It will not be repeated here.

[0073] Applicants found in the development process that at present, due to the objective fact of signal attenuation in signal transmission process, the display effect of the traditional LED lamp beads will decrease when the number of series connection is too large. In the ideal state, the number of LED lamp beads in a lamp string is generally controlled within 384. This greatly reduces the size of the LED transparent display screen.

[0074] As a preferred mode, as shown in Figure 11 The driving chip 21 further comprises a pair of short-circuit pins 214, which are divided into input signal short-circuit pins 214 and output signal short-circuit pins 214; the pair of short-circuit pins 214 are short-circuited inside the driving chip 21, so that the control signal is directly transmitted between the pair of short-circuit pins 214 without passing through the circuit inside the driving chip 21.

[0075] As a preferred mode, as shown in Figure 9 、 Figure 11 Each lamp bead string is provided with two signal pads 33, which are respectively referred to as a first signal pad 331 and a second signal pad 332;

[0076] In the lamp bead string, the signal pin 211 of the input signal of the first light-emitting assembly 2 is connected to the first signal pad 331, and the short-circuit pin 214 of the input signal of the first light-emitting assembly 2 is connected to the second signal pad 332;

[0077] Alternatively, the signal pin 211 of the input signal of the first light-emitting assembly 2 is connected to the second signal pad 332, and the short-circuit pin 214 of the input signal of the first light-emitting assembly 2 is connected to the first signal pad 331;

[0078] The signal pins 211 of the input signals of each of the other light-emitting components 2 are connected to the shorting pins 214 of the output signals of the previous light-emitting component 2, and the shorting pins 214 of the input signals of each light-emitting component 2 are connected to the signal pins 211 of the output signals of the previous light-emitting component 2; the signal pins 211 of the output signals of each light-emitting component 2 are connected to the shorting pins 214 of the input signals of the next light-emitting component 2, and the shorting pins 214 of the output signals of each light-emitting component 2 are connected to the signal pins 211 of the input signals of the next light-emitting component 2.

[0079] In this way, a single LED string can be transformed into two LED strings controlled by two control signals. For example, the odd-numbered LED components 2 in the LED string transmit control signals from the first signal pad 331; the even-numbered LED components 2 in the LED string transmit control signals from the second signal pad 332; and vice versa. Due to this special bonding connection method, the two signals from the first signal pad 331 and the second signal pad 332 are always transmitted in adjacent LED components 2 or short-circuited so that they do not pass through the interior of the LED component 2.

[0080] Further description is as follows: Let the control signal input to the first signal pad 331 be the first control signal, and the control signal input to the second signal pad 332 be the second control signal; then... Figure 11 As shown, taking the first column of light-emitting components 2 as an example, the first signal pad 331 is bonded to the shorting pin 214 of the input signal of the first column of light-emitting components 2; the second signal pad 332 is bonded to the signal pin 211 of the input signal of the first column of light-emitting components 2, so that the first control signal transmitted in the first signal pad 331 is shorted in the first column of light-emitting components 2 to the signal pin 211 of the input signal of the first column of light-emitting components 2, without passing through the inside of the first column of light-emitting components 2; so that the second control signal transmitted in the second signal pad 332 passes through the first column of light-emitting components 2, and the second control signal controls the lighting of the first column of light-emitting components 2, and is transmitted to the shorting pin 214 of the input signal of the first column of light-emitting components 2. Similarly, the first control signal is input from the signal pin 211 of the input signal for the first column, second row light-emitting component 2, controlling its on / off state. It is also output from the signal pin 211 of the output signal to the shorting pin 214 of the input signal for the first column, third row light-emitting component 2. The second control signal is shorted out of the first column, second row light-emitting component 2. This process continues, with the first control signal passing through the light-emitting components 2 in even-numbered rows, controlling their on / off state, and being shorted in the light-emitting components 2 in odd-numbered rows. The second control signal passes through the light-emitting components 2 in odd-numbered rows, controlling their on / off state, and is shorted in the light-emitting components 2 in even-numbered rows. The reverse is also possible.

[0081] This method increases the number of light-emitting components 2 connected in series in a row or column of light strings. The number of light-emitting components 2 in this method is twice that of LED beads in a conventional light string.

[0082] Preferred, such as Figure 10 As shown, the power supply line 31 includes a plurality of first power supply lines 31a and second power supply lines 31b arranged in rows or columns; a plurality of rows or columns of light-emitting components 2 are provided between the first power supply lines 31a and second power supply lines 31b; the plurality of rows or columns of light-emitting components 2 provided between the first power supply lines 31a and second power supply lines 31b share the first power supply lines 31a and second power supply lines 31b.

[0083] The power supply line 31 includes a plurality of first power supply lines 31a and second power supply lines 31b arranged in rows or columns; a plurality of rows or columns of light-emitting components 2 are provided between the first power supply lines 31a and second power supply lines 31b; the light-emitting components 2 share the first power supply lines 31a and second power supply lines 31b. For example, Figure 12 As shown, a first power supply line 31a, a second power supply line 31b, and a third power supply line 31a are spaced apart. A 4-row, 4-column array of light-emitting components 2 is arranged between the first power supply line 31a and the second power supply line 31b on the left side; these 4-row, 4-column arrays of light-emitting components 2 share the first power supply line 31a and the second power supply line 31b. A 4-row, 4-column array of light-emitting components 2 is also arranged between the first power supply line 31a and the second power supply line 31b on the right side; these 4-row, 4-column arrays of light-emitting components 2 share the first power supply line 31a and the second power supply line 31b on the right side.

[0084] By using the above method, several columns or rows of light-emitting components 2 can share a power supply line 31 of the same polarity. By arranging them in this cyclical manner, a large-area transparent LED display screen can be made. Sharing a power supply line 31 with several light-emitting components 2 can reduce the number of power supply lines 31, reduce obstruction of the view, and help improve the transparency of the display screen.

[0085] Although the power jumper 311 and the signal jumper 321 cross each other in the schematic diagram, in the actual manufacturing process they are bonded at different heights and then fixed by potting glue, so there will be no collapse or short circuit.

[0086] The application is not limited to the embodiment of the power supply line 31, which is not the core innovation of the application, and can use the implementation known to those skilled in the art. The number of the first power supply line 31a and the second power supply line 31b can be only one for each, or can be multiple for each. The number of the first power supply line 31a and the second power supply line 31b can be the same or different. The specific number is determined according to the power supply capacity of the power supply line 31 and the current demand of the light emitting component 2 between the first power supply line 31a and the second power supply line 31b.

[0087] The power supply line 31 can be straight, curved, or in the form of a snake. As a preferred mode, each power supply line 31 is generally arranged in a row or column, and the implementation is not limited as long as it can provide power supply. For example, it can be a metal layer etched on the transparent substrate 1, or a metal mesh, or a nano-silver coating or ITO coating, or a metal wire or a metal sheet embedded in the transparent substrate 1 as described in the patent previously applied by the applicant.

[0088] As a preferred mode, as shown in Figure 12 , the power supply line 31 is preferably a conductive mesh. The conductive mesh can be a metal mesh or ITO, and the dots in the figure are the binding lines and the binding points (electrical connection points) of the metal mesh or ITO. The metal mesh or ITO has a large square resistance and a small conductive capacity, so a large area is needed to meet the current demand. In the figure, the conductive mesh is arranged on both sides of the several columns of light emitting components 2, and the light emitting components 2 between the first power supply line 31a and the second power supply line 31b in the form of conductive mesh share the first power supply line 31a and the second power supply line 31b. At this time, only the light emitting components 2 need to be fixed on the glass substrate.

[0089] As shown in Figure 13 , Figure 14 , in order to enhance the conductive capacity of the conductive mesh, the area of the conductive mesh can also be expanded, and then the light emitting component 2 and the adapter pad 312 are installed on the conductive mesh, but at this time, the light emitting component 2 needs to be insulated from the conductive mesh. That is, the light emitting component 2 is bound to the metal mesh by insulating die bonding, and the driving chip 21 and the conductive mesh are firmly bonded by insulating die bonding glue. For example, the two columns of light emitting components 2 on the left side of the figure are arranged on the conductive mesh of the first power supply line 31a, and the two columns of light emitting components 2 on the right side of the figure are arranged on the conductive mesh of the second power supply line 31b. The adapter pad 312 is also installed on the transparent substrate 1 or on the conductive mesh in an insulating die bonding manner.

[0090] As for the design of the power supply line 31, there can also be other forms of deformation, for example, as shown in Figure 15As shown, a plurality of transparent unit plates 6 are arranged on the transparent substrate 1; the light emitting assembly 2 is arranged on the transparent unit plate 6; the metal strip is arranged on both sides of each transparent unit plate 6 as the power supply line 31; the light emitting assembly 2 on each transparent unit plate 6 is connected to the power supply line 31. The power supply lines 31 on both sides are respectively the first power supply line 31a and the second power supply line 31b. In this way, the transparent substrate 1 surface is free of the power supply line 31, but is embedded between the two transparent unit plates 6. The transparent unit plate 6 is a mutually independent glass plate, and each transparent unit plate 6 is fixed on the lower whole transparent substrate 1. The advantage of this way is that the cross-sectional area of the metal strip in the screen viewing direction is very small, which can ensure sufficient current supply between the two power supply lines with opposite polarity and a plurality of light emitting assemblies 2, greatly reducing the obstruction of the conductive material to the line of sight, and improving the transparency of the screen.

[0091] By removing the shell in the existing LED lamp bead, only the driving chip 21 and the light emitting wafer 20 arranged in a split manner are retained, and the light emitting wafer 20 is arranged on an adapter pad to form a light emitting assembly 2 without a shell. The light emitting assembly 2 is arranged on the transparent substrate 1 in place of the existing LED lamp bead array, and the size of the light emitting assembly 2 is much smaller than that of the LED lamp bead. Therefore, the pixel pitch can be effectively reduced, and the resolution can be effectively improved. A transparent LED display screen with a pitch of less than 3mm x 3mm can be made. The power supply and signal transmission are realized by the jumper binding method, and a smaller diameter binding wire is selected. Under the condition of ensuring the power supply and signal transmission of the light emitting assembly, the obstruction of the conductive material to the line of sight is reduced as a whole, so that the transparency of the transparent LED display screen can be further improved. Since the diameter of the jumper is very small, a copper wire with a diameter of 15μm-70μm can be preferably selected to ensure the current while having little effect on the line of sight. Therefore, even under the condition of a pitch of 2mm x 2mm, the screen can have a transparency of more than 80%, and the transparent effect is very obvious. Meanwhile, a pair of power supply pins and a plurality of color control pins are arranged on the driving chip 21 of the light emitting assembly 2, and an adapter pad 312 is arranged on the circuit pattern 3. The power supply pins are connected by the adapter pad 312. In this way, each light emitting assembly 2 can independently take power from the power supply line 31 through the adapter line, thereby improving the overall stability of the product.

[0092] The above only describes the preferred embodiments of the present application and is not intended to limit the present application. Any modification, equivalent replacement and improvement within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A transparent LED display, characterized by The application relates to a transparent substrate and a light-emitting component; a circuit pattern is arranged on the transparent substrate; the light-emitting component is arranged on the transparent substrate in an array; the light-emitting component comprises a driving chip and a light-emitting wafer arranged separately. The circuit pattern comprises a power supply pad, a power supply circuit and a switching circuit; the power supply circuit comprises a plurality of first power supply circuits and second power supply circuits with opposite polarities. The power supply pad is connected to the first power supply circuit and the second power supply circuit. The switching circuit comprises a switching jumper and a switching pad arranged on both sides of the driving chip; the switching pad is directly or indirectly connected to the first power supply circuit and the second power supply circuit through the switching jumper. The driving chip comprises a pair of power supply pins and a plurality of color control pins. The pair of power supply pins comprises a first power supply pin and a second power supply pin. The first power supply pin and the second power supply pin on each light-emitting component are respectively connected to the switching pad on both sides of the driving chip through a power supply jumper. The light-emitting wafer is arranged on the switching pad, and the light-emitting wafer is connected to the color control pin on the driving chip. The circuit pattern further comprises a signal pad, and the driving chip further comprises a pair of signal pins; the pair of signal pins comprises a first signal pin and a second signal pin; one of the first signal pin and the second signal pin is an input signal pin, and the other is an output signal pin. The driving chip of the light-emitting component is connected to the signal pad or the driving chip of the light-emitting component in front of or behind the signal pad through a signal jumper, so that the light-emitting components are connected in series to form a light bead string; and a control signal for controlling the light-emitting components can be input from the signal pad through the signal jumper and then transmitted through the light-emitting components in series. The driving chip further comprises a pair of short-circuit pins, and the pair of short-circuit pins comprises an input signal short-circuit pin and an output signal short-circuit pin; the pair of short-circuit pins are short-circuited in the driving chip, so that the control signal is directly transmitted between the pair of short-circuit pins without passing through the circuit in the driving chip. Each light bead string is provided with two signal pads, which are respectively referred to as a first signal pad and a second signal pad. In the light bead string, the input signal pin of the first light-emitting component is connected to the first signal pad, and the input signal short-circuit pin of the first light-emitting component is connected to the second signal pad. Alternatively, the input signal pin of the first light-emitting component is connected to the second signal pad, and the input signal short-circuit pin of the first light-emitting component is connected to the first signal pad. The signal pin of the input signal of each of the light emitting assemblies is connected to the short pin of the output signal of the previous light emitting assembly, and the short pin of the input signal of each of the light emitting assemblies is connected to the signal pin of the output signal of the previous light emitting assembly; the signal pin of the output signal of each of the light emitting assemblies is connected to the short pin of the input signal of the next light emitting assembly, and the short pin of the output signal of each of the light emitting assemblies is connected to the signal pin of the input signal of the next light emitting assembly.

2. The transparent LED display of claim 1, wherein, The first power supply pin is arranged on one side of the driving chip, and the second power supply pin is arranged on the other side of the driving chip.

3. The transparent LED display of claim 1, wherein, The driving chip is connected to the transparent substrate by COG binding.

4. The transparent LED display of claim 1, wherein, The light emitting wafer is mounted on the second conversion pad by CSP or COC.

5. The transparent LED display of claim 4, wherein, The first conversion pad is located on one side of the driving chip, and the first conversion pad is directly or indirectly electrically connected to the first power supply circuit through the conversion jumper wire. The second conversion pad is located on the other side of the driving chip, and the second conversion pad is directly or indirectly electrically connected to the second power supply circuit through the conversion jumper wire. The light emitting wafer is mounted on the second conversion pad.

6. The transparent LED display of claim 5, wherein, The light emitting assembly further comprises a light emitting PCB board; the driving chip and the second conversion pad are arranged on the light emitting PCB board; and the light emitting PCB board is mounted on the transparent substrate.

7. The transparent LED display of claim 1, wherein, The power supply circuit comprises a plurality of first power supply circuits and a plurality of second power supply circuits arranged in rows or columns; a plurality of light emitting assemblies are arranged between the first power supply circuits and the second power supply circuits; and the first power supply circuits and the second power supply circuits are shared by the plurality of light emitting assemblies arranged in rows or columns.

8. The transparent LED display of claim 1, wherein, The power supply circuit is a conductive grid, an ITO conductive film, or a nano-silver film.

9. The transparent LED display of claim 8, wherein, The power supply circuit is a conductive grid, and the light emitting assembly is fixed on the conductive grid by an insulating die bonding method.

10. The transparent LED display of claim 1, wherein, The transparent substrate on which the light emitting assembly is arranged is provided with a glue filling layer, the glue filling layer encapsulates each of the light emitting assemblies, and an upper surface of the glue filling layer is provided with a protective cover plate.

11. The transparent LED display of claim 10, wherein, The transparent substrate is provided with a plurality of transparent unit boards; the light emitting assemblies are arranged on the transparent unit boards; metal strips are arranged on both sides of each of the transparent unit boards as the power supply circuit; and the light emitting assemblies on each of the transparent unit boards are connected to the power supply circuit.

12. The transparent LED display of claim 9, wherein, The conversion pad is mounted on the transparent substrate or the conductive grid by an insulating die bonding method.

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